LTC3617_15 [Linear]
6A Monolithic Synchronous Step-Down Regulator for DDR Termination;型号: | LTC3617_15 |
厂家: | Linear |
描述: | 6A Monolithic Synchronous Step-Down Regulator for DDR Termination 双倍数据速率 |
文件: | 总20页 (文件大小:481K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC3617
6ꢀA MoMꢁlitlꢂAꢃSoꢂthMoMusA
ꢃiep-DMwoAReguꢁaiMhA
fMhADDRATehmloailMo
Features
Description
TheLTC®3617isahighefficiencymonolithicsynchronous
buckregulatorutilizingacurrentmode,constantfrequency
architecture. It operates from an input voltage range of
2.25V to 5.5V and provides a regulated output voltage
equal to 0.5 • VDDQIN while sourcing and sinking up to
6A of load current. An internal amplifier provides a VTTR
output voltage equal to 0.5 • VDDQIN with an output cur-
rent capability of 1ꢀmA.
n
6A Output Current
n
2.25V to 5.5V Input Voltage Range
n
±±10V Output Voltage Accuracy
n
Opti0ized for Low Output Voltages Down to 1.5V
n
High Efficiency
n
Integrated Buffer for VTTR = VDDQIN • 0.5
n
Shutdown Current: <1µA
n
Adjustable Switching Frequency: Up to 4MHz
n
Optional Internal Compensation
The operating frequency is externally programmable up to
4MHz, allowing the use of small surface mount inductors.
For switching-noise-sensitive applications, the LTC3617
can be synchronized to an external clock up to 4MHz.
n
Internal Soft-Start
n
Power Good Status Output
n
Input Overvoltage Protected
n
Thermally Enhanced 24-Pin 3mm × 5mm
ForcedcontinuousmodeoperationintheLTC3617reduces
noise and RF interference. Adjustable external compensa-
tion allows the transient response to be optimized over a
wide range of loads and output capacitors.
QFN Package
applications
n
DDR Termination
The internal synchronous switch increases efficiency and
eliminatestheneedforanexternalcatchdiode,minimizing
external component count and board space. The LTC3617
is offered in a leadless 24-pin 3mm × 5mm thermally
enhanced QFN package.
n
Supports DDR, DDR2 and DDR3 Standards
n
Tracking Supplies
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks
of Linear Technology Corporation. All other trademarks are the property of their respective
owners. Protected by U.S. Patents, including 6580258, 5481178, 6498466, 6611131.
Efficiency and Power Loss
vs Load Current
typical application
100
90
80
70
60
50
40
30
20
10
0
10
V
IN
2.5V
22µF
×4
SV
PV
IN
IN
V
REF
RUN
VDDQIN
RT
VTTR
1.25V
10ꢀm
1
0.1µF
0.15µH
VTT
1.25V
6m
LTC3617
SW
PGOOD
ITH
SGND
PGND
47µF
×2
0.1
0.01
SYNC
V
FB
3617 Tm01a
0.1
1
10
LOAD CURRENT (A)
3617 TA01b
3617fa
1
LTC3617
absolute MaxiMuM ratings
pin conFiguration
(Note ±)
TOP VIEW
PV , SV Voltages ..................................... –ꢀ.3V to 6V
IN
IN
SW Voltage ................................. –0.3V to (PV + ꢀ.3V)
IN
ITH, RT, SYNC Voltages.............. –0.3V to (SV + ꢀ.3V)
IN
24 23 22 21
VTTR, RUN, V Voltages ........... –0.3V to (SV + ꢀ.3V)
FB
IN
RT
SGND
VTTR
SYNC
RUN
1
2
3
4
5
6
7
8
20
19
18
17
16
15
14
13
VDDQIN, PGOOD Voltages........................... –ꢀ.3V to 6V
Operating Junction Temperature Range
SV
IN
(Notes 2, 8)............................................ –4ꢀ°C to 125°C
Storage Temperature.............................. –65°C to 15ꢀ°C
PV
IN
PV
IN
25
PGND
SW
SW
SW
SW
SW
SW
SW
SW
9
10 11 12
UDD PACKAGE
24-LEAD (3mm × 5mm) PLASTIC QFN
= 125°C, θ = 43°C/W
T
JMAX
JA
EXPOSED PAD (PIN 25) IS PGND, MUST BE SOLDERED TO PCB
orDer inForMation
LEAD FREE FINISH
LTC3617EUDD#PBF
LTC3617IUDD#PBF
TAPE AND REEL
PART MARKING*
LFXC
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3617EUDD#TRPBF
LTC3617IUDD#TRPBF
–4ꢀ°C to 125°C
–4ꢀ°C to 125°C
24-Lead (3mm × 5mm) Plastic QFN
24-Lead (3mm × 5mm) Plastic QFN
LFXC
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
electrical characteristics The l denotes the specifications which apply over the full operating junction
te0perature range, otherwise specifications are at TA = 25°C. PVIN = SVIN = 3.3V, RT = SVIN unless otherwise specified (Notes ±, 2, 8).
SYMBOL
PARAMETER
CONDITIONS
MIN
2.25
1.7
TYP
MAX
UNITS
l
V
V
Input Voltage Operating Range
Undervoltage Lockout Threshold
5.5
V
IN
l
l
SV Ramping Down
V
V
UVLO
IN
SV Ramping Up
2.2
7
IN
V
Overvoltage Lockout Threshold
SV Ramping Up
6.5
25ꢀ
V
mV
OVLO
IN
Hysteresis
l
VTTR
VTTR Output Voltage with Line and Load VDDQIN = 1.5V, Load = ±10mA
Regulation
0.49 • VDDQIN 0.5 • VDDQIN 0.51 • VDDQIN
V
VTTR Maximum Output Current
1ꢀ
mA
mV
nA
l
l
V
Feedback Voltage Accuracy
Feedback Input Current
VDDQIN = 1.5V (Note 3)
V = ꢀ.75V
FB
VTTR – 1ꢀ
VTTR
VTTR + 1ꢀ
3ꢀ
FB
I
FB
3617fa
2
LTC3617
electrical characteristics The l denotes the specifications which apply over the full operating junction
te0perature range, otherwise specifications are at TA = 25°C. PVIN = SVIN = 3.3V, RT = SVIN unless otherwise specified (Notes ±, 2, 8).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
l
Feedback Voltage Line Regulation
SV = PV = 2.25V to 5.5V,
ꢀ.2
%/V
∆V
IN
IN
FB(LINEREG)
VDDQIN = 1.5V (Notes 3, 4)
Feedback Voltage Load Regulation
ITH from 0.5V to 0.9V (Notes 3, 4)
ITH
ꢀ.25
ꢀ.25
%
%
∆V
FB(LOADREG)
V
= SV (Note 5)
IN
I
Input DC Supply Current
Active Mode
Q
V
= 0.6V, VDDQIN = 1.5V (Note 6)
11ꢀꢀ
ꢀ.1
µA
µA
FB
Shutdown
SV = PV = 5.5V, V = ꢀV
RUN
1
IN
IN
R
Top Switch On-Resistance
PV = 3.3V
35
25
mΩ
mΩ
A
DS(ON)
IN
Bottom Switch On-Resistance
Top Switch Positive Peak Current Limit
PV = 3.3V
IN
I
Sourcing (Note 7), V = ꢀ.5V
8
1ꢀ
14
–5
LIM
FB
Top Switch Negative Peak Current Limit Sinking (Note 7)
Error Amplifier Transconductance –5µA < I < 5µA (Note 4)
Error Amplifier Maximum Output Current (Note 4)
–12
–8
A
g
2ꢀꢀ
3ꢀ
µS
µA
ms
m(EA)
ITH
I
t
EAO
Internal Soft-Start Time
V
from ꢀ.ꢀ75V to ꢀ.675V,
FB
ꢀ.4
0.85
2
SS
VDDQIN = 1.5V
l
l
f
Oscillator Frequency
Internal Oscillator Frequency
R = 37ꢀk
0.8
1.8
1
2.25
1.2
2.7
MHz
MHz
OSC
T
V
= SV
RT
IN
f
Synchronization Frequency Range
ꢀ.3
1.2
4
MHz
SYNC
V
SYNC Input Threshold High Voltage
SYNC Input Threshold Low Voltage
V
V
SYNC
ꢀ.3
1
I
Switch Leakage Current
SV = PV = 5.5V, V = ꢀV
RUN
ꢀ.1
µA
SW(LKG)
IN
IN
PGOOD
Power Good Voltage Windows
VDDQIN = 1.5V, Entering Window
V
V
Ramping Up
–3.5
3.5
–5
5
%
%
FB
FB
Ramping Down
VDDQIN = 1.5V, Leaving Window
V
V
Ramping Up
8
–8
1ꢀ
–1ꢀ
%
%
FB
FB
Ramping Down
t
Power Good Blanking Time
Power Good Pull-Down On-Resistance
RUN voltage
Entering and Leaving Window
7ꢀ
8
1ꢀ5
17
14ꢀ
33
µs
PGOOD
R
Ω
PGOOD
l
l
V
Input High
Input Low
1
V
V
RUN
ꢀ.4
Note ±: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 3: This parameter is tested in a feedback loop which servos V to
FB
the midpoint for the error amplifier (V = ꢀ.75V).
ITH
Note 4: External compensation on ITH pin.
Note 5: Tying the ITH pin to SV enables the internal compensation.
IN
Note 2: The LTC3617 is tested under pulsed load conditions such that
Note 6: Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
T ≈ T . The LTC3617E is guaranteed to meet performance specifications
J
A
over the 0°C to 85°C operating junction temperature range. Specifications
over the –4ꢀ°C to 125°C operating junction temperature range are
assured by design, characterization and correlation with statistical process
controls. The LTC3617I is guaranteed to meet specifications over the
full –40°C to 125°C operating junction temperature range. Note that
the maximum ambient temperature is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors. The junction temperature
Note 7: In sourcing mode the average output current is flowing out of the
SW pin. In sinking mode the average output current is flowing into the SW
Pin.
Note 8: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
(T , in °C) is calculated from the ambient temperature (T , in °C) and
J
A
power dissipation (P , in watts) according to the formula:
D
T = T + (P • θ ), where θ (in °C/W) is the package thermal
J
A
D
JA
JA
impedance.
3617fa
3
LTC3617
typical perForMance characteristics
TA = 25°C, VIN = 3.3V, fO = ±MHz unless otherwise noted.
Efficiency vs Load Current
Efficiency vs Input Voltage
Efficiency vs Frequency
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
100
95
90
85
80
75
70
65
60
V
= 1.25V
V
= 1.25V
V
= 1.25V
OUT
OUT
OUT
I
I
I
= 600mA
= 2A
V
V
V
= 2.5V
= 3.3V
= 5V
150nH
330nH
470nH
LOAD
LOAD
OUT
IN
IN
IN
= 6A
2.25 2.75 3.25 3.75 4.25 4.75 5.25
0.1
1
10
1
1.5
2
2.5
3
3.5
4
INPUT VOLTAGE (V)
LOAD CURRENT (A)
FREQUENCY (MHz)
3617 G01
3617 G02
3617 G03
Load Regulation
Line Regulation
Output Voltage vs Ti0e
0.3
0.2
0.3
V
= 1.25V
OUT
0.2
0.1
SW
2V/DIV
0.1
0
0
V
OUT
20mV/DIV
–0.1
–0.2
–0.3
–0.1
–0.2
–0.3
I
L
1A/DIV
3617 G06
V
LOAD
= 1.25V
= 100mA
2µs/DIV
–6
–4
–2
0
2
4
6
2.20
3.30 3.85 4.40
INPUT VOLTAGE (V)
4.95 5.50
2.75
OUT
I
LOAD CURRENT (A)
3617 G04
3617 G05
Load Step Transient
Load Step Transient
V
V
OUT
OUT
200mV/DIV
100mV/DIV
I
L
I
L
5A/DIV
4A/DIV
3617 G07
3617 G09
40µs/DIV
40µs/DIV
V
LOAD
= 1.25V
V
LOAD
= 1.25V
OUT
OUT
I
= 100mA TO 6A
COMPENSATION FIGURE 1
I
= –6A TO 6A
COMPENSATION FIGURE 1
3617fa
4
LTC3617
typical perForMance characteristics
TA = 25°C, VIN = 3.3V, fO = ±MHz unless otherwise noted.
Sinking Current Internal Start-Up
Tracking Up/Down
RUN
5V/DIV
PGOOD
5V/DIV
PGOOD
5V/DIV
SW
2V/DIV
V
/VTTR
OUT
500mV/DIV
V
OUT
V
OUT
500mV/DIV
20mV/DIV
VDDQIN
2V/DIV
I
L
I
L
2A/DIV
2A/DIV
3617 G10
3617 G11
3617 G12
2ms/DIV
2µs/DIV
500µs/DIV
V
I
= 1.25V
= –3A
V
I
= 1.25V
= 0A
OUT
LOAD
OUT
LOAD
V
LOAD
= 1.25V
= 3A
OUT
I
Switch On-Resistance
vs Input Voltage
Switch On-Resistance
vs Te0perature
50
40
30
20
10
0
50
40
30
20
10
0
MAIN SWITCH
MAIN SWITCH
SYNCHRONOUS SWITCH
SYNCHRONOUS SWITCH
2.5
3.0
3.5
4.0
4.5
5.0
5.5
–50 –30 –10 10 30 50
130
70 90 110
TEMPERATURE (°C)
INPUT VOLTAGE (V)
3617 G15
3617 G14
Frequency vs RT Resistor
Frequency vs Te0perature
0.8
0.6
4.5
R
= SV
IN
R
T
= SV
IN
T
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
0
–50 –30 –10 10 30 50 70 90 100 130
0
200 400 600
1400
800 1000 1200
TEMPERATURE (°C)
RESISTOR ON RT/SYNC PIN (kΩ)
3617 G17
3617 G16
3617fa
5
LTC3617
typical perForMance characteristics
TA = 25°C, VIN = 3.3V, fO = ±MHz unless otherwise noted.
Switch Leakage Current
vs Te0perature, Main Switch
Frequency vs Input Voltage
1.0
0.5
8
7
6
5
4
3
2
1
0
V
V
V
= 2.25V
= 3.3V
= 5.5V
IN
IN
IN
0
–0.5
–1.0
–1.5
–2.0
–2.5
2.25
3.75 4.25 4.75 5.25
30 50
2.75 3.25
–50 –30 –10 10
70 90 110 130
INPUT VOLTAGE (V)
TEMPERATURE (°C)
3617 G18
3617 G19
Dyna0ic Supply Current
vs Te0perature
Switch Leakage Current vs
Te0perature, Synchronous Switch
50
40
30
20
10
0
8
7
6
5
4
3
2
1
0
V
V
V
= 2.25V
= 3.3V
= 5.5V
IN
IN
IN
V
V
V
= 2.5V
= 3.3V
= 5V
IN
IN
IN
30 50
TEMPERATURE (°C)
–50 –30 –10 10
70 90 110 130
–50 –25
0
25
50
75 100 125
TEMPERATURE (°C)
3617 G20
3617 G21
3617fa
6
LTC3617
pin Functions
RT (Pin ±): Oscillator Frequency. This pin provides two
ways of setting the constant switching frequency:
SYNC (Pin 21): External Synchronization Input. When
a clock signal is applied to this pin, the switching fre-
quency synchronizes to this clock signal. This pin can
be either floating or tied to ground if an external clock
is not being used.
1. Connecting a resistor from RT to ground will set the
switching frequency based on the resistor value.
2. Tying the RT pin to SV enables the internal 2.25MHz
IN
PGOOD (Pin 2±): Power Good. This open-drain output
is pulled down to SGND on start-up and when the FB
voltage is outside the power good voltage window. If the
FB voltage increases and stays inside the power good
window for more than 100µs the PGOOD pin is released.
If the FB voltage leaves the power good window for more
than 100µs the PGOOD pin is pulled low.
oscillator frequency.
SGND (Pin 2): Signal Ground. All small-signal and com-
pensation components should connect to this ground,
which in turn should connect to PGND at a single point.
VTTR (Pin 3): Voltage Buffer Output. This pin is the output
of an internal voltage buffer whose voltage is equal to
VDDQIN • 0.5. Output current capability is ±10mA. VTTR
is also the reference voltage of the error amplifier, which
sets the output voltage. V will regulate to VTTR. Do not
exceed 0.1µF capacitance on this pin.
The power good window moves in relation to the VDDQIN
pin voltage. In shutdown the PGOOD output will actively
pull low and may be used to discharge the output capaci-
tors via an external resistor.
FB
PV (Pins 4, ±1, ±±, ±7): Power Input Supply. PV con-
V
(Pin 22): Voltage Feedback Input Pin. Senses the
IN
IN
FB
nectstothesourceoftheinternalP-channelpowerMOSFET.
feedbackvoltagefromtheexternalresistivedivideracross
This pin is independent of SV and may be connected to
the output.
IN
the same supply or to a lower voltage.
ITH (Pin 23): Error Amplifier Compensation. The current
comparator’sthresholdincreaseswiththiscontrolvoltage.
Tying this pin to SVIN enables internal compensation.
SW (Pins 5, 6, 7, 8, ±3, ±4, ±5, ±6): Switch Node. Con-
nection to the inductor. These pins connect to the drains
of the internal power MOSFET switches.
VDDQIN (Pin 24): External Reference Input. An internal
NC (Pins 9, ±2): Can be connected to ground or left open.
resistor divider sets the VTTR and V regulated voltages
FB
to be equal to half the voltage applied to this input.
SV (Pin ±8): Signal Input Supply. This pin powers the
IN
internal control circuitry and is monitored by the under-
PGND (Exposed Pad Pin 25): Power Ground. This pin
connects to the source of the internal N-channel power
MOSFET. This pin should be connected close to the (–)
voltage lockout comparator.
RUN (Pin ±9): Enable Input. Pulling this pin high enables
the LTC3617 and forcing it to ground shuts the regulator
down. In shutdown, all functions are disabled and the chip
draws <1µA of supply current.
terminal of C and C
.
IN
OUT
3617fa
7
LTC3617
Functional block DiagraM
18
2
1
20
23
4
10
PV PV PV PV
IN
11
17
SV
SGND
RT
SYNC
ITH
IN
IN
IN
IN
ITH SENSE
COMPARATOR
+
–
BANDGAP
AND
BIAS
RUN
INTERNAL
COMPENSATION
CURRENT
SENSE
19
OSCILLATOR
SV – 0.3V
IN
VTTR
3
PMOS CURRENT
COMPARATOR
–
VDDQIN
ITH
LIMIT
24
+
–
+
SOFT-START
SLOPE
COMPENSATION
SW
SW
SW
SW
SW
SW
SW
SW
5
6
+
–
DRIVER
V
FB
22
7
ERROR
AMPLIFIER
8
1.08V
/2
DDQIN
+
–
13
14
15
16
LOGIC
+
–
REVERSE CURRENT
COMPARATOR
0.92V
/2
DDQIN
+
–
I
REV
PGND
25
V
+
–
TTR
EXPOSED PAD
0.45V
PGOOD
21
3617 BD
3617fa
8
LTC3617
operation
Main Control Loop
reference voltage of the error amplifier which controls the
output voltage. Therefore, large transients on this pin will
impact the behavior of the output.
The LTC3617 is a monolithic, constant frequency, current
mode step-down DC/DC converter. During normal opera-
tion, the internal top power switch (P-channel MOSFET) is
turned on at the beginning of each clock cycle. Current in
the inductor increases until the current comparator trips
and turns off the top power switch. The peak inductor
current when the current comparator trips is controlled
by the voltage on the ITH pin. The error amplifier adjusts
the voltage on the ITH pin by comparing the feedback
V Overvoltage Protection
IN
In order to protect the internal power MOSFET devices
against transient voltage spikes, the LTC3617 constantly
monitors the V pin for an overvoltage condition. When
IN
V rises above 6.5V, the regulator suspends operation by
IN
shutting off both MOSFETS. The regulator executes its
soft-start function when exiting an overvoltage condition.
signal from a resistor divider on the V pin with a refer-
FB
ence voltage on the VTTR pin. VTTR is the output of an
op amp buffer that expresses one-half the voltage on the
VDDQIN pin. When the load current increases, it causes a
reduction in the feedback voltage relative to the reference.
The error amplifier raises the ITH voltage until the average
inductor current matches the new load current. Typical
voltage range for the ITH pin is from 0.2V to 1.05V with
ꢀ.575V corresponding to zero current.
Low Supply Operation
The LTC3617 is designed to operate down to an input
supplyvoltageof2.25V. Animportantconsiderationatlow
input supply voltages is that the R
andN-channelpowerswitchesincreases. Theusershould
calculate the power dissipation when the LTC3617 is used
at 100% duty cycle with low input voltages to ensure that
thermal limits are not exceeded. See the Typical Perfor-
mance Characteristics graphs.
of the P-channel
DS(ON)
When the top power switch shuts off, the synchronous
bottom power switch (N-channel MOSFET) turns on until
either the bottom current limit is reached or the next clock
cycle begins. The bottom current limit is typically set at
–1ꢀA.
Short-Circuit Protection
The peak inductor current when the current comparator
shuts off the top power switch is controlled by the voltage
on the ITH pin.
The operating frequency defaults to 2.25MHz when RT is
connected to SV , or can be set by an external resistor
IN
Iftheoutputcurrentincreases, theerroramplifierraisesthe
ITH pin voltage until the average inductor current matches
the new load current. In normal operation the LTC3617
clampsthemaximumITHpinvoltageatapproximately1.ꢀ5V
which corresponds typically to 10A peak inductor current.
connected between the RT pin and ground, or by a clock
signal applied to the RT pin. The switching frequency can
be set from 3ꢀꢀkHz to 4MHz.
Overvoltage and undervoltage comparators pull the
PGOOD output low if the output voltage varies more than
±8% (typical) from the set point.
When the output is shorted to ground, the inductor cur-
rent decays very slowly during a single switching cycle.
To prevent current runaway from occurring, a secondary
current limit is imposed on the inductor current. If the
inductor current measured through the bottom MOSFET
increases beyond 12A typical, the top power MOSFET will
be held off and switching cycles will be skipped until the
inductor current decreases below this limit.
VTTR Voltage Buffer Output
An internal high accuracy op amp buffer generates a VTTR
pin voltage that is equal to VDDQIN • 0.5. VTTR can source
and sink up to 10mA and is stable with a maximum bypass
capacitor of 0.1µF. Short-circuit current limit is set around
2ꢀmA to prevent damage to the op amp. VTTR is also the
3617fa
9
LTC3617
applications inForMation
The basic LTC3617 application circuit is shown in Figure 1.
Tying the RT pin to SV sets the default internal operating
IN
frequency to 2.25MHz 2ꢀ%.
Operating Frequency
Frequency Synchronization
Selectionoftheoperatingfrequencyisatrade-offbetween
efficiency and component size. High frequency operation
allows the use of smaller inductor and capacitor values.
The LTC3617’s internal oscillator can be synchronized to
an external frequency by applying a square wave clock
signal to the SYNC pin. During synchronization, the top
switch turn-on is locked to the falling edge of the external
frequency source. The synchronization frequency range
is 3ꢀꢀkHz to 4MHz.
Operation at lower frequencies improves efficiency by
reducing internal gate charge losses but requires larger
inductance values and/or capacitance to maintain low
output voltage ripple.
The frequency set by the resistor on the RT pin should be
the same as the external clock frequency to ensure the
internal oscillator properly adjusts when the clock signal
is applied or removed.
The operating frequency of the LTC3617 is determined
by an external resistor that is connected between the RT
pin and ground. The value of the resistor sets the ramp
current that is used to charge and discharge an internal
timingcapacitorwithintheoscillatorandcanbecalculated
by using the following equation:
V
IN
LTC3617
SV
IN
f
OSC
RT
SYNC
SGND
3.82•1011Hz
2.25MHz
RT =
Ω –16kΩ
fOSC Hz
( )
Although frequencies as high as 4MHz are possible, the
minimum on-time of the LTC3617 imposes a minimum
limit on the operating duty cycle. The minimum on-time
is typically 80ns; therefore, the minimum duty cycle is
V
IN
LTC3617
SV
IN
0.4V
RT
SYNC
SGND
f
∝1/R
T
OSC
equal to 80ns•f (Hz)•100%.
R
OSC
T
V
IN
2.5V
C
V
IN
IN
LTC3617
SV
22µF
SV
IN
PV
IN
×4
R
T
IN
f
RUN
VDDQIN
RT
VTTR
1.25V
10ꢁꢀ
OSC
P
RT
SYNC
SGND
1.2V
R
1/T
PG
VTTR
100k
0.1µF
R
T
L1
0.33µH
LTC3617
365k
V
OUT
1.25V
6ꢀ
SW
SGND
0.3V
C
OUT
PGOOD
PGOOD
T
P
100µF
R
C
10k
3617 F02
ITH
PGND
FB
C
C1
C
V
C
SYNC
10pF
Figure 2. Setting Switching Frequency
680pF
(OPT)
3617 F01
Figure ±. ±.25V, ±6A at ±MHz fro0 2.5V
3617fa
10
LTC3617
applications inForMation
Inductor Selection
exceeded. This results in an abrupt increase in inductor
ripple current and consequently output voltage ripple. Do
not allow a ferrite core to saturate!
For a given input and output voltage, the inductor value
and operating frequency determine the ripple current. The
ripple current ∆I increases with higher V and decreases
Different core materials and shapes will change the size/
currentandprice/currentrelationshipofaninductor.Toroid
or shielded pot cores in ferrite or permalloy materials are
small and don’t radiate much energy, but generally cost
more than powdered iron core inductors with similar
characteristics. The choice of which style inductor to use
mainly depends on the price versus size requirements
and any radiated field/EMI requirements. Table 1 shows
some typical surface mount inductors that work well in
LTC3617 applications.
L
IN
with higher inductance:
VOUT
VOUT
VIN
∆IL =
• 1–
f
•L
SW
Having a lower ripple current reduces the core losses
in the inductor, the ESR losses in the output capacitors
and the output voltage ripple. A reasonable starting point
for selecting the ripple current is ∆I = 0.3 • I
The largest ripple current occurs at the highest V . To
.
L
OUT(MAX)
IN
guarantee that the ripple current stays below a specified
maximum, theinductorvalueshouldbechosenaccording
to the following equation:
Input Capacitor (C ) Selection
IN
In continuous mode, the source current of the top P-
channel MOSFET is a square wave of duty cycle V
/
OUT
V . To prevent large input voltage transients, a low ESR
VOUT
SW • ∆I
VOUT
IN
L =
• 1–
capacitor sized for the maximum RMS current must be
f
V
L(MAX)
IN(MAX)
used at V .
IN
The maximum RMS capacitor current is given by:
Inductor Core Selection
VOUT
VIN
VIN
Oncethevalue forL isknown, thetypeofinductormust be
selected. Actual core loss is independent of core size for a
fixed inductor value, but it is very dependent on the induc-
tanceselected.Astheinductanceincreases,corelossesde-
crease.Unfortunately,increasedinductancerequiresmore
turnsof wireand therefore, copperlosseswillincrease.
IRMS =IOUT(MAX)
•
•
–1
V
OUT
ThisformulahasamaximumatV = 2 • V ,whereI =
RMS
IN
OUT
I
/2.Thissimpleworst-caseconditioniscommonlyused
OUT
fordesignbecauseevensignificantdeviationsdonotoffer
muchrelief.Notethatripplecurrentratingsfromcapacitor
manufacturers are often based on only 2ꢀꢀꢀ hours of life
which makes it advisable to further derate the capacitor,
or choose a capacitor rated at a higher temperature than
required.Severalcapacitorsmayalsobeparalleledtomeet
size or height requirements in the design.
Ferrite designs have very low core losses and are pre-
ferred at high switching frequencies, so design goals can
concentrate on copper loss and preventing saturation.
Ferritecorematerialsaturates“hard,”meaningthatinduc-
tance collapses abruptly when the peak design current is
3617fa
11
LTC3617
applications inForMation
Table ±. Representative Surface Mount Inductors
where f
= operating frequency, C
L
= output capaci-
OUT
OSC
tance and ∆I = ripple current in the inductor. The output
INDUCTANCE
(μH)
DCR
(0Ω)
SATURATION
CURRENT (A)
DIMENSIONS
(00)
HEIGHT
(00)
ripple is highest at maximum input voltage since ∆I
increases with input voltage.
L
Vishay IHLP-2525CZ-1±
ꢀ.1ꢀ
ꢀ.15
ꢀ.2ꢀ
ꢀ.22
ꢀ.33
ꢀ.47
1.5
1.9
2.4
2.5
3.5
4
6ꢀ
52
41
4ꢀ
3ꢀ
26
3
3
3
3
3
3
6.5 × 6.9
6.5 × 6.9
6.5 × 6.9
6.5 × 6.9
6.5 × 6.9
6.5 × 6.9
In surface mount applications, multiple capacitors may
have to be paralleled to meet the capacitance, ESR or RMS
currenthandlingrequirementoftheapplication.Aluminum
electrolytic, special polymer, ceramic and dry tantalum
capacitors are all available in surface mount packages.
Tantalumcapacitorshavethehighestcapacitancedensity,
but can have higher ESR and must be surge tested for
use in switching power supplies. Aluminum electrolytic
capacitors have significantly higher ESR, but can often
be used in extremely cost-sensitive applications provided
that consideration is given to ripple current ratings and
long-term reliability.
Su0ida CDMC6D28 Series
ꢀ.2
ꢀ.3
2.5
3.2
4.2
21.7
15.4
13.6
3
3
3
7.25 × 6.5
7.25 × 6.5
7.25 × 6.5
ꢀ.47
Cooper HCM1713 Series
ꢀ.22
ꢀ.47
0.68
2.8
4.2
5.5
4ꢀ
26
25
3.ꢀ
3.ꢀ
3.ꢀ
6.8 × 7.1
6.8 × 7.1
6.8 × 7.1
Cera0ic Input and Output Capacitors
Würth Electronik WE-HC7443±1 Series
Ceramic capacitors have the lowest ESR and can be cost
effective, but also have the lowest capacitance density,
havehighvoltageandtemperaturecoefficients,andexhibit
audible piezoelectric effects. In addition, the high Q of
ceramic capacitors along with trace inductance can lead
to significant ringing.
ꢀ.24
ꢀ.52
1.8
4ꢀ
2ꢀ
3.ꢀ
3.ꢀ
7 × 6.9
7 × 6.9
3.7
Coilcraft SLC7531 Series
ꢀ.1ꢀꢀ
0.188
ꢀ.272
ꢀ.35ꢀ
ꢀ.4ꢀꢀ
ꢀ.123
ꢀ.1ꢀꢀ
ꢀ.1ꢀꢀ
ꢀ.1ꢀꢀ
ꢀ.1ꢀꢀ
2ꢀ
21
14
11
8
3
3
3
3
3
7.5 × 6.7
7.5 × 6.7
7.5 × 6.7
7.5 × 6.7
7.5 × 6.7
They are attractive for switching regulator use because of
their very low ESR, but care must be taken when using
only ceramic input and output capacitors.
Ceramic capacitors are prone to temperature effects
which require the designer to check loop stability over
the operating temperature range. To minimize their large
temperature and voltage coefficients, only X5R or X7R
ceramic capacitors should be used.
Output Capacitor (C ) Selection
OUT
The selection of C
is typically driven by the required
OUT
ESR to minimize voltage ripple and load step transients
(low ESR ceramic capacitors are discussed in the next
section). Typically, once the ESR requirement is satisfied,
the capacitance is adequate for filtering. The output ripple
Whenaceramiccapacitorisusedattheinputandthepower
is being supplied through long wires, such as from a wall
adapter, a load step at the output can induce ringing at the
∆V
is determined by:
OUT
V pin. At best, this ringing can couple to the output and
1
IN
∆VOUT ≤ ∆IL • ESR+
be mistaken as loop instability. At worst, the ringing at the
8 • fSW •C
OUT
input can be large enough to damage the part.
3617fa
12
LTC3617
applications inForMation
V
OUT
Since the ESR of a ceramic capacitor is so low, the input
and output capacitor must instead fulfill a charge storage
requirement.Duringaloadstep,theoutputcapacitormust
instantaneously supply the current until the feedback loop
raises the switch current enough to support the load. The
timerequiredforthefeedbacklooptorespondisdependent
on the compensation components and the output capaci-
tor size. Typically, 3 to 4 switching cycles are required to
respond to a load step, but only in the first cycle does the
R2
V
FB
LTC3617
SGND
R1
3617 F03
Figure 3. Setting the Output Voltage
Internal and External Co0pensation
output drop linearly. The output droop, V
, is usually
DROOP
The regulator loop response can be checked by looking at
the load current transient response. Switching regulators
take several cycles to respond to a step in DC load current.
about2to4timesthelineardropofthefirstcycle;however,
this behavior can vary depending on the compensation
component values. Thus, a good place to start is with the
output capacitor size of approximately:
When a load step occurs, V
shifts by an amount equal
OUT
to ∆I
• ESR, where ESR is the effective series resis-
LOAD
tance of C . ∆I
3.5• ∆IOUT
fSW • VDROOP
also begins to charge or discharge
OUT
LOAD
COUT
≈
C
, generating the feedback error signal that forces the
OUT
regulatortoadapttothecurrentchangeandreturnV
to
OUT
This is only an approximation; more capacitance may
be needed depending on the duty cycle and load step
requirements.
its steady-state value. During this recovery time V
can
OUT
be monitored for excessive overshoot or ringing, which
would indicate a stability problem. The availability of the
ITH pin allows the transient response to be optimized over
a wide range of output capacitance.
Inmostapplications,theinputcapacitorismerelyrequired
to supply high frequency bypassing, since the impedance
to the supply is very low.
The ITH external components (R and C ) shown in Fig-
C
C
ure 1 provide adequate compensation as a starting point
for most applications. The values can be modified slightly
to optimize transient response once the final PCB layout
is done and the particular output capacitor type and value
have been determined. The output capacitors need to be
selected because the various types and values determine
the loop gain and phase. The gain of the loop will be in-
Output Voltage Progra00ing
In most applications, V
is connected directly to V .
FB
OUT
The output voltage will be equal to one-half of the voltage
on the VDDQIN pin for this case.
VDDQIN
VOUT
=
2
creased by increasing R and the bandwidth of the loop
C
will be increased by decreasing C . If R is increased by
C
C
If a different output relationship is desired, an external
resistor divider from V to V can be used. The output
the same factor that C is decreased, the zero frequency
C
OUT
FB
will be kept the same, thereby keeping the phase shift the
same in the most critical frequency range of the feedback
loop. The output voltage settling behavior is related to the
stability of the closed-loop system. The external capaci-
voltagewillthenbesetaccordingtothefollowingequation:
VDDQIN
2
R2
R1
VOUT
=
• 1+
tor, C , (Figure 1) is not needed for loop stability, but it
C1
helps filter out any high frequency noise that may couple
onto that node.
3617fa
13
LTC3617
applications inForMation
The first circuit in the Typical Applications section uses
faster compensation to improve step response.
pin to SV . However, selecting the internal compensation
IN
might result in an unstable output voltage when tracking
down to 0V.
A second, more severe transient is caused by switching
in loads with large (>1μF) supply bypass capacitors. The
dischargedbypasscapacitorsareeffectivelyputinparallel
Shutdown and Soft-Start
The RUN pin provides a means to shut down the LTC3617.
Tying the RUN pin to SGND places the regulator in a low
with C , causing a rapid drop in V . No regulator can
OUT
OUT
alter its delivery of current quickly enough to prevent this
sudden step change in output voltage if the load switch
resistance is low and it is driven quickly. More output
capacitance may be required depending on the duty cycle
and load step requirements.
quiescent current shutdown state (I < 1µA).
Q
PullingtheRUNpinhighenablestheregulatorwhichallows
an internal soft-start to slowly ramp the VTTR pin voltage
at a rate of approximately 850mV/ms. During this start-
up time, the regulator will operate in discontinuous mode
until the VTTR pin voltage exceeds approximately ꢀ.45V.
Internal Co0pensation
The LTC3617 provides the option to use a fixed internal
loopcompensationnetworktoreducetherequiredexternal
component count and design time. The internal loop com-
pensation network can be selected by connecting the ITH
When RUN is pulled low, the regulator will force the peak
inductorcurrenttodischargetoaroundꢀAbeforeshutting
off both power MOSFETs.
Output Power Good
V
OUT
The PGOOD output of the LTC3617 is driven by a 17Ω
(typical) open-drain pull-down MOSFET. This MOSFET
turns off approximately 3ms to 4ms after the beginning
of start-up and once the output voltage is within 5% (typi-
cal) of 0.5 • VDDQIN, allowing the voltage at PGOOD to
rise via an external pull-up resistor (1ꢀꢀk typical). If the
output voltage exits an 8% (typical) regulation window
of 0.5 • VDDQIN or the VTTR pin is lower than 0.45V, the
open-drain output will pull low, thus dropping the PGOOD
pin voltage. To prevent unwanted PGOOD glitches during
50mV/DIV
I
L
2A/DIV
3617 F04
V
V
LOAD
= 3.3V
40µs/DIV
IN
= 1.25V
OUT
I
= 100mA TO 3A
COMPENSATION FIGURE 1
Figure 4. Load Step Transient with
External Co0pensation
transientsordynamicV
changes,theLTC3617PGOOD
OUT
falling edge includes a filter time of approximately 105μs.
V
OUT
50mV/DIV
Efficiency Considerations
I
Theefficiencyofaswitchingregulatorisequaltotheoutput
power divided by the input power times 100%. It is often
useful to analyze individual losses to determine what is
limiting the efficiency and which change would produce
the most improvement. Efficiency can be expressed as:
L
2A/DIV
3617 F05
V
V
LOAD
= 3.3V
40µs/DIV
IN
= 1.25V
OUT
I
= 100mA TO 3A
= 3.3V
V
ITH
OUTPUT CAPACITOR VALUE FIGURE 1
Efficiency = 1ꢀꢀ% – (L1 + L2 + L3 + ...)
Figure 5. Load Step Transient with
Internal Co0pensation
where L1, L2, etc. are the individual losses as a percent-
age of input power.
3617fa
14
LTC3617
applications inForMation
Although all dissipative elements in the circuit produce
However, in high current applications where the LTC3617
is running at high ambient temperature with low supply
voltage and high duty cycles, such as in dropout, the heat
generatedmayexceedthemaximumjunctiontemperature
of the part. If the junction temperature reaches approxi-
mately 160°C, both power switches will be turned off and
the SW node will become high impedance.
losses, two main sources usually account for most of
2
the losses: V quiescent current and I R losses. The V
IN
IN
quiescent current loss dominates the efficiency loss at
2
very low load currents whereas the I R loss dominates
the efficiency loss at medium to high load currents. In a
typical efficiency plot, the efficiency curve at very low load
currents can be misleading since the actual power lost is
usually of no consequence.
To prevent the LTC3617 from exceeding the maximum
junction temperature, some thermal analysis is required.
The temperature rise is given by:
1. TheV quiescentcurrentisduetotwocomponents:the
IN
DCbiascurrentasgivenintheElectricalCharacteristics
and the internal main switch and synchronous switch
gate charge currents. The gate charge current results
fromswitchingthegatecapacitanceoftheinternalpower
MOSFET switches. Each time the gate is switched from
low to high to low again, a packet of charge dQ moves
T
= (P ) • (θ )
D JA
RISE
where P is the power dissipated by the regulator and θ
D
JA
is the thermal resistance from the junction of the die to
the ambient temperature. The junction temperature, T ,
J
is given by:
from V to ground. The resulting dQ/dt is the current
IN
T = T + T
RISE
J
A
intoV dueto gate charge, and itistypically largerthan
IN
where T is the ambient temperature.
A
the DC bias current. Both the DC bias and gate charge
losses are proportional to V ; thus, their effects will
As an example, consider the case when the LTC3617 is
used in a DDR application where V = 3.3V, I
IN
be more pronounced at higher supply voltages.
= 6A,
IN
OUT
2
f = 1MHz, V
= 1.25V. The equivalent power MOSFET
OUT
2. I R losses are calculated from the resistances of the
resistance R is:
SW
internal switches, R , and external inductor, R . In
SW
L
continuous mode the average output current flowing
through inductor L is “chopped” between the main
switch and the synchronous switch. Thus, the series
resistance looking into the SW pin is a function of both
VOUT
VOUT
RSW =RDS(ON)TOP •
+RDS(ON)BOT • 1–
V
V
IN
IN
1.25
= 35mΩ•
3.3
1.25
3.3
+25mΩ• 1–
= 28.79mΩ
top and bottom MOSFET R
(DC) as follows:
and the duty cycle
DS(ON)
The V current during 1MHz with no load is about 22mA,
R
SW
= (R )(DC) + (R )(1 – DC)
DS(ON)TOP DS(ON)BOT
IN
which includes switching and internal biasing current
loss, transition loss, inductor core loss and other losses
in the application. Therefore, the total power dissipated
by the part is:
The R
for both the top and bottom MOSFETs can
DS(ON)
be obtained from the Typical Performance Character-
2
istics curves. To obtain I R losses, simply add R to
SW
R and multiply the result by the square of the average
L
2
P = I
D
• R + V • I (No Load)
SW IN VIN
output current.
OUT
2
= 36A • 28.79mΩ + 3.3V • 22mA = 1.11W
Other losses including C and C
ESR dissipative
OUT
IN
losses and inductor core losses generally account for
TheQFN3mm× 5mmpackagejunction-to-ambientthermal
less than 2% of the total loss.
resistance, θ , is around 43°C/W. Therefore, the junction
JA
temperature of the regulator operating in a 25°C ambient
Ther0al Considerations
temperature is approximately:
Inmostapplications,theLTC3617doesnotgeneratemuch
heat due to its high efficiency.
T = 1.11W • 43°C/W + 25°C = 73°C
J
3617fa
15
LTC3617
applications inForMation
Remembering that the above junction temperature is
C should be selected for a maximum current rating of:
IN
obtained from the R
at 25°C, we might recalculate
DS(ON)
1.25V
2.5V
2.5V
1.25V
the junction temperature based on a higher R
since
DS(ON)
IRMS = 6A •
•
–1 = 3A
RMS
it increases with temperature. Redoing the calculation
assuming that R increased 15% at 73°C yields a new
SW
Decoupling PV with four 10µF to 22µF capacitors is
IN
junctiontemperatureof79°C. Therefore, wecansafelyas-
sume that the actual junction temperature will not exceed
the absolute maximum junction temperature of 125°C.
adequate for most applications. Connecting the V pin
FB
directlytoV
willsettheoutputvoltageequaltoone-half
of the voltage on the VDDQIN pin. The complete circuit of
OUT
Note that for very low input voltage, the junction tempera-
ture will be higher due to increased switch resistance,
this design example is illustrated in Figure 1.
PC Board Layout Checklist
R
. It is not recommended to use full load current
DS(ON)
with high ambient temperature and low input voltage.
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3617:
To maximize the thermal performance of the LTC3617 the
exposed pad must be soldered to a ground plane. See the
PCB Layout Board Checklist.
1. Agroundplaneisrecommended.Ifagroundplanelayer
is not used, the signal and power grounds should be
segregated with all small-signal components returning
to the SGND pin at one point which is then connected
to the PGND pin close to the LTC3617.
Design Exa0ple
As a design example, consider the LTC3617 in an applica-
tion with the following specifications:
2. Connect the (+) terminal of the input capacitor(s), C ,
V
= 2.5V, V
= 1.25V, I
= 6A, I
=
OUT(MIN)
IN
IN
OUT
OUT(MAX)
ascloseaspossibletothePV pin, andthe(–)terminal
2ꢀꢀmA, f = 2.6MHz.
IN
as close as possible to the exposed pad, PGND. This
capacitorprovidestheACcurrentintotheinternalpower
MOSFETs.
First, calculate the timing resistor:
3.8211Hz
2.6MHz
RT =
–16k =130kΩ
3. Keep the switching node, SW, away from all sensitive
small-signal nodes.
Next, calculate the inductor value for about 33% ripple
current at maximum V :
4. Flood all unused areas on all layers with copper. Flood-
ing with copper will reduce the temperature rise of
powercomponents. ConnectthecopperareastoPGND
(exposed pad) for best performance.
IN
1.25V
2.6MHz •2A
1.25V
2.5V
L =
• 1–
= 0.12µH
5. Connect the V pin directly to V
.
FB
OUT
Using a standard value of 0.1µH inductor results in a
maximum ripple current of:
1.25V
2.6MHz•0.1µH
1.25V
2.5V
∆IL =
• 1–
= 2.4A
C
will be selected based on the ESR that is required
OUT
to satisfy the output voltage ripple requirement and the
bulk capacitance needed for loop stability. For this design,
a 100µF ceramic capacitor is used with a X5R or X7R
dielectric.
3617fa
16
LTC3617
typical applications
±.25V, ±6A DDR Me0ory Ter0ination Supply, 2.25MHz
V
IN
2.5V TO 5.5V
C
IN
R
F
22µF
24Ω
×4
C
1µF
F
SV
RUN
VDDQIN
RT
PV
IN
VTTR
IN
V
REF
1.25V
10ꢀA
VDDQ
2.5V
C
O1
0.1µF
L1
0.15µH
R1
LTC3617
VTT
100k
1.25V
6A
SW
SGND
PGND
R
C
C
O2
PGOOD
PGOOD
ITH
20k
100µF
C
C
C
C1
V
FB
SYNC
470pF
10pF
3617 TA02a
L1: VISHAY IHLP-2525CZ-01 150nH
Efficiency vs Load Current
Load Step Response
100
90
80
70
60
50
40
30
20
10
0
V
TT
50mV/DIV
I
L
4A/DIV
3617 TA02c
V
= 3.3V
40µs/DIV
V
V
V
= 2.5V
= 3.3V
= 5V
IN
IN
IN
IN
VTT = 1.25V
= 100mA TO 6A
I
LOAD
0.1
1
10
LOAD CURRENT (A)
3617 TA02b
3617fa
17
LTC3617
typical applications
1.75V, ±6A DDR Ter0ination Using a ±MHz External Clock
V
IN
2.5V TO 5.5V
C
IN
R
F
22µF
24Ω
×4
C
1µF
F
SV
RUN
VDDQIN
RT
PV
IN
IN
VTTR
V
REF
0.75V
10ꢀA
VDDQ
1.5V
C
O1
0.1µF
L1
0.33µH
R1
365k
R2
100k
VTT
0.75V
6A
LTC3617
SW
C
O2
100µF
R
C
PGOOD
PGOOD
ITH
SGND
PGND
6k
C
C
C
C1
V
FB
SYNC
1.5nF
10pF
1MHz CLOCK
3617 TA03a
L1: VISHAY IHLP-2525CZ-01 330nH
External Start-Up
Output Tracking Up/Down
VDDQ
VDDQ
500mV/DIV
500mV/DIV
V
/VTT
REF
V
/VTT
REF
3617 TA03b
3617 TA03c
2ms/DIV
4ms/DIV
package Description
UDD Package
24-Lead Plastic QFN (300 × 500)
(Reference LTC DWG # 05-08-1833 Rev Ø)
PIN ꢀ NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.75 0.05
ꢀ.50 REF
R = 0.05 TYP
3.00 0.ꢀ0
23
24
0.70 0.05
0.40 0.ꢀ0
3.50 0.05
PIN ꢀ
TOP MARK
(NOTE 6)
ꢀ
2
2.ꢀ0 0.05
3.65 0.05
ꢀ.65 0.05
ꢀ.50 REF
3.65 0.ꢀ0
ꢀ.65 0.ꢀ0
5.00 0.ꢀ0
PACKAGE OUTLINE
3.50 REF
0.25 0.05
0.50 BSC
3.50 REF
4.ꢀ0 0.05
5.50 0.05
(UDD24) QFN 0808 REV
Ø
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.200 REF
0.00 – 0.05
0.25 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
R = 0.ꢀꢀ5
TYP
NOTE:
ꢀ. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.ꢀ5mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
6. SHADED AREA IS ONLY A REFERENCE FOR PIN ꢀ LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3617fa
18
LTC3617
revision history
REV
DATE
DESCRIPTION
PAGE NUMBER
A
7/11
Updated Main Control section
Updated Output Power Good section
Updated Typical Application and scale on graphs
9
14
18, 20
3617fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
LTC3617
typical application
DDR2 Ter0ination, ±MHz
External Start-Up
V
IN
2.25V TO 5.5V
22µF
×4
SV
RUN
VDDQIN
RT
PV
IN
VTTR
VDDQ
IN
V
REF
0.9V
10ꢀA
VDDQ
1.8V
0.1µF
L1
0.33µH
500mV/DIV
R1
365k
R2
100k
VTT
0.9V
6A
V
/VTT
REF
LTC3617
SW
R
C
100µF
47µF
PGOOD
PGOOD
ITH
SYNC
SGND
PGND
6k
C
C
C1
10pF
C
V
FB
2.2nF
3617 TA04b
400µs/DIV
3617 TA04a
L1: COILCRAFT D03316T
relateD parts
PART NUMBER DESCRIPTION
COMMENTS
95% Efficiency, V
LTC3616
LTC3612
LTC3418
LTC3415
LTC3416
LTC3413
LTC3412A
5.5V, 6A (I ) 4MHz Synchronous Step-Down DC/DC
= 2.25V, V
= 5.5V, V
OUT(MIN)
= ꢀ.6V,
= ꢀ.6V,
OUT
IN(MIN)
IN(MAX)
Converter
I = 70µA, I < 1µA, 3mm × 5mm QFN24 Package
Q SD
5.5V, 3A (I ), 4MHz, Synchronous Step-Down DC/DC
95% Efficiency, V
I = 70µA, I <1µA, 3mm × 4mm QFN-20 TSSOP20E Package
Q SD
= 2.25V, V
= 5.5V, V
IN(MAX) OUT(MIN)
OUT
IN(MIN)
Converter
5.5V, 8A (I ), 4MHz, Synchronous Step-Down DC/DC
95% Efficiency, V
I = 380µA, I <1µA, 5mm × 7mm QFN-38 Package
Q SD
= 2.25V, V
= 5.5V, V = 0.8V,
OUT(MIN)
OUT
IN(MIN)
IN(MAX)
Converter
5.5V, 7A (I ), 1.5MHz, Synchronous Step-Down DC/DC
95% Efficiency, V
I = 450µA, I <1µA, 5mm × 7mm QFN-38 Package
Q SD
= 2.5V, V
= 5.5V, V = ꢀ.6V,
OUT(MIN)
OUT
IN(MIN)
IN(MAX)
Converter
5.5V, 4A (I ), 4MHz, Synchronous Step-Down DC/DC
95% Efficiency, V
I = 64µA, I <1µA, TSSOP20E Package
Q SD
= 2.25V, V
= 5.5V, V
= 0.8V,
OUT
IN(MIN)
IN(MAX)
OUT(MIN)
OUT(MIN)
Converter
5.5V, 3A (I
Sink/Source), 2MHz, Monolithic Synchronous
90% Efficiency, V
I = 280µA, I <1µA, TSSOP16E Package
Q SD
= 2.25V, V
= 5.5V, V
= V /2,
REF
OUT
IN(MIN)
IN(MAX)
Regulator for DDR/QDR Memory Termination
5.5V, 2.5A (I ), 4MHz, Synchronous Step-Down DC/DC
95% Efficiency, V
I = 60µA, I <1µA, 4mm × 4mm QFN-16 TSSOP16E Package
Q SD
= 2.5V, V
= 5.5V, V
= 0.8V,
OUT(MIN)
OUT
IN(MIN)
IN(MAX)
Converter
3617fa
LT 0711 REV A • PRINTED IN USA
20 LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
●
●
LINEAR TECHNOLOGY CORPORATION 2011
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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