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2410SFV12.0FM/065-2 [MACOM]

Surface-mount Fuses Fundamentals;
2410SFV12.0FM/065-2
型号： 2410SFV12.0FM/065-2
厂家： Tyco Electronics    Tyco Electronics
描述：

Surface-mount Fuses Fundamentals

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Surface-mount Fuses  
Fundamentals  
Overview  
TE Circuit Protection offers the widest selection of surface-mount  
fuses available for addressing a broad range of overcurrent  
protection applications. Helping to prevent costly damage and  
promote  
a safe environment for electronic and electrical  
equipment, our single-use chip fuses provide performance stability  
to support applications with current ratings from .5A up to 20A.  
TE Circuit Protection also offers the telecom FT600 fuse for  
telecommunications applications. This telecom fuse helps comply  
with North American overcurrent protection requirements,  
including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68),  
and UL60950 3rd edition.  
Multi-layer Design for Chip Fuses  
The multi-layer design has the benefit of exposing more
f
use  
element surface area to the glass-ceramic absorptio
n
m
at
e
rial.  
When the fuse elements open, there is more mat
e
rial for the  
vaporizing fuse metals to absorb into, resulting in a
v
ery
e
ff
i
ci
e
n
t  
and effective quenching of the fuse arc.  
Figure 1  
Glass/Cerami
c  
Substrat
e  
Multiple Fuse  
Elements  
Substrate Single Fuse Glass  
Material Element Coating  
Figure 1 compared the multi-layer design of our
S
F
F fuses with  
standard glass coated designs. The
g
las
s
coat
e
d design
s
rely on  
the coating on only one side of th
e
fuse elemen
t
t
o abs
o
rb th
e  
vaporizing fuse material when it o
p
ens. T
h
eref
o
r
e
,
t
here is m
u
c
h  
less absorption material available
t
o
a
b
so
r
b t
he
f
u
s
e
metal
s
.
T
h
e  
result can be prolonged arcing an
d
po
s
sible coati
n
g br
e
ac
h
.  
Multi-layer Design  
Single-layer Glass Coated Design  
Figu
r
e
2  
Fault Zones  
Figure 2 shows how the absorpt
i
on characteristi
c
s
of
t
he
two  
designs differ. The multi-layer design indicates a cle
a
n
s
e
p
ar
a
tio
n  
with the fuse element evenly diffusi
n
g into the surr
o
unding  
ceramic substrate. In the glass coated de
si
gn, the element  
diffusion takes place in a small porti
o
n o
f
the de
v
ice a
n
d is only  
absorbed by the glass material di
re
c
t
l
y
a
b
ove th
e
area of failure.  
11  
Multi-layer Design  
Single-layer Glass Coated Design  
Wire-In-Air Design for 241
0
SF
V
Fuses  
The 2410(6125) is a Wire-In-Air SMD
F
use which is very suitable  
for secondary level over current protection applications.  
Figure 3  
Glass fiber enforced  
epoxy body  
Figure 3 compared our straight wire element design 2410SFV  
fuses with normal corrugating wire design fuse. The straight wire  
element in air performs consistent fusing and cutting  
characteristics together with excellent inrush current  
withstanding capability.  
Straight wire element  
Copper terminal  
plated with Ni and Tin  
Introduced PCB assembly technology into 2410SFV fuses design  
and manufacture, we achieved on lead free completely and no  
end cap falling off risk comparing with traditional ceramic body  
with end cap fuse.  
Ceramic body  
Corrugate wire element  
End cap plated with Tin  
75  
Temperature Derating  
A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime.  
Operating temperature should be taken into consideration when selecting the fuse current r
a
ting. The Thermal Derating Curve for  
surface mount fuses is presented in Figure 4. Use it to determine the derating percent
a
ge based on operating temperature and  
apply it to the derated system current.  
Figure 4  
1206/0603/0402 Series  
2410 Series  
Temperature Effect on Current Rating  
Temp
er
ature
E
ffect On Current Rating  
105  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
11
0  
105  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
0
-55  
-35  
-15  
5
25  
45  
65  
85  
105  
1
2
5  
14
5  
-55  
-35  
-15  
5
25  
45  
65  
85  
105  
125  
Maximum OperatingT
e
m
peratu
r
e
(°C)  
Maxim
u
m OperatingTemperature (°C)  
Pulse Cycle Derating  
Once the I2t value for the
a
pplic
a
tion
w
a
v
e
form ha
s
been  
determined, it must be derate
d
base
d
on
t
he n
u
mbe
r
o
f
c
y
cl
e
s  
expected over the system lifetime.
S
ince the s
t
r
ess
i
n
du
c
ed
b
y t
h
e  
current pulse is mechanical in n
a
t
u
re, the nu
m
b
e
r of times
t
he  
stress is applied has significa
n
t
b
earing on h
ow
much dera
t
ing  
must be applied to the fuse rating. Figure 5 prese
n
ts
t
h
e
cu
r
rent  
pulse derating curve for our surfac
e
-mo
u
nt
c
hip f
u
ses up to  
100,000 cycles.  
Figur
e
5  
Surface-mount Fuse Pulse Derating Curve  
100%  
10%  
100  
1000  
10000  
100000  
Number of Pulses  
Selecting Surface-moun
t
Fu
s
es  
11  
Fuse selection seems straightforward, in that, you pick one which has a current rating just a bit higher than your worstcase system  
operating current. Unfortunately, it’s not that simple. There are derating considerations for operating current and application  
temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or  
spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as  
knowing the nominal current drawn by the system.  
Fuse Selection Flowchart  
However, the basic considerations for fuse selection are shown in the flowchart presented in Figure 6. Following this flow chart  
will help you select a fuse best suited for your application conditions.  
Figure 6  
Step 1 –  
Determine Steady State  
Fuse Current Rating  
Apply Standard Steady  
State Derating (75%)  
[Ifuse ≥ Isys/0.75]  
Apply  
Temperature Derating  
[Ifuse ≥ Isys/0.75/Ktemp  
Steady State  
Fuse Current  
Rating  
]
Step 2 –  
Step 3 –  
Step 4 –  
Step 5 –  
Step 6 –  
Determine Pulse  
Waveform by  
Calculating I2t  
Apply Pulse  
Cycle Derating  
Apply Pulse  
Temperature  
Derating  
Apply Derating  
for Variance in  
the Circuit  
Select Fuse Current  
Rating for Pulse  
Environment  
Step 7 – Select Fuse Current Rating  
(use higher value between Step 1 and Step 6)  
Step 8 – Check Voltage Rating  
76  
Surface-mount Fuses  
Pulse
T
o
lerant Chip Fuses  
Pulse Tolerant chip fuses has high inrush current  
withstand capability and provide overcurrent protection  
on DC power systems. Silver fusing element, monolithic  
and multilayer design provides strong arc suppression  
characteristics.  
These RoHS-compliant surface-mount devices facilitate  
the development of more reliable, high performan
c
e  
consumer electronics such as laptops, multi
m
e
d
ia  
devices, cell phones, and other portable electr
o
nic
s
.  
Benefits  
Features  
• High inrush current withstandin
g
c
apabilit
y  
• Ceramic Monolithic structure  
• Lead free materials and RoHS compliant  
• Halogen free  
(refers to: BrՅ900ppm, ClՅ900ppm, Br+ClՅ1500ppm)  
• Silver fusing element and silv
e
r ter
m
i
n
ation with  
nickel and tin plating  
• Monolithic, multilayer design  
11  
• Excellent temperature stability  
• High-temperature performance  
• Strong arc suppression characteristics  
• -55°C to +125°C operating temperature range  
Applications  
• Laptops  
• Printers  
• Game systems  
• LCD monitors  
• Scanners  
• Digital cameras  
• Cell phones  
• DVD players  
• Portable electronics  
77  
Table FP1 Clear Time Characteristics for Pulse Tolerant Chip Fuses  
% of rated current  
100%  
Clear time at 25°C  
4 hours (min.)  
200%  
1 seconds (min.)  
0.0002 second (min.)  
60 seconds (m
a
x.)  
1000%  
0.02 second
s
(max.)  
Table FP2 Typical Electrical Characteristics an
d
Dimensions for Pulse
T
olerant Chip Fuses  
0603 (1608 mm) Pulse Tolerant Chip Fuse
s  
Ty pical  
Max.  
Electrica
l
Characteristics  
Interrupt Ratings  
Rate
d  
Nominal Nominal  
D
A
Cur
r
e
nt Cold DCR  
I2t  
Voltage Current  
(A2sec)†  
(VDC  
32  
32  
32  
32  
32  
32  
32  
32  
32  
)
(A)  
50  
50  
50  
50  
50  
50  
50  
50  
50  
Part Nu
m
ber  
(A)  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
(Ω)*  
0.210  
0.101  
0.057  
0.042  
0.030  
0.022  
0.018  
0.014  
0.013  
Shape and Dimensions  
mm (Inch)  
06
0
3
SFP100F/32-
2  
0603SFP150F
/3
2-2  
0603SFP
20
0F/32-2  
0603
S
FP250F/32-2  
0
6
03SFP300F/32-2  
0603SFP350F/32-2  
0603SFP400F/32-2  
0603SFP450F/32-2  
0603SFP500F/32-2  
0.080  
0.11  
0.24  
0.56  
0.72  
1.10  
2.08  
2.63  
3.25  
B
C
A
B
C
D
Min  
Max  
Min  
M
a
x  
0.95  
Min  
Ma
x  
Min  
Max  
mm  
in  
1.45  
1.75  
0.65  
0.21  
0.51  
0
.6
5  
0.9
5  
(0.057) (0.069)  
(0.026) (0.037)  
(
0.0
0
8) (0.
0
20)  
(0.0
2
6) (
0
.037)  
1206 (3216 mm) Pulse Tol
e
ran
t
C
h
ip Fuses  
Typical  
Max.  
Electrical Characteristics  
Interrupt Ratings  
D
A
Rated  
Nominal Nominal  
Current Cold DCR  
I2t  
Voltage Current  
(A2sec)†  
(VDC  
63  
63  
63  
32  
32  
32  
32  
32  
32  
)
(A)  
50  
50  
50  
50  
50  
50  
50  
50  
50  
11  
Part Number  
(A)  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
(Ω)*  
0.340  
0.150  
0.090  
0.070  
0.035  
0.029  
0.023  
0.021  
0.017  
Shape and Dimensions  
mm (Inch)  
1206SFP100F/63-2  
1206SFP150F/63-2  
1206SFP200F/63-2  
1206SFP250F/32-2  
1206SFP300F/32-2  
1206SFP350F/32-2  
1206SFP400F/32-2  
1206SFP450F/32-2  
1206SFP500F/32-2  
0.11  
0.33  
0.80  
1.19  
1.35  
1.84  
2.74  
3.20  
5.50  
B
C
A
B
C
D
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
mm  
in  
3.00  
3.40  
0.77  
1.17  
0.26  
0.76  
1.40  
1.80  
(0.118) (0.134)  
(0.030) (0.046)  
(0.010) (0.030)  
(0.055) (0.071)  
* Measured at Յ10% of rated current and 25°C ambient temperature.  
† Melting I2t at 0.001 sec clear time.  
78  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses  
Figure FP1  
0603SFP AverageTime Current Curves  
100  
10  
1
0.1  
0.01  
0.001  
0.0001  
1
10  
100  
Current (A
)  
Figure FP2  
06
0
3SF
P
I2T vs. t Curves  
10,000  
1000  
100  
10  
5.0A  
4.5A  
4.0A  
3.5A  
3.0A  
2.5A  
2.0A  
11  
1.5A  
1.0A  
1
0.1  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
Time (s)  
Note: Curves are nominal  
79  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses  
Cont’d  
Figure FP3  
1206SFP AverageTime Current Curves  
10,000  
100  
1
0.01  
0.001  
1
10  
100  
Current (A)  
Figure FP4  
1206SFP I2T vs. t Curves  
5.0A  
4.5A  
4.0A  
3.5A  
3.0A  
2.5A  
10,000  
100  
1
2.0A  
1.5A  
1.0A  
11  
0.01  
0.0001  
0.01  
1
100  
10,000  
Time (s)  
Note: Curves are nominal  
ꢀ Please go to page 97 for more information for PulseTolerant Chip Fuses.  
80  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Surface-mount Fuses  
0603 Very Fast-Acting Chip Fuses  
Very Fast-acting chip fuses help provide overcurrent  
protection on systems using DC power sources up to  
32VDC. The fuse’s monolithic, multilayer design provides  
the highest hold current in the smallest footprint,  
reduces diffusion-related aging, improves product  
reliability and resilience, and enhances high-temperature  
performance in a wide range of circuit designs.  
These RoHS-compliant surface-mount devices offer  
strong arc suppression characteristics and facilitate the  
development of more reliable, high performance  
consumer electronics such as laptops, multimedia  
devices, cell phones, and other portable electro
n
i
c
s.  
Benefits  
Feat
u
res  
• Very fast acting at 200% and 3
0
0
%
overlo
a
d
s  
•
L
ead free materials and RoHS compliant  
• Excellent inrush current withstanding ca
p
abilit
y
a
t  
high overloads  
• Halogen free  
(refers to: BrՅ900ppm, ClՅ900ppm, Br+ClՅ1500ppm)  
• Thin body for space limiting applica
t
io
n
s  
• Glass ceramic monolithic struct
u
r
e  
• Monolithic, multilayer design  
11  
• High-temperature performance  
• Silver fusing element and silv
e
r
t
e
r
m
inati
o
n with  
nickel and tin plating  
• -55°C to +125°C operating temperature range  
• RoHS compliant and lead-fre
e
ma
t
erials  
• Symmetrical design with mark
i
n
g
on both sides  
(optional)  
Applications  
• Laptops  
• Printers  
• Game systems  
• LCD monitors  
• Scanners  
• Digital cameras  
• Cell phones  
• DVD players  
• Portable electronics  
81  
Table FV1 Clear Time Characteristics for Very Fast-Acting Chip Fuses  
% of rated current  
100%  
Clear time at 25°C  
4 hours (min.)  
200%  
0.01 second (min.)  
0.001 second (min.)  
5 seconds (max.)  
300%  
0.2 seconds (max.)  
Table FV2 Typical Electrical Characteristics and Dimensions f
o
r
Very
Fa
st-Acting Chip Fuses  
0603 (1608 mm) Very Fast-Acting Chip Fuses  
Typi
c
al Electrical Characteristics  
Max. Interrupt Ratings  
R
ated  
Current  
(A)  
Nomina
l  
Cold
D
C
R  
(Ω)*  
Nominal  
I2t  
Voltage  
(VDC)  
Current  
(A)  
D
A
(A2sec)  
P
a
r
t
Number  
Shape and Dimensions  
mm (Inch)  
060
3S
FV050F/32-2  
0.5  
0.8  
1.0  
1.3  
1.5  
1
.8  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
0.860  
0.450  
0.280  
0.205  
0.143  
0.0
95  
0.073  
0.046  
0.039  
0.028  
0.023  
0.019  
0.015  
0.0093  
0.0191  
0.0360  
0.0630  
0.0950  
0.1400  
0.2100  
0.3000  
0.4600  
0.7300  
1.1500  
1.6800  
2.6200  
32  
50  
50  
50  
35  
35  
35  
35  
35  
35  
35  
35  
35  
35  
0603
S
FV075F/32-2  
0603
S
FV100F/32-2  
0603
S
FV125F/32-2  
06
0
3
S
FV150F/32-2  
0603SFV175F/32-2  
0603SFV200F/32-2  
0603
S
FV250F/
3
2-2  
06
0
3
S
FV3
00
F/32-2  
06
0
3
S
FV350F/32-2  
0
60
3
S
FV400F/32-
2  
0
603
S
FV450F/
3
2-2  
060
3
SFV
5
0
0F/32-2  
32  
32  
32  
32  
32  
32  
32  
32  
32  
32  
32  
32  
B
C
A
B
C
D
Min Max  
Min Max  
Min M
ax  
M
i
n
M
a
x  
mm 1.45 1.75  
0.22 0.48  
0.21 0.51  
0.
6
5
0.95  
in  
(0.057) (0.069) (0.009) (0.019) (0.
0
08)
(0
.020) (0.025) (0.0
3
7)  
* M
e
asured at 10% of rated current and 25°C  
Figure FV1-FV2 Family Performa
n
c
e
C
ur
v
es for Very Fast-Acting Chip Fuses  
Figure FV1  
Figure FV2  
0603SFV Averag
e
Time
C
ur
re
nt Curves  
0603SFV I²t vs. t Curves  
11  
100  
10  
1000  
100  
10  
5.00A  
4.50A  
4.00A  
3.50A  
3.00A  
2.50A  
2.00A  
1.75A  
1.50A  
1.25A  
1.00A  
0.75A  
0.05A  
1
1
0.1  
0.1  
0.01  
0.001  
0.01  
0.001  
0.0001  
1
0.0001  
0.0001  
10  
100  
0.001  
0.01  
0.1  
1
10  
Current (A)  
Time (s)  
Note: Curves are nominal  
ꢀ Please go to page 97 for more information for Very Fast-Acting Chip Fuses.  
82  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Surface-mount Fuses  
Fast-Acting Chip Fuses  
Fast-acting chip fuses help provide overcurrent protection  
on systems using DC power sources up to 63VDC. The  
fuse’s monolithic, multilayer design provides the highest  
hold current in the smallest footprint, reduces diffusion-  
related aging, improves product reliability and resilienc
e
,  
and enhances high-temperature performance in
a
wi
d
e  
range of circuit designs.  
These RoHS-compliant surface-mou
n
t de
v
i
ce
s
o
ffer  
strong arc suppression characteristics and f
a
c
il
i
t
ate
t
he  
development of more reliabl
e
,
h
igh perfor
m
a
n
ce  
consumer electronics such a
s
la
p
tops,
m
ultim
e
dia  
devices, cell phones, and other porta
b
le e
l
e
c
t
r
onic
s
Benefits  
Features  
• Small size with high-current r
a
ting
s  
• Excellent temperature stability  
• High reliability and resilience  
• Lead free materials and RoHS compliant  
• Halogen free  
(refers to: Br
Յ
900ppm
,
Cl
Յ
900
ppm, Br+ClՅ1500ppm)  
• Monolithic, multilayer design  
• Strong arc suppression characteristics  
11  
• High-temperature performance  
• -55°C to +125°C operating temperature range  
Applications  
• Laptops  
• Printers  
• Game systems  
• LCD monitors  
• Scanners  
• Digital cameras  
• Cell phones  
• DVD players  
• Portable electronics  
83  
Table FF1 Clear Time Characteristics for Fast-Acting Chip F
u
ses  
% of rated current  
100%  
Clear time at 25°C  
4 hours min.  
250%  
5 seconds max.  
0.05 seconds max.  
400%  
Typical Electrical Characteri
s
t
i
c
s, Dim
e
nsions and Recom
m
e
nded Pad Layout for  
Fast-Acting Chip Fuses  
Table FF2  
0402 (1005mm) Fast-Acting Chip Fus
e
s  
T
y pical Elect
r
i
c
al Characteristics  
Max. Interrupt Ratings  
Shape and  
Dimensions  
Inch (mm)  
0.020 0.004  
(0.51 0.10)  
0.039 0.004  
(1. 0 0 0.10)  
Rated  
Curren
t  
(A)  
Nominal  
Cold DCR  
(Ω)*  
Nominal  
I2t  
Voltage  
Current  
(A)  
(A2sec)†  
(VDC  
)
0.020 0.004  
(0.51 0.10)  
Pa
rt
Num
be
r  
0402SFF050F/24  
0
.50  
0.75  
1.00  
1.50  
2.00  
3.00  
4.00  
0.380  
0.210  
0.120  
0.056  
0.035  
0.021  
0.014  
0.0043  
0.0076  
0.0170  
0.0490  
0.0700  
0.1250  
0.2250  
24  
35  
35  
35  
35  
35  
35  
35  
0.010 0.004  
(0.25 0.10)  
0
4
0
2
S
FF075F/24  
04
02
S
FF100F/
2
4  
0402
S
FF1
5
0F/24  
040
2
SFF200F/24  
04
0
2SFF300F/24  
0402SFF400F/24  
24  
24  
24  
24  
24  
24  
0.06
3  
(1. 6
0
)  
Recommended  
Pad Layout  
Inch (mm)  
0.016  
(0.4
0
)  
0.028  
(0.70)  
0.024  
(0.60)  
0603 (1608mm) Fast-Ac
t
in
g
C
h
ip Fus
e
s  
Typical Electrical Characteristics  
Max. Interrupt Ratings  
Shape and  
Dimensions  
Inch (mm)  
0.031 0.006  
(0.80 0.15)  
Rated  
Current  
(A)  
Nominal  
Cold DCR  
(Ω)*  
Nominal  
I2t  
0.063 0006  
(1.60
0
.15)  
Voltage  
Current  
(A)  
(A2sec)†  
(VDC  
32  
32  
32  
32  
32  
32  
32  
32  
32  
32  
24  
)
Part Number  
0603SFF050F/32  
0603SFF075F/32  
0603SFF100F/32  
0603SFF150F/32  
0603SFF200F/32  
0603SFF250F/32  
0603SFF300F/32  
0603SFF350F/32  
0603SFF400F/32  
0603SFF500F/32  
0603SFF600F/24  
0.50  
0.75  
1.00  
1.50  
2.00  
2.50  
3.00  
3.50  
4.00  
5.00  
6.00  
0.485  
0.254  
0.131  
0.059  
0.044  
0.032  
0.025  
0.024  
0.018  
0.013  
0.010  
0.0029  
0.0064  
0.0160  
0.0300  
0.0600  
0.1150  
0.1900  
0.2950  
0.4000  
0.7000  
1.1250  
50  
50  
50  
35  
35  
35  
35  
35  
35  
35  
35  
0.031 0.006  
(0
.
80 0
.
15)  
0.014 0.006  
(0.36 0.15)  
0.110  
(2.80)  
Recommended  
Pad Layout  
Inch (mm)  
0.024  
(0.60)  
11  
0.039  
(1.00)  
0.043  
(1.09)  
1206 (3216mm) Fast-Acting Chip Fuses  
Typical Electrical Characteristics  
Max. Interrupt Ratings  
Rated  
Current  
(A)  
Nominal  
Cold DCR  
(Ω)*  
Nominal  
I2t  
Voltage  
Current  
(A)  
Shape and  
Dimensions  
Inch (mm)  
0.063 0.008  
(A2sec)†  
(VDC  
63  
63  
63  
63  
63  
63  
32  
32  
32  
32  
32  
32  
32  
24  
24  
24  
)
Part Number  
(1.60 0.20)  
0.126 0.008  
(3.20 0.20)  
1206SFF050F/63  
1206SFF075F/63  
1206SFF100F/63  
1206SFF150F/63  
1206SFF175F/63  
1206SFF200F/63  
1206SFF250F/32  
1206SFF300F/32  
1206SFF400F/32  
1206SFF500F/32  
1206SFF600F/32  
1206SFF700F/32  
1206SFF800F/32  
1206SFF600F/24  
1206SFF700F/24  
1206SFF800F/24  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
6.00  
7.00  
8.00  
0.730  
0.513  
0.220  
0.120  
0.100  
0.050  
0.035  
0.031  
0.022  
0.015  
0.013  
0.011  
0.008  
0.013  
0.011  
0.008  
0.0021  
0.0052  
0.0120  
0.0250  
0.0450  
0.0700  
0.1400  
0.2200  
0.3800  
0.6000  
1.0000  
1.7500  
2.5000  
1.0000  
1.7500  
2.5000  
50  
50  
50  
50  
50  
50  
50  
50  
45  
45  
50  
50  
50  
45  
45  
45  
0.043 0.008  
(1.10 0.20)  
0.020 0.010  
(0.51 0.25)  
Recommended  
Pad Layout  
Inch (mm)  
0.173  
(4.40)  
0.059  
(1.50)  
0.071  
(1.80)  
0.057  
(1.45)  
* Measured at Յ10% of rated current and 25°C ambient temperature.  
† Melting I2t at 0.001 sec clear time.  
84  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses  
Figure FF1  
Figure FF2  
0402SFF AverageTime Current Curves  
0
402SFF I²t vs. t Curves  
10  
1000  
100  
10  
4.0A  
3.0A  
2.0A  
1.5A  
1.0A  
0.75A  
0.5A  
1
0.1  
1
0.1  
0.01  
0.01  
0.001  
0.1  
0
.001  
0.001  
1
10  
100  
0.01  
0.1  
1
10  
Current (A)  
Time (s)  
Note: Curves are nominal  
Figure FF3  
Figure FF4  
0603SFF AverageTi
m
e
Cu
rr
e
nt Curv
e
s  
0603SFF I²t vs. t Curves  
10  
10000  
1000  
100  
10  
11  
6.0A  
5.0A  
4.0A  
3.5A  
3.0A  
1
2.5A  
2.0A  
1.5A  
1.0A  
0.75A  
0.5A  
0.1  
1
0.1  
0.01  
0.01  
0.001  
0.1  
0.001  
0.001  
1
10  
100  
0.01  
0.1  
1
10  
Current (A)  
Time (s)  
Note: Curves are nominal  
85  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fu
s
es  
Cont’d  
Figure FF5  
Figure FF6  
1206SFF AverageTime Current Curves  
1
2
0
6SFF I²t vs. t Curves  
10000  
1000  
100  
10  
10  
8.0A  
7.0A  
6.0A  
5.0A  
4.0A  
3.0A  
2.5A  
2.0A  
1.75A  
1.5A  
1
1.0A  
0.75A  
0.5A  
0.1  
1
0.1  
0.01  
0.01  
0.001  
0.001  
0.001  
0.1  
0.01  
0.1  
1
10  
1
10  
100  
Time (s)  
Current (A)  
Note: Curves are nominal  
ꢀ Please go to page 97 for mor
e
info
r
mation for Fast-Acting Chip Fuses.  
11  
86  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Surface-mount Fuses  
High-Current-Rated Chip Fuses  
The monolithic multilayer design of the TE Circuit  
Protection high-current-rated chip fuses helps to  
provide some of the highest current ratings available in  
the 1206 size and enhances high-temperature  
performance in a wide range of circuit protection  
designs. The devices’ small size, high reliability and  
strong arc suppression characteristics make them  
suitable for overcurrent protection of power supplies,  
servers, communications equipment, voltage regulator  
modules, and other high-current, small size applications.  
Benefits  
Features  
• Glass ceramic monolithic structure
p
rovi
d
e
s
s
tabili
t
y  
in application cycling  
•
Lead fr
e
e materials and RoHS compliant  
• Hal
o
gen free  
• High-current rating in a small p
a
ckage allo
w
s
m
o
re  
efficient use in system space  
(
r
efers to: Br
Յ
900ppm, Cl
Յ
900ppm, Br+ClՅ1500ppm)  
• Monolithic multilayer design  
• Strong arc suppression in overcurrent co
n
di
t
ions  
11  
• High-temperature performance  
• -55°C to +125°C operating temperature range  
Applications  
• Communications equipment  
• Voltage regulator modules  
• Power supplies  
• Servers  
87  
Table FH1 Clear Time Characteristics for High-Current-Rated Chip Fuses  
1206SFH Series  
% of rated current  
100%  
Clear time at 25°C  
4 hours (min.)  
250%  
5 seconds (max.)  
Typical Electrical Characteristics,
D
i
m
ensions a
nd
Recommended Pad Layout for  
High-Current-Rated Chip Fuses  
Table FH2  
1206 (3216mm) High-Current-Rated Chip Fus
e
s  
Typical
E
lectrical  
Characteristics  
Max.  
Interrupt Ratings  
Shape and  
Dimensions  
Inch (mm)  
0.063 0.008  
(1.60 0.20)  
0.126 0.008  
(3.20 0.20)  
Rated  
Current  
(A
)  
Nominal  
Cold DCR  
(Ω)*  
Nominal  
I2t  
Voltage  
Current  
(A)  
Pa
r
t Nu
m
ber  
(A2sec)†  
(VDC  
)
12
0
6SFH100F/24  
12
0
6SFH120F/24  
1
2
06SFH15
0
F/24  
1
2
06SFH200F/24  
10  
12  
15  
20  
0.010  
0.008  
0.005  
0.003  
9
24  
100  
100  
100  
100  
0.0
3
8
0
.008  
(0.97 0.20)  
14  
26  
56  
24  
24  
24  
0.020 0.010  
(0.51 0.25)  
*
Measured at Յ10% of rated current and 25°C ambient temperature.  
†
Melting I2t at 0.001 sec clear time.  
Recommended  
Pad Layout  
Inch (mm)  
0.173  
(4.40)  
0.059  
(1.50)  
0.071  
(1.80)  
0.057  
(1.45)  
Figure FH1-FH2 Family
P
e
r
f
ormance Curves for High-Current-Rated Chip Fuses  
Figure FH1  
Figure FH2  
1206SFH AverageTime Current Curves  
1206SFH I²t vs. t Curves  
11  
10  
10000  
20A  
15A  
12A  
10A  
1
1000  
100  
10  
0.1  
0.01  
0.001  
10  
1
100  
1000  
0.001  
0.01  
0.1  
1
10  
Current (A)  
Time (s)  
Note: Curves are nominal  
ꢀ Please go to page 97 for more information for High-Current-Rated Chip Fuses.  
88  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Surface-mount Fuses  
Slow-Blow Chip Fuses  
Available in industry standard 1206 and 0603 chip sizes,  
TE Circuit Protection’s slow-blow chip fuses help  
provide overcurrent protection on systems that  
experience large and frequent current surges as part of  
their normal operation.  
The slow-blow chip fuse’s monolithic, multilayer design  
helps provide some of the highest current ratings  
available in the 1206 and 0603 footprints and enhance
s  
high-temperature performance in a wide range of circ
u
it  
protection designs. The devices’ small siz
e
, hi
g
h  
reliability and strong arc suppression chara
c
teri
s
t
i
c
s  
make them suitable for overcurrent prote
c
tion of p
o
w
e
r  
supplies, capacitor filter banks, LC
D
(Liq
u
i
d
C
ry
s
t
a
l  
Display) backlight inverters, e
l
e
ctric m
o
t
o
r
s an
d  
portable electronics.  
Benefits  
Features  
• Time-delayed design prevents nuisa
n
ce
o
p
e
n
ings  
in pulsed and high inrush cur
r
ent applic
a
tio
n
s  
• Small size with high-current rat
i
n
g
s  
• Lead free materials and RoHS compliant  
• Halogen free  
(refers to: Br
Յ
900ppm, Cl
Յ
900ppm, Br+ClՅ1500ppm)  
• Monolithic multilayer design  
• Strong arc suppression chara
c
t
e
r
ist
i
cs  
11  
• High-temperature performance  
• -55°C to +125°C operating temperature range  
Applications  
• Small motors systems  
• Portable electronics  
• Input power ports  
• Power over Ethernet (POE)  
• Computer drives  
• Displays  
• Test equipment  
• POL converter protection  
• Printers  
89  
Table FS1 Clear Time Characteristics for Slow-Blow Chip Fuses  
0603SFS Series  
1206SFS Ser
ie
s  
% of rated current  
100%  
Clear time at 25°C  
% of rated
c
urrent  
100%  
Clear time at 25°C  
4 hours (min.)  
4 hours (min.)  
200%  
1 second (min.) 120 seconds (max.)  
200%  
1 second (min.) 120 seconds (max.)  
300%  
0.1 second (min.)  
3 seconds (max.)  
300%  
0.1 second (min.)  
3 seconds (max.)  
800%(1.0A-1.5A)  
800%(2.0A-5.0A)  
0.0005 second (min.) 0.05 seconds (max.)  
0.001 second (min.) 0.05 seconds (max.)  
800%(1.0A-1.5A)  
800%(2.0A-8.0A)  
0.001
6
second (min.) 0.05 seconds (max.)  
0
.002 second (min.) 0.05 seconds (max.)  
Typical Electrical Character
i
s
ti
c
s
,
D
i
m
e
nsions an
d
Recommended Pad Layout for  
Slow-Blow Chip Fuses  
Table FS2  
0603 (1608mm) Slow-Blow Chip Fuse
s  
Typical Electrical  
Characteristics  
Max.  
Interrupt Ratings  
Shape and  
Dimensions  
Inch (mm)  
0.031 0.006  
(0.80 0.15)  
0.06
3
0.006  
(1.6
0
0.15)  
Rated  
Current  
(A)  
Nominal  
Cold DCR  
(Ω)*  
Nominal  
I2t  
Voltage  
Current  
(A)  
Part Num
b
e
r  
(A2sec)†  
(VDC  
32  
32  
32  
32  
32  
32  
32  
32  
32  
)
0.031 0.
0
06  
(0.80 0.
1
5)  
0603SFS100F/32  
0
60
3SFS150F/32  
0603SFS200F/32  
0603SFS250F/32  
0603SFS300F/32  
0603SFS350F/32  
0603SFS400F/32  
0603SFS450F/32  
0603SFS500F/32  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
0.200  
0.100  
0.052  
0.041  
0.031  
0.021  
0.017  
0.015  
0.013  
0.093  
0.18  
0.32  
0.63  
0.87  
1.20  
2.30  
2.70  
3.20  
50  
50  
50  
50  
50  
50  
50  
50  
50  
0.014 0.006  
(0.36 0.15)  
0.110  
(ꢀ.80)  
Recommended  
Pad Layout  
Inch (mm)  
0.0ꢀ4  
(0.60)  
0.039  
(1.00)  
0.043  
(1.09)  
1206 (3216mm) Slow-Blow Chip Fuses  
Typical Electrical  
Characteristics  
Max.  
Interrupt Ratings  
Shape and  
Dimensions  
Inch (mm)  
11  
0.063 0.008  
Rated  
Current  
(A)  
Nominal  
Cold DCR  
(Ω)*  
Nominal  
I2t  
(1.60 0.ꢀ0)  
0.1ꢀ6 0.008  
(3.ꢀ0 0.ꢀ0)  
Voltage  
Current  
(A)  
Part Number  
(A2sec)†  
(VDC  
63  
63  
63  
63  
32  
32  
32  
32  
32  
32  
24  
24  
24  
24  
)
1206SFS100F/63  
1206SFS125F/63  
1206SFS150F/63  
1206SFS200F/63  
1206SFS250F/32  
1206SFS300F/32  
1206SFS350F/32  
1206SFS400F/32  
1206SFS450F/32  
1206SFS500F/32  
1206SFS550F/24  
1206SFS600F/24  
1206SFS700F/24  
1206SFS800F/24  
1.0  
1.25  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
7.0  
8.0  
0.360  
0.200  
0.150  
0.088  
0.065  
0.034  
0.028  
0.024  
0.020  
0.016  
0.014  
0.011  
0.010  
0.009  
0.11  
0.22  
0.23  
0.63  
0.90  
1.20  
1.60  
2.20  
3.60  
5.30  
6.40  
8.50  
10.00  
16.90  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
50  
60  
60  
60  
0.038 0.008  
(0.97 0.ꢀ0)  
0.0ꢀ0 0.010  
(0.51 0.ꢀ5)  
Recommended  
Pad Layout  
Inch (mm)  
0.173  
(4.40)  
0.059  
(1.50)  
0.071  
(1.80)  
0.057  
(1.45)  
* Measured at Յ10% of rated current and 25°C ambient temperature.  
† Melting I2t at 0.001 sec clear time.  
90  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Figure FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses  
Figure FS1  
0603SFS AverageTime Current Curves  
100  
10  
1
0.1  
0.01  
0.001  
1
10  
100  
Current (A)  
Figure FS2  
0
603SFS I²t vs. t Curves  
10,000  
1000  
100  
10  
5.0A  
4.5A  
4.0A  
3.5A  
3.0A  
ꢀ.5A  
ꢀ.0A  
11  
1.5A  
1.0A  
1
0.1  
0.01  
0.001  
0.01  
0.1  
1
10  
100  
Time (s)  
Note: Curves are nominal  
91  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Figure FS1-FS4 Family Performance Curves for Slow-Blow Ch
i
p
Fuses  
Cont’d  
Figure FS3  
1206SFS AverageTime Current Curves  
100  
10  
1
0.1  
0.01  
0.001  
1
10  
100  
1000  
Current (A)  
Figure FS4  
1206SFS I²t vs. t Curves  
100000  
10000  
1000  
100  
8.0A  
7.0A  
6.0A  
5.5A  
5.0A  
4.5A  
4.0A  
3.5A  
3.0A  
ꢀ.5A  
ꢀ.0A  
1.5A  
1.ꢀ5A  
11  
1.0A  
10  
1
0.1  
0.01  
0.001  
0.01  
0.1  
1
10  
100  
Time (s)  
Note: Curves are nominal  
ꢀ Please go to page 97 for more information for Slow-Blow Chip Fuses.  
92  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Surface-mount Fuses  
2410 Very Fast-Acting Fuses  
The 2410(6125) is Wire-in Air SMD Fuse which is very  
suitable for secondary level overcurrent protection  
applications.  
These lead-free surface mount devices offer more  
reliability and have no end cap falling off risk. Straigh
t  
wire element in air performs consistent fusing a
n
d  
cutting characteristics.  
Benefits  
Features  
• Very fast acting at 200% ove
r
lo
a
d
c
urren
t
level  
• Excellent inrush current with
s
t
andi
n
g
c
apability  
• High reliability and resilience  
• Halogen free, RoHS compliant and 100% lead-free  
• Copper or copper alloy composite fuse link  
• Fiberglass enforced epoxy fuse body  
• Wide range of current rating  
• Strong arc suppression characteristics  
• Copper terminal with nickel and tin plated  
11  
• -55°C to +125°C operating temperature range  
(with de-rating)  
Applications  
• Industrial equipment  
• LCD/PDP TV  
• Power supplier  
• Telecom system  
• Networking  
• Game systems  
• White goods  
• Automotive  
• Backlight inverter  
93  
Table SFV1 Clear Time Characteristics for 2410 Very Fast-Acting Fuses  
% of rated current  
100%  
Clear time at 25°C  
4 hours (min.)  
200% (0.5A-10.0A)  
200% (12.0A-20.0A)  
0.01 second (min.)  
0.01 second (min.)  
5 seconds (max.)  
20 seconds (max.)  
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for  
2410 Very Fast-Acting Fuses  
Table SFV2  
2410 (6125 mm) Very Fast-Acting Fuse  
Shape and Dimensions  
mm (Inch)  
Recommended Pad Layout  
mm (Inch)  
A
B
C
D
6.86  
(0.270)  
D
Min  
Max  
Min  
M
ax  
Min  
Max  
Min  
Max  
A
2.95  
(0.116)  
C
mm  
in  
5.95  
6.25  
1.9
6  
2.
36  
0
.9
7  
1.73  
2.34  
2.64  
(0.234) (0.246) (
0
.077)
(
0.09
3
) (
0
.038) (0.068) (0.092) (0.104)  
3.15  
(0.124)  
B
1.96  
(0.077)  
T
y
pical E
l
ec
t
ri
c
al Cha
r
act
e
ristics  
Max. Interrupt Ratings  
Rated  
Current  
(A)  
No
min
al  
C
old
D
CR  
(Ω)
*  
Nominal  
I2t  
Voltage  
Marking  
Cod
e  
Current  
(A)  
Part Number  
(A2sec)  
(VAC  
)
(VDC  
)
2410SFV0.50FM/125-2  
2410SFV0.63FM/125-2  
2410SFV0.75FM/125-2  
2410SFV1.00FM/125-2  
2410SFV1.25FM/125-2  
2410SFV1.50FM/125-2  
2410SFV2.00FM/125-2  
2410SFV2.50FM/125-2  
2410SFV3.00FM/125-2  
2410SFV3.15FM/125-2  
2410SFV3.50FM/125-2  
2410SFV4.00FM/125-2  
2410SFV5.00FM/125-2  
2410SFV6.30FM/125-2  
2410SFV7.00FM/125-2  
2410SFV8.00FM/125-2  
C
0.5  
0.6  
0.8  
1.0  
1.3  
1.5  
2.0  
2.5  
3.0  
3.2  
3.5  
4.0  
5.0  
6.3  
7.0  
8.0  
0
.2310  
0
.1740  
0.
1
480  
0
.0930  
0.0700  
0.0620  
0.0420  
0.0310  
0.0249  
0.0232  
0.0220  
0.0172  
0.0143  
0.0100  
0.0094  
0.0086  
0.10  
0.16  
0.23  
0.59  
0.96  
1.19  
2.75  
1.21  
1.73  
2.20  
2.50  
4.10  
5.90  
12.50  
14.20  
20.30  
250  
125  
S
D
E
F
250  
250  
250  
250  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
125  
50A @ 250VAC  
50A @ 125VDC  
300A @ 32VDC  
G
I
11  
J
K
V
L
50A @ 125VAC  
50A @ 125VDC  
300A @ 32VDC  
M
N
O
P
R
35A @ 125VAC  
50A @ 125VDC  
300A @ 32VDC  
2410SFV10.0FM/125-2  
Q
10.0  
0.0066  
29.20  
125  
125  
50A @ 65VAC  
50A @ 65VDC  
300A @ 32VDC  
2410SFV12.0FM/065-2  
2410SFV15.0FM/065-2  
X
Y
12.0  
15.0  
0.0053  
0.0038  
49.20  
65  
65  
65  
65  
102.50  
50A @ 65VAC  
50A @ 65VDC  
300A @ 32VDC  
2410SFV20.0FM/065-2  
Z
20.0  
0.0034  
126.20  
65  
65  
* Measured at Յ10% of rated current and 25°C ambient temperature.  
94  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Figure SFV1-SFV2 Family Performance Curves for 2410 Very Fast-Acting Fuses  
Figure SFV1  
2410SFV AverageTime Current Curves  
100  
10  
1
0.1  
0.01  
0.001  
0.1  
1
10  
100  
1000  
Cu
rrent (A)  
Figure SFV2  
2410SFV I2T vs. t Curves  
20.0A  
15.0A  
100,000  
12.0A  
10.0A  
8.00A  
7.00A  
6.30A  
5.00A  
4.00A  
3.50A  
3.15A  
3.00A  
2.50A  
2.00A  
1.50A  
1.25A  
1.00A  
0.75A  
10,000  
1000  
100  
10  
11  
0.63A  
0.50A  
1
0.1  
0.01  
0.001  
0.01  
0.1  
1
10  
100  
Time (s)  
Note: Curves are nominal  
ꢀ Please go to page 97 for more information for 2410 Fast-Acting Fuses.  
95  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
11  
96  
Specifications, Packaging Information, Agency Approvals and  
Part Numbering Systems for All Fuses  
Table F1 Environmental Specifications for All Fuses  
Operating temperature  
Mechanical vibration  
Mechanical shock  
Thermal shock  
-55°C to +125°C  
Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202  
Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202  
Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202  
Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202  
Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202  
Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202  
Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202  
Յ30°C/ 85% RH  
Resistance to soldering heat  
Solderability  
Moisture resistance  
Salt spray  
Storage temperature  
Storage humidity  
Per MIL-STD-202F, Method 106F  
Table F2 Material Specifications for All Fuses  
Construction body material  
Termination material  
Fuse element  
Ceramic (1206/0603/0402); Fiberglass/Epoxy (2410)  
Silver, Nickel, Tin  
Silver(1206/0603/0402); Copper/Copper Alloy (241
0
)  
Figure F1 Thermal Derating Current for All Fuses  
1206/0603/0402 Series  
Temperature Effect on Current Rating  
2
4
10 Series  
Temperature Effect on Current Rating  
105  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
110  
105  
100  
95  
11  
90  
85  
80  
75  
70  
6
5  
60  
55  
0
-55  
50  
-35  
-15  
5
25  
45  
65  
85  
10
5  
125  
145  
-55  
-35  
-15  
5
25  
45  
65  
85  
105  
125  
Maximum OperatingTemper
at
ure (
˚C
)  
Maximum OperatingTemperature (˚C)  
Table F3 Electrical Specifi
c
atio
n
s
f
o
r All Fuses  
Insulation resistance after opening  
20,
0
00
Ω
minimum @ rated voltage. Fuse clearing under low voltage conditions may result in lower -  
post-clearing insulation values. Under normal fault conditions TE Circuit Protection fuses provide  
sufficient insulation resistance for circuit protection.  
Current carrying capacity  
Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419.  
97  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Table F4 Packaging Information for All Fuses  
Reel Quantity  
Carrier  
Ta pe Size  
Reels  
Shipment Box  
per Outside  
Outside Shipment  
Boxes per Overpack  
Size  
(pcs)  
10,000  
4,000  
6,000  
3,000  
2,000  
Reel Diameter  
178mm white plastic  
178mm white plastic  
178mm white plastic  
178mm white plastic  
178mm white plastic  
Reel Width  
9.0 0.5mm  
9.0 0.5mm  
9.0 0.5mm  
9.0 0.5mm  
13.4 0.5mm  
TapeTy
p
e  
Paper  
0402(1005)  
0603(1608)  
0603SFV(1608)  
1206(3216)  
2410(6125)  
8.00 0.10mm  
8.00 0.10mm  
8.00 0.10mm  
8.00 0.
10
mm  
12.0
0
0.10mm  
5
5
5
5
4
1 to 10  
1 to 10  
1 to 10  
1 to 10  
1 to 10  
Paper  
Paper  
Plastic  
P
lasti
c  
Figure F2 Recommended Soldering Temper
a
t
ur
e
Profile f
o
r
All Fuses  
tp  
Critical Zone  
TL toTp  
Tp  
TL  
Ramp up  
tL  
TsMAX  
TsMIN  
ts  
Ramp down  
Preheat  
25  
t 2
5
˚
C
to Pea
k  
Time  
Reflow Profile  
Classification Reflow Profiles  
Profile Feature  
1206/0603/0402  
2410  
Average ramp up rate (TsMAX t
o
Tp)  
Preheat  
3°C/second max.  
3°C/second max.  
• Temperature min. (TsMIN  
• Temperature max. (TsMAX  
• Time (tsMIN to tsMAX  
)
150°C  
150°C  
)
200°C  
200°C  
11  
)
60
-
180 seconds  
40
-
100 seconds  
Time maintained above:  
• Temperature (TL)  
• Time (tL)  
217°C  
200°C  
60-150 seconds  
260°C max.  
30-90 seconds  
250°C max.  
Peak/Classification temperature (Tp)  
Time within 5°C of actual peak temperature  
Time (tp)  
20-40 seconds  
8 minutes max.  
4°C/second max.  
30-40 seconds  
40-100 seconds  
Natural cooling  
From 25°C to preheating (150°C)  
Ramp down rate  
Recommended conditions for hand soldering:  
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,  
do not directly contact the chip termination with the tip of soldering iron.  
2. Preheating: 150°C, 60s (min).  
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.  
98  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Table F5 Tape and Reel Specifications for All Fuses  
Dimension in inches (mm)  
Mark  
0402 (1005)  
0.069 0.004  
(1.75 0.10)  
0.138 0.002  
(3.50 0.05)  
0.315 0.004  
(8.00 0.10)  
0.079 0.004  
(2.00 0.10)  
0.157 0.004  
(4.00 0.10)  
0.079 0.002  
(2.00 0.05)  
0.059 0.004  
(1.50+0.10/-0.00)  
—
0603 (1608)  
0.069 0.004  
(1.75 0.10)  
0.138 0.002  
(3.50 0.05)  
0.315 0.004  
(8.00 0.10)  
0.157 0.004  
(4.00 0.10)  
0.157 0.004  
(4.00 0.10)  
0.079 0.002  
(2.00 0.05)  
0.059 0.004  
(1.50+0.10/-0.00)  
—
1206 (3216)  
0.069 0.004  
(1.75 0.10)  
0.138 0.002  
(3.50 0.05)  
0.315 0.004  
(8.00 0.10)  
0.157 0.004  
(4.00 0.10)  
0.157 0.004  
(4.00 0.1
0
)  
0.079 0.002  
(
2
.00 0.05)  
0
.059 0.004  
(1.50+0.1
0
/-0.00)  
0.0
3
9
m
ax  
0603SFV (1608)  
0.069 0.004  
(1.75 0.10)  
0.138 0.002  
(3.50 0.05)  
0.315 0.004  
(
8.00 0.10)  
0.157 0.004  
(4.00
0
.10)  
0.157 0.004  
(4.00 0.10)  
0.079 0.002  
(2.00 0.05)  
0.059 0.004  
(1.50+0.10/-0.00)  
—
2410 (6125)  
0.069 0.004  
(1.75 0.10)  
0.217 0.004  
(5.50 0.10)  
0.472 0.004  
(12.00 0.10)  
0.157 0.004  
(4.00 0.10)  
0.157 0.004  
(4.00 0.10)  
0.079 0.004  
(2.00 0.10)  
0.059 0.004  
(1.50+0.10/-0.00)  
0.61 0.004  
(1.55 0.10)  
0.010 0.002  
(0.25 0.05)  
0.112 0.004  
(2.85 0.10)  
0.252 0.004  
(6.40 0.10)  
0.093 0.004  
(2.35 0.10)  
E1  
F
W
P1  
P0  
P2  
D0  
D1  
t
(
1
.00 max)  
—
—
0.009 0.001  
(0.23 0.02)  
0.071 0.004  
(1.80 0.10)  
0.
1
38 0.004  
(
3
5
0
0.10)  
0.050 0.004  
(1.27 0.1
0
)  
—
A0  
B0  
K0  
0.026 0.004  
(0.67 0.10)  
0.046 0.004  
(1.17 0.10)  
0.025 0.004  
(0.63 0.10)  
0.039 0.004  
(0.
9
8 0.10)  
0.0
7
1 0.0
0
4  
(1.8
0
0.
1
0)  
0.037 0.003  
(0.95 0.08)  
0.039 0.004  
(0.98 0.10)  
0.071 0.004  
(1.80 0.10)  
0.024 0.003  
(0.60 0.08)  
Figure F3 Component Tap
e
Dimensi
o
n
s
for
A
ll Fuses  
Paper CarrierTape Specifications  
11  
P
P2  
D0  
E1  
F
W
B0  
P1  
D1  
A0  
K0  
Plastic CarrierTape Specifications  
t
D0  
P0  
P2  
E1  
F
W
B0  
P1  
D1  
A0  
K0  
99  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Figure F4 Reel Dimensions for All Fuses  
Dimension (mm)  
Dimension  
W2  
Description  
Mark  
1206/0603/0402  
2410  
60.2  
13.4  
16  
Hub outer diameter  
Reel inside width  
Reel outside width  
Tape width  
B
60  
9
W1  
W2  
B
11.4  
8
W1  
Agency Approvals for All Fuses  
UL  
File # E197536  
Part Numbering System for Fast-Acting, Slo
w
-Bl
o
w And 0603 Very Fas
t
-
Acting Chip Fuses  
1206 SF  
F 400 F / 24 -2  
Packa
g
ing  
-2 =T
a
pe
a
nd Reel  
Volta
g
e
R
ating  
24 =
2
4
VDC  
Sp
e
c
ia
l
C
ode  
F
=
Ro
H
S
Com
p
lia
n
t  
FM = 
R
oHS
C
om
p
liant +
M
arked
P
art  
Ra
t
e
d
C
ur
r
ent  
050 = 0.50
A
m
ps  
400 = 4 Amps  
Fu
s
e
Bl
o
wTyp
e  
F
=
F
a
s
t A
c
t
ing  
S
= Slo
w
B
low  
11  
SF
=
Surface Mount Fuse  
S
ize (1206, 0603, 0402)  
Part Numbering System for High-Current-Rated Chip Fuses  
1206 SF  
H 100 F / 24 -2  
Packaging  
-2 =Tape and Reel  
Voltage Rating  
24 = 24VDC  
Special Code  
F
= RoHS Compliant  
FM = RoHS Compliant + Marked Part  
Rated Current  
100 = 10 Amps  
Fuse BlowType  
H
= High Current  
SF = Surface Mount Fuse  
Size (1206)  
100  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
Part Numbering System for 2410 Very Fast-Acting Fuses  
2410 SF  
V 6.30 FM / 125 -2  
Packaging  
-2 =Tape and Reel  
Voltage Rating  
125 = 125VDC  
Special Code  
F
= RoHS Compliant  
M
= Marked Part  
Rated Current  
6.30= 6.30 Amps  
Fuse BlowType  
V
= Very Fast Acting  
SF = Surface Mount Fu
s
e  
Size (0.24*0.1
0
inc
h
)  
11  
Warning :  
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and  
test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies  
(“TE”) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.TE’s only obligations  
are those in the TE Standard Terms and Conditions of Sale for this product, and in no case will TE be liable for any incidental, indirect, or  
consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In  
addition,TE reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without  
notification to Buyer.  
101  
RoHS Compliant, ELV Compliant  
HF Halogen Free  
11  
102  

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