RH1086BHKDICE [Linear]

IC VREG ADJUSTABLE POSITIVE LDO REGULATOR, 1.25 V DROPOUT, MBFM3, METAL CAN, TO39, 3 PIN, Adjustable Positive Single Output LDO Regulator;
RH1086BHKDICE
型号: RH1086BHKDICE
厂家: Linear    Linear
描述:

IC VREG ADJUSTABLE POSITIVE LDO REGULATOR, 1.25 V DROPOUT, MBFM3, METAL CAN, TO39, 3 PIN, Adjustable Positive Single Output LDO Regulator

局域网 输出元件 调节器
文件: 总16页 (文件大小:251K)
中文:  中文翻译
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SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
REVISION RECORD  
DESCRIPTION  
REV  
DATE  
0
A
INITIAL RELEASE  
PAGE 11, FIGURES 6, 7, CHANGED θja AND θjc.  
PAGE 3, PARAGRAPH 3.8 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 1.  
PAGE 4, PARAGRAPH 5.0 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3.  
PARAGRAPH 5.2 ADDED “HEREIN” AFTER TABLE 2.  
06/02/98  
09/24/99  
B
03/07/01  
PARAGRAPH 6.2 ADDED “HEREIN” AFTER TABLE 3.  
PAGE 5, 6.3 CHANGED VERBIAGE ADDED “HEREIN” AFTER TABLE 3.  
REMOVED THE “M” FROM THE DEVICE TITLE, THROUGHOUT THE SPEC, TO MATCH THE  
DATA SHEET AND RPL.  
C
07/16/02  
PAGE 3, PARAGRAPH 3.6 CHANGED TO REFLECT ONLY FIGURE 1 FOR BOTH DEVICE  
OPTIONS.  
PARAGRAPH 3.7.1, CHANGED THE DOSAGE RATE FROM “APPROXIMATELY 20 RADS PER  
SECOND” TO “LESS THAN OR EQUAL TO 10 RADS PER SECOND”.  
PARAGRAPH 3.7.3, NOW REFLECTS TOTAL DOSE BIAS AS FIGURE 2.  
PAGE 4, PARAGRAPH 5.5, NOW REFLECTS BURN-IN CIRCUITS AS FIGURES 3 AND 4.  
PARAGRAPH 5.6, NOW REFLECTS CASE OUTLINES AS FIGURES 5 AND 6.  
PARAGRAPH 5.7, NOW REFLECTS TERMINAL CONNECTIONS AS FIGURES 7 AND 8.  
PARAGRAPH 6.1 CHANGED QUALITY ASSURANCE PROVISIONS TO STATE THAT LTC IS  
QML CERTIFIED AND THAT RAD HARD CANDIDATES ARE ASSEMBLED ON QUALIFIED  
CLASS S MANUFACTURING LINES.  
PAGES 6 THROUGH 12, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND  
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.  
CONVERSION OF SPECIFICATION FROM WORD PERFECT TO MICROSOFT WORD.  
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART  
REVISION  
INDEX  
PAGE NO.  
REVISION  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
I
15  
I
16  
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I
LINEAR TECHNOLOGY CORPORATION  
MILPITAS, CALIFORNIA  
TITLE: MICROCIRCUIT, LINEAR,  
RH1086BHK, 0.5A AND RH1086BKK, 1.5A,  
LOW DROPOUT POSITIVE  
ORIG  
DSGN  
ENGR  
MFG  
CM  
REGULATOR DICE  
SIZE  
CAGE  
CODE  
64155  
DRAWING  
NUMBER  
05-08-5134  
REV  
QA  
PROG  
I
APPLICATION  
FUNCT  
SIGNOFFS  
DATE CONTRACT:  
FOR OFFICIAL USE ONLY  
LINEAR TECHNOLOGY CORPORATION  
Page 1 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
REVISION RECORD  
DESCRIPTION  
CHANGED RH1086H TO RH1086BHK AND RH1086K TO RH1086BKK THROUGHOUT SPEC.  
REV  
DATE  
D
E
F
10/28/03  
03/22/05  
05/21/08  
PAGE 3, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.  
PAGE 4, PARAGRAPH 3.7.1 CHANGED VERBIAGE.  
PAGE 5, PARAGRAPH 5.8 CHANGED ALLOY 42 TO ALLOY 52 TO3 PACKAGE  
REQUIREMENT.  
G
09/11/09  
PAGE 10, FIGURE 4 STATIC BURN-IN CIRCUIT CHANGED TO 04-06-0302 PER. ENG.  
PAGE 16, CHANGED RH CANNED SAMPLE TABLE III FOR QUALIFYING DICE SALES  
ADDED TEMPERATURE CYCLE, CONSTANT ACCELERATION & REMOVED PIND TEST.  
H
12/07/10  
UPDATED REFERENCE VOLTAGE vs. POST IRRADIATION LIMITS IN TABLE II  
ELECTRICAL CHARACTERISTICS  
I
05/02/11  
PAGE 15, UPDATED REFERENCE POST IRRADIATION LIMITS IN TABLE II  
ELECTRICAL CHARACTERISTICS TO ADD MISSING DROPOUT VOLTAGE FOR “H”  
PACKAGE.  
FOR OFFICIAL USE ONLY  
LINEAR TECHNOLOGY CORPORATION  
Page 2 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
1.0  
2.0  
SCOPE:  
1.1  
This specification defines the performance and test requirements for a microcircuit processed to a  
space level manufacturing flow.  
APPLICABLE DOCUMENTS:  
2.1 Government Specifications and Standards: the following documents listed in the Department of  
Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation,  
form a part of this specification to the extent specified herein.  
SPECIFICATIONS:  
MIL-PRF-38535  
Integrated Circuits (Microcircuits) Manufacturing, General Specification  
for  
MIL-STD-883  
MIL-STD-1835  
Test Method and Procedures for Microcircuits  
Microcircuits Case Outlines  
2.2  
Order of Precedence: In the event of a conflict between the documents referenced herein and the  
contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535  
and other referenced specifications.  
3.0  
REQUIREMENTS:  
3.1  
General Description: This specification details the requirements for the RH1086BHK, 0.5A and  
RH1086BKK, 1.5A, Low Dropout Positive Regulator Dice and Element Evaluation Test Samples,  
processed to space level manufacturing flow as specified herein.  
3.2  
Part Number:  
3.2.1 OPTION 1 – RH1086BHK Dice  
3.2.2 OPTION 2 – RH1086BKK Dice  
3.3  
Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC  
dice. Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride  
passivation as on standard dice. Silicon nitride protects the dice surface from scratches by it’s hard  
and dense properties. The passivation on Rad Hard dice is silicon dioxide which is much “softer”  
than silicon nitride.  
LTC recommends that dice handling be performed with extreme care so as to protect the dice  
surface from scratches. If the need arises to move the die around from the chip tray, use a Teflon  
tipped vacuum wand. This wand can be made by pushing a small diameter of Teflon tubing onto  
the tip of a steel tipped wand. The inside diameter of the Teflon tip should match the dice size for  
efficient pickup. The tip of the Teflon should be cut square and flat to ensure good vacuum to dice  
surface. Ensure the Teflon tip remains clean from debris by inspecting under stereo scope.  
During die attach, care must be exercised to ensure no tweezers touch the top of the dice.  
LINEAR TECHNOLOGY CORPORATION  
Page 3 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
3.4  
The Absolute Maximum Ratings:  
.
.
Power Dissipation  
Input to Output Voltage Differential  
.
.
.
.
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.
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Internally Limited  
25V  
.
.
Operating Junction Temperature Range  
Control Section  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
-55°C to +150°C  
-55°C to +200°C  
-65°C to +150°C  
300°C  
Power Transistor  
Storage Temperature Range  
.
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Lead Temperature (Soldering, 10 sec)  
3.5  
3.6  
3.7  
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions,  
and electrical requirements shall be specified herein.  
Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall  
be specified in Figure 1.  
Radiation Hardness Assurance (RHA):  
3.7.1  
3.7.2  
3.7.3  
The manufacturer shall perform a lot sample test as an internal process monitor for total  
dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019  
Condition A as a guideline..  
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose  
irradiation, the manufacturer will provide certified RAD testing and report through an  
independent test laboratory when required as a customer purchase order line item.  
Total dose bias circuit is specified in Figure 2.  
3.8  
Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25°C to the limits shown in Table I  
herein. All reject dice shall be removed from the lot. This testing is normally performed prior to  
dicing the wafer into chips. Final specifications after assembly are sample tested during the  
element evaluation.  
3.9  
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535,  
Appendix A, except for the following: Top side glassivation thickness shall be a minimum of  
4KÅ.  
3.10  
3.11  
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of  
SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data  
Pack when specified as a customer purchase order line item.  
Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality  
Conformance Inspection.  
4.0  
5.0  
QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests  
and inspections specified herein.  
SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and  
subjected to element evaluation per Table III herein.  
LINEAR TECHNOLOGY CORPORATION  
Page 4 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
5.1  
100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in  
accordance with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from  
the lot.  
5.2  
5.3  
Electrical Performance Characteristics for Element Evaluation: The electrical performance  
characteristics shall be as specified in Table I and Table II herein.  
Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to  
element evaluation sample testing. No dice shall be delivered until all the lot sample testing has  
been performed and the results found to be acceptable unless the customer supplies a written  
approval for shipment prior to completion of wafer qualification as specified in this specification.  
5.4  
Part Marking of Element Evaluation Sample Includes:  
5.4.1 LTC Logo  
5.4.2 LTC Part Number  
5.4.3 Date Code  
5.4.4 Serial Number  
5.4.5 ESD Identifier per MIL-PRF-38535, Appendix A  
5.4.6 Diffusion Lot Number  
5.4.7 Wafer Number  
5.5  
5.6  
Burn-In Requirement: Burn-In circuit for TO39 package is specified in Figure 3 and Burn-In  
circuit for TO3 package is specified in Figure 4.  
Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with  
Figure 5 and Figure 6.  
5.7  
5.8  
Terminal Connections: The terminal connections shall be as specified in Figure 7 and Figure 8.  
Lead Material and Finish: The lead material and finish shall be Kovar for device option 1 and  
Alloy 52 for device option 2, with hot solder dip (Finish letter A) in accordance with MIL-PRF-  
38535.  
6.0  
VERIFICATION (QUALITY ASSURANCE PROVISIONS)  
6.1  
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-  
PRF-38535. Linear Technology is a QML certified company and all Rad Hard candidates are  
assembled on qualified Class S manufacturing lines.  
6.2  
6.3  
6.4  
Sampling and Inspection: Sampling and Inspection shall be in accordance with Table III herein.  
Screening: Screening requirements shall be in accordance with Table III herein.  
Source Inspection:  
LINEAR TECHNOLOGY CORPORATION  
Page 5 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
6.4.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal  
internal visual.  
6.4.2 The procuring activity has the right to perform source inspection at the supplier’s facility  
prior to shipment for each lot of deliverables when specified as a customer purchase order  
line item. This may include wafer lot acceptance, die visual, and final data review.  
6.5  
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:  
6.5.1 Lot Serial Number Sheets identifying all Canned Sample devices accepted through final  
inspection by serial number.  
6.5.2 100% attributes (completed element evaluation traveler).  
6.5.3 Element Evaluation variables data, including Burn-In and Op Life  
6.5.4 SEM photographs (3.10 herein)  
6.5.5 Wafer Lot Acceptance Report (3.9 herein)  
6.5.6 A copy of outside test laboratory radiation report if ordered  
6.5.7 Certificate of Conformance certifying that the devices meet all the requirements of this  
specification and have successfully completed the mandatory tests and inspections herein.  
Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment.  
7.0  
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice  
shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative  
material with an external conductive field shielding barrier.  
LINEAR TECHNOLOGY CORPORATION  
Page 6 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS  
OPTION 1, RH1086BHK, 0.5A DICE AND OPTION 2, RH1086BKK, 1.5A DICE  
“H” OR “K” (DEPENDING ON THE DEVICE OPTION)  
WILL BE REFLECTED HERE  
FIGURE 1  
LINEAR TECHNOLOGY CORPORATION  
Page 7 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
TOTAL DOSE BIAS CIRCUIT  
FIGURE 2  
LINEAR TECHNOLOGY CORPORATION  
Page 8 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
TO39 STATIC BURN-IN CIRCUIT  
OPTION 1, T039 METAL CAN / 3 LEADS  
FIGURE 3  
LINEAR TECHNOLOGY CORPORATION  
Page 9 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
STATIC BURN-IN CIRCUIT  
OPTION #2, TO3 / 2 LEADS  
FIGURE 4  
LINEAR TECHNOLOGY CORPORATION  
Page 10 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
DEVICE OPTION # 1  
(H) TO39 METAL CAN / 3 LEADS CASE OUTLINE  
FIGURE 5  
θ
ja = +150°C/W  
θjc = +40°C/W  
LINEAR TECHNOLOGY CORPORATION  
Page 11 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
DEVICE OPTION # 2  
(K) TO3 METAL CAN / 2 LEADS CASE OUTLINE  
θja = +35°C/W  
θjc = +3°C/W  
FIGURE 6  
LINEAR TECHNOLOGY CORPORATION  
Page 12 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
TERMINAL CONNECTIONS  
DEVICE OPTION #1, TO39 / 3 LEAD METAL CAN  
FIGURE 7  
DEVICE OPTION #2, TO3 / 2 LEAD METAL CAN  
FIGURE 8  
LINEAR TECHNOLOGY CORPORATION  
Page 13 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
TABLE I DICE ELECTRICAL CHARACTERISTICS – Element Evaluation (Note 1)  
LINEAR TECHNOLOGY CORPORATION  
Page 14 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
TABLE II ELECTRICAL CHARACTERISTICS (POSTIRRADIATION)  
TA = 25°C unless otherwise noted.  
LINEAR TECHNOLOGY CORPORATION  
Page 15 of 16  
SPEC NO. 05-08-5134 REV. I  
RH1086BHK, 0.5A AND RH1086BKK , 1.5A  
LOW DROPOUT POSITIVE REGULATOR DICE  
TABLE III RH ELEMENT EVALUATION TABLE QUALLIFICATION OF DICE SALES  
LINEAR TECHNOLOGY CORPORATION  
Page 16 of 16  

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