2410SFV1.25FM/125-2 [MACOM]
Surface-mount Fuses Fundamentals;型号: | 2410SFV1.25FM/125-2 |
厂家: | Tyco Electronics |
描述: | Surface-mount Fuses Fundamentals 电路保护 |
文件: | 总28页 (文件大小:2866K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface-mount Fuses
Fundamentals
Overview
TE Circuit Protection offers the widest selection of surface-mount
fuses available for addressing a broad range of overcurrent
protection applications. Helping to prevent costly damage and
promote
a safe environment for electronic and electrical
equipment, our single-use chip fuses provide performance stability
to support applications with current ratings from .5A up to 20A.
TE Circuit Protection also offers the telecom FT600 fuse for
telecommunications applications. This telecom fuse helps comply
with North American overcurrent protection requirements,
including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68),
and UL60950 3rd edition.
Multi-layer Design for Chip Fuses
The multi-layer design has the benefit of exposing more use
element surface area to the glass-ceramic absorptioatrial.
When the fuse elements open, there is more matrial for the
vaporizing fuse metals to absorb into, resulting in a ery ffcin
and effective quenching of the fuse arc.
Figure 1
Glass/Cerami
Substrat
Multiple Fuse
Elements
Substrate Single Fuse Glass
Material Element Coating
Figure 1 compared the multi-layer design of our F fuses with
standard glass coated designs. The lascoatd designrely on
the coating on only one side of thfuse elemeno absrb th
vaporizing fuse material when it oens. Terefr, here is mc
less absorption material available o sob tfsmetal.
result can be prolonged arcing anposible coatig brac.
Multi-layer Design
Single-layer Glass Coated Design
Figu2
Fault Zones
Figure 2 shows how the absorpton characteristis ttwo
designs differ. The multi-layer design indicates a clen eartio
with the fuse element evenly diffusig into the surrunding
ceramic substrate. In the glass coated degn, the element
diffusion takes place in a small portin othe deice ad is only
absorbed by the glass material diclaove tharea of failure.
11
Multi-layer Design
Single-layer Glass Coated Design
Wire-In-Air Design for 241SFFuses
The 2410(6125) is a Wire-In-Air SMD use which is very suitable
for secondary level over current protection applications.
Figure 3
Glass fiber enforced
epoxy body
Figure 3 compared our straight wire element design 2410SFV
fuses with normal corrugating wire design fuse. The straight wire
element in air performs consistent fusing and cutting
characteristics together with excellent inrush current
withstanding capability.
Straight wire element
Copper terminal
plated with Ni and Tin
Introduced PCB assembly technology into 2410SFV fuses design
and manufacture, we achieved on lead free completely and no
end cap falling off risk comparing with traditional ceramic body
with end cap fuse.
Ceramic body
Corrugate wire element
End cap plated with Tin
75
Temperature Derating
A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime.
Operating temperature should be taken into consideration when selecting the fuse current rting. The Thermal Derating Curve for
surface mount fuses is presented in Figure 4. Use it to determine the derating percentge based on operating temperature and
apply it to the derated system current.
Figure 4
1206/0603/0402 Series
2410 Series
Temperature Effect on Current Rating
Tempature ffect On Current Rating
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
11
105
100
95
90
85
80
75
70
65
60
55
50
0
-55
-35
-15
5
25
45
65
85
105
2
14
-55
-35
-15
5
25
45
65
85
105
125
Maximum OperatingTperatue
Maximm OperatingTemperature (°C)
Pulse Cycle Derating
Once the I2t value for the ppliction vform habeen
determined, it must be deratebaseon he nmbeoccls
expected over the system lifetime. ince the sess dued y te
current pulse is mechanical in nre, the nubr of times he
stress is applied has significaearing on hmuch deraing
must be applied to the fuse rating. Figure 5 presehcurent
pulse derating curve for our surfac-mont hip fses up to
100,000 cycles.
Figur
Surface-mount Fuse Pulse Derating Curve
100%
10%
100
1000
10000
100000
Number of Pulses
Selecting Surface-mounFues
11
Fuse selection seems straightforward, in that, you pick one which has a current rating just a bit higher than your worstcase system
operating current. Unfortunately, it’s not that simple. There are derating considerations for operating current and application
temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or
spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as
knowing the nominal current drawn by the system.
Fuse Selection Flowchart
However, the basic considerations for fuse selection are shown in the flowchart presented in Figure 6. Following this flow chart
will help you select a fuse best suited for your application conditions.
Figure 6
Step 1 –
Determine Steady State
Fuse Current Rating
Apply Standard Steady
State Derating (75%)
[Ifuse ≥ Isys/0.75]
Apply
Temperature Derating
[Ifuse ≥ Isys/0.75/Ktemp
Steady State
Fuse Current
Rating
]
Step 2 –
Step 3 –
Step 4 –
Step 5 –
Step 6 –
Determine Pulse
Waveform by
Calculating I2t
Apply Pulse
Cycle Derating
Apply Pulse
Temperature
Derating
Apply Derating
for Variance in
the Circuit
Select Fuse Current
Rating for Pulse
Environment
Step 7 – Select Fuse Current Rating
(use higher value between Step 1 and Step 6)
Step 8 – Check Voltage Rating
76
Surface-mount Fuses
Pulse Tolerant chip fuses has high inrush current
withstand capability and provide overcurrent protection
on DC power systems. Silver fusing element, monolithic
and multilayer design provides strong arc suppression
characteristics.
These RoHS-compliant surface-mount devices facilitate
the development of more reliable, high performane
consumer electronics such as laptops, multieia
devices, cell phones, and other portable electrnic.
Benefits
Features
• High inrush current withstandinapabilit
• Ceramic Monolithic structure
• Lead free materials and RoHS compliant
• Halogen free
(refers to: BrՅ900ppm, ClՅ900ppm, Br+ClՅ1500ppm)
• Silver fusing element and silvr teriation with
nickel and tin plating
• Monolithic, multilayer design
11
• Excellent temperature stability
• High-temperature performance
• Strong arc suppression characteristics
• -55°C to +125°C operating temperature range
Applications
• Laptops
• Printers
• Game systems
• LCD monitors
• Scanners
• Digital cameras
• Cell phones
• DVD players
• Portable electronics
77
Table FP1 Clear Time Characteristics for Pulse Tolerant Chip Fuses
% of rated current
100%
Clear time at 25°C
4 hours (min.)
200%
1 seconds (min.)
0.0002 second (min.)
60 seconds (mx.)
1000%
0.02 second(max.)
Table FP2 Typical Electrical Characteristics anDimensions for Pulse olerant Chip Fuses
0603 (1608 mm) Pulse Tolerant Chip Fuse
Ty pical
Max.
ElectricaCharacteristics
Interrupt Ratings
Rate
Nominal Nominal
D
A
Curnt Cold DCR
I2t
Voltage Current
(A2sec)†
(VDC
32
32
32
32
32
32
32
32
32
)
(A)
50
50
50
50
50
50
50
50
50
Part Nuber
(A)
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
(Ω)*
0.210
0.101
0.057
0.042
0.030
0.022
0.018
0.014
0.013
Shape and Dimensions
mm (Inch)
06SFP100F/32-
0603SFP150F2-2
0603SFP0F/32-2
0603FP250F/32-2
03SFP300F/32-2
0603SFP350F/32-2
0603SFP400F/32-2
0603SFP450F/32-2
0603SFP500F/32-2
0.080
0.11
0.24
0.56
0.72
1.10
2.08
2.63
3.25
B
A
B
C
D
Min
Max
Min
Mx
0.95
Min
Ma
Min
Max
mm
in
1.45
1.75
0.65
0.21
0.51
.6
0.9
(0.057) (0.069)
(0.026) (0.037)
0.08) (0.20)
(0.06) (.037)
1206 (3216 mm) Pulse TolranCip Fuses
Typical
Max.
Electrical Characteristics
Interrupt Ratings
A
Rated
Nominal Nominal
Current Cold DCR
I2t
Voltage Current
(A2sec)†
(VDC
63
63
63
32
32
32
32
32
32
)
(A)
50
50
50
50
50
50
50
50
50
11
Part Number
(A)
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
(Ω)*
0.340
0.150
0.090
0.070
0.035
0.029
0.023
0.021
0.017
Shape and Dimensions
mm (Inch)
1206SFP100F/63-2
1206SFP150F/63-2
1206SFP200F/63-2
1206SFP250F/32-2
1206SFP300F/32-2
1206SFP350F/32-2
1206SFP400F/32-2
1206SFP450F/32-2
1206SFP500F/32-2
0.11
0.33
0.80
1.19
1.35
1.84
2.74
3.20
5.50
B
C
A
B
C
D
Min
Max
Min
Max
Min
Max
Min
Max
mm
in
3.00
3.40
0.77
1.17
0.26
0.76
1.40
1.80
(0.118) (0.134)
(0.030) (0.046)
(0.010) (0.030)
(0.055) (0.071)
* Measured at Յ10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
78
RoHS Compliant, ELV Compliant
HF Halogen Free
Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses
Figure FP1
0603SFP AverageTime Current Curves
100
10
1
0.1
0.01
0.001
0.0001
1
10
100
Current (A
Figure FP2
3SFI2T vs. t Curves
10,000
1000
100
10
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
11
1.5A
1.0A
1
0.1
0.01
0.0001
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal
79
RoHS Compliant, ELV Compliant
HF Halogen Free
Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses
Cont’d
Figure FP3
1206SFP AverageTime Current Curves
10,000
100
1
0.01
0.001
1
10
100
Current (A)
Figure FP4
1206SFP I2T vs. t Curves
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
10,000
100
1
2.0A
1.5A
1.0A
11
0.01
0.0001
0.01
1
100
10,000
Time (s)
Note: Curves are nominal
ꢀ Please go to page 97 for more information for PulseTolerant Chip Fuses.
80
RoHS Compliant, ELV Compliant
HF Halogen Free
Surface-mount Fuses
0603 Very Fast-Acting Chip Fuses
Very Fast-acting chip fuses help provide overcurrent
protection on systems using DC power sources up to
32VDC. The fuse’s monolithic, multilayer design provides
the highest hold current in the smallest footprint,
reduces diffusion-related aging, improves product
reliability and resilience, and enhances high-temperature
performance in a wide range of circuit designs.
These RoHS-compliant surface-mount devices offer
strong arc suppression characteristics and facilitate the
development of more reliable, high performance
consumer electronics such as laptops, multimedia
devices, cell phones, and other portable electros.
Benefits
Featres
• Very fast acting at 200% and 30overlod
• ead free materials and RoHS compliant
• Excellent inrush current withstanding caabilita
high overloads
• Halogen free
(refers to: BrՅ900ppm, ClՅ900ppm, Br+ClՅ1500ppm)
• Thin body for space limiting applicaio
• Glass ceramic monolithic structr
• Monolithic, multilayer design
11
• High-temperature performance
• Silver fusing element and silvr rinatin with
nickel and tin plating
• -55°C to +125°C operating temperature range
• RoHS compliant and lead-fremaerials
• Symmetrical design with markon both sides
(optional)
Applications
• Laptops
• Printers
• Game systems
• LCD monitors
• Scanners
• Digital cameras
• Cell phones
• DVD players
• Portable electronics
81
Table FV1 Clear Time Characteristics for Very Fast-Acting Chip Fuses
% of rated current
100%
Clear time at 25°C
4 hours (min.)
200%
0.01 second (min.)
0.001 second (min.)
5 seconds (max.)
300%
0.2 seconds (max.)
Table FV2 Typical Electrical Characteristics and Dimensions fVery st-Acting Chip Fuses
0603 (1608 mm) Very Fast-Acting Chip Fuses
Typial Electrical Characteristics
Max. Interrupt Ratings
ated
Current
(A)
Nomina
Cold R
(Ω)*
Nominal
I2t
Voltage
(VDC)
Current
(A)
D
A
(A2sec)
PNumber
Shape and Dimensions
mm (Inch)
060FV050F/32-2
0.5
0.8
1.0
1.3
1.5
.8
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.860
0.450
0.280
0.205
0.143
0.0
0.073
0.046
0.039
0.028
0.023
0.019
0.015
0.0093
0.0191
0.0360
0.0630
0.0950
0.1400
0.2100
0.3000
0.4600
0.7300
1.1500
1.6800
2.6200
32
50
50
50
35
35
35
35
35
35
35
35
35
35
0603FV075F/32-2
0603FV100F/32-2
0603FV125F/32-2
063FV150F/32-2
0603SFV175F/32-2
0603SFV200F/32-2
0603FV250F/2-2
063FV3F/32-2
063FV350F/32-2
03FV400F/32-
603FV450F/2-2
060SFV0F/32-2
32
32
32
32
32
32
32
32
32
32
32
32
B
C
A
B
C
D
Min Max
Min Max
Min M
mm 1.45 1.75
0.22 0.48
0.21 0.51
0.0.95
in
(0.057) (0.069) (0.009) (0.019) (0.08) .020) (0.025) (0.07)
* Masured at 10% of rated current and 25°C
Figure FV1-FV2 Family Performacures for Very Fast-Acting Chip Fuses
Figure FV1
Figure FV2
0603SFV AveragTime urnt Curves
0603SFV I²t vs. t Curves
11
100
10
1000
100
10
5.00A
4.50A
4.00A
3.50A
3.00A
2.50A
2.00A
1.75A
1.50A
1.25A
1.00A
0.75A
0.05A
1
1
0.1
0.1
0.01
0.001
0.01
0.001
0.0001
1
0.0001
0.0001
10
100
0.001
0.01
0.1
1
10
Current (A)
Time (s)
Note: Curves are nominal
ꢀ Please go to page 97 for more information for Very Fast-Acting Chip Fuses.
82
RoHS Compliant, ELV Compliant
HF Halogen Free
Fast-acting chip fuses help provide overcurrent protection
on systems using DC power sources up to 63VDC. The
fuse’s monolithic, multilayer design provides the highest
hold current in the smallest footprint, reduces diffusion-
related aging, improves product reliability and resilienc,
and enhances high-temperature performance in wie
range of circuit designs.
These RoHS-compliant surface-mout deceffer
strong arc suppression characteristics and filate he
development of more reliabl, igh perforace
consumer electronics such alatops, ultimdia
devices, cell phones, and other portale eetonic
Benefits
Features
• Small size with high-current rting
• Excellent temperature stability
• High reliability and resilience
• Lead free materials and RoHS compliant
• Halogen free
, ppm, Br+ClՅ1500ppm)
• Monolithic, multilayer design
• Strong arc suppression characteristics
11
• High-temperature performance
• -55°C to +125°C operating temperature range
Applications
• Laptops
• Printers
• Game systems
• LCD monitors
• Scanners
• Digital cameras
• Cell phones
• DVD players
• Portable electronics
83
Table FF1 Clear Time Characteristics for Fast-Acting Chip Fses
% of rated current
100%
Clear time at 25°C
4 hours min.
250%
5 seconds max.
0.05 seconds max.
400%
Typical Electrical Characteriis, Dimnsions and Recomnded Pad Layout for
Fast-Acting Chip Fuses
Table FF2
0402 (1005mm) Fast-Acting Chip Fuss
y pical Electal Characteristics
Max. Interrupt Ratings
Shape and
Dimensions
Inch (mm)
0.020 0.004
(0.51 0.10)
0.039 0.004
(1. 0 0 0.10)
Rated
Curren
(A)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
Voltage
Current
(A)
(A2sec)†
(VDC
)
0.020 0.004
(0.51 0.10)
PaNumr
0402SFF050F/24
.50
0.75
1.00
1.50
2.00
3.00
4.00
0.380
0.210
0.120
0.056
0.035
0.021
0.014
0.0043
0.0076
0.0170
0.0490
0.0700
0.1250
0.2250
24
35
35
35
35
35
35
35
0.010 0.004
(0.25 0.10)
2FF075F/24
02FF100F/4
0402FF10F/24
040SFF200F/24
042SFF300F/24
0402SFF400F/24
24
24
24
24
24
24
0.06
(1. 6)
Recommended
Pad Layout
Inch (mm)
0.016
(0.4)
0.028
(0.70)
0.024
(0.60)
0603 (1608mm) Fast-Acinip Fuss
Typical Electrical Characteristics
Max. Interrupt Ratings
Shape and
Dimensions
Inch (mm)
0.031 0.006
(0.80 0.15)
Rated
Current
(A)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
0.063 0006
(1.60 .15)
Voltage
Current
(A)
(A2sec)†
(VDC
32
32
32
32
32
32
32
32
32
32
24
)
Part Number
0603SFF050F/32
0603SFF075F/32
0603SFF100F/32
0603SFF150F/32
0603SFF200F/32
0603SFF250F/32
0603SFF300F/32
0603SFF350F/32
0603SFF400F/32
0603SFF500F/32
0603SFF600F/24
0.50
0.75
1.00
1.50
2.00
2.50
3.00
3.50
4.00
5.00
6.00
0.485
0.254
0.131
0.059
0.044
0.032
0.025
0.024
0.018
0.013
0.010
0.0029
0.0064
0.0160
0.0300
0.0600
0.1150
0.1900
0.2950
0.4000
0.7000
1.1250
50
50
50
35
35
35
35
35
35
35
35
0.031 0.006
..
0.014 0.006
(0.36 0.15)
0.110
(2.80)
Recommended
Pad Layout
Inch (mm)
0.024
(0.60)
11
0.039
(1.00)
0.043
(1.09)
1206 (3216mm) Fast-Acting Chip Fuses
Typical Electrical Characteristics
Max. Interrupt Ratings
Rated
Current
(A)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
Voltage
Current
(A)
Shape and
Dimensions
Inch (mm)
0.063 0.008
(A2sec)†
(VDC
63
63
63
63
63
63
32
32
32
32
32
32
32
24
24
24
)
Part Number
(1.60 0.20)
0.126 0.008
(3.20 0.20)
1206SFF050F/63
1206SFF075F/63
1206SFF100F/63
1206SFF150F/63
1206SFF175F/63
1206SFF200F/63
1206SFF250F/32
1206SFF300F/32
1206SFF400F/32
1206SFF500F/32
1206SFF600F/32
1206SFF700F/32
1206SFF800F/32
1206SFF600F/24
1206SFF700F/24
1206SFF800F/24
0.50
0.75
1.00
1.50
1.75
2.00
2.50
3.00
4.00
5.00
6.00
7.00
8.00
6.00
7.00
8.00
0.730
0.513
0.220
0.120
0.100
0.050
0.035
0.031
0.022
0.015
0.013
0.011
0.008
0.013
0.011
0.008
0.0021
0.0052
0.0120
0.0250
0.0450
0.0700
0.1400
0.2200
0.3800
0.6000
1.0000
1.7500
2.5000
1.0000
1.7500
2.5000
50
50
50
50
50
50
50
50
45
45
50
50
50
45
45
45
0.043 0.008
(1.10 0.20)
0.020 0.010
(0.51 0.25)
Recommended
Pad Layout
Inch (mm)
0.173
(4.40)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
* Measured at Յ10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
84
RoHS Compliant, ELV Compliant
HF Halogen Free
Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses
Figure FF1
Figure FF2
0402SFF AverageTime Current Curves
402SFF I²t vs. t Curves
10
1000
100
10
4.0A
3.0A
2.0A
1.5A
1.0A
0.75A
0.5A
1
0.1
1
0.1
0.01
0.01
0.001
0.1
.001
0.001
1
10
100
0.01
0.1
1
10
Current (A)
Time (s)
Note: Curves are nominal
Figure FF3
Figure FF4
0603SFF AverageTie rrnt Curvs
0603SFF I²t vs. t Curves
10
10000
1000
100
10
11
6.0A
5.0A
4.0A
3.5A
3.0A
1
2.5A
2.0A
1.5A
1.0A
0.75A
0.5A
0.1
1
0.1
0.01
0.01
0.001
0.1
0.001
0.001
1
10
100
0.01
0.1
1
10
Current (A)
Time (s)
Note: Curves are nominal
85
RoHS Compliant, ELV Compliant
HF Halogen Free
Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fues
Cont’d
Figure FF5
Figure FF6
1206SFF AverageTime Current Curves
16SFF I²t vs. t Curves
10000
1000
100
10
10
8.0A
7.0A
6.0A
5.0A
4.0A
3.0A
2.5A
2.0A
1.75A
1.5A
1
1.0A
0.75A
0.5A
0.1
1
0.1
0.01
0.01
0.001
0.001
0.001
0.1
0.01
0.1
1
10
1
10
100
Time (s)
Current (A)
Note: Curves are nominal
ꢀ Please go to page 97 for morinfomation for Fast-Acting Chip Fuses.
11
86
RoHS Compliant, ELV Compliant
HF Halogen Free
Surface-mount Fuses
High-Current-Rated Chip Fuses
The monolithic multilayer design of the TE Circuit
Protection high-current-rated chip fuses helps to
provide some of the highest current ratings available in
the 1206 size and enhances high-temperature
performance in a wide range of circuit protection
designs. The devices’ small size, high reliability and
strong arc suppression characteristics make them
suitable for overcurrent protection of power supplies,
servers, communications equipment, voltage regulator
modules, and other high-current, small size applications.
Benefits
Features
• Glass ceramic monolithic structure rovis tabiliy
in application cycling
Lead fre materials and RoHS compliant
• Halgen free
• High-current rating in a small pckage allomre
efficient use in system space
(efers to: Br900ppm, Cl900ppm, Br+ClՅ1500ppm)
• Monolithic multilayer design
• Strong arc suppression in overcurrent codiions
11
• High-temperature performance
• -55°C to +125°C operating temperature range
Applications
• Communications equipment
• Voltage regulator modules
• Power supplies
• Servers
87
Table FH1 Clear Time Characteristics for High-Current-Rated Chip Fuses
1206SFH Series
% of rated current
100%
Clear time at 25°C
4 hours (min.)
250%
5 seconds (max.)
Typical Electrical Characteristics, iensions aRecommended Pad Layout for
High-Current-Rated Chip Fuses
Table FH2
1206 (3216mm) High-Current-Rated Chip Fuss
Typical lectrical
Characteristics
Max.
Interrupt Ratings
Shape and
Dimensions
Inch (mm)
0.063 0.008
(1.60 0.20)
0.126 0.008
(3.20 0.20)
Rated
Current
(A
Nominal
Cold DCR
(Ω)*
Nominal
I2t
Voltage
Current
(A)
Pat Nuber
(A2sec)†
(VDC
)
126SFH100F/24
126SFH120F/24
106SFH15F/24
106SFH200F/24
10
12
15
20
0.010
0.008
0.005
0.003
9
24
100
100
100
100
0.08 .008
(0.97 0.20)
14
26
56
24
24
24
0.020 0.010
(0.51 0.25)
Measured at Յ10% of rated current and 25°C ambient temperature.
Melting I2t at 0.001 sec clear time.
Recommended
Pad Layout
Inch (mm)
0.173
(4.40)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
Figure FH1-FH2 Family rormance Curves for High-Current-Rated Chip Fuses
Figure FH1
Figure FH2
1206SFH AverageTime Current Curves
1206SFH I²t vs. t Curves
11
10
10000
20A
15A
12A
10A
1
1000
100
10
0.1
0.01
0.001
10
1
100
1000
0.001
0.01
0.1
1
10
Current (A)
Time (s)
Note: Curves are nominal
ꢀ Please go to page 97 for more information for High-Current-Rated Chip Fuses.
88
RoHS Compliant, ELV Compliant
HF Halogen Free
Surface-mount Fuses
Slow-Blow Chip Fuses
Available in industry standard 1206 and 0603 chip sizes,
TE Circuit Protection’s slow-blow chip fuses help
provide overcurrent protection on systems that
experience large and frequent current surges as part of
their normal operation.
The slow-blow chip fuse’s monolithic, multilayer design
helps provide some of the highest current ratings
available in the 1206 and 0603 footprints and enhance
high-temperature performance in a wide range of circit
protection designs. The devices’ small siz, hih
reliability and strong arc suppression charateritc
make them suitable for overcurrent protetion of pe
supplies, capacitor filter banks, LC(Liqirytl
Display) backlight inverters, ectric mts an
portable electronics.
Benefits
Features
• Time-delayed design prevents nuisace eings
in pulsed and high inrush curent applictios
• Small size with high-current ratns
• Lead free materials and RoHS compliant
• Halogen free
(refers to: Br900ppm, Cl900ppm, Br+ClՅ1500ppm)
• Monolithic multilayer design
• Strong arc suppression charatistcs
11
• High-temperature performance
• -55°C to +125°C operating temperature range
Applications
• Small motors systems
• Portable electronics
• Input power ports
• Power over Ethernet (POE)
• Computer drives
• Displays
• Test equipment
• POL converter protection
• Printers
89
Table FS1 Clear Time Characteristics for Slow-Blow Chip Fuses
0603SFS Series
1206SFS Sers
% of rated current
100%
Clear time at 25°C
% of rated urrent
100%
Clear time at 25°C
4 hours (min.)
4 hours (min.)
200%
1 second (min.) 120 seconds (max.)
200%
1 second (min.) 120 seconds (max.)
300%
0.1 second (min.)
3 seconds (max.)
300%
0.1 second (min.)
3 seconds (max.)
800%(1.0A-1.5A)
800%(2.0A-5.0A)
0.0005 second (min.) 0.05 seconds (max.)
0.001 second (min.) 0.05 seconds (max.)
800%(1.0A-1.5A)
800%(2.0A-8.0A)
0.001second (min.) 0.05 seconds (max.)
.002 second (min.) 0.05 seconds (max.)
Typical Electrical CharactertisDnsions anRecommended Pad Layout for
Slow-Blow Chip Fuses
Table FS2
0603 (1608mm) Slow-Blow Chip Fuse
Typical Electrical
Characteristics
Max.
Interrupt Ratings
Shape and
Dimensions
Inch (mm)
0.031 0.006
(0.80 0.15)
0.060.006
(1.60.15)
Rated
Current
(A)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
Voltage
Current
(A)
Part Numr
(A2sec)†
(VDC
32
32
32
32
32
32
32
32
32
)
0.031 0.06
(0.80 0.5)
0603SFS100F/32
03SFS150F/32
0603SFS200F/32
0603SFS250F/32
0603SFS300F/32
0603SFS350F/32
0603SFS400F/32
0603SFS450F/32
0603SFS500F/32
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.200
0.100
0.052
0.041
0.031
0.021
0.017
0.015
0.013
0.093
0.18
0.32
0.63
0.87
1.20
2.30
2.70
3.20
50
50
50
50
50
50
50
50
50
0.014 0.006
(0.36 0.15)
0.110
(ꢀ.80)
Recommended
Pad Layout
Inch (mm)
0.0ꢀ4
(0.60)
0.039
(1.00)
0.043
(1.09)
1206 (3216mm) Slow-Blow Chip Fuses
Typical Electrical
Characteristics
Max.
Interrupt Ratings
Shape and
Dimensions
Inch (mm)
11
0.063 0.008
Rated
Current
(A)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
(1.60 0.ꢀ0)
0.1ꢀ6 0.008
(3.ꢀ0 0.ꢀ0)
Voltage
Current
(A)
Part Number
(A2sec)†
(VDC
63
63
63
63
32
32
32
32
32
32
24
24
24
24
)
1206SFS100F/63
1206SFS125F/63
1206SFS150F/63
1206SFS200F/63
1206SFS250F/32
1206SFS300F/32
1206SFS350F/32
1206SFS400F/32
1206SFS450F/32
1206SFS500F/32
1206SFS550F/24
1206SFS600F/24
1206SFS700F/24
1206SFS800F/24
1.0
1.25
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
7.0
8.0
0.360
0.200
0.150
0.088
0.065
0.034
0.028
0.024
0.020
0.016
0.014
0.011
0.010
0.009
0.11
0.22
0.23
0.63
0.90
1.20
1.60
2.20
3.60
5.30
6.40
8.50
10.00
16.90
50
50
50
50
50
50
50
50
50
50
50
60
60
60
0.038 0.008
(0.97 0.ꢀ0)
0.0ꢀ0 0.010
(0.51 0.ꢀ5)
Recommended
Pad Layout
Inch (mm)
0.173
(4.40)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
* Measured at Յ10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
90
RoHS Compliant, ELV Compliant
HF Halogen Free
Figure FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses
Figure FS1
0603SFS AverageTime Current Curves
100
10
1
0.1
0.01
0.001
1
10
100
Current (A)
Figure FS2
603SFS I²t vs. t Curves
10,000
1000
100
10
5.0A
4.5A
4.0A
3.5A
3.0A
ꢀ.5A
ꢀ.0A
11
1.5A
1.0A
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal
91
RoHS Compliant, ELV Compliant
HF Halogen Free
Figure FS1-FS4 Family Performance Curves for Slow-Blow ChFuses
Cont’d
Figure FS3
1206SFS AverageTime Current Curves
100
10
1
0.1
0.01
0.001
1
10
100
1000
Current (A)
Figure FS4
1206SFS I²t vs. t Curves
100000
10000
1000
100
8.0A
7.0A
6.0A
5.5A
5.0A
4.5A
4.0A
3.5A
3.0A
ꢀ.5A
ꢀ.0A
1.5A
1.ꢀ5A
11
1.0A
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal
ꢀ Please go to page 97 for more information for Slow-Blow Chip Fuses.
92
RoHS Compliant, ELV Compliant
HF Halogen Free
The 2410(6125) is Wire-in Air SMD Fuse which is very
suitable for secondary level overcurrent protection
applications.
These lead-free surface mount devices offer more
reliability and have no end cap falling off risk. Straigh
wire element in air performs consistent fusing ad
cutting characteristics.
Benefits
Features
• Very fast acting at 200% ovelod urrenlevel
• Excellent inrush current withandig apability
• High reliability and resilience
• Halogen free, RoHS compliant and 100% lead-free
• Copper or copper alloy composite fuse link
• Fiberglass enforced epoxy fuse body
• Wide range of current rating
• Strong arc suppression characteristics
• Copper terminal with nickel and tin plated
11
• -55°C to +125°C operating temperature range
(with de-rating)
Applications
• Industrial equipment
• LCD/PDP TV
• Power supplier
• Telecom system
• Networking
• Game systems
• White goods
• Automotive
• Backlight inverter
93
Table SFV1 Clear Time Characteristics for 2410 Very Fast-Acting Fuses
% of rated current
100%
Clear time at 25°C
4 hours (min.)
200% (0.5A-10.0A)
200% (12.0A-20.0A)
0.01 second (min.)
0.01 second (min.)
5 seconds (max.)
20 seconds (max.)
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
2410 Very Fast-Acting Fuses
Table SFV2
2410 (6125 mm) Very Fast-Acting Fuse
Shape and Dimensions
mm (Inch)
Recommended Pad Layout
mm (Inch)
A
B
C
D
6.86
(0.270)
D
Min
Max
Min
ax
Min
Max
Min
Max
A
2.95
(0.116)
C
mm
in
5.95
6.25
1.9
2.
.9
1.73
2.34
2.64
(0.234) (0.246) (.077) 0.09) (.038) (0.068) (0.092) (0.104)
3.15
(0.124)
B
1.96
(0.077)
Tpical Eecrial Chaactristics
Max. Interrupt Ratings
Rated
Current
(A)
Noal
old CR
(Ω)
Nominal
I2t
Voltage
Marking
Cod
Current
(A)
Part Number
(A2sec)
(VAC
)
(VDC
)
2410SFV0.50FM/125-2
2410SFV0.63FM/125-2
2410SFV0.75FM/125-2
2410SFV1.00FM/125-2
2410SFV1.25FM/125-2
2410SFV1.50FM/125-2
2410SFV2.00FM/125-2
2410SFV2.50FM/125-2
2410SFV3.00FM/125-2
2410SFV3.15FM/125-2
2410SFV3.50FM/125-2
2410SFV4.00FM/125-2
2410SFV5.00FM/125-2
2410SFV6.30FM/125-2
2410SFV7.00FM/125-2
2410SFV8.00FM/125-2
C
0.5
0.6
0.8
1.0
1.3
1.5
2.0
2.5
3.0
3.2
3.5
4.0
5.0
6.3
7.0
8.0
.2310
.1740
0.480
.0930
0.0700
0.0620
0.0420
0.0310
0.0249
0.0232
0.0220
0.0172
0.0143
0.0100
0.0094
0.0086
0.10
0.16
0.23
0.59
0.96
1.19
2.75
1.21
1.73
2.20
2.50
4.10
5.90
12.50
14.20
20.30
250
125
S
D
E
F
250
250
250
250
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
125
50A @ 250VAC
50A @ 125VDC
300A @ 32VDC
G
I
11
J
K
V
L
50A @ 125VAC
50A @ 125VDC
300A @ 32VDC
M
N
O
P
R
35A @ 125VAC
50A @ 125VDC
300A @ 32VDC
2410SFV10.0FM/125-2
Q
10.0
0.0066
29.20
125
125
50A @ 65VAC
50A @ 65VDC
300A @ 32VDC
2410SFV12.0FM/065-2
2410SFV15.0FM/065-2
X
Y
12.0
15.0
0.0053
0.0038
49.20
65
65
65
65
102.50
50A @ 65VAC
50A @ 65VDC
300A @ 32VDC
2410SFV20.0FM/065-2
Z
20.0
0.0034
126.20
65
65
* Measured at Յ10% of rated current and 25°C ambient temperature.
94
RoHS Compliant, ELV Compliant
HF Halogen Free
Figure SFV1-SFV2 Family Performance Curves for 2410 Very Fast-Acting Fuses
Figure SFV1
2410SFV AverageTime Current Curves
100
10
1
0.1
0.01
0.001
0.1
1
10
100
1000
rrent (A)
Figure SFV2
2410SFV I2T vs. t Curves
20.0A
15.0A
100,000
12.0A
10.0A
8.00A
7.00A
6.30A
5.00A
4.00A
3.50A
3.15A
3.00A
2.50A
2.00A
1.50A
1.25A
1.00A
0.75A
10,000
1000
100
10
11
0.63A
0.50A
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal
ꢀ Please go to page 97 for more information for 2410 Fast-Acting Fuses.
95
RoHS Compliant, ELV Compliant
HF Halogen Free
11
96
Specifications, Packaging Information, Agency Approvals and
Part Numbering Systems for All Fuses
Table F1 Environmental Specifications for All Fuses
Operating temperature
Mechanical vibration
Mechanical shock
Thermal shock
-55°C to +125°C
Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202
Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202
Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202
Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202
Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202
Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202
Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202
Յ30°C/ 85% RH
Resistance to soldering heat
Solderability
Moisture resistance
Salt spray
Storage temperature
Storage humidity
Per MIL-STD-202F, Method 106F
Table F2 Material Specifications for All Fuses
Construction body material
Termination material
Fuse element
Ceramic (1206/0603/0402); Fiberglass/Epoxy (2410)
Silver, Nickel, Tin
Silver(1206/0603/0402); Copper/Copper Alloy (241
Figure F1 Thermal Derating Current for All Fuses
1206/0603/0402 Series
Temperature Effect on Current Rating
10 Series
Temperature Effect on Current Rating
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
110
105
100
95
11
90
85
80
75
70
6
60
55
0
-55
50
-35
-15
5
25
45
65
85
10
125
145
-55
-35
-15
5
25
45
65
85
105
125
Maximum OperatingTemperure ()
Maximum OperatingTemperature (˚C)
Table F3 Electrical Specifiatios r All Fuses
Insulation resistance after opening
20,00minimum @ rated voltage. Fuse clearing under low voltage conditions may result in lower -
post-clearing insulation values. Under normal fault conditions TE Circuit Protection fuses provide
sufficient insulation resistance for circuit protection.
Current carrying capacity
Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419.
97
RoHS Compliant, ELV Compliant
HF Halogen Free
Table F4 Packaging Information for All Fuses
Reel Quantity
Carrier
Ta pe Size
Reels
Shipment Box
per Outside
Outside Shipment
Boxes per Overpack
Size
(pcs)
10,000
4,000
6,000
3,000
2,000
Reel Diameter
178mm white plastic
178mm white plastic
178mm white plastic
178mm white plastic
178mm white plastic
Reel Width
9.0 0.5mm
9.0 0.5mm
9.0 0.5mm
9.0 0.5mm
13.4 0.5mm
TapeTy
Paper
0402(1005)
0603(1608)
0603SFV(1608)
1206(3216)
2410(6125)
8.00 0.10mm
8.00 0.10mm
8.00 0.10mm
8.00 0.mm
12.00.10mm
5
5
5
5
4
1 to 10
1 to 10
1 to 10
1 to 10
1 to 10
Paper
Paper
Plastic
lasti
Figure F2 Recommended Soldering TemperurProfile fAll Fuses
tp
Critical Zone
TL toTp
Tp
TL
Ramp up
tL
TsMAX
TsMIN
ts
Ramp down
Preheat
25
t 2˚to Pea
Time
Reflow Profile
Classification Reflow Profiles
Profile Feature
1206/0603/0402
2410
Average ramp up rate (TsMAX tTp)
Preheat
3°C/second max.
3°C/second max.
• Temperature min. (TsMIN
• Temperature max. (TsMAX
• Time (tsMIN to tsMAX
)
150°C
150°C
)
200°C
200°C
11
)
-
-
Time maintained above:
• Temperature (TL)
• Time (tL)
217°C
200°C
60-150 seconds
260°C max.
30-90 seconds
250°C max.
Peak/Classification temperature (Tp)
Time within 5°C of actual peak temperature
Time (tp)
20-40 seconds
8 minutes max.
4°C/second max.
30-40 seconds
40-100 seconds
Natural cooling
From 25°C to preheating (150°C)
Ramp down rate
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
98
RoHS Compliant, ELV Compliant
HF Halogen Free
Table F5 Tape and Reel Specifications for All Fuses
Dimension in inches (mm)
Mark
0402 (1005)
0.069 0.004
(1.75 0.10)
0.138 0.002
(3.50 0.05)
0.315 0.004
(8.00 0.10)
0.079 0.004
(2.00 0.10)
0.157 0.004
(4.00 0.10)
0.079 0.002
(2.00 0.05)
0.059 0.004
(1.50+0.10/-0.00)
—
0603 (1608)
0.069 0.004
(1.75 0.10)
0.138 0.002
(3.50 0.05)
0.315 0.004
(8.00 0.10)
0.157 0.004
(4.00 0.10)
0.157 0.004
(4.00 0.10)
0.079 0.002
(2.00 0.05)
0.059 0.004
(1.50+0.10/-0.00)
1206 (3216)
0.069 0.004
(1.75 0.10)
0.138 0.002
(3.50 0.05)
0.315 0.004
(8.00 0.10)
0.157 0.004
(4.00 0.10)
0.157 0.004
(4.00 0.1)
0.079 0.002
(.00 0.05)
.059 0.004
(1.50+0.1/-0.00)
0.09 ax
0603SFV (1608)
0.069 0.004
(1.75 0.10)
0.138 0.002
(3.50 0.05)
0.315 0.004
8.00 0.10)
0.157 0.004
(4.00 .10)
0.157 0.004
(4.00 0.10)
0.079 0.002
(2.00 0.05)
0.059 0.004
(1.50+0.10/-0.00)
2410 (6125)
0.069 0.004
(1.75 0.10)
0.217 0.004
(5.50 0.10)
0.472 0.004
(12.00 0.10)
0.157 0.004
(4.00 0.10)
0.157 0.004
(4.00 0.10)
0.079 0.004
(2.00 0.10)
0.059 0.004
(1.50+0.10/-0.00)
0.61 0.004
(1.55 0.10)
0.010 0.002
(0.25 0.05)
0.112 0.004
(2.85 0.10)
0.252 0.004
(6.40 0.10)
0.093 0.004
(2.35 0.10)
E1
F
W
P1
P0
P2
D0
D1
t
(.00 max)
—
—
0.009 0.001
(0.23 0.02)
0.071 0.004
(1.80 0.10)
0.38 0.004
(50.10)
0.050 0.004
(1.27 0.1)
A0
B0
K0
0.026 0.004
(0.67 0.10)
0.046 0.004
(1.17 0.10)
0.025 0.004
(0.63 0.10)
0.039 0.004
(0.8 0.10)
0.01 0.04
(1.80.0)
0.037 0.003
(0.95 0.08)
0.039 0.004
(0.98 0.10)
0.071 0.004
(1.80 0.10)
0.024 0.003
(0.60 0.08)
Figure F3 Component TapDimensinfor ll Fuses
Paper CarrierTape Specifications
11
P
P2
D0
E1
F
W
B0
P1
D1
A0
K0
Plastic CarrierTape Specifications
t
D0
P0
P2
E1
F
W
B0
P1
D1
A0
K0
99
RoHS Compliant, ELV Compliant
HF Halogen Free
Figure F4 Reel Dimensions for All Fuses
Dimension (mm)
Dimension
W2
Description
Mark
1206/0603/0402
2410
60.2
13.4
16
Hub outer diameter
Reel inside width
Reel outside width
Tape width
B
60
9
W1
W2
B
11.4
8
W1
Agency Approvals for All Fuses
UL
File # E197536
Part Numbering System for Fast-Acting, Slo-Blw And 0603 Very FasActing Chip Fuses
1206 SF
F 400 F / 24 -2
Packaing
-2 =Tpe nd Reel
Voltaating
24 = VDC
Spcl ode
F
RoComliat
FM = oHS omliant + arked art
Rad
050 = 0.50 ps
400 = 4 Amps
Fue wTyp
F
= at Aing
S
= Slolow
11
SF Surface Mount Fuse
ize (1206, 0603, 0402)
Part Numbering System for High-Current-Rated Chip Fuses
1206 SF
H 100 F / 24 -2
Packaging
-2 =Tape and Reel
Voltage Rating
24 = 24VDC
Special Code
F
= RoHS Compliant
FM = RoHS Compliant + Marked Part
Rated Current
100 = 10 Amps
Fuse BlowType
H
= High Current
SF = Surface Mount Fuse
Size (1206)
100
RoHS Compliant, ELV Compliant
HF Halogen Free
Part Numbering System for 2410 Very Fast-Acting Fuses
2410 SF
V 6.30 FM / 125 -2
Packaging
-2 =Tape and Reel
Voltage Rating
125 = 125VDC
Special Code
F
= RoHS Compliant
M
= Marked Part
Rated Current
6.30= 6.30 Amps
Fuse BlowType
V
= Very Fast Acting
SF = Surface Mount Fue
Size (0.24*0.1inc)
11
Warning :
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and
test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies
(“TE”) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.TE’s only obligations
are those in the TE Standard Terms and Conditions of Sale for this product, and in no case will TE be liable for any incidental, indirect, or
consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In
addition,TE reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without
notification to Buyer.
101
RoHS Compliant, ELV Compliant
HF Halogen Free
11
102
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