MAX14783EATA+ [MAXIM]
High-Speed 3.3V/5V RS-485/RS-422 Transceiver with ±35kV HBM ESD Protection;
| 型号： | MAX14783EATA+ |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | High-Speed 3.3V/5V RS-485/RS-422 Transceiver with ±35kV HBM ESD Protection |
| 文件： | 总17页 (文件大小：1044K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
General Description
Benefits and Features
● Integrated Protection Increases Robustness
The MAX14783E is a half-duplex RS-485/422 transceiver
that operates at either 3.3V or 5V rails with high ±35kV
ESD performance and up to 42Mbps data rate. The
device is optimized for high speeds over extended cable
runs while maximizing tolerance to noise.
• High ESD Protection
• ±35kV HBM ESD per JEDEC JS-001-2012
• ±20kV Air Gap per IEC 61000-4-2
• ±12kV Contact ESD per IEC 61000-4-2
• ±4kV EFT per IEC 61000-4-4
®
The MAX14783E is available in 8-pin µMAX , 8-pin SO,
• Short-Circuit Protected Outputs
and 8-pin TDFN-EP packages. The device in the TDFN-EP
package operates over the -40°C to +125°C temperature
range. The MAX14783E in the μMAX and SO packages
operates over the -40°C to +85°C and -40°C to +125°C
temperature ranges.
• True Fail-Safe Receiver Prevents False Transition
on Receiver Input Short or Open Events
• Hot-Swap Capability Eliminates False Transitions
During Power-Up or Hot Insertion
● 3V to 5.5V Supply Voltage Range
Applications
● High-Speed Data Rates up to 42Mbps
● -40°C to +125°C Operating Temperature
● Allows Up to 32 Transceivers on the Bus
● Motion Controllers
● Field Bus Networks
● Encoder Interfaces
● Backplane Busses
● Low 10µA (max) Shutdown Current for Lower Power
Consumption
Ordering Information appears at end of data sheet.
Functional Diagram
V
CC
MAX14783E
R
RO
RE
B
A
SHUTDOWN
DE
DI
D
GND
µMAX is a registered trademark of Maxim Integrated Products, Inc,.
19-6734; Rev 2; 7/20
MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Absolute Maximum Ratings
(Voltages referenced to GND.)
Junction Temperature......................................................+150°C
V
.....................................................................-0.3V to +6.0V
Storage Temperature Range............................ -65°C to +150°C
CC
RO ............................................................ -0.3V to (V
+ 0.3V)
Continuous Power Dissipation (T = +70°C)
CC
A
RE, DE, DI............................................................-0.3V to +6.0V
µMAX (derate at 4.8mW/°C above +70°C) .................387mW
SO (derate at 7.6mW/°C above +70°C)......................606mW
TDFN-EP (derate at 24.4mW/°C above +70°C)........1951mW
Lead Temperature (soldering, 10s) .................................+300ºC
Soldering Temperature (reflow)...................................... +260°C
A, B (V
≥ 3.6V) .............................................-8.0V to +13.0V
CC
A, B (V
< 3.6V) .............................................-9.0V to +13.0V
CC
Short-Circuit Duration (RO, A, B) to GND.................Continuous
Operating Temperature Range
MAX14783EE_............................................... -40°C to +85°C
MAX14783EA_............................................. -40°C to +125°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
PACKAGE TYPE: 8 SOIC
Package Code
S8+4
Outline Number
21-0041
90-0096
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
)
132°C/W
38°C/W
JA
Junction to Case (θ
)
JC
PACKAGE TYPE: 8 TDFN
Package Code
T833+2
21-0137
90-0059
Outline Number
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
)
41°C/W
8°C/W
JA
Junction to Case (θ
)
JC
PACKAGE TYPE: 8 µMAX
Package Code
U8+1
Outline Number
21-0036
90-0092
Land Pattern Number
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
)
206°C/W
42°C/W
JA
Junction to Case (θ
)
JC
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”,
or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains
to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Maxim Integrated
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Electrical Characteristics
(V
= +3.0V to +5.5V, T = T
A
to T
, unless otherwise specified. Typical values are at V
= +5V and T = +25°C.) (Notes 1, 2)
CC A
CC
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY (Test)
Supply Voltage
V
3.0
5.5
4
V
CC
I
Supply Current
DE = V , RE = GND, no load
1.9
mA
µA
CC
CC
I
Shutdown Supply Current
DRIVER
DE = GND, RE = V
10
SHDN
CC
V
V
V
= 4.5V, R = 54Ω, Figure 1
2.1
2.0
1.5
CC
CC
CC
L
V
Differential Driver Output
= 3V, R = 100Ω, Figure 1
V
OD
L
= 3V, R = 54Ω, Figure 1
L
Change in Magnitude of Differential
Output Voltage
ΔV
R = 54Ω or 100Ω, Figure 1 (Note 3)
-0.2
0
+0.2
3
V
V
V
OD
L
Driver Common-Mode Output
Voltage
V
R = 54Ω or 100Ω, Figure 1
V
/ 2
OC
L
CC
Change in Magnitude of Common-
Mode Voltage
ΔV
R = 54Ω or 100Ω, Figure 1 (Note 3)
-0.2
2.2
+0.2
OC
L
V
Single-Ended Driver Output High
Single-Ended Driver Output Low
Differential Output Capacitance
A or B output, I
A or B output, I
= -20mA
= 20mA
V
OH
A or B
V
0.8
V
OL
A or B
C
DE = RE = V , f = 4MHz
12
pF
mA
mA
OD
CC
0 ≤ V
≤ +12V, output low
250
250
OUT
|I
|
Driver Short-Circuit Output Current
RECEIVER
OST
-7V ≤ V
≤ V , output high
CC
OUT
V
V
= +12V
= -7V
400
300
12
1000
DE = GND, V
or +5.5V
= GND
IN
IN
CC
I
Input Current
µA
pF
A, B
-800
-200
C
Differential Input Capacitance
Between A and B, DE = GND, f = 4MHz
A, B
Receiver Differential Threshold
Voltage
V
-7V ≤ V
≤ +12V
-105
10
-10
mV
TH
CM
ΔV
Receiver Input Hysteresis
Receiver Input Resistance
LOGIC INTERFACE (DI, DE, RE, RO)
Input Voltage High
V
= 0V
mV
TH
CM
R
-7V ≤ V
≤ +12V
12
kΩ
IN
CM
V
DE, DI, RE
DE, DI, RE
DE, DI, RE
DE, DI, RE
DE, RE
2.0
V
V
IH
V
Input Voltage Low
0.8
IL
V
Input Hysteresis
50
mV
µA
kΩ
HYS
I
Input Current
±1
10
IN
Input Impedance on First Transition
1
RE = GND, I
= -2mA,
RO
V
RO Output Voltage High
RO Output Voltage Low
V
– 0.4
V
V
OHRO
CC
(V - V ) > 200mV
A
B
RE = GND, I
= 2mA,
RO
V
0.4
OLRO
(V - V ) < -200mV
A
B
Maxim Integrated
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Electrical Characteristics (continued)
(V
= +3.0V to +5.5V, T = T
to T
, unless otherwise specified. Typical values are at V
= +5V and T = +25°C.) (Notes 1, 2)
CC A
CC
A
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
RE = V , 0 ≤ V ≤ V
MIN
TYP
MAX
UNITS
I
Receiver Tri-State Output Current
±1
µA
OZR
CC
RO
CC
Receiver Output Short-Circuit
Current
I
0 ≤ V
≤ V
±110
mA
OSR
RO
CC
PROTECTION
T
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
Temperature rising
+160
15
°C
°C
SHDN
IEC 61000-4-2 Air Gap Discharge to GND
IEC 61000-4-2 Contact Discharge to GND
Human Body Model
±20
±12
±35
±2
ESD Protection on A and B Pins
ESD Protection, All Other Pins
kV
kV
Human Body Model
Switching Characteristics MAX14783E
(V
= +3V to +5.5V, T = T
to T
, unless otherwise specified. Typical values are at V
= +5V and T = +25°C.) (Notes 1, 2, 4)
CC A
CC
A
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DRIVER
t
20
20
DPLH
R = 54Ω, C = 50pF,
L L
Figures 2 and 3
Driver Propagation Delay
ns
ns
ns
t
DPHL
Driver Differential Output Rise or
Fall Time
R = 54Ω, C = 50pF,
L
L
t
, t
7
3
HL LH
Figures 2 and 3
Differential Driver Output Skew
R = 54Ω, C = 50pF,
L
L
t
DSKEW
|t
- t
|
Figures 2 and 3 (Note 5)
DPLH DPHL
MAX14783EATA
42
30
40
42
MAX14783EEUA
MAX14783EESA
3.0V ≤ V
3.6V
≤
≤
≤
CC
CC
CC
DR
Maximum Data Rate
Mbps
MAX
MAX14783EAUA
MAX14783EASA
3.0V ≤ V
5.5V
6
3.0V ≤ V
3.6V
42
16
3.0V ≤ V
≤
CC
5.5V
Maxim Integrated
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Switching Characteristics MAX14783E (continued)
(V
= +3V to +5.5V, T = T
to T
, unless otherwise specified. Typical values are at V
= +5V and T = +25°C.) (Notes 1, 2, 4)
CC A
CC
A
MIN
MAX
PARAMETER
SYMBOL
CONDITIONS
R = 110Ω, C = 50pF,
MIN
TYP
MAX
UNITS
L
L
t
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable Time from Low
Driver Disable Time from High
30
ns
DZH
Figures 4 and 5 (Note 6)
R = 110Ω, C = 50pF,
L
L
t
30
30
30
6
ns
ns
ns
µs
DZL
DLZ
DHZ
Figures 4 and 5 (Note 6)
R = 110Ω, C = 50pF,
L
L
t
Figures 4 and 5
R = 110Ω, C = 50pF,
L
L
t
Figures 4 and 5
Driver Enable from Shutdown to
Output High
R = 110Ω, C = 15pF,
L
L
t
DLZ(SHDN)
Figures 4 and 5 (Note 6)
Driver Enable from Shutdown to
Output Low
R = 110Ω, C = 15pF,
Figures 4 and 5 (Note 6)
L
L
t
6
µs
ns
DHZ(SHDN)
t
Time to Shutdown
(Note 6)
50
42
800
SHDN
RECEIVER
t
25
25
RPLH
Receiver Propagation Delay
C = 15pF, Figures 6 and 7
ns
L
t
RPHL
C = 15pF, Figures 6 and 7
L
(Note 5)
t
Receiver Output Skew
Maximum Data Rate
2
ns
RSKEW
DR
Mbps
MAX
R = 1kΩ, C = 15pF,
Figure 8 (Note 6)
L
L
t
Receiver Enable to Output High
Receiver Enable to Output Low
30
30
ns
ns
RZH
R = 1kΩ, C = 15pF,
L
L
t
RZL
Figure 8 (Note 6)
t
Receiver Disable Time from Low
Receiver Disable Time from High
R = 1kΩ, C = 15pF, Figure 8
30
30
ns
ns
RLZ
L
L
t
R = 1kΩ, C = 15pF, Figure 8
RHZ
L
L
Receiver Enable from Shutdown to
Output High
R = 1kΩ, C = 15pF,
L L
Figure 8 (Note 6)
t
6
µs
RLZ(SHDN)
RHZ(SHDN)
Receiver Enable from Shutdown to
Output Low
R = 1kΩ, C = 15pF,
L
L
t
6
µs
ns
Figure 8 (Note 6)
t
Time to Shutdown
(Note 6)
50
800
SHDN
Note 1: All devices 100% production tested at T = +25°C. Specifications over temperature are guaranteed by design.
A
Note 2: All currents into the device are positive; all currents out of the device are negative. All voltages are referenced to ground,
unless otherwise noted.
Note 3: ΔV
and ΔV
are the changes in V
and V , respectively, when the DI input changes state.
OD
OC
OD OC
Note 4: Capacitive load includes test probe and fixture capacitance.
Note 5: Guaranteed by design; not production tested.
Note 6: The timing parameter refers to the driver or receiver enable delay, when the device has exited the initial hot-swap protect
state and is in normal operating mode.
Note 7: Shutdown is enabled by driving RE high and DE low. The device is guaranteed to have entered shutdown after t
has
SHDN
elapsed.
Maxim Integrated
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Test and Timing Diagrams
A
V
CC
DE
R
L
2
A
B
DI
V
OD
R
L
C
L
V
OD
R
2
L
V
OC
B
Figure 1. Driver DC Test Load
Figure 2. Driver Timing Test Circuit
f = 1MHz, t = 3ns, t = 3ns
LH
HL
V
CC
DI
1.5V
1.5V
0
t
t
DPHL
DPLH
B
A
V
OD
V
= [V - V ]
A B
OD
V
O
90%
90%
V
OD
0
10%
10%
-V
O
t
LH
t
HL
t
|t
- t
|
DSKEW = DPLH DPHL
Figure 3. Driver Propagation Delays
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
A
B
S1
DI
V
0
GND OR V
CC
OUT
CC
D
C
L
1.5V
50pF
DE
t
, t
R
110Ω
DZH DZH(SHDN)
L =
DE
0.25V
V
0
OH
1.5V
GENERATOR
OUT
50Ω
t
DHZ
Figure 4. Driver Enable and Disable Times (t
t
)
DZH, DHZ
V
CC
R
L =
110Ω
A
V
0
CC
S1
DI
0 OR V
OUT
CC
D
1.5V
DE
t
, t
DZL DZL(SHDN)
B
t
DLZ
V
CC
DE
OUT
1.5V
V
OL
0.25V
GENERATOR
50Ω
Figure 5. Driver Enable and Disable Times (t
, t
)
DZL DLZ
A
B
R
RO
ATE
V
ID
Figure 6. Receiver Propagation Delay Test Circuit
Maxim Integrated
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
A
B
1V
-1V
t
t
RPHL
RPLH
V
OH
RO
1.5V
1.5V
V
OL
t
|t
- t
|
RSKEW = RPHL RPLH
Figure 7. Receiver Propagation Delays
+1.5V
-1.5V
S3
R
1kΩ
S1
S2
V
CC
RO
V
R
ID
C
L
15pF
RE
GENERATOR
50Ω
V
0
V
CC
CC
S1 OPEN
S2 CLOSED
S3 = +1.5V
S1 CLOSED
S2 OPEN
S3 = -1.5V
RE
RO
1.5V
1.5V
RE
0
t
t
RZH, RZH(SHDN)
t
, t
RZL RZL(SHDN)
V
V
OH
CC
2
CC
OL
V
V
CC
2
0
V
RO
RE
V
CC
V
CC
S1 OPEN
S2 CLOSED
S3 = +1.5V
S1 CLOSED
S2 OPEN
S3 = -1.5V
1.5V
1.5V
RE
RO
0
0
V
0
t
t
RLZ
RHZ
V
CC
OL
OH
0.25V
0.25V
V
RO
Figure 8. Receiver Enable and Disable Times
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Typical Operating Characteristics
(V
= +5V, T = +25°C, unless otherwise specified.)
CC
A
NO-LOAD SUPPLY CURRENT
vs. TEMPERATURE
SHUTDOWN SUPPLY CURRENT
SUPPLY CURRENT vs. DATA RATE
vs. TEMPERATURE
120
3.0
2.5
10
9
8
7
6
5
4
3
2
1
0
DE = V
CC
V
= 5V, 54Ω LOAD
CC
DE = V
DE = GND
RE = V
CC
RE = GND
CC
100
80
60
40
20
0
V
CC
= 5V
2.0
1.5
1.0
0.5
0
V
= 3.3V, 54Ω LOAD
CC
V
= 3.3V
CC
V
CC
= 5V
V
= 5V, NO LOAD
CC
V
= 3.3V
CC
V
CC
= 3.3V, NO LOAD
0
10
20
DATA RATE (Mbps)
30
40
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
TEMPERATURE (°C)
TEMPERATURE (°C)
RECEIVER-OUTPUT HIGH VOLTAGE
vs. OUTPUT CURRENT
RECEIVER-OUTPUT LOW VOLTAGE
vs. OUTPUT CURRENT
DRIVER OUTPUT CURRENT
vs. DIFFERENTIAL OUTPUT VOLTAGE
5
4
3
2
1
0
5
4
3
2
1
0
160
120
80
40
0
OUTPUT SOURCING CURRENT
OUTPUT SINKING CURRENT
V
CC
= 5V
V
= 5V
CC
V
= 3.3V
V
CC
= 3.3V
CC
V
= 3.3V
CC
V
= 5V
50
CC
0
-10
-20
-30
-40
-50
-60
0
10
20
30
40
60
0
1
2
3
4
5
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
DIFFERENTIAL OUTPUT VOLTAGE (V)
DIFFERENTIAL DRIVER OUTPUT
VOLTAGE vs. TEMPERATURE
DRIVER OUTPUT CURRENT
vs. OUTPUT HIGH VOLTAGE
5.0
-180
V
= 5V
R = 54Ω
L
CC
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-160
-140
-120
-100
-80
C = 50pF
L
V
= 5V
CC
V
= 3.3V
CC
-60
V
CC
= 3.3V
-40
-20
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-7 -6 -5 -4 -3 -2 -1
0
1
2
3
4
5
TEMPERATURE (°C)
OUTPUT HIGH VOLTAGE (V)
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Typical Operating Characteristics (continued)
(V
= +3.0V to +5.5V, T = T
to T
, unless otherwise specified. Typical values are at V
= +5V and T = +25°C.) (Notes 1, 2)
A
CC
A
MIN
MAX
CC
DRIVER OUTPUT CURRENT
vs. OUTPUT LOW VOLTAGE
DRIVER PROPAGATION DELAY
DIFFERENTIAL DRIVER SKEW
vs. TEMPERATURE
vs. TEMPERATURE
180
30
10
9
8
7
6
5
4
3
2
1
0
R = 54Ω
C = 50pF
L
R = 54Ω
C = 50pF
L
V
= 5V
L
L
CC
160
140
120
100
80
25
t
, V = 3.3V
DPHL CC
20
15
10
5
t , V = 3.3V
DPLH CC
V
CC
= 3.3V
60
V
CC
= 3.3V
t
, V = 5V
DPHL CC
40
t , V = 5V
DPLH CC
20
V
CC
= 5V
0
0
0
2
4
6
8
10
12
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
OUTPUT LOW VOLTAGE (V)
TEMPERATURE (°C)
TEMPERATURE (°C)
DRIVER-OUTPUT RISE/FALL TIME
vs. TEMPERATURE
DRIVER-OUTPUT TRANSITION SKEW
vs. TEMPERATURE
RECEIVER PROPAGATION DELAY
vs. TEMPERATURE
8
7
6
5
4
3
2
1
0
3.0
2.5
2.0
1.5
1.0
0.5
0
20
18
16
14
12
10
8
R = 54Ω
C = 50pF
L
C = 15pF
L
R = 54Ω
C = 50pF
L
L
L
t
, V = 3.3V
HL CC
t
, V = 3.3V
RPLH CC
t , V = 5V
HL CC
t , V = 3.3V
RPHL CC
V
= 3.3V
CC
t , V = 5V
RPHL CC
t
, V = 5V
LH CC
6
t , V = 3.3V
LH CC
t , V = 5V
RPLH CC
4
2
V
= 5V
CC
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
DRIVER/RECEIVER
PROPAGATION DELAY
DIFFERENTIAL INPUT CAPACITANCE
vs. FREQUENCY
MAX14783E toc15
30
20
10
0
V
= 3.3V
DE = GND
CC
C = 8pF
L
5V/div
DI
A/B
RO
2V/div
5V/div
0
3
30
10ns/div
FREQUENCY (MHz)
Maxim Integrated
│ 10
www.maximintegrated.com
MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Pin Configuration
TOP VIEW
V
B
7
A
6
GND
5
CC
8
+
RO
RE
DE
1
2
3
8
7
6
V
B
A
CC
MAX14783E
MAX14783E
*EP
+
DI
4
5
GND
1
2
3
4
RO
RE
DE
DI
µMAX/SO
TDFN-EP
*CONNECT EXPOSED PAD (EP) TO GND
Pin Description
PIN
NAME
FUNCTION
1
RO
Receiver Output. See Function Tables.
Receiver Output Enable. Drive RE low to enable RO. Drive RE high to disable the receiver. RO is high
impedance when RE is high. Drive RE high and pull DE low to enter low-power shutdown mode.
2
3
4
RE
Driver Output Enable. Drive DE high to enable the driver. Drive DE low to disable the driver. Driver
outputs are high-impedance when the driver is disabled. Drive RE high and pull DE low to enter low-
power shutdown mode.
DE
Driver Input. With DE high, a low on DI forces the A output low and the B output high. Similarly, a high
on DI forces the A output high and B output low.
DI
5
6
GND
A
Ground
Noninverting RS-485/RS-422 Receiver Input and Driver Output
Inverting RS-485/RS-422 Receiver Input and Driver Output
7
B
8
V
Positive Supply Voltage Input. Bypass V
with a 0.1µF ceramic capacitor to ground.
CC
CC
—
EP
Exposed Pad (TDFN only). Connect EP to GND.
Maxim Integrated
│ 11
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Function Tables
TRANSMITTING
INPUTS
OUTPUTS
MODE
RE
X
DE
1
DI
1
B
0
1
A
1
0
Active
Active
X
1
0
0
0
X
X
High Impedance
High Impedance
Driver Disabled
Shutdown
1
0
RECEIVING
INPUTS
OUTPUTS
MODE
RE
0
DE
X
A-B
≥ -10mV
≤ -200mV
Open/Shorted
X
RO
1
Active
Active
0
X
0
0
X
1
Active
1
1
1
High Impedance
High Impedance
Receiver Disabled
Shutdown
0
X
X = Don’t care
Maxim Integrated
│ 12
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Hot-Swap Capability
Detailed Description
The MAX14783E is a 3.3V/5V ESD-protected RS-485/
RS-422 transceiver intended for high-speed, half-duplex
communications. Integrated hot-swap functionality elimi-
nates false transitions on the bus during power-up or hot
insertion.
Hot-Swap Inputs
When circuit boards are inserted in a hot or powered
backplane, disturbances on the enable inputs and dif-
ferential receiver inputs can lead to data errors. Upon
initial circuit board insertion, the processor undergoes its
power-up sequence. During this period, the processor
output drivers are high impedance and are unable to drive
the DE and RE inputs of the MAX14783E to a defined
logic level. Leakage currents up to 10µA from the high-
impedance outputs of a controller could cause DE and RE
to drift to an incorrect logic state. Additionally, parasitic
The device features fail-safe receiver inputs guaranteeing
a logic-high receiver output when inputs are shorted or
open. The IC has a 1-unit load receiver input impedance,
allowing up to 32 transceivers on the bus.
True Fail Safe
The MAX14783E guarantees a logic-high receiver output
when the receiver inputs are shorted or open, or when
they are connected to a terminated transmission line with
all drivers disabled. If the differential receiver input voltage
(A–B) is greater than or equal to -10mV, RO is logic-high.
circuit board capacitance could cause coupling of V
CC
or GND to DE and RE. These factors could improperly
enable the driver or receiver. The MAX14783E features
integrated hot-swap inputs that help to avoid these poten-
tial problems.
When V
rises, an internal pulldown circuit holds DE
Driver Single-Ended Operation
CC
low and RE high. After the initial power-up sequence, the
pulldown circuit becomes transparent, resetting the hot-
swap-tolerable inputs.
The A and B outputs can either be used in the standard
differential operating mode, or can be used as single-
ended outputs. Since the A and B driver outputs swing
rail-to-rail, they can individually be used as standard TTL
logic outputs.
Hot-Swap Input Circuitry
The DE and RE enable inputs feature hot-swap capabil-
ity. At the input, there are two nMOS devices, M1 and M2
(Figure 9). When V
ramps from 0V, an internal 10µs
CC
timer turns on M2 and sets the SR latch that also turns
V
CC
10µs
TIMER
TIMER
DRIVER
ENABLE
5kΩ (typ)
DE
(HOT SWAP)
100µA
500µA
M1
M2
Figure 9. Simplified Structure of the Driver Enable (DE) Pin
Maxim Integrated
│ 13
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MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
on M1. Transistors M2 (a 500µA current sink) and M1 (a
100µA current sink) pull DE to GND through a 5kΩ (typ)
resistor. M2 is designed to pull DE to the disabled state
against an external parasitic capacitance up to 100pF that
can drive DE high. After 10µs, the timer deactivates M2
while M1 remains on, holding DE low against three-state
leakages that can drive DE high. M1 remains on until an
external source overcomes the required input current.
At this time, the SR latch resets and M1 turns off. When
M1 turns off, DE reverts to a standard, high-impedance
● ±35kV HBM
● ±20kV using the Air-Gap Discharge method specified
in IEC 61000-4-2
● ±12kV using the Contact Discharge method specified
in IEC 61000-4-2
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents test
setup, test methodology, and test results.
CMOS input. Whenever V
swap input is reset.
drops below 1V, the hot-
CC
Human Body Model (HBM)
Figure 10 shows the HBM, and Figure 11 shows the cur-
rent waveform it generates when discharged into a low-
impedance state. This model consists of a 100pF capaci-
tor charged to the ESD voltage of interest, which is then
discharged into the test device through a 1.5kΩ resistor.
A complementary circuit employing two pMOS devices
pulls RE to V
.
CC
±35kV ESD Protection
ESD protection structures are incorporated on all pins
to protect against electrostatic discharges encountered
during handling and assembly. The driver outputs and
receiver inputs of the MAX14783E have extra protection
against static electricity. The ESD structures withstand
high ESD in all states: normal operation, shutdown, and
powered down. After an ESD event, the MAX14783E
keeps working without latch-up or damage.
IEC 61000-4-2
The IEC 61000-4-2 standard covers ESD testing and per-
formance of finished equipment. However, it does not spe-
cifically refer to integrated circuits. The MAX14783E helps
in designing equipment to meet IEC 61000-4-2 without the
need for additional ESD protection components.
The major difference between tests done using the HBM
and IEC 61000-4-2 is higher peak current in IEC 61000-
4-2 because series resistance is lower in the IEC 61000-
4-2 model. Hence, the ESD withstand voltage measured
to IEC 61000-4-2 is generally lower than that measured
using the HBM.
ESD protection can be tested in various ways. The trans-
mitter outputs and receiver inputs of the MAX14783E are
characterized for protection to the following limits:
R
1.5kΩ
R
1MΩ
D
C
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
100%
90%
I
P
R
DISCHARGE
RESISTANCE
CHARGE CURRENT-
LIMIT RESISTOR
AMPERES
36.8%
HIGH-
DEVICE
UNDER
TEST
VOLTAGE
DC
C
100pF
STORAGE
CAPACITOR
S
10%
0
SOURCE
TIME
0
t
RL
t
DL
CURRENT WAVEFORM
Figure 10. Human Body ESD Test Model
Figure 11. Human Body Current Waveform
Maxim Integrated
│ 14
www.maximintegrated.com
MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Figure 12 shows the IEC 61000-4-2 model, and Figure
13 shows the current waveform for IEC 61000-4-2 ESD
Contact Discharge test.
RE and DE can be connected together and driven simul-
taneously. The MAX14783E is guaranteed not to enter
shutdown if RE is high and DE is low for less than 50ns.
If the inputs are in this state for at least 800ns (max), the
device is guaranteed to enter shutdown.
Applications Information
Driver Output Protection
Typical Applications
Two mechanisms prevent excessive output current and
power dissipation caused by faults or by bus connec-
tion. The first, a current limit on the output stage provides
immediate protection against short circuits over the whole
common-mode voltage range. The second, a thermal-shut-
down circuit, forces the driver outputs into a high-imped-
ance state if the die temperature exceeds +160°C (typ).
The MAX14783E transceiver is designed for bidirectional
data communications on multipoint bus transmission
lines. Figure 14 shows a typical network application cir-
cuit. To minimize reflections, terminate the line at both
ends with its characteristic impedance and keep stub
lengths off the main line as short as possible.
Low-Power Shutdown Mode
Low-power shutdown mode is initiated by bringing RE
high and DE low. In shutdown, the devices draw less than
10µA of supply current.
R
C
R
D
I
50MΩ TO 100MΩ
330Ω
100%
90%
DISCHARGE
RESISTANCE
CHARGE CURRENT-
LIMIT RESISTOR
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
C
150pF
STORAGE
CAPACITOR
S
SOURCE
10%
t
R
= 0.7ns TO 1ns
t
30ns
60ns
Figure 12. IEC 61000-4-2 ESD Test Model
Figure 13. IEC 61000-4-2 ESD Generator Current Waveform
120Ω
120Ω
DE
B
B
DI
D
D
DI
DE
A
B
A
B
A
A
R
RO
RE
RO
RE
R
R
R
D
D
MAX14783E
DE
RE
DI
DI
RO
DE RO RE
Figure 14. Typical Half-Duplex RS-485 Network
Maxim Integrated
│ 15
www.maximintegrated.com
MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Ordering Information
PART
SUPPLY RANGE
DATA RATE (MAX)
TEMP RANGE
PIN-PACKAGE
MAX14783EEUA+
MAX14783EESA+
MAX14783EATA+
3.0V to 5.5V
3.0V to 5.5V
3.0V to 5.5V
3.0V to 3.6V
3.0V to 5.5V
3.0V to 3.6V
3.0V to 5.5V
30Mbps
40Mbps
42Mbps
42Mbps
16Mbps
42Mbps
6Mbps
-40°C to +85°C
-40°C to +85°C
-40°C to +125°C
8 µMAX
8 SO
8 TDFN-EP*
MAX14783EASA+
MAX14783EAUA+
-40°C to +125°C
-40°C to +125°C
8 SO
8 µMAX
+Denotes lead(Pb)-free/RoHS-compliant package.
*EP = Exposed paddle.
Chip Information
PROCESS: BiCMOS
Maxim Integrated
│ 16
www.maximintegrated.com
MAX14783E
High-Speed 3.3V/5V RS-485/RS-422 Transceiver
with ±35kV HBM ESD Protection
Revision History
REVISION REVISION
PAGES
CHANGED
DESCRIPTION
NUMBER
DATE
6/13
1/15
7/20
0
1
2
Initial release
—
1
Updated page 1 content
Updated the Benefits and Features and Electrical Characteristics sections
1, 3
For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
©
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
2020 Maxim Integrated Products, Inc.
│ 17
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