LTC4007EGN#TRPBF [Linear]

LTC4007 - 4A, High Efficiency, Standalone Li-Ion Battery Charger; Package: SSOP; Pins: 24; Temperature Range: -40°C to 85°C;
LTC4007EGN#TRPBF
型号: LTC4007EGN#TRPBF
厂家: Linear    Linear
描述:

LTC4007 - 4A, High Efficiency, Standalone Li-Ion Battery Charger; Package: SSOP; Pins: 24; Temperature Range: -40°C to 85°C

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Final Electrical Specifications  
LTC4007  
4A, High Efficiency,  
Standalone Li Battery Charger  
January 2003  
U
FEATURES  
DESCRIPTION  
The LTC®4007 is a complete constant-current/constant-  
voltage charger controller for 3- or 4-cell lithium-ion  
batteries.ThePWMcontrollerusesasynchronous,quasi-  
constant frequency, constant off-time architecture that  
will not generate audible noise even when using ceramic  
capacitors. Charging current is programmable to ±5%  
accuracyusingaprogrammingresistor.Chargingcurrent  
can also be monitored as a voltage across the program-  
ming resistor.  
Complete Charger Controller for 3- or 4-Cell  
Lithium-Ion Batteries  
High Conversion Efficiency: Up to 96%  
Output Currents Exceeding 4A  
±0.8% Charging Voltage Accuracy  
Built-In Charge Termination for Li-Ion Batteries  
AC Adapter Current Limiting Maximizes Charge Rate*  
Thermistor Input for Temperature Qualified Charging  
Wide Input Voltage Range: 6V to 28V  
0.5V Dropout Voltage; Maximum Duty Cycle: 98%  
Programmable Charge Current: ±5% Accuracy  
Indicator Outputs for Charging, C/10 Current  
Detection, AC Adapter Present, Low Battery, Input  
Current Limiting and Faults  
The output float voltage is pin programmed for cell count  
(3 cells or 4 cells) and chemistry (4.2V/4.1V). A timer,  
programmed by an external resistor, sets the total charge  
time.Chargingisautomaticallyrestartedwhencellvoltage  
falls below 3.9V/cell.  
Charging Current Monitor Output  
Available in a 24-Pin Narrow SSOP Package  
LTC4007 includes a thermistor input, which suspends  
charging if an unsafe temperature condition is detected. If  
the cell voltage is less than 2.5V, a low-battery indicator  
asserts and can be used to program a trickle charge cur-  
rent to safely charge depleted batteries. The FAULT pin is  
also asserted and charging terminates if the low-battery  
conditionpersistsformorethan1/4ofthetotalchargetime.  
U
APPLICATIO S  
Notebook Computers  
Portable Instruments  
Battery-Backup Systems  
Standalone Li-Ion Chargers  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
*U.S. Patent No. 5,723,970  
U
TYPICAL APPLICATIO  
12.6V, 4A Li-Ion Battery Charger  
INPUT SWITCH  
DCIN  
0V TO 28V  
0.1µF  
4.9k  
3C4C  
DCIN  
INFET  
CLP  
V
LOGIC  
0.025Ω  
15nF  
100k  
100k 100k  
CHEM  
LOBAT  
SYSTEM  
LOAD  
LOBAT  
I
I
LTC4007 CLN  
TGATE  
CL  
CL  
20µF  
ACP  
SHDN  
FAULT  
CHG  
ACP  
Q1  
10µH  
0.025Ω  
SHDN  
BGATE  
Li-Ion  
BATTERY  
Q2  
FAULT  
CHG  
PGND  
CSP  
20µF  
3.01k  
FLAG  
FLAG  
NTC  
BAT  
32.4k  
3.01k  
PROG  
ITH  
CHARGING  
CURRENT  
MONITOR  
R
T
THERMISTOR  
0.0047µF  
0.47µF  
GND  
6.04k  
0.12µF  
10k  
NTC  
Q1: Si4431DY  
Q2: FDC6459  
TIMING RESISTOR  
(~2 HOURS)  
26.7k  
309k  
4007 TA01  
4007i  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tation that the interconnection of its circuits as described herein will notinfringe onexisting patent rights.  
1
LTC4007  
W W  
U W  
U
W U  
ABSOLUTE MAXIMUM RATINGS  
PACKAGE/ORDER INFORMATION  
(Note 1)  
TOP VIEW  
Voltage from DCIN, CLP, CLN to GND ....... +32V/0.3V  
PGND with Respect to GND ................................. ±0.3V  
CSP, BAT to GND....................................... +28V/0.3V  
CHEM, 3C4C, RT to GND .............................. +7V/0.3V  
NTC ............................................................ +10V/0.3V  
ACP, SHDN, CHG, FLAG,  
FAULT, LOBAT, ICL .............................................. +32V/0.3V  
Operating Ambient Temperature Range  
(Note 4) ............................................. 40°C to 85°C  
Operating Junction Temperature ......... 40°C to 125°C  
Storage Temperature Range ................. 65°C to 150°C  
Lead Temperature (Soldering, 10 sec).................. 300°C  
ORDER PART  
NUMBER  
1
2
SHDN  
INFET  
BGATE  
PGND  
TGATE  
CLN  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
DCIN  
CHG  
ACP  
LTC4007EGN  
3
4
R
T
5
FAULT  
GND  
3C4C  
LOBAT  
NTC  
6
7
CLP  
8
FLAG  
CHEM  
BAT  
9
10  
11  
12  
ITH  
CSP  
PROG  
NC  
I
CL  
GN PACKAGE  
24-LEAD PLASTIC SSOP  
TJMAX = 125°C, θJA = 90°C/W  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating  
temperature range (Note 4), otherwise specifications are at TA = 25°C. VDCIN = 20V, VBAT = 12V unless otherwise noted.  
SYMBOL PARAMETER  
DCIN Operating Range  
CONDITIONS  
MIN  
TYP  
MAX  
28  
UNITS  
V
6
I
Operating Current  
Sum of Current from CLP, CLN , DCIN  
3
5
mA  
Q
V
Charge Voltage Accuracy  
Nominal Values: 12.3V, 12.6V, 16.4V, 16.8V  
(Note 2)  
–0.8  
–1.0  
0.8  
1.0  
%
%
TOL  
I
Charge Current Accuracy (Note 3)  
V
– V  
Target = 100mV  
–4  
–5  
–60  
–35  
4
5
60  
35  
%
%
%
%
TOL  
CSP  
BAT  
V
< 6V, V  
– V  
Target = 10mV  
BAT  
BAT  
CSP  
6V V  
V  
, V  
– V  
BAT  
LOBAT CSP BAT  
Target = 10mV  
T
Termination Timer Accuracy  
Battery Leakage Current  
R
= 270k  
–15  
15  
%
TOL  
RT  
Shutdown  
DCIN = 0V  
SHDN = 3V  
15  
30  
10  
µA  
µA  
–10  
4.2  
1
UVLO  
Undervoltage Lockout Threshold  
Shutdown Threshold at SHDN  
SHDN Pin Current  
DCIN Rising, V  
= 0  
4.7  
1.6  
10  
2
5.5  
2.5  
V
V
BAT  
µA  
mA  
Operating Current in Shutdown  
V
= 0V, Sum of Current from CLP,  
3
SHDN  
CLN, DCIN  
Current Sense Amplifier, CA1  
Input Bias Current Into BAT Pin  
CA1/I Input Common Mode Low  
11.67  
µA  
V
CMSL  
CMSH  
0
1
CA1/I Input Common Mode High  
V
– 0.2  
CLN  
V
1
4007i  
2
LTC4007  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating  
temperature range (Note 4), otherwise specifications are at TA = 25°C. VDCIN = 20V, VBAT = 12V unless otherwise noted.  
SYMBOL PARAMETER  
Current Comparators I  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
and I  
CMP  
REV  
I
I
Maximum Current Sense Threshold (V  
– V  
)
BAT  
V = 2.4V  
ITH  
140  
165  
–30  
200  
mV  
mV  
TMAX  
TREV  
CSP  
Reverse Current Threshold (V  
– V  
)
BAT  
CSP  
Current Sense Amplifier, CA2  
Transconductance  
Source Current  
1
mmho  
µA  
Measured at I , V = 1.4V  
40  
40  
TH ITH  
Sink Current  
Measured at I , V = 1.4V  
µA  
TH ITH  
Current Limit Amplifier  
Transconductance  
1.4  
100  
100  
mmho  
mV  
V
Current Limit Threshold  
CLP Input Bias Current  
93  
107  
110  
CLP  
CLP  
I
nA  
Voltage Error Amplifier, EA  
Transconductance  
Sink Current  
1
mmho  
µA  
Measured at I , V = 1.4V  
36  
TH ITH  
OVSD  
Overvoltage Shutdown Threshold as a Percent  
of Programmed Charger Voltage  
102  
0
107  
%
Input P-Channel FET Driver (INFET)  
DCIN Detection Threshold (V  
– V  
)
CLN  
DCIN Voltage Ramping Up  
0.17  
0.25  
50  
V
DCIN  
from V  
– 0.1V  
CLN  
Forward Regulation Voltage (V  
– V  
)
25  
25  
5.8  
mV  
mV  
V
DCIN  
CLN  
Reverse Voltage Turn-Off Voltage (V  
– V  
)
DCIN Voltage Ramping Down  
60  
5
DCIN  
CLN  
INFET “On” Clamping Voltage (V  
INFET “Off” Clamping Voltage (V  
– V  
– V  
)
I
I
= 1µA  
6.5  
DCIN  
DCIN  
INFET  
INFET  
INFET  
)
= 25µA  
0.25  
V
INFET  
Thermistor  
NTCVR  
Reference Voltage During Sample Time  
High Threshold  
4.5  
V
V
V
NTC  
V
NTC  
V
NTC  
Rising  
Falling  
10V  
NTCVR NTCVR NTCVR  
• 0.48 • 0.5 • 0.52  
Low Threshold  
NTCVR NTCVR NTCVR  
• 0.115 • 0.125 • 0.135  
V
Thermistor Disable Current  
10  
µA  
Indicator Outputs (ACP, CHG, FLAG, LOBAT, I , FAULT  
CL  
C10TOL  
LBTOL  
FLAG (C/10) Accuracy  
Voltage Falling at PROG  
0.375  
0.397  
0.420  
V
LOBAT Threshold Accuracy  
3C4C = 0V, CHEM = 0V  
7.10  
7.27  
9.46  
9.70  
7.32  
7.50  
9.76  
10  
7.52  
7.71  
10.10  
V
V
V
V
3C4C = 0V, CHEM = Open  
3C4C = Open, CHEM = 0V  
3C4C = Open, CHEM = Open  
10.28  
RESTART Threshold Accuracy  
3C4C = 0V, CHEM = 0V  
11.13  
11.40  
14.84  
15.20  
11.42  
11.70  
15.23  
15.60  
11.65  
11.94  
15.54  
15.92  
V
V
V
V
3C4C = 0V, CHEM = Open  
3C4C = Open, CHEM = 0V  
3C4C = Open, CHEM = Open  
I
Threshold Accuracy  
83  
93  
1O5  
mV  
CL  
4007i  
3
LTC4007  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating  
temperature range (Note 4), otherwise specifications are at TA = 25°C. VDCIN = 20V, VBAT = 12V unless otherwise noted.  
SYMBOL PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
Low Logic Level of ACP, CHG, FLAG, LOBAT,  
, FAULT  
I
= 100µA  
0.5  
V
OL  
OL  
I
CL  
V
High Logic Level of CHG, LOBAT, I  
I
= –1µA  
2.7  
–1  
V
µA  
µA  
V
OH  
OFF  
PO  
CL  
OH  
I
I
Off State Leakage Current of ACP, FLAG, FAULT  
V
= 3V  
1
OH  
Pull-Up Current on CHG, LOBAT, I  
Timer Defeat Threshold at CHG  
V = 0V  
–10  
CL  
1
1
Programming Inputs (CHEM and 3C4C)  
V
IH  
V
IL  
High Logic Level  
Low Logic Level  
Pull-Up Current  
3.3  
345  
V
V
I
V = 0V  
14  
µA  
PI  
Oscillator  
f
f
Regulator Switching Frequency  
255  
20  
300  
25  
kHz  
kHz  
%
OSC  
MIN  
Regulator Switching Frequency in Drop Out  
Regulator Maximum Duty Cycle  
Duty Cycle 98%  
DC  
V
= V  
BAT  
98  
99  
MAX  
CSP  
Gate Drivers (TGATE, BGATE)  
V
TGATE  
V
BGATE  
V
TGATE  
V
BGATE  
High (V  
High  
– V  
)
I
= –1mA  
= 3000pF  
= 3000pF  
= 1mA  
50  
10  
10  
50  
mV  
V
CLN  
TGATE  
TGATE  
C
C
4.5  
4.5  
5.6  
5.6  
LOAD  
Low (V  
Low  
– V  
)
V
CLN  
TGATE  
LOAD  
I
mV  
BGATE  
TGATE Transition Time  
TGATE Rise Time  
TGATE Fall Time  
TGTR  
TGTF  
C
LOAD  
C
LOAD  
= 3000pF, 10% to 90%  
= 3000pF, 10% to 90%  
50  
50  
110  
100  
ns  
ns  
BGATE Transition Time  
BGATE Rise Time  
BGATE Fall Time  
BGTR  
BGTF  
C
LOAD  
C
LOAD  
= 3000pF, 10% to 90%  
= 3000pF, 10% to 90%  
40  
40  
90  
80  
ns  
ns  
V
TGATE  
V
BGATE  
at Shutdown (V  
at Shutdown  
– V  
)
I
I
= –1µA, DCIN = 0V, CLN = 12V  
= 1µA, DCIN = 0V, CLN = 12V  
100  
100  
mV  
mV  
CLN  
TGATE  
TGATE  
BGATE  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
of a device may be impaired.  
Note 2: See Test Circuit.  
Note 3: Does not include tolerance of current sense resistor or current  
Note 4: The LTC4007E is guaranteed to meet performance specifications  
from 0°C to 70°C. Specifications over the –40°C to 85°C operating  
temperature range are assured by design, characterization and correlation  
with statistical process controls.  
programming resistor.  
4007i  
4
LTC4007  
U
U
U
PI FU CTIO S  
DCIN (Pin 1): External DC Power Source Input. Bypass  
thispinwithatleast0.01µF. SeeApplicationsInformation.  
NTC (Pin 9): A thermistor network is connected from NTC  
to GND. This pin determines if the battery temperature is  
safe for charging. The charger and timer are suspended  
and the FAULT pin is driven low if the thermistor indicates  
a temperature that is unsafe for charging. The thermistor  
functionmaybedisabledwitha300kto500kresistorfrom  
DCIN to NTC.  
CHG (Pin 2): Charge Status Output. When the battery is  
being charged, the CHG pin is pulled low by an internal  
N-channel MOSFET. Internal 10µA pull-up to 3.5V. If  
V
LOGIC is greater than 3.3V, add an external pull-up. The  
timerfunctioncanbedefeatedbyforcingthispinbelow1V  
(or connecting it to GND).  
ITH (Pin 10): Control Signal of the Inner Loop of the  
Current Mode PWM. Higher ITH voltage corresponds to  
higherchargingcurrentinnormaloperation. A6kresistor,  
in series with a capacitor of at least 0.1µF to GND provides  
loop compensation. Typical full-scale output current is  
40µA. Nominal voltage range for this pin is 0V to 3V.  
ACP(Pin 3): Open-Drain output to indicate if the AC  
adapter voltage is adequate for charging. This pin is pulled  
low by an internal N-channel MOSFET if DCIN is below  
BAT. A pull-up resistor is required. The pin is capable of  
sinking at least 100µA.  
PROG (Pin 11): Current Programming/Monitoring Input/  
Output. An external resistor to GND programs the peak  
charging current in conjunction with the current sensing  
resistor. The voltage at this pin provides a linear indication  
of charging current. Peak current is equivalent to 1.19V.  
Zero current is approximately 0.3V. A capacitor from  
PROG to ground is required to filter higher frequency  
components. The maximum resistance to ground is 100k.  
Values higher than 100k can cause the charger to shut  
down.  
RT (Pin 4): Timer Resistor. The timer period is set by  
placing a resistor, RRT , to GND. This resistor is always  
required.  
The timer period is tTIMER = (1hour • RRT/154K).  
FAULT (Pin 5): Active low open-drain output that indi-  
cates charger operation has stopped due to a low-battery  
conditioningerror, orthatchargeroperationissuspended  
due to the thermistor exceeding allowed values. A pull-up  
resistor is required if this function is used. The pin is  
capable of sinking at least 100µA.  
NC (Pin 12): No Connect.  
GND (Pin 6): Ground for Low Power Circuitry.  
ICL (Pin 13): Input Current Limit Indicator. Active low  
digital output. Internal 10µA pull-up to 3.5V. Pulled low if  
the charger current is being reduced by the input current  
limiting function. The pin is capable of sinking at least  
100µA. If VLOGIC is greater than 3.3V, add an external  
pull-up.  
3C4C (Pin 7): Select 3-cell or 4-cell float voltage by  
connecting this pin to GND or open, respectively. Internal  
14µA pull-up to 5.3V. This pin can also be driven with  
open-collector/drain logic levels. High: 4 cell. Low: 3 cell.  
LOBAT (Pin 8): Low-Battery Indicator. Active low digital  
output. Internal 10µA pull-up to 3.5V. If the battery  
voltage is below 2.5V/cell (or 2.44V/cell for 4.1V chemis-  
try batteries) LOBAT will be low. The pin is capable of  
sinking at least 100µA. If VLOGIC is greater than 3.3V, add  
an external pull-up.  
CSP (Pin 14): Current Amplifier CA1 Input. The CSP and  
BAT pins measure the voltage across the sense resistor,  
RSENSE, to provide the instantaneous current signals re-  
quired for both peak and average current mode operation.  
4007i  
5
LTC4007  
U
U
U
PI FU CTIO S  
BAT (Pin 15): Battery Sense Input and the Negative  
Reference for the Current Sense Resistor. A precision  
internal resistor divider sets the final float potential on this  
pin.Theresistordividerisdisconnectedduringshutdown.  
CLN (Pin 19): Negative Reference for the Input Current  
Limit Amplifier, CL1. This pin also serves as the power  
supply for the IC. A 10µF to 22µF bypass capacitor should  
be connected as close as possible to this pin.  
CHEM (Pin 16):Select 4.1V or 4.2V cell chemistry by  
connecting the pin to GND or open, respectively. Internal  
14µA pull-up to 5.3V. Can also be driven with open-  
collector/drain logic levels.  
TGATE(Pin20):DrivesthetopexternalP-channelMOSFET  
of the battery charger buck converter.  
PGND (Pin 21):HighCurrentGroundReturnfortheBGATE  
Driver.  
FLAG (Pin 17): Active low open-drain output that indi-  
cates when charging current has declined to 10% of  
maximum programmed current. A pull-up resistor is  
required if this function is used. The pin is capable of  
sinking at least 100µA.  
BGATE (Pin 22): Drives the bottom external N-channel  
MOSFET of the battery charger buck converter.  
INFET(Pin23):DrivestheGateoftheExternalInputPFET.  
SHDN (Pin 24):Charger is shut down and timer is reset  
when this pin is HIGH. Internal 10µA pull-up to 3.5V. This  
pin can also be used to reset the charger by applying a  
positive pulse that is a minimum of 0.1µs long.  
CLP (Pin 18): Positive input to the supply current limiting  
amplifier, CL1. The threshold is set at 100mV above the  
voltage at the CLN pin. When used to limit supply current,  
a filter is needed to filter out the switching noise. If no  
current limit function is desired, connect this pin to CLN.  
4007i  
6
LTC4007  
W
BLOCK DIAGRA  
0.1µF  
V
IN  
DCIN  
1
5.8V  
INFET  
Q3  
23  
3
CLN  
2
4
CHG  
ACP  
R
RT  
R
T
OSCILLATOR  
TIMER/CONTROLLER  
SHDN 24  
FAULT  
5
32.4k  
TBAD  
NTC  
RESTART  
THERMISTOR  
9
10k  
NTC  
0.47µF  
397mV  
C/10  
FLAG 17  
+
35mV  
GND  
6
+
11.67µA  
3C4C  
7
MUX  
3k  
3k  
BAT  
CSP  
CHEM 16  
15  
14  
+
+
R
SENSE  
20µF  
+
CA1  
LOBAT  
8
1.105V  
708mV  
1.19V  
+
g
= 1m  
m
EA  
5k  
CLP  
CLN  
g
= 1.4m  
18  
+
m
9k  
R
CL  
15nF  
CL1  
100mV  
+
g
m
= 1m  
19  
13  
CA2  
I
CL  
1.19V  
DCIN  
ITH  
OSCILLATOR  
WATCHDOG  
DETECT  
10  
6K  
20µF  
t
OFF  
+
0.12µF  
BUFFERED ITH  
÷5  
OV  
1.28V  
CLN  
TGATE  
S
+
+
20  
Q1  
Q2  
Q
I
R
CMP  
BGATE  
PGND  
CHARGE  
PWM  
LOGIC  
22  
21  
+
I
REV  
17mV  
PROG  
11  
0.0047µF  
L1  
R
PROG  
26.7k  
4007 BD  
4007i  
7
LTC4007  
TEST CIRCUIT  
LTC4007  
CHEM  
3C4C  
V
16  
7
+
REF  
DIVIDER/  
MUX  
EA  
BAT  
ITH  
10  
15  
+
LT1055  
0.6V  
4007 TC  
U
OPERATIO  
C/10 comparator will indicate this condition by latching  
the FLAG pin low. The charge timer is also reset to 1/4 of  
thetotalchargetimewhenFLAGgoeslow.Ifthiscondition  
is caused by an input current limit condition, described  
below, then the FLAG indicator will be inhibited. When a  
time-out occurs, charging is terminated immediately and  
the CHG pin is forced to a high impedance state. The  
charger will automatically restart if the cell voltage is  
below3.9V(or3.81VifCHEMislow).Torestartthecharge  
cycle manually, simply remove the input voltage and  
reapply it, or set the SHDN pin high momentarily. When  
the input voltage is not present, the charger goes into a  
sleep mode, dropping battery current drain to 15µA. This  
greatly reduces the current drain on the battery and  
increases the standby time. The charger is inhibited any  
time the SHDN pin is high.  
Overview  
The LTC4007 is a synchronous current mode PWM step-  
down (buck) switcher battery charger controller. The  
charge current is programmed by the combination of a  
program resistor (RPROG) from the PROG pin to ground  
and a sense resistor (RSENSE) between the CSP and BAT  
pins. The final float voltage is programmed to one of four  
values (12.3V, 12.6V, 16.4V, 16.8V) with ±1% maximum  
accuracy using pins 3C4C and CHEM. Charging begins  
when the potential at the DCIN pin rises above the voltage  
atBAT(andtheUVLOvoltage)andtheSHDNpinislow;the  
CHG pin is set low. At the beginning of the charge cycle, if  
the cell voltage is below 2.5V (2.44V if CHEM is low), the  
LOBAT pin will be low. The LOBAT indicator can be used  
to reduce the charging current to a low value, typically  
10% of full scale. If the cell voltage stays below 2.5V for  
25% of the total charge time, the charge sequence will be  
terminated immediately and the FAULT pin will be set low.  
Input FET  
The input FET circuit performs two functions. It enables  
the charger if the input voltage is higher than the CLN pin  
and provides the logic indicator of AC present on the ACP  
pin. It controls the gate of the input FET to keep a low  
forward voltage drop when charging and also prevents  
reverse current flow through the input FET.  
An external thermistor network is sampled at regular  
intervals. If the thermistor value exceeds design limits,  
charging is suspended and the FAULT pin is set low. If the  
thermistor value returns to an acceptable value, charging  
resumesandtheFAULTpinissethigh.Anexternalresistor  
on the RT pin sets the total charge time. The timer can be  
defeated by forcing the CHG pin to a low voltage.  
If the input voltage is less than VCLN, it must go at least  
170mVhigherthanVCLN toactivatethecharger.Whenthis  
occurs the ACP pin is released and pulled up with an  
external load to indicate that the adapter is present. The  
As the battery approaches the final float voltage, the  
charge current will begin to decrease. When the current  
drops to 10% of the full-scale charge current, an internal  
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OPERATIO  
Table 1. Truth Table For Indicator States  
TIMER  
STATE  
MODE  
DCIN  
<BAT  
>BAT  
>BAT  
>BAT  
>BAT  
SHDN  
LOW  
LOW  
LOW  
LOW  
LOW  
ACP**  
LOW  
LOBAT FLAG** FAULT**  
I
CHG**  
HIGH  
LOW  
LOW  
LOW  
LOW  
CL  
Shut down by low adapter voltage  
Charging a low bat  
LOW  
LOW  
HIGH  
HIGH  
X
HIGH  
HIGH* HIGH*  
HIGH HIGH*  
HIGH* HIGH*  
HIGH  
LOW  
HIGH*  
HIGH*  
LOW  
Reset  
HIGH  
HIGH  
HIGH  
HIGH  
Running  
Running  
Running  
Paused  
Normal charging  
Input current limited charging  
Charger paused due to thermistor out of range  
X
LOW  
(from  
NTC)  
HIGH  
Shut down by SHDN pin  
X
HIGH  
LOW  
X
X
HIGH  
HIGH  
LOW  
LOW  
LOW  
Reset  
>T/4  
HIGH  
Terminated by low-battery fault (Note 1)  
>BAT  
HIGH  
LOW  
HIGH*  
HIGH  
(Faulted)  
Timer is reset when FLAG goes low, then  
terminates after 1/4 T  
>BAT  
LOW  
HIGH  
HIGH  
HIGH  
HIGH  
LOW  
HIGH  
HIGH  
LOW  
>T/4  
after  
FLAG =  
HIGH  
(Waiting  
for Restart)  
LOW  
Terminated by expired timer  
>BAT  
X
LOW  
HIGH  
LOW  
>T  
HIGH  
(Waiting  
for Restart  
Timer defeated  
X
X
X
X
X
X
X
Forced LOW  
HIGH*  
Shut down by undervoltage lockout  
>BAT  
LOW  
HIGH  
HIGH  
HIGH  
HIGH*  
LOW  
Reset  
+ <UVL  
*Most probable condition X = Don’t care, ** Open-drain output HIGH = OPEN with pull-up  
Note 1: If a depleted battery is inserted while the charger is in this state, the  
charger must be reset to initiate charging.  
gateoftheinputFETisdriventoavoltagesufficienttokeep  
a low forward voltage drop from drain to source. If the  
voltage between DCIN and CLN drops to less than 25mV,  
the input FET is turned off slowly. If the voltage between  
DCIN and CLN is ever less than 25mV, then the input FET  
is turned off in less than 10µs to prevent significant  
reverse current from flowing in the input FET. In this  
condition, the ACP pin is driven low and the charger is  
disabled.  
IREV or the beginning of the next cycle. The oscillator uses  
the equation:  
VDCIN – VBAT  
VDCIN • fOSC  
tOFF  
=
to set the bottom MOSFET on time. The result is a nearly  
constant switching frequency over a wide input/output  
voltage range. This activity is diagrammed in Figure 1.  
OFF  
TGATE  
ON  
Battery Charger Controller  
The LTC4007 charger controller uses a constant off-time,  
current mode step-down architecture. During normal op-  
eration, the top MOSFET is turned on each cycle when the  
oscillator sets the SR latch and turned off when the main  
currentcomparatorICMP resetstheSRlatch. Whilethetop  
MOSFET is off, the bottom MOSFET is turned on until  
either the inductor current trips the current comparator  
ON  
t
BGATE  
OFF  
OFF  
TRIP POINT SET BY ITH VOLTAGE  
INDUCTOR  
CURRENT  
4006 F01  
Figure 1  
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9
LTC4007  
U
OPERATIO  
The peak inductor current, at which ICMP resets the SR  
latch, is controlled by the voltage on ITH. ITH is in turn  
controlled by several loops, depending upon the situation  
at hand. The average current control loop converts the  
voltage between CSP and BAT to a representative current.  
Error amp CA2 compares this current against the desired  
current programmed by RPROG at the PROG pin and  
adjusts ITH until:  
voltage,therebyreducingchargingcurrent.TheICL indica-  
tor output will go low when this condition is detected and  
the FLAG indicator will be inhibited if it is not already LOW.  
If the charging current decreases below 10% to 15% of  
programmed current while engaged in input current lim-  
iting, BGATEwillbeforcedlowtopreventthechargerfrom  
discharging the battery. Audible noise can occur in this  
mode of operation.  
VREF  
RPROG  
VCSP VBAT +11.67µA 3kΩ  
3kΩ  
An overvoltage comparator guards against voltage tran-  
sient overshoots (>7% of programmed value). In this  
case, both MOSFETs are turned off until the overvoltage  
condition is cleared. This feature is useful for batteries  
which “load dump” themselves by opening their protec-  
tion switch to perform functions such as calibration or  
pulse mode charging.  
=
therefore,  
VREF  
RPROG  
3kΩ  
RSENSE  
ICHARGE(MAX)  
=
– 11.67µA •  
The voltage at BAT is divided down by an internal resistor  
divider and is used by error amp EA to decrease ITH if the  
divider voltage is above the 1.19V reference. When the  
charging current begins to decrease, the voltage at PROG  
will decrease in direct proportion. The voltage at PROG is  
then given by:  
PWM Watchdog Timer  
There is a watchdog timer that observes the activity on the  
BGATE and TGATE pins. If TGATE stops switching for  
more than 40µs, the watchdog activates and turns off the  
top MOSFET for about 400ns. The watchdog engages to  
prevent very low frequency operation in dropout—a po-  
tential source of audible noise when using ceramic input  
and output capacitors.  
RPROG  
3kΩ  
VPROG = ICHARGE RSENSE +11.67µA 3k•  
(
)
VPROG is plotted in Figure 2.  
The amplifier CL1 monitors and limits the input current,  
normally from the AC adapter to a preset level (100mV/  
RCL). At input current limit, CL1 will decrease the ITH  
Charger Start-Up  
When the charger is enabled, it will not begin switching  
until the ITH voltage exceeds a threshold that assures  
initial current will be positive. This threshold is 5% to 15%  
of the maximum programmed current. After the charger  
beginsswitching,thevariousloopswillcontrolthecurrent  
at a level that is higher or lower than the initial current. The  
duration of this transient condition depends upon the loop  
compensation, but is typically less than 100µs.  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1.19V  
Thermistor Detection  
0.309V  
The thermistor detection circuit is shown in Figure 3. It  
requires an external resistor and capacitor in order to  
function properly.  
60  
80  
0
20  
40  
100  
I
(% OF MAXIMUM CURRENT)  
CHARGE  
4007 F02  
Thethermistordetectorperformsasample-and-holdfunc-  
tion. An internal clock, whose frequency is determined by  
Figure 2. VPROG vs ICHARGE  
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U
OPERATIO  
the timing resistor connected to RT, keeps switch S1  
closed to sample the thermistor:  
tHOLD = 10 • RRT • 17.5pF = 64µs,  
for RRT = 309k  
tSAMPLE = 127.5 • 20 • RRT • 17.5pF = 16.2ms,  
When the tHOLD interval ends the result of the thermistor  
testing is stored in the D flip-flop (DFF). If the voltage at  
NTC is within the limits provided by the resistor divider  
feeding the comparators, then the NOR gate output will be  
low and the DFF will set TBAD to zero and charging will  
continue. If the voltage at NTC is outside of the resistor  
dividerlimits, thentheDFFwillsetTBAD toone, thecharger  
will be shut down, FAULT pin is set low and the timer will  
be suspended until TBAD returns to zero (see Figure 4).  
for RRT = 309k  
The external RC network is driven to approximately 4.5V  
and settles to a final value across the thermistor of:  
4.5V RTH  
VRTH(FINAL)  
=
R
TH + R9  
This voltage is stored by C7. Then the switch is opened for  
a short period of time to read the voltage across the  
thermistor.  
LTC4007  
CLK  
R9  
32.4k  
NTC  
6
R
S1  
TH  
C7  
0.47µF  
+
~4.5V  
10k  
NTC  
60k  
+
45k  
15k  
+
TBAD  
D
C
Q
4007 F03  
Figure 3  
CLK  
(NOT TO  
SCALE)  
t
SAMPLE  
t
HOLD  
VOLTAGE ACROSS THERMISTOR  
COMPARATOR HIGH LIMIT  
COMPARATOR LOW LIMIT  
V
NTC  
4007 F04  
Figure 4  
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APPLICATIO S I FOR ATIO  
Battery Detection  
LTC4007  
PROG  
11  
It is generally not good practice to connect a battery while  
the charger is running. The timer is in an unknown state  
and the charger could provide a large surge current into  
the battery for a brief time. The Figure 5 circuit keeps the  
chargershutdownandthetimerresetwhileabatteryisnot  
connected.  
R
Z
C
PROG  
R
PROG  
102k  
5V  
0V  
Q1  
2N7002  
4007 F06  
LTC4007  
ADAPTER  
Figure 6. PWM Current Programming  
1
DCIN  
POWER  
increased to reduce the ripple caused by the RPROG  
switching. The compensation capacitor at ITH will prob-  
ably need to be increased also to improve stability and  
prevent large overshoot currents during start-up condi-  
tions. Charging current will be proportional to the duty  
cycleoftheswitchwithfullcurrentat100%dutycycleand  
zero current when Q1 is off.  
24 SHDN  
SWITCH CLOSED  
WHEN BATTERY  
CONNECTED  
4007 F05  
Figure 5  
Charger Current Programming  
The basic formula for charging current is:  
Maintaining C/10 Accuracy  
The C/10 comparator threshold that drives the FLAG pin  
has a fixed threshold of approximately VPROG = 400mV.  
This threshold works well when RPROG is 26.7k, but will  
not yield a 10% charging current indication if RPROG is a  
different value. There are situations where a standard  
valueofRSENSE willnotallowthedesiredvalueofcharging  
current when using the preferred RPROG value. In these  
cases, wherethefull-scalevoltageacrossRSENSE iswithin  
±20mV of the 100mV full-scale target, the input resistors  
connected to CSP and BAT can be adjusted to provide the  
desired maximum programming current as well as the  
correct FLAG trip point.  
VREF 3k/RPROG – 0.035V  
ICHARGE(MAX)  
=
RSENSE  
VREF = 1.19V  
This leaves two degrees of freedom: RSENSE and RPROG  
.
The 3k input resistors must not be altered since internal  
currents and voltages are trimmed for this value. Pick  
RSENSE by setting the average voltage between CSP and  
BAT to be close to 100mV during maximum charger  
current. Then RPROG can be determined by solving the  
above equation for RPROG  
.
VREF 3kΩ  
RSENSE ICHARGE(MAX) + 0.035V  
For example, the desired max charging current is 2.5A but  
the best RSENSE value is 0.033. In this case, the voltage  
across RSENSE at maximum charging current is only  
82.5mV, normally RPROG would be 30.1k but the nominal  
FLAG trip point is only 5% of maximum charging current.  
If the input resistors are reduced by the same amount as  
the full-scale voltage is reduced then, R4 = R5 = 2.49k and  
RPROG  
=
Table 2. Recommended RSNS and RPROG Resistor Values  
(A) () 1% (W) (k) 1%  
I
R
R
SENSE  
R
PROG  
MAX  
SENSE  
1.0  
0.100  
0.25  
0.25  
0.5  
26.7  
2.0  
3.0  
4.0  
0.050  
0.033  
0.025  
26.7  
26.7  
26.7  
R
PROG =26.7k, themaximumchargingcurrentisstill2.5A  
0.5  
but the FLAG trip point is maintained at 10% of full scale.  
There are other effects to consider. The voltage across the  
current comparator is scaled to obtain the same values as  
the 100mV sense voltage target, but the input referred  
Charging current can be programmed by pulse width  
modulating RPROG with a switch Q1 to RPROG at a fre-  
quency higher than a few kHz (Figure 6). CPROG must be  
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APPLICATIO S I FOR ATIO  
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200  
sense voltage is reduced, causing some careful consider-  
ation of the ripple current. Input referred maximum com-  
paratorthresholdis117mV,whichisthesameratioof1.4x  
the DC target. Input referred IREV threshold is scaled back  
to –24mV. The current at which the switcher starts will be  
reduced as well so there is some risk of boost activity.  
Theseconcernscanbeaddressedbyusingaslightlylarger  
inductor to compensate for the reduction of tolerance to  
ripple current.  
180  
160  
140  
120  
100  
80  
60  
40  
20  
0
100  
300  
400 450  
500  
150 200 250  
350  
Charger Voltage Programming  
R
(k)  
RT  
4007 F07  
PinsCHEMandC3C4areusedtoprogramthechargerfinal  
output voltage. The CHEM pin programs Li-Ion battery  
chemistry for 4.1V/cell (low) or 4.2V/cell (high). The C3C4  
pin selects either 3 series cells (low) or 4 series cells  
(high). It is recommended that these pins be shorted to  
ground (logic low) or left open (logic high) to effect the  
desired logic level. Use open-collector or open-drain out-  
puts when interfacing to the CHEM and 3C4C pins from a  
logic control circuit.  
Figure 7. tTIMER vs RRT  
current starts ramping up when ITH voltage reaches 0.8V  
and full current is achieved with ITH at 2V. With a 0.12µF  
capacitor, time to reach full charge current is about 2ms  
and it is assumed that input voltage to the charger will  
reach full value in less than 2ms. The capacitor can be  
increased up to 1µF if longer input start-up times are  
needed.  
Table 3. Charger Voltage Programming  
V
(V)  
3C4C  
LOW  
LOW  
HIGH  
HIGH  
CHEM  
LOW  
HIGH  
LOW  
HIGH  
FINAL  
Input and Output Capacitors  
12.3  
12.6  
16.4  
16.8  
The input capacitor (C2) is assumed to absorb all input  
switching ripple current in the converter, so it must have  
adequate ripple current rating. Worst-case RMS ripple  
currentwillbeequaltoonehalfofoutputchargingcurrent.  
Actual capacitance value is not critical. Solid tantalum low  
ESR capacitors have high ripple current rating in a rela-  
tively small surface mount package, but caution must be  
used when tantalum capacitors are used for input or  
output bypass. High input surge currents can be created  
when the adapter is hot-plugged to the charger or when a  
batteryisconnectedtothecharger. Solidtantalumcapaci-  
tors have a known failure mechanism when subjected to  
very high turn-on surge currents. Only Kemet T495 series  
of “Surge Robust” low ESR tantalums are rated for high  
surge conditions such as battery to ground.  
Setting the Timer Resistor  
The charger termination timer is designed for a range of  
1hour to 3 hour with a ±15% uncertainty. The timer is  
programmed by the resistor RRT using the following  
equation:  
tTIMER = 227 • RRT • 175pF  
It is important to keep the parasitic capacitance on the RT  
pin to a minimum. The trace connecting RT to RRT should  
be as short as possible.  
Soft-Start  
The relatively high ESR of an aluminum electrolytic for C1,  
The LTC4007 is soft started by the 0.12µF capacitor on the located at the AC adapter input terminal, is helpful in  
ITH pin. On start-up, ITH pin voltage will rise quickly to reducing ringing during the hot-plug event. Refer to AN88  
0.5V, then ramp up at a rate set by the internal 40µA pull- for more information.  
up current and the external capacitor. Battery charging  
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13  
LTC4007  
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APPLICATIO S I FOR ATIO  
Highest possible voltage rating on the capacitor will mini-  
mizeproblems. Consultwiththemanufacturerbeforeuse.  
Alternatives include new high capacity ceramic (at least  
20µF) from Tokin, United Chemi-Con/Marcon, et al. Other  
alternative capacitors include OS-CON capacitors from  
Sanyo.  
IL exceed 0.6(IMAX) due to limits imposed by IREV and  
CA1. Remember the maximum IL occurs at the maxi-  
mum input voltage. In practice 10µH is the lowest value  
recommended for use.  
Lower charger currents generally call for larger inductor  
values. Use Table 4 as a guide for selecting the correct  
inductor value for your application.  
The output capacitor (C3) is also assumed to absorb  
output switching current ripple. The general formula for  
capacitor current is:  
Table 4  
MAX AVERAGE  
CURRENT (A)  
MINIMUM INDUCTOR  
INPUT VOLTAGE (V)  
VALUE (µH)  
VBAT  
VDCIN  
0.29 V  
1–  
1
1
2
2
3
3
4
4
20  
>20  
20  
>20  
20  
>20  
20  
>20  
40 ±20%  
56 ±20%  
20 ±20%  
30 ±20%  
15 ±20%  
20 ±20%  
10 ±20%  
15 ±20%  
(
)
BAT  
IRMS  
=
L1 f  
( )( )  
For example:  
VDCIN = 19V, VBAT = 12.6V, L1 = 10µH, and  
f = 300kHz, IRMS = 0.41A.  
EMI considerations usually make it desirable to minimize  
ripple current in the battery leads, and beads or inductors  
maybeaddedtoincreasebatteryimpedanceatthe300kHz  
switching frequency. Switching ripple current splits be-  
tween the battery and the output capacitor depending on  
the ESR of the output capacitor and the battery imped-  
ance. If the ESR of C3 is 0.2and the battery impedance  
is raised to 4with a bead or inductor, only 5% of the  
current ripple will flow in the battery.  
Charger Switching Power MOSFET  
and Diode Selection  
Two external power MOSFETs must be selected for use  
with the charger: a P-channel MOSFET for the top (main)  
switch and an N-channel MOSFET for the bottom (syn-  
chronous) switch.  
The peak-to-peak gate drive levels are set internally. This  
voltageistypically6V.Consequently,logic-levelthreshold  
MOSFETs must be used. Pay close attention to the BVDSS  
specification for the MOSFETs as well; many of the logic  
level MOSFETs are limited to 30V or less.  
Inductor Selection  
Higher operating frequencies allow the use of smaller  
inductor and capacitor values. A higher frequency gener-  
ally results in lower efficiency because of MOSFET gate  
charge losses. In addition, the effect of inductor value on  
ripple current and low current operation must also be  
considered. The inductor ripple current IL decreases  
with higher frequency and increases with higher VIN.  
SelectioncriteriaforthepowerMOSFETsincludetheON”  
resistance RDS(ON), total gate capacitance QG, reverse  
transfer capacitance CRSS, input voltage and maximum  
output current. The charger is operating in continuous  
mode at moderate to high currents so the duty cycles for  
the top and bottom MOSFETs are given by:  
1
VOUT  
V
IN  
IL =  
VOUT 1–  
f L  
( )( )  
Main Switch Duty Cycle = VOUT/VIN  
Accepting larger values of IL allows the use of low  
inductances, but results in higher output voltage ripple  
and greater core losses. A reasonable starting point for  
setting ripple current is IL = 0.4(IMAX). In no case should  
Synchronous Switch Duty Cycle = (VIN – VOUT)/VIN.  
4007i  
14  
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APPLICATIO S I FOR ATIO  
U
The MOSFET power dissipations at maximum output  
Calculating IC Power Dissipation  
current are given by:  
The power dissipation of the LTC4007 is dependent upon  
the gate charge of the top and bottom MOSFETs (QG1 &  
QG2 respectively) The gate charge is determined from the  
manufacturer’sdatasheetandisdependentuponboththe  
gate voltage swing and the drain voltage swing of the  
MOSFET. Use 6V for the gate voltage swing and VDCIN for  
the drain voltage swing.  
PMAIN = VOUT/VIN(IMAX)2(1 + δ∆T)RDS(ON)  
+ k(VIN)2(IMAX)(CRSS)(fOSC  
)
PSYNC = (VIN – VOUT)/VIN(IMAX)2(1 + δ∆T)RDS(ON)  
Where δ∆T is the temperature dependency of RDS(ON) and  
k is a constant inversely related to the gate drive current.  
Both MOSFETs have I2R losses while the PMAIN equation  
includesanadditionaltermfortransitionlosses,whichare  
highest at high input voltages. For VIN < 20V the high  
currentefficiencygenerallyimproveswithlargerMOSFETs,  
while for VIN > 20V the transition losses rapidly increase  
to the point that the use of a higher RDS(ON) device with  
lower CRSS actually provides higher efficiency. The syn-  
chronous MOSFET losses are greatest at high input volt-  
age or during a short circuit when the duty cycle in this  
switch in nearly 100%. The term (1 + δ∆T) is generally  
given for a MOSFET in the form of a normalized RDS(ON) vs  
temperature curve, but δ = 0.005/°C can be used as an  
approximationforlowvoltageMOSFETs.CRSS =QGD/VDS  
is usually specified in the MOSFET characteristics. The  
constant k = 2 can be used to estimate the contributions of  
the two terms in the main switch dissipation equation.  
PD = VDCIN • (fOSC (QG1 + QG2) + IQ)  
Example:  
V
DCIN = 19V, fOSC = 345kHz, QG1 = QG2 = 15nC.  
PD = 235mW  
Adapter Limiting  
An important feature of the LTC4007 is the ability to  
automatically adjust charging current to a level which  
avoids overloading the wall adapter. This allows the prod-  
uct to operate at the same time that batteries are being  
charged without complex load management algorithms.  
Additionally, batteries will automatically be charged at the  
maximum possible rate of which the adapter is capable.  
This feature is created by sensing total adapter output  
current and adjusting charging current downward if a  
preset adapter current limit is exceeded. True analog  
control is used, with closed-loop feedback ensuring that  
adapter load current remains within limits. Amplifier CL1  
in Figure 8 senses the voltage across RCL, connected  
If the charger is to operate in low dropout mode or with a  
high duty cycle greater than 85%, then the topside  
P-channel efficiency generally improves with a larger  
MOSFET.UsingasymmetricalMOSFETsmayachievecost  
savings or efficiency gains.  
The Schottky diode D1, shown in the Typical Application  
on the back page, conducts during the dead-time between  
the conduction of the two power MOSFETs. This prevents  
thebodydiodeofthebottomMOSFETfromturningonand  
storing charge during the dead-time, which could cost as  
much as 1% in efficiency. A 1A Schottky is generally a  
good size for 4A regulators due to the relatively small  
average current. Larger diodes can result in additional  
transition losses due to their larger junction capacitance.  
LTC4007  
100mV  
CLP  
+
18  
15nF  
5k  
CL1  
+
AC ADAPTER  
INPUT  
R
*
CL  
CLN  
V
IN  
19  
+
C
IN  
100mV  
ADAPTER CURRENT LIMIT  
*R  
CL  
=
4007 F08  
The diode may be omitted if the efficiency loss can be  
tolerated.  
Figure 8. Adapter Current Limiting  
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betweentheCLPandCLNpins. Whenthisvoltageexceeds  
100mV, the amplifier will override programmed charging  
current to limit adapter current to 100mV/RCL. A lowpass  
filter formed by 5kand 15nF is required to eliminate  
switchingnoise.Ifthecurrentlimitisnotused,CLPshould  
be connected to DCIN.  
network; the thermistor must have a HIGH/LOW resis-  
tance ratio of 1:7. If this happy circumstance is true for  
you, then simply set R9 = RTH(LOW)  
If you are using a thermistor that doesn’t have a 1:7 HIGH/  
LOW ratio, or you wish to set the HIGH/LOW limits to  
different temperatures, then the more generic network in  
Figure 10 should work.  
Note that the ICL pin will be asserted when the voltage  
across RCL is 93mV, before the adapter limit regulation  
threshold.  
LTC4007  
R9  
NTC  
9
Setting Input Current Limit  
C7  
R
TH  
To set the input current limit, you need to know the  
minimum wall adapter current rating. Subtract 5% for the  
input current limit tolerance and use that current to deter-  
mine the resistor value.  
4007 F09  
Figure 9. Voltage Divider Thermistor Network  
RCL = 100mV/ILIM  
ILIM = Adapter Min Current –  
(Adapter Min Current • 5%)  
LTC4007  
R9  
NTC  
9
C7  
R9A  
R
TH  
Table 5. Common RCL Resistor Values  
4007 F10  
ADAPTER  
RATING (A)  
R
VALUE*  
CL  
() 1%  
R
POWER  
R
POWER  
CL  
CL  
DISSIPATION (W)  
RATING (W)  
Figure 10. General Thermistor Network  
1.5  
1.8  
2
0.06  
0.05  
0.135  
0.25  
0.162  
0.25  
Once the thermistor, RTH, has been selected and the  
thermistor value is known at the temperature limits, then  
resistors R9 and R9A are given by:  
0.045  
0.039  
0.036  
0.033  
0.03  
0.18  
0.25  
2.3  
2.5  
2.7  
3
0.206  
0.25  
0.225  
0.5  
For NTC thermistors:  
0.241  
0.5  
0.27  
0.5  
R9 = 6 RTH(LOW) • RTH(HIGH)/(RTH(LOW) – RTH(HIGH)  
)
* Values shown above are rounded to nearest standard value.  
R9A=6RTH(LOW) RTH(HIGH)/(RTH(LOW) 7•RTH(HIGH)  
For PTC thermistors:  
)
As is often the case, the wall adapter will usually have at  
least a +10% current limit margin and many times one can  
simply set the adapter current limit value to the actual  
adapter rating (see Table 5).  
R9 = 6 RTH(LOW) • RTH(HIGH)/(RTH(HIGH) – RTH(LOW)  
)
R9A =6RTH(LOW)RTH(HIGH)/(RTH(HIGH)7• RTH(LOW)  
)
Designing the Thermistor Network  
Example #1: 10kNTC with custom limits  
There are several networks that will yield the desired  
function of voltage vs temperature needed for proper  
operation of the thermistor. The simplest of these is the  
voltage divider shown in Figure 9. Unfortunately, since the  
HIGH/LOW comparator thresholds are fixed internally,  
there is only one thermistor type that can be used in this  
TLOW = 0°C, THIGH = 50°C  
RTH = 10k at 25°C,  
RTH(LOW) = 32.582k at 0°C  
RTH(HIGH) = 3.635k at 50°C  
R9 = 24.55k 24.3k (nearest 1% value)  
R9A = 99.6k 100k (nearest 1% value)  
4007i  
16  
LTC4007  
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APPLICATIO S I FOR ATIO  
U
Example #2: 100kNTC  
charge depleted batteries using the circuit in Figure 11. If  
the battery voltage is less than 2.5V/cell (2.44V/cell if  
CHEM is low) then the LOBAT indicator will be low and Q4  
isoff.ThisprogramsthechargingcurrentwithRPROG =R6  
+ R14. Charging current is approximately 300mA. When  
the cell voltage becomes greater than 2.5V the LOBAT  
indicator goes high, Q4 shorts out R13, then RPROG = R6.  
Charging current is then equal to 3A.  
TLOW = 5°C, THIGH = 50°C  
RTH = 100k at 25°C,  
R
TH(LOW) = 272.05k at 5°C  
RTH(HIGH) = 33.195k at 50°C  
R9 = 226.9k 226k (nearest 1% value)  
R9A = 1.365M 1.37M (nearest 1% value)  
Example #3: 22kPTC  
PCB Layout Considerations  
TLOW = 0°C, THIGH = 50°C  
RTH = 22k at 25°C,  
RTH(LOW) = 6.53k at 0°C  
RTH(HIGH) = 61.4k at 50°C  
R9 = 43.9k 44.2k (nearest 1% value)  
R9A = 154k  
For maximum efficiency, the switch node rise and fall  
times should be minimized. To prevent magnetic and  
electricalfieldradiationandhighfrequencyresonantprob-  
lems,properlayoutofthecomponentsconnectedtotheIC  
is essential. (See Figure 12.) Here is a PCB layout priority  
list for proper layout. Layout the PCB using this specific  
order.  
Sizing the Thermistor Hold Capacitor  
During the hold interval, C7 must hold the voltage across  
the thermistor relatively constant to avoid false readings.  
A reasonable amount of ripple on NTC during the hold  
interval is about 10mV to 15mV. Therefore, the value of C7  
is given by:  
1. Inputcapacitorsneedtobeplacedascloseaspossible  
to switching FET’s supply and ground connections.  
Shortest copper trace connections possible. These  
parts must be on the same layer of copper. Vias must  
not be used to make this connection.  
C7 = tHOLD/(R9/7 • –ln(1 – 8 • 15mV/4.5V))  
= 10 • RRT • 17.5pF/(R9/7 • ln(1 – 8 • 15mV/4.5V)  
Example:  
2. ThecontrolICneedstobeclosetotheswitchingFET’s  
gate terminals. Keep the gate drive signals short for a  
clean FET drive. This includes IC supply pins that con-  
nect to the switching FET source pins. The IC can be  
placedontheoppositesideofthePCBrelativetoabove.  
R9 = 24.3k  
RRT = 309k (~2 hour timer)  
C7 = 0.51µF 0.56µF (nearest value)  
3. Place inductor input as close as possible to switching  
FET’s output connection. Minimize the surface area of  
this trace. Make the trace width the minimum amount  
needed to support current—no copper fills or pours.  
Avoid running the connection using multiple layers in  
parallel. Minimize capacitance from this node to any  
other trace or plane.  
Disabling the Thermistor Function  
If the thermistor is not needed, connecting a resistor  
between DCIN and NTC will disable it. The resistor should  
besizedtoprovideatleast10µAwiththeminimumvoltage  
applied to DCIN and 10V at NTC. Generally, a 301k resistor  
will work for DCIN less than 15V. A 499k resistor is  
recommended for DCIN greater than 15V.  
4. Place the output current sense resistor right next to  
the inductor output but oriented such that the IC’s  
currentsensefeedbacktracesgoingtoresistorarenot  
long. The feedback traces need to be routed together  
asasinglepaironthesamelayeratanygiventimewith  
smallest trace spacing possible. Locate any filter  
componentonthesetracesnexttotheICandnotatthe  
sense resistor location.  
Conditioning Depleted Batteries  
Severelydepletedbatteries,withlessthan2.5V/cell,should  
be conditioned with a trickle charge to prevent possible  
damage. This trickle charge is typically 10% of the 1C rate  
of the battery. The LTC4007 can automatically trickle  
4007i  
17  
LTC4007  
W U U  
U
APPLICATIO S I FOR ATIO  
5. Place output capacitors next to the sense resistor  
9. A good rule of thumb for via count for a given high  
current path is to use 0.5A per via. Be consistent.  
output and ground.  
6. Output capacitor ground connections need to feed  
into same copper that connects to the input capacitor  
ground before tying back into system ground.  
10. If possible, place all the parts listed above on the same  
PCB layer.  
11. Copper fills or pours are good for all power connec-  
tionsexceptasnotedaboveinRule3.Youcanalsouse  
copper planes on multiple layers in parallel too—this  
helps with thermal management and lower trace in-  
ductance improving EMI performance further.  
General Rules  
7. Connection of switching ground to system ground or  
internal ground plane should be single point. If the  
system has an internal system ground plane, a good  
way to do this is to cluster vias into a single star point  
to make the connection.  
12. For best current programming accuracy provide a  
Kelvin connection from RSENSE to CSP and BAT. See  
Figure 12 as an example.  
8. Route analog ground as a trace tied back to IC ground  
(analog ground pin if present) before connecting to  
any other ground. Avoid using the system ground  
plane. CAD trick: make analog ground a separate  
ground net and use a 0resistor to tie analog ground  
to system ground.  
It is important to keep the parasitic capacitance on the RT,  
CSP and BAT pins to a minimum. The traces connecting  
these pins to their respective resistors should be as short  
as possible.  
Q3  
INPUT SWITCH  
DCIN  
0V TO 20V  
3A  
C1  
R1  
4.9k  
1%  
0.1µF  
3C4C  
DCIN  
INFET  
CLP  
V
*
*
LOGIC  
R
CL  
R10  
R11  
R12  
0.033Ω  
C4  
15nF  
CHEM  
LOBAT  
100k 100k 100k  
1%  
SYSTEM  
LOAD  
LOBAT  
C2  
20µF  
LTC4007  
I
I
CLN  
CL  
CL  
R
SENSE  
L1  
0.033Ω  
ACP  
SHDN  
FAULT  
CHG  
ACP  
TGATE  
BGATE  
PGND  
CSP  
Q1  
Q2  
15µH 3A  
1%  
BAT  
SHDN  
FAULT  
CHG  
D1  
C3  
R4  
3.01k  
1%  
20µF  
FLAG  
FLAG  
NTC  
BAT  
R9 32.4k 1%  
R5 3.01k 1%  
PROG  
ITH  
R
T
MONITOR  
(CHARGING  
CURRENT  
MONITOR)  
C7  
0.47µF  
R6  
26.7k  
1%  
R7  
*PIN OPEN  
D1: MBRM140T3  
Q1: Si4431ADY  
Q2: FDC645N  
Q4: 2N7002 OR BSS138  
GND  
THERMISTOR  
C5  
6.04k  
0.0047µF  
1%  
R
T
309k  
1%  
TIMING RESISTOR  
(~2 HOURS)  
R14  
73.2k  
1%  
C6  
0.12µF  
Q4  
4007 F11  
Figure 11. Circuit Application (16.8V/3A) to Automatically Trickle Charge Depleted Batteries  
4007i  
18  
LTC4007  
W U U  
U
APPLICATIO S I FOR ATIO  
SWITCH NODE  
L1  
DIRECTION OF CHARGING CURRENT  
V
BAT  
HIGH  
FREQUENCY  
CIRCULATING  
PATH  
R
SENSE  
C2  
D1  
V
IN  
C3  
BAT  
4007 F13  
BAT  
CSP  
4007 F12  
Figure 12. High Speed Switching Path  
Figure 13. Kelvin Sensing of Charging Current  
U
PACKAGE DESCRIPTION  
GN Package  
24-Lead Plastic SSOP (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1641)  
.337 – .344*  
(8.560 – 8.738)  
.033  
(0.838)  
REF  
24 23 22 21 20 19 18 17 16 15 14 13  
.045 ±.005  
.229 – .244  
.150 – .157**  
(5.817 – 6.198)  
(3.810 – 3.988)  
.254 MIN  
.150 – .165  
1
2
3
4
5
6
7
8
9 10 11 12  
.0165 ±.0015  
.0250 TYP  
RECOMMENDED SOLDER PAD LAYOUT  
.015 ± .004  
(0.38 ± 0.10)  
.053 – .068  
(1.351 – 1.727)  
.004 – .0098  
(0.102 – 0.249)  
× 45°  
.007 – .0098  
(0.178 – 0.249)  
0° – 8° TYP  
.016 – .050  
(0.406 – 1.270)  
.008 – .012  
(0.203 – 0.305)  
.0250  
(0.635)  
BSC  
NOTE:  
1. CONTROLLING DIMENSION: INCHES  
INCHES  
2. DIMENSIONS ARE IN  
(MILLIMETERS)  
GN24 (SSOP) 0502  
3. DRAWING NOT TO SCALE  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
4007i  
19  
LTC4007  
U
TYPICAL APPLICATIO  
12.6V, 4A Li-Ion Battery Charger  
Q3  
INPUT SWITCH  
DCIN  
0V TO 20V  
3A  
C1  
R1  
0.1µF  
4.9k  
1%  
3C4C  
DCIN  
INFET  
CLP  
V
LOGIC  
R
CL  
R10  
R11  
R12  
0.033Ω  
C4  
15nF  
CHEM  
LOBAT  
*
100k 100k 100k  
1%  
SYSTEM  
LOAD  
LOBAT  
C2  
20µF  
LTC4007  
I
I
CLN  
CL  
CL  
R
SENSE  
L1  
10µH 4A  
0.025Ω  
ACP  
SHDN  
FAULT  
CHG  
ACP  
TGATE  
BGATE  
PGND  
CSP  
Q1  
Q2  
1%  
BAT  
SHDN  
FAULT  
CHG  
D1  
C3  
20µF  
R4  
3.01k 1%  
FLAG  
FLAG  
NTC  
BAT  
R9 32.4k 1%  
R5 3.01k 1%  
PROG  
ITH  
CHARGING  
CURRENT  
MONITOR  
R
T
THERMISTOR  
C7  
0.47µF  
C5  
0.0047µF  
R7  
10k  
NTC  
GND  
6.04k  
*PIN OPEN  
1%  
C6  
0.12µF  
R
D1: MBRS130T3  
Q1: Si4431ADY  
Q2: FDC645N  
R
RT  
PROG  
26.7k  
1%  
TIMING RESISTOR  
(~2 HOURS)  
309k  
1%  
4007 TA02  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LT®1511  
Constant-Current/Constant-Voltage 3A Battery  
Charger with Input Current Limiting  
High Efficiency Current Mode PWM with 4A Internal Switch  
LT1513  
SEPIC Constant- or Programmable-Current/  
Constant-Voltage Battery Charger  
Charger Input Voltage May Be Higher, Equal to or Lower Than Battery Voltage;  
Charges Any Number of Cells Up to 20V, 500kHz Switching Frequency  
LT1571  
1.5A Switching Charger  
1- or 2-Cell Li-Ion, 500kHz or 200kHz Switching Frequency, Termination Flag  
LTC1628-PG  
LTC1709  
2-Phase, Dual Synchronous Step-Down Controller  
Minimizes C and C , Power Good Output, 3.5V V 36V  
IN OUT IN  
2-Phase, Dual Synchronous Step-Down Controller  
with VID  
Up to 42A Output, Minimum C and C , Uses Smallest Components for  
IN OUT  
Intel and AMD Processors  
LTC1729  
LT1769  
2A Switching Battery Charger  
Constant-Current/Constant-Voltage Switching Regulator, Input Current  
Limiting Maximizes Charge Current  
LTC1778  
LTC1960  
LTC3711  
LTC4006  
Wide Operating Range, No R  
Step-Down Controller  
Synchronous  
2% to 90% Duty Cycle at 200kHz, Stable with Ceramic C  
OUT  
SENSE  
Dual Battery Charger/Selector with SPI Interface  
Simultaneous Charge or Discharge of Two Batteries, DAC Programmable  
Current and Voltage, Input Current Limiting Maximizes Charge Current  
No R  
TM Synchronous Step-Down Controller  
3.5V V 36V, 0.925V V  
2V, for Transmeta, AMD and Intel  
SENSE  
with VID  
IN  
OUT  
Mobile Processors  
Small, High Efficiency, Fixed Voltage,  
Lithium-Ion Battery Charger  
Constant-Current/Constant-Voltage Switching Regulator with Termination  
Timer, AC Adapter Current Limit and Thermistor Sensor in a Small  
16-Pin Package  
LTC4008  
High Efficiency, Programmable Voltage/Current  
Battery Charger  
Constant-Current/Constant-Voltage Switching Regulator, Resistor Voltage/  
Current Programming, AC Adapter Current Limit and Thermistor Sensor  
No R  
is a trademark of Linear Technology Corporation.  
SENSE  
4007i  
LT/TP 0103 1.5K • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
LINEAR TECHNOLOGY CORPORATION 2003  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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