MMD-2060HU [MARKIMICROWAVE]

GaAs MMIC Millimeter Wave Doubler;


型号：	MMD-2060HU
厂家：	Marki
描述：	GaAs MMIC Millimeter Wave Doubler
文件：	总10页 (文件大小：432K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GaAs MMIC Millimeter Wave Doubler

1. Device Overview

MMD-2060H

Die

1.1 General Description

Module

The MMD-2060H is a MMIC millimeter wave doubler fabricated

with GaAs Schottky diodes. This operates over a guaranteed 10

to 30 GHz input frequency range or a doubled output frequency

range of 20 to 60 GHz. It features excellent conversion loss,

superior isolations and harmonic suppressions across a broad

bandwidth. Both the wire bondable die and connectorized units

are available.

1.2 Features

1.3 Applications

▪ High fundamental rejection

▪ Millimeter wave output

frequencies

▪ High frequency synthesis

▪ LO signal chain

1.4 Functional Block Diagram

1.5 Part Ordering Options¹

Part

Product

Lifecycle

Export

Classification

Description

Number

Package Green Status

MMD-2060HCH

MMD-2060HU

Wire bondable die

Active

EAR99

RoHS

Connectorized

module; 1.85 mm

connector output

Active

Refer to our website for a list of definitions for terminology presented in this table.

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3.3 Recommended Operating Conditions . 4

3.4 Sequencing Requirements ............... 4

3.5 Electrical Specifications .................. 5

3.6 Typical Performance Plots ............... 6

4. Die Mounting Recommendations............ 8

Table of Contents

1. Device Overview ............................... 1

1.1 General Description........................ 1

1.2 Features ....................................... 1

1.3 Applications................................... 1

1.4 Functional Block Diagram ................ 1

1.5 Part Ordering Options..................... 1

2. Port Configurations and Functions ...... 3

2.1 Port Diagram................................. 3

2.2 Port Functions............................... 3

3. Specifications ................................... 4

3.1 Absolute Maximum Ratings.............. 4

3.2 Package Information ....................... 4

4.1 Mounting and Bonding

Recommendations ................................ 8

4.2 Handling Precautions ...................... 8

4.3 Bonding Diagram............................ 9

5.Mechanical Data ................................ 10

5.1 CH Package Outline Drawing ......... 10

5.2 U Package Outline Drawing............ 10

Revision History

Revision Code

Comment

Datasheet Initial Release

Correction to Performance Plots

Limits

Revision Date

November 2018

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MMD-2060H

2. Port Configurations and Functions

2.1 Port Diagram

A top-down view of the MMD-2060H’s CH package outline drawing is shown below. The

MMD-2060H should only be used in the forward direction, with the input and output

ports given in Port Functions.

2.2 Port Functions

Equivalent Circuit

Port

Function

Description

for Package

Port 1 is DC coupled to the diodes for

the CH and U packages. Blocking

capacitor is optional.

Port 1

Input

Port 2 is DC open for the CH and U

package.

Port 2

GND

Output

Ground

CH package ground path is provided

through the substrate and ground bond

pads. U package ground provided

through metal housing and outer coax

conductor.

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MMD-2060H

3. Specifications

3.1 Absolute Maximum Ratings

The Absolute Maximum Ratings indicate limits beyond which damage may occur to the

device. If these limits are exceeded, the device may be inoperable or have a reduced

lifetime.

Parameter

Maximum Rating

Units

Port 1 DC Current

Port 2 DC Current

N/A

dBm

°C

Power Handling, at any Port

Operating Temperature

Storage Temperature

+23

-55 to +100

-65 to +125

ºC

3.2 Package Information

Parameter

Details

Rating

ESD

Human Body Model (HBM), per MIL-STD-750, Method 1020

U Package

Weight

10 g

3.3 Recommended Operating Conditions

The Recommended Operating Conditions indicate the limits, inside which the device should

be operated, to guarantee the performance given in Electrical Specifications Operating

outside these limits may not necessarily cause damage to the device, but the

performance may degrade outside the limits of the electrical specifications. For limits,

above which damage may occur, see Absolute Maximum Ratings.

Min Nominal Max Units

T_A, Ambient Temperature

Input Power

-55

+25

+100

+15

°C

+10

dBm

3.4 Sequencing Requirements

There is no requirement to apply power to the ports in a specific order. However, it is

recommended to provide a 50Ω termination to each port before applying power. This is a

passive diode doubler that requires no DC bias.

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3.5 Electrical Specifications

The electrical specifications apply at T_A=+25°C in a 50Ω system. Typical data shown is

for the connectorized U package doubler used in the forward direction with a +11 dBm

sine wave input.

Min and Max limits apply only to our connectorized units and are guaranteed at T_A=+25°C. RF testing of our die is performed on a sample

basis to verify conformance to datasheet guaranteed specifications.

Parameter

Test Conditions

Min Typical Max Units

Input (Port 1) Frequency Range

GHz

Output (Port 2) Frequency

Range

Input Power

+10

+15

dBm

Input = 10 - 30 GHz

Output = 20 - 60 GHz

Input = 10 - 30 GHz

Output = 10 - 30 GHz

Input = 10 – 20 GHz

Output = 30 - 60 GHz

Input = 10 – 15 GHz

Output = 40 - 60 GHz

Input = 10 – 30 GHz

Output = 10 - 30 GHz

Input = 10 – 20 GHz

Output = 30 – 60 GHz

Input = 10 – 15 GHz

Output = 40 - 60 GHz

10.5

2F Conversion Loss (CL)

Suppression^2,3

Isolations⁴

39.5

12.5

49.7

dBc

22.5

Suppressions and isolations measured with an input source with >60dBc (relative to fundamental

input) harmonic suppression

Suppression is defined as the harmonic power relative to the 2F doubled output power

⁴Isolation is defined as the harmonic power relative to the 1F fundamental input power.

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3.6 Typical Performance Plots

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4. Die Mounting Recommendations

4.1 Mounting and Bonding Recommendations

Marki MMICs should be attached directly to a ground plane with conductive epoxy. The

ground plane electrical impedance should be as low as practically possible. This will

prevent resonances and permit the best possible electrical performance. Datasheet

performance is only guaranteed in an environment with a low electrical impedance ground.

Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the

mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.

Cure epoxy according to manufacturer instructions.

Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.

Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding

force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use

the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be

started on the chip and terminated on the package or substrate. All bonds should be as

short as possible <0.31 mm (12 mils).

Circuit Considerations – 50 Ω transmission lines should be used for all high frequency

connections in and out of the chip. Wirebonds should be kept as short as possible, with

multiple wirebonds recommended for higher frequency connections to reduce parasitic

inductance. In circumstances where the chip more than .001” thinner than the

substrate, a heat spreading spacer tab is optional to further reduce bondwire length and

parasitic inductance.

4.2 Handling Precautions

General Handling

Chips should be handled with care using tweezers or a vacuum collet. Users should take

precautions to protect chips from direct human contact that can deposit contaminants,

like perspiration and skin oils on any of the chip's surfaces.

Static Sensitivity

GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and

transported only in static protected environments.

Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or

expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are

opened, chips should be stored in a dry nitrogen atmosphere.

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4.3 Bonding Diagram

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5.Mechanical Data

5.1 CH Package Outline Drawing

PROJECTION

INCH

[MM]

.005

[.13]

min clearance

.002

[.04]

.010

[.25]

.027

[.69]

.008[.20] x.004[.10]

bonding pad

2 PL

.054

[1.38]

.046

[1.17]

.004

[.10]

5.2 U Package Outline Drawing

Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.

Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any

particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any

product.

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