LTC3565IMSE-TRPBF [Linear]

1.25A, 4MHz, Synchronous Step-Down DC/DC Converter; 1.25A ,为4MHz ,同步降压型DC / DC转换器
LTC3565IMSE-TRPBF
型号: LTC3565IMSE-TRPBF
厂家: Linear    Linear
描述:

1.25A, 4MHz, Synchronous Step-Down DC/DC Converter
1.25A ,为4MHz ,同步降压型DC / DC转换器

转换器
文件: 总20页 (文件大小:594K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC3565  
1.25A, 4MHz, Synchronous  
Step-Down DC/DC Converter  
FEATURES  
DESCRIPTION  
The LTC®3565 is a constant frequency, synchronous  
step-down DC/DC converter. Intended for medium power  
applications, it operates from a 2.5V to 5.5V input voltage  
range and has a user configurable operating frequency  
up to 4MHz, allowing the use of tiny, low cost capacitors  
and inductors 1mm or less in height. The output voltage is  
adjustablefrom0.6Vto5.5V. Internalsynchronouspower  
switches provide high efficiency. The LTC3565’s current  
mode architecture and external compensation allow the  
transient response to be optimized over a wide range of  
loads and output capacitors.  
High Efficiency: Up to 95%  
IN  
V Range: 2.5V to 5.5V  
High Frequency Operation: Up to 4MHz  
Selectable Low Ripple (Typical 25mV  
)
p-p  
Burst Mode® Operation: I = 40μA  
Q
Stable with Ceramic Capacitors  
Uses Tiny Capacitors and Inductor  
Low R  
Internal Switches: 0.15Ω  
DS(ON)  
Current Mode Operation for Excellent Line  
and Load Transient Response  
Short-Circuit Protected  
Low Dropout Operation: 100% Duty Cycle  
The LTC3565 can be configured for automatic power  
saving Burst Mode operation (I = 40μA) to reduce gate  
charge losses when the load current drops below the level  
required for continuous operation. For reduced noise and  
RF interference, the SYNC/MODE pin can be configured to  
skip pulses or provide forced continuous operation.  
Low Shutdown Current: I ≤ 1μA  
Q
Q
Output Voltages from 0.6V to 5V  
Synchronizable to External Clock  
Supports Pre-Biased Outputs  
Small 10-Lead (3mm × 3mm) DFN or MSOP Package  
To further maximize battery life, the P-channel MOSFET  
is turned on continuously in dropout (100% duty cycle).  
In shutdown, the device draws <1μA.  
, LT, LTC, LTM and Burst Mode are registered trademarks of Linear Technology  
Corporation. All other trademarks are the property of their respective owners. Protected by  
U.S. Patents, including 5481178, 6580258, 6498466, 6611131.  
APPLICATIONS  
Notebook Computers  
Digital Cameras  
Cellular Phones  
Handheld Instruments  
Board Mounted Power Supplies  
TYPICAL APPLICATION  
Efficiency and Power Loss vs Output Current  
Step-Down 2.5V/1.25A Regulator  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1
V
IN  
2.5V TO 5.5V  
22μF  
0.1  
SV PV  
IN  
IN  
SYNC/MODE  
RUN  
2.2μH  
V
OUT  
0.01  
0.001  
SW  
PGOOD  
2.5V  
LTC3565  
1.25A  
ITH  
RT  
22μF  
22pF  
12.1k  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
IN  
IN  
IN  
V
FB  
931k  
294k  
GND  
680pF  
0.0001  
10000  
191k  
0.1  
1
10  
100  
1000  
OUTPUT CURRENT (mA)  
3565 TA01a  
3565 TA01b  
3565f  
1
LTC3565  
ABSOLUTE MAXIMUM RATINGS (Note 1)  
PV , SV Voltages ..................................... –0.3V to 6V  
Operating Junction Temperature Range  
IN  
IN  
V , ITH, RT Voltages ....................–0.3V to (V + 0.3V)  
(Notes 2, 5, 8)........................................ –40°C to 125°C  
Storage Temperature Range................... –65°C to 125°C  
Lead Temperature (Soldering, 10 sec) .................. 300°C  
FB  
IN  
SYNC/MODE, PGOOD Voltage .......–0.3V to (V + 0.3V)  
IN  
SW Voltage (DC) ...........................–0.3V to (V + 0.3V)  
IN  
RUN Voltage ............................................... –0.3V to 6V  
PIN CONFIGURATION  
TOP VIEW  
TOP VIEW  
RT  
RUN  
1
2
3
4
5
10 ITH  
RT  
RUN  
1
2
3
4
5
10 ITH  
9
8
7
6
V
FB  
9
8
7
6
V
FB  
11  
SYNC/MODE  
SW  
PGOOD  
11  
SYNC/MODE  
SW  
PGOOD  
SV  
IN  
PV  
IN  
SV  
PV  
IN  
IN  
GND  
GND  
MSE PACKAGE  
10-LEAD PLASTIC MSOP  
DD PACKAGE  
T
= 125°C, θ = 40°C/W, θ = 10°C/W  
JMAX  
JA JC  
10-LEAD (3mm × 3mm) PLASTIC DFN  
= 125°C, θ = 43°C/W, θ = 7.5°C/W  
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB  
T
JMAX  
JA JC  
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB  
ORDER INFORMATION  
LEAD FREE FINISH  
LTC3565EDD#PBF  
LTC3565IDD#PBF  
LTC3565EMSE#PBF  
LTC3565IMSE#PBF  
TAPE AND REEL  
PART MARKING*  
LTDNR  
PACKAGE DESCRIPTION  
10-Lead (3mm × 3mm) Plastic DFN  
TEMPERATURE RANGE  
–40°C to 125°C  
LTC3565EDD#TRPBF  
LTC3565IDD#TRPBF  
LTC3565EMSE#TRPBF  
LTC3565IMSE#TRPBF  
LTDNR  
10-Lead (3mm × 3mm) Plastic DFN  
10-Lead Plastic MSOP  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
LTDVJ  
LTDVJ  
10-Lead Plastic MSOP  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
ELECTRICAL CHARACTERISTICS The denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, RT = 125k unless otherwise specified. (Note 2)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
Operating Voltage Range  
2.5  
5.5  
V
IN  
I
Feedback Pin Input Current  
Feedback Voltage  
(Note 3)  
(Note 3)  
50  
0.612  
0.2  
nA  
V
FB  
V
0.588  
0.6  
0.04  
0.02  
300  
FB  
ΔV  
ΔV  
Reference Voltage Line Regulation  
Output Voltage Load Regulation  
Error Amplifier Transconductance  
V
= 2.5V to 5V  
IN  
%/V  
%
LINEREG  
ITH = 0.55V to 0.9V  
0.2  
LOADREG  
g
ITH Pin Load = 5μA (Note 3)  
μS  
m(EA)  
3565f  
2
LTC3565  
ELECTRICAL CHARACTERISTICS The denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, RT = 125k unless otherwise specified. (Note 2)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
Input DC Supply Current (Note 4)  
Active Mode  
S
V
V
V
= 3.6V, V = 0.55V  
330  
40  
0.1  
450  
60  
1
μA  
μA  
μA  
SYNC/MODE  
SYNC/MODE  
RUN  
FB  
Sleep Mode  
= 3.6V, V = 0.8V  
FB  
Shutdown  
= 0V  
f
Oscillator Frequency  
RT = 125k  
(Note 7)  
1.3  
1.5  
1.7  
4
MHz  
MHz  
OSC  
f
I
Synchronization Frequency  
Peak Switch Current Limit  
Top Switch On-Resistance  
(Note 7)  
0.4  
1.5  
4
MHz  
SYNC  
LIM  
V
= 0.5V  
2.1  
2.5  
0.2  
A
FB  
R
MSE Package  
DD Package (Note 6)  
0.15  
0.15  
Ω
Ω
DS(ON)  
Bottom Switch On-Resistance  
MSE Package  
DD Package (Note 6)  
0.13  
0.13  
0.18  
Ω
Ω
I
Switch Leakage Current  
RUN Threshold  
V
= 5V, V  
= 0V, V = 0V  
0.01  
1
1.5  
1
μA  
SW(LKG)  
IN  
RUN  
FB  
V
0.3  
0.8  
V
RUN  
RUN  
I
RUN Leakage Current  
Undervoltage Lockout Threshold  
Power Good Threshold  
0.01  
1.9  
μA  
V
V
V
Ramping Down  
2.2  
UVLO  
IN  
PGOOD  
V
V
Ramping Up from 0.45V to 0.6V  
Ramping Down from 0.69V to 0.6V  
–7  
7
%
%
FB  
FB  
R
Power Good Pull-Down On-Resistance  
15  
20  
Ω
PGOOD  
PGOOD Blanking  
V
V
Step from 0V to 0.6V  
Step from 0.6V to 0V  
40  
105  
μs  
μs  
FB  
FB  
V
Pulse Skip  
Force Continuous  
Burst  
0.63  
V
V
V
SYNC-MODE  
1.1  
– 0.75  
0.6  
V – 1.05  
IN  
V
IN  
t
10% to 90% of Regulation  
0.9  
1.2  
ms  
SOFT-START  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 5: T is calculated from the ambient T and power dissipation P  
according to the following formulas:  
J
A
D
LTC3565EDD: T = T + (P • 43°C/W)  
J
A
D
LTC3565EMS: T = T + (P • 120°C/W)  
J
A
D
Note 2: The LTC3565E is guaranteed to meet performance specifications  
from 0°C to 125°C junction temperature. Specifications over the –40°C  
to 125°C operating junction temperature range are assured by design,  
characterization and correlation with statistical process controls. The  
LTC3565I is guaranteed over the full –40°C to 125°C operating junction  
temperature range. High junction temperatures degrade operating lifetimes.  
Operating lifetime is derated at junction temperatures greater than 125°C.  
Note 6: Switch on-resistance is guaranteed by correlation to wafer level  
measurements and assured by design characterization and correlation with  
statistical process controls.  
Note 7: 4MHz operation is guaranteed by design but not production tested  
and is subject to duty cycle limitations (see Applications Information).  
Note 8: This IC includes overtemperature protection that is intended  
to protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
Note 3: The LTC3565 is tested in a feedback loop which servos V to the  
FB  
midpoint for the error amplifier (V = 0.7V).  
ITH  
Note 4: Dynamic supply current is higher due to the internal gate charge  
being delivered at the switching frequency.  
3565f  
3
LTC3565  
TYPICAL PERFORMANCE CHARACTERISTICS  
TA = 25°C, VIN = 3.6V, fO = 1MHz, unless  
otherwise noted.  
Efficiency vs Input Voltage  
Efficiency vs Output Current  
Efficiency vs Output Current  
100  
90  
80  
70  
60  
50  
40  
30  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
I
= 100mA  
I
= 10mA  
OUT  
OUT  
I
= 1.25A  
OUT  
I
= 1mA  
OUT  
I
= 0.1mA  
5.0  
OUT  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
IN  
IN  
IN  
20  
10  
0
IN  
IN  
IN  
V
= 1.8V  
OUT  
V
OUT  
= 1.8V  
1
V
OUT  
= 1.5V  
1
4.5  
INPUT VOLTAGE(V)  
5.5  
2.5  
3.0  
3.5  
4.0  
0.1  
10  
100  
1000  
10000  
0.1  
10  
100  
1000  
10000  
OUTPUT CURRENT (mA)  
OUTPUT CURRENT (mA)  
3565 G02  
3565 G03  
3565 G01  
Efficiency vs Output Current  
Efficiency vs Frequency  
Load Regulation  
95  
94  
93  
92  
91  
90  
89  
88  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1.00  
Burst Mode  
OPERATION  
4.7μH  
0.75  
0.50  
PULSE  
SKIP  
2.2μH  
Burst Mode OPERATION  
0.25  
FORCED CONTINUOUS  
PULSE SKIP  
0.00  
1μH  
FORCED CONTINUOUS  
= 1.8V  
–0.25  
–0.50  
V
= 1.8V  
V
OUT  
OUT  
V
= 1.8V  
1000  
OUT  
4
0
1
2
3
5
800  
1000 1200 1400  
0.1  
1
10  
100  
10000  
0
200 400 600  
OUTPUT CURRENT (mA)  
FREQUENCY (MHz)  
OUTPUT CURRENT(mA)  
3565 G04  
3565 G05  
3565 G06  
Reference Voltage vs  
Temperature  
Frequency Variation vs  
Temperature  
Line Regulation  
615  
610  
605  
600  
0.6  
6
0.4  
0.2  
4
2
0.0  
0
595  
590  
585  
–0.2  
–0.4  
–0.6  
–2  
–4  
–6  
V
= 1.8V  
= 400mA  
OUT  
I
LOAD  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
4.5  
2.5  
3.0  
3.5  
4.0  
5.0  
5.5  
50  
–50 –25  
0
25  
75 100 125  
INPUT VOLTAGE(V)  
TEMPERATURE(°C)  
3565 G08  
3565 G07  
3565 G09  
3565f  
4
LTC3565  
TYPICAL PERFORMANCE CHARACTERISTICS  
TA = 25°C, VIN = 3.6V, fO = 1MHz, unless  
otherwise noted.  
Frequency Variation vs Input  
Voltage  
RDS(ON) vs Input Voltage  
RDS(ON) vs Temperature  
0.25  
0.20  
0.30  
0.25  
6
4
2
0.20  
0.15  
0.10  
0.15  
0.10  
0
–2  
–4  
–6  
–8  
0.05  
0.0  
0.05  
0.0  
MAIN SWITCH  
MAIN SWITCH  
SYNCHRONOUS SWITCH  
SYNCHRONOUS SWITCH  
4.5  
INPUT VOLTAGE (V)  
2.5  
3.0  
3.5  
4.0  
5.0  
5.5  
50  
TEMPERATURE (°C)  
–50 –25  
0
25  
75 100 125  
4.5  
INPUT VOLTAGE (V)  
2.5  
3.0  
3.5  
4.0  
5.0  
5.5  
3565 G11  
3565 G12  
3565 G10  
Dynamic Supply Current vs Input  
Voltage  
Dynamic Supply Current vs  
Temperature  
Switch Leakage vs Input Voltage  
100  
10  
2500  
100  
10  
FORCED CONTINUOUS  
FORCED CONTINUOUS  
2000  
1500  
1000  
MAIN SWITCH  
1
1
PULSE SKIP  
PULSE SKIP  
Burst Mode  
OPERATION  
Burst Mode  
OPERATION  
0.1  
0.1  
SYNCHRONOUS SWITCH  
0.01  
0.001  
0.01  
0.001  
500  
0
V
I
= 1.8V  
= 0A  
V
LOAD  
= 1.8V  
OUT  
LOAD  
OUT  
I
= 0A  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
4
0
1
2
3
5
6
–50 –25  
0
25  
50  
75  
100 125  
INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
3565 G13  
3565 G14  
3565 G15  
Burst Mode Operation  
Pulse Skipping Mode  
Switch Leakage vs Temperature  
600  
500  
SW  
2V/DIV  
SW  
2V/DIV  
400  
300  
200  
100  
0
V
V
OUT  
OUT  
50mV/DIV  
50mV/DIV  
AC COUPLED  
AC COUPLED  
I
I
L
L
200mA/DIV  
200mA/DIV  
MAIN SWITCH  
SYNCHRONOUS SWITCH  
3565 G17  
3565 G18  
4μs/DIV  
4μs/DIV  
V
V
I
= 3.6V  
V
V
I
= 3.6V  
IN  
OUT  
IN  
OUT  
= 1.8V  
= 1.8V  
= 5mA  
= 50mA  
50  
–50 –25  
0
25  
75 100 125  
LOAD  
LOAD  
TEMPERATURE (°C)  
3565 G16  
3565f  
5
LTC3565  
TYPICAL PERFORMANCE CHARACTERISTICS  
TA = 25°C, VIN = 3.6V, fO = 1MHz, unless  
Start-Up from Shutdown  
otherwise noted.  
Forced Continuous Mode  
Start-Up from Shutdown  
RUN  
2V/DIV  
SW  
2V/DIV  
RUN  
2V/DIV  
V
V
OUT  
OUT  
V
OUT  
50mV/DIV  
1V/DIV  
1V/DIV  
AC COUPLED  
I
I
L
L
I
500mA/DIV  
1A/DIV  
L
200mA/DIV  
3565 G20  
3565 G21  
400μs/DIV  
400μs/DIV  
V
V
I
= 3.6V  
V
V
I
= 3.6V  
IN  
OUT  
IN  
OUT  
3565 G19  
2μs/DIV  
= 1.8V  
= 0A  
= 1.8V  
V
V
LOAD  
= 3.6V  
= 1.25A  
IN  
LOAD  
LOAD  
= 1.8V  
Burst Mode OPERATION  
Burst Mode OPERATION  
OUT  
I
= 80mA  
Start-Up from Shutdown with  
a Prebiased Output (Forced  
Continuous Mode)  
Load Step  
Load Step  
V
V
V
OUT  
OUT  
OUT  
100mV/DIV  
100mV/DIV  
1V/DIV  
AC COUPLED  
AC COUPLED  
I
I
I
L
L
L
1A/DIV  
1A/DIV  
500mA/DIV  
I
I
LOAD  
1A/DIV  
LOAD  
1A/DIV  
3565 G23  
3565 G24  
3565 G22  
40μs/DIV  
40μs/DIV  
200μs/DIV  
V
V
I
= 3.6V  
V
V
I
= 3.6V  
V
= 3.6V  
IN  
OUT  
IN  
OUT  
IN  
= 1.8V  
= 0A to 1.25A  
= 1.8V  
= 50mA to 1.25A  
PREBIASED V  
= 3V, V  
= 1.8V  
OUT  
OUT  
I
= 0A  
LOAD  
LOAD  
LOAD  
Burst Mode OPERATION  
Burst Mode OPERATION  
VOUT Short to VIN (Forced  
Continuous Mode)  
Load Step  
VOUT Short to Ground  
V
OUT  
V
OUT  
1V/DIV  
100mV/DIV  
AC COUPLED  
V
OUT  
1V/DIV  
I
L
1A/DIV  
I
I
L
L
2A/DIV  
500mA/DIV  
I
LOAD  
1A/DIV  
3565 G26  
3565 G27  
3565 G25  
40μs/DIV  
40μs/DIV  
40μs/DIV  
V
V
I
= 3.6V  
V
V
I
= 3.6V  
V
V
I
= 3.6V  
IN  
OUT  
IN  
OUT  
IN  
OUT  
= 1.8V  
= 0A  
= 1.8V  
= 0A  
= 1.8V  
= 250mA to 1.25A  
LOAD  
LOAD  
LOAD  
Burst Mode OPERATION  
3565f  
6
LTC3565  
PIN FUNCTIONS  
RT (Pin 1): Timing Resistor Pin. The oscillator frequency  
is programmed by connecting a resistor from this pin to  
ground.  
PV (Pin 6): Main Supply Pin. Must be closely decoupled  
IN  
to GND.  
SV (Pin 7): The Signal Power Pin. All active circuitry is  
IN  
RUN (Pin 2): Converter Enable Pin. Forcing this pin above  
1.5V enables this part, while forcing it below 0.3V causes  
the device to shut down. In shutdown, the device draws  
<1μA supply current. This pin must be driven; do not float.  
powered from this pin. Must be closely decoupled to GND.  
SV must be greater than or equal to PV .  
IN  
IN  
PGOOD (Pin 8): The Power Good Pin. This common drain  
logic output is pulled to GND when the output voltage is  
not within 7% of regulation.  
SYNC/MODE (Pin 3): Combination Mode Selection and  
Oscillator Synchronization Pin. This pin controls the  
V
(Pin 9): Receives the feedback voltage from the ex-  
FB  
operation of the device. When tied to SV or GND, Burst  
IN  
ternal resistive divider across the output. Nominal voltage  
Mode operation or pulse skipping mode is selected,  
for this pin is 0.6V.  
respectively. If this pin is held at half of SV , the forced  
IN  
ITH (Pin 10): Error Amplifier Compensation Point. The  
current comparator threshold increases with this control  
voltage. Nominal voltage range for this pin is 0.4V to  
1.4V.  
continuous mode is selected. The oscillation frequency  
can be synchronized to an external oscillator applied to  
this pin. When synchronized to an external clock, pulse  
skip mode is selected.  
Exposed Pad (Pin 11): Ground. Must be soldered to  
electrical ground on PCB.  
SW (Pin 4): The Switch Node Connection to the Inductor.  
This pin swings from PV to GND.  
IN  
GND (Pin 5): Main Power Ground Pin. Connect to the  
(–) terminal of C , and (–) terminal of C .  
OUT  
IN  
NOMINAL (V)  
TYP  
ABSOLUTE MAX (V)  
PIN  
1
NAME  
RT  
DESCRIPTION  
MIN  
–0.3  
–0.3  
0
MAX  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
MAX  
Timing Resistor  
Enable Pin  
0.4  
SV  
SV  
SV  
PV  
SV + 0.3  
IN  
IN  
IN  
IN  
IN  
2
RUN  
SV  
IN  
3
SYNC/MODE Mode Select/Synchronization Pin  
SV + 0.3  
IN  
4
SW  
Switch Node  
0
PV + 0.3  
IN  
5
GND  
Main Power Ground  
Main Power Supply  
Signal Power Supply  
Power Good Pin  
0
6
PV  
SV  
–0.3  
2.5  
0
5.5  
5.5  
SV  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
6
6
IN  
IN  
7
8
PGOOD  
SV + 0.3  
IN  
IN  
9
V
Output Feedback Pin  
Error Amplifier Compensation  
0
0.8  
1.0  
1.5  
SV + 0.3  
IN  
FB  
10  
ITH  
0
SV + 0.3  
IN  
3565f  
7
LTC3565  
BLOCK DIAGRAM  
SV  
GND  
5
ITH  
10  
PV  
IN  
IN  
7
6
0.6V  
PMOS CURRENT  
COMPARATOR  
VOLTAGE  
REFERENCE  
ITH  
LIMIT  
BCLAMP  
+
+
+
9
V
FB  
ERROR  
AMPLIFIER  
V
B
BURST  
COMPARATOR  
+
0.645V  
SLOPE  
COMPENSATION  
4
SW  
OSCILLATOR  
+
LOGIC  
0.555V  
+
PGOOD  
8
NMOS  
COMPARATOR  
+
5
GND  
REVERSE  
COMPARATOR  
2
1
3
3565 BD  
RUN  
RT  
SYNC/MODE  
3565f  
8
LTC3565  
OPERATION  
The LTC3565 uses a constant frequency, current mode  
switch from continuous operation to the selected mode  
when the load current is low.  
architecture. The operating frequency is determined by  
the value of the R resistor or can be synchronized to an  
T
To optimize efficiency, the Burst Mode operation can be  
selected. When the load is relatively light, the LTC3565  
automaticallyswitchesintoBurstModeoperationinwhich  
the PMOS switch operates intermittently based on load  
demand. By running cycles periodically, the switching  
losses which are dominated by the gate charge losses  
of the power MOSFETs are minimized. The main control  
loop is interrupted when the output voltage reaches the  
desired regulated value. The burst comparator trips when  
ITH is below approximately 0.5V, shutting off the switch  
and reducing the power. The output capacitor and the  
inductor supply the power to the load until ITH rises above  
approximately 0.5V, turning on the switch and the main  
control loop which starts another cycle.  
external oscillator. To suit a variety of applications, the  
selectable MODE pin allows the user to trade-off noise  
for efficiency.  
The output voltage is set by an external divider returned  
to the V pin. An error amplifier compares the divided  
FB  
output voltage with the reference voltage of 0.6V and ad-  
justs the peak inductor current accordingly. Overvoltage  
andundervoltagecomparatorswillpullthePGOODoutput  
low if the output voltage is not within 7% of its regulated  
value. A tripping delay of 40μs and untripping delay of  
105μs ensures PGOOD will not glitch due to transient  
spikes on V  
.
OUT  
Main Control Loop  
For lower output voltage ripple at low currents, pulse  
skipping mode can be used. In this mode, the LTC3565  
continues to switch at a constant frequency down to  
very low currents, where it will eventually begin skipping  
pulses.  
Duringnormaloperation,thetoppowerswitch(P-channel  
MOSFET) is turned on at the beginning of a clock cycle.  
Currentowsthroughthisswitchintotheinductorandthe  
load, increasing until the peak inductor current reaches  
the limit set by the voltage on the ITH pin. Then, the top  
switch is turned off, the bottom switch is turned on, and  
the energy stored in the inductor forces the current to  
flow through the bottom switch and the inductor out into  
the load until the next clock cycle.  
Finally, in forced continuous mode, the inductor cur-  
rent is constantly cycled which creates a fixed output  
voltage ripple at all output current levels. This feature is  
desirable in telecommunications since the noise is at a  
constant frequency and is thus easy to filter out. Another  
advantage of this mode is that the regulator is capable  
of both sourcing current into a load and sinking current  
from the output.  
The peak inductor current is controlled by the voltage  
on the ITH pin, which is the output of the error amplifier.  
The output is developed by the error amplifier comparing  
the feedback voltage, V , to the 0.6V reference voltage.  
FB  
When the load current increases, the output voltage and  
Dropout Operation  
V
decrease slightly. This decrease in V causes the er-  
FB  
FB  
Whentheinputsupplyvoltagedecreasestowardtheoutput  
voltage, the duty cycle increases to 100% which is the  
dropout condition. In dropout, the PMOS switch is turned  
on continuously with the output voltage being equal to the  
input voltage minus the voltage drops across the internal  
P-channel MOSFET and the inductor.  
ror amplifier to increase the ITH voltage until the average  
inductor current matches the new load current.  
The main control loop is shut down by grounding the RUN  
pin, resetting the internal soft-start. Re-enabling the main  
control loop by pulling RUN high activates the internal  
soft-start, which slowly ramps the output voltage over  
approximately 0.9ms until it reaches regulation.  
Low Supply Operation  
TheLTC3565incorporatesanundervoltagelockoutcircuit  
which shuts down the part when the input voltage drops  
below about 1.9V to prevent unstable operation.  
Low Current Operation  
Three modes are available to control the operation of the  
LTC3565 at low currents. All three modes automatically  
3565f  
9
LTC3565  
APPLICATIONS INFORMATION  
A general LTC3565 application circuit is shown in  
Figure 4.Externalcomponentselectionisdrivenbytheload  
requirement, and begins with the selection of the inductor  
inductances, but results in higher output ripple voltage,  
greater core loss and lower output capability.  
A reasonable starting point for setting ripple current is  
L1. Once L1 is chosen, C and C  
can be selected.  
IN  
OUT  
ΔI = 0.4•I  
,whereI  
is1.25A.Thelargest  
L
OUT(MAX)  
OUT(MAX)  
ripplecurrentΔI occursatthemaximuminputvoltage.To  
L
Operating Frequency  
guarantee that the ripple current stays below a specified  
maximum, theinductorvalueshouldbechosenaccording  
to the following equation:  
Selectionoftheoperatingfrequencyisatrade-offbetween  
efficiency and component size. High frequency operation  
allows the use of smaller inductor and capacitor values.  
Operation at lower frequencies improves efficiency by  
reducing internal gate charge losses but requires larger  
inductance values and/or capacitance to maintain low  
output ripple voltage.  
VOUT  
fO IL  
VOUT  
VIN(MAX)  
L =  
• 1ꢁ  
The inductor value will also have an effect on Burst Mode  
operation. The transition from low current operation  
begins when the peak inductor current falls below a level  
set by the burst clamp. Lower inductor values result in  
higher ripple current which causes this to occur at lower  
load currents. This causes a dip in efficiency in the upper  
range of low current operation. In Burst Mode operation,  
lower inductance values will cause the burst frequency  
to increase.  
Theoperatingfrequency,f ,oftheLTC3565isdetermined  
O
by an external resistor that is connected between the RT  
pin and ground. The value of the resistor sets the ramp  
current that is used to charge and discharge an internal  
timingcapacitorwithintheoscillatorandcanbecalculated  
by using the following equation:  
6
–1.2674  
R = 1.21 × 10 (f )  
(kΩ)  
T
O
5000  
T
= 25°C  
A
where R is in kΩ and f is in kHz or can be selected  
T
O
4500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
using Figure 1.  
The maximum usable operating frequency is limited by  
the minimum on-time and the duty cycle. This can be  
calculated as:  
VOUT  
fO(MAX) 6.67 •  
(MHz)  
V
IN(MAX)  
0
The minimum frequency is limited by leakage and noise  
0
100  
200  
300  
400  
500  
600  
coupling due to the large resistance of R .  
R
(kΩ)  
T
T
3565 F01  
Inductor Selection  
Figure 1. Frequency vs RT  
Inductor Core Selection  
The operating frequency, f , has a direct effect on the  
O
inductorvalue,whichinturninfluencestheinductorripple  
Different core materials and shapes will change the  
size/current and price/current relationship of an induc-  
tor. Toroid or shielded pot cores in ferrite or permalloy  
materials are small and don’t radiate much energy, but  
generally cost more than powdered iron core inductors  
with similar electrical characteristics. The choice of which  
style inductor to use often depends more on the price vs  
sizerequirementsandanyradiatedeld/EMIrequirements  
current, ΔI :  
L
OUT ꢅ  
V
VOUT  
fO L  
IL =  
• 1ꢁ  
VIN  
The inductor ripple current decreases with larger induc-  
tanceorfrequency, andincreaseswithhigherV or V  
.
IN  
OUT  
Accepting larger values of ΔI allows the use of lower  
L
than on what the LTC3565 requires to operate. Table 1  
3565f  
10  
LTC3565  
APPLICATIONS INFORMATION  
shows some typical surface mount inductors that work  
diode peak current and average power dissipation so as  
not to exceed the diode ratings. The main problem with  
Schottkydiodesisthattheirparasiticcapacitancereduces  
the efficiency, usually negating the possible benefits for  
LTC3565 circuits. Another problem that a Schottky diode  
can introduce is higher leakage current at high tempera-  
tures, which could reduce the low current efficiency.  
well in LTC3565 applications.  
Table 1. Representative Surface Mount Inductors  
MANU-  
FACTURER PART NUMBER  
MAXDC  
VALUE CURRENT DCR HEIGHT  
Toko  
A914BYW-1R2M=P3:  
D52LC  
1.2μH 2.15A  
44mΩ 2mm  
A960AW-1R2M=P3:  
D518LC  
1.2μH  
1.8A  
46mΩ 1.8mm  
Remember to keep lead lengths short and observe proper  
grounding(seeBoardLayoutConsiderations)toavoidring-  
ing and increased dissipation when using a catch diode.  
DB3015C-1068AS-1R0N 1.0μH  
DB3018C-1069AS-1R0N 1.0μH  
DB3020C-1070AS-1R0N 1.0μH  
2.1A  
2.1A  
2.1A  
43mΩ 1.5mm  
45mΩ 1.8mm  
47mΩ 2mm  
49mΩ 2mm  
22mΩ 3mm  
80mΩ 1mm  
70mΩ 3mm  
120mΩ 1mm  
72mΩ 3mm  
40mΩ 1.2mm  
36mΩ 1.5mm  
24mΩ 2mm  
Input Capacitor (C ) Selection  
IN  
A914BYW-2R2M-D52LC 2.2μH 2.05A  
In continuous mode, the input current of the converter is a  
A915AY-2ROM-D53LC 2.0μH  
3.3A  
2.1A  
2.3A  
2.4A  
2.1A  
2.2A  
2.2A  
2.1A  
square wave with a duty cycle of approximately V /V .  
OUT IN  
Coilcraft LPO1704-122ML  
D01608C-222  
1.2μH  
2.2μH  
2.2μH  
1.0μH  
1.0μH  
1.2μH  
1.1μH  
1.0μH  
1.1μH  
Topreventlargevoltagetransients,alowequivalentseries  
resistance (ESR) input capacitor sized for the maximum  
RMS current must be used. The maximum RMS capacitor  
current is given by:  
LP01704-222M  
Sumida  
CR32-1R0  
CR5D11-1R0  
CDRH3D14-1R2  
CDRH4D18C/LD-1R1  
CDRH4D28C/LD-1R0  
CDRH4D28C-1R1  
CDRH4D28-1R2  
CDRH6D12-1R0  
CDRH4D282R2  
CDC5D232R2  
VOUT(V VOUT  
)
IN  
IRMS IMAX  
V
IN  
3.0A 17.5mΩ 3mm  
3.8A 22mΩ 3mm  
where the maximum average output current I  
equals  
MAX  
1.2μH 2.56A 23.6mΩ 3mm  
1.0μH 2.80A 37.5mΩ 1.5mm  
the peak current minus half the peak-to-peak ripple cur-  
rent, I I – ΔI /2.  
MAX  
LIM  
L
2.2μH 2.04A  
2.2μH 2.16A  
23mΩ 3mm  
30mΩ 2.5mm  
27mΩ 1.8mm  
29mΩ 3.2mm  
32mΩ 2.8mm  
24mΩ 5mm  
80mΩ 1mm  
This formula has a maximum at V = 2V , where  
IN  
OUT  
I
= I /2. This simple worst case is commonly used  
RMS  
OUT  
Taiyo  
Yuden  
NPO3SB1ROM  
N06DB2R2M  
1.0μH  
2.2μH  
2.2μH  
2.2μH  
0.9μH  
2.6A  
3.2A  
2.9A  
3.2A  
1.4A  
to design because even significant deviations do not offer  
muchrelief. Notethatcapacitormanufacturer’sripplecur-  
rent ratings are often based on only 2000 hours lifetime.  
This makes it advisable to further derate the capacitor,  
or choose a capacitor rated at a higher temperature than  
required.Severalcapacitorsmayalsobeparalleledtomeet  
thesizeorheightrequirementsofthedesign.Anadditional  
0.1μF to 1μF ceramic capacitor is also recommended on  
N05DB2R2M  
Murata  
FDK  
LQN6C2R2M04  
MIPW3226DORGM  
Catch Diode Selection  
Although unnecessary in most applications, a small  
improvement in efficiency can be obtained in a few ap-  
plications by including the optional diode D1 shown in  
Figure 2, which conducts when the synchronous switch  
is off. When using Burst Mode operation or pulse skip  
mode, the synchronous switch is turned off at a low  
current and the remaining current will be carried by the  
optional diode. It is important to adequately specify the  
V for high frequency decoupling, when not using an all  
IN  
ceramic capacitor solution.  
Output Capacitor (C ) Selection  
OUT  
The selection of C  
is driven by the required ESR to  
OUT  
minimizevoltagerippleandloadsteptransients.Typically,  
once the ESR requirement is satisfied, the capacitance  
3565f  
11  
LTC3565  
APPLICATIONS INFORMATION  
is adequate for filtering. The output ripple (ΔV ) is  
In most cases, 0.1μF to 1μF of ceramic capacitors should  
also be placed close to the LTC3565 in parallel with the  
main capacitors for high frequency decoupling.  
OUT  
determined by:  
L ꢃ  
1
VOUT ꢁ ꢀI ESR +  
8fOCOUT  
Ceramic Input and Output Capacitors  
Higher value, lower cost ceramic capacitors are now be-  
coming available in smaller case sizes. Their high ripple  
current, high voltage rating and low ESR make them  
ideal for switching regulator applications. Because the  
LTC3565’s control loop does not depend on the output  
capacitor’s ESR for stable operation, ceramic capacitors  
can be used freely to achieve very low output ripple and  
small circuit size.  
where f = operating frequency, C  
= output capacitance  
OUT  
and ΔI = ripple current in the inductor. The output ripple  
L
is highest at maximum input voltage since ΔI increases  
L
with input voltage. With ΔI = 0.4 • I  
, the output  
L
OUT(MAX)  
ripplewillbelessthan100mVatmaximumV  
,aminimum  
IN  
C
of 10μF and f = 1MHz with:  
OUT  
O
ESRC  
< 150mΩ  
OUT  
Once the ESR requirements for C  
have been met, the  
OUT  
However, care must be taken when ceramic capacitors are  
used at the input. When a ceramic capacitor is used at the  
input and the power is supplied by a wall adapter through  
long wires, a load step at the output can induce ringing at  
RMS current rating generally far exceeds the I  
RIPPLE(P-P)  
requirement, except for an all ceramic solution.  
In surface mount applications, multiple capacitors may  
have to be paralleled to meet the capacitance, ESR or RMS  
currenthandlingrequirementoftheapplication.Aluminum  
electrolytic, special polymer, ceramic and dry tantalum  
capacitors are all available in surface mount packages.  
The OS-CON semiconductor dielectric capacitor avail-  
able from Sanyo has the lowest ESR(size) product of any  
aluminum electrolytic at a somewhat higher price. Special  
polymer capacitors, such as Sanyo POSCAP, offer very  
low ESR, but have a lower capacitance density than other  
types. Tantalum capacitors have the highest capacitance  
density, but it has a larger ESR and it is critical that the  
capacitors are surge tested for use in switching power  
supplies. An excellent choice is the AVX TPS series of  
surfacemounttantalums,availableincaseheightsranging  
from2mmto4mm.Aluminumelectrolyticcapacitorshave  
a significantly larger ESR, and is often used in extremely  
cost-sensitive applications provided that consideration is  
given to ripple current ratings and long term reliability.  
Ceramic capacitors have the lowest ESR and cost but also  
have the lowest capacitance density, a high voltage and  
temperature coefficient and exhibit audible piezoelectric  
effects.Inaddition,thehighQofceramiccapacitorsalong  
withtraceinductancecanleadtosignificantringing.Other  
capacitor types include the Panasonic specialty polymer  
(SP) capacitors.  
theinput, V . Atbest, thisringingcancoupletotheoutput  
IN  
and be mistaken as loop instability. At worst, a sudden  
inrush of current through the long wires can potentially  
cause a voltage spike at V large enough to damage the  
IN  
part. Refer to Linear Technology Application Note 88 for  
a detailed discussion of this potential issue.  
When choosing the input and output ceramic capacitors,  
choose the X5R or X7R dielectric formulations. These  
dielectrics have the best temperature and voltage charac-  
teristics of all the ceramics for a given value and size.  
Since the ESR of a ceramic capacitor is so low, the input  
and output capacitor must instead fulfill a charge storage  
requirement.Duringaloadstep,theoutputcapacitormust  
instantaneously supply the current to support the load  
until the feedback loop raises the switch current enough  
to support the load. The time required for the feedback  
loop to respond is dependent on the compensation com-  
ponents and the output capacitor value. Typically, 3 to 4  
cycles are required to respond to a load step, but only in  
the first cycle does the output drop linearly. The output  
droop, V  
, is usually about 2 to 3 times the linear  
DROOP  
3565f  
12  
LTC3565  
APPLICATIONS INFORMATION  
drop of the first cycle. Thus, a good place to start is with  
the output capacitor value of approximately:  
will ramp from zero to full scale over a time period of ap-  
proximately0.9ms.ThispreventstheLTC3565fromhaving  
to quickly charge the output capacitor and thus supplying  
an excessive amount of instantaneous current.  
ΔIOUT  
COUT 2.5  
fO • VDROOP  
The LTC3565 can start into a back-biased output in force  
continuous operation. When the output is pre-biased at  
either a higher or lower value than the regulated output  
voltage, theLTC3565willsinkorsourcecurrentasneeded  
to bring the output back into regulation. However, during  
soft-start the regulator will always start in pulse skip  
mode ignoring the mode selected with the SYNC/MODE  
pin. This prevents the output from discharging to below  
the regulation point when soft-starting.  
More capacitance may be required depending on the duty  
cycle and load step requirements.  
Inmostapplications,theinputcapacitorismerelyrequired  
to supply high frequency bypassing, since the impedance  
to the supply is very low. A 10μF ceramic capacitor is  
usually enough for these conditions.  
Setting the Output Voltage  
Mode Selection and Frequency Synchronization  
The LTC3565 develops a 0.6V reference voltage between  
the feedback pin, V , and the signal ground as shown in  
FB  
TheSYNC/MODEpinisamultipurposepinwhichprovides  
mode selection and frequency synchronization. Connect-  
Figure 4. The output voltage is set by a resistive divider  
according to the following formula:  
ing this pin to V enables Burst Mode operation, which  
IN  
provides the best low current efficiency at the cost of a  
higheroutputvoltageripple. Whenthispinisconnectedto  
ground,pulseskippingoperationisselectedwhichprovides  
the lowest output voltage and current ripple at the cost  
of low current efficiency. Applying a voltage that is half  
the value of the input voltage results in forced continuous  
mode, whichcreatesaxedoutputrippleandiscapableof  
sinking up to 0.4A. Since the switching noise is constant  
in this mode, it is also the easiest to filter out.  
R2  
R1  
VOUT 0.6V 1+  
Keeping the current small (<5μA) in these resistors maxi-  
mizes efficiency, but making them too small may allow  
stray capacitance to cause noise problems and reduce  
the phase margin of the error amp loop.  
To improve the frequency response, a feed-forward ca-  
pacitor C may also be used. Great care should be taken  
F
The LTC3565 can also be synchronized to an external  
clock signal by the SYNC/MODE pin. The internal oscilla-  
tor frequency should be set to 20% of the external clock  
frequency to ensure adequate slope compensation, since  
slopecompensationisderivedfromtheinternaloscillator.  
During synchronization, the mode is set to pulse skipping  
and the top switch turn on is synchronized to the falling  
edge of the external clock.  
to route the V line away from noise sources, such as  
FB  
the inductor or the SW line.  
Shutdown and Soft-Start  
PullingtheRUNpinhighallowsaninternalsoft-startcircuit  
to slowly ramp the output voltage up until regulation.  
Soft-start prevents surge currents from V by gradually  
ramping the output voltage up during start-up. The output  
IN  
3565f  
13  
LTC3565  
APPLICATIONS INFORMATION  
mediately shif ts by an amount equal to ΔI  
ESR,where  
Checking Transient Response  
LOAD  
ESR is the effective series resistance of C . ΔI  
also  
The OPTI-LOOP® compensation allows the transient re-  
sponsetobeoptimizedforawiderangeofloadsandoutput  
capacitors. The availability of the ITH pin not only allows  
optimizationofthecontrolloopbehaviorbutalsoprovides  
a DC coupled and AC filtered closed loop response test  
point. The DC step, rise time and settling time at this test  
point truly reflects the closed loop response. Assuming a  
predominantlysecondordersystem,phasemarginand/or  
damping factor can be estimated using the percentage  
of overshoot seen at this pin. The bandwidth can also be  
estimated by examining the rise time at the pin.  
OUT  
LOAD  
begins to charge or discharge C  
generating a feedback  
OUT  
error signal used by the regulator to return V  
to its  
OUT  
OUT  
steady-state value. During this recovery time, V  
can  
be monitored for overshoot or ringing that would indicate  
a stability problem.  
The initial output voltage step may not be within the  
bandwidth of the feedback loop, so the standard second  
order overshoot/DC ratio cannot be used to determine  
phase margin. The gain of the loop increases with R and  
the bandwidth of the loop increases with decreasing C.  
If R is increased by the same factor that C is decreased,  
the zero frequency will be kept the same, thereby keeping  
the phase the same in the most critical frequency range  
of the feedback loop. In addition, a feedforward capacitor  
TheITHexternalcomponentsshowninthecircuitonpage1  
ofthisdatasheetwillprovideanadequatestartingpointfor  
most applications. The series R-C filter sets the dominant  
pole-zero loop compensation. The values can be modified  
slightly (from 0.5 to 2 times their suggested values) to  
optimize transient response once the final PC layout is  
done and the particular output capacitor type and value  
have been determined. The output capacitors need to be  
selected because the various types and values determine  
theloopfeedbackfactorgainandphase.Anoutputcurrent  
pulse of 20% to 100% of full load current having a rise  
time of 1μs to 10μs will produce output voltage and ITH  
pin waveforms that will give a sense of the overall loop  
stability without breaking the feedback loop.  
C can be added to improve the high frequency response,  
F
as shown in Figure 2. Capacitor C provides phase lead by  
F
creating a high frequency zero with R2 which improves  
the phase margin.  
Theoutputvoltagesettlingbehaviorisrelatedtothestability  
of the closed-loop system and will demonstrate the actual  
overall supply performance. For a detailed explanation of  
optimizing the compensation components, including a  
review of control loop theory, refer to Linear Technology  
Application Note 76.  
OPTI-LOOP is a registered trademark of Linear Technology Corporation.  
Switching regulators take several cycles to respond to a  
step in load current. When a load step occurs, V  
im-  
OUT  
V
IN  
+
R5  
R6  
C6  
C
IN  
SV  
PV  
PGOOD  
SW  
PGOOD  
IN  
IN  
L1  
C8  
V
OUT  
D1  
OPTIONAL  
+
LTC3565  
C
OUT  
C5  
RUN  
C
F
V
FB  
SYNC/MODE  
ITH  
R2  
R1  
R
RT  
C
C
ITH  
GND  
R
C
C
T
3565 F04  
Figure 2. LTC3565 General Schematic  
3565f  
14  
LTC3565  
APPLICATIONS INFORMATION  
Although a buck regulator is capable of providing the full  
output current in dropout, it should be noted that as the  
Although all dissipative elements in the circuit produce  
losses, four main sources usually account for most of  
inputvoltageV dropstowardV ,theloadstepcapability  
the losses in LTC3565 circuits: 1) LTC3565 V current,  
IN  
OUT  
IN  
2
does decrease due to the decreasing voltage across the  
inductor. Applications that require large load step capabil-  
ity near dropout should use a different topology such as  
SEPIC, Zeta or single inductor, positive buck/boost.  
2) switching losses, 3) I R losses, 4) other losses.  
1) The V current is the DC supply current given in the  
IN  
electrical characteristics which excludes MOSFET driver  
andcontrolcurrents. V currentresultsinasmall(<0.1%)  
IN  
Insomeapplications,amoreseveretransientcanbecaused  
by switching in loads with large (>1μF) input capacitors.  
Thedischargedinputcapacitorsareeffectivelyputinparal-  
loss that increases with V , even at no load.  
IN  
2) The switching current is the sum of the MOSFET driver  
and control currents. The MOSFET driver current results  
fromswitchingthegatecapacitanceofthepowerMOSFETs.  
Each time a MOSFET gate is switched from low to high  
lel with C , causing a rapid drop in V . No regulator  
OUT  
OUT  
can deliver enough current to prevent this problem, if the  
switchconnectingtheloadhaslowresistanceandisdriven  
quickly. The solution is to limit the turn-on speed of the  
load switch driver. A Hot Swap™ controller is designed  
specifically for this purpose and usually incorporates cur-  
rent limiting, short-circuit protection, and soft-starting.  
to low again, a packet of charge dQ moves from V to  
IN  
ground. The resulting dQ/dt is a current out of V that is  
IN  
typically much larger than the DC bias current. In continu-  
ous mode, I  
= f (QT + QB), where QT and QB are  
GATECHG  
O
the gate charges of the internal top and bottom MOSFET  
switches. The gate charge losses are proportional to V  
IN  
Efficiency Considerations  
and thus their effects will be more pronounced at higher  
The percent efficiency of a switching regulator is equal to  
the output power divided by the input power times 100%.  
It is often useful to analyze individual losses to determine  
what is limiting the efficiency and which change would  
produce the most improvement. Percent efficiency can  
be expressed as:  
supply voltages.  
2
3) I R losses are calculated from the DC resistances of  
the internal switches, R , and external inductor, R . In  
SW  
L
continuous mode, the average output current flowing  
through inductor L is “chopped” between the internal top  
and bottom switches. Thus, the series resistance look-  
ing into the SW pin is a function of both top and bottom  
%Efficiency = 100% – (L1 + L2 + L3 + ...)  
MOSFET R  
and the duty cycle (DC) as follows:  
DS(ON)  
where L1, L2, etc. are the individual losses as a percent-  
age of input power.  
R
SW  
= (R TOP)(DC) + (R BOT)(1 – DC)  
DS(ON) DS(ON)  
The R  
for both the top and bottom MOSFETs can  
1
DS(ON)  
V
O
= 3.6V  
IN  
beobtainedfromtheTypicalPerformanceCharacteristics  
f
= 1MHz  
2
curves. Thus, to obtain I R losses:  
0.1  
2
I R losses = I 2(R + R )  
OUT  
SW  
L
4) Other “hidden” losses such as copper trace and internal  
battery resistances can account for additional efficiency  
degradations in portable systems. It is very important  
to include these “system” level losses in the design of a  
system.Theinternalbatteryandfuseresistancelossescan  
0.01  
0.001  
V
V
= 1.2V  
= 1.5V  
OUT  
OUT  
= 1.2V-1.8V  
V
OUT  
0.0001  
be minimized by making sure that C has adequate charge  
0.1  
1
10  
100  
1000  
10000  
IN  
LOAD CURRENT (mA)  
storageandverylowESRattheswitchingfrequency.Other  
3565 F05  
Hot Swap is a trademark of Linear Technology Corporation.  
Figure 3. Power Loss vs Load Currrent  
3565f  
15  
LTC3565  
APPLICATIONS INFORMATION  
lossesincludingdiodeconductionlossesduringdead-time  
and inductor core losses, which generally account for less  
than 2% total additional loss.  
Remembering that the above junction temperature is  
obtained from an R at 25°C, we might recalculate  
DS(ON)  
the junction temperature based on a higher R  
since  
DS(ON)  
it increases with temperature. However, we can safely as-  
sume that the actual junction temperature will not exceed  
the absolute maximum junction temperature of 125°C.  
Thermal Considerations  
In a majority of applications, the LTC3565 does not dis-  
sipate much heat due to its high efficiency. However,  
in applications where the LTC3565 is running at high  
ambient temperature with low supply voltage and high  
duty cycles, such as in dropout, the heat dissipated may  
exceed the maximum junction temperature of the part. If  
the junction temperature reaches approximately 150°C,  
both power switches will be turned off and the SW node  
will become high impedance.  
Design Example  
As a design example, consider using the LTC3565 in a  
portable application with a Li-Ion battery. The battery  
providesaV =2.5Vto4.2V.Theloadrequiresamaximum  
IN  
of 1.25A in active mode and 10mA in standby mode. The  
output voltage is V  
= 2.5V. Since the load still needs  
OUT  
power in standby, Burst Mode operation is selected for  
good low load efficiency.  
To avoid the LTC3565 from exceeding the maximum junc-  
tion temperature, the user will need to do some thermal  
analysis. The goal of the thermal analysis is to determine  
whether the power dissipated exceeds the maximum  
junction temperature of the part. The temperature rise  
is given by:  
First, calculate the timing resistor for 1MHz operation:  
6
3 –1.2674  
R = 1.21 • 10 (10 )  
= 190.8k  
Use a standard value of 191k. Next, calculate the inductor  
value for about 40% ripple current at maximum V :  
T
IN  
T
= P θ  
D JA  
2.5V  
1MHz • 500mA  
2.5V  
4.2V  
RISE  
L =  
• 1ꢀ  
= 2μH  
where P is the power dissipated by the regulator and θ  
D
JA  
is the thermal resistance from the junction of the die to  
Choosing the closest inductor from a vendor of 2.2μH,  
results in a maximum ripple current of:  
the ambient temperature.  
The junction temperature, T , is given by:  
J
2.5V  
1MHz • 2.2μH  
2.5V  
4.2V  
IL =  
• 1ꢁ  
= 460mA  
T = T  
J
+ T  
AMBIENT  
RISE  
As an example, consider the case when the LTC3565 is  
in dropout at an input voltage of 3.3V with a load current  
of 1A. From the Typical Performance Characteristics  
graph of Switch Resistance, the R  
P-channel switch is 0.160Ω. Therefore, power dissipated  
by the part is:  
For cost reasons, a ceramic capacitor will be used. C  
OUT  
selection is then based on load step droop instead of ESR  
resistance of the  
requirements. For a 5% output droop:  
DS(ON)  
1.25A  
1MHz (5% • 2.5V)  
COUT 2.5  
= 25μF  
2
P = I  
• R  
= 160mW  
D
OUT  
DS(ON)  
The closest standard value is 22μF. Since the output  
TheMSEpackagejunction-to-ambientthermalresistance,  
JA  
junction temperature of the regulator operating in a 70°C  
ambient temperature is approximately:  
impedance of a Li-Ion battery is very low, C is typically  
θ , will be in the range of about 40°C/W. Therefore, the  
IN  
22μF. In noisy environments, decoupling SV from PV  
IN  
IN  
with an R6/C8 filter of 1Ω/0.1μF may help, but is typically  
not needed.  
T = 0.16 • 40 + 70 = 76.4°C  
J
3565f  
16  
LTC3565  
APPLICATIONS INFORMATION  
The output voltage can now be programmed by choosing  
the values of R1 and R2. To maintain high efficiency, the  
current in these resistors should be kept small. Choosing  
Awiththe0.6VfeedbackvoltagemakesR1~300k.Aclose  
standard 1% resistor value is 294k then R2 is 931k.  
provides the AC current to the internal power MOSFETs  
and their drivers.  
2. Are the C  
OUT  
and L1 closely connected? The (–) plate of  
OUT  
C
returns current to PGND and the (–) plate of C .  
IN  
3. The resistor divider, R1 and R2, must be connected  
The compensation should be optimized for these compo-  
nentsbyexaminingtheloadstepresponsebutagoodplace  
to start for the LTC3565 is with a 12.1kΩ and 680pF filter.  
The output capacitor may need to be increased depending  
on the actual undershoot during a load step.  
between the (+) plate of C  
and a ground line. The  
OUT  
feedback signal V should be routed away from noisy  
FB  
components and traces, such as the SW line (Pin 4), and  
its trace should be minimized.  
4. Keep sensitive components away from the SW pin. The  
ThePGOODpinisacommondrainoutputandrequiresapull-  
up resistor. A 100k resistor is used for adequate speed.  
input capacitor C , the compensation capacitor C and  
IN  
C
C
ITH  
and all the resistors R1, R2, R , and R should be  
T C  
Thecircuitonpage1ofthisdatasheetshowsthecomplete  
schematic for this design example.  
routed away from the SW trace and the inductor L1. The  
SW pin pad should be kept as small as possible.  
5. A ground plane is preferred, but if not available, keep  
thesignalandpowergroundssegregatedwithsmallsignal  
components returning to the GND pin at one point.  
Board Layout Considerations  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of  
the LTC3565. These items are also illustrated graphically  
in the layout diagram of Figure 4. Check the following in  
your layout:  
6. Flood all unused areas on all layers with copper. Flood-  
ing with copper will reduce the temperature rise of power  
components. These copper areas should be connected to  
one of the input supply rails: PV , SV or GND.  
IN  
IN  
1. Does the capacitor CIN connect to the power VIN (Pin 6)  
andpowerGND(Pin5)ascloseaspossible?Thiscapacitor  
C
C
C
ITH  
R1  
R
10  
R2  
C
R
T
1
2
ITH  
RT  
C4  
9
V
LTC3565  
RUN  
FB  
8
PGOOD  
3
4
5
SYNC/MODE  
SW  
L1  
R5  
7
6
V
OUT  
SV  
IN  
V
IN  
PV  
IN  
GND  
C
OUT  
3565 F06  
C
IN  
BOLD LINES INDICATE HIGH CURRENT PATHS  
Figure 4. LTC3565 Layout Diagram (See Board Layout Checklist)  
3565f  
17  
LTC3565  
TYPICAL APPLICATION  
General Purpose Buck Regulator Using Ceramic Capacitors  
V
IN  
2.5V TO  
5.5V  
C1  
22μF  
R5  
100k  
PGOOD  
PV  
IN  
L1  
SV  
PGOOD  
SW  
IN  
2.2μH  
V
OUT  
RS1  
1M  
1.8V/1.5V/1.2V  
AT 1.25A  
LTC3565  
BM  
PS  
R2 294k  
SYNC/MODE  
ITH  
V
FC  
FB  
SHDN/RT  
RS2  
1M  
1.8V  
1.5V  
1.2V  
C2  
22μF  
GND  
C4 22pF  
R3  
12.1k  
R4  
191k  
R1A  
147k  
R1B  
196k  
R1C  
294k  
C3  
680pF  
3565 TA02a  
NOTE: IN DROPOUT, THE OUTPUT TRACKS THE INPUT VOLTAGE  
C1, C2: TAIYO YUDEN JMK325BJ226MM  
L1: TOKO A914BYW-2R2M (D52LC SERIES)  
Efficiency vs Output Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Burst Mode  
OPERATION  
V
OUT  
100mV/DIV  
AC COUPLED  
PULSE SKIP  
I
L
1A/DIV  
I
FORCED CONTINUOUS  
LOAD  
1A/DIV  
3565 TA02c  
V
V
O
= 3.6V  
= 1.2V  
= 1MHz  
IN  
OUT  
40μs/DIV  
V
V
I
= 3.6V  
IN  
OUT  
f
= 1.2V  
= 100mA TO 1.25A  
0.1  
1
10  
100  
1000  
10000  
LOAD  
Burst Mode OPERATION  
OUTPUT CURRENT (mA)  
3565 TA02b  
V
OUT  
100mV/DIV  
AC COUPLED  
I
L
1A/DIV  
I
LOAD  
1A/DIV  
3565 TA02d  
40μs/DIV  
V
V
= 3.6V  
IN  
= 1.8V  
OUT  
I
= 100mA TO 1.25A  
LOAD  
PULSE SKIPPING MODE  
3565f  
18  
LTC3565  
PACKAGE DESCRIPTION  
DD Package  
10-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1699)  
R = 0.115  
TYP  
6
0.38 ± 0.10  
10  
0.675 ±0.05  
3.50 ±0.05  
2.15 ±0.05 (2 SIDES)  
1.65 ±0.05  
3.00 ±0.10  
(4 SIDES)  
1.65 ± 0.10  
(2 SIDES)  
PIN 1  
TOP MARK  
(SEE NOTE 6)  
PACKAGE  
OUTLINE  
(DD) DFN 1103  
5
1
0.25 ± 0.05  
0.50 BSC  
0.75 ±0.05  
0.200 REF  
0.25 ± 0.05  
0.50  
BSC  
2.38 ±0.10  
(2 SIDES)  
2.38 ±0.05  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
RECOMMENDED SOLDER PAD  
PITCH AND DIMENSIONS  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).  
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
MSE Package  
10-Lead Plastic MSOP, Exposed Die Pad  
(Reference LTC DWG # 05-08-1664 Rev B)  
BOTTOM VIEW OF  
EXPOSED PAD OPTION  
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 3)  
2.794 ± 0.102  
(.110 ± .004)  
0.889 ± 0.127  
(.035 ± .005)  
0.497 ± 0.076  
(.0196 ± .003)  
2.06 ± 0.102  
(.081 ± .004)  
1
10 9  
8
7 6  
REF  
1.83 ± 0.102  
(.072 ± .004)  
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 4)  
5.23  
(.206)  
MIN  
4.90 ± 0.152  
(.193 ± .006)  
2.083 ± 0.102 3.20 – 3.45  
(.082 ± .004) (.126 – .136)  
DETAIL “A”  
0° – 6° TYP  
0.254  
(.010)  
1
2
3
4
5
10  
GAUGE PLANE  
0.50  
(.0197)  
BSC  
0.305 ± 0.038  
(.0120 ± .0015)  
TYP  
0.53 ± 0.152  
(.021 ± .006)  
0.86  
(.034)  
REF  
1.10  
(.043)  
MAX  
RECOMMENDED SOLDER PAD LAYOUT  
DETAIL “A”  
0.18  
(.007)  
SEATING  
PLANE  
0.17 – 0.27  
(.007 – .011)  
TYP  
0.1016 ± 0.0508  
(.004 ± .002)  
0.50  
(.0197)  
BSC  
MSOP (MSE) 0307 REV B  
NOTE:  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
3565f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-  
t ion t h a t t he in ter c onne c t ion o f i t s cir cui t s a s de s cr ib e d her ein w ill no t in fr inge on ex is t ing p a ten t r igh t s.  
19  
LTC3565  
TYPICAL APPLICATION  
1mm Height, 2MHz, Li-Ion to 1.8V Converter  
V
IN  
2.5V  
R5  
TO 4.2V  
C1  
100k  
10μF  
PV  
SV  
PGOOD  
SW  
PGOOD  
C4 22pF  
IN  
V
OUT  
1.8V  
IN  
L1  
0.9μH  
AT 1.25A  
LTC3565  
RUN  
SYNC/MODE  
ITH  
C2  
10μF  
× 2  
V
FB  
R1  
232k  
R2  
R3  
13.3k  
C3  
GND  
RT  
464k  
R4  
80.6k  
470pF  
C1, C2: TAIYO YUDEN JMK107BJ106MA  
L1: FDK MIPW3226DORGM  
3565 TA04a  
Efficiency vs Output Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
V
OUT  
OUT  
100mV/DIV  
AC COUPLED  
100mV/DIV  
AC COUPLED  
I
L
I
L
1A/DIV  
1A/DIV  
I
I
LOAD  
1A/DIV  
LOAD  
1A/DIV  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
IN  
IN  
IN  
3565 TA04c  
3565 F04d  
40μs/DIV  
40μs/DIV  
V
f
= 1.8V  
OUT  
= 2MHz  
O
V
V
I
= 3.6V  
V
V
I
IN  
OUT  
IN  
OUT  
= 1.8V  
= 50mA TO 1.25A  
0.1  
1
10  
100  
1000  
10000  
LOAD  
OUTPUT CURRENT (mA)  
3565 TA04b  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LTC3406/LTC3406B 600mA (I ), 1.5MHz Synchronous Step-Down DC/DC Converters 96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V,  
OUT  
IN  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
I = 20μA, I < 1μA, ThinSOT™  
Q
SD  
LTC3407A/LTC3407AB Dual 600mA/800mA (I ), 1.5MHz/2.25MHz Synchronous  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V,  
= 0.8V,  
= 0.8V,  
OUT  
IN  
Step-Down DC/DC Converters  
I = 40μA, I < 1μA, MS10E, DFN  
Q SD  
LTC3410/LTC3410B  
LTC3411A  
300mA (I ), 2.25MHz Synchronous Step-Down DC/DC Converters 95% Efficiency, V : 2.5V to 5.5V, V  
OUT IN  
I = 26μA, I < 1μA, SC70  
Q
SD  
1.25A (I ), 4MHz Synchronous Step-Down DC/DC Converter  
96% Efficiency, V : 2.5V to 5.5V, V  
IN  
OUT  
I = 60μA, I < 1μA, MS10, 3mm × 3mm DFN  
Q
SD  
LTC3412A  
3A (I ), 4MHz Synchronous Step-Down DC/DC Converter  
96% Efficiency, V : 2.25V to 5.5V, V  
= 0.8V,  
OUT(MIN)  
OUT  
IN  
I = 62μA, I < 1μA, TSSOP16E, 4mm × 4mm QFN  
Q
SD  
LTC3531/LTC3531-3 200mA (I ), 1.5MHz Synchronous Buck-Boost DC/DC Converters 95% Efficiency, V : 1.8V to 5.5V, V  
= 2V to 5V,  
= 2.4V to  
= 0.6V,  
OUT  
IN  
OUT(MIN)  
OUT(MIN)  
LTC3531-3.3  
LTC3532  
I = 16μA, I < 1μA, ThinSOT, DFN  
Q SD  
500mA (I ), 2MHz Synchronous Buck-Boost DC/DC Converter  
95% Efficiency, V : 2.4V to 5.5V, V  
IN  
OUT  
5.25V, I = 35μA, I < 1μA, MS10, DFN  
Q
SD  
LTC3542  
500mA (I ), 2.25MHz Synchronous Step-Down DC/DC Converter 95% Efficiency, V : 2.5V to 5.5V, V  
OUT IN OUT(MIN)  
I = 26μA, I < 1μA, 2mm × 2mm DFN  
Q
SD  
LTC3544  
Quad 300mA + 2× 200mA + 100mA, 2.25MHz Synchronous  
Step-Down DC/DC Converter  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V,  
OUT(MIN)  
IN  
I = 70μA, I < 1μA, 3mm × 3mm QFN  
Q
SD  
LTC3547/LTC3547B  
Dual 300mA, 2.25MHz Synchronous Step-Down DC/DC Converters 96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V,  
OUT(MIN)  
IN  
I = 40μA, I < 1μA, 2mm × 3mm DFN  
Q
SD  
LTC3548/LTC3548-1 Dual 400mA/800mA, (I ), 2.25MHz Synchronous Step-Down  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V,  
OUT  
IN  
OUT(MIN)  
OUT(MIN)  
LTC3548-2  
LTC3560  
DC/DC Converters  
I = 40μA, I < 1μA, MS10E, DFN  
Q SD  
800mA (I ), 2.25MHz Synchronous Step-Down DC/DC Converter 95% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V,  
OUT  
IN  
I = 16μA, I < 1μA, ThinSOT  
Q
SD  
ThinSOT is a trademark of Linear Technology Corporation.  
3565f  
LT 0109 • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
© LINEAR TECHNOLOGY CORPORATION 2009  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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LTC3567

High Effi ciency USB Power Manager Plus 1A Buck-Boost Converter with I2C Control
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LTC3567EUF#PBF

LTC3567 - High Efficiency USB Power Manager Plus 1A Buck-Boost Converter with I<sup>2</sup>C Control; Package: QFN; Pins: 24; Temperature Range: -40&deg;C to 85&deg;C
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