MM1-1467LCH-1 [MARKIMICROWAVE]

GaAs MMIC High Dynamic Range Mixer;


型号：	MM1-1467LCH-1
厂家：	Marki
描述：	GaAs MMIC High Dynamic Range Mixer
文件：	总15页 (文件大小：1065K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GaAs MMIC High Dynamic Range Mixer

1. Device Overview

MM1-1467L

Die

1.1 General Description

MM1-1467L is a GaAs MMIC double balanced mixer with a

broad IF bandwidth and low conversion loss. This mixer ideal for

applications which require broad IF bandwidths with operation at

mmWave frequencies. The MM1-1467L is available as both wire

bondable die and as connectorized modules. The -1 option for die

is available for this mixer. Both the -1 and -2 mixers are

electrically identically but with mirrored footprints. For a list of

recommended LO driver amps for all mixers and IQ mixers, see

here.

Module

1.2 Features

1.3 Applications

▪ High LO to RF isolation

▪ Broad IF bands covering critical

Ku & K band

▪ Test and measurement equipment

▪ Fixed RF up converters

▪ Electronic warfare equipment

▪ Flat IF response through K band

▪ Low LO drive

1.4 Functional Block Diagram

1.5 Part Ordering Options¹

Part

Green

Status

Product

Lifecycle

Export

Classification

Description

Number

Package

(option -2)

MM1-1467LCH-2

MM1-1467LCH-1

MM1-1467LUB

Wire bondable die

Active

EAR99

(option -1)

RoHS

Connectorized

module

Refer to our website for a list of definitions for terminology presented in this table.

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MM1-1467L

3.6.2 Typical Performance Plots: LO

Harmonic Isolation............................. 9

Table of Contents

3.6.3 Typical Performance Plots: Tuner

Mixer............................................. 10

1. Device Overview ............................... 1

1.1 General Description........................ 1

1.2 Features ....................................... 1

1.3 Applications................................... 1

1.4 Functional Block Diagram ................ 1

1.5 Part Ordering Options..................... 1

2. Port Configurations and Functions ...... 3

2.1 Port Diagram................................. 3

2.2 Port Functions............................... 3

3. Specifications ................................... 4

3.1 Absolute Maximum Ratings.............. 4

3.2 Package Information ....................... 4

3.3 Recommended Operating Conditions . 4

3.4 Sequencing Requirements ............... 4

3.5 Electrical Specifications .................. 5

3.6 Typical Performance Plots ............... 6

3.6.1 Typical Performance Plots: IP3 .. 8

3.6.4 Typical Spurious Performance:

Down-Conversion............................ 11

3.6.5 Typical Spurious Performance: Up-

Conversion..................................... 11

4. Die Mounting Recommendations ....... 12

4.1 Mounting and Bonding

Recommendations .............................. 12

4.2 Handling Precautions .................... 12

4.3 Bonding Diagram.......................... 13

5. Mechanical Data............................. 14

5.1 CH Package Outline Drawing (Option -

2)..................................................... 14

5.2 CH Package Outline Drawing (Option -

1)..................................................... 14

5.3 UB Package Outline Drawing ......... 15

Revision History

Revision Code

Comment

Datasheet Initial Release

Revision Date

May 2019

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MM1-1467L

2. Port Configurations and Functions

2.1 Port Diagram

A top-down view of the MM1-1467LCH-2 outline drawing is shown below to the left. The

MM1-1467LCH-1 is shown below to the right. Both mixers are electrically identical and

have mirrored footprints. The MM1-1467L has the input and output ports given in Port

Functions. The MM1-1467L can be used in either an up or down conversion.

MM1-1467LCH-2

MM1-1467LCH-1

2.2 Port Functions

Function

Equivalent Circuit

Port

Description

for Package

(Configuration A)

Port 1 is DC open for the CH and UB

packages.

Port 1

(Configuration B)

Port 2 is diode connected for the CH

and UB package.

Port 2

Port 3

(Configuration A)

Port 3 is DC open for the CH and UB

packages.

(Configuration B)

CH package ground path is provided

through the substrate and ground bond

pads. UB package ground provided

through metal housing and outer coax

conductor.

GND

Ground

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MM1-1467L

3. Specifications

3.1 Absolute Maximum Ratings

The Absolute Maximum Ratings indicate limits beyond which damage may occur to the

device. If these limits are exceeded, the device may be inoperable or have a reduced

lifetime.

Parameter

Maximum Rating

Units

Port 1 DC Current

Port 2 DC Current

N/A

TBD

dBm

°C

Power Handling, at any Port

Operating Temperature

Storage Temperature

+27

-55 to +100

-65 to +125

ºC

3.2 Package Information

Parameter

Details

Rating

ESD

Human Body Model (HBM), per MIL-STD-750, Method 1020

UB Package

Weight

16 g

3.3 Recommended Operating Conditions

The Recommended Operating Conditions indicate the limits, inside which the device should

be operated, to guarantee the performance given in Electrical Specifications Operating

outside these limits may not necessarily cause damage to the device, but the

performance may degrade outside the limits of the electrical specifications. For limits,

above which damage may occur, see Absolute Maximum Ratings.

Min Nominal Max Units

T_A, Ambient Temperature

LO Input Power

-55

+25

+100

+13

°C

dBm

3.4 Sequencing Requirements

There is no requirement to apply power to the ports in a specific order. However, it is

recommended to provide a 50Ω termination to each port before applying power. This is a

passive diode mixer that requires no DC bias.

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MM1-1467L

3.5 Electrical Specifications

The electrical specifications apply at T_A=+25°C in a 50Ω system. Typical data shown is

for the connectorized UB package mixer used with a +13 dBm sine wave LO.

Specifications shown for configuration A (B).

Min and Max limits apply only to our connectorized units and are guaranteed at T_A=+25°C. All bare die are 100% DC tested and visually

inspected.

Parameter

Test Conditions

Min Typical

Max

Units

RF (Port 3) Frequency Range

LO (Port 1) Frequency Range

I (Port 2) Frequency Range

GHz

RF/LO = 14 - 67 GHz

I = 0.091 GHz

RF/LO = 14 - 67 GHz

I = 0.091- 21 GHz

RF/LO = 14 - 67 GHz

I = 0.091- 21 GHz

(8.5)

(13)

Conversion Loss (CL)²

(10.5)

Noise Figure (NF)³

LO to RF

8.5

RF/LO = 14 - 67 GHz

IF/LO = 14 - 67 GHz

RF/IF = 14 - 67 GHz

Isolation

LO to IF

RF to IF

RF/LO = 14 - 67 GHz

I = 0.091 GHz

+12

(+13)

Input IP3 (IIP3)

dBm

Input 1 dB Gain Compression

Point (P1dB)

(+3.5)

Measured as a down converter to a fixed 91 MHz IF. Unless otherwise stated, frequency

conversion done using a highside LO.

Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater

than 5 MHz.

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3.6 Typical Performance Plots

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3.6.1 Typical Performance Plots: IP3

MM1-1467L

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3.6.2 Typical Performance Plots: LO Harmonic Isolation

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MM1-1467L

3.6.3 Typical Performance Plots: Tuner Mixer

Tuner mixer performance plots are taken with the following test conditions and frequency plan:

Parameter

IF Input Frequency

Start

Nominal

Stop

Units

GHz

dBm

IF Input Power

-10

LO Input Frequency

GHz

dBm

GHz

LO Input Power

+13

RF Output Frequency

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3.6.4 Typical Spurious Performance: Down-Conversion

MM1-1467L

Typical spurious data is provided by selecting RF and LO frequencies (± m*LO ± n*RF) within the

RF/LO bands, to create a spurious output within the IF band. The mixer is swept across the full

spurious band and the mean is calculated. The numbers shown in the table below are for a -10

dBm RF input. Spurious suppression is scaled for different RF power levels by (n-1), where “n” is

the RF spur order. For example, the 2RF x 2LO spur is 65 dBc for a -10 dBm input, so a -20

dBm RF input creates a spur that is (2-1) x (-10 dB) lower, or 75 dBc.

Typical Down-conversion spurious suppression (dBc): Config A (B)

-10 dBm

0xLO

1xLO

2xLO

3xLO

4xLO

5xLO

RF Input

1xRF

41 (25)

87 (89)

90 (79)

115 (112)

N/A

Reference

48 (61)

41 (36)

65 (66)

85 (77)

94 (94)

109 (94)

15 (13)

56 (63)

58 (62)

94 (101)

94 (100)

45 (37)

65 (69)

N/A

2xRF

63 (71)

56 (61)

91 (103)

97 (105)

3xRF

50 (50)

79 (81)

4xRF

88 (101)

103 (108)

102 (104)

118 (114)

5xRF

3.6.5 Typical Spurious Performance: Up-Conversion

Typical spurious data is taken by mixing an input within the IF band, with LO frequencies

(± m*LO ± n*IF), to create a spurious output within the RF output band. The mixer is swept

across the full spurious output band and the mean is calculated. The numbers shown in the table

below are for a -10 dBm IF input. Spurious suppression is scaled for different IF input power levels

by (n-1), where “n” is the IF spur order. For example, the 2IFx1LO spur is typically 78 dBc for a -

10 dBm input with a sine-wave LO, so a -20 dBm IF input creates a spur that is (2-1) x (-10 dB)

lower, or 88 dBc.

Typical Up-conversion spurious suppression (dBc): Config A (B)

-10 dBm

0xLO

1xLO

2xLO

3xLO

4xLO

5xLO

RF Input

1xIF

40 (25)

71 (70)

Reference

78 (77)

41 (34)

63 (66)

14 (13)

72 (73)

56 (55)

100 (97)

88 (85)

46 (38)

67 (71)

N/A

2xIF

63 (66)

47 (50)

94 (101)

84 (91)

3xIF

85 (80)

59 (62)

80 (74)

74 (70)

4xIF

96 (101)

120 (119)

103 (105)

99 (106)

100 (98)

117 (114)

96 (95)

5xIF

110 (105)

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MM1-1467L

4. Die Mounting Recommendations

4.1 Mounting and Bonding Recommendations

Marki MMICs should be attached directly to a ground plane with conductive epoxy. The

ground plane electrical impedance should be as low as practically possible. This will

prevent resonances and permit the best possible electrical performance. Datasheet

performance is only guaranteed in an environment with a low electrical impedance ground.

Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the

mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.

Cure epoxy according to manufacturer instructions.

Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.

Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding

force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use

the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be

started on the chip and terminated on the package or substrate. All bonds should be as

short as possible <0.31 mm (12 mils).

Circuit Considerations – 50 Ω transmission lines should be used for all high frequency

connections in and out of the chip. Wirebonds should be kept as short as possible, with

multiple wirebonds recommended for higher frequency connections to reduce parasitic

inductance. In circumstances where the chip more than .001” thinner than the

substrate, a heat spreading spacer tab is optional to further reduce bondwire length and

parasitic inductance.

4.2 Handling Precautions

General Handling

Chips should be handled with care using tweezers or a vacuum collet. Users should take

precautions to protect chips from direct human contact that can deposit contaminants,

like perspiration and skin oils on any of the chip's surfaces.

Static Sensitivity

GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and

transported only in static protected environments.

Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or

expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are

opened, chips should be stored in a dry nitrogen atmosphere.

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MM1-1467L

4.3 Bonding Diagram

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MM1-1467L

5. Mechanical Data

5.1 CH Package Outline Drawing (Option -2)

1. CH Substrate material is 0.004 in thick GaAs.

2. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.

5.2 CH Package Outline Drawing (Option -1)

3. CH Substrate material is 0.004 in thick GaAs.

4. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.

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MM1-1467L

5.3 UB Package Outline Drawing

Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.

Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any

particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any

product.

MM1-1467LCH-1 [MARKIMICROWAVE]

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