LTM4609IVPBF [Linear]
36VIN, 34VOUT High Effi ciency Buck-Boost DC/DC μModule; 36VIN , 34VOUT高艾菲效率降压 - 升压型DC / DC微型模块型号: | LTM4609IVPBF |
厂家: | Linear |
描述: | 36VIN, 34VOUT High Effi ciency Buck-Boost DC/DC μModule |
文件: | 总24页 (文件大小:293K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTM4609
36V , 34V High Efficiency
IN
OUT
Buck-Boost DC/DC µModule
FEATURES
DESCRIPTION
The LTM®4609 is a high efficiency switching mode buck-
boost power supply. Included in the package are the
switchingcontroller,powerFETsandsupportcomponents.
Operating over an input voltage range of 4.5V to 36V, the
LTM4609 supports an output voltage range of 0.8V to
34V, set by a resistor. This high efficiency design delivers
up to 4A continuous current in boost mode (10A in buck
mode). Only the inductor, sense resistor, bulk input and
output capacitors are needed to finish the design.
n
Single Inductor Architecture Allows V Above,
IN
Below or Equal to V
OUT
n
Wide V Range: 4.5V to 36V
IN
OUT
n
Wide V
OUT
Range: 0.8V to 34V
n
n
n
n
n
n
n
n
n
I
: 4A DC (10A DC in Buck Mode)
Up to 98% Efficiency
Current Mode Control
Power Good Output Signal
Phase-Lockable Fixed Frequency: 200kHz to 400kHz
Ultrafast Transient Response
Current Foldback Protection
Output Overvoltage Protection
Small, Low Profile Surface Mount LGA Package
(15mm × 15mm × 2.8mm)
Thelowprofilepackageenablesutilizationofunusedspace
on the bottom of PC boards for high density point of load
regulation. The high switching frequency and current
mode architecture enable a very fast transient response
to line and load changes without sacrificing stability. The
LTM4609 can be frequency synchronized with an external
clock to reduce undesirable frequency harmonics.
APPLICATIONS
n
Faultprotectionfeaturesincludeovervoltageandfoldback
current protection. The DC/DC μModule® is offered in a
small thermally enhanced 15mm × 15mm × 2.8mm LGA
package. The LTM4609 is Pb-free and RoHS compliant.
Telecom, Servers and Networking Equipment
n
Industrial and Automotive Equipment
n
High Power Battery-Operated Devices
L, LT, LTC, LTM, Linear Technology, the Linear logo and μModule are registered trademarks of
Linear Technology Corporation. All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
Efficiency and Power Loss
vs Input Voltage
30V/2A Buck-Boost DC/DC μModule with 5V to 36V Input
V
IN
99
98
97
96
95
94
93
92
91
6
5
4
3
2
1
0
CLOCK SYNC
6.5V TO 36V
10μF
50V
V
30V
2A
OUT
V
IN
PLLIN
V
OUT
+
10μF
50V
330μF
50V
FCB
ON/OFF
RUN
LTM4609
5.6μH
SW1
SW2
R
SENSE
+
SENSE
R2
0.1μF
15mΩ
s2
–
SS
SENSE
EFFICIENCY
POWER LOSS
SGND
V
FB
PGND
2.74k
24
(V)
28
36
8
12
16
20
V
32
IN
4609 TA01a
4609 TA01b
4609fa
1
LTM4609
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1)
(See Table 6 Pin Assignment)
V ............................................................. –0.3V to 36V
OUT
IN
V
TOP VIEW
BANK 2
............................................................. 0.8V to 36V
INTV , EXTV , RUN, SS, PGOOD.............. –0.3V to 7V
CC
CC
M
L
SW1, SW2 .................................................... –5V to 36V
V , COMP................................................ –0.3V to 2.4V
FB
BANK 4
K
BANK 1
BANK 3
FCB, STBYMD....................................... –0.3V to INTV
CC
J
PLLIN........................................................ –0.3V to 5.5V
PLLFLTR.................................................... –0.3V to 2.7V
Operating Temperature Range
H
G
BANK 5
F
(Note 2)....................................................–40°C to 85°C
Junction Temperature ........................................... 125°C
Storage Temperature Range...................–55°C to 125°C
Solder Temperature (Note 3)................................. 245°C
E
D
C
BANK 6
B
A
1
2
3
4
5
6
7
8
9
10
11
12
LGA PACKAGE
141-LEAD (15mm s 15mm s 2.8mm)
T
JMAX
= 125°C, θ = 4°C/W, WEIGHT = 1.5g
JP
ORDER INFORMATION
LEAD FREE FINISH
LTM4609EV#PBF
LTM4609IV#PBF
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTM4609V
141-Lead (15mm × 15mm × 2.8mm) LGA
141-Lead (15mm × 15mm × 2.8mm) LGA
–40°C to 85°C
–40°C to 85°C
LTM4609V
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
This product is only offered in trays. For more information go to: http://www.linear.com/packaging/
The l denotes the specifications which apply over the –40°C to 85°C
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C, VIN = 12V. Per typical application (front page) configuration.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Input Specifications
l
l
V
V
Input DC Voltage
4.5
36
4
V
V
IN(DC)
IN(UVLO)
Q(VIN)
Undervoltage Lockout Threshold
V
Falling
3.4
IN
I
Input Supply Bias Current
Normal
2.8
1.6
35
mA
mA
μA
Standby
Shutdown Supply Current
V
RUN
V
RUN
= 0V, V
= 0V, V
> 2V
= Open
STBYMD
STBYMD
60
4609fa
2
LTM4609
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the –40°C to 85°C
temperature range, otherwise specifications are at TA = 25°C, VIN = 12V. Per typical application (front page) configuration.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Output Specifications
I
Output Continuous Current Range
(See Output Current Derating Curves
V
V
= 32V, V = 12V
OUT
10
4
A
A
OUTDC
IN
IN
= 6V, V
= 12V
OUT
for Different V , V
and T )
A
IN OUT
Reference Voltage Line Regulation
Accuracy
V
IN
= 4.5V to 36V, V
= 1.2V (Note 4)
0.002
0.02
%/V
ΔV /V
FB FB(NOM)
COMP
l
l
Load Regulation Accuracy
V
COMP
V
COMP
= 1.2V to 0.7V
= 1.2V to 1.8V (Note 4)
0.15
–0.15
0.5
–0.5
%
%
ΔV /V
FB FB(LOAD)
Switch Section
M1 t
M1 t
M3 t
M3 t
Turn-On Time (Note 5)
Turn-Off Time
Drain to Source Voltage V = 12V,
50
40
25
20
20
20
50
50
50
50
220
220
10
14
14
14
ns
ns
r
f
r
f
DS
Bias Current I = 10mA
SW
Drain to Source Voltage V = 12V,
DS
Bias Current I = 10mA
SW
Turn-On Time
Drain to Source Voltage V = 12V,
ns
DS
Bias Current I = 10mA
SW
Turn-Off Time
Drain to Source Voltage V = 12V,
ns
DS
Bias Current I = 10mA
SW
M2, M4 t
M2, M4 t
Turn-On Time
Drain to Source Voltage V = 12V,
ns
r
DS
Bias Current I = 10mA
SW
Turn-Off Time
Drain to Source Voltage V = 12V,
ns
f
DS
Bias Current I = 10mA
SW
t
1d
t
2d
t
3d
t
4d
M1 Off to M2 On Delay (Note 5)
M2 Off to M1 On Delay
M3 Off to M4 On Delay
M4 Off to M3 On Delay
M2 Off to M4 On Delay
M4 Off to M2 On Delay
Drain to Source Voltage V = 12V,
ns
DS
Bias Current I = 10mA
SW
Drain to Source Voltage V = 12V,
ns
DS
Bias Current I = 10mA
SW
Drain to Source Voltage V = 12V,
ns
DS
Bias Current I = 10mA
SW
Drain to Source Voltage V = 12V,
ns
DS
Bias Current I = 10mA
SW
Mode Transition 1
Mode Transition 2
Drain to Source Voltage V = 12V,
ns
DS
Bias Current I = 10mA
SW
Drain to Source Voltage V = 12V,
ns
DS
Bias Current I = 10mA
SW
M1 R
M2 R
M3 R
M4 R
Static Drain-to-Source
On-Resistance
Bias Current I = 3A
mΩ
mΩ
mΩ
mΩ
DS(ON)
DS(ON)
DS(ON)
DS(ON)
SW
Static Drain-to-Source
On-Resistance
Bias Current I = 3A
20
20
20
SW
Static Drain-to-Source
On-Resistance
Bias Current I = 3A
SW
Static Drain-to-Source
On-Resistance
Bias Current I = 3A
SW
Oscillator and Phase-Locked Loop
f
f
f
Nominal Frequency
V
V
V
= 1.2V
= 0V
260
170
340
300
200
400
50
330
220
440
kHz
kHz
kHz
kΩ
NOM
LOW
HIGH
PLLFLTR
PLLFLTR
PLLFLTR
Lowest Frequency
Highest Frequency
= 2.4V
R
PLLIN Input Resistance
Phase Detector Output Current
PLLIN
I
f
f
< f
> f
–15
15
μA
μA
PLLFLTR
PLLIN
PLLIN
OSC
OSC
4609fa
3
LTM4609
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the –40°C to 85°C
temperature range, otherwise specifications are at TA = 25°C, VIN = 12V. Per typical application (front page) configuration.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Control Section
l
V
V
Feedback Reference Voltage
RUN Pin ON/OFF Threshold
Soft-Start Charging Current
Start-Up Threshold
V
= 1.2V
0.792
1
0.8
1.6
0.808
2.2
V
V
FB
COMP
RUN
I
SS
V
V
V
= 2.2V
1
1.7
μA
V
RUN
V
V
V
Rising
0.4
0.7
STBYMD(START)
STBYMD(KA)
FCB
STBYMD
STBYMD
Keep-Active Power On Threshold
Forced Continuous Threshold
Forced Continuous Pin Current
Rising, V
= 0V
1.25
0.8
V
RUN
0.76
–0.3
0.84
–0.1
5.5
V
I
V
= 0.85V
FCB
–0.2
5.3
μA
V
FCB
V
Burst Inhibit (Constant Frequency)
Threshold
Measured at FCB Pin
BURST
DF
DF
Maximum Duty Factor
Maximum Duty Factor
% Switch M4 On
% Switch M1 On
99
99
%
%
ns
(BOOST, MAX)
(BUCK, MAX)
t
Minimum On-Time for Synchronous Switch M1 (Note 6)
Switch in Buck Operation
200
250
ON(MIN, BUCK)
RFBHI
Resistor Between V
and V Pins
99.5
5.7
100
100.5
kΩ
OUT
FB
Internal V Regulator
CC
l
l
INTV
Internal V Voltage
V
I
> 7V, V = 5V
EXTVCC
6
6.3
2
V
%
CC
CC
IN
Internal V Load Regulation
= 0mA to 20mA, V
= 5V
0.3
5.6
300
60
ΔV /V
LDO LDO
CC
CC
CC
EXTVCC
V
EXTV Switchover Voltage
I
= 20mA, V
Rising
5.4
V
EXTVCC
CC
EXTVCC
EXTVCC
EXTV Switchover Hysteresis
mV
mV
ΔV
ΔV
CC
EXTVCC(HYS)
EXTV Switch Drop Voltage
I
CC
= 20mA, V
= 6V
150
CC
EXTVCC
Current Sensing Section
l
l
V
Maximum Current Sense Threshold Boost Mode
Buck Mode
160
–130
190
–150
mV
mV
SENSE(MAX)
–95
V
Minimum Current Sense Threshold Discontinuous Mode
–6
mV
μA
SENSE(MIN, BUCK)
SENSE
–
+
I
Sense Pins Total Source Current
V
SENSE
= V
= 0V
SENSE
–380
PGOOD
PGOOD Upper Threshold
PGOOD Lower Threshold
PGOOD Hysteresis
V
V
V
Rising
Falling
5.5
7.5
–7.5
2.5
10
%
%
%
V
ΔV
FB
FBH
–5.5
–10
ΔV
FB
FBL
Returning
ΔV
FB
FB(HYS)
V
PGL
PGOOD Low Voltage
I
= 2mA
= 5V
0.2
0.3
1
PGOOD
I
PGOOD Leakage Current
V
μA
PGOOD
PGOOD
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 3: See Application Note 100.
Note 4: The LTM4609 is tested in a feedback loop that servos V
to a
COMP
specified voltage and measures the resultant V
.
FB
Note 5: Turn-on and turn-off time are measured using 10% and 90%
Note 2: The LTM4609E is guaranteed to meet performance specifications
from 0°C to 85°C. Specifications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls. The LTM4609I is guaranteed over the full
–40°C to 85°C temperature range.
levels. Transition delay time is measured using 50% levels.
Note 6: 100% test at wafer level only.
4609fa
4
LTM4609
TYPICAL PERFORMANCE CHARACTERISTICS (Refer to Figure 18)
Efficiency vs Load Current
6VIN to 12VOUT
Efficiency vs Load Current
12VIN to 12VOUT
Efficiency vs Load Current
32VIN to 12VOUT
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
SKIP CYCLE
DCM
CCM
BURST
DCM
BURST
DCM
CCM
CCM
0.01
0.1
1
10
100
0.01
0.1
1
10
0.01
0.1
1
10
LOAD CURRENT (A)
LOAD CURRENT (A)
LOAD CURRENT (A)
4609 G03
4609 G01
4609 G02
Efficiency vs Load Current
5.6μH Inductor
Efficiency vs Load Current
8μH Inductor
Efficiency vs Load Current
3.3μH Inductor
100
99
98
97
96
95
94
93
92
91
90
100
99
98
97
96
95
94
93
100
95
90
85
80
75
70
28V to 20V
30V to 30V
12V TO 5V
IN
OUT
OUT
OUT
IN
OUT
OUT
OUT
IN
OUT
OUT
OUT
32V to 20V
32V to 30V
24V TO 5V
IN
IN
IN
36V to 20V
IN
36V to 30V
IN
32V TO 5V
IN
0
1
2
3
4
5
6
7
8
3
6
0
1
2
4
5
0
4
5
6
7
8
9
10
1
2
3
LOAD CURRENT (A)
LOAD CURRENT (A)
LOAD CURRENT (A)
4609 G05
4609 G06
4609 G04
Transient Response from
12VIN to 12VOUT
Transient Response from
6VIN to 12VOUT
Efficiency vs Load Current
100
95
90
85
80
75
70
I
I
OUT
OUT
2A/DIV
2A/DIV
V
V
OUT
OUT
200mV/DIV
200mV/DIV
4609 G09
4609 G08
200μs/DIV
200μs/DIV
LOAD STEP: 0A TO 3A AT CCM
LOAD STEP: 0A TO 3A AT CCM
5V to 16V
IN
OUTPUT CAPS: 4x 22μF CERAMIC CAPS AND
2x 180μF ELECTROLYTIC CAPS
OUT
OUT
OUT
OUTPUT CAPS: 4x 22μF CERAMIC CAPS AND
2x 180μF ELECTROLYTIC CAPS
5V to 24V
IN
5V to 30V
IN
2x 15mΩ SENSING RESISTORS
2x 15mΩ SENSING RESISTORS
0
0.5
1
1.5
2
2.5
3
LOAD CURRENT (A)
4609 G07
4609fa
5
LTM4609
TYPICAL PERFORMANCE CHARACTERISTICS
Transient Response from
32VIN to 12VOUT
Start-Up with 6VIN to 12VOUT at
OUT = 4A
Start-Up with 32VIN to 12VOUT at
OUT = 5A
I
I
I
I
L
L
5A/DIV
5A/DIV
I
OUT
2A/DIV
I
I
IN
IN
2A/DIV
5A/DIV
V
OUT
V
100mV/DIV
V
OUT
OUT
10V/DIV
10V/DIV
4609 G12
4609 G10
4609 G11
10ms/DIV
0.1μF SOFT-START CAP
200μs/DIV
50ms/DIV
0.1μF SOFT-START CAP
LOAD STEP: 0A TO 5A AT CCM
OUTPUT CAPS: 4x 22μF CERAMIC CAPS AND
2x 180μF ELECTROLYTIC CAPS
OUTPUT CAPS: 4x 22μF CERAMIC CAPS AND
2x 180μF ELECTROLYTIC CAPS
OUTPUT CAPS: 4x 22μF CERAMIC CAPS AND
2x 180μF ELECTROLYTIC CAPS
2x 12mΩ SENSING RESISTORS
2x 12mΩ SENSING RESISTORS
2x 12mΩ SENSING RESISTORS
Short Circuit with 32VIN to 12VOUT
at IOUT = 5A
Short Circuit with 12VIN to 34VOUT
at IOUT = 2A
Short Circuit with 6VIN to 12VOUT
at IOUT = 4A
V
OUT
10V/DIV
V
OUT
5V/DIV
I
IN
2A/DIV
V
OUT
5V/DIV
I
IN
I
IN
5A/DIV
5A/DIV
4609 G14
4607 G15
4609 G13
50μs/DIV
20μs/DIV
50μs/DIV
OUTPUT CAPS: 4x 22μF CERAMIC CAPS AND
2x 180μF ELECTROLYTIC CAPS
2x 12mΩ SENSING RESISTORS
OUTPUT CAPS: 2x 10μF 50V CERAMIC CAPS AND
2x 47μF 50V ELECTROLYTIC CAPS
2x 15mΩ SENSING RESISTORS
OUTPUT CAPS: 4x 22μF CERAMIC CAPS AND
2x 180μF ELECTROLYTIC CAPS
2x 12mΩ SENSING RESISTORS
4609fa
6
LTM4609
PIN FUNCTIONS
V (Bank 1): Power Input Pins. Apply input voltage be-
STBYMD(PinA10):LDOControlPin.Determineswhether
theinternalLDOremainsactivewhenthecontrollerisshut
down. See Operations section for details. If the STBYMD
pin is pulled to ground, the SS pin is internally pulled to
ground to disable start-up and thereby providing a single
control pin for turning off the controller. An internal de-
coupling capacitor is tied to this pin.
IN
tween these pins and PGND pins. Recommend placing
input decoupling capacitance directly between V pins
IN
and PGND pins.
V
(Bank 5): Power Output Pins. Apply output load
OUT
between these pins and PGND pins. Recommend placing
outputdecouplingcapacitancedirectlybetweenthesepins
and PGND pins.
V
(Pin B6): The Negative Input of the Error Amplifier.
FB
Internally, this pin is connected to V
with a 100k preci-
OUT
PGND (Bank 6): Power Ground Pins for Both Input and
Output Returns.
sionresistor.Differentoutputvoltagescanbeprogrammed
with an additional resistor between V and SGND pins.
FB
SW1, SW2 (Bank 4, Bank 2): Switch Nodes. The power
inductor is connected between SW1 and SW2.
See the Applications Information section.
FCB(PinA9):ForcedContinuousControlInput.Thevoltage
applied to this pin sets the operating mode of the module.
When the applied voltage is less than 0.8V, the forced
continuous current mode is active in boost operation and
the skip cycle mode is active in buck operation. When the
R
(Bank3):SensingResistorPin. Thesensingresis-
SENSE
tor is connected from this pin to PGND.
+
SENSE (Pin A4): Positive Input to the Current Sense and
Reverse Current Detect Comparators.
pinistiedtoINTV ,theconstantfrequencydiscontinuous
CC
–
SENSE (Pin A5): Negative Input to the Current Sense and
current mode is active in buck or boost operation. See the
Reverse Current Detect Comparators.
Applications Information section.
EXTV (PinF6):ExternalV Input.WhenEXTV exceeds
CC
CC
CC
SGND (Pin A7): Signal Ground Pin. This pin connects to
5.7V, an internal switch connects this pin to INTV and
CC
PGND at output capacitor point.
shutsdowntheinternalregulatorsothatthecontrollerand
COMP (Pin B7): Current Control Threshold and Error
Amplifier Compensation Point. The current comparator
threshold increases with this control voltage. The voltage
ranges from 0V to 2.4V.
gate drive power is drawn from EXTV . Do not exceed
CC
7V at this pin and ensure that EXTV < V
CC
IN
INTV (Pin F5): Internal 6V Regulator Output. This pin is
CC
for additional decoupling of the 6V internal regulator.
PGOOD (Pin B5): Output Voltage Power Good Indicator.
Open drain logic output that is pulled to ground when
the output voltage is not within 7.5% of the regulation
point.
PLLIN (Pin B9): External Clock Synchronization Input
to the Phase Detector. This pin is internally terminated
to SGND with a 50k resistor. The phase-locked loop will
force the rising bottom gate signal of the controller to be
synchronized with the rising edge of PLLIN signal.
RUN (Pin A8): Run Control Pin. A voltage below 1.6V will
turn off the module. There is a 100k resistor between the
RUN pin and SGND in the module. Do not apply more than
6V to this pin. See the Applications Information section.
PLLFLTR (Pin B8): The lowpass filter of the phase-locked
loop is tied to this pin. This pin can also be used to set the
frequencyoftheinternaloscillatorwithanACorDCvoltage.
See the Applications Information section for details.
SS (Pin A6): Soft-Start Pin. Soft-start reduces the input
surgecurrentfromthepowersourcebygraduallyincreas-
ing the controller’s current limit.
4609fa
7
LTM4609
SIMPLIFIED BLOCK DIAGRAM
V
IN
4.5V TO 36V
EXTV
CC
C1
C
IN
M1
M2
SW2
INTV
CC
PGOOD
RUN
L
SW1
ON/OFF
V
OUT
100k
12V
4A
STBYMD
COMP
CO1
M3
M4
C
OUT
0.1μF
100k
R
FB
V
FB
7.15k
CONTROLLER
R
SENSE
INT
COMP
+
SS
SENSE
SS
0.1μF
PLLIN
PLLFLTR
INT
FILTER
R
SENSE
–
SENSE
INT
FILTER
PGND
FCB
1000pF
SGND
TO PGND PLANE AS
SHOWN IN FIGURE 15
4609 BD
Figure 1. Simplified LTM4609 Block Diagram
DECOUPLING REQUIREMENTS T = 25°C. Use Figure 1 configuration.
A
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
C
External Input Capacitor Requirement
I
= 4A
10
μF
IN
OUT
(V = 4.5V to 36V, V
= 12V)
IN
OUT
C
OUT
External Output Capacitor Requirement
(V = 4.5V to 36V, V = 12V)
I
= 4A
200
300
μF
OUT
IN
OUT
4609fa
8
LTM4609
OPERATION
Power Module Description
frequency can be synchronized by the input clock signal
from the PLLIN pin. The typical switching frequency is
400kHz.
The LTM4609 is a non-isolated buck-boost DC/DC power
supply. It can deliver a wide range output voltage from
0.8V to 34V over a wide input range from 4.5V to 36V,
by only adding the sensing resistor, inductor and some
external input and output capacitors. It provides precisely
regulated output voltage programmable via one external
resistor. The typical application schematic is shown in
Figure 18.
The Burst Mode® and skip-cycle mode operations can
be enabled at light loads in the LTM4609 to improve its
efficiency, while the forced continuous mode and discon-
tinuous mode operations are used for constant frequency
applications. Foldback current limiting is activated in an
overcurrent condition as V drops. Internal overvoltage
FB
andundervoltagecomparatorspulltheopen-drainPGOOD
output low if the output feedback voltage exits the 7.5%
window around the regulation point. Pulling the RUN pin
below 1.6V forces the controller into its shutdown state.
The LTM4609 has an integrated current mode buck-boost
control, ultralow R
FETs with fast switching speed
DS(ON)
andintegratedSchottkydiodes.Withcurrentmodecontrol
and internal feedback loop compensation, the LTM4609
modulehassufficientstabilitymarginsandgoodtransient
performance under a wide range of operating conditions
and with a wide range of output capacitors. The frequency
of LTM4609 can be operated from 200kHz to 400kHz by
setting the voltage on the PLLFLTR pin. Alternatively, its
IfanexternalbiassupplyisappliedontheEXTV pin,then
CC
an efficiency improvement will occur due to the reduced
powerlossintheinternallinearregulator.Thisisespecially
true at the higher input voltage range.
Burst Mode is a registered trademark of Linear Technology Corporation.
APPLICATIONS INFORMATION
The typical LTM4609 application circuit is shown in
Figure 18. External component selection is primarily
determined by the maximum load current and output
voltage. Refer to Table 3 for specific external capacitor
requirements for a particular application.
Operation Frequency Selection
The LTM4609 uses current mode control architecture at
constant switching frequency, which is determined by the
internal oscillator’s capacitor. This internal capacitor is
charged by a fixed current plus an additional current that
is proportional to the voltage applied to the PLLFLTR pin.
The PLLFLTR pin can be grounded to lower the frequency
to 200kHz or tied to 2.4V to yield approximately 400kHz.
When PLLIN is left open, the PLLFLTR pin goes low, forc-
ing the oscillator to its minimum frequency.
Output Voltage Programming
The PWM controller has an internal 0.8V 1% reference
voltage. As shown in the Block Diagram, a 100k 0.5%
internal feedback resistor connects V
and V pins
FB
OUT
FB
together. Adding a resistor R from the V pin to the
FB
A graph for the voltage applied to the PLLFLTR pin vs
frequency is given in Figure 2. As the operating frequency
increases, the gate charge losses will be higher, thus the
efficiency is low. The maximum switching frequency is
approximately 400kHz.
SGND pin programs the output voltage:
100k +RFB
VOUT = 0.8V •
RFB
Table 1. RFB Resistor (0.5%) vs Output Voltage
V
0.8V 1.5V 2.5V
Open 115k 47.5k 32.4k 19.1k 15.4k
10V 12V 15V 16V 20V 24V
8.66k 7.15k 5.62k 5.23k 4.12k 3.4k 2.74k 2.37k
3.3V
5V
6V
8V
11k 9.76k
30V 34V
9V
OUT
FREQUENCY SYNCHRONIZATION
R
FB
The LTM4609 can also be synchronized to an external
sourceviathePLLINpininsteadofadjustingthevoltageon
the PLLFLTR pin directly. The power module has a phase-
V
OUT
R
FB
4609fa
9
LTM4609
APPLICATIONS INFORMATION
locked loop comprised of an internal voltage controlled
oscillator and a phase detector. This allows turning on the
internal top MOSFET for locking to the rising edge of the
external clock. A pulse detection circuit is used to detect
a clock on the PLLIN pin to turn on the phase-lock loop.
The input pulse width of the clock has to be at least 400ns,
and 2V in amplitude. The synchronized frequency ranges
from 200kHz to 400kHz, corresponding to a DC voltage
input from 0V to 2.4V at PLLFLTR. During the start-up of
the regulator, the phase-lock loop function is disabled.
lower than the preset minimum output current level. The
MOSFETs will turn on for several cycles, followed by a
variable “sleep” interval depending upon the load current.
During buck operation, skip-cycle mode sets a minimum
positive inductor current level. In this mode, some cycles
will be skipped when the output load current drops below
1% of the maximum designed load in order to maintain
the output voltage.
When the FCB pin voltage is tied to the INTV pin, the
CC
controllerentersconstantfrequencydiscontinuouscurrent
mode (DCM). For boost operation, if the output voltage is
highenough,thecontrollercanenterthecontinuouscurrent
buck mode for one cycle to discharge inductor current. In
the following cycle, the controller will resume DCM boost
operation. for buck operation, constant frequency discon-
tinuous current mode is turned on if the preset minimum
negative inductor current level is reached. At very light
loads, this constant frequency operation is not as efficient
as Burst Mode operation or skip-cycle, but does provide
low noise, constant frequency operation.
450
400
350
300
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
PLLFLTR PIN VOLTAGE (V)
Input Capacitors
4609 F02
In boost mode, since the input current is continuous, only
minimuminputcapacitorsarerequired.However,theinput
current is discontinuous in buck mode. So the selection
Figure 2. Frequency vs PLLFLTR Pin Voltage
Low Current Operation
of input capacitor C is driven by the need of filtering the
Toimprovetheefficiencyatlowcurrentoperation,LTM4609
provides three modes for both buck and boost operations
by accepting a logic input on the FCB pin. Table 2 shows
the different operation modes.
IN
input square wave current.
For a buck converter, the switching duty-cycle can be
estimated as:
Table 2. Different Operating Modes
VOUT
D=
FCB PIN
0V to 0.75V
0.85V to 5V
>5.3V
BUCK
BOOST
V
IN
Force Continuous Mode
Skip-Cycle Mode
Force Continuous Mode
Burst Mode Operation
DCM with Constant Freq
Without considering the inductor current ripple, the RMS
current of the input capacitor can be estimated as:
DCM with Constant Freq
IOUT(MAX)
When the FCB pin voltage is lower than 0.8V, the controller
behavesasacontinuous,PWMcurrentmodesynchronous
switching regulator. When the FCB pin voltage is below
ICIN(RMS)
=
• D•(1−D)
η
In the above equation, η is the estimated efficiency of the
V
– 1V, but greater than 0.8V, the controller enters
INTVCC
power module. C can be a switcher-rated electrolytic
IN
Burst Mode operation in boost operation or enters skip-
cycle mode in buck operation. During boost operation,
Burst Mode operation is activated if the load current is
aluminum capacitor, OS-CON capacitor or high volume
ceramic capacitors. Note the capacitor ripple current rat-
4609fa
10
LTM4609
APPLICATIONS INFORMATION
ings are often based on temperature and hours of life. This
makes it advisable to properly derate the input capacitor,
or choose a capacitor rated at a higher temperature than
required. Always contact the capacitor manufacturer for
derating requirements.
ripple ΔI is typically set to 20% to 40% of the maximum
L
inductor current. In the inductor design, the worst cases
in continuous mode are considered as follows:
V2 • V
− V
IN
(
)
IN
OUT(MAX)
LBOOST
≥
V2OUT(MAX) • ƒ •IOUT(MAX) •Ripple%
Output Capacitors
In boost mode, the discontinuous current shifts from the
VOUT • VIN(MAX) − V
(
)
OUT
LBUCK
where:
≥
input to the output, so the output capacitor C
must be
OUT
V
IN(MAX) • ƒ •IOUT(MAX) •Ripple%
capable of reducing the output voltage ripple.
For boost and buck modes, the steady ripple due to charg-
ing and discharging the bulk capacitance is given by:
ƒ is operating frequency, Hz
IOUT(MAX) • V
− V
IN(MIN)
(
)
OUT
Ripple% is allowable inductor current ripple, %
VRIPPLE,BOOST
=
COUT • VOUT • ƒ
V
V
V
is maximum output voltage, V
OUT(MAX)
is maximum input voltage, V
IN(MAX)
VOUT • VIN(MAX) − V
(
)
OUT
VRIPPLE,BUCK
=
is output voltage, V
8 •L •COUT • VIN(MAX) • ƒ2
OUT
I
is maximum output load current, A
OUT(MAX)
The steady ripple due to the voltage drop across the ESR
(effective series resistance) is given by:
The inductor should have low DC resistance to reduce the
2
I R losses, and must be able to handle the peak inductor
current without saturation. To minimize radiated noise,
use a toroid, pot core or shielded bobbin inductor. Please
refer to Table 3 for the recommended inductors for dif-
ferent cases.
VESR,BUCK = ΔIL(MAX) •ESR
VESR,BOOST =IL(MAX) •ESR
The LTM4609 is designed for low output voltage ripple.
R
SENSE
Selection and Maximum Output Current
The bulk output capacitors defined as C
are chosen
OUT
withlowenoughESRtomeettheoutputvoltagerippleand
transient requirements. C can be the low ESR tantalum
R
is chosen based on the required inductor current.
SENSE
Since the maximum inductor valley current at buck mode
is much lower than the inductor peak current at boost
mode, different sensing resistors are suggested to use
in buck and boost modes.
OUT
capacitor, the low ESR polymer capacitor or the ceramic
capacitor. Multiple capacitors can be placed in parallel to
meettheESRandRMScurrenthandlingrequirements.The
typicalcapacitanceis300μF.Additionaloutputfilteringmay
be required by the system designer, if further reduction of
outputrippleordynamictransientspikeisrequired.Table3
shows a matrix of different output voltages and output
capacitors to minimize the voltage droop and overshoot
at a current transient.
The current comparator threshold sets the peak of the
inductorcurrentinboostmodeandthemaximuminductor
valley current in buck mode. In boost mode, the allowed
maximum average load current is:
⎛
⎞
⎟
ΔIL
V
IN
160mV
IOUT(MAX,BOOST)
=
−
•
⎜
R
2
VOUT
⎝
⎠
SENSE
Inductor Selection
The inductor is chiefly decided by the required ripple cur-
rent and the operating frequency. The inductor current
where ΔI is peak-to-peak inductor ripple current.
L
4609fa
11
LTM4609
APPLICATIONS INFORMATION
In buck mode, the allowed maximum average load cur-
rent is:
The RUN pin can also be used as an undervoltage lockout
(UVLO) function by connecting a resistor from the input
supply to the RUN pin. The equation:
ΔIL
2
130mV
RSENSE
IOUT(MAX,BUCK)
=
+
R1+R2
V _UVLO=
•1.6V
R2
The maximum current sensing R
mode is:
value for the boost
SENSE
Power Good
RSENSE(MAX,BOOST)
=
The PGOOD pin is an open drain pin that can be used to
monitor valid output voltage regulation. This pin monitors
a 7.5% window around the regulation point, and tracks
with margining.
2•160mV • V
2•IOUT(MAX,BOOST) • VOUT + ΔIL • V
IN
IN
The maximum current sensing R
mode is:
value for the buck
SENSE
COMP Pin
This pin is the external compensation pin. The module
has already been internally compensated for most output
voltages. A spice model will be provided for other control
loop optimization.
2•130mV
RSENSE(MAX,BUCK)
=
2•IOUT(MAX,BUCK) – ΔIL
A20%to30%marginonthecalculatedsensingresistoris
usually recommended. Please refer to Table 3 for the rec-
ommended sensing resistors for different applications.
Fault Conditions: Current Limit and Overcurrent
Foldback
LTM4609 has a current mode controller, which inherently
limitsthecycle-by-cycleinductorcurrentnotonlyinsteady
state operation, but also in transient. Refer to Table 3.
Soft-Start
The SS pin provides a means to soft-start the regulator.
A capacitor on this pin will program the ramp rate of the
output voltage. A 1.7μA current source will charge up the
external soft-start capacitor. This will control the ramp of
the internal reference and the output voltage. The total
soft-start time can be calculated as:
To further limit current in the event of an overload condi-
tion,theLTM4609providesfoldbackcurrentlimiting.Ifthe
output voltage falls by more than 70%, then the maximum
output current is progressively lowered to about 30% of
its full current limit value for boost mode and about 40%
for buck mode.
2.4V •CSS
1.7µA
tSOFTSTART
=
Standby Mode (STBYMD)
When the RUN pin falls below 1.6V, then soft-start pin is
resettoallowforpropersoft-startcontrolwhentheregula-
torisenabledagain.Currentfoldbackandforcecontinuous
mode are disabled during the soft-start process. The soft-
start function can also be used to control the output ramp
up time, so that another regulator can be easily tracked.
Do not apply more than 6V to the SS pin.
Thestandbymode(STBYMD)pinprovidesseveralchoices
for start-up and standby operational modes. If the pin is
pulled to ground, the SS pin is internally pulled to ground,
preventing start-up and thereby providing a single control
pin for turning off the controller. If the pin is left open or
decoupledwithacapacitortoground,theSSpinisinternally
providedwithastartingcurrent,permittingexternalcontrol
for turning on the controller. If the pin is connected to a
Run Enable
voltage greater than 1.25V, the internal regulator (INTV )
CC
The RUN pin is used to enable the power module. The pin
can be driven with a logic input, and not exceed 6V.
will be on even when the controller is shut down (RUN
4609fa
12
LTM4609
APPLICATIONS INFORMATION
pin voltage <1.6V). In this mode, the onboard 6V linear
regulator can provide power to keep-alive functions such
as a keyboard controller.
When the cooling is limited, proper output current de-
rating is necessary, considering ambient temperature,
airflow, input/output condition, and the need for increased
reliability.
INTV and EXTV
CC
CC
The power loss curves in Figures 5 and 6 can be used
in coordination with the load current derating curves in
An internal P-channel low dropout regulator produces 6V
at the INTV pin from the V supply pin. INTV powers
Figures 7 to 14 for calculating an approximate θ for
CC
IN
CC
JA
the control chip and internal circuitry within the module.
the module. Column designation delineates between no
heat sink, and a BGA heat sink. Each of the load current
derating curves will lower the maximum load current as
a function of the increased ambient temperature to keep
the maximum junction temperature of the power module
at 115°C allowing a safe margin for the maximum operat-
ing temperature below 125°C. Each of the derating curves
and the power loss curve that corresponds to the correct
output voltage can be used to solve for the approximate
TheLTM4609alsoprovidestheexternalsupplyvoltagepin
EXTV . When the voltage applied to EXTV rises above
CC
CC
5.7V, the internal regulator is turned off and an internal
switch connects the EXTV pin to the INTV pin thereby
CC
CC
supplyinginternalpower.Theswitchremainscloseaslong
as the voltage applied to EXTV remains above 5.5V. This
CC
allows the MOSFET driver and control power to be derived
from the output when (5.7V < V
< 7V) and from the
OUT
θ ofthecondition.Acompleteexplanationofthethermal
JA
internalregulatorwhentheoutputisoutofregulation(start-
characteristics is provided in the thermal application note
up, short-circuit). If more current is required through the
for the LTM4609.
EXTV switchthanisspecified,anexternalSchottkydiode
CC
can be interposed between the EXTV and INTV pins.
CC
CC
Ensure that EXTV ≤ V .
DESIGN EXAMPLES
CC
IN
The following list summarizes the three possible connec-
tions for EXTV :
Buck Mode Operation
CC
As a design example, use input voltage V = 12V to 36V,
IN
1. EXTV left open (or grounded). This will cause INTV
CC
CC
V
= 12V and ƒ = 400kHz.
OUT
to be powered from the internal 6V regulator at the cost
Set the PLLFLTR pin at 2.4V or more for 400kHz frequency
and connect FCB to ground for continuous current mode
operation.Ifadividerisusedtosetthefrequencyasshown
in Figure 16, the bottom resistor R3 is recommended not
to exceed 1kΩ.
of a small efficiency penalty.
2. EXTV connected directly to V
(5.7V < V
< 7V).
CC
OUT
OUT
This is the normal connection for a 6V regulator and
provides the highest efficiency.
3. EXTV connected to an external supply. If an external
CC
To set the output voltage at 12V, the resistor R from V
pin to ground should be chosen as:
FB
FB
supply is available in the 5.5V to 7V range, it may be
used to power EXTV provided it is compatible with
CC
0.8V •100k
VOUT − 0.8V
the MOSFET gate drive requirements.
RFB =
≈7.15k
Thermal Considerations and Output Current Derating
To choose a proper inductor, we need to know the current
ripple at different input voltages. The inductor should be
chosen by considering the worst case in the practical
operating region. If the maximum output power P is 120W
In different applications, LTM4609 operates in a variety
of thermal environments. The maximum output current is
limited by the environmental thermal condition. Sufficient
cooling should be provided to ensure reliable operation.
4609fa
13
LTM4609
APPLICATIONS INFORMATION
at buck mode, we can get the current ripple ratio of the
For the output capacitor, the output voltage ripple and
transient requirements require low ESR capacitors. If
assuming that the ESR dominates the output ripple, the
output ripple is as follows:
current ripple ΔI to the maximum inductor current I as
L
L
follows:
2
(V – VOUT )• VOUT
ΔIL
IL
IN
=
ΔVOUT(P-P) =ESR • ΔIL
V •L • ƒ •P
IN
If a total low ESR of about 5mΩ is chosen for output ca-
pacitors, the maximum output ripple of 21.5mV occurs at
the input voltage of 36V with the current ripple at 4.3A.
Figure 3 shows the current ripple ratio at different input
voltagesbasedontheinductorvalues:2.5μH,3.3μH,4.7μH
and 6μH. If we need about 40% ripple current ratio at all
inputs, the 4.7μH inductor can be selected.
Boost Mode Operation
At buck mode, sensing resistor selection is based on
the maximum output current and the allowed maximum
sensing threshold 130mV.
For boost mode operation, use input voltage V = 5V to
IN
12V, V
= 12V and ƒ = 400kHz.
OUT
Set the PLLFLTR pin and R as in buck mode.
FB
2•130mV
2•(P / VOUT )− ΔIL
RSENSE
=
If the maximum output power P is 50W at boost mode
and the module efficiency η is about 90%, we can get
the current ripple ratio of the current ripple ΔI to the
Consider the safety margin about 30%, we can choose
the sensing resistor as 9mΩ.
L
maximum inductor current I as follows:
L
2
For the input capacitor, use a low ESR sized capacitor to
handle the maximum RMS current. Input capacitors are
required to be placed adjacent to the module. In Figure 16,
the 10μF ceramic input capacitors are selected for their
ability to handle the large RMS current into the converter.
The100μFbulkcapacitorisonlyneedediftheinputsource
impedance is compromised by long inductive leads or
traces.
(VOUT − V )• V η
ΔIL
IL
IN
IN
=
VOUT •L • ƒ •P
Figure 4 shows the current ripple ratio at different input
voltages based on the inductor values: 1.5μH, 2.5μH,
3.3μH and 4.7μH. If we need 30% ripple current ratio at
all inputs, the 3.3μH inductor can be selected.
At boost mode, sensing resistor selection is based on
the maximum input current and the allowed maximum
sensing threshold 160mV.
0.8
2.5μH
2•160mV
0.6
RSENSE
=
3.3μH
P
2•
+ ΔIL
η• V
IN(MIN)
4.7μH
0.4
0.2
0
6μH
Consider the safety margin about 30%, we can choose
the sensing resistor as 8mΩ.
12
18
24
30
36
INPUT VOLTAGE V (V)
IN
4609 F03
Figure 3. Current Ripple Ratio at Different Inputs for Buck Mode
4609fa
14
LTM4609
APPLICATIONS INFORMATION
0.8
Wide Input Mode Operation
1.5μH
Ifawideinputrangeisrequiredfrom5Vto36V,themodule
will work in different operation modes. If input voltage
0.6
V = 5V to 36V, V
= 12V and ƒ = 400kHz, the design
IN
OUT
2.5μH
0.4
needs to consider the worst case in buck or boost mode
design. Therefore, the maximum output power is limited
to 60W. The sensing resistor is chosen at 8mΩ, the input
capacitor is the same as the buck mode design and the
output capacitor uses the boost mode design. Since the
maximum output ripple normally occurs at boost mode
in the wide input mode design, more inductor ripple cur-
rent, up to 150% of the inductor current, is allowed at
buck mode to meet the ripple design requirement. Thus,
a 3.3μH inductor is chosen at the wide input mode. The
maximum output ripple voltage is still 70mV if the total
ESR is about 5mΩ.
3.3μH
4.7μH
0.2
0
5
6
7
8
9
10
11
12
INPUT VOLTAGE V (V)
IN
4609 F04
Figure 4. Current Ripple Ratio at Different Inputs for Boost Mode
For the input capacitor, only minimum capacitors are
needed to handle the maximum RMS current, since it
is a continuous input current at boost mode. A 100μF
capacitor is only needed if the input source impedance is
compromised by long inductive leads or traces.
Additionally, the current limit may become very high when
the module runs at buck mode due to the low sensing
resistor used in the wide input mode operation.
Since the output capacitors at boost mode need to filter
the square wave current, more capacitors are expected
to achieve the same output ripples as the buck mode. If
assuming that the ESR dominates the output ripple, the
output ripple is as follows:
Safety Considerations
TheLTM4609modulesdonotprovideisolationfromV to
IN
V
OUT
.Thereisnointernalfuse.Ifrequired,aslowblowfuse
with a rating twice the maximum input current needs to be
ΔVOUT(P-P) =ESR •IL(MAX)
provided to protect each unit from catastrophic failure.
If a total low ESR about 5mΩ is chosen for output capaci-
tors,themaximumoutputrippleof70mVoccursattheinput
voltage of 5V with the peak inductor current at 14A.
An RC snubber is recommended on SW1 to obtain low
switching noise, as shown in Figure 17.
4609fa
15
LTM4609
APPLICATIONS INFORMATION
Table 3. Typical Components (ƒ = 400kHz)
C
VENDORS
PART NUMBER
C
OUT2
VENDORS
PART NUMBER
OUT1
TDK
C4532X7R1E226M (22μF, 25V)
PART NUMBER
Sanyo
16SVP180MX (180μF, 16V), 20SVP150MX (150μF, 20V)
PART NUMBER
INDUCTOR VENDORS
R
SENSE
VENDORS
Toko
FDA1254
Vishay
Panasonic
Power Metal Strip Resistors WSL1206-18
Thick Film Chip Resistors ERJ12
Sumida
CDEP134, CDEP145, CDEP147
V
(V)
V
(V)
R
Inductor
(μH)
C
C
C
C
I
*
OUT(MAX)
IN
OUT
SENSE
IN
IN
OUT1
OUT2
(0.5W RATING)
(CERAMIC)
(BULK)
(CERAMIC)
(BULK)
(A)
5
10
10
10
10
10
10
12
12
12
12
12
12
16
16
16
16
16
16
16
20
20
20
20
24
24
24
24
2 × 16mW 0.5W
2 × 18mW 0.5W
2 × 20mW 0.5W
2 × 18mΩ 0.5W
2 × 22mΩ 0.5W
2 × 22mΩ 0.5W
2 × 14mΩ 0.5W
2 × 16mW 0.5W
2 × 18mW 0.5W
2 × 18mΩ 0.5W
2 × 22mΩ 0.5W
2 × 22mΩ 0.5W
2 × 18mW 0.5W
2 × 16mW 0.5W
2 × 14mW 0.5W
2 × 20mW 0.5W
2 × 20mΩ 0.5W
2 × 22mΩ 0.5W
2 × 22mΩ 0.5W
2 × 18mΩ 0.5W
2 × 18mΩ 0.5W
1 × 12mΩ 0.5W
1 × 13mΩ 0.5W
2 × 16mΩ 0.5W
2 × 18mΩ 0.5W
1 × 14mΩ 0.5W
1 × 13mΩ 0.5W
2.2
2.2
3.3
3.3
4.7
4.7
2.2
2.2
3.3
3.3
4.7
4.7
3.3
3.3
2.2
2.2
3.3
4.7
6
None
150μF 35V
150μF 35V
150μF 35V
150μF 35V
150μF 35V
150μF 50V
150μF 35V
150μF 35V
150μF 35V
150μF 35V
150μF 35V
150μF 50V
150μF 35V
150μF 35V
150μF 35V
150μF 35V
150μF 35V
150μF 35V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
4 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
4 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
4 × 22μF 25V
4 × 22μF 25V
4 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
4 × 22μF 25V
4 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
4 × 22μF 25V
4 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 180μF 16V
2 × 150μF 20V
2 × 150μF 20V
2 × 150μF 20V
2 × 150μF 20V
2 × 150μF 20V
2 × 150μF 20V
2 × 150μF 20V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
4
11
10
10
9
15
20
24
32
36
6
2 × 10μF 25V
2 × 10μF 25V
2 × 10μF 25V
2 × 10μF 50V
2 × 10μF 50V
None
9
4
16
20
24
32
36
5
2 × 10μF 25V
2 × 10μF 25V
2 × 10μF 25V
2 × 10μF 50V
2 × 10μF 50V
None
11
10
9
9
9
2.5
4
8
None
12
20
24
32
36
5
None
8
2 × 10μF 25V
2 × 10μF 25V
2 × 10μF 50V
2 × 10μF 50V
NONE
10
10
9
9
3.3
3.3
6
2
10
32
36
5
NONE
5
2 × 10μF 50V
2 × 10μF 50V
NONE
9
8
8
3.3
4.7
4.7
7
1.5
5
12
32
36
NONE
2 × 10μF 50V
2 × 10μF 50V
8
8
4609fa
16
LTM4609
APPLICATIONS INFORMATION
Table 3. Typical Components (ƒ = 400kHz) Continued
V
(V)
V
(V)
R
Inductor
(μH)
C
C
C
C
I
*
IN
OUT
SENSE
IN
IN
OUT1
OUT2
OUT(MAX)
(0.5W RATING)
(CERAMIC)
(BULK)
(CERAMIC)
(BULK)
(A)
5
30
30
30
30
34
34
34
34
2 × 16mꢀ 0.5W
2 × 14mꢀ 0.5W
1 × 12mꢀ 0.5W
1 × 13mꢀ 0.5W
2 × 18mꢀ 0.5W
2 × 16mꢀ 0.5W
1 × 12mꢀ 0.5W
1 × 12mꢀ 0.5W
3.3
4.7
2.5
4.7
3.3
4.7
5.6
2.5
NONE
NONE
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
4 × 22μF 50V
4 × 22μF 50V
2 × 22μF 50V
2 × 22μF 50V
4 × 22μF 50V
4 × 22μF 50V
4 × 22μF 50V
2 × 22μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
1.3
3
12
32
36
5
2 × 10μF 50V
2 × 10μF 50V
NONE
8
8
1
12
24
36
NONE
3
NONE
5
2 × 10μF 50V
8
INDUCTOR MANUFACTURER
WEBSITE
PHONE NUMBER
408-321-9660
847-297-0070
Sumida
Toko
www.sumida.com
www.toko.com
SENSING RESISTOR MANUFACTURER
WEBSITE
PHONE NUMBER
949-462-1816
814-362-5536
800-433-5700
Panasonic
KOA
www.panasonic.com/industrial/components
www.koaspeer.com
Vishay
www.vishay.com
*Maximum load current is based on the Linear Technology DC1198A at room temperature with natural convection. Poor board layout design may
decrease the maximum load current.
(Power Loss includes all external components)
TYPICAL APPLICATIONS
7
6
5
4
7
6
5
4
3
2
1
0
32V TO 12V
IN
OUT
OUT
36V TO 20V
IN
3
2
1
0
5V TO 16V
IN
OUT
OUT
5V TO 30V
IN
0
1
2
3
0
1
2
3
4
5
6
7
8
9
LOAD CURRENT (A)
LOAD CURRENT (A)
4609 F05
4609 F06
Figure 5. Boost Mode Operation
Figure 6. Buck Mode Operation
4609fa
17
LTM4609
TYPICAL APPLICATIONS
3.0
3.0
2.5
2.0
1.5
1.0
0.5
0
2.5
2.0
1.5
1.0
0.5
5V TO 16V
WITH 0LFM
WITH 200LFM
WITH 400LFM
IN
OUT
OUT
OUT
5V TO 16V
IN
5V TO 16V
IN
0
25 35 45 55 65 75 85 95 105 115
AMBIENT TEMPERATURE (°C)
25
45
65
85
105
125
AMBIENT TEMPERATURE (°C)
4609 F07
4609 F08
5V TO 16V
WITH 0LFM
WITH 200LFM
WITH 400LFM
IN
OUT
OUT
OUT
5V TO 16V
IN
5V TO 16V
IN
Figure 7. 5VIN to 16VOUT without Heat Sink
Figure 8. 5VIN to 16VOUT with Heat Sink
1.50
1.25
1.00
0.75
0.50
1.50
1.25
1.00
0.75
0.50
5V TO 30V
IN
WITH 0LFM
WITH 200LFM
WITH 400LFM
5V TO 30V
IN
WITH 0LFM
WITH 200LFM
WITH 400LFM
0.25
0
OUT
OUT
OUT
OUT
OUT
OUT
0.25
0
5V TO 30V
IN
5V TO 30V
IN
5V TO 30V
IN
5V TO 30V
IN
25 35 45 55 65 75 85 95 105
AMBIENT TEMPERATURE (°C)
25 35 45 55 65 75 85 95 105
AMBIENT TEMPERATURE (°C)
4609 F10
4609 F09
Figure 9. 5VIN to 30VOUT without Heat Sink
Figure 10. 5VIN to 30VOUT with Heat Sink
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
25
35
45
55
65
75
85
95
25
35
45
55
65
75
85
95
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
32V TO 12V
WITH 0LFM
32V TO 12V
WITH 0LFM
IN
OUT
OUT
OUT
IN
OUT
OUT
OUT
32V TO 12V
WITH 200LFM
32V TO 12V
WITH 200LFM
IN
IN
32V TO 12V
WITH 400LFM 4609 F11
32V TO 12V
WITH 400LFM 4609 F12
IN
IN
Figure 11. 32VIN to 12VOUT without Heat Sink
Figure 12. 32VIN to 12VOUT with Heat Sink
4609fa
18
LTM4609
TYPICAL APPLICATIONS
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
0
0
25 35 45 55 65 75 85 95 105
25 35 45 55 65 75 85 95 105
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
4609 F13
4609 F14
36V TO 20V
WITH 0LFM
WITH 200LFM
WITH 400LFM
36V TO 20V
WITH 0LFM
WITH 200LFM
WITH 400LFM
IN
OUT
OUT
OUT
IN
OUT
OUT
OUT
36V TO 20V
36V TO 20V
IN
IN
36V TO 20V
36V TO 20V
IN
IN
Figure 13. 36VIN to 20VOUT without Heat Sink
Figure 14. 36VIN to 20VOUT with Heat Sink
APPLICATIONS INFORMATION
Table 4. Boost Mode
DERATING CURVE
Figure 7, 9
V
(V)
POWER LOSS CURVE
Figure 5
AIR FLOW (LFM)
HEAT SINK
None
θ
(°C/W)*
11.4
8.5
OUT
JA
16, 30
16, 30
16, 30
16, 30
16, 30
16, 30
0
Figure 7, 9
Figure 5
200
400
0
None
Figure 7, 9
Figure 5
None
7.5
Figure 8, 10
Figure 8, 10
Figure 8, 10
Figure 5
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
11.0
7.9
Figure 5
200
400
Figure 5
7.1
Table 5. Buck Mode
DERATING CURVE
Figure 11, 13
V
(V)
POWER LOSS CURVE
Figure 6
AIR FLOW (LFM)
HEAT SINK
None
θ
(°C/W)*
8.2
OUT
JA
12, 20
0
Figure 11, 13
12, 20
12, 20
12, 20
12, 20
12, 20
Figure 6
200
400
0
None
5.9
Figure 11, 13
Figure 6
None
5.4
Figure 12, 14
Figure 6
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
7.5
Figure 12, 14
Figure 6
200
400
5.3
Figure 12, 14
Figure 6
4.8
HEAT SINK MANUFACTURER
Wakefield Engineering
Aaivd Thermalloy
PART NUMBER
LTN20069
PHONE NUMBER
603-635-2800
603-224-9988
375424B00034G
*The results of thermal resistance from junction to ambient θ are based on the demo board DC 1198A. Thus, the maximum temperature on board is treated
JA
as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has to be
mentioned that poor board design may increase the θ
.
JA
4609fa
19
LTM4609
APPLICATIONS INFORMATION
Layout Checklist/Example
• Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
The high integration of LTM4609 makes the PCB board
layoutverysimpleandeasy.However,tooptimizeitselectri-
cal and thermal performance, some layout considerations
are still necessary.
Figure 15. gives a good example of the recommended
layout.
• UselargePCBcopperareasforhighcurrentpath,includ-
SW1
SW2
V
IN
ing V , R
, SW1, SW2, PGND and V . It helps to
IN SENSE
OUT
minimize the PCB conduction loss and thermal stress.
L1
• Place high frequency input and output ceramic capaci-
tors next to the V , PGND and V
pins to minimize
IN
OUT
high frequency noise
–
+
• RouteSENSE andSENSE leadstogetherwithminimum
PC trace spacing. Avoid sense lines passing through
noisy areas, such as switch nodes.
C
IN
R
V
SENSE
OUT
• Place a dedicated power ground layer underneath the
unit.
C
OUT
• Tominimizetheviaconductionlossandreducemodule
thermal stress, use multiple vias for interconnection
between the top layer and other power layers
+
–
SGND
PGND
PGND
R
4609 F15
SENSE
• Do not put vias directly on pads, unless the vias are
capped.
KELVIN CONNECTIONS TO R
SENSE
Figure 15. Recommended PCB Layout
TYPICAL APPLICATIONS
V
IN
CLOCK SYNC
12V TO 36V
10μF
50V
×2
V
12V
10A
OUT
V
PLLIN
IN
PGOOD
RUN
V
OUT
+
100μF
25V
ON/OFF
FCB
L1
4.7μH
LTM4609
COMP
INTV
SW1
SW2
CC
R1
PLLFLTR
EXTV
1.5k
R
CC
SENSE
+
R3
1k
STBYMD
SENSE
C3
0.1μF
R2
9mΩ
–
SS
SENSE
SGND
V
FB
PGND
R
FB
7.15k
4609 TA02
Figure 16. Buck Mode Operation with 12V to 36V Input
4609fa
20
LTM4609
TYPICAL APPLICATIONS
V
IN
CLOCK SYNC
5V TO 12V
4.7μF
35V
V
12V
4A
OUT
V
PLLIN
IN
PGOOD
RUN
V
OUT
+
330μF
25V
22μF
25V
×2
ON/OFF
FCB
LTM4609
COMP
2200pF
2Ω
INTV
SW1
SW2
CC
R1
1.5k
PLLFLTR
L1
3.3μH
OPTIONAL
FOR LOW
SWITCHING NOISE
R3
1k
EXTV
CC
R
SENSE
+
STBYMD
SENSE
C3
0.1μF
R2
8mΩ
–
SS
SENSE
SGND
V
FB
PGND
R
FB
7.15k
4609 TA03
Figure 17. Boost Mode Operation with 5V to 12V Input with Low Switching Noise (Optional)
V
IN
CLOCK SYNC
5V TO 36V
10μF
50V
×2
V
12V
4A
OUT
V
PLLIN
IN
PGOOD
RUN
V
OUT
+
330μF
25V
22μF
25V
×4
ON/OFF
FCB
2200pF
LTM4609
COMP
INTV
SW1
CC
R1
1.5k
2Ω
L1
3.3μH
PLLFLTR
SW2
R3
1k
EXTV
CC
R
SENSE
+
STBYMD
SENSE
C3
0.1μF
R2
8mΩ
–
SS
SENSE
SGND
V
FB
PGND
R
FB
7.15k
4609 TA04
L1: TOKO FDA1254
Figure 18. Wide Input Mode with 5V to 36V Input, 12V at 4A Output
4609fa
21
LTM4609
TYPICAL APPLICATIONS
V
IN
CLOCK SYNC
8V TO 36V
10μF
50V
×2
V
32V
2A
OUT
V
PLLIN
IN
PGOOD
RUN
V
OUT
+
220μF
50V
ON/OFF
FCB
L1
4.7μH
LTM4609
COMP
INTV
SW1
SW2
CC
R1
PLLFLTR
EXTV
1.5k
R
CC
SENSE
+
R3
1k
STBYMD
SENSE
C3
0.1μF
R2
9mΩ
–
SS
SENSE
SGND
V
FB
PGND
R
FB
2.55k
4609 TA05
Figure 19. 32V at 2A Design
V
IN
5V TO 36V
CLOCK SYNC 0° PHASE
PLLIN
10μF
50V
V
12V
8A
OUT
R5
100k
V
IN
PGOOD
RUN
V
OUT
+
C2
330μF
25V
FCB
L1
3.3μH
22μF
25V
×2
LTM4609
COMP
SW1
SW2
INTV
CC
LTC6908-1
PLLFLTR
R
5.1V
SENSE
+
C1
EXTV
CC
SENSE
0.1μF
+
V
OUT1
OUT2
MOD
R2
8mΩ
STBYMD
R4
324k
–
GND
SET
SS
SENSE
C3
0.1μF
SGND
V
FB
PGND
R
*
FB
2-PHASE OSCILLATOR
3.57k
CLOCK SYNC 180° PHASE
PLLIN
10μF
50V
V
IN
PGOOD
V
OUT
+
C4
330μF
25V
FCB
L2
3.3μH
22μF
25V
×2
LTM4609
RUN
COMP
SW1
SW2
INTV
CC
PLLFLTR
EXTV
R
SENSE
+
*R IS SELECTED USING
FB
SENSE
CC
R3
8mΩ
STBYMD
100k
ꢁRFB
N
–
SS
VOUT ꢀ 0.8V
SENSE
RFB
WHERE N IS THE NUMBER
OF PARALLELED MODULES.
SGND
V
FB
PGND
4609 TA06
Figure 20. Two-Phase Parallel, 12V at 8A Design
4609fa
22
LTM4609
PACKAGE DESCRIPTION
Z
b b b
Z
6 . 9 8 5 0
5 . 7 1 5 0
4 . 4 4 5 0
3 . 1 7 5 0
1 . 9 0 5 0
0 . 6 3 5 0
0 . 0 0 0 0
0 . 6 3 5 0
1 . 9 0 5 0
3 . 1 7 5 0
4 . 4 4 5 0
5 . 7 1 5 0
6 . 9 8 5 0
4609fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
23
LTM4609
PACKAGE DESCRIPTION
Pin Assignment Table 6
(Arranged by Pin Number)
PIN NAME
A1 PGND
A2 PGND
A3 PGND
A4 SENSE
A5 SENSE
A6 SS
PIN NAME
PIN NAME
PIN NAME
PIN NAME
J1 SW1
J2 SW1
J3 SW1
J4 SW1
PIN NAME
L1 SW1
L2 SW1
L3 SW1
L4 SW1
C1 PGND
C2 PGND
C3 PGND
C4 PGND
C5 PGND
C6 PGND
C7 PGND
C8 PGND
C9 PGND
E1
E2
V
V
G1
V
OUT
V
OUT
V
OUT
V
OUT
OUT
OUT
G2
E3 PGND
E4 PGND
E5 PGND
E6 PGND
E7 PGND
E8 PGND
E9 PGND
E10 PGND
E11 PGND
E12 PGND
G3
+
–
G4
G5
R
R
R
R
R
R
R
R
J5
J6
J7
R
SENSE
R
SENSE
R
SENSE
L5
L6
R
SENSE
R
SENSE
SENSE
SENSE
SENSE
SENSE
SENSE
SENSE
SENSE
SENSE
OUT
G6
A7 SGND
A8 RUN
A9 FCB
G7
L7 SW2
L8 SW2
L9 SW2
G8
J8 SW2
J9 SW2
G9
A10 STBYMD C10 PGND
G10
G11
G12
H1
J10
J11
J12
V
IN
V
IN
V
IN
L10
L11
L12
V
IN
V
IN
V
IN
A11 PGND
A12 PGND
B1 PGND
B2 PGND
B3 PGND
B4 PGND
C11 PGND
C12 PGND
D1 PGND
D2 PGND
D3 PGND
D4 PGND
F1
F2
F3
F4
V
OUT
V
OUT
V
OUT
V
OUT
V
V
V
V
K1 SW1
K2 SW1
K3 SW1
K4 SW1
M1 SW1
M2 SW1
M3 SW1
M4 SW1
H2
OUT
H3
OUT
H4
OUT
B5 PGOOD D5 PGND
F5 INTV
H5
R
SENSE
R
SENSE
R
SENSE
R
SENSE
R
SENSE
R
SENSE
R
SENSE
R
SENSE
K5
K6
R
R
M5
M6
R
R
CC
SENSE
SENSE
SENSE
SENSE
B6
V
D6 PGND
D7 PGND
F6 EXTV
H6
FB
CC
B7 COMP
F7
–
H7
K7 SW2
K8 SW2
K9 SW2
M7 SW2
M8 SW2
M9 SW2
B8 PLLFLTR D8 PGND
F8
–
H8
B9 PLLIN
B10 PGND
B11 PGND
B12 PGND
D9 PGND
D10 PGND
D11 PGND
D12 PGND
F9
–
H9
F10
F11
F12
R
R
R
H10
H11
H12
K10
K11
K12
V
IN
V
IN
V
IN
M10 V
M11 V
M12 V
SENSE
SENSE
SENSE
IN
IN
IN
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
Synchronous Operation; Single Inductor; 4V ≤ V ≤ 36V; 0.8V ≤ V
LTC3780
36V Buck-Boost Controller
10V Buck-Boost Controller
10A DC/DC μModule
≤ 30V
OUT
IN
LTC3785
Synchronous; No R
™; 2.7V ≤ V ≤ 10V; 2.7V ≤ V
≤ 10V
OUT
SENSE
IN
LTM4600
Basic 10A DC/DC μModule
LTM4601/LTM4601A 12A DC/DC μModule with PLL, Output
Synchronizable, PolyPhase® Operation to 48A, LTM4601-1 Has No Remote
Tracking/ Margining and Remote Sensing
Military Plastic 10A DC/DC μModule
6A DC/DC μModule
Sensing
LTM4600HVMP
LTM4602
–55°C ≤ T ≤ 125°C Operation; 15mm × 15mm × 2.8mm LGA
A
Pin Compatible with the LTM4600
LTM4603
6A DC/DC μModule with PLL and Output
Tracking/Margining and Remote Sensing
Synchronizable, PolyPhase Operation, LTM4603-1 Version Has No Remote
Sensing, Pin Compatible with the LTM4601
LTM4604A
4A, Low V , DC/DC μModule
2.375V ≤ V ≤ 5.5V; 0.8V ≤ V
≤ 5V; 9mm × 15mm × 2.3mm
IN
IN
OUT
LTM4605/LTM4607
LTM4606/LTM4612
LTM4608A
5A High Efficiency Buck-Boost DC/DC μModules Pin Compatible with LTM4609, Lower Voltage Versions of the LTM4609
Ultralow Noise DC/DC μModules
Low EMI; LTM4606 Verified by Xilinx to Power Rocket IO™; CISPR22 Compliant
8A, Low V , DC/DC μModule
2.7V ≤ V ≤ 5.5V; 0.6V ≤ V ≤ 5V; 9mm × 15mm × 2.8mm
IN
IN
OUT
No R
is a trademark of Linear Technology Corporation. PolyPhase is a registered trademark of Linear Technology Corporation.
SENSE
4609fa
LT 0809 REV A • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
24
●
●
© LINEAR TECHNOLOGY CORPORATION 2009
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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SI9137LG
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SI9122E
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