MMIQ-1865LCH-2_技术文档

Passive GaAs MMIC IQ Mixer

1. Device Overview

MMIQ-1865L

1.1

General Description

The MMIQ-1865L is a low LO drive, passive MMIC IQ mixer. This is an

ultra-broadband mixer spanning 18 to 65 GHz on the RF and LO ports

with an IF from DC to 23 GHz. Up to 35 dB of image rejection is

available due to the excellent phase and amplitude balance of its on-chip

LO quadrature hybrid. Both wire bondable die and connectorized

modules are available. For a list of recommended LO

Die

driver amps for all mixers and IQ mixers, see here.

Module

1.2 Electrical Summary

1.3 Applications

▪ Single Side Band & Image Rejection

Mixing

Parameter

Typical

Unit

RF/LO Frequency Range

IF Frequency Range

I+Q Conversion Loss

Image Rejection

18 - 65

DC - 23

9

GHz

dB

▪ IQ Modulation/Demodulation

▪ Vector Amplitude Modulation

▪ Band Shifting

35

dB

LO-RF Isolation

50

dB

1.4 Functional Block Diagram

R

L

I

Q

1.5 Part Ordering Options¹

Part

Green

Status

Product

Lifecycle

Export

Classification

Description

Number

Package

CH

Wire bondable die

RoHS

Active

EAR99

MMIQ-1865LCH-2

MMIQ-1865LUB

Connectorized module

UB

RoHS

Active

EAR99

1

Refer to our website for a list of definitions for terminology presented in this table.

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MMIQ-1865L

4. Application Information .................... 11

4.1 Detailed Description ..................... 11

4.2 Down-Converter........................... 12

4.3 Up-Converter............................... 13

4.4 Band Shifter ................................ 15

4.5 Vector Modulator......................... 16

5. Die Mounting Recommendations ....... 17

Table of Contents

1. Device Overview ............................... 1

1.1

General Description...................... 1

1.2 Electrical Summary......................... 1

1.3 Applications................................... 1

1.4 Functional Block Diagram ................ 1

1.5 Part Ordering Options..................... 1

2. Port Configurations and Functions ...... 3

2.1 Port Diagram................................. 3

2.2 Port Functions............................... 3

3. Specifications ................................... 4

3.1 Absolute Maximum Ratings.............. 4

3.2 Package Information ....................... 4

3.3 Recommended Operating Conditions . 4

3.4 Sequencing Requirements ............... 4

3.5 Electrical Specifications .................. 5

3.6 Typical Performance Plots ............... 6

5.1 Mounting and Bonding

Recommendations .............................. 17

5.2 Handling Precautions .................... 17

5.3 Bonding Diagram.......................... 18

6. Mechanical Data............................. 19

6.1 CH-2 Package Outline Drawing ...... 19

6.2 UB Package Outline Drawing ......... 19

Revision History

Revision Code

Comment

Datasheet Initial Release

Added P1dB Data to Section 3.5

Changed I/Q Max Current Rating

Updated Max Power Handling

Corrected Port Designations

Revision Date

March 2019

May 2019

August 2019

October 2019

-

A

B

C

D

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MMIQ-1865L

2. Port Configurations and Functions

2.1 Port Diagram

A top-down view of the MMIQ-1865L’s UB package outline drawing is shown below. The mixer may

be operated as either a downconverter or an upconverter. Use of the RF or IF as the input or

output port will depend on the application.

2.2 Port Functions

Port

Function

Description

Equivalent Circuit

Port 1 is DC open and AC matched to

50Ω over the specified LO frequency

range.

Port 1

LO Input

Port 2 is diode coupled and AC matched

to 50Ω over the specified Q port

frequency range.

Port 2

Port 3

Port 4

GND

Q Input / Output

I Input / Output

RF Input/Output

Ground

Port 3 is diode coupled and AC matched

to 50Ω over the specified I port

frequency range.

Port 4 is DC open and AC matched to

50Ω over the specified RF frequency

range.

UB package ground path is provided

through the metal housing and outer coax

conductor.

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MMIQ-1865L

3. Specifications

3.1 Absolute Maximum Ratings

The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If

these limits are exceeded, the device may be inoperable or have a reduced lifetime.

Parameter

Maximum Rating

Units

Port 2 DC Current

Port 3 DC Current

30

mA

dBm

°C

Power Handling, at any Port

Operating Temperature

Storage Temperature

+26

-55 to +100

-65 to +125

ºC

3.2 Package Information

Parameter

Details

Rating

Human Body Model (HBM), per MIL-STD-750, Method

1020

ESD

1A

Weight

UB package

17 g

3.3 Recommended Operating Conditions

The Recommended Operating Conditions indicate the limits, inside which the device should be

operated, to guarantee the performance given in Electrical Specifications. Operating outside these

limits may not necessarily cause damage to the device, but the performance may degrade outside

the limits of the electrical specifications. For limits, above which damage may occur, see Absolute

Maximum Ratings.

Min Nominal Max

Units

T_A, Ambient Temperature

LO drive power

-55

+8

+25

+13

+100

+17

+4

°C

dBm

RF/IF input power

3.4 Sequencing Requirements

There is no requirement to apply power to the ports in a specific order. However, it is

recommended to provide a 50Ω termination to each port before applying power. This is a passive

diode mixer that requires no DC bias.

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MMIQ-1865L

3.5 Electrical Specifications

The electrical specifications apply at T_A=+25°C in a 50Ω system. Typical data shown is for a down

conversion application with a +13dBm sine wave LO input.

Min and Max limits apply only to our connectorized units and are guaranteed at T_A=+25°C. All bare die are 100% DC tested and visually

inspected.

Parameter

Test Conditions

Min

Typical

Max Units

RF (Port 4) Frequency Range

18

65

LO (Port 1) Frequency Range

I (Port 3) Frequency Range

Q (Port 2) Frequency Range

18

0

65

GHz

23

0

23

RF/LO = 18 - 65 GHz

I = DC – 0.2 GHz

RF/LO = 18 - 65 GHz

I = 0.2 - 23 GHz

RF/LO = 18 - 65 GHz

Q = DC -0.2 GHz

RF/LO = 18 - 65 GHz

Q = 0.2 - 23 GHz

RF/LO = 18 - 65 GHz

I = DC – 0.2 GHz

RF/LO = 18 - 65 GHz

Q = DC – 0.2 GHz

RF/LO = 18 - 65 GHz

I+Q = DC – 0.2 GHz

11

12

11

12

11

12

35

Conversion Loss (CL)²

dB

Noise Figure (NF)³

dB

Image Rejection (IR)⁴

dBc

LO to RF

RF/LO = 18-65 GHz

IF/LO = 18-65 GHz

RF/IF = 18-65 GHz

49

44

28

50

LO to I

LO to Q

RF to I

dB

Isolation

RF to Q

RF/LO = 18 - 65 GHz

I = DC – 0.2 GHz

Input IP3 (IIP3)⁵

I+Q

15

dBm

Input 1 dB Gain

Compression

Point (P1dB)

I

3.8

4

Q

2

Measured as an I/Q down converter. (i.e., I and Q powers are not combined)

Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater

3

than 5 MHz.

4

Image Rejection and Single sideband performance plots are defined by the upper sideband (USB)

or lower sideband (LSB) with respect to the LO signal. Plots are defined by which sideband is

selected by the external IF quadrature hybrid.

5

Typical IIP3 measured with I and Q ports combined with an external quadrature hybrid coupler.

^6.Vector Modulator measured with +30mA DC current applied to the I and Q ports.

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3.6 Typical Performance Plots⁶

6

I output means that the IF output signal is measured at the I port of the mixer and the Q port is

loaded. Q output means the IF output signal is measured at the Q port of the mixer while the I

port is loaded.

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3.6.1 Typical Spurious Performance: Down-Conversion⁷

Typical spurious data is provided by selecting RF and LO frequencies (± m*LO ± n*RF) within the

RF/LO bands, to create a spurious output within the IF band. The mixer is swept across the full

spurious band and the mean is calculated. The numbers shown in the table below are for a -10

dBm RF input. Spurious suppression is scaled for different RF power levels by (n-1), where “n” is

the RF spur order. For example, the 2RF x 2LO spur is 64 dBc for a -10 dBm input, so a -20

dBm RF input creates a spur that is (2-1) x (-10 dB) lower, or 74 dBc. Data is shown for the

frequency plan in 3.6 Typical Performance.

Typical Down-conversion spurious suppression (dBc): I Port (Q Port)

-10 dBm

0xLO

1xLO

2xLO

3xLO

4xLO

5xLO

RF Input

1xRF

39 (40)

82 (75)

71 (74)

N/A

Reference

51 (47)

59 (59)

90 (87)

N/A

29 (22)

64 (64)

12 (16)

61 (64)

19 (20)

67 (61)

N/A

2xRF

68 (60)

3xRF

90 (91)

72 (71)

87 (84)

80 (80)

4xRF

101 (104)

125 (126)

104 (106)

115 (115)

112 (114)

130 (134)

111 (114)

117 (116)

5xRF

N/A

3.6.2 Typical Spurious Performance: Up-Conversion⁷

Typical spurious data is taken by mixing an input within the IF band, with LO frequencies

(± m*LO ± n*IF), to create a spurious output within the RF output band. The mixer is swept

across the full spurious output band and the mean is calculated. The numbers shown in the table

below are for a -10 dBm IF input. Spurious suppression is scaled for different IF input power levels

by (n-1), where “n” is the IF spur order. For example, the 2IFx1LO spur is typically 66 dBc for a -

10 dBm input with a sine-wave LO, so a -20 dBm IF input creates a spur that is (2-1) x (-10 dB)

lower, or 76 dBc. Data is shown for the frequency plan in 3.6 Typical Performance.

Typical Up-conversion spurious suppression (dBc): I Port (Q Port)

-10 dBm

0xLO

1xLO

2xLO

3xLO

4xLO

5xLO

RF Input

1xIF

39 (40)

68 (71)

Reference

66 (65)

27 (21)

54 (52)

12 (13)

65 (53)

31 (28)

65 (58)

N/A

2xIF

68 (58)

3xIF

79 (79)

63 (62)

64 (65)

61 (54)

66 (65)

58 (58)

4xIF

105 (106)

114 (110)

109 (108)

100 (100)

65 (58)

108 (105)

96 (96)

102 (90)

110 (107)

107 (106)

105 (102)

5xIF

111 (117)

7

Measured as I/Q mixer (not IR/SSB mixer). SSB/IR mixers experience additional spurious

suppressions.

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MMIQ-1865L

4. Application Information

4.1 Detailed Description

MMIQ-1865 belongs to Marki Microwave’s MMIQ family of mixers. The MMIQ product line

consists of passive GaAs MMIC mixers designed and fabricated with GaAs Schottky diodes.

MMIQ mixers offer excellent amplitude and phase balance from the due to its on-chip LO

quadrature hybrid. Up to 35dB of image rejection (i.e., single sideband suppression) can be

obtained by using the MMIQ-1865 as an image rejection or single sideband mixer. The MMIQ-

1865H and MMIQ-1865S are the sister mixers of the MMIQ-1865L. The MMIQ-1865H and

MMIQ-1865S require a higher LO drive to operate the mixer. In exchange, the MMIQ-1865H and

MMIQ-1865S display higher linearity (i.e., higher IIP3, P1dB, Spurious Suppression) than the

MMIQ-1865L. Marki S, H, and L diodes correspond to different diode forward turn on voltages.

Support for the K, through V bands are offered by the ultra-broadband performance of the mixer’s

RF and LO ports (ports 1 and 2). Direct baseband to V band frequency conversions are available

by using this mixer as an up-converter. Traditional use of this mixer to do image reject or single

sideband mixing is available with an external IF quadrature hybrid. The MMIQ-1865 is also suitable

for use as a Vector Modulator through DC bias of the I and Q ports (ports 3 and 4).

Port 1, the LO port, and port 4, the RF port, support an 18-65GHz signal. Ports 2 and 3, the I

and Q ports, support a DC-23GHz signal. A signal may be input into any port of the mixer which

supports that signal’s frequency. This is the basis of using the mixer as a band shifter.

For a given LO power within the recommended operating range, the RF (in the case of a down

conversion) or IF (in the case of an up conversion) input power should be below the input 1dB

compression point to avoid signal distortion. The input 1dB compression point will vary across the

mixer’s operating bandwidth and with LO input power. Careful characterization is required for

optimal performance for each application. There is no minimum small signal input power required

for operation. Excessive RF/IF input power increases non-desired spurious output power and

degrades the fundamental conversion loss. Excessive LO input power can also cause this effect.

The table below describes how to use an IQ mixer and quad hybrid to select a single sideband.

Up Conversion

Hybrid Port

Mixer Port

Sideband Selected

Lower Sideband

0

I

Q

I

Q

90

0

Upper Sideband

Down Conversion

Hybrid Port

Mixer Port

Sideband Selected

Upper Sideband

0

I

Q

I

90

0

Lower Sideband

Q

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4.2 Down-Converter

A down converter is a mixer application which takes a high frequency small signal RF input, and a

high frequency large signal LO input and mixes the signals together to produce a low frequency IF

output. The fundamental 1RFx1LO outputs present at the IF port are the f_LO-RFand f_LO+RFtones.

The desired output in a down conversion is typically the f_LO-RFterm. An image frequency at

f_Image=f_2LO-RFwill also down convert to the f_LO-RFfrequency. The above illustration shows the relative

location of the image frequency for a highside LO, or the frequency plan for which f_LO> f_RF.

To use the IQ mixer as a down converter, input a high frequency small signal RF input into port 4,

a high frequency large signal LO input into port 1, and pull the low frequency IF output from ports

2 and 3. Ports 2 and 3 will output the IF signals I and Q. I and Q IF outputs will be at the same

frequency but 90° out of phase (i.e., I and Q are in quadrature). If only a single IF output is

desired, terminate either the I or Q ports with a wideband 50Ω load.

This is the input scheme was used to take I/Q down-conversion data found in the Typical

Performance Plots section.

4.2.1 Image Reject Down-Converter

An image reject mixer is a mixer which rejects the down converted image frequency from the IF

output. Image reject mixers are constructed using an external quadrature hybrid attached to the I

and Q (i.e., IF) output ports. Using the external IF quadrature hybrid, one can select the whether

the upper sideband or lower sideband signal is suppressed with respect to the LO signal.

To use the IQ mixer as an image reject mixer, input the high frequency small signal RF into port 1

and a high frequency large signal LO input into port 2. Take the combined I+Q down converted

signal through the IF quadrature hybrid. Select the upper sideband (i.e., suppress the lower

sideband) by connecting the I port to the 0° port of the IF quadrature hybrid and attach the Q port

to the 90° port of the IF quadrature hybrid. Select the lower sideband (i.e., suppress the upper

sideband) by attaching the I port to the 90° port of the IF quadrature hybrid and attach the Q port

to the 0° port of the IF quadrature hybrid.

This is the input scheme was used to take image rejection down-conversion data found in the

Typical Performance Plots section.

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4.3 Up-Converter

An up converter is a mixer application which takes a low frequency small signal IF input, and a high

frequency large signal LO input and mixes the signal together to produce a high frequency RF

output. The fundamental 1IFx1LO outputs present at the RF port are the f_LO-IFand f_LO+RFtones.

An up conversion can select either the f_LO-IFor the f_LO+IFtones. The above illustration shows both

up converted sidebands with either an I or Q port input signal.

To use the IQ mixer as an up converter, input a low frequency small signal IF input into port 2 or

3, a high frequency large signal LO input into port 1, and pull the high frequency RF output from

port 4. Input into the Q port will result in a up converted signal that is 90° out of phase with the

up converted I port input signal. If only a single IF input is desired, terminate either the I or Q

ports with a wideband 50Ω load.

This is the input scheme used to take I/Q up-conversion data found in section 3.6 Typical

Performance.

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4.3.1 Single Sideband Up-Converter

MMIQ-1865L

A single sideband mixer is a mixer which suppress the up converted image frequency from the RF

output. Single sideband mixers are constructed using an external quadrature hybrid attached to

the I and Q (i.e., IF) input ports. Using an external IF quadrature hybrid, one can select whether

the upper sideband of the lower sideband signal is suppressed with respect to the LO signal.

To use the IQ mixer as a single sideband mixer, input the low frequency small signal I+Q IF signal

into the IF quadrature hybrid. The IF quadrature hybrid is attached to the I and Q ports of the IQ

mixer. Input the high frequency large signal LO input into port 1 and take the up converted high

frequency RF signal from port 4. Select the upper sideband (i.e., suppress the lower sideband) by

attaching the I port to the 90° port of the IF quadrature hybrid and attach the Q port to the 0°

port of the IF quadrature hybrid. Select the lower sideband (i.e., suppress the upper sideband) by

attaching the I port to the 0° port of the IF quadrature hybrid and attach the Q port to the 90°

port of the IF quadrature hybrid.

This is the input scheme used to take single sideband up-conversion data found in section 3.6

Typical Performance.

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4.4 Band Shifter

A band shifter is an unusual application for a mixer. Band shifters take an IF signal and shift it to a

different band, generally to either avoid interference or for rebroadcast at a different frequency.

For cases in which the desired band shift cannot be employed by using a standard up or down

conversion scheme, an exotic input scheme is required.

A passive diode mixer is reciprocal on all ports. Port 4, the RF port, supports a 18-65GHz signal.

Port 1, the LO port, supports a 18-65GHz signal. Ports 2 and 3, the IF ports, support a DC-

23GHz signal. 2 signals input into any combination of the 3 ports, RF, LO, or IF, will result in an

output signal at the 3^rdport. In addition, an output signal will be present at both input ports. By

using the IF port, as a large signal input port, low frequency LO applications can be supported.

The diagram above shows an IQ mixer being used as a band shifter. Using an IQ mixer as a band

shifter allows for sideband suppression. This is identical to using the IQ mixer as a single sideband

up converter. However, the large signal input port is now 2+3 versus port 1. Selection of the

output tone is done through the orientation of the LO quadrature hybrid.

To use the mixer as a single sideband band shifter, input a low frequency large signal LO into the

external LO quadrature hybrid. Input the high frequency small signal IF signal into port 1 and take

the high frequency RF output from port 4. Select the upper sideband (i.e., suppress the lower

sideband) by attaching the I port to the 90° port of the IF quadrature hybrid and attach the Q port

to the 0° port of the LO quadrature hybrid. Select the lower sideband (i.e., suppress the upper

sideband) by attaching the I port to the 0° port of the LO quadrature hybrid and attach the Q port

to the 90° port of the LO quadrature hybrid.

Using this input scheme requires careful accounting of which input signal is injecting which port.

Injecting a signal into any port which does not support the correct band will lead to a degraded or

no output response. Abide by the maximum DC current input into the I and Q ports of the mixer or

otherwise irreversible damage to the mixer will occur.

The limiting factor in use of the mixer as an image reject band shifter is in the bandwidth of the

external LO quadrature hybrid and bandwidth of the I and Q ports.

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4.5 Vector Modulator

A vector modulator is a device that can modulate an input signal’s amplitude and phase. Similar to

using a double balanced mixer as a phase modulator or phase shifter, an IQ mixer can be used as a

vector modulator. An IQ mixer can be used as a vector modulator by inputting DC current into

both the I and Q ports.

Injecting DC current into both the I and Q ports forward biases both mixer cores and causes them

to be shorted. This connects the RF and LO baluns allowing the input signal to pass from balun to

balun without a frequency conversion. Modulating the DC current into either or both I and Q

mixers causes both the phase and amplitude to modulate based on the polarity of the input current

and the magnitude of the input current. Modulating only the I or Q mixers causes the device to

behave as a biphase modulator (i.e., the device can only swing the phase from +90° to -90°).

To use the IQ mixer as a vector modulator, supply a DC current sufficient to turn on the mixer

through both the I and Q ports. Current limiting the DC source to the maximum DC current value

found in section 3.1 Absolute Maximum Ratings is recommended to prevent irreversible damage to

the vector modulator. The typical DC current required to turn on the vector modulator is <30mA.

It is recommended to sequence the vector modulator by slowly increasing the DC bias until the

vector modulator is operating at the user desired condition.

Near the band edges of the vector modulator, more current than is typical for mid-band operation

may be necessary to achieve the same amplitude and phase shift. This is due to the on chip LO

quadrature hybrid operating near its band edge.

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5. Die Mounting Recommendations

5.1 Mounting and Bonding Recommendations

Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground

plane electrical impedance should be as low as practically possible. This will prevent resonances

and permit the best possible electrical performance. Datasheet performance is only guaranteed in

an environment with a low electrical impedance ground.

Mounting

To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a

thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to

manufacturer instructions.

Wire Bonding

Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with

a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge

bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to

achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the

package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).

Circuit Considerations

50 Ω transmission lines should be used for all high frequency connections in and out of the chip.

Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher

frequency connections to reduce parasitic inductance. In circumstances where the chip more than

.001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce

bondwire length and parasitic inductance.

5.2 Handling Precautions

General Handling

Chips should be handled with care using tweezers or a vacuum collet. Users should take

precautions to protect chips from direct human contact that can deposit contaminants, like

perspiration and skin oils on any of the chip's surfaces.

Static Sensitivity

GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and

transported only in static protected environments.

Cleaning and Storage

Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid.

Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry

nitrogen atmosphere.

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5.3 Bonding Diagram

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MMIQ-1865L

6. Mechanical Data

6.1 CH-2 Package Outline Drawing

1. CH Substrate material is 0.004 in thick GaAs.

2. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au

6.2 UB Package Outline Drawing

Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.

Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any

particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any

product.


型号：	MMIQ-1865LCH-2
厂家：	Marki
描述：	Passive GaAs MMIC IQ Mixer
文件：	总19页 (文件大小：1147K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MMIQ-1865LCH-2 [MARKIMICROWAVE]

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