LTC5800-IPM [Linear]

2.4 GHz 802.15.4 EternaTM Mote-on-Chip; 2.4 GHz的802.15.4 EternaTM莫特级芯片
LTC5800-IPM
型号: LTC5800-IPM
厂家: Linear    Linear
描述:

2.4 GHz 802.15.4 EternaTM Mote-on-Chip
2.4 GHz的802.15.4 EternaTM莫特级芯片

文件: 总28页 (文件大小:915K)
中文:  中文翻译
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A d v a n c e d I n f o r m a t i o n  
S m a r t M e s h® I P  
LTC5800-IPM  
2.4 GHz 802.15.4 EternaTM Mote-on-Chip  
About SmartMesh IP  
Dust Networks’ new standards-based SmartMesh® IP product line achieves unsurpassed levels of networking resilience and reliability, with  
advanced network management and comprehensive security. Based on Dust’s breakthrough Eterna™ SoC technology, SmartMesh IP  
enables 8 times lower power consumption than competing solutions even in harsh, dynamically changing RF environments. Cost effective,  
Internet Protocol (IP) compatible, and widely applicable, SmartMesh IP serves an extensive range of applications such as energy  
management, building automation, renewable energy, and other implementations in smart infrastructure that call for ultra-low power.  
Product Description – LTC5800-IPM  
SmartMesh IP networks are built from wireless network nodes called motes. The motes include advanced hardware and advanced software  
algorithms that provide resilient, reliable, and low-power true-mesh networks. Dust motes deliver unprecedented low power consumption  
with a receive current of less than 5 mA and a transmit current of less than 10 mA at +8dBm (< 6 mA at 0 dBm). With Dust’s time-  
synchronized SmartMesh IP networking, all motes in the network may route and may be battery-powered, powered by an energy-harvester,  
or line powered. SmartMesh IP’s time-synchronized mesh networking combines with Dust Network’s innovative IEEE 802.15.4-compliant  
radio design to enable battery life of a decade for all motes, including routing motes, on two AA batteries.  
The LTC5800-IPM Mote-on-Chipcombines Dust Networks’ robust sensor networking solution with Dust’s breakthrough EternaTM SoC  
Technology in an easy-to-integrate 72-pin 10 mm x 10 mm QFN package. The LTC5800-IPM integrates all radio circuitry components,  
including an on-chip power amplifier, and requires only an AC coupling capacitor and an antenna for robust wireless connectivity. Dust  
Networks provides a fully-engineered RF solution, comprehensive APIs, and complete development documentation thereby accelerating  
customer development time and reducing customer development costs.  
Key Product Features  
Highly Scalable  
Ultra-low Power Operation  
Automatic network formation—new motes join  
Industry-leading radio technology  
automatically from anywhere in the network  
All motes are wireless routers, providing a full-mesh  
network that easily scales to tens of thousands of motes per  
square kilometer  
Dedicated support for energy-scavenged operation  
Automatic power optimization of every device in network,  
enabling a decade of network operation on two Lithium AA  
batteries  
Time-synchronized communication across 15 channels  
virtually eliminates in-network collisions, allowing for  
dense deployments in overlapping radio spaces  
IP Standards Compliance  
Compliant to IETF 6LoWPAN and IEEE 802.15.4e  
Easy to Integrate and Deploy  
Superior Reliability  
Fully engineered RF, with power amplifier (PA), integrated  
balun, and antenna matching circuitry  
Intelligent Networking Platform enables greater than  
99.99% network reliability even in the most challenging  
environments  
Time-synchronized channel hopping seamlessly  
compensates for in band blocking and multipath fading in  
dynamic RF environments  
A comprehensive application programming interface (API)  
provides a rich and flexible functionality to ease software  
development and device integration  
Secure Global Market Solution  
Operates on 2.4 GHz global license-free band, providing  
customers with a single product for world-wide use  
AES-128 bit encryption  
Linear Technology / Dust Networks  
A d v a n c e d I n f o r m a t i o n  
Table of Contents  
1.0  
1.1  
1.2  
General ..............................................................................................................4  
Related Documentation ..................................................................................... 4  
Conventions..................................................................................................... 4  
1.2.1 Signal Naming.............................................................................................. 4  
1.2.2 Number Format ............................................................................................ 4  
2.0  
2.1  
Introduction.......................................................................................................5  
Power Supply................................................................................................... 5  
2.1.1 Supply Monitoring and Reset .......................................................................... 6  
2.2 Precision Timing............................................................................................... 6  
2.2.1 Time Synchronization .................................................................................... 6  
2.3  
Time References............................................................................................... 6  
2.3.1 Relaxation Oscillator...................................................................................... 6  
2.3.2 32.768 kHz Crystal ....................................................................................... 6  
2.3.3 20 MHz Crystal............................................................................................. 6  
2.4  
2.5  
Radio.............................................................................................................. 6  
UARTs............................................................................................................. 7  
2.5.1 API UART Protocols ....................................................................................... 7  
2.5.3 CLI UART..................................................................................................... 8  
2.6  
2.7  
2.8  
Autonomous MAC ............................................................................................. 8  
Security .......................................................................................................... 9  
Temperature Sensor ......................................................................................... 9  
2.8.1 Radio Inhibit ................................................................................................ 9  
2.8.2 Sleep .......................................................................................................... 9  
2.10 Flash Programming........................................................................................... 9  
4.0  
Operation.........................................................................................................10  
4.1  
Start Up.........................................................................................................10  
4.1.1 Fuse Table..................................................................................................10  
4.2  
4.3  
Serial Flash Emulation......................................................................................11  
Operation.......................................................................................................11  
4.3.1 Active State ................................................................................................11  
4.3.2 Doze State..................................................................................................11  
4.4  
5.0  
5.1  
5.3  
Duty Cycling and Autonomous Peripherals...........................................................11  
Pinout ..............................................................................................................12  
Eterna Mote-on-Chip........................................................................................12  
Power Supply..................................................................................................14  
5.3.1 Antenna .....................................................................................................15  
5.4  
5.5  
6.0  
Analog ...........................................................................................................15  
JTAG..............................................................................................................15  
Absolute Maximum Ratings..............................................................................15  
Recommended Operating Conditions................................................................16  
7.0  
2
Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
8.0  
8.1  
Electrical Characteristics..................................................................................16  
Radio Specifications.........................................................................................16  
DC Characteristics ...........................................................................................16  
Radio Receive Characteristics ............................................................................17  
Radio Transmitter Characteristics.......................................................................18  
Digital I/O Characteristics.................................................................................18  
Temperature Sensor Characteristics ...................................................................19  
ADC Characteristics .........................................................................................19  
System Characteristics.....................................................................................19  
UART AC Characteristics...................................................................................20  
8.2  
8.3  
8.4  
8.5  
8.6  
8.7  
8.8  
8.9  
8.10 TIMEn AC Characteristics..................................................................................21  
8.11 SLEEPn AC Characteristics ................................................................................21  
8.12 RADIO_INHIBIT AC Characteristics.....................................................................21  
8.13 FLASH AC Characteristics..................................................................................22  
8.14 Flash Programming AC Characteristics................................................................22  
9.0  
Typical Performance Characteristics ................................................................23  
10.0 Mechanical Details ...........................................................................................25  
10.1 Mote-on-Chip..................................................................................................25  
10.3 Soldering Information ......................................................................................25  
11.0 Regulatory and Standards Compliance.............................................................25  
11.1 Compliance to Restriction of Hazardous Substances (RoHS)...................................25  
12.0 References .......................................................................................................26  
13.0 Order Information............................................................................................26  
Eterna Datasheet  
Linear Technology / Dust Networks  
3
A d v a n c e d I n f o r m a t i o n  
1.0 General  
1.1  
Related Documentation  
040-0102 Eterna Integration Guide  
040-0109 Design Specific Configuration Guide  
040-0110 Eterna Serial Programmer Guide  
1.2  
Conventions  
1.2.1  
Signal Naming  
The naming convention for Eterna signals is UPPER_CASE_SEPARATED_BY_UNDERSCORE. Active-low signals, such  
as RESETn, add a trailing lower case n. An exception to the naming convention is UART transmit and receive signals which  
are named consistent with industry practice as RX and TX, omitting the lower case n, despite being active low signals. The  
terms assertion and active refers to a signal in a logically true state: logic ‘1’ for active high signals and logic ‘0’ for active  
low signals. The terms negated and inactive refer to a signal being in its logically false state: logic ‘0’ for active high signals  
and logic ‘1’ for active low signals.  
1.2.2  
Number Format  
The 0x prefix indicates a hexadecimal number follows.  
The 0b prefix indicates a binary number follows.  
The lack of a prefix indicates a decimal number follows.  
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Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
2.0 Introduction  
Eterna is the world’s most energy-efficient IEEE 802.15.4 compliant platform enabling battery and energy harvested  
endpoint, routing and network management solutions. With a powerful 32-bit ARM® Cortex™-M3, best in class radio, flash,  
RAM and purpose-built peripherals, Eterna provides a flexible, scalable and robust networking solution for applications  
demanding both minimal energy consumption and data reliability in even the most challenging RF environments.  
Shown in Figure 1, Eterna integrates purpose-built peripherals that excel in both low operating-energy consumption and the  
ability to rapidly and precisely cycle between operating and low-power states. Items in the shaded region correspond to the  
analog/RF components.  
32 kHz  
Timers  
Sched.  
32 kHz, 20 MHz  
Voltage Reference  
Core Regulator  
Primary  
DC/DC  
Converter  
SRAM  
72 KB  
Clock Regulator  
Analog Regulator  
Flash  
512 KB  
PMU /  
Clock  
Control  
Relaxation  
Oscillator  
PA  
DC/DC  
Converter  
Flash  
Controller  
PoR  
802.15.4  
Mod  
AES  
LPF  
DAC  
PA  
Code  
802.15.4  
Framing  
DMA  
PLL  
Auto  
MAC  
Cortex-M3  
System  
802.15.4  
Demod  
ADC  
Limiter  
AGC  
LNA  
BPF  
PPF  
RSSI  
IPCS  
SPI  
Slave  
CLI  
UART  
(2 pin)  
API  
UART  
(6-pin)  
ADC  
Ctrl.  
10-bit  
ADC  
Bat.  
Load  
VGA  
S
PTAT  
4-bit  
DAC  
Figure 1 Eterna Block Diagram  
2.1  
Power Supply  
Eterna is powered from a single pin, VSUPPLY, which powers the I/O cells and is also used to generate internal supplies.  
Eterna’s two on-chip DC/DC converters minimize Eterna’s energy consumption while the device is awake. To prevent power  
from being wasted the DC/DC converter is disabled when the device is in low-power state. Eterna’s rejection of supply noise  
is substantial owing to the two integrated DC/DC converters and three integrated low-dropout regulators. Eterna’s operating  
supply range is high enough to support direct connection to Li-SClO2 sources and wide enough to support battery operation  
over a broad temperature range.  
Eterna Datasheet  
Linear Technology / Dust Networks  
5
A d v a n c e d I n f o r m a t i o n  
2.1.1  
Supply Monitoring and Reset  
Eterna integrates an Power on Reset (PoR) circuit and as the RESETn input pin is nominally configured with an internal pull-  
up resistor, thus no connection is required. For a graceful shutdown, the software and networking layers be cleanly halted  
prior to assertion of the RESETn pin. Eterna includes a soft brown-out monitor that fully protects the Flash from corruption  
in the event that power is removed while writing to flash. Integrated flash supervisory functionality in conjunction with ***  
(do we do a JFS?) yields a robust non-volatile file system.  
2.2  
Precision Timing  
Eterna, differs from competing 802.15.4 product offerings by providing low-power dedicated timing hardware and timing  
algorithms that provide timing precision two to three orders of magnitude better than any other available low-power solution.  
Improved timing accuracy allows motes to minimize the amount of radio listening time required to ensure packet reception  
thereby lowering even further the power consumed by an Eterna network. Eterna’s patented timing hardware and timing  
algorithms provide superior performance over rapid temperature changes, further differentiating Eterna’s reliability when  
compared with other wireless products. In addition, precise timing enables networks to reduce spectral dead time, increasing  
total network throughput.  
2.2.1  
Time Synchronization  
In addition to coordinating timeslots across the network, which is transparent to the user, Eterna’s unparalleled timing  
management is used to support two mechanisms to share network time. Having an accurate, shared, network-wide time base  
enables events to be accurately time stamped or tasks to be performed in a synchronized fashion across a network. Eterna  
will send a time packet through its serial interface when one of the following occurs:  
Eterna receives an HDLC request to read time  
The TIMEn signal is asserted  
The use of TIMEn has the advantage of being more accurate. The value of the timestamp is captured in hardware relative to  
the rising edge of TIMEn. If the HDLC request is used, due to packet processing the value of the timestamp may be captured  
several milliseconds after receipt of the packet. See Section 8.10 for the time functions definition and specifications.  
2.3  
Time References  
Eterna includes three clock sources: a low power oscillator designed for a 32.768 kHz crystal, the radio reference oscillator  
designed for a 20 MHz crystal, and an internal relaxation oscillator.  
2.3.1  
Relaxation Oscillator  
The relaxation oscillator is the primary clock source for Eterna, providing the clock for the CPU, memory subsystems, and all  
peripherals. The internal relaxation oscillator typically starts up in a few μs, providing an expedient, low-energy method for  
duty cycling between active and low power states. Quick start-up from the doze state, defined in section 4.0, allows Eterna to  
wake up and receive data over the UART and SPI interfaces by simply by detecting activity the appropriate signals.  
2.3.2  
32.768 kHz Crystal  
Once Eterna is powered up and the 32.768 kHz crystal source has begun oscillating, the 32.768 kHz crystal remains  
operational while in the Active state, and is used as the timing basis when in Doze state. See Section 4.0 for a description of  
Eterna’s operational states.  
2.3.3  
20 MHz Crystal  
The 20 MHz crystal source provides a frequency reference for the radio, and is automatically enabled and disabled by Eterna  
as needed.  
2.4  
Radio  
Eterna is the lowest-power commercially available 2.4 GHz IEEE 802.15.4e radio by a substantial margin. (Please refer to  
section 8.2 for power consumption numbers.). Eterna’s integrated power amplifier is calibrated and temperature-compensated  
to consistently provide power at a limit suitable for worldwide radio certifications. Additionally, Eterna uniquely includes a  
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Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
hardware-based autonomous MAC that handles precise sequencing of peripherals, including the transmitter, the receiver, and  
AES peripherals. The hardware-based autonomous MAC minimizes CPU activity, thereby further decreasing power  
consumption.  
2.5  
UARTs  
The principal network interface is through the application programming interface (API) UART. A command-line interface  
(CLI) is also provided for support of test and debug functions. Both UARTs sense activity continuously, consuming virtually  
no power until data is transferred over the port and then automatically returning to their lowest power state after the  
conclusion of a transfer.  
2.5.1  
API UART Protocols  
The API UART supports multiple protocols with the goal of supporting a wide range of companion MCUs while reducing  
power consumption of the system. In a system design with more than one device communicating across a serial port, higher  
serial data rates translate into lower power consumption. The receive half of the API UART protocol includes two additional  
signals in addition to UART_RX, UART_RX_RTSn and UART_RX_CTSn. The transmit half of the API UART protocol  
includes two additional signals in addition to UART_TX, UART_TX_RTSn and UART_TX_CTSn. Three supported  
protocols are supported and are referred to as UART Mode 0, UART Mode 2 and UART Mode 4.  
In the Figures accompanying the protocol descriptions, signals driven by the companion processor are drawn in black and  
signals driven by Eterna are drawn in blue.  
2.5.1.1 UART Mode 0  
UART Mode 0 is set to 9600 baud, not HDLC encoded, only UART_RX and UART_TX signals are supported.  
2.5.1.2 UART Mode 2  
UART Mode 2 provides the most energy efficient method for operating Eterna’s API UART. UART Mode 2 requires the  
use of all six UART signals, but does not require adherence to with the minimum inter-packet delay as defined in section 8.9.  
UART Mode 2 incorporates edge sensitive flow control, enabling both 9600 and 115200 baud. Packets are HDLC encoded,  
one stop bit, no parity bit. The flow control signals for Eterna’s API receive path are shown in Figure 2. Transfers are  
initiated by the companion processor asserting UART_RX_RTSn, Eterna responds by enabling the UART and asserting  
UART_RX_CTSn. After detecting the assertion of UART_RX_CTSn the companion processor sends the entire packet.  
Following the transmission of the final byte in the packet the companion processor negates UART_RX_RTSn and waits  
until the negation of UART_RX_CTSn before asserting UART_RX_RTSn again.  
Figure 2 UART Mode 2 Receive Flow Control  
The flow control signals for Eterna’s API transmit path are shown in Figure 3. Transfers are initiated by Eterna asserting  
UART_TX_RTSn, The companion processor responds by asserting UART_TX_CTSn when ready to receive data. After  
detecting the falling edge of UART_TX_CTSn Eterna sends the entire packet. Following the transmission of the final byte in  
the packet Eterna negates UART_TX_RTSn and waits until the negation of UART_TX_CTSn before asserting  
UART_TX_RTSn again. The companion processor may negate UART_TX_CTSn any time after the first byte is transmitted  
provided the time out from UART_TX_RTSn to UART_TX_CTSn is met.  
Eterna Datasheet  
Linear Technology / Dust Networks  
7
A d v a n c e d I n f o r m a t i o n  
Figure 3 UART Mode 2 Transmit Flow Control  
2.5.1.3 UART Mode 4  
UART Mode 4 incorporates level sensitive flow control on the TX channel and requires no flow control on the RX channel,  
supporting both 9600 and 115200 baud. The use of level sensitive flow control signals enables support of higher data rates  
with the option of using a reduced set of the flow control signals, with the drawback of requiring the companion processor to  
comply with the minimum inter-packet delay as defined in section 8.9. Packets are HDLC encoded, one stop bit, no parity  
bit. The use of the RX flow control signals, UART_RX_RTSn and UART_RX_CTSn, for Mode 4 are optional provided the  
use is limited to the industrial temperature range, -40 deg C to 85 deg C; otherwise, the flow control should follow the same  
protocol described in section 2.5.1.2. The flow control signals for the TX channel are shown in Figure 4. Transfers are  
initiated by Eterna asserting UART_TX_RTSn. The UART_TX_CTSn signal may be actively driven by the companion  
processor when ready to receive a packet or UART_TX_CTSn may be tied low. After detecting a logic ‘0’ of  
UART_TX_CTSn Eterna sends the entire packet. Following the transmission of the final byte in the packet Eterna negates  
UART_TX_RTSn and waits for a minimum period defined in section 8.9 before asserting UART_TX_RTSn again.  
Figure 4 UART Mode 4 Transmit Flow Control  
For details on the timing of the UART protocol, see section 8.9 (UART AC Characteristics).  
2.5.3  
CLI UART  
The Command Line Interface (CLI) UART port is a two wire protocol (TX and RX) that operates at a fixed 9600 baud rate  
with one-stop bit and no parity. The CLI UART interface is intended to support command-line instructions and response  
activity.  
2.6  
Autonomous MAC  
Eterna was designed as a system solution with the objective of providing a reliable, ultra-low power, and secure network. A  
reliable network capable of dynamically optimizing operation over changing environments requires solutions that are far too  
complex to completely support through hardware acceleration alone. As described in Section 2.2, proper time management is  
essential for optimizing a solution that is both low power and reliable. To address this solution Eterna includes the  
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Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
Autonomous MAC, which includes hardware support for controlling all of the time-critical radio operations. The  
Autonomous MAC provides two benefits: first, preventing variable software latency from affecting network timing and  
second, greatly reducing system power consumption by allowing the CPU to remain inactive during the majority of the radio  
activity. The Autonomous MAC, unique to Eterna, provides software-independent timing control of the radio and radio-  
related functions, resulting in superior reliability and exceptionally low power.  
2.7  
Security  
Network security is an often overlooked component of a complete network solution. Proper implementation of security  
protocols is significant in terms of both engineering effort and market value in an OEM product. Eterna system solutions  
provide a FIPS-197 validated encryption scheme, and goes further, providing a complete set of mechanisms to protect  
network security. Eterna includes hardware support for electronically locking devices, thereby preventing access to Eterna’s  
flash and RAM memory. This lock-out feature provides a means to securely unlock a device should support of a product  
require access. For details see 040-0109 Design Specific Configuration Guide.  
2.8  
Temperature Sensor  
Eterna includes a calibrated temperature sensor on chip. The temperature readings are available locally through Eterna’s  
serial API, in addition to being available via the network manager. The performance characteristics of the temperature sensor  
can be found in Section 8.6.  
2.8.1  
Radio Inhibit  
The RADIO_INHIBIT digital interrupt enables an external controller to temporarily disable the radio software drivers (for  
example, to take a sensor reading that is susceptible to radio interference). When RADIO_INHIBIT is asserted the software  
radio drivers will disallow radio operations including clear channel assessment, packet transmits, or packet receipts. If a radio  
event is in progress radio inhibit will take effect after the present operation completes. For details on the timing associated  
with RADIO_INHIBIT, see Section 8.12.  
2.8.2  
Sleep  
The SLEEPn digital interrupt enables an external controller to temporarily disable Eterna’s duty cycling between active and  
Doze states (see Section 4.0 for state definitions). Forcing Eterna to the Doze state should only be done when absolutely  
necessary, such as when taking a very sensitive sensor reading, as forcing a device into a Doze state will on the average  
increase the energy consumption of other devices in the network. When SLEEPn is asserted the software will go into a Doze  
state until the SLEEPn signal is negated. For details on the timing associated with SLEEPn, see Section 8.11.  
2.10  
Flash Programming  
Eterna’s software images are loaded via the IPCS, in-circuit programming control system, SPI interface. Sequencing of  
RESETn and FLASH_P_ENn, as described in Section 4.0, places Eterna in a state emulating a serial flash to support in-  
circuit programming. Hardware and software for supporting development and production programming of devices is  
described in 040-0110 Eterna Serial Programmer Guide. The serial protocol, SPI, and timing parameters are described in  
Section 8.13.  
Eterna Datasheet  
Linear Technology / Dust Networks  
9
A d v a n c e d I n f o r m a t i o n  
4.0 Operation  
In order to provide capabilities and flexibility in addition to ultra low power, Eterna operates in various states, as shown in  
Figure 8 and described in this section.  
Power-On  
Reset  
VSUPPLY > PoR  
RESETn low and  
FLASH_P_ENn low  
Load Fuse  
Settings  
Serial Flash  
Emulation  
RESETn low and  
FLASH_P_ENn high  
Set RESETn high and  
FLASH_P_EN high  
for 125 µs, then  
set RESETn low  
Reset  
De-assert RESETn  
Boot  
Start Up  
Assert RESETn  
Deep Sleep  
Assert RESETn  
Assert RESETn  
CPU and peripherals  
inactive  
Doze  
Active  
HW or PMU Event  
lowPowerSleep  
Command  
Operation  
Figure 8 State Diagram – Operating Modes  
Inactive  
4.1  
Start Up  
Start Up occurs as a result of either tripping of the power-on-reset circuit or the assertion of RESETn. After the completion  
of power-on-reset (see Section 2.1.1) or the falling edge of an internally synchronized RESETn, Eterna loads its Fuse Table  
(see section 4.1.1), including setting I/O direction. In this state, Eterna checks the state of the FLASH_P_ENn and RESETn  
and enters the serial flash emulation mode, if both signals are asserted. If the FLASH_P_ENn pin is not asserted but RESETn  
is not asserted, Eterna automatically reduces its energy consumption to a minimum until RESETn is released. Once RESETn is de-  
asserted, Eterna goes through a boot sequence, and then enters the Active state.  
4.1.1  
Fuse Table  
Eterna’s Fuse Table is a 2 KB page in flash that contains two data structures, one for hardware configuration immediately  
following Power on Reset or the assertion of RESETn and one for configuration of design specific parameters. Hardware  
support for configuration includes configuration of I/O, preventing I/O leakage from negatively affecting current  
consumption during power on, which can be a significant issue for current limited supplies. Examples of design-specific  
parameters include setting of UART modes, clock sources and trim values. Fuse Tables are created via the Fuse Table  
application software described in 040-0109 Design Specific Configuration Guide. Fuse Tables are loaded into flash using the  
same software and in-circuit programmer used to load Eterna’s networking software image – see the 040-0110 Eterna Serial  
Programmer Guide for details.  
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Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
4.2  
Serial Flash Emulation  
When both RESETn and FLASH_P_ENn are asserted, Eterna disables normal operation and enters a mode to emulate the  
operation of a serial flash. In this mode, its flash can be programmed with software updates. For details, see Section 2.10.  
4.3  
Operation  
Once Eterna has completed startup, Eterna transitions to the Operational group of states (active / CPU active, active / CPU  
inactive, and Doze). There, Eterna cycles between the various states, automatically selecting the lowest power state possible  
while fulfilling the demands of network operation.  
4.3.1  
Active State  
In Active state, Eterna’s relaxation oscillator is running and peripherals are enabled as needed. The ARM Cortex-M3 cycles  
as needed between CPU-active and CPU-inactive (referred to in the ARM Cortex-M3 literature as “Sleep Now” or “Sleep on  
Exit” modes). Eterna’s extensive use of DMA and intelligent peripherals that can independently move Eterna between the  
Active and Doze states minimizes the time the CPU is active, significantly reducing Eterna’s energy consumption.  
4.3.2  
Doze State  
The Doze state consumes orders of magnitude less current than the Active state (see Table 6) and is entered when all of the  
peripherals, save the low power portion of the timer module, and the CPU are inactive. In the Doze state Eterna’s full state is  
retained and Eterna is configured to detect, wake, and rapidly respond to activity on I/Os (such as UART signals and the  
TIMEn pin). The Doze state also uses the 32.768-kHz oscillator and 32 kHz based timers are active.  
4.4  
Duty Cycling and Autonomous Peripherals  
Eterna’s ability to quickly and efficiently transition between Doze and Active states, in conjunction with the ability of  
peripherals to operate autonomously for most operations (shown in Figure 9), enables the system solution to significantly  
reduce power consumption. For example the system can automatically go from Doze to Active and determine if RF energy is  
present. The CPU is then only woken if a packet is detected, otherwise Eterna returns to Doze mode.  
Figure 9 Low Energy Duty Cycling  
Eterna Datasheet  
Linear Technology / Dust Networks  
11  
A d v a n c e d I n f o r m a t i o n  
5.0 Pinout  
5.1  
Eterna Mote-on-Chip  
Figure 10 and Table 1 show the default pinout and pin-assignment for Eterna. For clarity the pins are grouped by function in  
the pin-assignment table.  
Note: All unused input pins not configured with a pull resistor (see Pull column in pinout table) must be driven to their  
inactive state or be configured by the Fuse Table to pull to an inactive state to avoid excess leakage and undesired operation.  
Leakage due to floating inputs can be substantially greater than Eterna’s average power consumption. Pin functions shown in  
gray are not currently supported via software.  
72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55  
1
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
RADIO_INHIBIT / GPIO15  
CAP_PA_1P  
CAP_PA_1M  
CAP_PA_2M  
CAP_PA_2P  
CAP_PA_3P  
CAP_PA_3M  
CAP_PA_4M  
CAP_PA_4P  
VDDPA  
VPP  
SPIS_SSn / SDA  
SPIS_SCK / SCL  
GPIO26 / SPIS_MOSI / UARTC1_RX  
SPIS_MISO / 1-Wire / UARTC1_TX  
PWM0 / GPIO16  
2
3
4
5
6
7
GPIO20  
8
SPIM_SS_0n / GPIO12  
SPIM_SS_1n / GPIO13  
IPCS_SSn / GPIO3  
IPCS_SCK / GPIO4  
SPIM_SCK / GPIO9  
IPCS_MOSI / GPIO5  
SPIM_MOSI / GPIO10  
IPCS_MISO / GPIO6  
SPIM_MISO / GPIO11  
UARTC0_RX  
Paddle  
(GND)  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
LNA_EN / GPIO17  
RADIO_TX / GPIO18  
RADIO_TXn / GPIO19  
ANTENNA  
AI_0  
AI_1  
AI_3  
AI_2  
UARTC0_TX  
19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36  
Figure 10 Eterna Mote-on-Chip Pinout – Top View  
12  
Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
Table 1  
No  
P
Eterna Mote-on-Chip Pinout Assignments  
Power Supply  
GND  
Type  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Power  
Type  
I/O  
Pull  
Description  
Ground connection P = QFN Paddle  
PA DC/DC converter capacitor 1 plus terminal  
PA DC/DC converter capacitor 1 minus terminal  
PA DC/DC converter capacitor 2 minus terminal  
PA DC/DC converter capacitor 2 plus terminal  
PA DC/DC converter capacitor 3 plus terminal  
PA DC/DC converter capacitor 3 minus terminal  
PA DC/DC converter capacitor 4 minus terminal  
PA DC/DC converter capacitor 4 plus terminal  
Internal power amplifier power supply  
Regulated analog supply  
-
-
2
CAP_PA_1P  
CAP_PA_1M  
CAP_PA_2M  
CAP_PA_2P  
CAP_PA_3P  
CAP_PA_3M  
CAP_PA_4M  
CAP_PA_4P  
VDDPA  
-
-
3
-
-
4
-
-
5
-
-
6
-
-
7
-
-
8
-
-
9
-
-
10  
30  
31  
32  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
No  
1
-
-
VDDA  
-
-
VCORE  
-
-
Regulated core supply  
VOSC  
-
-
Regulated oscillator supply  
VPRIME  
-
-
Internal primary core power supply  
Primary DC/DC converter capacitor 4 plus terminal  
Primary DC/DC converter capacitor 4 minus terminal  
Primary DC/DC converter capacitor 3 minus terminal  
Primary DC/DC converter capacitor 3 plus terminal  
Primary DC/DC converter capacitor 2 plus terminal  
Primary DC/DC converter capacitor 2 minus terminal  
Primary DC/DC converter capacitor 1 minus terminal  
Primary DC/DC converter capacitor 1 plus terminal  
Power supply input to Eterna  
CAP_PRIME_4P  
CAP_PRIME_4M  
CAP_PRIME_3M  
CAP_PRIME_3P  
CAP_PRIME_2P  
CAP_PRIME_2M  
CAP_PRIME_1M  
CAP_PRIME_1P  
VSUPPLY  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Radio  
I/O  
Pull  
Description  
RADIO_INHIBIT  
ANTENNA  
1*  
I
-
Radio Inhibit  
14  
No  
15  
16  
17  
18  
No  
19  
20  
28  
29  
-
-
-
Single-ended antenna port  
Analog  
Type  
I/O  
Pull  
Description  
AI_0  
Analog  
Analog  
Analog  
Analog  
Type  
I
-
Analog input 0  
AI_1  
I
-
Analog input 1  
AI_3  
I
-
Analog input 3  
AI_2  
I
-
Analog input 2  
Crystals  
I/O  
Pull  
Description  
OSC_32K_XOUT  
OSC_32K_XIN  
OSC_20M_XIN  
Crystal  
Crystal  
Crystal  
Crystal  
I
I
I
I
-
-
-
-
32 kHz crystal xout  
32 kHz crystal xin  
20 MHz crystal xin  
OSC_20M_XOU  
T
20 MHz crystal xout  
No  
22  
Reset  
Type  
I/O  
Pull  
Description  
RESETn  
1
I
UP  
Reset, Input, active low  
No  
23  
JTAG  
TDI  
Type  
I/O  
Pull  
UP  
-
Description  
JTAG test data in  
1
1
1
1
I
O
I
TDO  
JTAG test data out  
24  
TMS  
UP  
JTAG test mode select  
25  
TCK  
I
DOWN JTAG test clock  
26  
Eterna Datasheet  
Linear Technology / Dust Networks  
13  
A d v a n c e d I n f o r m a t i o n  
No  
GPIOs  
Type  
I/O  
I/O  
Pull  
Description  
34  
51  
GPIO21  
GPIO26  
1
1
-
-
General purpose digital I/O  
General purpose digital I/O  
I/O  
Note: See also 40, 42, 44, and 45 for additional GPIO  
ports.  
No  
Special  
Type  
I/O  
Pull  
Description  
Purpose Digital  
35  
72  
SLEEPn  
TIMEn  
1*  
1*  
I
I
-
-
Deep Sleep, active low  
Time capture request, active low  
No  
CLI  
Type  
2
I/O  
Pull  
-
Description  
CLI UART 0 transmit  
37  
38  
UARTC0_TX  
UARTC0_RX  
O
I
UP  
CLI UART 0 receive  
1
No  
IPCS SPI  
/FLASH  
Type  
I/O  
Pull  
Description  
Programming  
40  
42  
44  
45  
55  
IPCS_MISO  
GPIO6  
2
2
1
1
1
1
1
1
1
O
I/O  
I
-
SPI flash emulation (MISO) master in slave out port  
General purpose digital I/O  
-
IPCS_MOSI  
GPIO5  
-
SPI flash emulation (MOSI) master out slave in port  
General purpose digital I/O  
I/O  
I
-
IPCS_SCK  
GPIO4  
-
-
SPI flash emulation (SCK) serial clock port  
General purpose digital I/O  
I/O  
I
IPCS_SSn  
GPIO3  
-
SPI flash emulation slave select, active low  
General purpose digital I/O  
I/O  
I
-
FLASH_P_ENn  
UP  
Flash program enable, active low  
Note that this functionality is available only when  
RESETn is asserted  
No  
UART  
Type  
1*  
1
I/O  
Pull  
Description  
UART receive (RTS) request to send, active low  
UART receive (CTS) clear to send, active low  
UART receive  
66  
67  
68  
69  
70  
71  
UART_RX_RTSn  
UART_RX_CTSn  
UART_RX  
I
O
I
-
-
-
-
-
-
1*  
1
UART_TX_RTSn  
UART_TX_CTSn  
UART_TX  
O
I
UART transmit (RTS) request to send, active low  
UART transmit (CTS) clear to send, active low  
UART transmit  
1*  
2
O
* Input signals that must be driven or pulled to a valid state to avoid leakage.  
* Input signals that must be driven or pulled to a valid state to avoid leakage.  
5.3  
Power Supply  
Eterna is powered from a single pin, VSUPPLY, and generates all required supplies internally. With two integrated DC/DC  
converters and four voltage regulators, the sensitivity to noise on VSUPPLY is minimal. However, during typical operation  
Eterna will vary its load on the power supply from the μA range to 10’s of mA over a few μs. During such transients, the  
power supply must meet the specifications for supply noise tolerance. Eterna is designed to operate with specific decoupling  
capacitance on VCORE, VDDA, VOSC, VDDPA, and VPRIME, as well as the internal converter capacitors C1 through C4.  
Failure to use correctly sized ceramic capacitors can result in supply instability and performance degradation.  
14  
Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
5.3.1  
Antenna  
Eterna allows direct connection to a single-ended 50-Ohm antenna; an internal TX/RX switch simplifies external circuitry  
requirements. Because both the transmit and the receive paths are single-ended, a balun (with its associated cost and  
efficiency loss) are not required. Eterna provides options to set typical output power to 0 dBm or to +8 dBm using the on-chip  
PA. For further details on radio transmit and receive, see section 2.4.  
5.4  
Analog  
Eterna has four analog inputs. Its 10-bit ADC includes a 4-bit DAC for adjusting offset and a 3-bit VGA, as shown in Figure  
13. The software application layer controls ADC operation and may be configured to automatically sample any combination  
of the internal temperature sensor, or analog input signals.  
Figure 13 Analog to Digital Chain  
5.5  
JTAG  
Eterna includes an IEEE 1149.1-compliant JTAG port for boundary scan.  
6.0 Absolute Maximum Ratings  
The absolute maximum ratings shown in Table 3 should not be violated under any circumstances. Permanent damage to the  
device may be caused by exceeding one or more of these parameters. Unless otherwise noted, all voltages in Table 3 are  
relative to GND.  
Table 3  
Absolute Maximum Ratings  
Parameter  
Min  
–0.3  
–0.3  
Typ  
Max  
Units  
Comments  
Supply voltage (VSUPPLY to GND)  
Voltage on any digital I/O pin  
3.76  
V
V
VSUPPLY  
+ 0.3  
3.76  
Input RF level  
+10  
dBm  
°C  
Input power at antenna connector  
Storage temperature range  
–55  
+105  
Extended storage at high  
temperature is discouraged, as this  
negatively affects the data  
retention of Eterna’s calibration  
data.  
Lead temperature  
VSWR of antenna  
ESD protection  
Antenna pad  
+245  
3:1  
°C  
For 10 seconds  
±1000  
±1000  
±100  
V
V
V
HBM  
HBM  
CDM  
All other pads  
Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent  
permanent damage.  
Eterna Datasheet  
Linear Technology / Dust Networks  
15  
A d v a n c e d I n f o r m a t i o n  
7.0  
Table 4  
Recommended Operating Conditions  
Recommended Operation Conditions  
Parameter  
Conditions  
Min  
Typ  
Max  
3.76  
250  
Units  
V
VSUPPLY range  
Including noise and load regulation  
2.1  
3.6  
Voltage supply noise  
Requires recommended RLC filter,  
50 Hz to 2 MHz  
mVp-p  
Operating temperature range  
Operating relative humidity  
Power on Reset threshold  
Temperature ramp  
–40  
10  
+85  
90  
°C  
% RH  
V
Non-condensing  
1.5  
-8  
+8  
°C/min  
8.0  
Electrical Characteristics  
8.1  
Radio Specifications  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 5  
Detailed Radio Specifications  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Frequency Band  
As specified by [ 1 ]  
2.4000  
2.4835  
GHz  
Number of channels  
15  
5
Channel separation  
As specified by [ 1 ]  
At –20 dBc  
MHz  
MHz  
MHz  
Occupied channel bandwidth  
Channel Center Frequency  
2.7  
Where k = 11 to 25.‡  
2405 +  
5 * (k-11)  
Modulation  
IEEE 802.15.4 DSSS  
As specified by [ 1 ]  
Raw data rate  
250  
kbps  
Range*  
25 °C, 50% RH, +2 dBi  
omni-directional antenna  
Indoor†  
100  
300  
1200  
m
m
m
Outdoor†  
Free space  
*
Actual RF range performance is subject to a number of installation-specific variables including, but not restricted to  
ambient temperature, relative humidity, presence of active interference sources, line-of-sight obstacles, and near-  
presence of objects (for example, trees, walls, signage, and so on) that may induce multipath fading. As a result, actual  
performance varies.  
1 meter above ground.  
‡ Channel 26 as specified by [ 1 ] is not used..  
8.2  
DC Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 6  
DC Specifications  
Parameter  
Conditions  
Min  
Typ  
1.2  
0.8  
1.2  
Max  
Units  
µA  
Reset  
After power-on reset  
Deep Sleep  
Doze  
µA  
RAM on; ARM Cortex-M3, flash, radio,  
and peripherals off, all data and state  
retained, 32.768 kHz reference active  
µA  
Serial Flash Emulation  
Peak Operating current  
20  
mA  
System operating at 14.7 MHz  
Radio Tx  
Flash Write  
16  
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Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
Conditions  
Parameter  
Min  
Typ  
Max  
30  
Units  
mA  
at +8 dBm output power  
at 0 dBm output power  
26  
mA  
Active*  
ARM Cortex-M3, RAM, and flash on;  
radio and peripherals off  
CLK = 7.37 MHz, Vcore = 1.8 V  
Single bank write  
2.4  
3
mA  
mA  
mA  
Flash write  
Flash erase  
Radio Tx†  
Single bank page or mass erase  
2.5  
Mesh Network - CLK = 7.3728 MHz,  
AES active  
0 dBm output power  
+8 dBm output power  
5.4  
9.7  
mA  
mA  
Radio Rx†  
Mesh Network - CLK = 7.3728 MHz,  
AES active  
4.5  
mA  
Note: See section 3.0 for detailed operational definitions of states.  
* CLK = Clock frequency of CPU and peripherals.  
Current with autonomous MAC handling packet transmission and reception; CPU idle.  
8.3  
Radio Receive Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 7  
Radio Receive Characteristics  
Parameter  
Conditions  
Min  
Typ  
–93  
–95  
0
Max  
Units  
dBm  
dBm  
dBm  
dBc  
Receiver sensitivity  
PER = 1%, as specified by [ 1 ]  
PER = 50%  
Receiver sensitivity  
Saturation (maximum input level)  
Adjacent channel rejection (high  
side)  
Desired signal at -82 dBm, adjacent  
modulated channel at 5 MHz, PER =  
1%, as specified by [ 1 ]  
22  
Adjacent channel rejection (low  
side)  
Desired signal at -82 dBm, adjacent  
modulated channel at -5 MHz, PER  
= 1%, as specified by [ 1 ]  
19  
40  
36  
42  
–6  
dBc  
dBc  
dBc  
dBc  
dBc  
Alternate channel rejection (high  
side)  
Desired signal at -82 dBm, adjacent  
modulated channel at 10 MHz, PER  
= 1%, as specified by [ 1 ]  
Alternate channel rejection (low  
side)  
Desired signal at -82 dBm, adjacent  
modulated channel at -10 MHz, PER  
= 1%, as specified by [ 1 ]  
Second alternate channel  
rejection  
Desired signal at -82 dBm, adjacent  
modulated channel at +/-10 MHz,  
PER = 1%, as specified by [ 1 ]  
Co-channel rejection  
Desired signal at -82 dBm.  
Undesired signal is 802.15.4  
modulated at same frequency. PER  
= 1%, as specified by [ 1 ]  
LO feed through  
<–55  
dBm  
ppm  
ppm  
dBm  
dB  
Frequency error tolerance  
Symbol rate error tolerance  
RSSI input range  
[ 1 ] requires ±40  
±50  
±50  
–10 to –90  
RSSI accuracy  
±6  
1
RSSI resolution  
dB  
Eterna Datasheet  
Linear Technology / Dust Networks  
17  
A d v a n c e d I n f o r m a t i o n  
8.4  
Radio Transmitter Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 8  
Radio Transmitter Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Output power  
Calibrated settings  
Delivered to a 50 load,  
over temperature and voltage  
ranges  
0
+8  
dBm  
dBm  
Spurious emissions  
Conducted measurement with a  
50 single-ended load, +8 dBm  
output power. All measurements  
made with Max Hold. RF  
implementation per Eterna reference  
design.  
30 MHz to 1000 MHz  
1 GHz to 12.75 GHz  
Upper Band Edge (Peak)  
Upper Band Edge (Average)  
Lower Band Edge  
RBW = 120 kHz, VBW = 100 Hz  
RBW = 1 MHz, VBW = 3 MHz  
RBW = 1 MHz, VBW = 3 MHz  
RBW = 1 MHz, VBW = 10 Hz  
RBW = 100 kHz, VBW = 100 kHz  
<–70  
–45  
-37  
-49  
-45  
dBm  
dBm  
dBm  
dBm  
dBc  
Harmonic emissions  
Conducted measurement delivered  
to a 50 load, Resolution  
Bandwidth = 1 MHz, Video  
Bandwidth = 1 MHz, RF  
implementation per Eterna reference  
design  
dBm  
2nd Harmonic  
3rd Harmonic  
–50  
–45  
8.5  
Digital I/O Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 9  
Digital I/O Type 1  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
VIL (low-level input voltage)  
VIH (high-level input voltage)  
–0.3  
0.6  
V
V
VSUPPLY  
- 0.3†  
VSUPPLY  
+ 0.3†  
VOL (low-level output voltage)  
VOH (high-level output voltage)  
IOL(max) = 1.2 mA  
0.4  
V
V
IOH(max) = 1.8 mA  
VSUPPLY  
- 0.3†  
VSUPPLY  
+ 0.3†  
Input leakage current  
pull-up / pull-down pins disabled.  
50  
nA  
Min and Min and Max IO input levels must respect the Minimum and Maximum voltages for VSUPPLY.  
Table 10 Digital I/O Type 2  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
VIL (low-level input voltage)  
VIH (high-level input voltage)  
–0.3  
0.6  
V
V
VSUPPLY  
- 0.3†  
VSUPPLY  
+ 0.3†  
VOL (low-level output voltage)  
Low Drive  
I
I
I
OL(max) = 2.2 mA  
OH(max) = 3.2 mA  
O(max) = 4.5 mA  
0.4  
V
V
V
VOH (high-level output voltage)  
Low Drive  
VSUPPLY  
- 0.3†  
VSUPPLY  
+ 0.3†  
VOL (low-level output voltage)  
High Drive  
0.4  
18  
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Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
VOH (high-level output voltage)  
High Drive  
I
OH(max) = 6.3 mA  
VSUPPLY  
- 0.3†  
VSUPPLY  
+ 0.3†  
V
Input leakage current  
50  
nA  
Min and Min and Max IO input levels must respect the Minimum and Maximum voltages for VSUPPLY.  
8.6  
Temperature Sensor Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 11 Temperature Sensor Characteristics  
Parameter  
Conditions  
Min  
Typ  
±0.25  
±0.033  
Max  
Units  
°C  
Offset  
Temperature offset error at 25 ºC  
Slope error from -40 to +85 ºC  
Slope error  
°C/°C  
8.7  
ADC Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 12 ADC Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Variable gain amplifier  
Gain  
1
8
1
Gain error  
%
Digital to analog converter (DAC)  
Offset output  
1.8/16  
1.8  
7.2  
V
mV  
Differential non-linearity (DNL)  
Analog to digital converter (ADC)  
Full-scale, signal  
1.80  
1.8  
V
Resolution  
Offset  
Differential non-linearity (DNL)  
Integral non-linearity (INL)  
Settling time  
mV  
LSB  
LSB  
LSB  
µs  
Midscale  
±4  
1
1
10  
20  
50  
10-kOhm source impedance  
Conversion time  
Current consumption  
µs  
µA  
Analog Inputs*  
Load  
17  
1
35  
2
pF  
kOhm  
Input resistance  
* The analog inputs to the ADC can be model as a series resistor to a load capacitor. At a minimum the entire circuit,  
including the source impedance for the signal driving the analog input should be designed to settle to within ¼ LSB within  
the sampling window to match the performance of the ADC.  
8.8  
System Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 13 System Characteristics  
Parameter  
Doze to Active state delay  
Doze to Radio TX or RX  
Conditions  
Min  
Typ  
5
Max  
Units  
µs  
1.2  
4
ms  
QCCA charge to sample RF channel Start from Doze state  
Radio baud rate  
µC  
250  
kbps  
µs  
RESETn pulse width  
125  
Eterna Datasheet  
Linear Technology / Dust Networks  
19  
A d v a n c e d I n f o r m a t i o n  
8.9  
UART AC Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 14 UART Timing Values  
Parameter  
Conditions  
Min  
–2  
–1  
0
Typ  
Max  
+2  
Unit  
%
tRX_BAUD  
tTX_BAUD  
Deviation from baud rate  
Deviation from baud rate  
+1  
%
tRX_RTS_R to RX_CTS  
Assertion of UART_RX_RTSn to  
assertion of UART_RX_CTSn, or  
negation of UART_RX_RTSn to  
negation of UART_RX_CTSn  
22  
ms  
tCTS_R to RX  
Assertion of UART_RX_CTSn to start  
of byte  
0
0
0
20  
22  
22  
ms  
ms  
ms  
tEOP to RX_RTS  
tTX_RTS_T to TX_CTS  
End of packet (end of the last stop bit)  
to negation of UART_RX_RTSn  
Assertion of UART_TX_RTSn to  
assertion of UART_TX_CTSn, or  
negation of UART_TX_RTSn to  
negation of UART_TX_CTSn  
tTX_CTS_T to TX  
tEOP to TX_RTS  
Assertion of UART_TX_CTSn to start  
of byte  
0
0
2
1
bit  
period  
End of packet (end of the last stop bit)  
to negation of UART_TX_RTSn  
bit  
period  
tRX_INTERBYTE  
tTX to TX_CTS  
Receive Inter-byte delay  
100  
ms  
ms  
Start of byte to negation of  
UART_TX_CTSn  
0
tINTERPACKET  
Transmit and Receive Inter-packet  
delay (Mode 4 only)  
100  
ms  
20  
Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
Figure 16 UART Timing  
8.10  
TIMEn AC Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified. Note that the time  
pin must remain negated until the time packet has been received.  
Table 15 Timestamp Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
µs  
tstrobe  
125  
tresponse  
Resolution  
From rising edge of TIMEn  
100  
ms  
µs  
See the serial API definition for  
getParameter<time>  
+/- 1  
+/- 5  
Network-wide time accuracy  
Stable temperature environment  
µs  
Figure 17 Timestamp Timing Diagram  
8.11  
SLEEPn AC Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified. Note that the time  
pin must remain negated until the time packet has been received.  
Table 16 SLEEPn Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
20  
Unit  
ms  
s
tdoze  
From falling edge of SLEEPn  
Maximum strobe width  
Tsleep_strobe  
2
Figure 18 SLEEPn Timing Diagram  
8.12  
RADIO_INHIBIT AC Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified. Note that the time  
pin must remain negated until the time packet has been received.  
Table 17 RADIO_INHIBIT Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
20  
Unit  
ms  
s
tradio_off  
From rising edge of RADIO_INHIBIT  
Maximum strobe width  
Tradio_inhibit_strobe  
2
Eterna Datasheet  
Linear Technology / Dust Networks  
21  
A d v a n c e d I n f o r m a t i o n  
Figure 19 RADIO_INHIBIT Timing Diagram  
8.13  
FLASH AC Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C, unless otherwise specified.  
Table 18 FLASH AC Timing Values  
Parameter  
Conditions  
Min  
Typ  
Max  
21  
Unit  
µs  
t32-BIT_WORD  
tPAGE_ERASE  
tMASS_ERASE  
Writing a 32-bit word  
Page Erase  
21  
ms  
ms  
Bank Erase  
21  
8.14  
Flash Programming AC Characteristics  
The following characteristics are measured with VSUPPLY = 3.6 V at 25 °C with 10 pF load capacitance, unless otherwise  
specified.  
Table 19 SPI Slave AC Timing Values  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
tSSS  
tSSH  
IPCS_SSn setleading edge of  
IPCS_SCK  
15  
ns  
IPCS_SSn hold from trailing edge of  
IPCS_SCK  
15  
ns  
tCK  
IPCS_SCK period  
50  
15  
5
ns  
ns  
ns  
ns  
ns  
tDIS  
tDIH  
tDOV  
tOFF  
IPCS_MOSI data setup  
IPCS_MOSI data hold  
IPCS_MISO data valid  
IPCS_MISO data tri-state  
3
15  
15  
0
Figure 20 Flash Programming Slave Timing  
22  
Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
9.0  
Typical Performance Characteristics  
All TIMEn synchronization error testing was performed with the hop-1 mote inside a temperature chamber. Timing errors  
due to temperature changes and temperature differences both between the AP and this mote and between this mote and its  
descendents therefore propagated down through the network. The synchronization of the hop-3 and hop-5 motes to the AP  
was then affected by the temperature ramps even though they were at room temperature. For 2°C/min. testing the temperature  
chamber was cycled between -40°C and 85°C at this rate for 24 hours. For 8°C/min. testing, the temperature chamber was  
rapidly cycled between 85°C and about 45°C for 8 hours, followed by rapid cycling between -5°C and about 45°C for 8  
hours, and lastly, rapid cycling between -40°C and about 15°C for 8 hours..  
Eterna Datasheet  
Linear Technology / Dust Networks  
23  
A d v a n c e d I n f o r m a t i o n  
Network motes typically route through at least two parents traffic destined for the manager. The bandwidth and keep-alive  
overhead required to support network motes will be shared across all of the mote's parents. The supply current plots include a  
parameter called traffic-weighted descendants. In these graphs the term traffic-weighted descendants refers to an amount of  
activity equivalent to the number of descendants were all of the network traffic and keep-alives directed to the mote in  
question. Generally the number of descendants of a parent is more (typically 2x or more) than the number of traffic-weighted  
descendants. For example, with reference to Figure 25 mote P1 has 0.75 traffic-weighted descendants. To obtain this value  
notice that mote D1 routes half its packets through mote P1 adding 0.5 to the traffic-weighted descendant value; the other  
half of D1's traffic is routed through its other parent, P2. Mote D2 routes half its packets through mote D1 (the other half  
going through parent P3), which we know routes half its packets to mote P1, adding another 0.25 to the traffic-weighted  
descendant value for a total traffic-weighted descendant value of 0.75.  
Figure 25 Network Graph Depicting Traffic Weighted Descendant Value Calculation  
The following plots correspond to networks with 1024 slots/frame, an assumed path stability of 80%, an 80 byte packet and  
unless otherwise specified operation at 25 degrees C.  
24  
Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
10.0  
Mechanical Details  
10.1  
Mote-on-Chip  
Eterna comes in 72-lead 10 x 10 mm, 0.5 mm lead pitch QFN, as illustrated in Figure 26.  
Figure 26 Mechanical Drawing – Eterna QFN Package Outline Drawing  
10.3  
Soldering Information  
Eterna is suitable for both eutectic PbSn and RoHS-6 reflow. The maximum reflow soldering temperature is 260 ºC.  
11.0  
Regulatory and Standards Compliance  
Eterna is suitable for systems targeting compliance with worldwide radio frequency regulations: ETSI EN 300 328 and  
EN300 440 class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).  
11.1  
Compliance to Restriction of Hazardous Substances (RoHS)  
Restriction of Hazardous Substances (RoHS) is a directive that places maximum concentration limits on the use of cadmium  
(Cd), lead (Pb), hexavalent chromium (Cr+6), mercury (Hg), Polybrominated Biphenyl (PBB), and Polybrominated Diphenyl  
Ethers (PBDE). Dust Networks is committed to meeting the requirements of the European Community directive 2002/95/EC.  
This product has been specifically designed to utilize RoHS-compliant materials and to eliminate or reduce the use of  
restricted materials to comply with 2002/95/EC.  
The RoHS-compliant design features include:  
RoHS-compliant solder for solder joints  
RoHS-compliant base metal alloys  
Eterna Datasheet  
Linear Technology / Dust Networks  
25  
A d v a n c e d I n f o r m a t i o n  
RoHS-compliant precious metal plating  
RoHS-compliant cable assemblies and connector choices  
Lead-free QFN package  
Halogen-free mold compound  
RoHS-compliant and 245 °C re-flow compatible  
Note: Customers may elect to use certain types of lead-free solder alloys in accordance with the European Community  
directive 2002/95/EC. Depending on the type of solder paste chosen, a corresponding process change to optimize reflow  
temperatures may be required.  
12.0  
References  
[ 1 ]  
IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications  
for Low-Rate Wireless Personal Area Networks (LR-WPANs)  
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf  
13.0 Order Information  
LEAD FREE FINISH  
TRAY  
PART  
MARKING*  
PACKAGE  
DESCRIPTION  
TEMPERATURE  
RANGE  
LTC5800IWR-IPMA#PBF  
LTC5800HWR-IPMA#PBF  
LTC5800IWR-IPMA#PBF  
LTC5800WRQ-IPMA#PBF  
LTC5800WR  
72-Lead (10mm x  
10mm x 0.85 mm) QFN  
-40 °C to 85 °C  
LTC5800WR  
72-Lead (10mm x  
-55 °C to 105 °C  
10mm x 0.85 mm) QFN  
*The temperature grade is identified by a label on the shipping container.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
This product is only offered in trays. For more information go to: http://www.linear.com/packaging/  
26  
Linear Technology / Dust Networks  
Eterna Datasheet  
A d v a n c e d I n f o r m a t i o n  
Trademarks  
SmartMesh Industrial and Eterna are trademarks of Dust Networks, Inc. The Dust Networks logo, Dust, Dust Networks, and SmartMesh are registered  
trademarks of Dust Networks, Inc. The Linear logo is a registered trademark of Linear Technology Corporation. All third-party brand and product names  
are the trademarks of their respective owners and are used solely for informational purposes.  
ARM and Cortex are trademarks or registered trademarks of ARM Limited in the EU and other countries.  
Copyright  
This documentation is protected by United States and international copyright and other intellectual and industrial property laws. It is solely owned by  
Dust Networks, Inc. and its licensors and is distributed under a restrictive license. This product, or any portion thereof, may not be used, copied, modified,  
reverse assembled, reverse compiled, reverse engineered, distributed, or redistributed in any form by any means without the prior written authorization of  
Dust Networks, Inc.  
RESTRICTED RIGHTS: Use, duplication, or disclosure by the U.S. Government is subject to restrictions of FAR 52.227-14(g) (2)(6/87) and FAR  
52.227-19(6/87), or DFAR 252.227-7015 (b)(6/95) and DFAR 227.7202-3(a), and any and all similar and successor legislation and regulation.  
Disclaimer  
This documentation is provided “as is” without warranty of any kind, either expressed or implied, including but not limited to, the implied warranties of  
merchantability or fitness for a particular purpose.  
This documentation might include technical inaccuracies or other errors. Corrections and improvements might be incorporated in new versions of the  
documentation.  
Dust Networks does not assume any liability arising out of the application or use of any products or services and specifically disclaims any and all  
liability, including without limitation consequential or incidental damages.  
Dust Networks products are not designed for use in life support appliances, devices, or other systems where malfunction can reasonably be expected to  
result in significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Dust Networks customers using or selling these  
products for use in such applications do so at their own risk and agree to fully indemnify and hold Dust Networks and its officers, employees,  
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Dust Networks was  
negligent regarding the design or manufacture of its products.  
Dust Networks reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its products or services at any  
time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should  
verify that such information is current and complete. All products are sold subject to Dust Network's terms and conditions of sale supplied at the time of  
order acknowledgment or sale.  
Dust Networks does not warrant or represent that any license, either express or implied, is granted under any Dust Networks patent right, copyright, mask  
work right, or other Dust Networks intellectual property right relating to any combination, machine, or process in which Dust Networks products or  
services are used. Information published by Dust Networks regarding third-party products or services does not constitute a license from Dust Networks to  
use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or  
other intellectual property of the third party, or a license from Dust Networks under the patents or other intellectual property of Dust Networks.  
Dust Networks, Inc is a wholly owned subsidiary of Linear Technology Corporation.  
© Dust Networks, Inc. 2012. All Rights Reserved.  
Eterna Datasheet  
Linear Technology / Dust Networks  
27  
A d v a n c e d I n f o r m a t i o n  
Last Revised:  
July 26, 2012  
Document Status  
Product Status  
Definition  
Advanced Information  
Planned or under development This datasheet contains the design specifications for product  
development. Dust Networks reserves the right to change  
specifications in any manner without notice.  
Preliminary  
Engineering samples and  
pre-production prototypes  
This datasheet contains preliminary data; supplementary data will  
be published at a later time. Dust Networks reserves the right to  
make changes at any time without notice in order to improve  
design and supply the best possible product. The product is not  
fully qualified at this point.  
No Identification Noted Full production  
This datasheet contains the final specifications. Dust Networks  
reserves the right to make changes at any time without notice in  
order to improve design and supply the best possible product.  
Obsolete  
Not in production  
This datasheet contains specifications for a product that has been  
discontinued by Dust Networks. The datasheet is printed for  
reference information only.  
28  
Linear Technology / Dust Networks  
Eterna Datasheet  

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