LTC3548EKD-1-PBF [Linear]
Dual Synchronous, Fixed Output 2.25MHz Step-Down DC/DC Regulator; 双同步,固定输出的2.25MHz降压型DC / DC稳压器![LTC3548EKD-1-PBF](http://pdffile.icpdf.com/pdf1/p00133/img/icpdf/LTC35_737151_icpdf.jpg)
型号: | LTC3548EKD-1-PBF |
厂家: | ![]() |
描述: | Dual Synchronous, Fixed Output 2.25MHz Step-Down DC/DC Regulator |
文件: | 总16页 (文件大小:920K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LTC3548-1
Dual Synchronous, Fixed
Output 2.25MHz Step-Down
DC/DC Regulator
FEATURES
DESCRIPTION
TheLTC®3548-1isadual,fixedoutput,constantfrequency,
synchronousstep-downDC/DCconverter.Intendedforlow
power applications, it operates from 2.5V to 5.5V input
voltage range and has a constant 2.25MHz switching
frequency, allowing the use of tiny, low cost capacitors
and inductors with a profile ≤1mm. The output voltage
for channel 1 is fixed at 1.8V and for channel 2 is fixed
at 1.575V. Internal synchronous 0.35Ω, 1.2A/0.7A power
switches provide high efficiency without the need for ex-
ternal Schottky diodes. Burst Mode® operation provides
high efficiency at light loads.
n
High Efficiency: Up to 95%
n
1.8V at 800mA/1.575V at 400mA
n
Very Low Quiescent Current: Only 40μA
n
2.25MHz Constant Frequency Operation
n
High Switch Current: 1.2A and 0.7A
n
No Schottky Diodes Required
n
V : 2.5V to 5.5V
IN
n
Current Mode Operation for Excellent Line
and Load Transient Response
Short-Circuit Protected
n
n
Low Dropout Operation: 100% Duty Cycle
n
Ultralow Shutdown Current: I < 1μA
Q
To further maximize battery runtime, the P-channel
MOSFETs are turned on continuously in dropout (100%
duty cycle), and both channels draw a total quiescent cur-
rent of only 40μA. In shutdown, the device draws <1μA.
n
Small Thermally Enhanced 3mm × 3mm
DFN Packages
APPLICATIONS
The LTC3548-1 is available in both thin (0.75mm) and
ultra-thin (0.55mm) 3mm × 3mm DFN packages.
n
PDAs/Palmtop PCs
n
L, LT, LTC, LTM and Burst Mode are registered trademarks of Linear Technology Corporation
All other trademarks are the property of their respective owners. Protected by U.S. Patents
including 5481178, 6580258, 6304066, 6127815, 6498466, 6611131.
Digital Cameras
n
Cellular Phones
n
Portable Media Players
n
PC Cards
n
Wireless and DSL Modems
TYPICAL APPLICATION
LTC3548-1 Efficiency Curve/Power Loss
100
95
90
85
80
75
70
65
60
1000
100
10
V
IN
2.7V TO 5.5V
C
10μF
CER
IN
V
RUN1 RUN2
LTC3548-1
IN
V
= 1.8V
OUT1
4.7μH
2.2μH
V
V
OUT1
OUT2
1.575V
400mA
1.8V
SW2
SW1
V
= 1.575V
OUT2
800mA
V
V
V
OUT1
C
OUT2
C
OUT1
OUT2
10μF
CER
C
C
FF1
330pF
FF2
330pF
10μF
CER
V
1
FB2
FB1
3548-1 F01
GND
CHANNEL 1
CHANNEL 2
0.1
1000
1
10
100
Figure 1. 1.8V/1.575V at 800mA/400mA Step-Down Regulators
LOAD CURRENT (mA)
35481 F01b
35481fb
1
LTC3548-1
ABSOLUTE MAXIMUM RATINGS
(Note 1)
V Voltages.................................................–0.3V to 6V
Ambient Operating Temperature Range
IN
V
, V , V
, V
,
(Note 2)....................................................–40°C to 85°C
Junction Temperature (Note 5) ............................. 125°C
Storage Temperature Range...................– 65°C to 125°C
FB1 FB2 OUT1 OUT2
RUN1, RUN2 Voltages ..................... –0.3V to V + 0.3V
IN
SW1, SW2 Voltage........................... –0.3V to V + 0.3V
IN
PIN CONFIGURATION
TOP VIEW
TOP VIEW
V
OUT1
V
1
2
3
4
5
10
9
V
V
V
1
2
3
4
5
10
9
V
V
FB1
FB2
OUT2
FB1
FB2
V
V
OUT1
OUT2
IN
RUN1
SW2
11
11
8
V
8
RUN1
SW2
IN
SW1
GND
7
SW1
GND
7
RUN2
6
6
RUN2
DD PACKAGE
10-LEAD (3mm × 3mm) PLASTIC DFN
KD PACKAGE
10-LEAD (3mm × 3mm) PLASTIC UTDFN
T
= 125°C, θ = 43°C/W, θ = 10°C/W
JA JC
T
= 125°C, θ = 40°C/W, θ = 3°C/W
JMAX
JMAX
JA
JC
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND
(SOLDERED TO A 4-LAYER BOARD)
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND
(SOLDERED TO A 4-LAYER BOARD)
ORDER INFORMATION
LEAD FREE FINISH
LTC3548EDD-1#PBF
LTC3548EKD-1#PBF
TAPE AND REEL
PART MARKING
LBZC
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3548EDD-1#TRPBF
LTC3548EKD-1#TRPBF
10-Lead (3mm × 3mm) Plastic DFN
10-Lead (3mm × 3mm) Plastic UTDFN
–40°C to 85°C
–40°C to 85°C
CXVT
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
35481fb
2
LTC3548-1
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, unless otherwise specified. (Note 2)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
V
Operating Voltage Range
Output Voltage
●
●
●
2.5
5.5
V
IN
0°C ≤ T ≤ 85°C (Note 3)
1.764
1.755
1.8
1.8
1.836
1.836
V
V
OUT1
A
–40°C ≤ T ≤ 85°C (Note 3)
A
V
OUT2
Output Voltage
0°C ≤ T ≤ 85°C (Note 3)
1.544
1.536
1.575 1.607
1.575 1.607
V
V
A
–40°C ≤ T ≤ 85°C (Note 3)
A
ΔV
ΔV
Reference Voltage Line Regulation
Output Voltage Load Regulation
V
= 2.5V to 5.5V (Note 3)
0.3
0.5
0.5
%/V
%
LINE REG
IN
(Note 3)
LOAD REG
I
S
Input DC Supply Current
Active Mode
V
V
= 1.5V, V
= 1.9V, V
= 1.3V
700
40
0.1
950
60
1
μA
μA
μA
OUT1
OUT1
OUT2
OUT2
Sleep Mode
= 1.65V
Shutdown
RUN = 0V, V = 5.5V
IN
f
I
Oscillator Frequency
V
= 1.8V, V = 1.575V
OUT2
●
1.8
2.25
2.7
MHz
OSC
OUT1
Peak Switch Current Limit Channel 1
Peak Switch Current Limit Channel 2
V
IN
V
IN
= 3V, Duty Cycle <35%
= 3V, Duty Cycle <35%
0.95
0.6
1.2
0.7
1.6
0.9
A
A
LIM
R
Top Switch On-Resistance
Bottom Switch On-Resistance
(Note 6)
(Note 6)
0.35
0.30
0.45
0.45
Ω
Ω
DS(ON)
I
Switch Leakage Current
RUN Threshold
V
IN
= 5V, V
= 0V, V
= V = 0
OUT2
0.01
1
1
1.5
1
μA
V
SW(LKG)
RUN
OUT1
V
●
●
0.3
RUN
RUN
I
RUN Leakage Current
0.01
μA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 3: The LTC3548-1 is tested in a proprietary test mode that connects
the output of the error amplifier to an outside servo-loop.
Note 4: Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
Note 2: The LTC3548-1 is guaranteed to meet specified performance
from 0°C to 85°C. Specifications over the –40°C and 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 5: T is calculated from the ambient T and power dissipation P
D
J
A
according to the following formula: T = T + (P • θ ).
J
A
D
JA
Note 6: The DFN switch on-resistance is guaranteed by correlation to
wafer level measurements.
TA = 25°C unless otherwise specified.
TYPICAL PERFORMANCE CHARACTERISTICS
Burst Mode Operation
Load Step
Load Step
V
OUT2
200mV/DIV
SW
5V/DIV
V
OUT1
200mV/DIV
I
L
I
200mA/DIV
L
I
L
500mA/DIV
200mA/DIV
I
LOAD
I
LOAD
40mA TO
400mA
80mA TO
800mA
V
OUT1
20mV/DIV
200mA/DIV
500mA/DIV
3548-1 G03
3548-1 G02
3548-1 G01
V
V
I
= 3.6V
20μs/DIV
V
V
I
= 3.6V
20μs/DIV
V
V
I
= 3.6V
2μs/DIV
IN
OUT2
IN
OUT1
IN
OUT1
= 1.575V
= 40mA TO 400mA
= 1.8V
= 80mA TO 800mA
= 1.8V
= 60mA
LOAD
LOAD
LOAD
CHANNEL 2; CIRCUIT OF FIGURE 3
CHANNEL 1; CIRCUIT OF FIGURE 3
CHANNEL 1; CIRCUIT OF FIGURE 3
35481fb
3
LTC3548-1
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified.
Oscillator Frequency
vs Temperature
Oscillator Frequency
vs Input Voltage
Efficiency vs Input Voltage
2.5
2.4
2.3
2.2
2.1
2.0
10
8
100
95
90
85
80
75
70
65
60
V
= 3.6V
IN
I
= 100mA
OUT
6
4
2
0
I
= 800mA
OUT
I
= 10mA
OUT
–2
–4
–6
–8
–10
I
= 1mA
OUT
4
4.5
2
2.5
3
3.5
5
5.5
6
50
TEMPERATURE (°C)
100 125
–50 –25
0
25
75
4
5
6
2
3
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
3548-1 G04
3548-1 G05
3548-1 G06
Output Voltage Error
vs Temperature
RDS(ON) vs Input Voltage
RDS(ON) vs Junction Temperature
1
0.8
500
450
400
350
300
250
200
550
500
450
400
350
300
250
200
150
100
V
= 3.6V
V
= 2.7V
IN
IN
V
= 3.6V
IN
0.6
V
= 4.2V
IN
0.4
MAIN
SWITCH
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
SYNCHRONOUS
SWITCH
MAIN SWITCH
SYNCHRONOUS SWITCH
3
5
7
1
2
4
6
50
100 125 150
–50
0
25
50
75 100 125
–50 –25
0
25
75
–25
TEMPERATURE (°C)
INPUT VOLTAGE (V)
JUNCTION TEMPERATURE (°C)
3548-1 G08
3548-1 G07
3548-1 G09
Efficiency vs Load Current
Load Regulation
Line Regulation
100
95
90
85
80
75
70
65
60
2.0
1.5
0.5
0.4
0.3
V
= 1.8V
1.0
OUT1
0.2
V
= 1.8V
V
= 1.8V
OUT1
OUT1
0.5
0.1
V
= 1.575V
OUT2
V
= 1.575V
OUT2
0
0
V
= 1.575V
OUT2
–0.1
–0.2
–0.3
–0.4
–0.5
–0.5
–1.0
–1.5
–2.0
1
10
100
1000
1
10
100
1000
2.5
3
4
4.5
5
5.5
3.5
LOAD CURRENT (mA)
LOAD CURRENT (mA)
LOAD CURRENT (mA)
3548-1 G11
3548-1 G12
3548-1 G15
35481fb
4
LTC3548-1
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified.
Efficiency vs Load Current
Efficiency vs Load Current
100
95
90
85
80
75
70
65
60
100
95
90
85
80
75
70
65
60
V
= 3.6V
V
= 2.7V
IN
IN
V
= 3.6V
V
= 2.7V
IN
IN
V
= 4.2V
IN
V
= 4.2V
IN
V
= 1.575V
V
= 1.8V
OUT2
OUT1
NO LOAD ON OTHER CHANNEL
CIRCUIT OF FIGURE 3
NO LOAD ON OTHER CHANNEL
CIRCUIT OF FIGURE 3
1
10
100
1000
1
10
100
1000
LOAD CURRENT (mA)
LOAD CURRENT (mA)
3548-1 G17
3548-1 G16
PIN FUNCTIONS
FB1
feedback voltage from internal resistive divider across the
output. Normal voltage for this pin is 0.6V.
V
(Pin 1): Output Feedback for Channel 1. Receives the
SW2 (Pin 7): Regulator 2 Switch Node Connection to the
Inductor. This pin swings from V to GND.
IN
RUN1(Pin8):Regulator1Enable.ForcingthispintoV en-
IN
V
(Pin 2): Output Voltage Feedback Pin for Channel 1.
ablesregulator1,whileforcingittoGNDcausesregulator1
OUT1
Aninternalresistivedividerdividestheoutputvoltagedown
to shut down. This pin must be driven; do not float.
for comparison to the internal reference voltage.
V
(Pin 9): Output Voltage Feedback Pin for Channel 2.
OUT2
V (Pin3):InputPowerSupply.Mustbecloselydecoupled
Aninternalresistivedividerdividestheoutputvoltagedown
IN
to GND.
for comparison to the internal reference voltage.
SW1 (Pin 4): Regulator 1 Switch Node Connection to the
V
(Pin 10): Output Feedback for Channel 2. Receives
FB2
Inductor. This pin swings from V to GND.
the feedback voltage from internal resistive divider across
the output. Normal voltage for this pin is 0.6V.
IN
GND (Pin 5): Ground. Connect to the (–) terminal of C
OUT
and (–) terminal of C (see Figure 4).
Exposed Pad (GND) (Pin 11): Ground. Connect to the
IN
(–) terminal of C , and (–) terminal of C . Must be con-
OUT
IN
RUN2(Pin6):Regulator2Enable.ForcingthispintoV en-
IN
nected to electrical ground on PCB (see Figure 4).
ablesregulator2,whileforcingittoGNDcausesregulator2
to shut down. This pin must be driven; do not float.
35481fb
5
LTC3548-1
BLOCK DIAGRAM
REGULATOR 1
V
IN
BURST
CLAMP
V
IN
SLOPE
COMP
EN
BURST
–
+
+
0.6V
SLEEP
–
+
I
TH
5ꢀ
EA
I
COMP
0.35V
–
V
2
1
OUT1
S
R
Q
V
FB
R1
RS
LATCH
V
FB1
Q
0.55V
–
+
R3
SWITCHING
LOGIC
UV
OV
UVDET
OVDET
AND
BLANKING
CIRCUIT
ANTI
SHOOT-
THRU
4
SW1
+
–
0.65V
+
–
I
RCMP
SHUTDOWN
11 GND
V
IN
3
5
V
IN
8
6
RUN1
RUN2
0.6V REF
OSC
OSC
GND
SW2
REGULATOR 2 (IDENTICAL TO REGULATOR 1)
9
V
OUT2
R1 = 240k, R3 = 120k FOR REGULATOR 1
R1 = 195k, R3 = 120k FOR REGULATOR 2
7
10
V
FB2
3548-1 BD
35481fb
6
LTC3548-1
OPERATION
The LTC3548-1 uses a constant frequency, current mode
architecture. The operating frequency is set at 2.25MHz.
Both channels share the same clock and run in-phase.
Low Current Operation
When the load is relatively light, the LTC3548-1 auto-
matically switches into Burst Mode operation, in which
the PMOS switch operates intermittently based on load
demand with a fixed peak inductor current. By running
cycles periodically, the switching losses which are domi-
nated by the gate charge losses of the power MOSFETs
are minimized. The main control loop is interrupted when
the output voltage reaches the desired regulated value. A
The output voltage is set by an internal divider. An error
amplfier compares the divided output voltage with a
reference voltage of 0.6V and adjusts the peak inductor
current accordingly.
Main Control Loop
voltagecomparatortripswhenI isbelow0.35V,shutting
TH
Duringnormaloperation,thetoppowerswitch(P-channel
MOSFET) is turned on at the beginning of a clock cycle
off the switch and reducing the power. The output capaci-
tor and the inductor supply the power to the load until I
TH
when the V
voltage is below the regulated voltage. The
OUT
exceeds 0.65V, turning on the switch and the main control
current flows into the inductor and the load increases until
current limit is reached. The switch turns off and energy
stored in the inductor flows through the bottom switch
(N-channel MOSFET) into the load until the next
clock cycle.
loop which starts another cycle.
Dropout Operation
When the input supply voltage decreases toward the
output voltage, the duty cycle increases to 100% which
is the dropout condition. In dropout, the PMOS switch is
turnedoncontinuouslywiththeoutputvoltagebeingequal
to the input voltage minus the voltage drops across the
internal p-channel MOSFET and the inductor.
The peak inductor current is controlled by the internally
compensated I voltage, which is the output of the error
TH
amplifier.ThisamplifiercomparesthefeedbackvoltageV
FB
to the 0.6V reference (see Block Diagram). When the load
currentincreases,theV voltagedecreasesslightlybelow
FB
the reference. This decrease causes the error amplifier to
An important design consideration is that the R
DS(ON)
increase the I voltage until the average inductor current
of the P-channel switch increases with decreasing input
supply voltage (see Typical Performance Characteristics).
Therefore, the user should calculate the power dissipation
when the LTC3548-1 is used at 100% duty cycle with low
input voltage (see Thermal Considerations in the Applica-
tions Information section).
TH
matches the new load current.
The main control loop is shut down by pulling the RUN
pin to ground.
Low Supply Operation
Topreventunstableoperation,theLTC3548-1incorporates
an undervoltage lockout circuit which shuts down the part
when the input voltage drops below about 1.65V.
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7
LTC3548-1
APPLICATIONS INFORMATION
A general LTC3548-1 application circuit is shown in
Figure 2. External component selection is driven by the
load requirement, and begins with the selection of the
higher ripple current which causes this to occur at lower
load currents. This causes a dip in efficiency in the upper
range of low current operation. In Burst Mode operation,
lower inductance values will cause the burst frequency
to increase.
inductor L. Once the inductor is chosen, C and C
IN
OUT
can be selected.
Inductor Core Selection
V
IN
2.7V TO 5.5V
C
10μF
CER
IN
Different core materials and shapes will change the size/
currentandprice/currentrelationshipofaninductor.Toroid
or shielded pot cores in ferrite or permalloy materials are
small and don’t radiate much energy, but generally cost
more than powdered iron core inductors with similar elec-
trical characterisitics. The choice of which style inductor
to use often depends more on the price vs size require-
ments and any radiated field/EMI requirements than on
what the LTC3548-1 requires to operate. Table 1 shows
some typical surface mount inductors that work well in
LTC3548-1 applications.
V
RUN1 RUN2
LTC3548-1
IN
4.7μH
2.2μH
V
V
OUT1
1.8V
800mA
OUT2
1.575V
400mA
SW2
SW1
V
V
V
OUT1
C
OUT2
FB2
C
OUT1
OUT2
10μF
CER
C
C
FF2
330pF
FF1
330pF
10μF
CER
V
FB1
3548-1 F01
GND
Figure 2. LTC3548-1 General Schematic
Inductor Selection
Table 1. Representative Surface Mount Inductors
Althoughtheinductordoesnotinfluencetheoperatingfre-
quency, the inductor value has a direct effect on ripple cur-
PART
NUMBER
VALUE
(μH)
DCR
MAX DC
SIZE
3
(Ω MAX) CURRENT (A) W × L × H (mm )
rent. The inductor ripple current ΔI decreases with higher
L
Sumida
CDRH3D16
2.2
3.3
4.7
0.075
0.110
0.162
1.20
1.10
0.90
3.8 × 3.8 × 1.8
inductance and increases with higher V or V
:
IN
OUT
ꢁ
ꢃ
ꢂ
OUT ꢄ
V
VOUT
fO •L
Sumida
CMD4D06
2.2
4.7
0.089
0.166
0.95
0.75
4.1 × 3.2 × 0.8
4.4 × 5.8 × 1.2
2.5 × 3.2 × 2.0
2.5 × 3.2 × 2.0
4.5 × 5.4 × 1.2
ꢀIL =
• 1–
ꢆ
V
ꢅ
IN
Sumida
CMD4D11
2.2
3.3
0.116
0.174
0.950
0.770
Accepting larger values of ΔI allows the use of low induc-
L
Murata
LQH32CN
1.0
2.2
0.060
0.097
1.00
0.79
tances, but results in higher output voltage ripple, greater
core losses, and lower output current capability.
Toko
D312F
2.2
3.3
0.060
0.260
1.08
0.92
A reasonable starting point for setting ripple current is
ΔI =0.3•I
, whereI
is0.8Aforchannel1
L
OUT(MAX)
OUT(MAX)
Panasonic
ELT5KT
3.3
4.7
0.17
0.20
1.00
0.95
and 400mA for channel 2. The largest ripple current ΔI
L
occurs at the maximum input voltage. To guarantee that
the ripple current stays below a specified maximum, the
inductor value should be chosen according to the follow-
ing equation:
Input Capacitor (C ) Selection
IN
In continuous mode, the input current of the converter is a
square wave with a duty cycle of approximately V /V .
ꢁ
ꢄ
OUT IN
VOUT
fO • ꢀIL
VOUT
L =
• 1–
Topreventlargevoltagetransients, alowequivalentseries
resistance (ESR) input capacitor sized for the maximum
RMS current must be used. The maximum RMS capacitor
current is given by:
ꢃ
ꢆ
V
ꢂ
ꢅ
IN(MAX)
The inductor value will also have an effect on Burst Mode
operation. The transition from low current operation
begins when the peak inductor current falls below a level
set by the burst clamp. Lower inductor values result in
VOUT V – V
(
)
IN
OUT
IRMS ≈IMAX
V
IN
35481fb
8
LTC3548-1
APPLICATIONS INFORMATION
where the maximum average output current I
equals
of any aluminum electrolytic at a somewhat higher price.
Special polymer capacitors, such as Sanyo POSCAP,
Panasonic Special Polymer (SP), and Kemet A700, of-
fer very low ESR, but have a lower capacitance density
than other types. Tantalum capacitors have the highest
capacitance density, but they have a larger ESR and it
is critical that the capacitors are surge tested for use in
switching power supplies. An excellent choice is the AVX
TPS series of surface mount tantalums, available in case
heightsrangingfrom2mmto4mm.Aluminumelectrolytic
capacitors have a significantly larger ESR, and are often
usedinextremelycost-sensitiveapplicationsprovidedthat
consideration is given to ripple current ratings and long
term reliability. Ceramic capacitors have the lowest ESR
and cost, but also have the lowest capacitance density,
a high voltage and temperature coefficient, and exhibit
audible piezoelectric effects. In addition, the high Q of
ceramic capacitors along with trace inductance can lead
to significant ringing.
MAX
the peak current minus half the peak-to-peak ripple cur-
rent, I = I – ΔI /2.
MAX
LIM
L
This formula has a maximum at V = 2V , where I
RMS
IN
OUT
= I /2. This simple worst-case is commonly used to
OUT
design because even significant deviations do not offer
much relief. Note that capacitor manufacturer’s ripple cur-
rent ratings are often based on only 2000 hours lifetime.
This makes it advisable to further derate the capacitor,
or choose a capacitor rated at a higher temperature than
required.Severalcapacitorsmayalsobeparalleledtomeet
thesizeorheightrequirementsofthedesign.Anadditional
0.1μF to 1μF ceramic capacitor is also recommended on
V for high frequency decoupling, when not using an all
IN
ceramic capacitor solution.
Output Capacitor (C ) Selection
OUT
The selection of C
is driven by the required ESR to
OUT
minimizevoltagerippleandloadsteptransients. Typically,
once the ESR requirement is satisfied, the capacitance
In most cases, 0.1μF to 1μF of ceramic capacitors should
also be placed close to the LTC3548-1 in parallel with the
main capacitors for high frequency decoupling.
is adequate for filtering. The output ripple (ΔV ) is
OUT
determined by:
ꢂ
ꢅ
1
Ceramic Input and Output Capacitors
ꢀVOUT ꢁ ꢀIL ESR+
ꢄ
ꢇ
8fO C
ꢃ
OUT ꢆ
Higher value, lower cost ceramic capacitors are now be-
comingavailableinsmallercasesizes. Thesearetempting
for switching regulator use because of their very low ESR.
Unfortunately, the ESR is so low that it can cause loop
stabilityproblems.SolidtantalumcapacitorESRgenerates
aloop“zero”at5kHzto50kHzthatisinstrumentalingiving
acceptableloopphasemargin. Ceramiccapacitorsremain
capacitivetobeyond300kHzandusuallyresonatewiththeir
ESLbeforeESRbecomeseffective. Also, ceramiccapsare
prone to temperature effects which requires the designer
to check loop stability over the operating temperature
range. To minimize their large temperature and voltage
coefficients, only X5R or X7R ceramic capacitors should
beused.Agoodselectionofceramiccapacitorsisavailable
from Taiyo Yuden, AVX, Kemet, TDK, and Murata.
wheref =operatingfrequency,C
=outputcapacitance
O
OUT
and ΔI = ripple current in the inductor. The output ripple
L
is highest at maximum input voltage since ΔI increases
L
with input voltage. With ΔI = 0.3 • I
the output
L
OUT(MAX)
ripple will be less than 100mV at maximum V and
IN
f = 2.25MHz with:
O
ESR
< 150mΩ
COUT
Once the ESR requirements for C
have been met, the
OUT
RMS current rating generally far exceeds the I
RIPPLE(P-P)
requirement, except for an all ceramic solution.
In surface mount applications, multiple capacitors may
have to be paralleled to meet the capacitance, ESR or
RMS current handling requirement of the application.
Aluminum electrolytic, special polymer, ceramic and dry
tantulum capacitors are all available in surface mount
packages.TheOS-CONsemiconductordielectriccapacitor
available from Sanyo has the lowest ESR(size) product
Great care must be taken when using only ceramic input
and output capacitors. When a ceramic capacitor is used
at the input and the power is being supplied through long
wires, suchasfromawalladapter, aloadstepattheoutput
35481fb
9
LTC3548-1
APPLICATIONS INFORMATION
can induce ringing at the V pin. At best, this ringing can
margin.Inaddition,afeed-forwardcapacitor,C ,isadded
IN
FF
couple to the output and be mistaken as loop instability.
At worst, the ringing at the input can be large enough to
damage the part.
externallytoimprovethehighfrequencyresponse.Capaci-
tor C provides phase lead by creating a high frequency
FF
zero with R1, which improves the phase margin.
Since the ESR of a ceramic capacitor is so low, the input
and output capacitor must instead fulfill a charge storage
requirement.Duringaloadstep,theoutputcapacitormust
instantaneously supply the current to support the load
until the feedback loop raises the switch current enough
to support the load. The time required for the feedback
loop to respond is dependent on the compensation and
theoutputcapacitorsize. Typically, 3-4cyclesarerequired
to respond to a load step, but only in the first cycle does
Theoutputvoltagesettlingbehaviorisrelatedtothestability
of the closed-loop system and will demonstrate the actual
overall supply performance. For a detailed explanation of
optimizing the compensation components, including a re-
view of control loop theory, refer to Application Note 76.
In some applications, a more severe transient can be
caused by switching loads with large (>1μF) load input
capacitors. The discharged load input capacitors are ef-
fectively put in parallel with C , causing a rapid drop in
OUT
the output drop linearly. The output droop, V
, is
DROOP
V
OUT
. No regulator can deliver enough current to prevent
usually about 2-3 times the linear drop of the first cycle.
Thus, a good place to start is with the output capacitor
size of approximately:
this problem, if the switch connecting the load has low
resistance and is driven quickly. The solution is to limit
the turn-on speed of the load switch driver. A Hot Swap™
controller is designed specifically for this purpose and
usuallyincorporatescurrentlimiting, short-circuitprotec-
tion, and soft-starting.
ΔIOUT
fO • VDROOP
COUT ≈2.5
More capacitance may be required depending on the duty
cycle and load step requirements.
Efficiency Considerations
Inmostapplications,theinputcapacitorismerelyrequired
to supply high frequency bypassing, since the impedance
to the supply is very low. A 10μF ceramic capacitor is
usually enough for these conditions.
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can
be expressed as:
Checking Transient Response
The regulator loop response can be checked by look-
ing at the load transient response. Switching regulators
take several cycles to respond to a step in load current.
% Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc. are the individual losses as a percent-
age of input power.
When a load step occurs, V
immediately shifts by an
OUT
amount equal to ΔI
• ESR, where ESR is the effective
LOAD
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of
series resistance of C . ΔI
also begins to charge
OUT
LOAD
or discharge C , generating a feedback error signal
OUT
the losses in LTC3548-1 circuits: 1)V quiescent current,
IN
used by the regulator to return V
value. During this recovery time, V
to its steady-state
can be monitored
2
OUT
OUT
2) switching losses, 3) I R losses, 4) other losses.
1) The V current is the DC supply current given in the
for overshoot or ringing that would indicate a stability
problem.
IN
ElectricalCharacteristicswhichexcludesMOSFETdriver
and control currents. V current results in a small
IN
The initial output voltage step may not be within the band-
width of the feedback loop, so the standard second-order
overshoot/DC ratio cannot be used to determine phase
(<0.1%) loss that increases with V , even at no load.
IN
Hot Swap is a trademark of Linear Technology Corporation.
35481fb
10
LTC3548-1
APPLICATIONS INFORMATION
2) The switching current is the sum of the MOSFET driver
and control currents. The MOSFET driver current re-
sults from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge dQ moves
duty cycles, such as in dropout, the heat dissipated may
exceed the maximum junction temperature of the part. If
the junction temperature reaches approximately 150°C,
both power switches will turn off and the SW node will
become high impedance.
from V to ground. The resulting dQ/dt is a current
IN
To prevent the LTC3548-1 from exceeding the maximum
junctiontemperature,theuserwillneedtodosomethermal
analysis. The goal of the thermal analysis is to determine
whether the power dissipated exceeds the maximum
junction temperature of the part. The temperature rise is
given by:
out of V that is typically much larger than the DC bias
IN
current. In continuous mode, I
= f (Q + Q ),
GATECHG
O T B
where Q and Q are the gate charges of the internal
T
B
top and bottom MOSFET switches. The gate charge
losses are proportional to V and thus their effects
IN
will be more pronounced at higher supply voltages.
T
= P • θ
D JA
2
RISE
3) I R losses are calculated from the DC resistances of
where P is the power dissipated by the regulator and θ
the internal switches, R , and external inductor, R .
D
JA
SW
L
is the thermal resistance from the junction of the die to
In continuous mode, the average output current flows
throughinductorL,butis“chopped”betweentheinternal
top and bottom switches. Thus, the series resistance
looking into the SW pin is a function of both top and
the ambient temperature.
The junction temperature, T , is given by:
J
T = T
J
+ T
AMBIENT
bottom MOSFET R
follows:
and the duty cycle (D) as
RISE
DS(ON)
As an example, consider the case when the LTC3548-1 is
at an input voltage of 2.7V with a load current of 400mA
and 800mA and an ambient temperature of 70°C. From
the Typical Performance Characteristics graph of Switch
R
= (R
)(D) + (R
)(1 – D)
SW
DS(ON)TOP
DS(ON)BOT
TheR
forboththetopandbottomMOSFETscanbe
DS(ON)
obtained from the Typical Performance Characteristics
Resistance, the R
resistance of the main switch is
DS(ON)
2
curves. Thus, to obtain I R losses:
0.425Ω. Therefore, power dissipated by each channel is:
2
2
I R losses = I
(R + R )
SW L
2
OUT
P = I • R
= 272mW and 68mW
D
DS(ON)
4) Other“hidden”lossessuchascoppertraceandinternal
batteryresistancescanaccountforadditionalefficiency
degradations in portable systems. It is very important
to include these “system” level losses in the design of a
system. The internal battery and fuse resistance losses
The DFN package junction-to-ambient thermal resistance,
JA
the regulator operating in a 70°C ambient temperature is
approximately:
θ , is 40°C/W. Therefore, the junction temperature of
T = (0.272 + 0.068) • 40 + 70 = 83.6°C
J
can be minimized by making sure that C has adequate
IN
charge storage and very low ESR at the switching fre-
quency.Otherlossesincludingdiodeconductionlosses
during dead-time and inductor core losses generally
account for less than 2% total additional loss.
which is below the absolute maximum junction tempera-
ture of 125°C.
Design Example
As a design example, consider using the LTC3548-1 in
an portable application with a Li-Ion battery. The battery
Thermal Considerations
In a majority of applications, the LTC3548-1 does not
dissipate much heat due to its high efficiency. However,
in applications where the LTC3548-1 is running at high
ambient temperature with low supply voltage and high
providesaV =2.8Vto4.2V.Theloadrequiresamaximum
IN
of 800mA in active mode and 2mA in standby mode. The
output voltage is V
= 1.8V.
OUT
35481fb
11
LTC3548-1
APPLICATIONS INFORMATION
First, calculate the inductor value for about 30% ripple
Board Layout Considerations
current at maximum V :
IN
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
theLTC3548-1.Theseitemsarealsoillustratedgraphically
in the layout diagram of Figure 4. Check the following in
your layout:
1.8V
L =
1.8V
4.2V
ꢀ
ꢁ
ꢃ
ꢄ
• 1–
=1.9μH
ꢂ
ꢅ
2.25MHz •240mA
Choosing a vendor’s closest inductor value of 2.2μH,
results in a maximum ripple current of:
1. Does the capacitor C connect to the power V (Pin 3)
IN
IN
and GND (exposed pad) as close as possible? This
capacitor provides the AC current to the internal power
MOSFETs and their drivers.
1.8V
2.25MHz •2.2μ
1.8V
4.2V
ꢂ
ꢃ
ꢅ
ꢆ
ꢀIL =
• 1ꢁ
= 207mA
ꢄ
ꢇ
For cost reasons, a ceramic capacitor will be used. C
OUT
2. The feedback lines from V
should be routed away
OUT
selection is then based on load step droop instead of ESR
from noisy traces such as the SW line and its trace
should be minimized.
requirements. For a 5% output droop:
800mA
2.25MHz •(5%•1.8V)
3. Are the C
and L1 closely connected? The (–) plate of
OUT
COUT ≈1.8
= 7.1μF
C
returns current to GND and the (–) plate of C .
OUT
IN
4. Keep sensitive components away from the SW pins.
Agoodstandardvalueis10μF.Sincetheoutputimpedance
The input capacitor C should be routed away from
IN
of a Li-lon battery is very low, C is typically 10μF.
IN
the SW traces and the inductors.
Figure 3 shows the complete schematic for this design
example.
5. Agroundplaneispreferred,butifnotavailable,keepthe
signal and power grounds segregated with small signal
components returning to the GND pin at one point and
should not share the high current path of C or C
.
IN
OUT
6. Floodallunusedareasonalllayerswithcopper.Flooding
with copper will reduce the temperature rise of power
components. These copper areas should be connected
to V or GND.
IN
V
IN
2.7V TO 5.5V
C
IN
10μF
CER
V
IN
RUN1 RUN2
LTC3548-1
4.7μH
2.2μH
V
V
OUT1
OUT2
1.8V
1.575V
400mA
SW2
SW1
800mA
V
V
V
OUT1
C
10μF
CER
OUT2
C
OUT1
OUT2
C
C
FF1
330pF
FF2
10μF
330pF
CER
V
FB2
FB1
3548-1 F01
GND
Figure 3. LTC3548-1 Typical Application
35481fb
12
LTC3548-1
APPLICATIONS INFORMATION
V
OUT2
L2
C
FF
C
OUT2
GND
GND
C
FF
C
IN
C
OUT1
VIA TO V
OUT1
L1
V
OUT1
V
IN
3548-1 F04
GND
Figure 4. LTC3548-1 Layout Diagram
Efficiency vs Load Current
100
95
90
85
80
75
70
65
60
V
= 1.8V
OUT1
V
= 1.575V
OUT2
1
10
100
1000
LOAD CURRENT (mA)
3548-1 G11
35481fb
13
LTC3548-1
TYPICAL APPLICATIONS
1mm Profile Core and I/O Supplies
V
IN
2.7V TO 5.5V
C1
10μF
V
IN
RUN1 RUN2
LTC3548-1
CER
L1
L2
4.7μH
2.2μH
V
V
OUT1
OUT2
1.8V
1.575V
400mA
SW2
SW1
800mA
V
V
V
OUT1
C3
10μF
CER
OUT2
FB2
C2
C
C
FF1
330pF
FF2
10μF
CER
330pF
V
FB1
3548-1 TA07
GND
C1, C2: MURATA GRM219R60J106KE19
C3: MURATA GRM219R60J475KE19
L1: COILTRONICS LPO3310-222MX
L2: COILTRONICS LPO3310-472MX
*IF C1 IS GREATER THAN 3" FROM POWER SOURCE,
ADDITIONAL CAPACITANCE MAY BE REQUIRED.
Efficiency vs Load Current
100
95
90
V
= 1.8V
OUT1
85
80
75
70
65
60
V
= 1.575V
OUT2
1
10
100
1000
LOAD CURRENT (mA)
3548-1 G11
35481fb
14
LTC3548-1
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
R = 0.115
0.38 0.10
TYP
6
10
0.675 0.05
3.50 0.05
2.15 0.05 (2 SIDES)
1.65 0.05
3.00 0.10
(4 SIDES)
1.65 0.10
(2 SIDES)
PIN 1
PACKAGE
OUTLINE
TOP MARK
(SEE NOTE 6)
(DD) DFN 1103
5
1
0.25 0.05
0.50 BSC
0.75 0.05
0.200 REF
0.25 0.05
0.50
BSC
2.38 0.10
(2 SIDES)
2.38 0.05
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
KD Package
10-Lead Plastic UTDFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1739 Rev Ø)
0.40 ± 0.10
2.00 REF
2.00 REF
3.00 ±0.10
6
10
R = 0.05
TYP
0.675 ±0.05
2.38 ±0.05
2.38 ±0.10
3.50 ±0.05
2.15 ±0.05
3.00 ±0.10
0.55 ±0.05
1.65 ±0.05
1.65 ± 0.10
PIN 1
TOP MARK
PACKAGE
OUTLINE
(SEE NOTE 6)
(KD10) UTDFN 1106 REV Ø
5
1
0.25 ± 0.05
0.50 BSC
0.25 ± 0.05
0.125 REF
R = 0.115
0.50 BSC
TYP
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE VARIATION OF (TBI).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
35481fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LTC3548-1
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
95% Efficiency, V : 2.7V to 6V, V
LTC1878
600mA (I ), 550kHz,
= 0.8V, I = 10μA,
OUT(MIN) Q
OUT
IN
Synchronous Step-Down DC/DC Converter
I
<1μA, MSOP-8 Package
SD
LT1940
Dual Output 1.4A(I
, Constant 1.1MHz,
V : 3V to 25V, V
= 1.2V, I = 2.5mA, I = <1μA,
OUT)
IN
OUT(MIN)
Q
SD
High Efficiency Step-Down DC/DC Converter
TSSOP-16E Package
LTC3252
Dual 250mA (I ), 1MHz, Spread Spectrum
88% Efficiency, V : 2.7V to 5.5V, V
Q SD
= 0.9V to 1.6V,
OUT
IN
OUT(MIN)
Inductorless Step-Down DC/DC Converter
I = 60μA, I < 1μA, DFN-12 Package
LTC3405/LTC3405A
LTC3406/LTC3406B
LT3407/LT3407-2
LTC3410/LTC3410B
LTC3411
300mA (I ), 1.5MHz,
96% Efficiency, V : 2.5V to 5.5V, V
SD
= 0.8V, I = 20μA,
Q
OUT
IN
OUT(MIN)
OUT(MIN)
OUT(MIN)
OUT(MIN)
OUT(MIN)
OUT(MIN)
Synchronous Step-Down DC/DC Converters
I
<1μA, ThinSOT Package
600mA (I ), 1.5MHz,
96% Efficiency, V : 2.5V to 5.5V, V
= 0.6V, I = 20μA,
Q
OUT
IN
Synchronous Step-Down DC/DC Converters
I
SD
<1μA, ThinSOT Package
600mA/1.5MHz, 800mA/2.25MHz
Dual Synchronous Step-Down DC/DC Converter
96% Efficiency, V : 2.5V to 5.5V, V
= 0.6V, I = 40μA,
Q
IN
I
SD
<1μA, MSE, DFN Package
300mA, 2.25MHz Synchronous Step-Down
DC/DC Converters
95% Efficiency, V : 2.5V to 5.5V, V
= 0.8V, I = 26μA,
Q
IN
I
SD
<1μA, SC70 Package
1.25A (I ), 4MHz,
95% Efficiency, V : 2.5V to 5.5V, V
= 0.8V, I = 60μA,
Q
OUT
IN
Synchronous Step Down DC/DC Converter
I
SD
<1μA, MSOP-10 Package
LTC3412
2.5A (I ), 4MHz,
95% Efficiency, V : 2.5V to 5.5V, V
= 0.8V, I = 60μA,
Q
OUT
IN
Synchronous Step Down DC/DC Converter
I
SD
<1μA, TSSOP-16E Package
LTC3414
4A (I ), 4MHz,
95% Efficiency, V : 2.25V to 5.5V, V
SD
= 0.8V, I = 64μA,
OUT(MIN) Q
OUT
IN
Synchronous Step Down DC/DC Converter
I
<1μA, TSSOP-28E Package
LTC3440
600mA (I ), 2MHz,
95% Efficiency, V : 2.5V to 5.5V, V
SD
= 2.5V, I = 25μA,
Q
OUT
IN
OUT(MIN)
Synchronous Buck-Boost DC/DC Converter
I
<1μA, MSOP-10 Package
LTC3548
400mA/800mA (I ), 2.25MHz, Dual Synchronous
95% Efficiency, V : 2.5V to 5.5V, V
SD
= 0.6V, I = 40μA,
Q
OUT
IN
OUT(MIN)
Step-Down DC/DC Converter
I
<1μA, MSE, DFN-10 Packages
35481fb
LT 0608 REV B • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
16
●
●
© LINEAR TECHNOLOGY CORPORATION 2006
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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