MAX17623ATA [MAXIM]
2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs;
| 型号： | MAX17623ATA |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs |
| 文件： | 总19页 (文件大小：2265K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
General Description
Benefits and Features
The Himalaya series of voltage regulator ICs, power
modules, and chargers enable cooler, smaller, and
simpler power supply solutions.ꢀ MAX17623 and
MAX17624 are high-frequency synchronous Himalaya
step-down DC-DC converters with integrated MOSFETs
and internal compensation. MAX17623 and MAX17624
have an input-voltage range of 2.9V to 5.5V, supports up
to 1A, and output voltage can be adjusted from 0.8V to
3.3V.
● Easy to Use
•
•
•
•
•
•
•
•
2.9V to 5.5V Input
Adjustable 0.8V to 3.3V Output
±1% Feedback Accuracy
Up to 1A Output Current
Fixed 2MHz or 4MHz Operation
100% Duty-Cycle Operation
Internally Compensated
All Ceramic Capacitors
The MAX17623 and MAX17624 employ peak-current-
mode control architecture under steady-state operation.ꢀ
To reduce input-inrush current, the devices offer a fixed
1ms soft-start time. Both devices feature selectable
PWM for fixed frequency operation, or PFMꢀmode for
better efficiency at light loads.ꢀWhen PWM mode is
selected, MAX17623 operates at a fixed 2MHz switching
frequency and MAX17624 operates at a fixed 4MHz
switching frequency. MAX17623 offers output voltages
from 0.8V to 1.5V, and MAX17624 offers output voltages
from 1.5V to 3.3V.
● High Efficiency
•
•
Selectable PWM- or PFM-Mode of Operation
Shutdown Current as Low as 0.1μA (typ)
● Flexible Design
•
•
Internal Soft-Start and Prebias Startup
Open-Drain Power Good Output (PGOOD Pin)
● Robust Operation
•
•
•
Overtemperature Protection
Overcurrent Protection
-40°C to +125°C Ambient Operating
Temperature/ -40°C to +150°C Junction
Temperature
The MAX17623 and MAX17624 devices are available in
a compact 8-pin, 2mm × 2mm TDFN package.
Applications
•
•
•
•
•
Point-of-Load Power Supply
Standard 5V Rail Supplies
Battery-Powered Applications
Distributed Power Systems
Ordering Information at end of data sheet.
Industrial Sensors and Process Control
Typical Application Circuit
L1
1µH
3.6V TO 5.5V
3.3V, 1A
MAX17624
LX
V
IN
IN
C
10µF
C
2.2µF
OUT
IN
R1
118kΩ
OUTSNS
EN
PGOOD
FB
R2
37.4kΩ
MODE
GND
19-100976; Rev 0; 10/20
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Absolute Maximum Ratings
IN, EN, PGOOD, FB, OUTSNS to GND .................-0.3V to 6V
MODE, LX to GND ....................................-0.3V to (IN + 0.3V)
Output Short-Circuit Duration .................................Continuous
Operating Temperature.................................. -40°C to +125°C
Junction Temperature (Note1) ..................................... +150°C
Storage Temperature Range ......................... -65°C to +150°C
Lead Temperature (soldering,10s)............................... +260ºC
Soldering Temperature (reflow)................................... +260°C
Continuous Power Dissipation (up to T = +70°C) (derate
A
11.7mW/°C above T = +70°C)................................ 937.9mW
A
Note 1:
Junction temperature greater than +125°C degrades operating lifetimes.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or
any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
PACKAGE TYPE: 8- PIN TDFN
Package Code
Outline Number
Land Pattern
T822+3C
21-0168
90-0065
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θ
)
85.3°C/W
8.9°C/W
JA
Junction to Case (θ
)
JC
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix
character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
four-layer
board. For detailed information
on package thermal
considerations,
refer to www.maximintegrated.com/thermal-
tutorial.
Electrical Characteristics
(V = V
= 3.6V, V
= V
= V = 0V, LX = OUTSNS = PGOOD= OPEN. T = T = -40°C to +125°C, unless otherwise noted.
IN EN
GND
MODE
FB
A
J
Typical values are at T = +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2)
A
PARAMETER
INPUT SUPPLY (V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
)
IN
Input-Voltage Range
V
2.9
5.5
V
IN
I
V
= 0, shutdown mode
0.1
40
4.5
6
IN-SHDN
EN
µA
I
PFM mode, No Load
Q-PFM
Input-Supply Current
PWM mode, MAX17623
PWM mode, MAX17624
I
mA
Q-PWM
Undervoltage-Lockout
Threshold (UVLO)
V
V
Rising
2.72
2.8
2.88
0.8
V
IN_UVLO
IN
V
IN_UVLO_HY
S
UVLO Hysteresis
200
mV
ENABLE(EN)
EN LOW Threshold
EN HIGH Threshold
V
EN falling
EN rising
V
V
EN_LOW
V
2
EN_HIGH
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Maxim Integrated | 2
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
(V = V
IN EN
= 3.6V, V
GND
= V
MODE
= V = 0V, LX = OUTSNS = PGOOD= OPEN. T = T = -40°C to +125°C, unless otherwise noted.
FB
A
J
Typical values are at T = +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2)
A
PARAMETER
EN Input Leakage
POWER MOSFETS
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
º
I
EN = 5.5V, T = T = +25 C
10
50
nA
EN
A
J
V
V
V
V
= 3.6V, I
= 190mA
120
100
80
200
160
145
130
1
High-Side pMOS On-
Resistance
IN
IN
IN
IN
OUT
R
mΩ
DS_ONH
= 5V, I
= 190mA
OUT
= 3.6V, I
= 190mA
Low-Side nMOS On-
Resistance
OUT
R
mΩ
DS_ONL
= 5V, I
= 190mA
70
OUT
o
LX Leakage Current
I
LX = GND or IN, T = +25 C
A
0.1
µA
LX_LKG
TIMING
MAX17623
MAX17624
1.92
3.84
2.00
4.00
40
2.08
4.16
Switching Frequency
f
MHz
SW
Minimum On Time
Maximum Duty Cycle
LX Dead Time
t
ns
%
ON_MIN
D
100
MAX
3
1
ns
ms
Soft-Start Time
t
SS
FEEDBACK (FB)
FB Regulation Voltage
FB Voltage Accuracy
FB Input-Bias Current
V
0.8
V
%
FB-REG
V
PWM Mode
-1
+1
FB
FB
I
FB = 0.6V, T = T = +25ºC
50
20
nA
A
J
MAX17623
= 5.5V
nA
µA
V
OUTSNS Input Bias
Current
OUTSNS
MAX17624
= 5.5V
I
OUTSNS-BIAS
10
V
OUTSNS
CURRENT LIMIT
Peak Current-Limit
Threshold
Valley Current-Limit
Threshold
Negative Current-Limit
Threshold
I
1.4
1.2
2
2.5
1.8
A
A
A
LIM-PEAK
I
1.5
LIM-VALLEY
I
Current entering LX pin
-1.09
LIM-NEG
POWER GOOD (PGOOD)
PGOOD Rising
Threshold
PGOOD Falling
Threshold
V
V
FB Rising
FB Falling
91.5
88
93.5
90
95.5
%
PGOOD_RISE
92
%
mV
nA
PGOOD_FALL
PGOOD Output Low
V
I
= 5mA
200
100
OL_PGOOD
PGOOD
PGOOD Output
Leakage Current
Delay in PGOOD
Assertion after Soft-
Start
º
I
PGOOD = 5.5V, T = T = +25 C
LEAK_PGOOD
A
J
184
5
μs
MODE
MODE Pullup Current
V
= GND
μA
MODE
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Maxim Integrated | 3
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
(V = V
IN EN
= 3.6V, V
GND
= V
MODE
= V = 0V, LX = OUTSNS = PGOOD= OPEN. T = T = -40°C to +125°C, unless otherwise noted.
FB
A
J
Typical values are at T = +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2)
A
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
THERMAL SHUTDOWN
Thermal-Shutdown
Rising Threshold
Thermal-Shutdown
Hysteresis
165
10
°C
°C
º
Note 2: Electrical specifications are production tested at T = +25 C. Specifications over the entire operating temperature range are
A
guaranteed by design and characterization.
Typical Operating Characteristics
(VIN = VEN = 5V, VGND = VMODE = VFB = VOUTSNS = 0V, LX = PGOOD = OPEN, TA = TJ = -40°C to +125°C, unless otherwise
noted. Typical values are at TA = +25°C. All voltages are referenced to GND, unless otherwise noted.)
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Maxim Integrated | 4
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
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Maxim Integrated | 5
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
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Maxim Integrated | 6
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
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Maxim Integrated | 7
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
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Maxim Integrated | 8
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
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Maxim Integrated | 9
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Pin Configurations
TOP VIEW
LX
8
OUTSNS
7
FB
6
PGOOD
5
MAX17623/
MAX17624
*EP
+
1
2
3
4
IN
GND
EN
MODE
TDFN
2mm x 2mm
Pin Descriptions
PIN
NAME
FUNCTION
Power Supply Input. Decouple the IN pin to GND with a capacitor. Place the capacitor close to the IN
and GND pins.
1
IN
Ground Pin of the converter. Connect externally to the power ground plane. Refer to the
MAX17623/MAX17624 evaluation kit data sheet for a layout example.
Active High Enable Input Pin. Connect to IN for always ON operation. Connect to GND to disable the
output.
PWM or PFM Mode Selection Input. Connect the MODE pin to GND to enable PWM mode operation.
Leave the MODE pin unconnected to enable PFM mode of operation.
Open- Drain Output Power Good Status Pin. Pullup PGOOD to an external logic supply using a pullup
resistor to generate a “high” level if the output voltage is above 93.5% of the target regulated voltage. If
not used, leave this pin unconnected. The PGOOD is driven low if the output voltage is below 90% of the
target regulated voltage
2
3
4
GND
EN
MODE
5
6
PGOOD
FB
Feedback Input. Connect FB to the center of the external resistor-divider from the output-voltage node
(V
) to GND to set the output voltage.
OUT
Sense Pin for Output Voltage. Connect to the positive terminal of the output capacitor C
Kelvin connection.
through a
OUT
7
8
OUTSNS
LX
Switching Node. Connect the LX pin to the switching node of the inductor.
Exposed Pad. Connect the exposed pad to the GND pin of the device. Also, connect EP to a large GND
plane with several thermal vias for the best thermal performance. Refer to the MAX17623/MAX17624
evaluation kit data sheet for an example of the correct method of EP connection and thermal vias.
—
EP
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Maxim Integrated | 10
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Functional Diagram
MAX17623/
MAX17624
IN
HIGH-SIDE
DRIVER
+
-
EN
2V/0.8V
OSCILLATOR
SOFT-START
LX
CONTROLLER
LOW-SIDE
DRIVER
CONTROLLER-
MODE LOGIC
OUTSNS
GND
MODE-
SELECTION
LOGIC
SLOPE
COMPENSATION
MODE
FB
PGOOD
PGOOD
LOGIC
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Maxim Integrated | 11
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Detailed Description
MAX17623 and MAX17624 are high-frequency synchronous step-down DC-DC converters, with integrated MOSFETs
and compensation components, that operate over a 2.9V to 5.5V input-voltage range. MAX17623 and MAX17624 support
up to 1A load current and allows use of small, low-cost input and output capacitors. The output voltage can be adjusted
from 0.8V to 3.3V.
When the EN pin is asserted, an internal power-up sequence ramps up the error-amplifier reference, resulting in output-
voltage soft-start. The FB pin monitors the output voltage through a resistor-divider. The devices select either PFM or
forced-PWM mode depending on the state of the MODE pin at power-up. By pulling the EN pin to low, the devices enter
shutdown mode and consume only 0.1μA (typ) of standby current.
The devices use an internally compensated, fixed-frequency, peak-current mode control scheme. On the falling edge of
an internal clock, the high-side pMOSFET turns on, and continues to be on during normal operation until at least the rising
edge of the clock (for 40ns). An internal error amplifier compares the feedback voltage to a fixed internal reference voltage
and generates an error voltage. The error voltage is compared to a sum of the current-sense voltage and a slope-
compensation voltage by a PWM comparator to set the on-time. During the on-time of the pMOSFET, the inductor current
ramps up. For the remainder of the switching period (off-time), the pMOSFET is kept off and the low-side nMOSFET turns
on. During the off-time, the inductor releases the stored energy as the inductor current ramps down, providing current to
the output. Under overload conditions, the cycle-by-cycle current-limit feature limits the inductor peak current by turning
off the high-side pMOSFET and turning on the low-side nMOSFET.
Mode Selection (MODE)
The logic state of the MODE pin is latched after the EN pin goes above its rising threshold and all internal voltages are
ready to allow LX switching. If the MODE pin is unconnected at power-up, the part operates in PFM mode at light loads.
If the MODE pin is grounded at power-up, the part operates in constant-frequency PWM mode at all loads. State changes
on the MODE pin are ignored during normal operation.
PWM Operation
In PWM mode, the device output current is allowed to go negative. PWM operation is useful in frequency sensitive
applications and provides fixed switching frequency operation at all loads. However, PWM-mode of operation gives lower
efficiency at light loads compared to PFM-mode of operation.
PFM Operation
PFM mode of operation disables negative output current from the device and skips pulses at light loads for better
efficiency. At low-load currents, if the peak value of the inductor current is less than 350mA for 64 consecutive cycles,
and the inductor current reaches zero, the part enters PFM mode. In PFM mode, When the FB pin voltage is below 0.8V,
the high-side switch is turned on until the inductor current reaches 500mA. After the high-side switch is turned OFF, the
low-side switch is turned ON until the inductor current comes down to zero and LX enters a high-impedance state. If the
FB pin voltage is greater than 0.8V for 3 consecutive CLK falling edges after LX enters a high-impedance state, the device
continues to operate in PFM mode. In PFM mode, the part hibernates when the FB pin voltage is above 0.8V for 5
consecutive switching cycles after LX enters a high-impedance state. If the FB pin voltage drops below 0.8V within 3
consecutive CLK falling edges after LX enters a high-impedance state, the part comes out of PFM mode.
EN Input (EN), Soft-Start
When the EN pin voltage is above 2V (min), the internal error-amplifier reference voltage starts to ramp up. The duration
of the soft-start ramp is 1ms (typ), allowing a smooth increase of the output voltage. Driving EN low disables both power
MOSFETs, as well as other internal circuitry, and reduces IN quiescent current to below 0.1μA.
Power Good (PGOOD)
The devices include an open-drain power good output that indicates the output voltage status. PGOOD goes high when
the output voltage is above 93.5% of the target value and goes low when the output voltage is below 90% of the target
value. During startup, the PGOOD pin goes high after 184μs of soft-start completion.
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Maxim Integrated | 12
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Startup into a Prebiased Output
The devices are capable of soft-start into a prebiased output, without discharging the output capacitor in both the PFM
and forced-PWM modes. Such a feature is useful in applications where digital integrated circuits with multiple rails are
powered.
100% Duty Cycle Operation
The device can provide 100% duty-cycle operation. In this mode, the high-side switch is constantly turned on, while the
low-side switch is turned off. This is particularly useful in battery-powered applications to achieve the longest operation
time by taking full advantage of the whole battery-voltage range. The minimum input voltage to maintain the output-voltage
regulation can be calculated as:
VIN_MIN = VOUT+(IOUT × RON
)
where,
V
V
R
= Minimum input voltage
IN
= Target output voltage
OUT
= Sum of the high-side FET on-resistance and the output inductor DCR
ON
Undervoltage Lockout
The device features an integrated input undervoltage lockout (UVLO) feature that turns the device on/off based on the
voltage at the IN pin. The device turns on if the IN pin voltage is higher than the UVLO threshold (V
) of 2.8V (typ)
IN_UVLO
) below the V
(assuming EN is at logic-high) and turns off when the IN pin voltage is 200mV (V
IN_UVLO_HYS
IN_UVLO.
Overcurrent Protection
The MAX17623/MAX17624 are provided with a robust overcurrent protection (OCP) scheme that protects the devices
under overload and output short-circuit conditions. When overcurrent is detected in the inductor, the switches are
controlled by a mechanism, which detects both the high-side MOSFET and low-side MOSFET currents and compares
them with the respective limits. Whenever the inductor current exceeds the internal peak current limit of 2A (typ), the high-
side MOSFET is turned off and the low-side MOSFET is turned ON. The low-side MOSFET is kept on until the subsequent
CLK rising edge after the inductor current drops below 1.5A (typ). The high-side MOSFET is turned on after the low-side
MOSFET is turned off and the cyclic operation continues. When the overload condition is removed, the part regulates
output to the set voltage.
Thermal Overload Protection
Thermal overload protection limits the total power dissipation in the device. When the junction temperature exceeds
+165°C, an on-chip thermal sensor shuts down the device, turns off the internal power MOSFETs, allowing the device to
cool down. The thermal sensor turns the device on after the junction temperature cools by 10°C.
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Maxim Integrated | 13
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Applications Information
Selection of Inductor
Three key inductor parameters must be specified to select the output inductor:
1) Inductor value
2) Inductor saturation current
3) DC-resistance of the inductor
The device internal slope compensation and current limit are optimized with output inductors of 1.5µH for MAX17623 and
1µH for MAX17624. For MAX17623, select a 1.5µH inductor and for MAX17624, select a 1µH inductor. The saturation
current rating (I
) of the inductor must be high enough to ensure that saturation can occur only above the peak current-
SAT
limit value of 2A (typ). Select a low-loss inductor with acceptable dimensions and having the lowest possible DC-
resistance to improve the efficiency.
Selection of Input Capacitor
The input filter capacitor reduces peak currents drawn from the power source and reduces noise and voltage ripple on
the input caused by the circuit switching. The input capacitor RMS current requirement (I
) is defined by the following
RMS
equation:
V
OUT × (VIN - VOUT)
√
IRMS = IOUT(MAX)
×
VIN
where,
I
is the maximum load current. I
has the maximum value when the input voltage equals twice the output
OUT(MAX)
voltage (V = 2 x V
RMS
= I /2.
OUT(MAX)
), so I
OUT
IN
RMS(MAX)
Choose an input capacitor that exhibits less than +10°C temperature rise at the RMS input current for optimal long-term
reliability. Use low-ESR ceramic capacitors with high-ripple-current capability at the input. X7R capacitors are
recommended in industrial applications for their temperature stability. Calculate the input capacitance using the following
equation:
D × (1 - D)
CIN = IOUT(MAX)
×
fSW × η × ∆VIN
where,
D = Duty ratio of the converter
f
= Switching frequency
SW
ΔV = Allowable input-voltage ripple
IN
η = Efficiency
Selection of Output Capacitor
Small ceramic X7R-grade capacitors are sufficient and recommended for the device. The output capacitor has two
functions. It filters the square wave generated by the device along with the inductor. It stores sufficient energy to support
the output voltage under load transient conditions and stabilizes the device’s internal control loop. The device’s internal
loop-compensation parameters are optimized for 22µF and 10µF output capacitors for MAX17623 and MAX17624,
respectively. MAX17623 requires a minimum of 22µF (typ) and MAX17623 requires a minimum of 10µF (typ) capacitance
for stability. Derating of ceramic capacitors with DC-voltage must be considered while selecting the output capacitor.
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Maxim Integrated | 14
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Adjusting the Output Voltage
The MAX17623/MAX17624 output voltage can be programmed from 0.8V to 3.3V. MAX17623 offers output voltages from
0.8V to 1.5V and MAX17624 offers output voltages from 1.5V to 3.3V. Set the output voltage by connecting a resistor-
divider from output to FB to GND (see Figure 1). Choose R2 to be less than 37.4kΩ and calculate R1 with the following
equation:
VOUT
R1 = R2 × [
- 1]
0.8
V
OUT
R1
MAX17623/
MAX17624
FB
R2
Figure 1. Setting the Output Voltage
Power Dissipation
At a particular operating condition, the power losses that lead to a temperature rise of the part are estimated as follows:
1
PLOSS = POUT × ( - 1ꢀ - ꢁIOUT2 × RDCRꢂ
η
POUT = VOUT × IOUT
where,
P
= Output Power
OUT
R
DCR
= DC-resistance of the inductor
η = Efficiency of the power supply at the desired operating conditions. See the Typical Operating Characteristics section
for efficiency or measure the efficiency to determine total power dissipation. An EE-Sim model is available for the
MAX17623/MAX17624 to simulate efficiency and power loss.
The junction temperature T can be estimated at any given maximum ambient temperature T from the following
J
A
equation:
ꢃ
)
TJ = TA + θJA × PLOSS
Where θ is the junction-to-ambient thermal resistance of the package (85.3°C/W for a four-layer board measured using
JA
JEDEC specification JESD51-7)
If the application has a thermal-management system that ensures the exposed pad of the device is maintained at a given
temperature (TEP), the junction temperature can be estimated using the following formula
ꢃ
)
TJ = TEP + θJC × PLOSS
where θJC is the junction-to-case thermal resistance of the device (8.9°C/W)
Note: Operating the device at junction temperatures greater than +125°C degrades operating lifetimes.
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Maxim Integrated | 15
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
PCB Layout Guidelines
Careful PCB layout is critical to achieve clean and stable operation. In particular, the traces that carry pulsating current
should be short and wide so that the parasitic inductance formed by these traces can be minimized. Follow the following
guidelines for good PCB layout:
•
•
•
•
•
•
Keep the input capacitors as close as possible to the IN and GND pins.
Keep the output capacitors as close as possible to the OUT and GND pins.
Keep the resistive feedback divider as close as possible to the FB pin.
Connect all the GND connections to a copper plane area as large as as possible on the top and bottom layers.
Use multiple vias to connect internal GND planes to the top layer GND plane.
Keep the power traces and load connections short. This practice is essential for high efficiency. Using thick
copper PCBs (2oz vs. 1oz) can enhance full load efficiency.
•
Refer to the MAX17623/MAX17624 evaluation kit layout for first pass success.
R2
R1
LX PLANE
V
OUT
V
IN
L
PLANE
PLANE
MAX17623/
MAX17624
10
7
1
2
3
4
LX
IN
C
IN
OUTSNS
FB
GND
6
EN
5
MODE
PGOOD
GND PLANE
Figure 2. Layout Guidelines
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Maxim Integrated | 16
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Typical Application Circuits
Typical Application Circuit (0.8V, 1A)
L1
1.5µH
2.9V TO 5.5V
0.8V, 1A
MAX17623
LX
V
IN
IN
C
22µF
C
2.2µF
OUT
IN
OUTSNS
EN
f
: 2MHz
SW
PGOOD
FB
C
: 2.2µF/10V/X7R/0603 (GRM188R71A225KE15)
IN
R2
37.4kΩ
L1: 1.5µH (DFE252012F-1R5M)
: 22µF/6.3V/X7R/0805 (GRM21BZ70J226ME44)
C
MODE
GND
OUT
Typical Application Circuit (1.5V, 1A)
L1
1.5µH
2.9V TO 5.5V
1.5V, 1A
MAX17623
LX
V
IN
IN
C
22µF
C
2.2µF
OUT
IN
R1
33.2kΩ
OUTSNS
EN
f
: 2MHz
SW
PGOOD
FB
C
: 2.2µF/10V/X7R/0603 (GRM188R71A225KE15)
IN
L1: 1.5µH (DFE252012F-1R5M)
: 22µF/6.3V/X7R/0805 (GRM21BZ70J226ME44)
R2
37.4kΩ
C
OUT
MODE
GND
Typical Application Circuit (1.5V, 1A)
L1
1µH
1.5V, 1A
MAX17624
2.9V TO 5.5V
LX
V
IN
IN
C
10µF
C
2.2µF
OUT
IN
R1
33.2kΩ
OUTSNS
FB
EN
f
: 4MHz
SW
PGOOD
C
IN
: 2.2µF/10V/X7R/0603 (GRM188R71A225KE15)
L1: 1µH (DFE252012F-1R0M)
: 10µF/6.3V/X7R/0805 (GRM21BR70J106K)
R2
37.4kΩ
C
OUT
MODE
GND
Typical Application Circuit (3.3V, 1A)
L1
1µH
3.6V TO 5.5V
3.3V, 1A
MAX17624
LX
V
IN
IN
C
10µF
C
2.2µF
OUT
IN
R1
118kΩ
OUTSNS
EN
f
: 4MHz
SW
PGOOD
C
IN
: 2.2µF/10V/X7R/0603 (GRM188R71A225KE15)
FB
L1: 1µH (DFE252012F-1R0M)
: 10µF/6.3V/X7R/0805 (GRM21BR70J106K)
R2
37.4kΩ
C
OUT
MODE
GND
www.maximintegrated.com
Maxim Integrated | 17
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Ordering Information
PART NUMBER
TEMP RANGE
PIN-PACKAGE
8 TDFN
f
(MHz)
V
(V)
SW
OUT
MAX17623ATA+
MAX17623ATA+T
MAX17624ATA+
MAX17624ATA+T
-40ºC to +125ºC
-40ºC to +125ºC
-40ºC to +125ºC
-40ºC to +125ºC
2
2
4
4
0.8 to 1.5
0.8 to 1.5
1.5 to 3.3
1.5 to 3.3
8 TDFN
8 TDFN
8 TDFN
+ Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape-and-reel.
www.maximintegrated.com
Maxim Integrated | 18
MAX17623
MAX17624
2.9V to 5.5V,1A, Synchronous Step-Down
Converter with Integrated MOSFETs
Revision History
REVISION
NUMBER
0
REVISION
DATE
10/20
PAGES
CHANGED
DESCRIPTION
Initial release
—
For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
© 2020 Maxim Integrated Products, Inc.
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