LTM8045MPY [Linear]
LTM8045 - Inverting or SEPIC µModule (Power Module) DC/DC Converter with Up to 700mA Output Current; Package: BGA; Pins: 40; Temperature Range: -55°C to 125°C;
| 型号： | LTM8045MPY |
| 厂家： | 
Linear |
| 描述： | LTM8045 - Inverting or SEPIC µModule (Power Module) DC/DC Converter with Up to 700mA Output Current; Package: BGA; Pins: 40; Temperature Range: -55°C to 125°C 开关 |
| 文件： | 总22页 (文件大小：342K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LTM8045
Inverting or SEPIC µModule
DC/DC Converter with Up
to 700mA Output Current
DescripTion
FeaTures
n
SEPIC or Inverting Topology
The LTM®8045 is a µModule® (micromodule) DC/DC
converter that can be configured as a SEPIC or inverting
converterbysimplygroundingtheappropriateoutputrail.
In a SEPIC configuration the regulated output voltage can
beabove,beloworequaltotheinputvoltage.TheLTM8045
includes power devices, inductors, control circuitry and
passive components. All that is needed to complete the
design are input and output capacitors, and small resis-
tors to set the output voltage and switching frequency.
Other components may be used to control the soft-start
and undervoltage lockout.
n
n
Wide Input Voltage Range: 2.8V to 18V
Up to 700mA Output Current at V = 12V,
IN
V
OUT
= 2.5V or –2.5V
n
Up to 375mA Output Current at V = 12V,
IN
V
OUT
=15V or –15V
n
n
n
n
n
2.5V to 15V or –2.5V to –15V Output Voltage
Selectable Switching Frequency: 200kHz to 2MHz
Programmable Soft-Start
User Configurable Undervoltage Lockout
6.25mm × 11.25mm × 4.92mm BGA Package
The LTM8045 is packaged in a compact (6.25mm ×
11.25mm)overmoldedballgridarray(BGA)packagesuit-
able for automated assembly by standard surface mount
equipment. The LTM8045 is available with SnPb (BGA)
or RoHS compliant terminal finish.
applicaTions
n
Battery Powered Regulator
n
Local Negative Voltage Regulator
n
Low Noise Amplifier Power
L, LT, LTC, LTM, Linear Technology, the Linear logo, µModule and PolyPhase are registered
trademarks of Linear Technology Corporation. All other trademarks are the property of their
respective owners.
Typical applicaTion
Use Two LTM8045s to Generate 5V
LTM8045
Maximum Output Current
vs Input Voltage
–
OUT
V
V
IN
V
V
OUT
–5V
IN
2.8VDC TO 18VDC
800
700
600
500
400
300
200
100
RUN
SS
4.7µF
60.4k
22µF
RT
FB
+
SYNC
V
OUT
130k
GND
2ꢀ5V
3ꢀ3V
5V
OUT
OUT
OUT
LTM8045
8V
OUT
–
V
V
V
12V
15V
IN
OUT
OUT
OUT
RUN
SS
2
4
6
8
10 12 14 16 18
100µF
INPUT VOLTAGE (V)
FB
+
8045 TA01b
RT
45.3k
SYNC
OUT
115k
V
OUT
5V
GND
8045 TA01b
8045fc
1
For more information www.linear.com/LTM8045
LTM8045
absoluTe MaxiMuM raTings
pin conFiguraTion
(Note 1)
TOP VIEW
V , RUN ...................................................................20V
IN
–
5
4
3
2
1
RT, SYNC ....................................................................5V
SS, FB......................................................................2.5V
V
V
IN
BANK 4
OUT
BANK 1
GND
+
–
+
V
V
(V
(V
= 0V)...................................................16V
= 0V).................................................–16V
OUT
OUT
OUT
FB
–
BANK 3
RUN
OUT
+
V
BANK 2
OUT
SYNC
Maximum Internal Temperature ............................ 125°C
Maximum Solder Temperature..............................250°C
Storage Temperature.............................. –55°C to 125°C
A
B
C
D
E
F
G
H
SS RT
BGA PACKAGE
40-LEAD (11.25mm × 6.25mm × 4.92mm)
T
= 125°C, θ = 28.7°C/W, θ = 7.6°C/W,
JMAX
θ
JA
JB
= 40.3°C/W, θ
= 10.5°C/W
JCtop
JCbottom
θ VALUES DETERMINED PER JEDEC 51-9, 51-12
WEIGHT = 0.9g
orDer inForMaTion
http://www.linear.com/product/LTM8045#orderinfo
PART MARKING*
PACKAGE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
PART NUMBER
LTM8045EY#PBF
LTM8045IY#PBF
LTM8045IY
PAD OR BALL FINISH
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
DEVICE
FINISH CODE
TYPE
BGA
BGA
BGA
BGA
BGA
LTM8045Y
LTM8045Y
LTM8045Y
LTM8045Y
LTM8045Y
e1
e1
e0
e1
e0
3
3
3
3
3
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
LTM8045MPY#PBF
LTM8045MPY
SAC305 (RoHS)
SnPb (63/37)
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
• Terminal Finish Part Marking:
www.linear.com/leadfree
8045fc
2
For more information www.linear.com/LTM8045
LTM8045
elecTrical characTerisTics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. RUN = 12V unless otherwise specified. (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
l
Input DC Voltage
2.8
18
V
–
Positive Output DC Voltage
I
I
= 0.7A, R = 15.4kΩ, V
Grounded
2.5
15
V
V
OUT
OUT
FB
OUT
–
= 0.375A, R =165kΩ, V
Grounded
FB
OUT
+
Negative Output DC Voltage
I
I
= 0.7A, R = 30.0kΩ, V
Grounded
–2.5
–15
V
V
OUT
OUT
FB
OUT
+
= 0.375A, R =178kΩ, V
Grounded
FB
OUT
Continuous Output DC Current
V
V
= 12V, V
= 12V, V
= 2.5V or –2.5V
= 15V or –15V
0.7
0.375
A
A
IN
IN
OUT
OUT
V
Quiescent Current
V
= 0V
0
10
1
µA
mA
IN
RUN
Not Switching
Line Regulation
4V ≤ V ≤ 18V, I
= 0.2A
0.6
0.2
4
%
%
IN
OUT
Load Regulation
0.01A ≤ I
≤ 0.58A
OUT
Output RMS Voltage Ripple
Input Short-Circuit Current
Switching Frequency
V
V
= 12V, V
= 5V, I = 580mA, 100kHz to 4MHz
OUT
mV
mA
IN
OUT
–
+
= V
= 0V, V = 12V
200
OUT
OUT
IN
l
l
R = 45.3k
1800
180
2000
200
2200
220
kHz
kHz
T
R = 464k
T
l
l
Voltage at FB Pin (Positive Output)
Voltage at FB Pin (Negative Output)
1.195
0
1.215
5
1.235
12
V
mV
l
l
Current into FB Pin (Positive Output)
Current into FB Pin (Negative Output)
81
81
83.3
83.3
86
86.5
µA
µA
RUN Pin Threshold Voltage
RUN Pin Rising
RUN Pin Falling
1.32
1.29
1.385
V
V
1.235
9.7
RUN Pin Current
V
RUN
V
RUN
V
RUN
= 3V
= 1.3V
= 0V
40
11.6
0
60
13.4
0.1
µA
µA
µA
SS Sourcing Current
SS = 0V
5
8
13
2000
65
µA
kHz
%
Synchronization Frequency Range
Synchronization Duty Cycle
SYNC Input Low Threshold
SYNC Input High Threshold
200
35
0.4
V
1.3
V
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
full –55°C to 125°C internal operating temperature range. Note that
the maximum internal temperature is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors.
Note 2: The LTM8045E is guaranteed to meet performance specifications
from 0°C to 125°C. Specifications over the –40°C to 125°C internal
temperature range are assured by design, characterization and correlation
with statistical process controls. LTM8045I is guaranteed to meet
specifications over the full –40°C to 125°C internal operating temperature
range. The LTM8045MP is guaranteed to meet specifications over the
Note 3: This μModule converter includes overtemperature protection that
is intended to protect the device during momentary overload conditions.
Internal temperature will exceed 125°C when overtemperature protection
is active. Continuous operation above the specified maximum internal
operating junction temperature may impair device reliability.
8045fc
3
For more information www.linear.com/LTM8045
LTM8045
Typical perForMance characTerisTics
Efficiency
2.5VOUT SEPIC
Efficiency
3.3VOUT SEPIC
Efficiency
5VOUT SEPIC
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
3.3V
IN
3.3V
IN
3.3V
IN
IN
IN
5V
5V
5V
IN
12V
18V
12V
18V
12V
18V
IN
IN
IN
IN
IN
IN
0
100 200 300 400 500 600 700 800
0
100 200 300 400 500 600 700 800
0
100 200 300 400 500 600 700
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G01
8045 G02
8045 G03
Efficiency
8VOUT SEPIC
Efficiency
12VOUT SEPIC
Efficiency
15VOUT SEPIC
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
3.3V
IN
3.3V
IN
IN
IN
5V
5V
5V
12V
18V
IN
IN
IN
12V
18V
12V
18V
IN
IN
IN
IN
0
100
200
300
400
500
0
100
200
300
400
500
600
0
100
200
300
400
500
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G05
8045 G04
8045 G06
Efficiency
–2.5VOUT Inverting Converter
Efficiency
–3.3VOUT Inverting Converter
Efficiency
–5VOUT Inverting Converter
90
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
3.3V
IN
3.3V
5V
12V
18V
3.3V
IN
5V
12V
18V
IN
IN
IN
IN
IN
5V
IN
IN
IN
12V
18V
IN
IN
0
100 200 300 400 500 600 700
0
100 200 300 400 500 600 700 800
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G09
8045 G07
8045 G08
8045fc
4
For more information www.linear.com/LTM8045
LTM8045
Typical perForMance characTerisTics
Efficiency
–8VOUT Inverting Converter
Efficiency
–12VOUT Inverting Converter
Efficiency
–15VOUT Inverting Converter
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
3.3V
IN
3.3V
IN
IN
IN
5V
5V
5V
12V
18V
IN
IN
IN
12V
18V
12V
IN
IN
IN
18V
IN
0
100
200
300
400
500
600
0
100
200
300
400
500
0
100
200
300
400
500
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G10
8045 G11
8045 G12
Input Current vs Output Current,
2.5VOUT SEPIC
Input Current vs Output Current,
3.3VOUT SEPIC
Input Current vs Output Current,
5VOUT SEPIC
600
500
400
300
200
100
0
700
600
500
400
300
200
100
0
800
700
600
500
400
300
200
100
0
3.3V
IN
3.3V
IN
3.3V
IN
IN
IN
5V
5V
5V
12V
18V
IN
IN
IN
12V
18V
12V
18V
IN
IN
IN
IN
0
100 200 300 400 500 600 700 800
0
100 200 300 400 500 600 700 800
0
100 200 300 400 500 600 700
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G13
8045 G14
8045 G15
Input Current vs Output Current,
8VOUT SEPIC
Input Current vs Output Current,
12VOUT SEPIC
Input Current vs Output Current,
15VOUT SEPIC
900
800
700
600
500
400
300
200
100
0
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
5V
IN
3.3V
IN
3.3V
IN
12V
18V
5V
IN
5V
IN
IN
IN
IN
IN
12V
IN
12V
18V
IN
18V
0
100
200
300
400
500
0
100
200
300
400
500
600
0
100
200
300
400
500
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G18
8045 G16
8045 G17
8045fc
5
For more information www.linear.com/LTM8045
LTM8045
Typical perForMance characTerisTics
Input Current vs Output Current,
–2.5VOUT Inverting Converter
Input Current vs Output Current,
–3.3VOUT Inverting Converter
Input Current vs Output Current,
–5VOUT Inverting Converter
600
500
400
300
200
100
0
700
600
500
400
300
200
100
0
800
700
600
500
400
300
200
100
0
3.3V
IN
3.3V
IN
3.3V
IN
IN
IN
5V
5V
5V
12V
18V
IN
IN
IN
12V
18V
12V
18V
IN
IN
IN
IN
0
100 200 300 400 500 600 700 800
0
100 200 300 400 500 600 700 800
0
100 200 300 400 500 600 700
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G19
8045 G20
8045 G21
Input Current vs Output Current,
–8VOUT Inverting Converter
Input Current vs Output Current,
–12VOUT Inverting Converter
Input Current vs Output Current,
–15VOUT Inverting Converter
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
900
800
700
600
500
400
300
200
100
0
3.3V
IN
3.3V
IN
5V
IN
IN
5V
IN
5V
12V
IN
12V
IN
12V
18V
18V
IN
IN
IN
18V
IN
0
100
200
300
400
500
600
0
100
200
300
400
500
0
100
200
300
400
500
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G22
8045 G23
8045 G23
Input Current vs Input Voltage,
5mA Load
Input Current vs Input Voltage,
Output Shorted
Output Current vs Input Voltage,
Output Shorted
60
55
50
45
40
35
30
25
20
15
10
550
500
450
400
350
300
250
200
150
2.2
2.0
1.8
1.6
1.4
1.2
15V
12V
OUT
OUT
8V
5V
OUT
OUT
3ꢀ3V
2ꢀ5V
OUT
OUT
2
4
6
8
10 12 14 16 18
2
4
6
8
10 12 14 16 18
2
4
6
8
10 12 14 16 18
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
8045 G25
8045 G26
8045 G27
8045fc
6
For more information www.linear.com/LTM8045
LTM8045
Typical perForMance characTerisTics
Minimum Required Input Voltage
vs Output Current
Maximum Output Current
vs Input Voltage
Internal Temperature Rise vs Output
Current, 2.5VOUT SEPIC
18
16
14
12
10
8
800
700
600
500
400
300
200
100
30
25
20
15
10
5
±15V
OUT
18V
IN
±12V
OUT
12V
IN
±8V
OUT
5V
IN
±5V
±±3±V
±235V
3.3V
IN
OUT
OUT
OUT
2ꢀ5V
3ꢀ3V
OUT
OUT
6
5V
8V
12V
15V
OUT
OUT
4
OUT
OUT
2
0
0
200
400
600
800
2
4
6
8
10 12 14 16 18
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
INPUT VOLTAGE (V)
OUTPUT CURRENT (mA)
8045 G28
8045 G29
8045 G30
Internal Temperature Rise vs Output
Current, 3.3VOUT SEPIC
Internal Temperature Rise vs Output
Current, 5VOUT SEPIC
Internal Temperature Rise vs Output
Current, 8VOUT SEPIC
35
30
25
20
15
10
5
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
18V
IN
18V
IN
18V
IN
12V
IN
12V
IN
12V
IN
5V
IN
5V
IN
5V
IN
3.3V
IN
3.3V
IN
3.3V
IN
0
0
0
0
100 200 300 400 500 600 700
0
100 200 300 400 500 600 700 800
0
100
200
300
400
500
600
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G32
8045 G31
8045 G33
Internal Temperature Rise
vs Output Current, –2.5VOUT
Inverting Converter
Internal Temperature Rise vs Output
Current, 12VOUT SEPIC
Internal Temperature Rise vs Output
Current, 15VOUT SEPIC
45
40
35
30
25
20
15
10
5
60
50
40
30
20
10
0
25
20
15
10
5
18V
12V
IN
3.3V
18V
12V
IN
IN
IN
IN
5V
5V
IN
IN
18V
IN
IN
12V
5V
IN
3.3V
IN
0
0
0
100
200
300
400
500
0
100
200
300
400
500
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G34
8045 G35
8045 G36
8045fc
7
For more information www.linear.com/LTM8045
LTM8045
Typical perForMance characTerisTics
Internal Temperature Rise
vs Output Current, –3.3VOUT
Inverting Converter
Internal Temperature Rise
vs Output Current, –5VOUT
Inverting Converter
Internal Temperature Rise
vs Output Current, –8VOUT Inverting
Converter
30
25
20
15
10
5
35
30
25
20
15
10
5
35
30
25
20
15
10
5
18V
12V
5V
18V
12V
5V
18V
IN
IN
IN
IN
IN
12V
IN
5V
IN
3.3V
IN
IN
IN
3.3V
3.3V
IN
IN
0
0
0
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
0
100 200 300 400 500 600 700
0
100
200
300
400
500
600
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G37
8045 G38
8045 G39
Internal Temperature Rise
vs Output Current, –12VOUT
Inverting Converter
Internal Temperature Rise
vs Output Current, –15VOUT
Inverting Converter
45
40
35
30
25
20
15
10
5
60
50
40
30
20
10
0
18V
12V
IN
3.3V
IN
IN
18V
IN
12V
IN
5V
5V
IN
IN
0
0
100
200
300
400
500
0
100
200
300
400
500
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8045 G40
8045 G41
8045fc
8
For more information www.linear.com/LTM8045
LTM8045
pin FuncTions
–
–
V
(Bank 1): V
is the negative output of the
SYNC (Pin E1): To synchronize the switching frequency
to an outside clock, simply drive this pin with a clock. The
high voltage level of the clock needs to exceed 1.3V, and
the low level should be less than 0.4V. Drive this pin to
less than 0.4V to revert to the internal free running clock.
Ground this pin if the SYNC function is not used. See the
Applications Information section for more information.
OUT
OUT
+
LTM8045. Apply an external capacitor between V
and
OUT
–
V
. Tie this net to GND to configure the LTM8045 as
OUT
a positive output SEPIC regulator.
+
+
V
OUT
(Bank 2): V
is the positive output of the
OUT
+
LTM8045. Apply an external capacitor between V
and
OUT
–
V
. Tie this net to GND to configure the LTM8045 as
OUT
a negative output inverting regulator.
SS(PinF1):Placeasoft-startcapacitorhere.Uponstart-up,
the SS pin will be charged by a (nominally) 275k resistor
to about 2.2V.
GND (Bank 3): Tie these GND pins to a local ground plane
below the LTM8045 and the circuit components. GND
+
–
MUST BE CONNECTED EITHER TO V
OR V
FOR
RT (Pin G1): The RT pin is used to program the switching
frequency of the LTM8045 by connecting a resistor from
this pin to ground. The necessary resistor value for the
OUT
OUT
PROPER OPERATION. In most applications, the bulk of
the heat flow out of the LTM8045 is through these pads,
so the printed circuit design has a large impact on the
thermal performance of the part. See the PCB Layout and
Thermal Considerations sections for more details. Return
LTM8045isdeterminedbytheequationR =(91.9/f )–1,
T
OSC
where f
T
is the typical switching frequency in MHz and
R is in kΩ. Do not leave this pin open.
OSC
the feedback divider (R ) to this net.
FB
RUN (Pin G3): This pin is used to enable/disable the chip
and restart the soft-start sequence. Drive below 1.235V
to disable the chip. Drive above 1.385V to activate chip
and restart the soft-start sequence. Do not float this pin.
V (Bank4):TheV pinsuppliescurrenttotheLTM8045’s
IN
IN
internal regulator and to the internal power switch. This
pin must be locally bypassed with an external, low ESR
capacitor.
FB (Pin A3): If configured as a SEPIC, the LTM8045
regulates its FB pin to 1.215V. Apply a resistor between
+
FB and V
. Its value should be R = [(V
– 1.215)/
OUT
FB
OUT
0.0833]kΩ. If the LTM8045 is configured as an inverting
converter,theLTM8045regulatestheFBpinto5mV.Apply
a resistor between FB and V
+ 0.005)/0.0833]kΩ.
–
of value R = [(|V
|
OUT
FB
OUT
8045fc
9
For more information www.linear.com/LTM8045
LTM8045
block DiagraM
–
+
V
IN
V
OUT
OUT
10µH
10µH
2µF
1µF
0.1µF
V
RUN
SS
FB
CURRENT
MODE
CONTROLLER
SYNC
RT
GND
8045 BD
8045fc
10
For more information www.linear.com/LTM8045
LTM8045
operaTion
The LTM8045 is a stand-alone switching DC/DC converter
that may be configured either as a SEPIC (single-ended
primary inductance converter) or inverting power supply
to an external source, drive a valid signal source into the
SYNC pin. An R resistor is required whether or not a
T
SYNC signal is applied. See the Applications Information
section for more details.
–
+
simply by tying V
or V
to GND, respectively.
OUT
OUT
It accepts an input voltage up to 18VDC. The output is
adjustable between 2.5V and 15V for the SEPIC, and
between –2.5V and –15V for the inverting configuration.
The LTM8045 also features RUN and SS pins to control
the start-up behavior of the device. The RUN pin may also
be used to implement an accurate undervoltage lockout
function by applying just one or two resistors.
The LTM8045 can provide 700mA at V = 12V when V
IN
OUT
= 2.5V or –2.5V.
The LTM8045 is equipped with a thermal shutdown to
protectthedeviceduringmomentaryoverloadconditions.
It is set above the 125°C absolute maximum internal tem-
perature rating to avoid interfering with normal specified
operation, so internal device temperatures will exceed
the absolute maximum rating when the overtemperature
protection is active. Therefore, continuous or repeated
activation of the thermal shutdown may impair device
reliability.
As shown in the Block Diagram, the LTM8045 contains a
current mode controller, power switching element, power
coupled inductor, power Schottky diode and a modest
amount of input and output capacitance. The LTM8045
is a fixed frequency PWM converter.
The LTM8045 switching can free run by applying a resis-
tor to the RT pin or synchronize to an external source at
a frequency between 200kHz and 2MHz. To synchronize
8045fc
11
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LTM8045
applicaTions inForMaTion
For most applications, the design process is straight
forward, summarized as follows:
maximum output current is limited by junction tempera-
ture, therelationshipbetweentheinputandoutputvoltage
magnitudes, polarity and other factors. Please refer to the
graphs in the Typical Performance Characteristics section
for guidance.
1. Look at Table 1 and find the row that has the desired
input range and output voltage.
2. Apply the recommended C , C , R and R values.
IN OUT FB
T
Themaximumfrequency(andattendantR value)atwhich
T
While these component combinations have been tested
for proper operation, it is incumbent upon the user to
verify proper operation over the intended system’s line,
load and environmental conditions. Bear in mind that the
the LTM8045 should be allowed to switch is given in
Table 1 in the f
column, while the recommended fre-
MAX
quency(andR value)foroptimalefficiencyoverthegiven
T
input condition is given in the f
column.
OPTIMAL
Table 1. Recommended Component Values and Configuration
(TA = 25°C. See the Typical Performance Characteristics for Load Conditions)
SEPIC Topology
V
(V)
V
(V)
C
C
R
FB
(k)
f
R
(k)
f
(MHz)
R
T(MIN)
(k)
IN
OUT
IN
OUT
OPTIMAL
T(OPTIMAL)
MAX
2.8 to 18
2.8 to 18
2.8 to 18
2.8 to 18
2.8 to 18
4.5 to 18
2.5
4.7µF, 25V, 1206
4.7µF, 25V, 1206
4.7µF, 25V, 1206
4.7µF, 25V, 1206
4.7µF, 25V, 1206
4.7µF, 25V, 1206
100µF, 6.3V, 1210
100µF, 6.3V, 1210
100µF, 6.3V, 1210
47µF, 10V, 1210
22µF, 16V, 1210
22µF, 25V, 1210
15.4
24.9
45.3
80.6
130
600kHz
700kHz
800kHz
1MHz
154
1.3
69.8
3.3
5
130
115
1.5
2
60.4
45.3
45.3
45.3
45.3
8
90.9
75.0
60.4
2
12
15
1.2MHz
1.5MHz
2
165
2
Inverting Topology
(V)
V
V
(V)
C
C
R
FB
(k)
f
R
(k)
f
(MHz)
R
T(MIN)
(k)
IN
OUT
IN
OUT
OPTIMAL
T(OPTIMAL)
MAX
2.8 to 18
2.8 to 18
2.8 to 18
2.8 to 18
2.8 to 18
4.5 to 18
–2.5
–3.3
–5
4.7µF, 25V, 0805
4.7µF, 25V, 0805
4.7µF, 25V, 0805
4.7µF, 25V, 1206
4.7µF, 25V, 1206
4.7µF, 25V, 1206
47µF, 6.3V, 1206
47µF, 6.3V, 1206
22µF, 6.3V, 1206
22µF, 10V, 1206
10µF, 16V, 1206
4.7µF, 25V, 1206
30.1
600kHz
154
1.3
1.5
2
69.8
39.2
60.4
95.3
143
650kHz
700kHz
1MHz
140
130
60.4
45.3
45.3
45.3
45.3
–8
90.9
75.0
60.4
2
–12
–15
1.2MHz
1.5MHz
2
178
2
8045fc
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LTM8045
applicaTions inForMaTion
Setting Output Voltage
When the SYNC pin is driven low (< 0.4V), the frequency
of operation is set by the resistor from RT to ground. The
T
The output voltage is set by connecting a resistor (R )
FB
to
R value is calculated by the following equation:
+
–
from V
to the FB pin for a SEPIC and from V
OUT
OUT
91.9
fOSC
the FB pin for an inverting converter. R is determined
FB
RT =
−1
from the equation R = [(V
– 1.215)/0.0833]kΩ for
FB
OUT
a SEPIC and from R = [(|V | + 0.005)/0.0833]kΩ for
FB
OUT
an inverting converter.
where f
is the typical switching frequency in MHz and
OSC
R is in kΩ.
T
Capacitor Selection Considerations
The C and C capacitor values in Table 1 are the
Switching Frequency Trade-Offs
IN
OUT
minimum recommended values for the associated oper-
ating conditions. Applying capacitor values below those
indicated in Table 1 is not recommended, and may result
in undesirable operation. Using larger values is generally
acceptable, and can yield improved dynamic response, if
it is necessary. Again, it is incumbent upon the user to
verify proper operation over the intended system’s line,
load and environmental conditions.
ItisrecommendedthattheuserapplytheoptimalR value
T
given in Table 1 for the corresponding input and output
operatingcondition. Systemlevelorotherconsiderations,
however, may necessitate another operating frequency.
While the LTM8045 is flexible enough to accommodate a
widerangeofoperatingfrequencies,ahaphazardlychosen
one may result in undesirable operation under certain op-
eratingorfaultconditions. Afrequencythatistoohighcan
reduceefficiency,generateexcessiveheatorevendamage
the LTM8045 in some fault conditions. A frequency that
is too low can result in a final design that has too much
output ripple or too large of an output capacitor.
Ceramic capacitors are small, robust and have very low
ESR. However, not all ceramic capacitors are suitable.
X5R and X7R types are stable over temperature and ap-
plied voltage and give dependable service. Other types,
including Y5V and Z5U have very large temperature and
voltage coefficients of capacitance. In an application cir-
cuit they may have only a small fraction of their nominal
capacitanceresultinginmuchhigheroutputvoltageripple
than expected.
Switching Frequency Synchronization
Theswitchingfrequencycanbesynchronizedtoanexternal
clocksource.To synchronizetotheexternalsource,simply
provide a digital clock signal at the SYNC pin. Switching
will occur at the SYNC clock frequency. Drive SYNC low
and the switching frequency will revert to the internal
free-running oscillator after a few clock periods.
A final precaution regarding ceramic capacitors concerns
the maximum input voltage rating of the LTM8045. A
ceramic input capacitor combined with trace or cable
inductance forms a high Q (under damped) tank circuit.
If the LTM8045 circuit is plugged into a live supply, the
input voltage can ring to twice its nominal value, possi-
bly exceeding the device’s rating. This situation is easily
avoided; see the Hot-Plugging Safely section.
Switching will stop if SYNC is driven high.
The duty cycle of SYNC must be between 35% and 65%
for proper operation. Also, the frequency of the SYNC
signal must meet the following two criteria:
1. SYNC may not toggle outside the frequency range of
200kHz to 2MHz unless it is stopped low to enable the
free-running oscillator.
Programming Switching Frequency
TheLTM8045hasanoperationalswitchingfrequencyrange
between 200kHz and 2MHz. The free running frequency is
programmed with an external resistor from the RT pin to
ground.Donotleavethispinopenunderanycircumstance.
2. The SYNC frequency can always be higher than the
free-running oscillator frequency, f , but should not
OSC
be less than 25% below f
(f
is set by R ).
OSC OSC T
8045fc
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LTM8045
applicaTions inForMaTion
Soft-Start
The RUN pin has a voltage hysteresis with typical thresh-
olds of 1.32V (rising) and 1.29V (falling) and an internal
circuit that draws typically 11.6µA at the RUN threshold.
The LTM8045 soft-start function controls the slew rate
of the power supply output voltage during start-up. A
controlled output voltage ramp minimizes output voltage
This makes R
optional, allowing UVLO implemen-
UVLO2
tation with a single resistor. Resistor R
is optional.
UVLO2
overshoot, reduces inrush current from the V supply,
IN
R
canbeincludedtoreducetheoverallUVLOvoltage
UVLO2
and facilitates supply sequencing. A capacitor connected
from the SS pin to GND programs the slew rate. In the
event of a commanded shutdown or lockout (RUN pin),
internal undervoltage lockout or a thermal shutdown, the
soft-start capacitor is automatically discharged before
chargingresumes,thusassuringthatthesoft-startoccurs
when the LTM8045 restarts. The soft-start time is given
by the equation:
variation caused by variations in the RUN pin current (see
the Electrical Characteristics section). A good choice for
R
UVLO2
R
UVLO1
is ≤10k 1%. After choosing a value for R
can be determined from either of the following:
,
UVLO2
V
IN(RISING) −1.32V
RUVLO1
=
1.32V
+11.6µA
RUVLO2
t
= C /5.45,
SS
SS
or
where C is in µF and t is in seconds.
V
IN(FALLING) −1.29V
SS
SS
RUVLO1
=
1.29V
Configurable Undervoltage Lockout
+11.6µA
RUVLO2
Figure 1 shows how to configure an undervoltage lock-
out (UVLO) for the LTM8045. Typically, UVLO is used in
situations where the input supply is current-limited, has
a relatively high source resistance, or ramps up/down
slowly. A switching regulator draws constant power from
the source, so source current increases as source voltage
drops. This looks like a negative resistance load to the
source and can cause the source to current-limit or latch
low under low source voltage conditions. UVLO prevents
the regulator from operating at source voltages where
these problems might occur.
where V
and V
are the V threshold
IN(FALLING) IN
IN(RISING)
voltages when rising or falling, respectively.
For example, to disable the LTM8045 for V voltages
below3.5Vusingthesingleresistorconfiguration,choose:
IN
3.5V −1.29V
RUVLO1
=
= 191k
1.29V
+11.6µA
∞
To activate the LTM8045 for V voltage greater than 4.5V
using the two resistor configuration, choose R
10k and:
IN
=
UVLO2
V
IN
V
IN
4.5V −1.32V
LTM8045
RUVLO1
=
= 22.1k
1.32V
R
R
UVLO1
UVLO2
+11.6µA
10k
RUN
Internal Undervoltage Lockout
The LTM8045 monitors the V supply voltage in case V
IN
IN
GND
drops below a minimum operating level (typically about
2.3V). When V is detected low, the power switch is
8045 F01
IN
deactivated, and while sufficient V voltage persists, the
IN
soft-startcapacitorisdischarged.AfterV isdetectedhigh,
IN
Figure 1. The RUN Pin May Be Used
to Implement an Accurate UVLO
the LTM8045 will reactivate and the soft-start capacitor
will begin charging.
8045fc
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LTM8045
applicaTions inForMaTion
Thermal Shutdown
6. Use vias to connect the GND copper area to the board’s
internal ground planes. Liberally distribute these GND
vias to provide both a good ground connection and
thermal path to the internal planes of the printed circuit
board. Pay attention to the location and density of the
thermal vias in Figures 2 and 3. The LTM8045 can
benefit from the heat sinking afforded by vias that con-
nect to internal GND planes at these locations, due to
theirproximitytointernalpowerhandlingcomponents.
The optimum number of thermal vias depends upon
the printed circuit board design. For example, a board
might use very small via holes. It should employ more
thermal vias than a board that uses larger holes.
If the part is too hot, the LTM8045 engages its thermal
shutdown, terminates switching and discharges the soft-
startcapacitor.Whentheparthascooled,thepartautomati-
cally restarts. This thermal shutdown is set to engage at
temperaturesabovethe125°Cabsolutemaximuminternal
operating rating to ensure that it does not interfere with
functionality in the specified operating range. This means
that internal temperatures will exceed the 125°C absolute
maximum rating when the overtemperature protection is
active, possibly impairing the device’s reliability.
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8045. The LTM8045 is neverthe-
less a switching power supply, and care must be taken to
minimize EMI and ensure proper operation. Even with the
high level of integration, you may fail to achieve specified
operation with a haphazard or poor layout. See Figure 2
for the suggested layout of the inverting topology applica-
tion and Figure 3 for the suggested layout of the SEPIC
topology application. Ensure that the grounding and heat
sinking are acceptable.
–
V
GND
V
IN
OUT
C
IN
R
FB
RUN
FB
C
OUT
RT
GND
GND
R
T
8045 F02
GROUND, THERMAL VIAS
A few rules to keep in mind are:
Figure 2. Layout Showing Suggested External
Components, GND Plane and Thermal Vias for
the Inverting Topology Application
1. Place the R and R resistors as close as possible to
FB
T
their respective pins.
2. Place the C capacitor as close as possible to the V
IN
IN
GND
V
IN
and GND connection of the LTM8045.
C
IN
3. Place the Cout capacitor as close as possible to the
+
–
V
and V
connections of the LTM8045.
OUT
OUT
FB
RUN
4. Place the C and C
capacitors such that their
OUT
IN
C
OUT
ground currents flow directly adjacent or underneath
R
FB
the LTM8045.
RT
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8045.
GND
R
+
T
V
OUT
8045 F03
GROUND, THERMAL VIAS
Figure 3. Layout Showing Suggested External
Components, GND Plane and Thermal Vias
for the SEPIC Topology Application
8045fc
15
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LTM8045
applicaTions inForMaTion
Hot-Plugging Safely
ThethermalresistancenumberslistedinthePinConfigura-
tion section of the data sheet are based on modeling the
µModule package mounted on a test board specified per
JESD 51-9 (“Test Boards for Area Array Surface Mount
PackageThermalMeasurements”).Thethermalcoefficients
provided in this page are based on JESD 51-12 (“Guide-
lines for Reporting and Using Electronic Package Thermal
Information”).
The small size, robustness and low impedance of ceramic
capacitors make them an attractive option for the input
bypass capacitor of the LTM8045. However, these capaci-
tors can cause problems if the LTM8045 is plugged into a
live input supply (see Application Note 88 for a complete
discussion).Thelowlossceramiccapacitorcombinedwith
stray inductance in series with the power source forms an
underdamped tank circuit, and the voltage at the V pin
Forincreasedaccuracyandfidelitytotheactualapplication,
many designers use FEA to predict thermal performance.
To that end, the Pin Configuration section of the data sheet
typically gives four thermal coefficients:
IN
of the LTM8045 can ring to more than twice the nominal
input voltage, possibly exceeding the LTM8045’s rating
and damaging the part. If the input supply is poorly con-
trolled or the user will be plugging the LTM8045 into an
energized supply, the input network should be designed
to prevent this overshoot. This can be accomplished by
• θ – Thermal resistance from junction to ambient
JA
• θ
– Thermal resistance from junction to the
JCbottom
bottom of the product case
installing a small resistor in series with V , but the most
IN
popular method of controlling input voltage overshoot is
• θ – Thermal resistance from junction to top of the
JCtop
to add an electrolytic bulk capacitor to the V net. This
IN
product case
capacitor’s relatively high equivalent series resistance
damps the circuit and eliminates the voltage overshoot.
The extra capacitor improves low frequency ripple filter-
ing and can slightly improve the efficiency of the circuit,
though it is physically large.
• θ – Thermal resistance from junction to the printed
JB
circuit board.
While the meaning of each of these coefficients may seem
to be intuitive, JEDEC has defined each to avoid confusion
and inconsistency. These definitions are given in JESD
51-12, and are quoted or paraphrased below:
Thermal Considerations
The LTM8045 output current may need to be derated if
it is required to operate in a high ambient temperature or
deliver a large amount of continuous power. The amount
of current derating is dependent upon the input voltage,
output power and ambient temperature. The temperature
rise curves given in the Typical Performance Character-
istics section can be used as a guide. These curves were
• θ is the natural convection junction-to-ambient air
JA
thermal resistance measured in a one cubic foot sealed
enclosure.Thisenvironmentissometimesreferredtoas
“still air” although natural convection causes the air to
move.Thisvalueisdeterminedwiththepartmountedto
a JESD 51-9 defined test board, which does not reflect
an actual application or viable operating condition.
2
generated by a LTM8045 mounted to a 25.8cm 4-layer
• θ
isthethermalresistancebetweenthejunction
JCbottom
FR4 printed circuit board with a copper thickness of 2oz
for the top and bottom layer and 1oz for the inner layers.
Boards of other sizes and layer count can exhibit differ-
ent thermal behavior, so it is incumbent upon the user to
verify proper operation over the intended system’s line,
load and environmental operating conditions.
and bottom of the package with all of the component
power dissipation flowing through the bottom of the
package. In the typical µModule converter, the bulk of
the heat flows out the bottom of the package, but there
is always heat flow out into the ambient environment.
As a result, this thermal resistance value may be useful
for comparing packages but the test conditions don’t
generally match the user’s application.
8045fc
16
For more information www.linear.com/LTM8045
LTM8045
applicaTions inForMaTion
• θ
is determined with nearly all of the component
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
JCtop
power dissipation flowing through the top of the pack-
age.AstheelectricalconnectionsofthetypicalµModule
converter are on the bottom of the package, it is rare
for an application to operate such that most of the heat
flows from the junction to the top of the part. As in the
caseofθ
,thisvaluemaybeusefulforcomparing
JCbottom
packages but the test conditions don’t generally match
A graphical representation of these thermal resistances
is given in Figure 4.
the user’s application.
• θ is the junction-to-board thermal resistance where
JB
The blue resistances are contained within the µModule
converter, and the green are outside.
almost all of the heat flows through the bottom of the
µModule converter and into the board, and is really
The die temperature of the LTM8045 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8045. The bulk of the heat flow out of the LTM8045
is through the bottom of the μModule converter and the
BGA pads into the printed circuit board. Consequently a
poor printed circuit board design can cause excessive
heating, resulting in impaired performance or reliability.
Please refer to the PCB Layout section for printed circuit
board design suggestions.
the sum of the θ
and the thermal resistance
JCbottom
of the bottom of the part through the solder joints and
throughaportionoftheboard.Theboardtemperatureis
measured a specified distance from the package, using
a two-sided, two layer board. This board is described
in JESD 51-9.
Giventhesedefinitions,itshouldnowbeapparentthatnone
of these thermal coefficients reflects an actual physical
operating condition of a µModule converter. Thus, none
of them can be individually used to accurately predict the
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION
AMBIENT
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
BOARD-TO-AMBIENT
RESISTANCE
RESISTANCE
8045 F04
µMODULE DEVICE
Figure 4.
8045fc
17
For more information www.linear.com/LTM8045
LTM8045
Typical applicaTions
–5V Inverting Converter
Maximum Output Current vs Input Voltage
–5VOUT Inverting Converter
650
LTM8045
600
550
500
450
400
350
300
–
V
V
V
IN
OUT
V
V
OUT
IN
2.8VDC TO
18VDC
–5V
RUN
SS
4.7µF
130k
60.4k
22µF
RT
FB
+
SYNC
OUT
GND
8045 TA02
2
4
6
8
10 12 14 16 18
INPUT VOLTAGE (V)
8045 TA02b
–5V Inverting Converter with Added Output Filter
Output Ripple and Noise
LTM8045
MPZ1608S601A
FERRITE BEAD
–
V
V
IN
OUT
V
V
OUT
IN
12VDC
–5V
580mA
RUN
SS
4.7µF
60.4k
200µV/DIV
22µF
10µF
RT
FB
+
SYNC
V
OUT
130k
GND
8045 TA03
8045 TA03b
500ns/DIV
MEASURED PER AN70,
USING HP461A AMPLIFIER,
150MHz BW
–12V Inverting Converter
LTM8045
–
V
V
V
IN
OUT
V
V
OUT
IN
2.8VDC TO
18VDC
–12V
RUN
SS
4.7µF
75.0k
143k
10µF
RT
FB
+
SYNC
OUT
GND
8045 TA04
8045fc
18
For more information www.linear.com/LTM8045
LTM8045
package DescripTion
Table 2. Pin Assignment Table (Arranged by Pin Number)
PIN NUMBER
FUNCTION
PIN NUMBER
FUNCTION
PIN NUMBER
FUNCTION
GND
PIN NUMBER
FUNCTION
GND
+
+
A1
A2
A3
A4
A5
V
V
B1
B2
B3
B4
B5
V
OUT
V
OUT
C1
C2
C3
C4
C5
D1
D2
D3
D4
D5
OUT
+
+
GND
GND
OUT
FB
GND
GND
GND
–
–
–
V
V
V
GND
GND
OUT
OUT
OUT
OUT
–
V
GND
GND
E1
E2
E3
E4
E5
SYNC
GND
GND
GND
GND
F1
F2
F3
F4
F5
SS
G1
G2
G3
G4
G5
RT
H1
H2
H3
H4
H5
GND
GND
GND
GND
GND
GND
GND
GND
RUN
V
IN
V
IN
V
V
IN
IN
package phoTo
8045fc
19
For more information www.linear.com/LTM8045
LTM8045
package DescripTion
Please refer to http://www.linear.com/product/LTM8045#packaging for the most recent package drawings.
/ / b b b
Z
2 . 5 4 0
1 . 2 7 0
0 . 3 1 7 5
0 . 3 1 7
0 . 0 0 0
1 . 2 7 0
2 . 5 4 0
8045fc
20
For more information www.linear.com/LTM8045
LTM8045
revision hisTory
REV
DATE
DESCRIPTION
PAGE NUMBER
A
02/13 Output voltage maximum: changed from 16V and –16V to 15V and –15V, respectively
02/14 Add SnPb BGA package option
1
B
1, 2
12
C
10/16 Table 1: changed from R to R
ADJ FB
8045fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
21
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LTM8045
Typical applicaTion
12V SEPIC Converter
Maximum Output Current vs Input
Voltage 12VOUT SEPIC
500
450
400
350
300
250
200
150
LTM8045
–
V
V
V
IN
OUT
V
IN
2.8VDC TO 18VDC
RUN
SS
4.7µF
75.0k
22µF
FB
+
RT
130k
SYNC
OUT
V
OUT
12V
GND
8045 TA05
2
4
6
8
10 12 14 16 18
INPUT VOLTAGE (V)
8045 TA05b
relaTeD parTs
PART NUMBER DESCRIPTION
COMMENTS
LTM8047
LTM8048
LTM8025
LTM8033
LTM8026
LTM8027
LTM4613
LTM8061
1.5W, 725VDC Isolated μModule Regulator
1.5W Output Power, 3.1V ≤ V ≤ 32V, 2.5V ≤ V
≤ 12V,
≤ 12V,
IN
OUT
9mm × 11.25mm × 4.92mm BGA Package
1.5W, 725VDC Isolated μModule Regulator with
Integrated Low Noise Post Regulator
1.5W Output Power, 3.1V ≤ V ≤ 32V, 1.2V ≤ V
IN
OUT
1mV Output Ripple, 9mm × 11.25mm × 4.92mm BGA Package
P-P
36V , 3A Step-Down μModule Regulator
3.6V ≤ V ≤ 36V, 0.8V ≤ V
≤ 24V, Synchronizable,
IN
IN
OUT
9mm × 15mm × 4.32mm LGA Package
36V, 3A EN55022 Class B Certified DC/DC Step-Down
μModule Regulator
3.6V ≤ V ≤ 36V, 0.8V ≤ V ≤ 24V, Synchronizable,
IN
OUT
11.25mm × 15mm × 4.3mm LGA
36V , 5A Step-Down μModule Regulator with
6V ≤ V ≤ 36V, 1.2V ≤ V ≤ 24V, Adjustable Current Limit,
IN
IN
OUT
Adjustable Current Limit
Synchronizable, 11.25mm × 15mm × 2.82mm LGA
60V , 4A DC/DC Step-Down μModule Regulator
4.5V ≤ V ≤ 60V, 2.5V ≤ V ≤ 24V, Synchronizable,
IN
IN
OUT
15mm × 15mm × 4.3mm LGA
≤ 15V, 5V ≤ V ≤ 36V, PLL Input, V Tracking and Margining,
OUT
36V , 8A EN55022 Class B Certified DC/DC Step-Down 3.3V ≤ V
IN
OUT
IN
μModule Regulator
15mm × 15mm × 4.3mm LGA
32V, 2A Step-Down μModule Battery Charger with
Programmable Input Current Limit
Suitable for CC-CV Charging Single and Dual Cell Li-Ion or Li-Poly Batteries,
4.95V ≤ V ≤ 32V, C/10 or Adjustable Timer Charge Termination, NTC
IN
Resistor Monitor Input, 9mm × 15mm × 4.32mm LGA
LTM8062A
32V, 2A Step-Down μModule Battery Charger with
Integrated Maximum Peak Power Tracking (MPPT) for
Solar Applications
Suitable for CC-CV Charging Method Battery Chemistries (Li-Ion, Li-Poly,
Lead-Acid, LiFePO ), User adjustable MPPT servo voltage, 4.95V ≤ V
≤
4
IN
32V, 3.3V ≤ V
≤ 18.8V Adjustable, C/10 or Adjustable Timer Charge
BATT
Termination, NTC Resistor Monitor Input, 9mm × 15mm × 4.32mm LGA
2
LTC2978
LTC2974
LTC3880
Octal Digital Power Supply Manager with EEPROM
Quad Digital Power Supply Manager with EEPROM
I C/PMBus Interface, Configuration EEPROM, Fault Logging, 16-Bit ADC with
0.25% TUE, 3.3V to 15V Operation
2
I C/PMBus Interface, Configuration EEPROM, Fault Logging, Per Channel
Voltage, Current and Temperature Measurements
Dual Output PolyPhase® Step-Down DC/DC Controller
with Digital Power System Management
I C/PMBus Interface, Configuration EEPROM, Fault Logging, 0.5% Output
Voltage, Accuracy, MOSFET Gate Drivers
2
8045fc
LT 1116 REV C • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
22
●
●
LINEAR TECHNOLOGY CORPORATION 2013
(408)432-1900 FAX: (408) 434-0507 www.linear.com/LTM8045
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