LTC3615EUF-TRPBF [Linear]
Dual 4MHz, 3A Synchronous Step-Down DC/DC Converter; 双4MHz时, 3A同步降压型DC / DC转换器型号: | LTC3615EUF-TRPBF |
厂家: | Linear |
描述: | Dual 4MHz, 3A Synchronous Step-Down DC/DC Converter |
文件: | 总32页 (文件大小:2949K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC3615
Dual 4MHz, 3A Synchronous
Step-Down DC/DC Converter
DescripTion
FeaTures
TheLTC®3615isadual3Asynchronousstep-downregula-
torusingacurrentmode,constant-frequencyarchitecture.
TheDCsupplycurrentisonly130µA(BurstModeoperation
at no-load) while maintaining the output voltages, drop-
ping to zero current in shutdown. The 2.25V to 5.5V input
supply range makes the LTC3615 ideally suited for single
Li-Ion applications. 100% duty cycle capability provides
low dropout operation, which extends operating time in
battery-operated systems.
n
High Efficiency: Up to 94%
n
Dual Outputs with 2 × 3A Output Current Capability
Low Output Ripple Burst Mode® Operation:I = 130µA
n
Q
n
2.25V to 5.5V Input Voltage Range
n
1% Output Voltage Accuracy
n
Output Voltages Down to 0.6V
n
Programmable Slew Rate at Switch Pins
n
Low Dropout Operation: 100% Duty Cycle
n
Shutdown Current ≤1µA
n
Adjustable Switching Frequency Up to 4MHz
The operating frequency is externally programmable up to
4MHz, allowing the use of small surface mount inductors.
0°, 90°, or 180° of phase shift between the two channels
can be selected to minimize input current ripple and
output voltage ripple in a single 6A output configuration.
ProgrammableslewratelimitingreducesEMI,andexternal
synchronization can be applied up to 4MHz.
n
Internal or External Compensation
n
Selectable Pulse-Skipping/Forced Continuous/
Burst Mode Operation with Adjustable Burst Clamp
n
Optional Active Voltage Positioning (AVP) with
Internal Compensation
n
Selectable 0°/90°/180° Phase Shift Between Channels
Fixed Internal and Programmable External Soft-Start
n
n
n
n
The internal synchronous switches increase efficiency
and eliminate the need for external catch diodes, saving
external components and board space.
Accurate Start-Up Tracking Capability
DDR Memory Mode I = 1.5A
OUT
Availablein 4mm×4mm QFN-24andTSSOP-24Packages
The LTC3615 is offered in leadless 24-pin 4mm × 4mm
applicaTions
QFN and thermally enhanced 24-pin TSSOP packages.
n
Point-of-Load Supplies
L, LT, LTC, LTM, Linear Technology, Burst Mode and the Linear logo are registered trademarks
of Linear Technology Corporation. All other trademarks are the property of their respective
owners. Protected by U.S. Patents, including 5481178, 5994885, 6304066, 6498466, 6580258,
6611131.
n
Distributed Power Supplies
n
Portable Computer Systems
DDR Memory Termination
n
n
Handheld Devices
Efficiency and Power Loss vs Load Current
Typical applicaTion
100
90
80
70
60
50
40
30
20
10
0
10
V
IN
100µF
SV
IN
RUN1
PV
IN1
PV
IN2
SW1
0.47µH
0.47µH
V
1
OUT1
1.8V/3A
TRACK/SS1
PGOOD1
ITH1
47µF
422k
210k
0.1
LTC3615
FB1
SRLIM
R /SYNC
T
0.01
0.001
0.0001
MODE
V
OUT2
2.5V/3A
SW2
PHASE
47µF
RUN2
665k
210k
V
V
V
= 3.3V
= 4V
= 5V
IN
IN
IN
TRACK/SS2
PGOOD2
2.25MHz
= 2.5V
FB2
V
OUT
ITH2 SGND PGND
0.001
0.01
0.1
1
3615 TA01a
OUTPUT CURRENT (A)
3615 TA01b
3615f
ꢀ
LTC3615
absoluTe MaxiMuM raTings
(Note 1)
PV , PV Voltages.....................–0.3V to SV + 0.3V
Operating Junction Temperature
IN1
IN2
IN
SV Voltage................................................. –0.3V to 6V
Range (Note 2).......................................–40°C to 125°C
Storage Temperature..............................–65°C to 150°C
Lead Soldering Temperature (TSSOP) .................. 300°C
Reflow Peak Body Temperature (QFN).................. 260°C
IN
SW1 Voltage .............................–0.3V to (PV + 0.3V)
IN1
SW2 Voltage ..............................–0.3V to (PV + 0.3V)
IN2
PGOOD1, PGOOD2 Voltages........................ –0.3V to 6V
All Other Pins.............................. –0.3V to (SV + 0.3V)
IN
pin conFiguraTion
TOP VIEW
TOP VIEW
1
2
MODE
FB1
24
23
22
21
20
19
18
17
16
15
14
13
PHASE
FB2
3
ITH1
24 23 22 21 20 19
ITH2
4
TRACK/SS1
TRACK/SS2
SGND
ITH1
FB1
1
2
3
4
5
6
18 PGOOD1
5
SV
IN
SRLIM
17
16
25
PGND
MODE
PHASE
FB2
PGOOD2
6
PV
IN1
PV
IN2
25
PGND
15 R /SYNC
7
PV
IN1
PV
IN2
T
14
RUN1
8
SW1
SW2
SW2
ITH2
13 RUN2
9
SW1
10
11
12
PGOOD1
SRLIM
PGOOD2
7
8
9 10 11 12
RUN2
RUN1
R /SYNC
T
FE PACKAGE
24-LEAD PLASTIC TSSOP
UF PACKAGE
24-LEAD (4mm s 4mm) PLASTIC QFN
T
= 125°C, θ = 33°C/W
JA
JMAX
T
= 125°C, θ = 37°C/W
JMAX JA
EXPOSED PAD (PIN 25) IS PGND, MUST BE SOLDERED TO PCB
EXPOSED PAD (PIN 25) IS PGND, MUST BE SOLDERED TO PCB
orDer inForMaTion
LEAD FREE FINISH
LTC3615EFE#PBF
LTC3615IFE#PBF
LTC3615EUF#PBF
LTC3615IUF#PBF
TAPE AND REEL
PART MARKING*
LTC3615FE
LTC3615FE
3615
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3615EFE#TRPBF
LTC3615IFE#TRPBF
LTC3615EUF#TRPBF
LTC3615IUF#TRPBF
24-Lead Plastic TSSOP
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
24-Lead Plastic TSSOP
24-Lead (4mm × 4mm) Plastic QFN
24-Lead (4mm × 4mm) Plastic QFN
3615
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
3615f
ꢁ
LTC3615
elecTrical characTerisTics The l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2), SVIN = PVINx = 3.3V, RT = 178k, RSRLIM = 40.2k, unless
otherwise specified (Notes 1, 2, 11).
SYMBOL
PARAMETER
CONDITIONS
MIN
2.25
1.7
TYP
MAX
UNITS
l
l
V
V
Operating Voltage Range
Undervoltage Lockout Threshold
5.5
V
V
V
IN
SV Ramping Down
IN
UVLO
SV Ramping Up
IN
2.25
V
Feedback Voltage Internal Reference (Note 3) V
= SV , V
= 0V
FB
TRACK
IN SRLIM
0°C < T < 85°C
0.592
0.590
0.6
0.608
0.610
V
V
J
l
–40°C < T < 125°C
J
Feedback Voltage External Reference (Note 3) V
= 0.3V, V
= SV
= SV
0.289
0.489
0.3
0.5
0
0.311
0.511
30
V
V
TRACK
TRACK
SRLIM
SRLIM
IN
(Note 7)
(Note 3) V
= 0.5V, V
IN
l
l
I
FB
Feedback Input Current
Line Regulation
V
= 0.6V
FBx
nA
∆V
LINEREG
SV = PV = 2.25V to 5.5V (Note 4)
0.2
%/V
IN
INx
∆V
LOADREG
Load Regulation
V
V
from 0.5V to 0.9V (Note 4)
0.2
2
%
%
ITHx
ITHx
= SV , V = 0.6V (Note 5)
IN FBx
I
Active Mode
Sleep Mode
V
V
= 0.5V, V
= SV , V = 0V (Note 6)
IN RUN2
1100
1900
95
µA
µA
µA
S
FB1
MODE
MODE
RUN1
= 0.5V, V
= SV , V
= SV (Note 6)
FBx
IN RUNx
IN
V
V
= 0.7V, V
= SV , V
= 0V,
= 0V,
=0V,
=0V,
130
220
200
360
1
FB1
MODE
IN RUN2
= 0V, V
= SV (Note 5)
ITH1
IN
V
V
= 0.7V, V
MODE
= SV , V
IN RUN2
145
130
240
µA
µA
µA
FBx
RUN1
= 0V (Note 4)
V
V
= 0.7V, V
= SV , V
RUNx IN MODE
FBx
= SV (Note 5)
ITHx
IN
V
= 0.7V, V = SV , V
RUNx IN MODE
= (Note 4)
FBx
I
TH
Shutdown
SV = PV = 5.5V, V = 0V
RUNx
0.1
75
55
µA
mΩ
mΩ
IN
IN
R
Top Switch On-Resistance
Bottom Switch On-Resistance
Top Switch Current Limit
PV = 3.3V (Note 10)
INx
DS(ON)
PV = 3.3V (Note 10)
INx
I
Sourcing (Note 8), V = 0.5V
LIM
FB
Duty Cycle <35%
4.5
3.6
6
7.5
–5
1
A
A
Duty Cycle = 100%
Bottom Switch Current Limit
Sinking (Note 8), V = 0.7V,
Forced Continuous Mode
–2.5
–3.5
A
FB
I
Switch Leakage Current
SV = PV = 5.5V, V = 0V
RUNx
0.01
240
30
µA
µmho
µA
SW(LKG)
IN
IN
g
Error Amplifier Transconductance
Error Amplifier Output Current
Internal Soft-Start Time
–5µA < I < 5µA
m(EA)
TH
I
t
(Note 4)
EAO
V
from 0.06V to 0.54V, TRACK/SSx = SV
IN
0.65
1.1
1.7
ms
SOFT-START
FBx
R
TRACK/SS Pull-Down Resistance at
Start-Up
200
Ω
ON(TRACK/SS_DIS)
t
f
Soft-Start Discharge Time at Start-Up
Internal Oscillator Frequency
70
1.85
1.8
0.4
1.2
µs
MHz
MHz
MHz
V
TRACK/SS_DIS
l
l
R
= 178k
2.25
2.25
2.65
2.7
4
OSC
RT/SYNC
V
= SV
IN
RT/SYNC
f
Synchronization Frequency
SYNC Level High
t
, t
> 30ns
SYNC
LOW HIGH
V
RT/SYNC
SYNC Level Low
0.3
V
3615f
ꢂ
LTC3615
elecTrical characTerisTics The l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2), SVIN = PVINx = 3.3V, RT = 178k, RSRLIM = 40.2k, unless
otherwise specified (Notes 1, 2, 11).
SYMBOL
PARAMETER
CONDITIONS
V < 0.15 • SV
PHASE
MIN
TYP
0
MAX
UNITS
Deg
Deg
Deg
V
Output Phase Shift Between SW1
and SW2
j
IN
SW1–SW2
0.35 • SV < V
< 0.65 • SV
IN
90
IN
PHASE
V
> 0.85 • SV
180
PHASE
IN
V
V
Voltage at SRLIM to Enable DDR
Mode
(Note 9)
SV – 0.3
IN
SRLIM
MODE
Internal Burst Mode Operation
Pulse-Skipping Mode
0.3
V
V
V
V
(Note 9)
SV – 0.3
IN
Forced Continuous Mode
External Burst Mode Operation
Power Good Voltage Windows
1.1
0.5
SV • 0.58
IN
0.85
PGOOD
TRACK/SSx = SV , Entering Window
IN
V
V
Ramping Up
–3.5
3.5
–6
6
%
%
FBx
FBx
Ramping Down
TRACK/SSx = SV , Leaving Window
IN
V
V
Ramping Up
9
–9
11
–11
%
%
FBx
FBx
Ramping Down
t
Power Good Blanking Time
Entering/Leaving Window
70
8
105
12
140
30
µs
Ω
PGOOD
R
Power Good Pull-Down On-Resistance I = 10mA
PGOOD
l
l
V
Enable Pin
Input High
Input Low
1
V
V
RUN
0.4
Pull-Down Resistance
4
MΩ
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 3: This parameter is tested in a feedback loop which servos V
to
FB1,2
the midpoint for the error amplifier (V
= 0.75V).
ITH1,2
Note 4: External compensation on ITH pin.
Note 5: Tying the ITH pin to SV enables internal compensation and AVP
IN
Note 2: The LTC3615 is tested under pulsed load conditions such that
mode for the selected channel.
Note 6: Dynamic supply current is higher due to the internal gate charge
T
≈ T . The LTC3615E is guaranteed to meet performance specifications
J
A
over the 0°C to 85°C operating junction temperature range. Specifications
over the –40°C to 125°C operating junction temperature range are
assured by design, characterization and correlation with statistical process
controls. The LTC3615I is guaranteed to meet specifications over the
full –40°C to 125°C operating junction temperature range. Note that
the maximum ambient temperature is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors. Note that the maximum
ambient temperature consistent with these specifications is determined by
specific operating conditions in conjunction with board layout, the rated
package thermal impedance and other environmental factors. The junction
being delivered at the switching frequency.
Note 7: See description of the TRACK/SS pin in the Pin Functions section.
Note 8: When sourcing current, the average output current is defined
as flowing out of the SW pin. When sinking current, the average output
current is defined as flowing into the SW pin. Sinking mode requires the
use of forced continuous mode.
Note 9: See description of the MODE pin in the Pin Functions section.
Note 10: Guaranteed by design and correlation to wafer level
measurements for QFN packages.
Note 11: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability or permanently damage the
device.
temperature (T , in °C) is calculated from the ambient temperature
J
(T , in °C) and power dissipation (P , in watts) according to the formula:
A
D
T = T + (P • θ )
JA
J
A
D
where θ (in °C/W) is the package thermal impedence.
JA
3615f
ꢃ
LTC3615
Typical perForMance characTerisTics VIN = 3.3V, RT/SYNC = SVIN, unless otherwise noted.
Efficiency vs Load Current
(VMODE = 0V)
Efficiency vs Load Current
(VMODE = 0V)
Efficiency vs Load Current
(VMODE = 0V)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
V
= 1.8V
V
= 1.2V
V
= 2.5V
OUT
OUT
OUT
V
V
V
= 2.5V
= 3.3V
= 5V
V
V
V
= 2.5V
= 3.3V
= 5V
V
V
V
= 3.3V
= 4V
= 5V
IN
IN
IN
IN
IN
IN
IN
IN
IN
10
0.001
0.01
0.1
1
10
0.001
0.01
0.1
1
10
0.001
0.01
0.1
1
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
3615 G01
3615 G02
3615 G03
Efficiency vs Load Current
(VMODE = 0.55 • SVIN)
Efficiency vs Load Current
(VMODE = 0.55 • SVIN)
Efficiency vs Input Voltage
(VMODE = 0V)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
95
90
85
80
75
70
65
60
55
50
V
= 1.8V
V
OUT
= 1.2V
V
OUT
= 1.8V
OUT
I
I
I
I
I
= 3A
OUT
OUT
OUT
OUT
OUT
= 2A
V
V
V
= 2.25V
= 3.3V
= 5V
V
V
V
= 2.25V
= 3.3V
= 5V
= 1A
IN
IN
IN
IN
IN
IN
= 0.3A
= 0.2A
10
10
0.001
0.01
0.1
1
0.001
0.01
0.1
1
2.25
2.75 3.25
3.75 4.25 4.75 5.25
INPUT VOLTAGE (V)
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
3615 G04
3615 G05
3615 G06
Load Regulation
Line Regulation
0.20
0.15
0.5
0.4
V
= 1.5V
MODE
INTERNAL
COMPENSATION
0.3
0.10
0.05
(I = SV
TH
)
IN
0.2
0.1
0
0
EXTERNAL
–0.05
–0.10
–0.15
–0.20
COMPENSATION
–0.1
–0.2
–0.3
–0.4
2.25 2.75 3.25 3.75 4.25 4.75 5.25
INPUT VOLTAGE (V)
0
0.5
1
1.5
2
2.5
3
OUTPUT CURRENT (A)
3615 G08
3615 G07
3615f
ꢄ
LTC3615
Typical perForMance characTerisTics VIN = 3.3V, RT/SYNC = SVIN, unless otherwise noted.
Forced Continuous Mode
Operation (FCM)
Pulse-Skipping Mode Operation
Burst Mode Operation
V
OUT
20mV/DIV
V
V
OUT
OUT
20mV/DIV
20mV/DIV
I
L
200mA/DIV
I
L
I
L
500mA/DIV
500mA/DIV
3615 G10
3615 G11
3615 G09
V
I
= 1.8V
= 75mA
= 3.3V
20µs/DIV
V
I
= 1.8V
= 75mA
= 0V
20µs/DIV
V
I
= 1.8V
= 100mA
= 1.5V
1µs/DIV
OUT
OUT
MODE
OUT
OUT
MODE
OUT
OUT
MODE
V
V
V
Load Step Transient in
Burst Mode Operation
Load Step Transient in
FCM External Compensation
Load Step Transient
in Pulse-Skipping Mode
V
V
OUT
V
OUT
OUT
200mV/DIV
200mV/DIV
200mV/DIV
I
I
L
L
I
L
1A/DIV
1A/DIV
1A/DIV
3615 G12
3615 G14
3615 G13
V
I
= 1.8V
50µs/DIV
V
I
= 1.8V
OUT
LOAD
V
MODE
50µs/DIV
= 100mA TO 3A
= 0V
V
I
= 1.8V
50µs/DIV
OUT
LOAD
OUT
LOAD
= 100mA TO 3A
= 1.5V
= 100mA TO 3A
= 3.3V
V
V
MODE
MODE
COMPENSATION FIGURE 1
COMPENSATION FIGURE 1
COMPENSATION FIGURE 1
Load Step Transient in Forced
Continuous Mode Sourcing and
Sinking Current
Internal Start-Up in Forced
Continuous Mode
Load Step Transient in FCM
with AVP Mode
V
OUT
RUN
100mV/DIV
1V/DIV
V
OUT
200mV/DIV
V
OUT
I
L
500mV/DIV
1A/DIV
I
L
1A/DIV
I
L
0A
2A/DIV
PGOOD
2V/DIV
3615 G15
3615 G17
V
I
= 1.8V
50µs/DIV
V
I
= 1.8V
= 3A
MODE
500µs/DIV
OUT
LOAD
OUT
OUT
3615 G16
= 100mA TO 3A
= 1.5V
V
I
= 1.8V
50µs/DIV
OUT
LOAD
V
V
= 1.5V
= –1.5A TO 3A
= 1.5V
MODE
V
= 3.3V
V
ITH
MODE
OUTPUT CAPACITOR VALUE FIGURE 1
COMPENSATION FIGURE 1
3615f
ꢅ
LTC3615
Typical perForMance characTerisTics VIN = 3.3V, RT/SYNC = SVIN, unless otherwise noted.
Reference Voltage
vs Temperature
Switch On-Resistance
vs Input Voltage
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0.606
0.604
MAIN SWITCH
0.602
0.600
0.598
SYNCHRONOUS SWITCH
0.596
0.594
–50 –30 –10 10 30 50 70 90 110 130
2.25
3.25
4.25
(V)
5.25
TEMPERATURE (°C)
V
IN
3615 G18
3615 G19
Switch On-Resistance
vs Temperature
Frequency vs RT/SYNC
4.0
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
100
90
80
70
60
50
40
30
20
10
0
MAIN SWITCH
SYNCHRONOUS SWITCH
100 200 300 400 500 600 700 800 900 1000
–40
–10
5
20 35 50 65 80 95 110 125
–25
R /SYNC (kΩ)
T
TEMPERATURE (°C)
3615 G20
3615 G22
Frequency vs Temperature
Frequency vs Input Voltage
2.60
2.50
2.40
2.30
2.20
2.10
2.00
1.90
1.80
1.70
1.60
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
R /SYNC = SV
T
IN
R /SYNC = SV
T
IN
R /SYNC = 200k
T
R = 178k
T
–40
–10
5
20 35 50 65 80 95 110 125
–25
2.25
3.00
3.75
4.50
5.25
V
(V)
TEMPERATURE (°C)
IN
3615 G24
3615 G23
3615f
ꢆ
LTC3615
Typical perForMance characTerisTics VIN = 3.3V, RT/SYNC = SVIN, unless otherwise noted.
No Load Supply Current
vs Input Voltage
No Load Supply Current
vs Temperature
Switch Leakage vs Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
180
160
140
120
100
80
180
160
140
120
100
80
V
= 5.5V
MODE = 0V
MODE = 0V
IN
RUNx = ITHx = SV
RUNx = ITHx = SV
IN
IN
MAIN SWITCH
60
60
40
40
SYNCHRONOUS SWITCH
20
20
0
0
–40
–10
5
20 35 50 65 80 95 110 125
–25
–40
–10 5
20 35 50 65 80 95 110 125
–25
2.25
3.25 3.75 4.25 4.75 5.25
2.75
TEMPERATURE (°C)
V
(V)
TEMPERATURE (°C)
IN
3615 G25
3615 G26
3615 G27
Slew Rate of Falling Edge at
SW1/2 vs SRLIM Resistor
Slew Rate of Rising Edge at
SW1/2 vs SRLIM Resistor
Sinking Current
V
V
= 3.3V
V
= 3.3V
IN
V
IN
OUT
= 1.8V
OUT
= 1A
OUT
V
= 1.8V
= 1A
20mV/DIV
OUT
OUT
I
I
SRLIM =
SRLIM =
SGND OR SV
SGND OR SV
IN
IN
SW
2V/DIV
40.2k
40.2k
100k
100k
OPEN
1V/DIV
1V/DIV
I
L
OPEN
500mA/DIV
3615 G30
V
= 1.2V
= –1A
MODE
1µs/DIV
OUT
OUT
I
V
= 1.5V
3615 G28
3615 G29
2ns/DIV
2ns/DIV
Tracking Up/Down in
Forced Continuous Mode,
SRLIM Pin Tied to 0V
Tracking Up/Down in
Forced Continuous Mode,
SRLIM Pin Tied to SVIN
V
OUT1
V
OUT1
500mV/DIV
1V/DIV
V
TRACK/SS
V
TRACK/SS
200mV/DIV
500mV/DIV
PGOOD
2V/DIV
PGOOD
2V/DIV
3615 G32
3615 G31
2ms/DIV
2ms/DIV
V
I
= 0V TO 1.2V
= 3A
V
I
= 0V TO 1.8V
= 3A
OUT
OUT
OUT
OUT
V
= 0V TO 0.4V
V
= 0V TO 0.7V
TRACK/SS
TRACK/SS
V
V
= 1.5V
= 3.3V
V
V
= 1.5V
= 0V
MODE
SRLIM
MODE
SRLIM
3615f
ꢇ
LTC3615
pin FuncTions (FE/UF)
PHASE (Pin 1/Pin 4): Phase Shift Selection. If pin is tied to
slope compensation is automatically adapted to the
external clock frequency.
SGND, the phase between SW1 and SW2 will be 0°. Tying
PHASE to SV will select 180° of phase shift. With the
IN
3. Tying this pin to SV enables the internal 2.25MHz
IN
PHASE pin tied to half of the SV voltage, 90° of phase
IN
oscillator frequency.
shift will be selected.
PGOOD2 (Pin 13/Pin 16): Power Good Output for
Channel 2. See PGOOD1.
V
(Pin 2/Pin 5): Voltage Feedback Input Pin for Chan-
FB2
nel 2. See V
.
FB1
SRLIM (Pin 14 /Pin 17): Slew Rate Limit. Slew rate on the
switch pins is programmed with the SRLIM pin:
ITH2 (Pin 3/Pin 6): Error Amplifier Compensation of
Channel 2. See ITH1.
1. Tying this pin to SGND selects maximum slew rate.
2. Minimum slew rate is selected when the pin is open.
TRACK/SS2(Pin4/Pin7):Internal,ExternalSoft-Start,Ex-
ternal Reference Input for Channel 2. See TRACK/SS1.
3. Connecting a resistor from SRLIM to SGND allows the
slew rate to be continuously adjusted.
SGND (Pin 5/Pin 8): Signal Ground. All small-signal and
compensationcomponentsshouldconnecttothisground
pin which, in turn, should be connected to PGND at one
point.
4. If SRLIM is tied to SV the slew rate is set to maxi-
IN
mum and DDR mode is enabled (see the Applications
Information section).
PV (Pins 6, 7/Pins 9, 10) Channel 2 Power Supply
IN2
Input. See PV
.
IN1
PGOOD1 (Pin 15/Pin 18): Power Good Output Pin for
Channel 1. The open-drain output will be pulled down to
ground when the FB1 voltage of the channel is not within
the power good voltage window. The PGOOD1 will also be
pulled down if the channel is not enabled with the RUN1
SW2 (Pins 8, 9/Pins 11, 12): Channel 2 Switching Node.
See SW1.
RUN2 (Pin 10/Pin 13): Enable Pin for Channel 2. See
RUN1.
pin or an undervoltage at SV is detected. In DDR mode
IN
RUN1 (Pin 11/Pin 14): Enable Pin for Channel 1. Forc-
ing RUN1 above the input threshold enables the output
SW1 of channel 1. Forcing both RUNx pins to ground
shuts down the LTC3615. In shutdown, all functions
are disabled and the LTC3615 draws <1µA of supply
current.
(SRLIM=SV ),thepowergoodwindowmovesinrelation
IN
to the actual TRACK/SS pin voltage.
SW1 (Pins 17, 16/Pins 19, 20): Channel 1 Switching
Node. Connection to the external inductor. This pin con-
nects to the drains of the internal synchronous power
MOSFET switches.
R /SYNC (Pin 12/Pin 15): Oscillator Frequency. This
T
PV (Pins 18, 19/Pins 21, 22): Channel 1 Power Supply
IN1
pin provides three modes of setting the switching fre-
Inputs. These pins connect to the source of the internal
quency.
power P-channel MOSFET of channel 1. P
and P
VIN1
VIN2
1. Connecting a resistor from R /SYNC to ground will
are independent of each other. They may connect to equal
or lower supplies than S
T
set the switching frequency based on the resistor
.
VIN
value.
SV (Pin 20/Pin 23) Signal Input Supply. This pin pow-
IN
2. Driving R /SYNC with an external clock signal will
ers the internal control circuitry and is monitored by the
T
synchronize the switcher to the applied frequency. The
undervoltage lockout comparator.
3615f
ꢈ
LTC3615
pin FuncTions (FE/UF)
TRACK/SS1 (Pin 21/Pin 24): Internal, External Soft-
Start, External Reference Input for Channel 1. The type
of start-up behavior for channel 1 is programmable with
the TRACK/SS1 pin:
MODE (Pin 24/Pin 3): Mode Selection.
1. Tying the MODE pin to SV or SGND enables pulse-
IN
skippingmodeorBurstModeoperation(withaninternal
Burst Mode clamp), respectively.
1.Internalsoft-startwithafixedtimingcanbeprogrammed
2. If this pin is held at slightly higher than half of SV ,
IN
by tying TRACK/SS1 to SV .
IN
forced continuous mode will be selected.
2. External soft-start can be programmed with the timing
3. Connecting this pin to an external voltage will select
Burst Mode operation with the burst clamp set to the
pin voltage.
set by a capacitor to ground and a resistor to SV .
IN
3. Tracking the start-up behavior of another supply is
programmable (see the Applications Information
section).
PGND (Exposed Pad Pin 25/ Exposed Pad Pin 25): Power
Ground. The exposed pad connects to the sources of the
power N-channel MOSFETs. The PGND pin is common
for both channels. The exposed pad must be soldered
to the PCB.
4. The pin can be used as external reference input.
ITH1 (Pin 22/Pin 1): Error Amplifier Compensation. Con-
nection for external compensation from ITH to SGND.
The current comparator’s threshold increases with this
control voltage. Tying this pin to SV enables AVP mode
with internal compensation.
For electrical connection and rated thermal performance,
refer to the Operation and Applications Information sec-
tions for more information.
IN
V
(Pin 23/Pin 2): Voltage Feedback Input Pin for
FB1
Channel 1. Receives the feedback voltage for channel 1
from the external resistive divider across the output.
3615f
ꢀ0
LTC3615
FuncTional block DiagraM
CHANNEL 1
ITH1
PGOOD1
PGOOD
WINDOW-
COMPARATOR
DELAY
INTERNAL/
EXTERNAL
COMPENSATION
ITH-VOLTAGE
LIMIT
ERROR
AMPLIFIER
FB1
V
BURST
+
–
COMPARATOR
MODE
REF
+
–
+
IDEAL
DIODE
PMOS
CURRENT SENSE
PMOS
–
SLOPE
CURRENT
PV
+ –
COMPENSATION
IN1
COMPARATOR
MODE
CONTROLLER LOGIC
SW1
TRACK/SS1
SOFT-START
OR
GATE DRIVER
RUN1
RUN2
CLK1
PLL
OSCILLATOR
AND PHASE
SELECTOR
+
R /SYNC
T
NMOS
CURRENT SENSE
PHASE
0A
–
SV
IN
CLK2
UNDERVOLTAGE
LOCKOUT
REVERSE
SGND
SHUTDOWN
CURRENT
COMPARATOR
SRLIM
PGND
DUPLICATE FOR CHANNEL 2
PV
IN2
PGOOD2
FB2
SW2
TRACK/SS2
ITH2
3615f
ꢀꢀ
LTC3615
operaTion
Main Control Loop
MODE SELECTION
The LTC3615 is a dual monolithic step-down DC/DC
converter featuring current-mode, constant-frequency
operation. Both channels are identical and share common
clock and reference circuits to improve channel-to-chan-
nel matching.
The MODE pin is used to select one of four different
operating modes for both channels together (see Figures
1 and 3):
SV
IN
PS
FC
PULSE-SKIPPING MODE ENABLE
SV – 0.3V
IN
During normal operation, the internal top power switch
(P-channel MOSFET) of each channel is turned on at the
beginning of its clock cycle. Current in the inductor in-
creasesuntilthecurrentcomparatortripsandturnsoffthe
toppowerMOSFET. Thepeakinductorcurrentatwhichthe
current comparator shuts off is controlled by the voltage
on the ITH pin. The error amplifier adjusts the voltage on
the ITH pin by comparing the feedback signals derived
SV • 0.58
IN
FORCED CONTINUOUS MODE ENABLE
1.1V
0.8V
Burst Mode ENABLE—EXTERNAL CLAMP,
CONTROLLED BY VOLTAGE APPLIED AT
MODE PIN
BM
EXT
0.5V
0.3V
BM
Burst Mode ENABLE—INTERNAL CLAMP
SGND
from an external resistor divider on the V pin with an
FBx
3615 F01
internal 0.6V reference. When the load current increases,
it causes a reduction in the feedback voltage relative to
the reference. The error amplifier raises the ITH voltage
until the average inductor current matches the new load
current. TypicalvoltagerangefortheITHpinisfrom0.45V
to 1.05V with 0.45V corresponding to zero current.
Figure 1. Mode Selection Voltage
Burst Mode Operation—Internal Clamp
Connecting the MODE pin to the SGND pin enables Burst
Mode operation with its peak current set internally. In
BurstModeoperationtheinternalpowerMOSFETsoperate
intermittently at light loads. This increases efficiency by
minimizingswitchinglosses.Duringtheintervalswhenthe
MOSFETs are not switching, the LTC3615 enters a sleep
state where many of the internal circuits are disabled to
save power. During Burst Mode operation, the ITH volt-
age is monitored by the burst comparator to determine
when the sleep state is entered or exited again. When the
average inductor current is greater than the load current,
the voltage on the ITH pin drops. As the ITH voltage falls
below the internal threshold, the LTC3615 enters the sleep
state. In the sleep state, the power MOSFETs are held
off and the load current is solely supplied by the output
capacitor. When the output voltage drops, the top power
MOSFET is switched back on and the internal circuits are
reenabled. This process repeats at a rate that is dependent
on the load current.
When the top power MOSFET shuts off, the synchronous
power switch (N-channel MOSFET) turns on until either
the current limit is reached or the next clock cycle begins.
The bottom current limit is typically set at –4A for forced
continuous mode and 0A for Burst Mode operation and
pulse-skipping mode.
The operating frequency defaults to 2.25MHz when
R /SYNC is connected to SV , or can be set by an ex-
T
IN
ternal resistor connected between the R /SYNC pin and
T
ground, or by a clock signal applied to the R /SYNC pin.
T
The switching frequency can be set from 400kHz to 4MHz
(see the Applications Information section).
OvervoltageandundervoltagecomparatorspullthePGOOD
output low if the output voltage varies more than 7.5%
from the set point.
3615f
ꢀꢁ
LTC3615
operaTion
Burst Mode Operation—External Clamp
Forced Continuous Mode Operation
Connecting the MODE pin to a voltage in the range of 0.5V
to0.8VenablesBurstModeoperationwithexternalclamp.
Duringthismodeofoperation,theminimumvoltageonthe
ITH pin is externally set by the voltage on the MODE pin.
It is recommended to use Burst Mode operation with the
internal clamp for ambient temperatures above 85°C.
In forced continuous mode the inductor current is con-
stantly cycled which creates a minimum output voltage
ripple at all output current levels.
Connecting the MODE pin, to a voltage in the range of
1.1V to SV • 0.58 will select the forced continuous mode
IN
operation.
Pulse-Skipping Mode Operation
The forced continuous mode must be used if the output
is required to sink current.
Pulse-skipping mode is similar to Burst Mode operation,
but the LTC3615 does not disable power to the internal
circuitry during sleep mode. This improves output voltage
ripple but uses more quiescent current compromising
light load efficiency.
Dropout Operation
Astheinputsupplyvoltageapproachestheoutputvoltage,
the duty cycle increases toward the maximum on-time.
Further reduction of the supply voltage forces the main
switch to remain on for more than one cycle, eventually
reaching 100% duty cycle. The output voltage will then be
determined by the input voltage minus the voltage drop
across the internal P-channel MOSFET and the inductor.
Connecting the MODE pin to SV enables pulse-skipping
IN
mode. As the load current decreases, the peak inductor
current will be determined by the voltage on the ITH pin
until the ITH voltage drops below 450mV, corresponding
to 0A. At this point switching cycles will be skipped to
keep the output voltage in regulation.
LTC3615
LTC3615
SV
SV
SW1
V
V
IN
V
IN
IN
IN
OUT1
R
R
M1
MODE
MODE
SGND
FB1
0V
M2
0V
SGND
2a. Burst Mode Operation
Internally Controlled
2b. Burst Mode Operation
Externally Controlled
LTC3615
LTC3615
SV
SV
IN
V
V
IN
IN
IN
R
R
M1
MODE
MODE
SGND
M2
0V
0V
SGND
3615 F02
2c. Pulse-Skipping Mode
2d. Forced Continuous Mode
Figure 2. Modes of Operation
3615f
ꢀꢂ
LTC3615
operaTion
Low Supply Operation
LTC3615 clamps the maximum ITH pin voltage at ap-
proximately 1.05V which corresponds to about 5A peak
inductor current.
The LTC3615 is designed to operate down to an input
supply voltage of 2.25V. An important consideration
at low input supply voltages is that the R
P-channel and N-channel power switches increases by
50% compared to 5V. The user should calculate the
power dissipation when the LTC3615 is used at 100%
duty cycle with low input voltages to ensure that thermal
limits are not exceeded.
of the
Whentheoutputisshortedtoground,theinductorcurrent
decays very slowly during a single switching cycle. The
LTC3615 uses two techniques to prevent current runaway
from occurring:
DS(ON)
1. If the output voltage drops below 50% of its nominal
value, the clamp voltage at pin ITH is lowered, causing
the maximum peak inductor current to lower gradu-
ally with the output voltage. When the output voltage
reaches 0V, the clamp voltage at the ITH pin drops to
40% of the clamp voltage during normal operation. The
short-circuitpeakinductorcurrentisdeterminedbythe
minimum on-time of the LTC3615, the input voltage
and the inductor value. This foldback behavior helps
in limiting the peak inductor current when the output
is shorted to ground. It is disabled during internal or
externalsoft-startandtrackingup/downoperation(see
the Applications Information section).
Slope Compensation and Inductor Peak Current
Slope compensation provides stability in current mode
constant-frequency architectures by preventing subhar-
monic oscillations at duty cycles greater than 50%. The
LTC3615 implements slope compensation by adding a
compensation ramp to the inductor current signal.
Short-Circuit Protection
Thepeakinductorcurrentatwhichthecurrentcomparator
shuts off the top power switch is controlled by the voltage
on the ITH pin.
2. If the inductor current of the bottom MOSFET increases
beyond 6A typical, the top power MOSFET will be held
off and switching cycles will be skipped until the induc-
tor current reduces.
If the output current increases, the error amplifier raises
the ITH pin voltage until the average inductor current
matches the new load current. In normal operation, the
3615f
ꢀꢃ
LTC3615
applicaTions inForMaTion
Operating Frequency
is typically 60ns, therefore, the minimum duty cycle is
equal to 60ns • 100% • f (Hz)
OSC
Selectionoftheoperatingfrequencyisatrade-offbetween
efficiency and component size. High frequency operation
allows the use of smaller inductor and capacitor values.
Tying the R /SYNC pin to SV sets the default internal
T
IN
operating frequency to 2.25MHz 20%.
Operation at lower frequencies improves efficiency by
reducing internal gate charge losses but requires larger
inductance values and/or capacitance to maintain low
output ripple voltage.
Frequency Synchronization
The LTC3615’s internal oscillator can be synchronized to
an external frequency by applying a square wave clock
signal to the R /SYNC pin. During synchronization, the
T
The operating frequency of the LTC3615 is determined by
top MOSFET turn-on of channel 1 is locked to the rising
edgeoftheexternalfrequencysource.Thesynchronization
frequency range is 400kHz to 4MHz. The internal slope
compensation is automatically adapted to the external
clock frequency.
anexternalresistorthatisconnectedbetweenpinR /SYNC
T
andground.Thevalueoftheresistorsetstherampcurrent
that is used to charge and discharge an internal timing
capacitor within the oscillator and can be calculated by
using the following equation:
In the signal path from the R /SYNC clock input to the
T
4 • 1011ΩHz
SW output, the LTC3615 is processing the external clock
RT =
fOSC
frequency through an internal PLL.
Although frequencies as high as 4MHz are possible, the
minimum on-time of the LTC3615 imposes a minimum
limit on the operating duty cycle. The minimum on-time
After detecting an external clock on the first rising edge
of R /SYNC the PLL starts up with the internal default of
T
2.25MHz. The internal PLL then requires a certain number
V
IN
3.3V
47µF
47µF
1µF
SV
(2s) PV
(2s) PV
IN1 IN2
IN
0.47µH
V
OUT1
(2s) SW1
RUN1
1.8V/3A
47µF
R1
422k
R
SS
4.7M
FB1
TRACK/SS1
PGOOD1
C
SS
R2
10nF
29.4k
ITH1
LTC3615
MODE
10pF
R
C
R3
178k
15k
R , 200k
T
R /SYNC
T
C
C
0.47µH
V
OUT2
R
1000pF
SRLIM
40.2k
(2s) SW2
2.5V/3A
47µF
R5
665k
SRLIM
PHASE
FB2
R4
210k
RUN2
TRACK/SS2
PGOOD2
ITH2 SGND
PGND
3615 F03
Figure 3. Soft-Start and Compensation for Channel 1 Externally Programmed,
Soft-Start and Compensation for Channel 2 Internally Programmed
3615f
ꢀꢄ
LTC3615
applicaTions inForMaTion
V
V
V
IN
V
IN
IN
IN
LTC3615
LTC3615
LTC3615
LTC3615
15pF
SV
SV
SV
SV
f
IN
IN
IN
f
IN
f
SW
1/T
P
SW
SW
P
f
t1/R
OSC
0.4V
SW
2.25MHz
1/T
R /SYNC
T
R /SYNC
T
R /SYNC
T
R /SYNC
T
SGND
SGND
SGND
1.2V
0.3V
1.2V
0.3V
R
OSC
R
T
3615 F04
T
T
P
P
Figure 4. Setting the Switching Frequency
of periods to settle until the frequency at SW matches the
Foradutycycleoflessthan40%foronechannelandmore
than 60% for the other channel, choose a phase shift of 0
frequency and phase of R /SYNC.
T
or 180° (PHASE = SGND or SV ). If both channels have
a duty cycle of around 50%, select a phase difference of
IN
When the external clock signal is removed, the LTC3615
needs approximately 5µs to detect the absence of the
external clock. During this time, the PLL will continue to
provide clock cycles before it is switched back to the de-
fault frequency or selected frequency (set via the external
90° (PHASE = one-half SV ).
IN
Inductor Selection
R resistor).
For a given input and output voltage, the inductor value
and operating frequency determine the ripple current. The
T
A safe way of driving the R /SYNC input is with an AC
T
ripple current ∆I increases with higher V and decreases
L
IN
couplingtotheclockgeneratorviaa15pFcapacitor.TheAC
couplingavoidscomplicationsiftheexternalclockgenera-
tor cannot provide a continuous clock signal at the time of
start-up, operation and shut down of the LTC3615.
with higher inductance.
VOUT
VOUT
∆IL =
• 1–
f
•L
V
IN(MAX)
SW
In general, any abrupt clock frequency change of the
regulator will have an effect on the SW pin timing and
may cause equally sudden output voltage changes. This
must be taken into account in particular if the external
clock frequency is significantly different from the internal
default of 2.25MHz.
Having a lower ripple current reduces the core losses
in the inductor, the ESR losses in the output capacitors
and the output voltage ripple. A reasonable starting point
for selecting the ripple current is ∆I = 0.3(I
).
L
OUT(MAX)
The largest ripple current occurs at the highest V . To
IN
guarantee that the ripple current stays below a specified
maximum, theinductorvalueshouldbechosenaccording
to the following equation:
Phase Selection
Channel 2 will operate in-phase, 180° out-of-phase
(anti-phase) or shifted by 90° from channel 1 depending
on the state of the PHASE pin—low, midrail and high,
respectively. Antiphase generally reduces input voltage
and current ripple. Crosstalk between switch nodes SW1,
SW2 and components or sensitive lines connected to FBx,
VOUT
SW • ∆I
VOUT
L =
• 1–
f
V
L(MAX)
IN(MAX)
The inductor value will also have an effect on Burst Mode
operation. The transition to low current operation begins
when the peak inductor current falls below a level set by
the burst clamp. Lower inductor values result in higher
ripple current which causes this to occur at lower DC
load currents. This causes a dip in efficiency in the upper
range of low current operation. In Burst Mode operation,
lower inductance values will cause the burst frequency
to increase.
ITHx, R /SYNC or SRLIM can cause unstable switching
T
waveforms and unexpectedly large input and output volt-
age ripple.
The situation improves if rising and falling edges of the
switchnodesaretimedcarefullynottocoincide.Depending
on the duty cycle of the two channels, choose the phase
differencebetweenthechannelstokeepedgesasfaraway
from each other as possible.
3615f
ꢀꢅ
LTC3615
applicaTions inForMaTion
Inductor Core Selection
This formula has a maximum at V = 2V , where I
OUT
=
RMS
IN
OUT
I
/2.Thissimpleworst-caseconditioniscommonlyused
Once the value for L is known, the type of inductor must
be selected. Actual core loss is independent of core size
for fixed inductor value, but it is very dependent on the
inductance selected. As the inductance increases, core
losses decrease. Unfortunately, increased inductance
requires more turns of wire, and therefore, copper losses
will increase.
fordesignbecauseevensignificantdeviationsdonotoffer
muchrelief.Notethatripplecurrentratingsfromcapacitor
manufacturers are often based on only 2000 hours of life
which makes it advisable to further derate the capacitor,
or choose a capacitor rated at a higher temperature than
required.Severalcapacitorsmayalsobeparalleledtomeet
size or height requirements in the design.
Ferrite designs have very low core losses and are pre-
ferred at high switching frequencies, so design goals can
concentrate on copper loss and preventing saturation.
Ferrite core material saturates hard, which means that
inductancecollapsesabruptlywhenthepeakdesigncurrent
is exceeded. This results in an abrupt increase in inductor
ripple current and consequent output voltage ripple. Do
not allow a ferrite core to saturate!
Table 1. Representative Surface Mount Inductors
INDUCTANCE DCR
MAX
DIMENSIONS
(mm)
HEIGHT
(mm)
(µH) (mΩ) CURRENT (A)
Vishay IHLP-2020BZ-01
0.33
0.47
0.68
1
7.6
8.9
25
21
15
16
2
2
2
2
5.18 × 5.49
5.18 × 5.49
5.18 × 5.49
5.18 × 5.49
11.2
18.9
Different core materials and shapes will change the size/
current and price/current relationship of an inductor.
Toroidorshieldedpotcoresinferriteorpermalloymaterials
are small and do not radiate much energy, but generally
cost more than powdered iron core inductors with similar
characteristics. The choice of which style inductor to use
mainly depends on the price versus size requirements
and any radiated field/EMI requirements. Table 1 shows
some typical surface mount inductors that work well in
LTC3615 applications.
Toko DE3518C Series
0.22
Sumida CDMC6D28 Series
8
24
2
4.3 × 4.7
0.3
0.47
0.68
1
3.2
4.2
5.4
8.8
15.4
13.6
11.3
8.8
3
3
3
3
6.7 × 7.25
6.7 × 7.25
6.7 × 7.25
6.7 × 7.25
NEC/Tokin MPLC0730L Series
0.47
0.75
1.0
4.5
7.5
9.0
16.6
12.2
10.6
3.0
3.0
3.0
6.9 × 7.7
6.9 × 7.7
6.9 × 7.7
Input Capacitor C Selection
IN
Coilcraft DO1813H Series
0.33
0.56
4
10
5
5
8.9 × 6.1
8.9 × 6.1
In continuous mode, the source current of the top P-chan-
10
7.7
nel MOSFET is a square wave of duty cycle V /V . To
OUT IN
Coilcraft SLC7530 Series
preventlargevoltagetransients, alowESRcapacitorsized
0.27
0.35
0.4
0.1
0.1
0.1
14
11
8
3
3
3
7.5 × 6.7
7.5 × 6.7
7.5 × 6.7
for the maximum RMS current must be used for C .
IN
The maximum RMS capacitor current is given by:
VOUT
V
V
OUT
IN
IRMS = IOUT(MAX)
•
•
– 1
V
IN
3615f
ꢀꢆ
LTC3615
applicaTions inForMaTion
Output Capacitor C
Selection
Capacitors are tempting for switching regulator use
because of their very low ESR. Great care must be taken
when using only ceramic input and output capacitors.
OUT
The selection of C
is typically driven by the required
OUT
ESR to minimize voltage ripple and load step transients
(low-ESR ceramic capacitors are discussed in the next
section). Typically, once the ESR requirement is satisfied,
the capacitance is adequate for filtering. The output ripple
Ceramic caps are prone to temperature effects which re-
quirethedesignertocheckloopstabilityovertheoperating
temperaturerange.Tominimizetheirlargetemperatureand
voltage coefficients, only X5R or X7R ceramic capacitors
should be used.
∆V
is determined by:
OUT
1
∆VOUT ≤ ∆IL • ESR +
8 • fSW • C
When a ceramic capacitor is used at the input, and the
power is being supplied through long wires, such as from
a wall adapter, a load step at the output can induce ringing
OUT
wheref =operatingfrequency,C =outputcapacitance
SW
OUT
and ∆I = ripple current in the inductor. The output ripple
at the V pin. At best, this ringing can couple to the output
L
IN
is highest at maximum input voltage since ∆I increases
and be mistaken as loop instability. At worst, the ringing
at the input can be large enough to damage the part.
L
with input voltage.
In surface mount applications, multiple capacitors may
have to be paralleled to meet the capacitance, ESR or RMS
currenthandlingrequirementoftheapplication.Aluminum
electrolytic, special polymer, ceramic and dry tantalum
capacitors are all available in surface mount packages.
Since the ESR of a ceramic capacitor is so low, the input
and output capacitor must instead fulfill a charge storage
requirement.Duringaloadstep,theoutputcapacitormust
instantaneously supply the current to support the load
until the feedback loop raises the switch current enough
to support the load. The time required for the feedback
loop to respond is dependent on the compensation com-
ponents and the output capacitor size. Typically, three to
four cycles are required to respond to a load step, but only
in the first cycle does the output drop linearly. The output
Tantalumcapacitorshavethehighestcapacitancedensity,
but can have higher ESR and must be surge tested for
use in switching power supplies. Aluminum electrolytic
capacitors have significantly higher ESR, but can often
be used in extremely cost-sensitive applications provided
that consideration is given to ripple current ratings and
long term reliability.
droop, V
, is usually about two to three times the
DROOP
linear drop of the first cycle. Thus, a good place to start
is with the output capacitor size of approximately:
Ceramic Input and Output Capacitors
2.5 • ∆IOUT
fSW • VDROOP
COUT
≈
Ceramic capacitors have the lowest ESR and can be cost
effective, but also have the lowest capacitance density,
high voltage and temperature coefficients, and exhibit
audible piezoelectric effects. In addition, the high-Q of
ceramic capacitors along with trace inductance can lead
to significant ringing.
More capacitance may be required depending on the duty
cycle and load step requirements. In most applications,
the input capacitor is merely required to supply high
frequency bypassing, since the impedance to the supply
is very low.
3615f
ꢀꢇ
LTC3615
applicaTions inForMaTion
Output Voltage Programming
Pulse-Skipping Mode
The output voltages are set by external resistive dividers.
Pulse-skippingmode,whichisacompromisebetweenlow
output voltage ripple and efficiency, can be implemented
For example, V
equation:
can be set according to the following
OUT2
by connecting the MODE pin to SV . This sets I
to
IN
BURST
0A. In this condition, the peak inductor current is limited
by the minimum on-time of the current comparator. The
lowestoutputvoltagerippleisachievedwhilestilloperating
discontinuously. During very light output loads, pulse-
skipping allows only a few switching cycles to skip while
maintaining the output voltage in regulation.
R5
R4
VOUT2 = 0.6V • 1+
The resistive divider allows pin V to sense a fraction of
the output voltage as shown in Figure 3.
FB
Burst Clamp Programming
Internal and External Compensation
If the voltage on the MODE pin is less than 0.8V, Burst
Mode operation is enabled. If the voltage on the MODE pin
is less than 0.3V, the internal default burst clamp level is
selected. The minimum voltage on the ITH pin is typically
525mV (internal clamp).
The regulator loop response can be checked by looking at
the load current transient response. Switching regulators
take several cycles to respond to a step in DC load current.
When a load step occurs, like the one shown in Figure 5,
V
shifts by an amount equal to ∆I
• ESR, where
OUT
LOAD
If the voltage is between 0.45V and 0.8V, the voltage on
ESR is the effective series resistance of C . ∆I
OUT
LOAD
the MODE pin (V
) is equal to the minimum voltage
BURST
also begins to charge or discharge C , generating the
feedback error signal that forces the regulator to adapt
to the current change and return V
value. During this recovery time, V
OUT
on the ITH pin (external clamp) and determines the burst
clamp level I (typically from 1A to 3.5A).
BURST
to its steady-state
can be monitored
OUT
OUT
When the ITH voltage falls below the internal (or external)
clamp voltage, the sleep state is entered. As the output
load current drops, the peak inductor current decreases
to keep the output voltage in regulation. When the output
load current demands a peak inductor current that is less
for excessive overshoot or ringing, which would indicate
a stability problem. The availability of the ITH pin allows
the transient response to be optimized over a wide range
of output capacitance.
than I
, the burst clamp will force the peak inductor
BURST
The ITH1 external components (15k and 100pF) shown
in Figure 3 will provide an adequate compensation as
well as a starting point for most applications. The values
can be modified slightly to optimize transient response
once the final PCB layout is complete and the particular
output capacitor type and value have been determined.
The output capacitors need to be selected because the
various types and values determine the loop gain and
phase. The gain of the loop will be increased by increas-
current to remain equal to I
regardless of further
BURST
reductions in the load current.
Since the average inductor current is greater than the
output load current, the voltage on the ITH pin will
decrease. When the ITH voltage drops, sleep mode is
enabled in which both power switches are shut off along
withmostofthecircuitrytominimizepowerconsumption.
All circuitry is turned back on and the power switches
resume operation when the output voltage drops out of
ing R and the bandwidth of the loop will be increased
C
by decreasing C . If R is increased by the same factor
regulation. The value for I
is determined by the
C
C
BURST
that C is decreased, the zero frequency will be kept the
desired amount of output voltage ripple. As the value of
increases, the sleep period between pulses and
C
same, thereby keeping the phase shift the same in the
most critical frequency range of the feedback loop. The
output voltage settling behavior is related to the stabil-
ity of the closed-loop system. The external compensa-
tion, forced continuous operation circuit in the Typical
I
BURST
the output voltage ripple increase. It is recommend to
use Burst Mode operation with internal clamp for tem-
peratures above 85°C ambient.
3615f
ꢀꢈ
LTC3615
applicaTions inForMaTion
Applicationssectionusesfastercompensationtoimprove
load step response.
When the load current suddenly decreases, the output
voltage starts at a level lower than nominal so the output
voltage can have more overshoot and stay within the
specified voltage range. This behavior is demonstrated
in Figure 6.
A second, more severe transient is caused by switching
in loads with large (>1µF) supply bypass capacitors. The
dischargedbypasscapacitorsareeffectivelyputinparallel
with C , causing a rapid drop in V . No regulator can
The benefit is a lower peak-to-peak output voltage devia-
tion for a given load step without having to increase the
output filter capacitance. Alternatively, the output voltage
filter capacitance can be reduced while maintaining the
same peak-to-peak transient response. For this operation
mode, theloopgainisreducedandnoexternalcompensa-
tion is required.
OUT
OUT
alter its delivery of current quickly enough to prevent this
sudden step change in output voltage if the load switch
resistance is low and it is driven quickly. More output
capacitance may be required depending on the duty cycle
and load step requirements.
If the ITH pin is tied to SV , the active voltage positioning
IN
(AVP) mode and the internal compensation is selected.
Programmable Switch Pin Slew Rate
In AVP mode, the load regulation performance is inten-
tionally reduced, setting the output voltage at a point that
is dependent on the load current. When the load current
suddenly increases, the output voltage starts from a level
slightly higher than nominal so the output voltage can
droop more and stay within the specified voltage range.
Asswitchingfrequenciesrise,itisdesirabletominimizethe
transitiontimerequiredwhenswitchingtominimizepower
losses and blanking time for the switch to settle. However,
fast slewing of the switch node results in relatively high
external radiated EMI and high on-chip supply transients,
which can cause problems for some applications.
V
OUT
100mV/DIV
V
OUT
200mV/DIV
3A
I
L
1A/DIV
I
L
1A/DIV
100mA
3615 F06
3615 F05
50µs/DIV
50µs/DIV
V
I
= 1.8V
V
I
= 1.8V
OUT
LOAD
OUT
LOAD
= 100mA TO 3A
= 1.5V
= 100mA TO 3A
= 1.5V
V
V
MODE
= V = 3.3V
ITH
MODE
V
COMPENSATION AND OUTPUT CAPACITOR
VALUES OF FIGURE 3
IN
OUTPUT CAPACITOR VALUE FIGURE 3
Figure 5. Load Step Transient in FCM with External Compensation
Figure 6. Load Step Transient in FCM in AVP Mode
3615f
ꢁ0
LTC3615
applicaTions inForMaTion
The LTC3615 allows the user to control the slew rate of
the switching node SW by using the SRLIM pin. Tying this
pin to ground selects the fastest slew rate. The slowest
slew rate is selected when the pin is open. Connecting a
resistor (between 10k to 100k) from SRLIM pin to ground
adjuststheslewratebetweenthemaximumandminimum
values. The reduced dV/dt of the switch node results in a
significant reduction of the supply and ground ringing, as
well as lower radiated EMI. See Figure 7a and the Typical
Performance Characteristics section for examples.
pin to SGND and discharging the external capacitor C
(see Figure 3).
SS
The initial discharge is adequate to discharge capacitors
up to 33nF. If a larger capacitor is required, connect the
external soft-start resistor R to the RUN pin to fully
SS
discharge the capacitor.
1. Tying this pin to SV selects the internal soft-start
IN
circuit. This circuit ramps the output voltage to the final
value within 1ms.
2. If a longer soft-start period is desired, it can be set ex-
ternallywitharesistorandcapacitorontheTRACK/SSx
pins as shown in Figure 3. The voltage applied at the
TRACK/SSx pins sets the value of the internal refer-
Reducing the slew rate causes a trade-off between ef-
ficiency and low EMI (see Figure 7b).
Particularattentionshouldbeusedwithveryhighswitching
frequencies. Using the slowest slew rate (SRLIM open)
can reduce the minimum duty cycle capability.
ence at V until TRACK/SSx is pulled above 0.6V. The
FB
external soft-start duration can be calculated by using
the following equation:
Soft-Start
SV
IN
tSS = RSS • CSS • In
The RUNx pins provide a means to shut down each chan-
nel of the LTC3615. Pulling both pins below 0.3V places
the LTC3615 in a low quiescent current shutdown state
SV – 0.6V
IN
3. The TRACK/SSx pin can be used to track the output
voltage of another supply.
(I < 1µA).
Q
After enabling the LTC3615 by bringing either one or both
RUNxpinsabovethethreshold,theenabledchannelsenter
a soft-start-up state. The type of soft-start behavior is set
by the TRACK/SSx pins. The soft-start cycle begins with
an initial discharge pulse pulling down the TRACK/SSx
Regardless of either the internal or external soft-start
state, the MODE pin is ignored during start-up and the
regulator defaults to pulse-skipping mode. In addition,
the PGOODx pin is kept low, and the frequency foldback
function is disabled.
92
V
V
I
= 3.3V
V
I
= 1.8V
= 1A
IN
OUT
OUT
FCM
= 1.8V
= 1A
91
90
89
88
87
86
85
84
83
82
OUT
OUT
SRLIM =
GND OR SV
OPEN
IN
SGND OR SV
IN
40.2k
20k
40.2k
100k
1V/DIV
OPEN
3615 F07a
2ns/DIV
2.25
3.06
4.69
5.50
3.88
(V)
V
IN
3615 07b
(7a) Slew Rate of Rising Edge at SW1/2 vs SRLIM Resistor
(7b) Efficiency vs SRLIM Resistor Programming
Figure 7. Slew Rate and the SRLIM Resistor
3615f
ꢁꢀ
LTC3615
applicaTions inForMaTion
Output Voltage Tracking Input
Through the TRACK/SS pin, the output voltage can be set
up to either coincidental or ratiometric tracking, as shown
in Figures 8 and 9.
If SRLIM is low, once V
reaches or exceeds 0.6V
TRACK/SS
the run state is entered, and the MODE selection, power
good and current foldback circuits are enabled.
To implement the coincidental tracking waveform in
Figure 8, connect an extra resistive divider to the output
of the master channel and connect its midpoint to the
TRACK/SS pin for the slave channel. The ratio of this
divider should be selected the same as that of the slave
channel’s feedback divider (Figure 10).
In the run state, the TRACK/SS pin can be used to track
down/up the output voltage of another supply. If the
V
again drops below 0.6V, the LTC3615 enters
TRACK/SS
the down-tracking state and the V
is referenced to
OUT
the TRACK/SS voltage. If V
reaches 0.1V value
TRACK/SS
In this tracking mode, the master channel’s output must
be set higher than slave channel’s output. To implement
the ratiometric start-up in Figure 9, no extra divider is
needed; simply connect the TRACK/SS pin to the other
the switching frequency is reduced by 4x to ensure that
the minimum duty cycle limit does not prevent the out-
put from following the TRACK/SS pin. The run state will
resume if the V
again exceeds 0.6V and the V
TRACK/SS
OUT
channel’s V pin (Figure 12).
is referenced to the internal reference.
FB
V
V
V
V
OUT1
OUT2
OUT1
OUT2
3615 F08
3615 F09
TIME
TIME
Figure 8. Coincident Start-Up Tracking
Figure 9. Ratiometric Start-Up Tracking
V
OUT1
R1
V
OUT1
V
OUT1
R3
R4
R1
R2
R2
R3
R1
LTC3615
FB1
LTC3615
FB1
LTC3615
FB1
R2
TRACK/SS2
FB2
TRACK/SS2
FB2
TRACK/SS2
FB2
V
V
V
OUT2
OUT2
OUT2
R5
R6
R4
R3
R4
R5
3615 F10
3615 F11
3615 F12
Figure 10. Set for Coincidentally
Tracking (R3 = R5, R4 = R6)
Figure 11. Alternative Set-Up for Coincident
Start-Up Tracking (R1 = R3, R2 = R3 = R5)
Figure 12. Set-Up for
Ratiometric Tracking
3615f
ꢁꢁ
LTC3615
applicaTions inForMaTion
External Reference Input (DDR Mode)
In DDR mode, the maximum slew rate is selected. If
V
is within 0.3V and 0.5V, the PGOOD function
TRACK/SS
is enabled. If V
If SRLIM is tied to SV , the TRACK/SS pin can be used
IN
is less than 0.3V, the output cur-
TRACK/SS
as an external reference input between 0.3V and 0.5V, if
rent foldback is disabled and the PGOOD pin is always
pulled down.
desired (see Figure 13).
0.6V
PIN
V
FB
VOLTAGE
0V
0.6V
TRACK/SS
PIN VOLTAGE
0.1V
0V
V
IN
RUN PIN
VOLTAGE
0V
V
IN
SV PIN
IN
VOLTAGE
0V
TIME
SHUTDOWN SOFT-START
RUN STATE
REDUCED
SWITCHING
FREQUENCY
RUN STATE
STATE
STATE
> 1ms
3615 F13
t
SS
DOWN-
UP-
TRACKING TRACKING
STATE STATE
Figure 13. Tracking if VSRLIM Is Low
0.45V
0.3V
V
PIN
FB
VOLTAGE
0V
EXTERNAL
VOLTAGE
REFERENCE 0.45V
0.45V
0.3V
TRACK/SS
PIN VOLTAGE
0.1V
0V
V
IN
RUN PIN
VOLTAGE
0V
V
IN
SV PIN
IN
VOLTAGE
0V
TIME
SHUTDOWN SOFT-START
STATE STATE
> 1ms
RUN STATE
REDUCED
SWITCHING
FREQUENCY
RUN STATE
3615 F14
t
SS
DOWN-
UP-
TRACKING
STATE
TRACKING
STATE
Figure 14. Tracking if VSRLIM Is Tied to SVIN
3615f
ꢁꢂ
LTC3615
applicaTions inForMaTion
DDR Application
Although all dissipative elements in the circuit produce
losses, two main sources usually account for most of
The LTC3615 can be used in DDR memory power supply
2
the losses: V quiescent current and I R losses. The V
IN
IN
applicationsbytyingtheSRLIMpintoSV . InDDRmode,
IN
quiescent current loss dominates the efficiency loss at
the maximum slew rate is selected. The output can both
sourceandsinkcurrent.Currentsinkingistypicallylimited
to 1.5A, for 1MHz frequency and 1µH inductance, but can
be lower at higher frequencies and low output voltages.
If higher ripple current can be tolerated, smaller inductor
values can increase the sink current limit. See the Typical
PerformanceCharacteristicscurvesformoreinformation.
In addition, in DDR mode, lower external reference volt-
ages and tracking output voltages between channels are
possible. See the Output Voltage Tracking Input section.
2
very low load currents whereas the I R loss dominates
the efficiency loss at medium to high load currents. In a
typical efficiency plot, the efficiency curve at very low load
currents can be misleading since the actual power lost is
of little consequence.
1. The V quiescent current is due to two components:
IN
the DC bias current as given in the Electrical Charac-
teristics and the internal main switch and synchronous
switch gate charge currents. The gate charge current
results from switching the gate capacitance of the
internal power MOSFET switches. Each time the gate
is switched from high to low to high again, a packet
Single, Low Ripple 6A Output Application
The LT3615 can generate a single, low ripple 6A output if
theoutputsofthetwoswitchingregulatorsaretiedtogether
and share a single output capacitor (see Figure 15 on back
ofdatasheet).Inordertoevenlysharethecurrentbetween
the two regulators, it is needed to connect pins FB1 to
FB2, ITH1 to ITH2 and to select forced continuous mode
at the MODE pin. To achieve lowest ripple, 90°, or better,
180°, antiphase is selected by connecting the PHASE pin
of charge dQ moves from V to ground. The resulting
IN
dQ/dt is the current out of V due to gate charge, and
IN
it is typically larger than the DC bias current. Both the
DC bias and gate charge losses are proportional to V ,
IN
thus, their effects will be more pronounced at higher
supply voltages.
2
2. I R losses are calculated from the resistances of the
to midrail or SV . There are several advantages to this
internal switches, R , and external inductor R . In
IN
SW
L
2-phase buck regulator. Ripple currents at the input and
output are reduced, reducing voltage ripple and allowing
the use of smaller, less expensive capacitors. Although
two inductors are required, each will be smaller than the
inductor required for a single-phase regulator. This may
be important when there are tight height restrictions on
the circuit.
continuous mode the average output current flowing
through inductor L is “chopped” between the main
switch and the synchronous switch. Thus, the series
resistance looking into the SW pin is a function of both
top and bottom MOSFET R
(DC), as follows:
and the duty cycle
DS(ON)
R
SW
= (R )(DC) + (R )(1 – DC)
DS(ON)TOP DS(ON)BOT
Efficiency Considerations
The R
for both the top and bottom MOSFETs can
DS(ON)
be obtained from the Typical Performance Characteristics
Theefficiencyofaswitchingregulatorisequaltotheoutput
power divided by the input power times 100%. It is often
useful to analyze individual losses to determine what is
limiting the efficiency and which change would produce
the most improvement. Efficiency can be expressed as:
Efficiency = 100% – (L1 + L2 + L3 + ...) where L1, L2, etc.
are the individual losses as a percentage of input power.
2
curves. To obtain I R losses, simply add R to R and
SW
L
multiply the result by the square of the average output
current.
Otherlosses,includingC andC ESRdissipativelosses
IN
OUT
and inductor core losses, generally account for less than
2% of the total loss.
3615f
ꢁꢃ
LTC3615
applicaTions inForMaTion
Thermal Considerations
R
. It is not recommended to use full load current at
DS(ON)
high ambient temperature and low input voltage.
In most applications, the LTC3615 does not dissipate
much heat due to its high efficiency. However, in ap-
plications where the LTC3615 is running at high ambient
temperature with low supply voltage and high duty cycles,
such as in dropout, the heat dissipated may exceed the
maximum junction temperature of the part. If the junction
temperature reaches approximately 160°C, all four power
switches will be turned off and the SW node will become
high impedance.
To maximize the thermal performance of the LTC3615, the
Exposed Pad should be soldered to a ground plane. See
the PC Board Layout Checklist.
Design Example
As a design example, consider using the LTC3615 in an
application with the following specifications:
V = 3.3V to 5.5V
IN
To prevent the LTC3615 from exceeding the maximum
junction temperature, the user will need to do some ther-
mal analysis. To determine whether the power dissipated
exceeds the maximum junction temperature of the part.
The temperature rise is given by:
V
V
= 2.5V
= 1.2V
OUT1
OUT2
I
I
I
= 1A
= 3A
= 100mA
OUT1(MAX)
OUT2(MAX)
OUT(MIN)
T
RISE
= P • θ
JA
f = 2.25MHz
D
where P is the power dissipated by the regulator, and
JA
to the ambient temperature. The junction temperature,
T , is given by:
J
Because efficiency is important at both high and low load
current,BurstModeoperationwillbeselectedbyconnect-
ing the MODE pin to SGND.
D
θ
is the thermal resistance from the junction of the die
First, calculate the timing resistor:
T = T + T
RISE
J
A
4E11Ω • Hz
2.25MHz
RRT/SYNC
=
= 178k
where T is the ambient temperature.
A
As an example, consider this case: the LTC3615 is in
dropout at an input voltage of 3.3V with a load current for
each channel of 2A at an ambient temperature of 70°C.
Assuming a 20°C rise in junction temperature, to 90°C,
Next, calculate the inductor values for about 1A ripple
current at maximum V :
IN
2.5V
2.25MHz • 1A
2.5V
5.5V
L1=
L2 =
• 1–
= 0.6µH
results in an R
of 0.086mΩ (see the graph in the
DS(ON)
Typical Performance Characteristics section). Therefore,
the power dissipated by the part is:
1.2V
1.2V
5.5V
• 1–
= 0.42µH
2
2
2.25MHz • 1A
P = (I + I ) • R = 0.69W
DS(ON)
D
1
2
Using a standard value of 0.56µH and 0.47µH inductors
results in maximum ripple currents of:
For the QFN package, the θ is 37°C/W.
JA
Therefore,thejunctiontemperatureoftheregulatoroperat-
ing at 70°C ambient temperature is approximately:
2.5V
2.5V
5.5V
∆IL1
=
• 1–
= 1.08A
2.25MHz • 0.56µH
T = 0.69W • 37°C/W + 70°C = 95°C
J
1.2V
2.25MHz • 0.47µH
1.2V
5.5V
Note that for very low input voltage, the junction tem-
perature will be higher due to increased switch resistance
∆IL2
=
• 1–
= 0.89A
3615f
ꢁꢄ
LTC3615
applicaTions inForMaTion
PC Board Layout Checklist
C
will be selected based on the ESR that is required
OUT
to satisfy the output voltage ripple requirement and the
bulk capacitance needed for loop stability. For this design,
47µF ceramic capacitors will be used with X5R or X7R
dielectric.
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3615:
1. A ground plane is recommended. If a ground plane
layer is not used, the signal and power grounds should
be segregated with all small signal components return-
ing to the SGND pin at one point which is then con-
nected to the PGND node at the exposed pad close to
the LTC3615
C should be sized for a maximum current rating of:
IN
IOUT1 IOUT2
IRMS(MAX)
=
+
= 2ARMS
2
2
Decoupling the PV with two 47µF capacitors is adequate
IN
for most applications.
2. Connect the (+) terminal of the input capacitors, C ,
IN
Finally, it is possible to define the soft-start up time choos-
ing the proper value for the capacitor and the resistor
as close as possible to the PV pins, and the (–) ter-
INx
minal as close as possible to the exposed pad PGND.
This capacitor provides the AC current into the internal
power MOSFETs.
connected to TRACK/SS pin. If one sets minimum T
=
SS
5ms and a resistor of 4.7M, the following equation can
be solved with the maximum SV = 5.5V:
IN
3. Keep the switching nodes, SWx, away from all sensitive
small signal nodes FBx, ITHx, RTSYNC, SRLIM.
5ms
CSS
=
= 9.2nF
5.5V
4.Floodallunusedareasonalllayerswithcopper.Flooding
with copper will reduce the temperature rise of power
components. Connect the copper areas to PGND (ex-
posed pad) for best performance.
4.7M • In
5.5V – 0.6V
The standard value of 10nF and 4.7M guarantees the
minimum soft-start time of 5ms. In Figure 3, channel 1
shows the schematic for this design example.
5. Connect the V pins directly to the feedback resistors.
FBx
The resistor divider must be connected between V
and SGND.
OUTx
3615f
ꢁꢅ
LTC3615
Typical applicaTions
External Compensation, Forced Continuous Operation,
In-Phase Switching, Slew Rate Limit, Common PGOOD Output
V
IN
3.3V
47µF
47µF
1µF
SV
(2s) PV
(2s) PV
IN2
(2s) SW1
IN
IN1
0.47µH
V
OUT1
1.8V/3A
RUN
RUN1
R1
47µF
TRACK/SS1
412k
PGOOD1
ITH1
FB1
MODE
R2
205k
R
178k
LTC3615
T
10pF
R
C1
43k
R /SYNC
T
C
R5
40.2k
C1
220pF
0.47µH
V
OUT2
2.5V/3A
(2s) SW2
SRLIM
MODE
PHASE
47µF
R3
665k
FB2
R6
226k
R7
174k
R4
210k
RUN2
TRACK/SS2
100k
PGOOD2
PGOOD
ITH2 SGND
PGND
3615 TA02
R
10pF
C2
43k
C
C2
220pF
VOUT1 Waveform
VOUT2 Waveform
V
V
OUT2
100mV/DIV
OUT1
100mV/DIV
I
I
OUT2
1A/DIV
OUT1
1A/DIV
3615 TA02b
3615 TA02c
20µs/DIV
20µs/DIV
3615f
ꢁꢆ
LTC3615
Typical applicaTions
DDR Memory Termination
V
IN
3.3V
C
IN1
47µF
C
C
IN3
1µF
IN2
47µF
L1
0.47µH
SV (2s) PV
(2s) PV
IN2
IN
IN1
V
DDQ
RUN1
(2s) SW1
1.8V/3A
TRACK/SS1
C
R3
150k
R1
121k
OUT1
47µF
PGOOD1
ITH1
FB1
C1
R10
15k
C2
R2
R4
10pF
R /SYNC
T
60.4k
49.9k
LTC3615
SRLIM
MODE
1000pF
L2
0.47µH
R9
226k
V
TT
R8
174k
0.9V
(2s) SW2
3A/–1.5A
OUT2
PHASE
RUN2
R5
49.9k
C
47µF
FB2
TRACK/SS2
PGOOD2
R6
49.9k
ITH2 SGND PGND
C3
10pF
3615 TA03a
R7
15k
C4
1000pF
Ratiometric Start-Up
V
DD
500mV/
DIV
V
TT
3615 TA03b
500µs/DIV
3615f
ꢁꢇ
LTC3615
Typical applicaTions
Master and Slave for Coincident Tracking Outputs Using a 2MHz External Clock
R
F1
24Ω
C
F1
1µF
V
IN
3.3V
C1
47µF
C2
47µF
L1
0.47µH
4.7M
V
OUT1
SV
(2s) PV (2s) PV
IN1 IN2
IN
1.8V/3A
C3
22pF
(2s) SW1
RUN1
TRACK/SS1
C
C
O12
22µF
R3
453k
R1
715k
O11
47µF
10nF
FB1
R5
100k
R2
357k
R4
453k
LTC3615
C
SYNC
PGOOD1
T
ITH1
PGOOD1
R
15pF
R /SYNC
2MHz
CLOCK
C
C2
R
T
C1
10pF
SRLIM
MODE
200k
15k
L2
C
C1
0.47µH
1000pF
V
R9
226k
OUT2
(2s) SW2
1.2V/3A
R8
174k
R5
294k
C
C
O21
O22
PHASE
RUN2
47µF
22µF
C7
22pF
FB2
R7
100k
TRACK/SS2
R6
294k
PGOOD2
PGOOD2
ITH2 SGND
PGND
C
C4
R
C2
10pF
15k
C
C3
3615 TA04a
470pF
Coincident Start-Up
Coincident Tracking Up/Down
V
OUT1
V
OUT1
V
OUT2
500mV/
DIV
500mV/
DIV
V
OUT2
3615 TA04b
3615 TA04c
2ms/DIV
200ms/DIV
3615f
ꢁꢈ
LTC3615
package DescripTion
FE Package
24-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation AA
7.70 – 7.90*
3.25
(.128)
(.303 – .311)
3.25
(.128)
24 23 22 21 20 19 18 17 16 15 14 13
6.60 p0.10
2.74
(.108)
4.50 p0.10
6.40
(.252)
BSC
2.74
(.108)
SEE NOTE 4
0.45 p0.05
1.05 p0.10
0.65 BSC
5
7
8
1
2
3
4
6
9 10 11 12
RECOMMENDED SOLDER PAD LAYOUT
1.20
(.047)
MAX
4.30 – 4.50*
(.169 – .177)
0.25
REF
0o – 8o
0.65
(.0256)
BSC
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
0.05 – 0.15
(.002 – .006)
0.195 – 0.30
FE24 (AA) TSSOP 0208 REV Ø
(.0077 – .0118)
TYP
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
MILLIMETERS
(INCHES)
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
3615f
ꢂ0
LTC3615
package DescripTion
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
0.70 ±0.05
4.50 ± 0.05
3.10 ± 0.05
2.45 ± 0.05
(4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
R = 0.115
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
0.75 ± 0.05
4.00 ± 0.10
(4 SIDES)
TYP
23 24
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
1
2
2.45 ± 0.10
(4-SIDES)
(UF24) QFN 0105
0.200 REF
0.25 ± 0.05
0.50 BSC
0.00 – 0.05
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3615f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
ꢂꢀ
LTC3615
Typical applicaTion
V
IN
3.3V
V
V
47µF
1µF
SW1
SW2
SV
(2s) (2s)
PV PV
IN
RUN1
IN1
IN2
L1
0.47µH
V
OUT
(2s)
SW1
TRACK/SS1
PGOOD1
ITH1
1.2V/6A
47µF
2V/DIV,
1A/DIV
R1
102k
FB1
I
L1
I
L2
LTC3615
R2
102k
20pF
L2
0.47µH
R /SYNC
T
I
+ I
L1 L2
R
C
SRLIM
(2s) SW2
7.5k
3615 F16
200ns/DIV
FB2
C
MODE
C
MODE = FCM
2000pF
R8
226k
R9
174k
PHASE
Figure 16. Reduced Ripple Current
(Waveform IL1 + IL2) and Ripple Voltage
(Not Shown) Through 180° Phase Shift
Between SW1 and SW2
RUN2
TRACK/SS2
PGOOD2
ITH2 SGND
PGND
3615 F15
100
90
V
= 1.2V
OUT
MODE = FCM
Figure 15. Single, Low Ripple 6A Output
80
70
60
50
40
30
20
10
0
V
V
V
= 2.5V
= 3.3V
= 5V
IN
IN
IN
0.01
0.1
1
10
OUTPUT CURRENT (A)
3615 F17
Figure 17. Efficiency vs Load Current
for VOUT = 1.2V and IOUT Up to 6A
relaTeD parTs
PART NUMBER DESCRIPTION
COMMENTS
LTC3633
LTC3546
LTC3417A-2
LTC3612
LTC3614
LTC3616
15V, Dual 3A, 4MHz, Synchronous Step-Down DC/DC 95% Efficiency, V : 3.60V to 15V, V
= 0.6V, I = 500µA, I < 13µA,
OUT(MIN) Q SD
IN
Converter
4mm × 5mm QFN-28 and TSSOP-28E Packages
5.5V, Dual 3A/1A, 4MHz, Synchronous Step-Down
DC/DC Converter
95% Efficiency, V : 2.25V to 5.5V, V
= 0.6V, I = 160µA, I < 1µA,
Q SD
IN
OUT(MIN)
OUT(MIN)
4mm × 5mm QFN-28 Package
5.5V, Dual 1.5A/1A, 4MHz, Synchronous Step-Down
DC/DC Converter
95% Efficiency, V : 2.25V to 5.5V, V
= 0.8V, I = 125µA, I < 1µA,
Q SD
IN
TSSOP-16E and 3mm × 5mm DFN-16 Packages
5.5V, 3A, 4MHz, Synchronous Step-Down DC/DC
Converter
95% Efficiency, V : 2.25V to 5.5V, V = 0.6V, I = 75µA, I < 1µA,
IN
OUT(MIN)
Q
SD
3mm × 4mm QFN-20 and TSSOP-20E Packages
5.5V, 4A, 4MHz, Synchronous Step-Down DC/DC
Converter
95% Efficiency, V : 2.25V to 5.5V, V = 0.6V, I = 75µA, I < 1µA,
IN
OUT(MIN)
Q
SD
3mm × 4mm QFN-20 and TSSOP-20E Packages
5.5V, 6A, 4MHz, Synchronous Step-Down DC/DC
Converter
95% Efficiency, V : 2.25V to 5.5V, V
= 0.6V, I = 75µA, I < 1µA,
OUT(MIN) Q SD
IN
3mm × 5mm QFN-24 Package
3615f
LT 0410 • PRINTED IN USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
ꢂꢁ
●
●
LINEAR TECHNOLOGY CORPORATION 2010
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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