MAX14906EVKIT [MAXIM]
Easy Evaluation of the MAX14906 with Per-Channel Configuration;型号: | MAX14906EVKIT |
厂家: | MAXIM INTEGRATED PRODUCTS |
描述: | Easy Evaluation of the MAX14906 with Per-Channel Configuration |
文件: | 总16页 (文件大小:2774K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Evaluates: MAX14906
MAX14906 Evaluation Kit
General Description
Features
The MAX14906 evaluation kit (EV kit) provides a
proven design to evaluate the MAX14906, a four-channel
industrial digital-output, digital-input device. The EV kit allows
the MAX14906 to be configured on a per-channel basis
as either a digital output (in High-Side switch or Push-Pull
driver configuration) or a Type 1 and 3, or Type 2 digital
input. The EV kit monitors the MAX14906 diagnostic
information, including open-wire condition, state of the
output channels, multiple undervoltage alarms, global
and per-channel overtemperature alarms, and multiple
fault alarms.
● Easy Evaluation of the MAX14906 with Per-Channel
Configuration
● SafeDemagTM for Safe Turn-Off of Unlimited
Inductance in Digital Output Modes
● Configurable for IEC 61131-2 Type 1 and 3,
or Type 2 Digital Input
●
●
●
●
Support up to 3.75kV
Galvanic Isolation with
MAX14483 and MAX14937
RMS
Support Communicating with External Microcontroller
or FPGA
The EV kit must be powered from an external 24V DC
power supply that can provide up to 6.4A (max), when all
DOI_ output channels are fully loaded with the option of
2x load inrush current.
Allow Output Switching with High-Speed Parallel
Interface or SPI Serial Interface
®
Windows 10, Windows 8.1, and Windows 7
Compatible GUI Software
Proven PCB Layout
The MAX14906 EV kit communicates with a graphical
user interface (GUI) on a PC through a USB port. The EV
kit features an on-board FT2232 controller interfacing to
the MAX14906 control signals. Alternatively, an external
SPI interface from a microcontroller or FPGA can be used
through the 20-pin header (J13).
●
●
●
Fully Assembled and Tested
RoHS Compliant
Ordering Information appears at end of data sheet.
The MAX14906 EV kit comes with the MAX14906ATM+
installed in a 48-pin, 7mm x 7mm QFN package.
MAX14906 EV Kit Board Photo
SafeDemag™ is a trademark of Maxim Integrated Products, Inc.
®
Windows is a registered trademark of Microsoft Corporation.
319-100535; Rev 1; 3/21
Evaluates: MAX14906
MAX14906 Evaluation Kit
MAX14906 EV Kit Block Diagram
V
LED
V
5
J2
J5
V
L
24V
36V
V
USB
0.1µF
0.1µF
0.1µF
0.1µF
0.1µF
GND
10µF
1µF
0.1µF
V
L
V
LED
10kΩ
V
L
GND
J7
24.9kΩ
J6
10kΩ
V
DD
V
V
DD
LED REGEN
V
5
V
L
EN
V
DDB
V
DDA
V
CCIO
Q4
Q3
VDDOK
MAX14483
G4
V
DD4
FAULT
SYNCH
CS
CLK
SDO
SDI
READY
IFAULT
OAUX
OCS
OFAULT
IAUX
INT
V
DD4
V
DD
GPIO
CS
ICS
J11
OSCLK
ISDO
ISCLK
OSDO
ISDI
SCLK
MISO
MOSI
GPIO
V
DD
OSDI
IRDY
SAA
G3
V
DD3
1kΩ
GNDA
GNDB
V
DD3
V
DD
V
L
J1
J10
V
V
USB
L
CRCEN
GND
0.1µF
0.1µF
V
DD
MAX14906
10kΩ
Q2
Q1
10kΩ
G2
V
DD2
10kΩ
10kΩ
V
V
DDA
DDB
V
DD2
V
DD
MAX14937
I/OB1
I/OB2
I/OA1
I/OA2
GPIO
GPIO
D4
D3
J9
GNDB
GNDA
V
DD
USB
FT2232
G1
V
L
V
USB
V
DD1
0.1µF
V
DD1
0.1µF
V
DD
10kΩ
10kΩ
J8
10kΩ
10kΩ
TERMINAL
BLOCK
V
DDB
V
DDA
MAX14937
D2
D1
I/OB1
I/OB2
I/OA1
I/OA2
GPIO
GPIO
V
GNDB
GNDA
L
J3
J4
DOI4
DOI4
PGND
A0
A1
GND
DOI3
DOI3
PGND
V
L
GND
DOI2
DOI2
PGND
5.6kΩ
5.6kΩ
5.6kΩ
5.6kΩ
L4
L3
L2
L1
DOI1
DOI1
PGND
UGND
EARTH
1000pF
EP
GND
FLED
SLED
SW1 AND
20-PIN HEADER (J13)
Quick Start
MAX14906 EV KIT Files
Required Equipment
FILE
DESCRIPTION
● MAX14906 EV kit
MAX14906EVKitSetupV1.0.2.ZIP Application Program (GUI)
● 24V, 6.4A(max) DC power supply
● Windows 10, Windows 8,1, Windows 7 PC with a
spare USB port
● USB A-to-micro-B cable
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Evaluates: MAX14906
MAX14906 Evaluation Kit
6) Verify that all jumpers are in their default positions
Procedure
(Table 1).
The EV kit is fully assembled and tested. Follow the steps
below to verify board operation.
7) Connect the DC power supply between the EV kit VDD
banana jack and GND banana jack. Set the DC power
supply output to +24V, and then enable the output. Ob-
serve that on the EV kit, the VDDOK and FAULT LEDs
are on, indicating the EV kit is powered up.
Note: In the following section(s), software-related items are
identified by bolding. Text in bold refers to items directly
from the EV kit software. Text in bold and underlined
refers to items from the Windows operating system.
8) Connect the USB A-to-micro-B cable from the PC to
the EV kit board. A Windows message appears when
connecting the EV kit board to the PC for the first
time. Each version of Windows has a slightly different
message. If you see a Windows message stating
ready to use, then proceed to the next step.
1) Visit www.maximintegrated.com to download the
latest version of the EV kit software, MAX14906EVKit-
SetupV1.0.2.ZIP or newer.
2) Save the EV kit software to a temporary folder and
uncompress the ZIP file.
3) Install the EV kit software and USB driver on your
computer by running the MAX14906EVkitSetup-
V1.0.2.EXE program inside the temporary folder.
9) Start the EV kit software by opening its icon in the
Windows Start | Programs | Maxim Integrated
menu. The EV kit software appears as shown in Fig-
ure 1. Verify that the lower-right status bar indicates
the EV kit hardware is Connected. The GUI automat-
ically detects that the EV kit is connected to the PC
and enables serial communication. Any configuration
change can be made on the Register Settings tab.
4) The program files are copied to your PC and icons are
created in the Windows Start | Programs | Maxim
Integrated menu. During software installation,
some versions of Windows might show a warning
message indicating that this software is from an un-
known publisher. This is not an error condition and
it is safe to proceed with installation. Administrator
privileges are required to install the USB device driver.
10) By default, SYNCH is enabled as seen in the Regis-
ter Settings tab.
11) Select the GlobalErr register (0x07) and press the
Read Selected button once to read the default value
of 0x1F. Press the Read Selected button for the sec-
ond time to clear all initially detected undervoltage
global conditions in the GUI.
5) At the end of the installation process, the installer
launches the installation for the FTDI Chip CDM
drivers. Follow the instructions on the installer and
once complete, click Finish. The default location of
the software is in the program files directory.
Table 1. MAX14906 EV Kit Shunt Positions and Settings
SHUNT
POSITION
HEADER
DESCIPTION
1–2
2–3*
1–2*
Open
1–2
Connect CRCEN to the V supply to enable CRC on the SPI interface.
L
J1
J2
J3
J4
Connect CRCEN to GND to disable CRC on the SPI interface.
Connect the external V
supply to V
supply.
LED
DD
Use an external power supply for the V
supply between the VLED test point and GND test point.
LED
Set chip LSB address bit A0 to 1 for the addressable SPI (needs to match the Address in the GUI).
Set chip LSB address bit A0 to 0 for the addressable SPI (needs to match the Address in the GUI).
Set chip MSB address bit A1 to 1 for the addressable SPI (needs to match the Address in the GUI).
Set chip MSB address bit A1 to 0 for the addressable SPI (needs to match the Address in the GUI)
2–3*
1–2
2–3*
Connect V to V 5V LDO output when REGEN is unconnected. If REGEN = GND, connect a 5V external
L
5
1–2*
supply between the V test point and the GND test point to provide 5V to both V and V .
L
L
5
J5
J6
Connect an external supply only on the V test point, when REGEN is unconnected and V is enabled as
L
5
Open
the LDO output. If REGEN = GND, connect the external supplies to both the V test point and the V test
L
5
point, respectively.
1–2*
2–3
Connect EN to the V supply to enable all DOI_ outputs.
L
Connect EN to GND to disable/three-state all DOI_ outputs.
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Evaluates: MAX14906
MAX14906 Evaluation Kit
Table 1. MAX14906 Board Shunt Positions and Settings (continued)
SHUNT
POSITION
HEADER
DESCIPTION
Connect REGEN to GND to disable the internal regulator. Connect an external 5V supply between
1–2
the V test point and GND test point.
J7
5
Open*
1–2
Enable the internal 5V regulator (V is a 5V supply output).
5
Connect V to V
. The external pMOS transistor Q1 is not used and G1 is turned off.
DD
DD1
J8
J9
V
is connected to V
through the external pMOS transistor Q1 for reverse current protection
DD1
DD
Open*
1–2
and G1 is turned on.
Connect V to V
. The external pMOS transistor Q2 is not used and G2 is turned off.
DD2
DD
V
DD
is connected to V
through the external pMOS transistor Q2 for reverse current protection
DD2
Open*
1–2
and G2 is turned on.
Connect V to V
. The external pMOS transistor Q3 is not used and G3 is turned off.
DD3
DD
J10
J11
V
is connected to V
through the external pMOS transistor Q3 for reverse current protection
DD3
DD
Open*
1–2
and G3 is turned on.
Connect V to V
. The external pMOS transistor Q4 is not used and G4 is turned off.
DD4
DD
V
DD
is connected to V
through the external pMOS transistor Q4 for reverse current protection
DD4
Open*
and G4 is turned on.
*Default configuration
12) Select Config1 register (0x0A) and set the SLEDSet
bit to 0 in the Setting cell to autonomously control
all four STATUS LEDs by the internal logic. The font
color of the modified register is changed from black to
red. Click the Write Selected button to write the new
configuration into the register.
supply to the GND test point. Connect the positive
terminal of the 24V DC power supply to the DOI1 test
point.
18) Using a voltmeter, verify D1 logic output is approxi-
mately 5V by probing the D1 test point.
19) Set the DC power supply output to be less than 6V.
13) By default, the GUI is set for DO High-Side Mode. In
the System tab of the GUI, select the desired output
mode (High-side, High-side 2x Inrush Current, Ac-
tive Clamp Push-pull or Simple Push-pull) and select
On to set D_ logic input high, thus the corresponding
DOI_ output is enabled/turned on. Notice that the cor-
responding status LED (SLED_) lights up.
20) Using a voltmeter, verify D1 logic output is approxi-
mately 0V by probing the D1 test point.
21) Repeat steps 17 to 20 to verify other DOI_ input be-
havior.
Detailed Description of Hardware
The MAX14906 EV kit allows the user to evaluate all
features and operational modes of the MAX14906, four-
channel digital-output, digital-input device.
14) Select Off in the pulldown menu to set the D_ logic in-
put low to turn off the corresponding DOI_ output. Verify
that the SLED_ is turned off, which indicates that the
DOI_ output is turned off.
External Power Supplies
15) Repeat steps 13 and 14 to verify other DOI_ outputs
and check that the status LED (SLED_) follows the
input setting.
The EV kit is powered from a single power supply and
accepts a wide range of supply voltages, from 10V to 40V
DC. The power is applied through two banana jacks, VDD
(+) and GND (-).
16) In the System tab select DI Mode for all DOI_ chan-
nels in the pulldown menu in the first column. This
configures the DOI1 to DOI4 channels to Type 1 and
3 digital-input mode (DI mode) and sets D1 to D4 log-
ic pins to logic outputs.
The MAX14906 requires a 5V DC power supply on V . It
5
can be powered by the internal 5V linear regulator when
the J7 header is left open. Alternatively, V can be powered
5
by an external 5V DC supply when J7 is in the 1–2 position.
17) Connect the negative terminal of the 24V DC power
Refer to Table 1 for details.
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Evaluates: MAX14906
MAX14906 Evaluation Kit
The logic supply V defines the levels on all I/O logic pins.
L
the SetOUT register (0x00). All the DOI_ channels can be
configured as either Type 1 and 3 or Type 2 digital inputs.
However, it is not possible to mix input types as the inter-
nal current sink is globally set to either 2.3mA (typ) for
Type 1 and 3, or 7mA (typ) for Type 2 inputs. By default,
the Typ2Di bit is set to 0, which is the Type 1 and 3 con-
figuration. The DOI_ inputs support a minimum operating
range of -3V to +30V which is compliant with IEC 61131-2
digital inputs standard. Input voltage can be applied to the
J12 terminal block or the DOI_ test points.
It can be powered by the internal 5V linear regulator when
the J7 header is left open and J5 is in the 1–2 position. If
a different logic level other than 5V is desired, for example
3.3V, an external power supply is needed to power up the
V pin through the V test point with a supply range of 2.5V
L
L
to 5.5V. In this case, the J5 header should be left open.
Each DOI_ channel is powered by their respective field
supply V
to V
. Each V
is connected directly
DD1
DD4
DD_
to V
through jumpers J8 to J11 when all jumpers are
DD
closed. In this configuration, the external pMOS transis-
tors Q1 to Q4 are not used and the gate driver outputs
G1 to G4 are turned off. To protect the MAX14906 against
high reverse-current flow into the DOI_ pins and allow the
LED Indicators
Field supply V
diagnostic faults are provided through
DD
the VDDOK LED. Global diagnostic faults and per-
channel diagnostic faults are provided through the FAULT
LED if the diagnostic features are enabled through the
registers. By default, FAULT LED is turned on at power-up
due to undervoltage faults set by default in the GlobalErr
register. Per-channel output state and per-channel fault
conditions are visible through the LED matrix, SLED1 to
SLED4, and FLED1 to FLED4, correspondingly. Other
diagnostics are provided through the SPI interface by
reading diagnostic registers 0x02 through 0x07.
DOI_ input voltage to go above the V
supply voltage
DD
and not be clamped to one diode above the field supply,
jumpers J8 to J11 are configured in open position, and
the Q1 to Q4 pMOS transistors are turned on by enabling
G1 to G4 gate driver outputs by setting the GDrvEn1 to
GDrvEn4 bits to 1 in the OpnWrEn register (0x08).
Power-Up Sequencing
1) Enable the +24V DC power supply.
2) Connect the USB A-to-micro-B cable from a PC to
the EV kit board.
3) Start the EV kit software.
When the GUI is not open, the DOI_ outputs are high due
to the D_ inputs being high since the device is in high-side
DO mode by default. When the GUI is open, the software
pulls D_ inputs low and then DOI_ outputs are also low.
Isolation Domains
The MAX14906 EV kit features galvanic isolation for
the 4-wire SPI, SYNCH, FAULT, and READY signals
using the MAX14483 and the D_ logic inputs/outputs
(D1, D2, D3 and D4) using the MAX14937s, whose
bidirectional channels allow the D_ signals to be trans-
mitted in both directions on the same line. Refer to
the MAX14906 EV Kit Schematic. The isolated logic
domain is powered exclusively from the USB connector
J202. The digital isolators, MAX14483 (U4) and the
MAX14937 (U2 and U3) keep the USB ground separate
from the rest of the MAX14906 circuitry.
Digital Output Operation
In the Digital Output mode, the user can control the
D_ logic inputs or HighO_ bits to enable or disable the
DOI_ outputs. The specific DO mode, such as High-
side, High-side 2x Inrush Current, Simple Push-pull, and
Active Clamp Push-pull can be selected in the pulldown
menu in the System tab, or by selecting the desired
output mode by using DoMode_[1:0] bits in the ConfigDO
register (0x0D). D_ logic inputs can be controlled either by
the EV kit GUI or by an external source when D_ signals
are disconnected from the on-board microcontroller using
the corresponding switch (SW1) channels. The external
D_ input signals can be applied to the D1 to D4 test points
or to J13 connector.
Protective Earth (PE) is provided on the upper-left cor-
ner of the EV kit with a safety rated Y capacitor (C13)
between the field ground (GND) and PE.
External pMOS Transistors
The MAX14906 EV kit has an external pMOS transistor
for each channel to protect the MAX14906 against high
reverse current flow into the DOI_ pins in the DO modes
and supports up to 30V input voltages in DI modes.
When using the external pMOS transistors, ensure J8,
J9, J10 and J11 headers are open, and gate drive pins
G1 to G4 are enabled by setting the GDrvEn_ bits to 1 in
the OpnWrEn register (0x08). The external pMOS tran-
sistors are always off and G1 to G4 pins are shorted to
Digital Input Operation
The user can configure the DOI_ channels as digital
inputs by selecting DI Mode in the pulldown menu in the
System tab, or by setting the SetDi1 to SetDi4 bits to 1 in
V
to V
in the DI modes and the high-impedance
DD1
DD4
low-leakage mode.
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Evaluates: MAX14906
MAX14906 Evaluation Kit
mode, as shown in Figure 2. The third pulldown menu
allows the DOI_ outputs to be on, off, or driving a square-
wave from the pulldown menu.
Surge and ESD Protection
The MAX14906 EV kit is immune to ±1kV surge pulses
(1.2/50µs, according to IEC 61000-4-5) applied between
the DIO_ and field ground. Without external protection
devices, the DOI_ channels of the MAX14906 are pro-
tected against negative 1kV surges per IEC 61000-4-5
(42Ω/0.5µF). To protect the MAX14906 from positive
surge transients on the DOI_ pins, a suppressor/TVS
The EV kit drives outputs once On is selected in the
pulldown menu. When driving a square wave, the user
must click the Drive Square button on the lower right-side
of the GUI to drive the outputs. The indicators connected
to the OUT1 to OUT4 pins show the state of each output.
diode (D5) is installed between V
the MAX14906 EV Kit Schematic.
and GND. Refer to
DD
Connect the oscilloscope probe to DOI_ test points on the
EV kit to see the output signal in real-time.
To protect the MAX14906 from electrostatic discharge
(ESD) events per IEC 61000-4-2, an additional 470pF can
be installed on C4, C8, C9, and C10 for each DOI_ pin.
In addition, if the external pMOS transistors Q1 to Q4 are
enabled (J8 to J11 open), install 1μF bypass capacitors
on C18 and C19 footprint. If the external pMOS transis-
tors Q1 to Q4 are not used (J8 to J11 closed), install 1μF
bypass capacitors on C1, C2, C11, and C12 footprint for
The user can set the MAX14906 in Digital Input mode
by selecting DI Mode in the pulldown menu in the first
column. In DI Mode, the pulldown menu in the second
column allows the user to configure all digital inputs to
either Type 1 and 3, or Type 2 inputs.
The user can also configure the MAX14906 to be in
low-leakage high-impedance mode by selecting the Low-
Leakage Mode, in the pulldown menu in the first column.
each V
pin.
DD_
Register Settings Tab
Communicating with the MAX14906
The Register Settings tab allows full configuration of the
device, as shown in Figure 3. The full register map of the
MAX14906 is located on the left-side of the tab, and the
bit-by-bit control and description table is located on the
right side. When the register is selected in the register
table, the detailed description of each bit is shown in the
bit description table. The bit value can be changed using
pulldown menus in the Setting cell for each bit individu-
ally in the bit description table. Both tables are synchro-
nized in that changes made in one table appear at both
tables. There are several write and read options available
through the corresponding control buttons located below
the bit description table.
The MAX14906 EV kit communicates to a PC through
a USB port. The on-board FT2232 controller is
communicating with all digital signals including SPI, D1
to D4, SYNCH, READY and FAULT, and is managed by
the EV kit GUI software on the PC. This is ideal for quick
evaluation and to explore the features and functions of
the MAX14906.
If the user prefers to use their own microcontroller or
FPGA and their own software, all digital signals including
SPI, D1 to D4 signals, SYNCH, READY and FAULT are
available through J13. If J13 is used, disconnect the on-
board FT2232 controller from the MAX14906 by opening
all switches on SW1.
When the Auto Write button is selected, any data typed
in, or selected through the Setting pulldown menu is
automatically written into the corresponding writable
register. The button renamed to Stop Auto Write and
auto write function can be canceled by clicking on this
button a second time.
Detailed Description of Software
The MAX14906 GUI provides access to all registers and
allows full configuration and control of the MAX14906.
There are two tabs available to control the EV kit. The
System tab provides quick and basic control of the DOI_
channels. The Register Settings tab provides per-chan-
nel and enhanced diagnostic configuration and allows full
control of the device.
The Read All button performs a read operation of all reg-
isters after each click.
When the fault conditions occur, they set the bit(s) in the
corresponding read-only registers 0x02 to 0x07. The fault
conditions should be carefully evaluated and removed
externally (over-/undervoltage, thermal overload, open-
wire, etc.). It is recommended to read the Interrupt (0x03)
and GlobalErr (0x07) registers first to identify what kind
of fault conditions are present, then read per-channel
diagnostic registers 0x02, 0x04 to 0x06 twice to make
sure that the condition is gone and to clear the interrupts.
System Tab
The System tab allows the DOI_ pins to be configured in
Digital Output mode by selecting the first pulldown menu
to DO Mode. The type of digital output mode can be con-
figured by selecting the second pulldown menu, including
High-side mode, High-side with 2x Inrush Current mode,
Active Clamp Push-pull mode and Simple Push-pull
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MAX14906 Evaluation Kit
The Write Selected button allows to write to the selected
register only, while the Write Modified button performs a
write operation to all modified registers after each click.
need to be matched. To enable the CRC, set the jumper
J1 in the 1–2 position and put the CRCEN slider to the
enabled position. To disable the CRC, set jumper J1 in the
2–3 position and set the CRCEN slider to disabled. The
SYNCH slider allows manual synchronization of multiple
devices.
The Burst Write allows the GUI to write to registers 0x00
and 0x01 only in one SPI cycle, while the Burst Read
allows the GUI to read multiple consecutive registers 0x02
through 0x07 (DoiLevel, Interrupt, OvrLdChF, OpnWirChF,
ShtVDDChF, and GlobalErr registers) in one SPI cycle.
The user must match A0 and A1 jumper position (2–3
position by default) on the EV kit with the SPI address
selected from the Address pulldown menu, located below
the register map table. The default address is 00.
There are a MAX14906 I/O Pins box and a SDO
Diagnostic Result box below the buttons. The SDO
diagnostic faults are updated after each SPI read or write
operation. To enable or disable the CRC function on the
SPI interface, both software and hardware configurations
Each SPI transaction is displayed in the Device Mode
Info box for user convenience.
Figure 1. MAX14906 EV Kit GUI System Tab
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Evaluates: MAX14906
MAX14906 Evaluation Kit
Figure 2. System Tab/Output Configuration
Figure 3. Register Settings Tab
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MAX14906 Evaluation Kit
Ordering Information
PART
TYPE
EV Kit
MAX14906EVKIT#
#Denotes RoHS compliance.
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Evaluates: MAX14906
MAX14906 Evaluation Kit
MAX14906 EV Kit Bill of Materials
ITEM
REF_DES
DNI/DNP
QTY
MFG PART #
MANUFACTURER
VALUE
DESCRIPTION
COMMENTS
CC0603KRX7R0BB104;
GRM188R72A104KA35;
GCJ188R72A104KA01;HMK107B7104KA;
06031C104KAT2A;GRM188R72A104K
CAPACITOR; SMT (0603);
CERAMIC CHIP; 0.1UF; 100V;
TOL=10%; TG=-55 DEGC TO +125
DEGC; TC=X7R
YAGEO;MURATA;MURATA;
TAIYO YUDEN;AVX;MURATA
1
C3, C17
-
2
0.1UF
10UF
1UF
CAPACITOR; SMT (1210);
CERAMIC CHIP; 10UF; 50V;
TOL=10%; TG=-55 DEGC TO +125
DEGC; TC=X7S
C3225X7S1H106K250AB;
CGA6P3X7S1H106K250AB;
GCM32EC71H106K
2
3
C5
-
-
1
1
TDK;TDK;MURATA
TDK;MURATA;TDK
C2012X7S2A105K125AB;
GRJ21BC72A105KE11;
CGA4J3X7S2A105K125AB;
GRM21BC72A105KE01
CAPACITOR; SMT (0805);
CERAMIC CHIP; 1UF; 100V;
TOL=10%; TG=-55 DEGC TO +125
DEGC; TC=X7S
C6
CAPACITOR; SMT (0805);
GMK212B7105KG;
GRM219R7YA105KA12
CERAMIC; 1UF; 35V; TOL=10%;
MODEL=GMK SERIES; TG=-55 DEGC
TO +125 DEGC; TC=X7R
4
5
6
C7
-
-
-
1
1
TAIYO YUDEN;MURATA
MURATA
1.0UF
1000PF
0.1UF
CAP; SMT (2211); 1000PF;
10%; 250V; X7R; CERAMIC CHIP
C13
GA352QR7GF102KW01
CAPACITOR; SMT (0402);
C14, C15, C205-C215,
C230, C231
C0402C104J4RAC;
GCM155R71C104JA55
CERAMIC CHIP; 0.1UF; 16V; TOL=5%;
MODEL=; TG=-55 DEGC TO +125
DEGC; TC=X7R
15
KEMET;MURATA
CAPACITOR; SMT (0402);
CERAMIC CHIP; 0.01UF; 35V;
TOL=10%; TG=-55 DEGC TO +125
DEGC; TC=X7R
7
8
C201
-
-
-
-
-
1
2
1
1
1
C1005X7R1V103K050BB
TDK
0.01UF
18PF
4.7UF
10UF
1UF
CAPACITOR; SMT (0402);
CERAMIC CHIP; 18PF; 50V; TOL=5%;
TG=-55 DEGC TO +125 DEGC;
TC=C0G
C0402C180J5GAC;
GRM1555C1H180JA01;
C1005C0G1H180J050BA
C202, C203
C204
KEMET;MURATA;TDK
C0603C475K8PAC;
CAPACITOR; SMT (0603);
CERAMIC CHIP; 4.7UF; 10V;
TOL=10%; TG=-55 DEGC TO +85
DEGC; TC=X5R
LMK107BJ475KA;CGB3B1X5R1A475K;
C1608X5R1A475K080AC;
CL10A475KP8NNN
KEMET;TAIYO YUDEN;TDK;
TDK;SAMSUNG ELECTRONICS
9
CAPACITOR; SMT (0805);
CERAMIC CHIP; 10UF; 16V;
TOL=10%; TG=-55 DEGC TO +85
DEGC; TC=X5R
CL21A106KOQNNN;
GRM21BR61C106KE15; EMK212ABJ106KD
SAMSUNG ELECTRONICS;
MURATA;TAIYO YUDEN
10
11
CP1
UMK107BJ105KA;
C1608X5R1H105K080AB;
CL10A105KB8NNN;
CAPACITOR; SMT (0603);
TAIYO YUDEN;TDK;
SAMSUNG;MURATA
CERAMIC CHIP; 1UF; 50V; TOL=10%;
MODEL=_MK SERIES; TG=-55 DEGC
TO +85 DEGC
CP2
GRM188R61H105KAAL
CAPACITOR; SMT; 0603;
C0603C102K5RAC;
GRM188R71H102KA01;
C0603X7R500-102KNE
CERAMIC; 1000pF; 50V; 10%; X7R; -
55degC to + 125degC; +/-15% from -
55degC to +125degC
12
13
CP3
CP4
-
-
1
1
KEMET;MURATA;VENKEL
1000PF
22UF
C0805C226M9PAC;
GRM21BR60J226ME39;
JMK212BJ226MG;
CAPACITOR; SMT (0805);
CERAMIC CHIP; 22UF; 6.3V;
TOL=20%; TG=-55 DEGC TO +125
DEGC; TC=X5R
KEMET;MURATA;TAIYO
YUDEN;SAMSUNG EL
CL21A226MQCLQN
CAPACITOR; SMT (0805);
CERAMIC CHIP; 4.7UF; 16V;
TOL=10%; MODEL=GRM SERIES;
TG=-55 DEGC TO +125 DEGC;
TC=X7R
GRM21BR71C475KA73;
0805YC475KAT2A;
GCM21BR71C475KA73;
CGA4J3X7R1C475K125AE
14
15
16
CP5, CP6
D5
-
-
-
2
1
4
MURATA;AVX;MURATA:TDK
4.7UF
36V
VISHAY GENERAL
SEMICONDUCTOR
DIODE; TVS; SMB (DO-214AA);
VRM=36V; IPP=10.3A
SMBJ36A-E3
TEST POINT; PIN DIA=0.125IN;
TOTAL LENGTH=0.445IN; BOARD
HOLE=0.063IN; BROWN; PHOSPHOR
BRONZE WIRE SILVER PLATE
FINISH;
DOI1-DOI4
5125 KEYSTONE
N/A
TEST POINT; PIN DIA=0.125IN;
TOTAL LENGTH=0.445IN; BOARD
HOLE=0.063IN; GREEN; PHOSPHOR
BRONZE WIRE SILVER PLATE
FINISH;
17
EARTH
-
1
5126 KEYSTONE
N/A
DIODE; LED; SMART; RED;
SMT (0603); PIV=1.8V; IF=0.02A; -40
DEGC TO +100 DEGC
18
19
20
FAULT, FLED1-FLED4
-
-
-
5
1
2
LS L29K-G1J2-1-Z
BLM21AG601SN1
BLM21PG331SN1
OSRAM
MURATA
MURATA
LS L29K-G1J2-1-Z
INDUCTOR; SMT (0805);
FERRITE-BEAD; 600; TOL=+/-25%;
0.2A
FB1
600
330
INDUCTOR; SMT (0805);
FERRITE-BEAD; 330; TOL=+/-25%;
1.5A
FB2, FB3
CONNECTOR; MALE;
PANELMOUNT; STANDARD
UNINSULATED BANANA JACK;
STRAIGHT; 1PIN
21
22
23
GND, VDD
-
-
-
2
4
7
3267 POMONA ELECTRONICS
SULLINS
3267
CONNECTOR; MALE; THROUGH
HOLE; BREAKAWAY; STRAIGHT
THROUGH; 3PINS; -65 DEGC TO
+125 DEGC
J1, J3, J4, J6
J2, J5, J7-J11
PCC03SAAN
PCC02SAAN
PCC03SAAN
PCC02SAAN
CONNECTOR; MALE; THROUGH
HOLE; BREAKAWAY; STRAIGHT
THROUGH; 2PINS; -65 DEGC TO
+125 DEGC
SULLINS
CONNECTOR; FEMALE;
THROUGH HOLE; COMPACT
TERMINAL STRIP WITH PUSH
BUTTON; STRAIGHT; 8PINS
24
25
J12
J13
-
-
1
1
250-408
WAGO
250-408
CONNECTOR; MALE; THROUGH
HOLE; BERGSTIK II BREAKAWAY
HEADER; RIGHT ANGLE; 20PINS
68021-220HLF
AMPHENOL ICC
68021-220HLF
CONNECTOR; MALE; THROUGH
HOLE; MICRO-USB CONNECTOR
MEETING REQUIREMENTS OF USB
2.0 STANDARD; RIGHT ANGLE;
5PINS
26
J202
-
1
ZX62RD-AB-5P8(30)
HIROSE ELECTRIC CO LTD.
ZX62RD-AB-5P8(30)
Maxim Integrated
│ 10
www.maximintegrated.com
Evaluates: MAX14906
MAX14906 Evaluation Kit
MAX14906 EV Kit Bill of Materials (continued)
ITEM
REF_DES
DNI/DNP
QTY
MFG PART #
MANUFACTURER
VALUE
DESCRIPTION
COMMENTS
DIODE; LED; SML-P1 SERIES;
ULTRA COMPACT HIGH
BRIGHTNESS LED; GREEN; SMT
(0402); VF=2.2V; IF=0.02A
27
LED201
-
1
SML-P12PT
ROHM
SML-P12PT
INDUCTOR; SMT (1812); FERRITE
CORE; 3.3UH; TOL=+/-10%; 0.9A
28
29
LP1
-
-
1
4
B82432T1332K000
NTTFS5116PLTAG
TDK
3.3UH
TRAN; POWER MOSFET; PCH;
WDFN8; PD-(40W); I-(-20A);
V-(-60V)
Q1-Q4
ON SEMICONDUCTOR
NTTFS5116PL
RESISTOR; 0603; 24.9K OHM;
1%; 100PPM; 0.10W; THICK FILM
30
31
32
33
34
35
36
R1
-
-
-
-
-
-
-
1
1
2
7
9
4
1
CRCW060324K9FK;ERJ-3EKF2492
CRCW060310K0JN;ERJ-3GEYJ103
CRCW06031K00FK;ERJ-3EKF1001
CRCW060320R0FK;ERJ-3EKF20R0
CRCW020110K0FK
VISHAY DALE;PANASONIC
VISHAY DALE;PANASONIC
VISHAY DALE;PANASONIC
VISHAY DALE;PANASONIC
VISHAY DALE
24.9K
10K
1K
RESISTOR; 0603; 10K OHM; 5%;
200PPM; 0.10W; THICK FILM
R2
RESISTOR; 0603; 1K; 1%;
100PPM; 0.10W; THICK FILM
R3, R17
RESISTOR, 0603, 20 OHM, 1%,
20
100PPM, 0.10W, THICK FILM
R4, R7-R11, R25
R6, R13, R15, R19-R24
R12, R14, R18, R26
R27
RESISTOR; 0201; 10K OHM; 1%;
100PPM; 0.05W; THICK FILM
10K
RESISTOR, 0603, 5.6K OHM,
1%, 100PPM, 0.10W, THICK FILM
CRCW06035K60FK
VISHAY DALE
5.6K
100K
1.3K
RESISTOR; 0402; 100K; 1%;
100PPM; 0.0625W; THICK FILM
CRCW0402100KFK;RC0402FR-07100KL
ERJ-2RKF1301
VISHAY;YAGEO
RESISTOR; 0402; 1.3K OHM;
1%; 100PPM; 0.10W; THICK FILM
37
38
39
40
41
R201
-
-
-
-
-
1
2
1
1
1
PANASONIC
CRCW060310R0FK; MCR03EZPFX10R0;
ERJ-3EKF10R0
RESISTOR; 0603; 10 OHM; 1%;
10
100PPM; 0.10W; THICK FILM
R202, R203
R204
VISHAY DALE;ROHM
VISHAY DALE;PANASONIC
VISHAY DALE
RESISTOR; 0603; 10K; 1%;
CRCW060310K0FK;ERJ-3EKF1002
CRCW060315K0FK
10K
15K
12K
100PPM; 0.10W; THICK FILM
RESISTOR, 0603, 15K OHM,1%,
100PPM, 0.10W, THICK FILM
RESISTOR, 0603, 12K OHM, 1%,
100PPM, 0.10W, THICK FILM
R205
R206
CRCW060312K0FK
VISHAY DALE
RESISTOR; 0402; 10K; 1%;
100PPM; 0.0625W; THICK FILM
42
43
44
45
R207
-
-
-
-
1
1
1
4
CRCW040210K0FK;RC0402FR-0710KL
CRCW04022K20FK;RC0402FR-072K2L
VISHAY DALE;YAGEO PHICOMP
VISHAY DALE;YAGEO PHICOMP
VISHAY DALE;PANASONIC
OSRAM
10K
RESISTOR, 0402, 2.2K OHM, 1%,
100PPM, 0.0625W, THICK FILM
R208
2.2K
CRCW0603100RFK;ERJ-3EKF1000;
RC0603FR-07100RL
RESISTOR; 0603; 100 OHM; 1%;
100PPM; 0.10W; THICK FILM
RP1
100
DIODE; LED; SMARTLED; GREEN;
SMT; PIV=1.7V; IF=0.02A
SLED1-SLED4
LGL29K-G2J1-24-Z
LGL29K-G2J1-24-Z
MACHINE FABRICATED;
ROUND-THRU HOLE SPACER; NO
THREAD; M3.5; 5/8IN; NYLON
46
47
SPACER1-SPACER4
SU1-SU11
-
-
4
9032 KEYSTONE
9032
TEST POINT; JUMPER; STR;
TOTAL LENGTH=0.24IN; BLACK;
INSULATION=PBT;PHOSPHOR
BRONZE CONTACT=GOLD PLATED
11
S1100-B;SX1100-B;STC02SYAN
219-12MST
KYCON;KYCON;SULLINS ELECTRON SX1100-B
SWITCH; SPST; SMT; STRAIGHT;
20V; 0.1A; SURFACE MOUNT DIP
SWITCH-AUTO PLACEABLE;
RINSULATION=1000M OHM
48
49
50
51
SW1
-
-
-
-
1
4
CTS
219-12MST
TEST POINT; PIN DIA=0.125IN;
TOTAL LENGTH=0.445IN; BOARD
HOLE=0.063IN; BLACK; PHOSPHOR
BRONZE WIRE SILVER PLATE
FINISH;
TP1, TP2, TP4, TP11
5011 KEYSTONE
5009 KEYSTONE
MAXIM
N/A
GND
TESTPOINT;PINDIA=0.125IN;
A0, A1, CLK, CRCEN,
CS, D1-D4, EN, MISO,
MOSI, SYNCH, TP3, TP15
TOTALLENGTH=0.35IN;BOARDHOLE
=0.063IN;YELLOW;PHOSPHORBRON
ZEWIRESILVERPLATEFINISH;
15
1
N/A
(TP3:FAULT) (TP15:READY)
EVKIT PART - IC; MAX14906ATM+;
TQFN48-EP; PAKCAGE CODE:
T4866+6C; PACKAGE OUTLINE: 21-
0144; PACKAGE LAND PATTERN: 90-
0130
U1
MAX14906ATM+
MAX14906ATM+
IC; ISO; TWO CHANNEL; 5KVRMS
I2C ISOLATOR; WSOIC16
52
53
U2, U3
U4
-
-
2
1
MAX14937AWE+
MAX14483AAP+
MAXIM
MAXIM
MAX14937AWE+
MAX14483AAP+
IC; DISO; 6-CHANNEL;
LOW-POWER; 3.75KVRMS SPI
DIGITAL ISOLATOR; SSOP20
IC; MMRY; DUAL HIGH SPEED USB
TO MULTIPURPOSE UART/FIFO;
QFN64-EP
54
55
56
U201
U202
U203
-
-
-
1
1
1
FT2232HQ
FUTURE TECHNOLOGY DEVICES INTFT2232HQ
IC; EPROM; 4K MICROWIRE SERIAL
EEPROM; SOT23-6
93LC66BT-I/OT
MAX1556ETB+
MICROCHIP
MAXIM
93LC66BT-I/OT
MAX1556ETB+
IC; CONV; PWM STEP-DOWN
DC-DC CONVERTER; TDFN10-EP
3X3
TEST POINT; PIN DIA=0.125IN;
TOTAL LENGTH=0.445IN; BOARD
HOLE=0.063IN; RED; PHOSPHOR
BRONZE WIRE SIL;
57
58
V5, VDD_TP, VL, VLED
VDDOK
-
-
4
1
5010 KEYSTONE
N/A
DIODE; LED; STANDARD; GREEN;
SMT (0805); PIV=5.0V; IF=0.12A; -55
DEGC TO +85 DEGC
LTST-C171GKT
LITE-ON ELECTRONICS INC.
LTST-C171GKT
CRYSTAL; SMT ; 18PF; 12MHZ;
+/-20PPM; +/-30PPM
59
60
Y1
-
-
1
1
ABM7-12.000MHZ-D2Y-T
MAX14906
ABRACON
MAXIM
12MHZ
PCB
PCB
PCB:MAX14906
-
C2012X7S2A105K125AB;
GRJ21BC72A105KE11;
CGA4J3X7S2A105K125AB;
GRM21BC72A105KE01
CAPACITOR; SMT (0805);
CERAMIC CHIP; 1UF; 100V;
TOL=10%; TG=-55 DEGC TO +125
DEGC; TC=X7S
61
C1, C2, C11, C12, C18, C19
C4, C8-C10
DNP
DNP
0
TDK;MURATA;TDK
KEMET
1UF
CAPACITOR; SMT (0603);
CERAMIC CHIP; 470PF; 100V;
TOL=10%; MODEL=C0G; TG=-55
DEGC TO +125 DEGC; TC=+
62
0
C0603C471K1GAC
470PF
TOTAL
154
Maxim Integrated
│ 11
www.maximintegrated.com
Evaluates: MAX14906
MAX14906 Evaluation Kit
MAX14906 EV Kit Schematic
8
7
6
5
8
7
6
5
1
3
1
3
3
2
1
3
2
1
2
1
2
1
A
K
E P
4 9
A 1
A 0
S Y N C H
3 6
1
S D I
C S
2
3 5
3 4
3 3
3 2
3 1
3 0
V D D O K
F L E D
3
C L K
S D O
V 5
4
L 4
L 3
L 2
L 1
5
6
G N D
7
F A U L T
2 9
8
S L E D
V L E D
R E G E N
2 8
9
E N
1 0
1 1
1 2
2 7
V D D
C R C E N
R E A D Y
2 6
V L
2 5
1
3
1
3
C
A
8
7
6
5
8
7
6
5
3
2
1
3
2
1
2
1
2
1
Maxim Integrated
│ 12
www.maximintegrated.com
Evaluates: MAX14906
MAX14906 Evaluation Kit
MAX14906 EV Kit Schematic (continued)
1 6
1 6
9
9
1 4
1 4
1 3
1 3
4
4
7
1
3
3
7
1
A
C
E P
6 5
V C C I O
V C C I O
V C C I O
V C C I O
5 6
4 2
3 1
2 0
G N D
5 1
G N D
4 7
G N D
3 5
G N D
2 5
V C O R E
V C O R E
V C O R E
6 4
3 7
1 2
G N D
1 5
G N D
1 1
G N D
5
V P L L
V P H Y
G N D
9
4
1
A G N D
1 0
2
1
6
2
6
7
8
9
1 0
2
7
Maxim Integrated
│ 13
www.maximintegrated.com
Evaluates: MAX14906
MAX14906 Evaluation Kit
MAX14906 EV Kit PCB Layout Diagrams
1ꢀ
1ꢀ
MAX14906 EV Kit—Top Silkscreen
MAX14906 EV Kit—Top Layer
1ꢀ
1ꢀ
MAX14906 EV Kit—Layer 2 GND
MAX14906 EV Kit—Layer 3 Power
Maxim Integrated
│ 14
www.maximintegrated.com
Evaluates: MAX14906
MAX14906 Evaluation Kit
MAX14906 EV Kit PCB Layout Diagrams (continued)
1ꢀ
1ꢀ
MAX14906 EV Kit—Bottom Layer
MAX14906 EV Kit—Bottom Silkscreen
Maxim Integrated
│ 15
www.maximintegrated.com
Evaluates: MAX14906
MAX14906 Evaluation Kit
Revision History
REVISION REVISION
PAGES
CHANGED
DESCRIPTION
NUMBER
DATE
0
5/20
Initial release
—
Updated the External Power Supplies, LED Indicators, Surge and ESD Protection and
Registers Setting Tab sections, andTable 1
1
3/21
4‒7
For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time.
©
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
2021 Maxim Integrated Products, Inc.
│ 16
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