MQS-0209 [MARKIMICROWAVE]

MMIC 2-9GHz 90Â° Splitter / Combiner;


型号：	MQS-0209
厂家：	Marki
描述：	MMIC 2-9GHz 90Â° Splitter / Combiner
文件：	总14页 (文件大小：741K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MMIC 2-9GHz 90° Splitter / Combiner

1 Device Overview

MQS-0209

1.1 General Description

The MQS-0209 is a MMIC 2GHz – 9GHz 90° splitter/combiner.

Wire bondable 50Ω terminations are available on-chip. Passive GaAs

MMIC technology allows production of smaller constructions that

replace larger form factor circuit board constructions. Tight

fabrication tolerances allow for less unit to unit variation than

traditional splitter/combiner technologies. The MQS-0209 is

available as a wire bondable chip or connectorized module. Low

variation allows for accurate simulations using the provided S4P file

taken from measured production units. Applications include single

sideband upconverters, image rejection downconverters, IQ

modulators, balanced amplifiers, and microwave correlators. The

MQS-0209 is not recommended for applications involving reflected

signals.

Bare Die

Module

1.2 Features

▪ Designed for S and C-band applications

▪ High amplitude and phase balance

▪ High isolation

▪ Low insertion loss

▪ On-chip 50Ω load terminations

▪ S4P data MQS-0209CH.zip MQS-0209UB.zip

1.3 Functional Block Diagram

90° Output

0° Output

Input

Isolated

1.4 Part Ordering Options¹

Part

Green

Status

Product

Lifecycle

Export

Classification

Description

Package

Number

MQS-0209CH

MQS-0209UB

Wire bondable die

Connectorized

RoHS

Active

EAR99

Refer to our website for a list of definitions for terminology presented in this table.

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MQS-0209

3.4

Typical Performance Plots ........... 6

Bare Die............................. 6

Table of Contents

3.4.1

3.4.2

Connectorized Module .......... 7

Device Overview ............................... 1

Application Information ...................... 9

Die Mounting Recommendations ....... 12

1.1

General Description.................... 1

Features ................................... 1

Functional Block Diagram ............ 1

Part Ordering Options................. 1

1.2

1.3

1.4

5.1

Mounting and Bonding

Recommendations .............................. 12

5.2

5.3

Handling Precautions ................ 12

Bonding Diagram ...................... 13

Port Configurations and Functions ...... 3

2.1

2.2

Port Diagram............................. 3

Port Functions ........................... 3

5.3.1

5.3.2

Four Port Device ............... 13

Isolated Port Terminated..... 13

Specifications ................................... 4

Mechanical Data............................. 14

3.1

Absolute Maximum Ratings.......... 4

Package Information.................... 4

Electrical Specifications .............. 4

6.1

6.2

CH Outline Drawing .................. 14

UB Package Outline Drawing...... 14

3.2

3.3

3.3.1

3.3.2

Bare Die............................. 4

Connectorized Module .......... 5

Revision History

Revision Code

Comment

Revision Date

August 2018

Datasheet Initial Release

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MQS-0209

2 Port Configurations and Functions

2.1 Port Diagram

A top-down view of the MQS-0209CH package outline drawing is shown below. Only

ports 1 and 2 may be used as an input. Ports 3 and 4 are not recommended as inputs.

Device is not recommended for applications requiring reflected signals. Ports 1 – 4

correspond to the UB package designation.

50Ω

Termination

4 pc

2.2 Port Functions²

Configuration Configuration

Port

Description

Equivalent Circuit

Port 1 is DC short to port

3 and open to ground.

Port 1

Input

90° Output

Port 2 is DC short to port

4 and open to ground.

Port 2

Port 3

Port 4

Pad

90° Output

0° Output

Isolated

Input

Isolated

0° Output

Ground

Port 3 is DC short to port

1 and open to ground.

Port 4 is DC short to port

2 and open to ground.

CH package ground path is

provided through the

substrate and ground bond

pads.

Ground

Each configuration describes a different application of the same product.

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MQS-0209

3 Specifications

3.1 Absolute Maximum Ratings

The Absolute Maximum Ratings indicate limits beyond which damage may occur to the

device. If these limits are exceeded, the device may be inoperable or have a reduced

lifetime.

Parameter

Maximum Rating

Units

DC Current at any port

TBD

dBm

°C

Power Handling, at any Port

Operating Temperature

Storage Temperature

TBD

-55 to +100

-65 to +125

°C

3.2 Package Information

Parameter

Details

Human Body Model (HBM), per MIL-STD-750, Method 1020

Rating

ESD

N/A

3.3 Electrical Specifications³

The electrical specifications apply at T_A=+25°C in a 50Ω system.

Min and Max limits are guaranteed at T_A=+25°C.

3.3.1 Bare Die

Frequency

Parameter

Min

Typ.

Max

Units

(GHz)

Coupling

Nominal Phase Shift

Amplitude Balance

Phase Balance

Degrees

±0.5

±3

±2

±15

Degrees

2-9

Excess Through Line

Insertion Loss

4.5

Isolation

VSWR

1.1

Impedance

Device is non-reciprocal. Operation not guaranteed when ports 3 or 4 are used as an input

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MQS-0209

3.3.2 Connectorized Module

Parameter

Frequency

Min

Typ.

Max

Units

(GHz)

Coupling

Nominal Phase Shift

Amplitude Balance

Phase Balance

Degrees

±0.3

±3

±1.2

±10

Degrees

2-9

Excess Through Line

Insertion Loss

2.5

5.2

Isolation

VSWR

1.13

Impedance

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MQS-0209

3.4 Typical Performance Plots

3.4.1 Bare Die

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MQS-0209

3.4.2 Connectorized Module

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MQS-0209

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MQS-0209

4 Application Information

Quadrature signal generation is useful for many applications in analog signal processing. Marki

MQH/S MMIC quadrature hybrids and 90˚ Splitter/Combiners offer this functionality in a small

factor with high repeatability. Below are applications and how they can be realized with the MQH

and MQS product lines.

Quadrature Hybrids vs 90˚ Splitter/Combiners

Some products are ‘true’ quadrature hybrids, while others are 90˚ Splitter/Combiners. A

quadrature hybrid is symmetric about all four ports, meaning that in a splitting application any port

can be used as an input, with the isolated and output ports following from this selection. Likewise,

for a combining application, any port can be used as an output.

A 90˚ Splitter/Combiner is not symmetric. When splitting, only ports 1 and 2 can be used as an

input. If ports 3 or 4 were used, there would be significant phase walk-off between the output

ports. As a combiner, only ports 1 and 2 are suitable as output ports. The phase walk-off

introduced when using ports 3 or 4 as an output means that reflected signals recombine and

cancel poorly inside a 90° Splitter/Combiner.

Single Sideband and Image Reject Mixers

The primary application for the MQH and MQS series is as IF or LO quadrature signal

splitter/combiners. They can be used in combination with the MMIQ series of IQ mixers to create

broadband single sideband and image reject mixers. Either 90˚ Splitter/Combiners or quadrature

hybrids can be used as the IF hybrid, but if a 90˚ Splitter/Combiner is used only one sideband (or

image) is accessible, whereas if a quadrature hybrid is used than both sidebands are accessible.

If a 90˚ Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1

(or 2) should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to

the I and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer to

reject.

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MQS-0209

Balanced Amplifiers

In a balanced amplifier, the poor return loss of an amplifier is compensated for with a quadrature

hybrid. In this application, the reflections from the input or output are collected at the isolated

port of the quadrature hybrid and terminated.

Since a 90˚ Splitter/Combiner is not completely symmetric, reflected signals will not terminate as

well as with a quadrature hybrid. An MQH option is recommended for this application. If a 90˚

Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1 (or 2)

should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to the I

and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer to reject.

Testing/simulation is recommended when considering if a 90° Splitter/Combiner is suitable.

Reflectionless Filter

Similar to a balanced amplifier, a reflectionless filter will terminate reflections that are out of band

for a filter (but in band for the quadrature hybrid) at the isolated port.

Since a 90˚ Splitter/Combiner is not completely symmetric, reflected signals will not terminate as

well as with a quadrature hybrid. An MQH option is recommended for this application. If a 90˚

Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1 (or 2)

should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to the I

and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer to reject.

Testing/simulation is recommended when considering if a 90° Splitter/Combiner is suitable.

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MQS-0209

Reflective Applications

Unlike in the previous applications, reflective applications only work well with a quadrature hybrid

(not a 90˚ Splitter/Combiner). In these applications a signal is reflected off of two identical

structures (typically a PIN diode) and the output signal is collected at the isolated port. In this

case the desired signal is deliberately reflected.

Since a 90˚ Splitter/Combiner is not completely symmetric, you will have poor results if you use

these for reflective applications.

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MQS-0209

5 Die Mounting Recommendations

5.1 Mounting and Bonding Recommendations

Marki MMICs should be attached directly to a ground plane with conductive epoxy. The

ground plane electrical impedance should be as low as practically possible. This will

prevent resonances and permit the best possible electrical performance. Datasheet

performance is only guaranteed in an environment with a low electrical impedance ground.

Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the

mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.

Cure epoxy according to manufacturer instructions.

Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.

Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding

force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use

the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be

started on the chip and terminated on the package or substrate.

Circuit Considerations – 50 Ω transmission lines should be used for all high frequency

connections in and out of the chip. In circumstances where the chip more than .001”

thinner than the substrate, a heat spreading spacer tab is optional to further reduce

bondwire length and parasitic inductance.

Special Considerations for 90° Splitters – Transitions between the chip and

transmission line should be as close to 50 Ω as possible. Small impedance mismatches will

result in poor phase balance mid-band due to reflections. Length and number of wire

bonds should be adjusted to tune inductance for an optimal 50 Ω match. In the modules,

chip transitions are optimized for broadband performance.

5.2 Handling Precautions

General Handling

Chips should be handled with care using tweezers or a vacuum collet. Users should take

precautions to protect chips from direct human contact that can deposit contaminants,

like perspiration and skin oils on any of the chip's surfaces.

Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or

expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are

opened, chips should be stored in a dry nitrogen atmosphere.

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MQS-0209

5.3 Bonding Diagram

The MQS-0209 has 50Ω loads near each I/O port, allowing the user to terminate the isolated port

on-chip.

5.3.1 Four Port Device

5.3.2 Isolated Port Terminated

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MQS-0209

6 Mechanical Data

6.1 CH Outline Drawing

1. CH Substrate material is 0.004 in thick GaAs.

2. I/O trace finish is 5 microns Au. Ground plane finish is 4 microns Au.

6.2 UB Package Outline Drawing

Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.

Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any

particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any

product.

MQS-0209 [MARKIMICROWAVE]

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