LTC3548EKD-1-PBF [Linear]

Dual Synchronous, Fixed Output 2.25MHz Step-Down DC/DC Regulator; 双同步,固定输出的2.25MHz降压型DC / DC稳压器
LTC3548EKD-1-PBF
型号: LTC3548EKD-1-PBF
厂家: Linear    Linear
描述:

Dual Synchronous, Fixed Output 2.25MHz Step-Down DC/DC Regulator
双同步,固定输出的2.25MHz降压型DC / DC稳压器

稳压器
文件: 总16页 (文件大小:920K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC3548-1  
Dual Synchronous, Fixed  
Output 2.25MHz Step-Down  
DC/DC Regulator  
FEATURES  
DESCRIPTION  
TheLTC®3548-1isadual,xedoutput,constantfrequency,  
synchronousstep-downDC/DCconverter.Intendedforlow  
power applications, it operates from 2.5V to 5.5V input  
voltage range and has a constant 2.25MHz switching  
frequency, allowing the use of tiny, low cost capacitors  
and inductors with a profile ≤1mm. The output voltage  
for channel 1 is fixed at 1.8V and for channel 2 is fixed  
at 1.575V. Internal synchronous 0.35Ω, 1.2A/0.7A power  
switches provide high efficiency without the need for ex-  
ternal Schottky diodes. Burst Mode® operation provides  
high efficiency at light loads.  
n
High Efficiency: Up to 95%  
n
1.8V at 800mA/1.575V at 400mA  
n
Very Low Quiescent Current: Only 40μA  
n
2.25MHz Constant Frequency Operation  
n
High Switch Current: 1.2A and 0.7A  
n
No Schottky Diodes Required  
n
V : 2.5V to 5.5V  
IN  
n
Current Mode Operation for Excellent Line  
and Load Transient Response  
Short-Circuit Protected  
n
n
Low Dropout Operation: 100% Duty Cycle  
n
Ultralow Shutdown Current: I < 1μA  
Q
To further maximize battery runtime, the P-channel  
MOSFETs are turned on continuously in dropout (100%  
duty cycle), and both channels draw a total quiescent cur-  
rent of only 40μA. In shutdown, the device draws <1μA.  
n
Small Thermally Enhanced 3mm × 3mm  
DFN Packages  
APPLICATIONS  
The LTC3548-1 is available in both thin (0.75mm) and  
ultra-thin (0.55mm) 3mm × 3mm DFN packages.  
n
PDAs/Palmtop PCs  
n
L, LT, LTC, LTM and Burst Mode are registered trademarks of Linear Technology Corporation  
All other trademarks are the property of their respective owners. Protected by U.S. Patents  
including 5481178, 6580258, 6304066, 6127815, 6498466, 6611131.  
Digital Cameras  
n
Cellular Phones  
n
Portable Media Players  
n
PC Cards  
n
Wireless and DSL Modems  
TYPICAL APPLICATION  
LTC3548-1 Efficiency Curve/Power Loss  
100  
95  
90  
85  
80  
75  
70  
65  
60  
1000  
100  
10  
V
IN  
2.7V TO 5.5V  
C
10μF  
CER  
IN  
V
RUN1 RUN2  
LTC3548-1  
IN  
V
= 1.8V  
OUT1  
4.7μH  
2.2μH  
V
V
OUT1  
OUT2  
1.575V  
400mA  
1.8V  
SW2  
SW1  
V
= 1.575V  
OUT2  
800mA  
V
V
V
OUT1  
C
OUT2  
C
OUT1  
OUT2  
10μF  
CER  
C
C
FF1  
330pF  
FF2  
330pF  
10μF  
CER  
V
1
FB2  
FB1  
3548-1 F01  
GND  
CHANNEL 1  
CHANNEL 2  
0.1  
1000  
1
10  
100  
Figure 1. 1.8V/1.575V at 800mA/400mA Step-Down Regulators  
LOAD CURRENT (mA)  
35481 F01b  
35481fb  
1
LTC3548-1  
ABSOLUTE MAXIMUM RATINGS  
(Note 1)  
V Voltages.................................................0.3V to 6V  
Ambient Operating Temperature Range  
IN  
V
, V , V  
, V  
,
(Note 2)....................................................40°C to 85°C  
Junction Temperature (Note 5) ............................. 125°C  
Storage Temperature Range...................– 65°C to 125°C  
FB1 FB2 OUT1 OUT2  
RUN1, RUN2 Voltages ..................... –0.3V to V + 0.3V  
IN  
SW1, SW2 Voltage........................... –0.3V to V + 0.3V  
IN  
PIN CONFIGURATION  
TOP VIEW  
TOP VIEW  
V
OUT1  
V
1
2
3
4
5
10  
9
V
V
V
1
2
3
4
5
10  
9
V
V
FB1  
FB2  
OUT2  
FB1  
FB2  
V
V
OUT1  
OUT2  
IN  
RUN1  
SW2  
11  
11  
8
V
8
RUN1  
SW2  
IN  
SW1  
GND  
7
SW1  
GND  
7
RUN2  
6
6
RUN2  
DD PACKAGE  
10-LEAD (3mm × 3mm) PLASTIC DFN  
KD PACKAGE  
10-LEAD (3mm × 3mm) PLASTIC UTDFN  
T
= 125°C, θ = 43°C/W, θ = 10°C/W  
JA JC  
T
= 125°C, θ = 40°C/W, θ = 3°C/W  
JMAX  
JMAX  
JA  
JC  
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND  
(SOLDERED TO A 4-LAYER BOARD)  
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND  
(SOLDERED TO A 4-LAYER BOARD)  
ORDER INFORMATION  
LEAD FREE FINISH  
LTC3548EDD-1#PBF  
LTC3548EKD-1#PBF  
TAPE AND REEL  
PART MARKING  
LBZC  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
LTC3548EDD-1#TRPBF  
LTC3548EKD-1#TRPBF  
10-Lead (3mm × 3mm) Plastic DFN  
10-Lead (3mm × 3mm) Plastic UTDFN  
–40°C to 85°C  
–40°C to 85°C  
CXVT  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
35481fb  
2
LTC3548-1  
ELECTRICAL CHARACTERISTICS  
The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, unless otherwise specified. (Note 2)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
V
Operating Voltage Range  
Output Voltage  
2.5  
5.5  
V
IN  
0°C ≤ T ≤ 85°C (Note 3)  
1.764  
1.755  
1.8  
1.8  
1.836  
1.836  
V
V
OUT1  
A
–40°C ≤ T ≤ 85°C (Note 3)  
A
V
OUT2  
Output Voltage  
0°C ≤ T ≤ 85°C (Note 3)  
1.544  
1.536  
1.575 1.607  
1.575 1.607  
V
V
A
–40°C ≤ T ≤ 85°C (Note 3)  
A
ΔV  
ΔV  
Reference Voltage Line Regulation  
Output Voltage Load Regulation  
V
= 2.5V to 5.5V (Note 3)  
0.3  
0.5  
0.5  
%/V  
%
LINE REG  
IN  
(Note 3)  
LOAD REG  
I
S
Input DC Supply Current  
Active Mode  
V
V
= 1.5V, V  
= 1.9V, V  
= 1.3V  
700  
40  
0.1  
950  
60  
1
μA  
μA  
μA  
OUT1  
OUT1  
OUT2  
OUT2  
Sleep Mode  
= 1.65V  
Shutdown  
RUN = 0V, V = 5.5V  
IN  
f
I
Oscillator Frequency  
V
= 1.8V, V = 1.575V  
OUT2  
1.8  
2.25  
2.7  
MHz  
OSC  
OUT1  
Peak Switch Current Limit Channel 1  
Peak Switch Current Limit Channel 2  
V
IN  
V
IN  
= 3V, Duty Cycle <35%  
= 3V, Duty Cycle <35%  
0.95  
0.6  
1.2  
0.7  
1.6  
0.9  
A
A
LIM  
R
Top Switch On-Resistance  
Bottom Switch On-Resistance  
(Note 6)  
(Note 6)  
0.35  
0.30  
0.45  
0.45  
Ω
Ω
DS(ON)  
I
Switch Leakage Current  
RUN Threshold  
V
IN  
= 5V, V  
= 0V, V  
= V = 0  
OUT2  
0.01  
1
1
1.5  
1
μA  
V
SW(LKG)  
RUN  
OUT1  
V
0.3  
RUN  
RUN  
I
RUN Leakage Current  
0.01  
μA  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 3: The LTC3548-1 is tested in a proprietary test mode that connects  
the output of the error amplifier to an outside servo-loop.  
Note 4: Dynamic supply current is higher due to the internal gate charge  
being delivered at the switching frequency.  
Note 2: The LTC3548-1 is guaranteed to meet specified performance  
from 0°C to 85°C. Specifications over the 40°C and 85°C operating  
temperature range are assured by design, characterization and correlation  
with statistical process controls.  
Note 5: T is calculated from the ambient T and power dissipation P  
D
J
A
according to the following formula: T = T + (P θ ).  
J
A
D
JA  
Note 6: The DFN switch on-resistance is guaranteed by correlation to  
wafer level measurements.  
TA = 25°C unless otherwise specified.  
TYPICAL PERFORMANCE CHARACTERISTICS  
Burst Mode Operation  
Load Step  
Load Step  
V
OUT2  
200mV/DIV  
SW  
5V/DIV  
V
OUT1  
200mV/DIV  
I
L
I
200mA/DIV  
L
I
L
500mA/DIV  
200mA/DIV  
I
LOAD  
I
LOAD  
40mA TO  
400mA  
80mA TO  
800mA  
V
OUT1  
20mV/DIV  
200mA/DIV  
500mA/DIV  
3548-1 G03  
3548-1 G02  
3548-1 G01  
V
V
I
= 3.6V  
20μs/DIV  
V
V
I
= 3.6V  
20μs/DIV  
V
V
I
= 3.6V  
2μs/DIV  
IN  
OUT2  
IN  
OUT1  
IN  
OUT1  
= 1.575V  
= 40mA TO 400mA  
= 1.8V  
= 80mA TO 800mA  
= 1.8V  
= 60mA  
LOAD  
LOAD  
LOAD  
CHANNEL 2; CIRCUIT OF FIGURE 3  
CHANNEL 1; CIRCUIT OF FIGURE 3  
CHANNEL 1; CIRCUIT OF FIGURE 3  
35481fb  
3
LTC3548-1  
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified.  
Oscillator Frequency  
vs Temperature  
Oscillator Frequency  
vs Input Voltage  
Efficiency vs Input Voltage  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
10  
8
100  
95  
90  
85  
80  
75  
70  
65  
60  
V
= 3.6V  
IN  
I
= 100mA  
OUT  
6
4
2
0
I
= 800mA  
OUT  
I
= 10mA  
OUT  
–2  
–4  
–6  
–8  
–10  
I
= 1mA  
OUT  
4
4.5  
2
2.5  
3
3.5  
5
5.5  
6
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
4
5
6
2
3
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
3548-1 G04  
3548-1 G05  
3548-1 G06  
Output Voltage Error  
vs Temperature  
RDS(ON) vs Input Voltage  
RDS(ON) vs Junction Temperature  
1
0.8  
500  
450  
400  
350  
300  
250  
200  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
V
= 3.6V  
V
= 2.7V  
IN  
IN  
V
= 3.6V  
IN  
0.6  
V
= 4.2V  
IN  
0.4  
MAIN  
SWITCH  
0.2  
0
–0.2  
–0.4  
–0.6  
–0.8  
–1  
SYNCHRONOUS  
SWITCH  
MAIN SWITCH  
SYNCHRONOUS SWITCH  
3
5
7
1
2
4
6
50  
100 125 150  
–50  
0
25  
50  
75 100 125  
–50 –25  
0
25  
75  
–25  
TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
JUNCTION TEMPERATURE (°C)  
3548-1 G08  
3548-1 G07  
3548-1 G09  
Efficiency vs Load Current  
Load Regulation  
Line Regulation  
100  
95  
90  
85  
80  
75  
70  
65  
60  
2.0  
1.5  
0.5  
0.4  
0.3  
V
= 1.8V  
1.0  
OUT1  
0.2  
V
= 1.8V  
V
= 1.8V  
OUT1  
OUT1  
0.5  
0.1  
V
= 1.575V  
OUT2  
V
= 1.575V  
OUT2  
0
0
V
= 1.575V  
OUT2  
–0.1  
–0.2  
–0.3  
–0.4  
–0.5  
–0.5  
–1.0  
–1.5  
–2.0  
1
10  
100  
1000  
1
10  
100  
1000  
2.5  
3
4
4.5  
5
5.5  
3.5  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
3548-1 G11  
3548-1 G12  
3548-1 G15  
35481fb  
4
LTC3548-1  
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified.  
Efficiency vs Load Current  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
V
= 3.6V  
V
= 2.7V  
IN  
IN  
V
= 3.6V  
V
= 2.7V  
IN  
IN  
V
= 4.2V  
IN  
V
= 4.2V  
IN  
V
= 1.575V  
V
= 1.8V  
OUT2  
OUT1  
NO LOAD ON OTHER CHANNEL  
CIRCUIT OF FIGURE 3  
NO LOAD ON OTHER CHANNEL  
CIRCUIT OF FIGURE 3  
1
10  
100  
1000  
1
10  
100  
1000  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
3548-1 G17  
3548-1 G16  
PIN FUNCTIONS  
FB1  
feedback voltage from internal resistive divider across the  
output. Normal voltage for this pin is 0.6V.  
V
(Pin 1): Output Feedback for Channel 1. Receives the  
SW2 (Pin 7): Regulator 2 Switch Node Connection to the  
Inductor. This pin swings from V to GND.  
IN  
RUN1(Pin8):Regulator1Enable.ForcingthispintoV en-  
IN  
V
(Pin 2): Output Voltage Feedback Pin for Channel 1.  
ablesregulator1,whileforcingittoGNDcausesregulator1  
OUT1  
Aninternalresistivedividerdividestheoutputvoltagedown  
to shut down. This pin must be driven; do not float.  
for comparison to the internal reference voltage.  
V
(Pin 9): Output Voltage Feedback Pin for Channel 2.  
OUT2  
V (Pin3):InputPowerSupply.Mustbecloselydecoupled  
Aninternalresistivedividerdividestheoutputvoltagedown  
IN  
to GND.  
for comparison to the internal reference voltage.  
SW1 (Pin 4): Regulator 1 Switch Node Connection to the  
V
(Pin 10): Output Feedback for Channel 2. Receives  
FB2  
Inductor. This pin swings from V to GND.  
the feedback voltage from internal resistive divider across  
the output. Normal voltage for this pin is 0.6V.  
IN  
GND (Pin 5): Ground. Connect to the (–) terminal of C  
OUT  
and (–) terminal of C (see Figure 4).  
Exposed Pad (GND) (Pin 11): Ground. Connect to the  
IN  
(–) terminal of C , and (–) terminal of C . Must be con-  
OUT  
IN  
RUN2(Pin6):Regulator2Enable.ForcingthispintoV en-  
IN  
nected to electrical ground on PCB (see Figure 4).  
ablesregulator2,whileforcingittoGNDcausesregulator2  
to shut down. This pin must be driven; do not float.  
35481fb  
5
LTC3548-1  
BLOCK DIAGRAM  
REGULATOR 1  
V
IN  
BURST  
CLAMP  
V
IN  
SLOPE  
COMP  
EN  
BURST  
+
+
0.6V  
SLEEP  
+
I
TH  
5ꢀ  
EA  
I
COMP  
0.35V  
V
2
1
OUT1  
S
R
Q
V
FB  
R1  
RS  
LATCH  
V
FB1  
Q
0.55V  
+
R3  
SWITCHING  
LOGIC  
UV  
OV  
UVDET  
OVDET  
AND  
BLANKING  
CIRCUIT  
ANTI  
SHOOT-  
THRU  
4
SW1  
+
0.65V  
+
I
RCMP  
SHUTDOWN  
11 GND  
V
IN  
3
5
V
IN  
8
6
RUN1  
RUN2  
0.6V REF  
OSC  
OSC  
GND  
SW2  
REGULATOR 2 (IDENTICAL TO REGULATOR 1)  
9
V
OUT2  
R1 = 240k, R3 = 120k FOR REGULATOR 1  
R1 = 195k, R3 = 120k FOR REGULATOR 2  
7
10  
V
FB2  
3548-1 BD  
35481fb  
6
LTC3548-1  
OPERATION  
The LTC3548-1 uses a constant frequency, current mode  
architecture. The operating frequency is set at 2.25MHz.  
Both channels share the same clock and run in-phase.  
Low Current Operation  
When the load is relatively light, the LTC3548-1 auto-  
matically switches into Burst Mode operation, in which  
the PMOS switch operates intermittently based on load  
demand with a fixed peak inductor current. By running  
cycles periodically, the switching losses which are domi-  
nated by the gate charge losses of the power MOSFETs  
are minimized. The main control loop is interrupted when  
the output voltage reaches the desired regulated value. A  
The output voltage is set by an internal divider. An error  
amplfier compares the divided output voltage with a  
reference voltage of 0.6V and adjusts the peak inductor  
current accordingly.  
Main Control Loop  
voltagecomparatortripswhenI isbelow0.35V,shutting  
TH  
Duringnormaloperation,thetoppowerswitch(P-channel  
MOSFET) is turned on at the beginning of a clock cycle  
off the switch and reducing the power. The output capaci-  
tor and the inductor supply the power to the load until I  
TH  
when the V  
voltage is below the regulated voltage. The  
OUT  
exceeds 0.65V, turning on the switch and the main control  
current flows into the inductor and the load increases until  
current limit is reached. The switch turns off and energy  
stored in the inductor flows through the bottom switch  
(N-channel MOSFET) into the load until the next  
clock cycle.  
loop which starts another cycle.  
Dropout Operation  
When the input supply voltage decreases toward the  
output voltage, the duty cycle increases to 100% which  
is the dropout condition. In dropout, the PMOS switch is  
turnedoncontinuouslywiththeoutputvoltagebeingequal  
to the input voltage minus the voltage drops across the  
internal p-channel MOSFET and the inductor.  
The peak inductor current is controlled by the internally  
compensated I voltage, which is the output of the error  
TH  
amplifier.ThisamplifiercomparesthefeedbackvoltageV  
FB  
to the 0.6V reference (see Block Diagram). When the load  
currentincreases,theV voltagedecreasesslightlybelow  
FB  
the reference. This decrease causes the error amplifier to  
An important design consideration is that the R  
DS(ON)  
increase the I voltage until the average inductor current  
of the P-channel switch increases with decreasing input  
supply voltage (see Typical Performance Characteristics).  
Therefore, the user should calculate the power dissipation  
when the LTC3548-1 is used at 100% duty cycle with low  
input voltage (see Thermal Considerations in the Applica-  
tions Information section).  
TH  
matches the new load current.  
The main control loop is shut down by pulling the RUN  
pin to ground.  
Low Supply Operation  
Topreventunstableoperation,theLTC3548-1incorporates  
an undervoltage lockout circuit which shuts down the part  
when the input voltage drops below about 1.65V.  
35481fb  
7
LTC3548-1  
APPLICATIONS INFORMATION  
A general LTC3548-1 application circuit is shown in  
Figure 2. External component selection is driven by the  
load requirement, and begins with the selection of the  
higher ripple current which causes this to occur at lower  
load currents. This causes a dip in efficiency in the upper  
range of low current operation. In Burst Mode operation,  
lower inductance values will cause the burst frequency  
to increase.  
inductor L. Once the inductor is chosen, C and C  
IN  
OUT  
can be selected.  
Inductor Core Selection  
V
IN  
2.7V TO 5.5V  
C
10μF  
CER  
IN  
Different core materials and shapes will change the size/  
currentandprice/currentrelationshipofaninductor.Toroid  
or shielded pot cores in ferrite or permalloy materials are  
small and don’t radiate much energy, but generally cost  
more than powdered iron core inductors with similar elec-  
trical characterisitics. The choice of which style inductor  
to use often depends more on the price vs size require-  
ments and any radiated field/EMI requirements than on  
what the LTC3548-1 requires to operate. Table 1 shows  
some typical surface mount inductors that work well in  
LTC3548-1 applications.  
V
RUN1 RUN2  
LTC3548-1  
IN  
4.7μH  
2.2μH  
V
V
OUT1  
1.8V  
800mA  
OUT2  
1.575V  
400mA  
SW2  
SW1  
V
V
V
OUT1  
C
OUT2  
FB2  
C
OUT1  
OUT2  
10μF  
CER  
C
C
FF2  
330pF  
FF1  
330pF  
10μF  
CER  
V
FB1  
3548-1 F01  
GND  
Figure 2. LTC3548-1 General Schematic  
Inductor Selection  
Table 1. Representative Surface Mount Inductors  
Althoughtheinductordoesnotinfluencetheoperatingfre-  
quency, the inductor value has a direct effect on ripple cur-  
PART  
NUMBER  
VALUE  
(μH)  
DCR  
MAX DC  
SIZE  
3
(Ω MAX) CURRENT (A) W × L × H (mm )  
rent. The inductor ripple current ΔI decreases with higher  
L
Sumida  
CDRH3D16  
2.2  
3.3  
4.7  
0.075  
0.110  
0.162  
1.20  
1.10  
0.90  
3.8 × 3.8 × 1.8  
inductance and increases with higher V or V  
:
IN  
OUT  
OUT ꢄ  
V
VOUT  
fO L  
Sumida  
CMD4D06  
2.2  
4.7  
0.089  
0.166  
0.95  
0.75  
4.1 × 3.2 × 0.8  
4.4 × 5.8 × 1.2  
2.5 × 3.2 × 2.0  
2.5 × 3.2 × 2.0  
4.5 × 5.4 × 1.2  
IL =  
• 1–  
V
IN  
Sumida  
CMD4D11  
2.2  
3.3  
0.116  
0.174  
0.950  
0.770  
Accepting larger values of ΔI allows the use of low induc-  
L
Murata  
LQH32CN  
1.0  
2.2  
0.060  
0.097  
1.00  
0.79  
tances, but results in higher output voltage ripple, greater  
core losses, and lower output current capability.  
Toko  
D312F  
2.2  
3.3  
0.060  
0.260  
1.08  
0.92  
A reasonable starting point for setting ripple current is  
ΔI =0.3•I  
, whereI  
is0.8Aforchannel1  
L
OUT(MAX)  
OUT(MAX)  
Panasonic  
ELT5KT  
3.3  
4.7  
0.17  
0.20  
1.00  
0.95  
and 400mA for channel 2. The largest ripple current ΔI  
L
occurs at the maximum input voltage. To guarantee that  
the ripple current stays below a specified maximum, the  
inductor value should be chosen according to the follow-  
ing equation:  
Input Capacitor (C ) Selection  
IN  
In continuous mode, the input current of the converter is a  
square wave with a duty cycle of approximately V /V .  
OUT IN  
VOUT  
fO IL  
VOUT  
L =  
• 1–  
Topreventlargevoltagetransients, alowequivalentseries  
resistance (ESR) input capacitor sized for the maximum  
RMS current must be used. The maximum RMS capacitor  
current is given by:  
V
IN(MAX)  
The inductor value will also have an effect on Burst Mode  
operation. The transition from low current operation  
begins when the peak inductor current falls below a level  
set by the burst clamp. Lower inductor values result in  
VOUT V – V  
(
)
IN  
OUT  
IRMS IMAX  
V
IN  
35481fb  
8
LTC3548-1  
APPLICATIONS INFORMATION  
where the maximum average output current I  
equals  
of any aluminum electrolytic at a somewhat higher price.  
Special polymer capacitors, such as Sanyo POSCAP,  
Panasonic Special Polymer (SP), and Kemet A700, of-  
fer very low ESR, but have a lower capacitance density  
than other types. Tantalum capacitors have the highest  
capacitance density, but they have a larger ESR and it  
is critical that the capacitors are surge tested for use in  
switching power supplies. An excellent choice is the AVX  
TPS series of surface mount tantalums, available in case  
heightsrangingfrom2mmto4mm.Aluminumelectrolytic  
capacitors have a significantly larger ESR, and are often  
usedinextremelycost-sensitiveapplicationsprovidedthat  
consideration is given to ripple current ratings and long  
term reliability. Ceramic capacitors have the lowest ESR  
and cost, but also have the lowest capacitance density,  
a high voltage and temperature coefficient, and exhibit  
audible piezoelectric effects. In addition, the high Q of  
ceramic capacitors along with trace inductance can lead  
to significant ringing.  
MAX  
the peak current minus half the peak-to-peak ripple cur-  
rent, I = I ΔI /2.  
MAX  
LIM  
L
This formula has a maximum at V = 2V , where I  
RMS  
IN  
OUT  
= I /2. This simple worst-case is commonly used to  
OUT  
design because even significant deviations do not offer  
much relief. Note that capacitor manufacturer’s ripple cur-  
rent ratings are often based on only 2000 hours lifetime.  
This makes it advisable to further derate the capacitor,  
or choose a capacitor rated at a higher temperature than  
required.Severalcapacitorsmayalsobeparalleledtomeet  
thesizeorheightrequirementsofthedesign.Anadditional  
0.1μF to 1μF ceramic capacitor is also recommended on  
V for high frequency decoupling, when not using an all  
IN  
ceramic capacitor solution.  
Output Capacitor (C ) Selection  
OUT  
The selection of C  
is driven by the required ESR to  
OUT  
minimizevoltagerippleandloadsteptransients. Typically,  
once the ESR requirement is satisfied, the capacitance  
In most cases, 0.1μF to 1μF of ceramic capacitors should  
also be placed close to the LTC3548-1 in parallel with the  
main capacitors for high frequency decoupling.  
is adequate for filtering. The output ripple (ΔV ) is  
OUT  
determined by:  
1
Ceramic Input and Output Capacitors  
VOUT ꢁ ꢀIL ESR+  
8fO C  
OUT ꢆ  
Higher value, lower cost ceramic capacitors are now be-  
comingavailableinsmallercasesizes. Thesearetempting  
for switching regulator use because of their very low ESR.  
Unfortunately, the ESR is so low that it can cause loop  
stabilityproblems.SolidtantalumcapacitorESRgenerates  
aloopzeroat5kHzto50kHzthatisinstrumentalingiving  
acceptableloopphasemargin. Ceramiccapacitorsremain  
capacitivetobeyond300kHzandusuallyresonatewiththeir  
ESLbeforeESRbecomeseffective. Also, ceramiccapsare  
prone to temperature effects which requires the designer  
to check loop stability over the operating temperature  
range. To minimize their large temperature and voltage  
coefficients, only X5R or X7R ceramic capacitors should  
beused.Agoodselectionofceramiccapacitorsisavailable  
from Taiyo Yuden, AVX, Kemet, TDK, and Murata.  
wheref =operatingfrequency,C  
=outputcapacitance  
O
OUT  
and ΔI = ripple current in the inductor. The output ripple  
L
is highest at maximum input voltage since ΔI increases  
L
with input voltage. With ΔI = 0.3 • I  
the output  
L
OUT(MAX)  
ripple will be less than 100mV at maximum V and  
IN  
f = 2.25MHz with:  
O
ESR  
< 150mΩ  
COUT  
Once the ESR requirements for C  
have been met, the  
OUT  
RMS current rating generally far exceeds the I  
RIPPLE(P-P)  
requirement, except for an all ceramic solution.  
In surface mount applications, multiple capacitors may  
have to be paralleled to meet the capacitance, ESR or  
RMS current handling requirement of the application.  
Aluminum electrolytic, special polymer, ceramic and dry  
tantulum capacitors are all available in surface mount  
packages.TheOS-CONsemiconductordielectriccapacitor  
available from Sanyo has the lowest ESR(size) product  
Great care must be taken when using only ceramic input  
and output capacitors. When a ceramic capacitor is used  
at the input and the power is being supplied through long  
wires, suchasfromawalladapter, aloadstepattheoutput  
35481fb  
9
LTC3548-1  
APPLICATIONS INFORMATION  
can induce ringing at the V pin. At best, this ringing can  
margin.Inaddition,afeed-forwardcapacitor,C ,isadded  
IN  
FF  
couple to the output and be mistaken as loop instability.  
At worst, the ringing at the input can be large enough to  
damage the part.  
externallytoimprovethehighfrequencyresponse.Capaci-  
tor C provides phase lead by creating a high frequency  
FF  
zero with R1, which improves the phase margin.  
Since the ESR of a ceramic capacitor is so low, the input  
and output capacitor must instead fulfill a charge storage  
requirement.Duringaloadstep,theoutputcapacitormust  
instantaneously supply the current to support the load  
until the feedback loop raises the switch current enough  
to support the load. The time required for the feedback  
loop to respond is dependent on the compensation and  
theoutputcapacitorsize. Typically, 3-4cyclesarerequired  
to respond to a load step, but only in the first cycle does  
Theoutputvoltagesettlingbehaviorisrelatedtothestability  
of the closed-loop system and will demonstrate the actual  
overall supply performance. For a detailed explanation of  
optimizing the compensation components, including a re-  
view of control loop theory, refer to Application Note 76.  
In some applications, a more severe transient can be  
caused by switching loads with large (>1μF) load input  
capacitors. The discharged load input capacitors are ef-  
fectively put in parallel with C , causing a rapid drop in  
OUT  
the output drop linearly. The output droop, V  
, is  
DROOP  
V
OUT  
. No regulator can deliver enough current to prevent  
usually about 2-3 times the linear drop of the first cycle.  
Thus, a good place to start is with the output capacitor  
size of approximately:  
this problem, if the switch connecting the load has low  
resistance and is driven quickly. The solution is to limit  
the turn-on speed of the load switch driver. A Hot Swap™  
controller is designed specifically for this purpose and  
usuallyincorporatescurrentlimiting, short-circuitprotec-  
tion, and soft-starting.  
ΔIOUT  
fO VDROOP  
COUT 2.5  
More capacitance may be required depending on the duty  
cycle and load step requirements.  
Efficiency Considerations  
Inmostapplications,theinputcapacitorismerelyrequired  
to supply high frequency bypassing, since the impedance  
to the supply is very low. A 10μF ceramic capacitor is  
usually enough for these conditions.  
The percent efficiency of a switching regulator is equal to  
the output power divided by the input power times 100%.  
It is often useful to analyze individual losses to determine  
what is limiting the efficiency and which change would  
produce the most improvement. Percent efficiency can  
be expressed as:  
Checking Transient Response  
The regulator loop response can be checked by look-  
ing at the load transient response. Switching regulators  
take several cycles to respond to a step in load current.  
% Efficiency = 100% – (L1 + L2 + L3 + ...)  
where L1, L2, etc. are the individual losses as a percent-  
age of input power.  
When a load step occurs, V  
immediately shifts by an  
OUT  
amount equal to ΔI  
• ESR, where ESR is the effective  
LOAD  
Although all dissipative elements in the circuit produce  
losses, four main sources usually account for most of  
series resistance of C . ΔI  
also begins to charge  
OUT  
LOAD  
or discharge C , generating a feedback error signal  
OUT  
the losses in LTC3548-1 circuits: 1)V quiescent current,  
IN  
used by the regulator to return V  
value. During this recovery time, V  
to its steady-state  
can be monitored  
2
OUT  
OUT  
2) switching losses, 3) I R losses, 4) other losses.  
1) The V current is the DC supply current given in the  
for overshoot or ringing that would indicate a stability  
problem.  
IN  
ElectricalCharacteristicswhichexcludesMOSFETdriver  
and control currents. V current results in a small  
IN  
The initial output voltage step may not be within the band-  
width of the feedback loop, so the standard second-order  
overshoot/DC ratio cannot be used to determine phase  
(<0.1%) loss that increases with V , even at no load.  
IN  
Hot Swap is a trademark of Linear Technology Corporation.  
35481fb  
10  
LTC3548-1  
APPLICATIONS INFORMATION  
2) The switching current is the sum of the MOSFET driver  
and control currents. The MOSFET driver current re-  
sults from switching the gate capacitance of the power  
MOSFETs. Each time a MOSFET gate is switched from  
low to high to low again, a packet of charge dQ moves  
duty cycles, such as in dropout, the heat dissipated may  
exceed the maximum junction temperature of the part. If  
the junction temperature reaches approximately 150°C,  
both power switches will turn off and the SW node will  
become high impedance.  
from V to ground. The resulting dQ/dt is a current  
IN  
To prevent the LTC3548-1 from exceeding the maximum  
junctiontemperature,theuserwillneedtodosomethermal  
analysis. The goal of the thermal analysis is to determine  
whether the power dissipated exceeds the maximum  
junction temperature of the part. The temperature rise is  
given by:  
out of V that is typically much larger than the DC bias  
IN  
current. In continuous mode, I  
= f (Q + Q ),  
GATECHG  
O T B  
where Q and Q are the gate charges of the internal  
T
B
top and bottom MOSFET switches. The gate charge  
losses are proportional to V and thus their effects  
IN  
will be more pronounced at higher supply voltages.  
T
= P θ  
D JA  
2
RISE  
3) I R losses are calculated from the DC resistances of  
where P is the power dissipated by the regulator and θ  
the internal switches, R , and external inductor, R .  
D
JA  
SW  
L
is the thermal resistance from the junction of the die to  
In continuous mode, the average output current flows  
throughinductorL,butischoppedbetweentheinternal  
top and bottom switches. Thus, the series resistance  
looking into the SW pin is a function of both top and  
the ambient temperature.  
The junction temperature, T , is given by:  
J
T = T  
J
+ T  
AMBIENT  
bottom MOSFET R  
follows:  
and the duty cycle (D) as  
RISE  
DS(ON)  
As an example, consider the case when the LTC3548-1 is  
at an input voltage of 2.7V with a load current of 400mA  
and 800mA and an ambient temperature of 70°C. From  
the Typical Performance Characteristics graph of Switch  
R
= (R  
)(D) + (R  
)(1 – D)  
SW  
DS(ON)TOP  
DS(ON)BOT  
TheR  
forboththetopandbottomMOSFETscanbe  
DS(ON)  
obtained from the Typical Performance Characteristics  
Resistance, the R  
resistance of the main switch is  
DS(ON)  
2
curves. Thus, to obtain I R losses:  
0.425Ω. Therefore, power dissipated by each channel is:  
2
2
I R losses = I  
(R + R )  
SW L  
2
OUT  
P = I • R  
= 272mW and 68mW  
D
DS(ON)  
4) Otherhiddenlossessuchascoppertraceandinternal  
batteryresistancescanaccountforadditionalefficiency  
degradations in portable systems. It is very important  
to include these “system” level losses in the design of a  
system. The internal battery and fuse resistance losses  
The DFN package junction-to-ambient thermal resistance,  
JA  
the regulator operating in a 70°C ambient temperature is  
approximately:  
θ , is 40°C/W. Therefore, the junction temperature of  
T = (0.272 + 0.068) • 40 + 70 = 83.6°C  
J
can be minimized by making sure that C has adequate  
IN  
charge storage and very low ESR at the switching fre-  
quency.Otherlossesincludingdiodeconductionlosses  
during dead-time and inductor core losses generally  
account for less than 2% total additional loss.  
which is below the absolute maximum junction tempera-  
ture of 125°C.  
Design Example  
As a design example, consider using the LTC3548-1 in  
an portable application with a Li-Ion battery. The battery  
Thermal Considerations  
In a majority of applications, the LTC3548-1 does not  
dissipate much heat due to its high efficiency. However,  
in applications where the LTC3548-1 is running at high  
ambient temperature with low supply voltage and high  
providesaV =2.8Vto4.2V.Theloadrequiresamaximum  
IN  
of 800mA in active mode and 2mA in standby mode. The  
output voltage is V  
= 1.8V.  
OUT  
35481fb  
11  
LTC3548-1  
APPLICATIONS INFORMATION  
First, calculate the inductor value for about 30% ripple  
Board Layout Considerations  
current at maximum V :  
IN  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of  
theLTC3548-1.Theseitemsarealsoillustratedgraphically  
in the layout diagram of Figure 4. Check the following in  
your layout:  
1.8V  
L =  
1.8V  
4.2V  
• 1–  
=1.9μH  
2.25MHz 240mA  
Choosing a vendor’s closest inductor value of 2.2μH,  
results in a maximum ripple current of:  
1. Does the capacitor C connect to the power V (Pin 3)  
IN  
IN  
and GND (exposed pad) as close as possible? This  
capacitor provides the AC current to the internal power  
MOSFETs and their drivers.  
1.8V  
2.25MHz 2.2μ  
1.8V  
4.2V  
IL =  
• 1ꢁ  
= 207mA  
For cost reasons, a ceramic capacitor will be used. C  
OUT  
2. The feedback lines from V  
should be routed away  
OUT  
selection is then based on load step droop instead of ESR  
from noisy traces such as the SW line and its trace  
should be minimized.  
requirements. For a 5% output droop:  
800mA  
2.25MHz (5%1.8V)  
3. Are the C  
and L1 closely connected? The (–) plate of  
OUT  
COUT 1.8  
= 7.1μF  
C
returns current to GND and the (–) plate of C .  
OUT  
IN  
4. Keep sensitive components away from the SW pins.  
Agoodstandardvalueis1F.Sincetheoutputimpedance  
The input capacitor C should be routed away from  
IN  
of a Li-lon battery is very low, C is typically 10μF.  
IN  
the SW traces and the inductors.  
Figure 3 shows the complete schematic for this design  
example.  
5. Agroundplaneispreferred,butifnotavailable,keepthe  
signal and power grounds segregated with small signal  
components returning to the GND pin at one point and  
should not share the high current path of C or C  
.
IN  
OUT  
6. Floodallunusedareasonalllayerswithcopper.Flooding  
with copper will reduce the temperature rise of power  
components. These copper areas should be connected  
to V or GND.  
IN  
V
IN  
2.7V TO 5.5V  
C
IN  
10μF  
CER  
V
IN  
RUN1 RUN2  
LTC3548-1  
4.7μH  
2.2μH  
V
V
OUT1  
OUT2  
1.8V  
1.575V  
400mA  
SW2  
SW1  
800mA  
V
V
V
OUT1  
C
10μF  
CER  
OUT2  
C
OUT1  
OUT2  
C
C
FF1  
330pF  
FF2  
10μF  
330pF  
CER  
V
FB2  
FB1  
3548-1 F01  
GND  
Figure 3. LTC3548-1 Typical Application  
35481fb  
12  
LTC3548-1  
APPLICATIONS INFORMATION  
V
OUT2  
L2  
C
FF  
C
OUT2  
GND  
GND  
C
FF  
C
IN  
C
OUT1  
VIA TO V  
OUT1  
L1  
V
OUT1  
V
IN  
3548-1 F04  
GND  
Figure 4. LTC3548-1 Layout Diagram  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
V
= 1.8V  
OUT1  
V
= 1.575V  
OUT2  
1
10  
100  
1000  
LOAD CURRENT (mA)  
3548-1 G11  
35481fb  
13  
LTC3548-1  
TYPICAL APPLICATIONS  
1mm Profile Core and I/O Supplies  
V
IN  
2.7V TO 5.5V  
C1  
10μF  
V
IN  
RUN1 RUN2  
LTC3548-1  
CER  
L1  
L2  
4.7μH  
2.2μH  
V
V
OUT1  
OUT2  
1.8V  
1.575V  
400mA  
SW2  
SW1  
800mA  
V
V
V
OUT1  
C3  
10μF  
CER  
OUT2  
FB2  
C2  
C
C
FF1  
330pF  
FF2  
10μF  
CER  
330pF  
V
FB1  
3548-1 TA07  
GND  
C1, C2: MURATA GRM219R60J106KE19  
C3: MURATA GRM219R60J475KE19  
L1: COILTRONICS LPO3310-222MX  
L2: COILTRONICS LPO3310-472MX  
*IF C1 IS GREATER THAN 3" FROM POWER SOURCE,  
ADDITIONAL CAPACITANCE MAY BE REQUIRED.  
Efficiency vs Load Current  
100  
95  
90  
V
= 1.8V  
OUT1  
85  
80  
75  
70  
65  
60  
V
= 1.575V  
OUT2  
1
10  
100  
1000  
LOAD CURRENT (mA)  
3548-1 G11  
35481fb  
14  
LTC3548-1  
PACKAGE DESCRIPTION  
DD Package  
10-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1699)  
R = 0.115  
0.38 0.10  
TYP  
6
10  
0.675 0.05  
3.50 0.05  
2.15 0.05 (2 SIDES)  
1.65 0.05  
3.00 0.10  
(4 SIDES)  
1.65 0.10  
(2 SIDES)  
PIN 1  
PACKAGE  
OUTLINE  
TOP MARK  
(SEE NOTE 6)  
(DD) DFN 1103  
5
1
0.25 0.05  
0.50 BSC  
0.75 0.05  
0.200 REF  
0.25 0.05  
0.50  
BSC  
2.38 0.10  
(2 SIDES)  
2.38 0.05  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).  
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
KD Package  
10-Lead Plastic UTDFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1739 Rev Ø)  
0.40 ± 0.10  
2.00 REF  
2.00 REF  
3.00 ±0.10  
6
10  
R = 0.05  
TYP  
0.675 ±0.05  
2.38 ±0.05  
2.38 ±0.10  
3.50 ±0.05  
2.15 ±0.05  
3.00 ±0.10  
0.55 ±0.05  
1.65 ±0.05  
1.65 ± 0.10  
PIN 1  
TOP MARK  
PACKAGE  
OUTLINE  
(SEE NOTE 6)  
(KD10) UTDFN 1106 REV Ø  
5
1
0.25 ± 0.05  
0.50 BSC  
0.25 ± 0.05  
0.125 REF  
R = 0.115  
0.50 BSC  
TYP  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE VARIATION OF (TBI).  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
35481fb  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
15  
LTC3548-1  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
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I
<1μA, ThinSOT Package  
600mA (I ), 1.5MHz,  
96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 20μA,  
Q
OUT  
IN  
Synchronous Step-Down DC/DC Converters  
I
SD  
<1μA, ThinSOT Package  
600mA/1.5MHz, 800mA/2.25MHz  
Dual Synchronous Step-Down DC/DC Converter  
96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 40μA,  
Q
IN  
I
SD  
<1μA, MSE, DFN Package  
300mA, 2.25MHz Synchronous Step-Down  
DC/DC Converters  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V, I = 26μA,  
Q
IN  
I
SD  
<1μA, SC70 Package  
1.25A (I ), 4MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V, I = 60μA,  
Q
OUT  
IN  
Synchronous Step Down DC/DC Converter  
I
SD  
<1μA, MSOP-10 Package  
LTC3412  
2.5A (I ), 4MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V, I = 60μA,  
Q
OUT  
IN  
Synchronous Step Down DC/DC Converter  
I
SD  
<1μA, TSSOP-16E Package  
LTC3414  
4A (I ), 4MHz,  
95% Efficiency, V : 2.25V to 5.5V, V  
SD  
= 0.8V, I = 64μA,  
OUT(MIN) Q  
OUT  
IN  
Synchronous Step Down DC/DC Converter  
I
<1μA, TSSOP-28E Package  
LTC3440  
600mA (I ), 2MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
SD  
= 2.5V, I = 25μA,  
Q
OUT  
IN  
OUT(MIN)  
Synchronous Buck-Boost DC/DC Converter  
I
<1μA, MSOP-10 Package  
LTC3548  
400mA/800mA (I ), 2.25MHz, Dual Synchronous  
95% Efficiency, V : 2.5V to 5.5V, V  
SD  
= 0.6V, I = 40μA,  
Q
OUT  
IN  
OUT(MIN)  
Step-Down DC/DC Converter  
I
<1μA, MSE, DFN-10 Packages  
35481fb  
LT 0608 REV B • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
16  
© LINEAR TECHNOLOGY CORPORATION 2006  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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