MAX3735ETG [MAXIM]
2.7Gbps, Low-Power SFP Laser Drivers; 2.7Gbps,低功耗SFP激光驱动器型号: | MAX3735ETG |
厂家: | MAXIM INTEGRATED PRODUCTS |
描述: | 2.7Gbps, Low-Power SFP Laser Drivers |
文件: | 总18页 (文件大小:1732K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
19-2529; Rev 1; 4/03
2.7Gbps, Low-Power SFP Laser Drivers
General Description
Features
ꢀ SFP Reference Design Available
The MAX3735/MAX3735A are +3.3V laser drivers for
SFP/SFF applications from 155Mbps up to 2.7Gbps.
The devices accept differential input data and provide
bias and modulation currents for driving a laser. DC-
coupling to the laser allows for multirate applications
and reduces the number of external components. The
MAX3735/MAX3735A are fully compliant with the SFP
MSA timing and the SFF-8472 transmit diagnostic
requirements.
ꢀ Fully Compliant with SFP and SFF-8472 MSAs
ꢀ Programmable Modulation Current from 10mA to
60mA (DC-Coupled)
ꢀ Programmable Modulation Current from 10mA to
85mA (AC-Coupled)
ꢀ Programmable Bias Current from 1mA to 100mA
ꢀ Edge Transition Times <51ps
An automatic power-control (APC) feedback loop is incor-
porated to maintain a constant average optical power
over temperature and lifetime. The wide modulation cur-
rent range of 10mA to 60mA (up to 85mA AC-coupled)
and bias current of 1mA to 100mA make this product
ideal for driving FP/DFB laser diodes in fiber-optic mod-
ules. The resistor range for the laser current settings is
optimized to interface with the DS1858 SFP controller IC.
ꢀ 27mA (typ) Power-Supply Current
ꢀ Multirate 155Mbps to 2.7Gbps Operation
ꢀ Automatic Average Power Control
ꢀ On-Chip Pullup Resistor for TX_DISABLE
ꢀ 24-Pin 4mm × 4mm QFN package
The MAX3735/MAX3735A provide transmit-disable con-
trol, a single-point latched transmit-failure monitor out-
put, photocurrent monitoring, and bias-current
monitoring to indicate when the APC loop is unable to
maintain the average optical power. The MAX3735A
also features improved multirate operation.
Ordering Information
PART
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
Dice*
MAX3735E/D
MAX3735ETG
MAX3735EGG
MAX3735AETG
The MAX3735/MAX3735A come in package and die
form, and operate over the extended temperature
range of -40°C to +85°C.
24 Thin QFN-EP**
24 QFN-EP**
24 Thin QFN-EP**
Applications
Gigabit Ethernet SFP/SFF Transceiver Modules
*Dice are designed to operate from -40°C to +85°C, but are
tested and guaranteed only at T = +25°C.
A
1G/2G Fibre Channel SFP/SFF Transceiver
Modules
**EP = Exposed pad.
Pin Configuration appears at end of data sheet.
Multirate OC3 to OC48-FEC SFP/SFF Transceiver
Modules
Typical Application Circuit
+3.3V
OPTIONAL SHUTDOWN
CIRCUITRY
+3.3V
+3.3V
0.01µF
15Ω
0.1µF
OUT-
10Ω
OUT+
IN+
SERDES
0.1µF
OUT+
MAX3735
MAX3735A
IN-
BIAS
FERRITE BEAD
MD
C
MD
DS1858/DS1859
CONTROLLER
IC
H0
H1
C
APC
R
R
BC_MON
PC_MON
MON1
M0N2
M0N3
+3.3V
REPRESENTS A CONTROLLED-IMPEDANCE TRANSMISSION LINE
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
2.7Gbps, Low-Power SFP Laser Drivers
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V ..............................................-0.5V to +6.0V
Continuous Power Dissipation (T = +85°C )
CC
A
Current into BIAS, OUT+, OUT-......................-20mA to +150mA
Current into MD.....................................................-5mA to +5mA
Voltage at IN+, IN-, TX_DISABLE, TX_FAULT,
24-Lead Thin QFN (derate 20.8mW/°C
above +85°C).............................................................1354mW
24-Lead QFN (derate 20.8mW/°C
above +85°C).............................................................1354mW
Operating Ambient Temperature Range (T )......-40°C to +85°C
SHUTDOWN...........................................-0.5V to (V
Voltage at BIAS, PC_MON, BC_MON,
+ 0.5V)
CC
A
MODSET, APCSET .................................-0.5V to (V
Voltage at OUT+, OUT-.............................+0.5V to (V
Voltage at APCFILT1, APCFILT2..............................-0.5V to +3V
+ 0.5V)
+ 1.5V)
Storage Ambient Temperature Range...............-55°C to +150°C
Die Attach Temperature...................................................+400°C
Lead Temperature (soldering, 10s) .................................+300°C
CC
CC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
= +2.97V to +3.63V, T = -40°C to +85°C. Typical values at V
= +3.3V, I
= 20mA, I
= 30mA, T = +25°C, unless
MOD A
CC
A
CC
BIAS
otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
50
UNITS
POWER SUPPLY
Excludes the laser bias and modulation
currents (Note 2)
Power-Supply Current
I
27
mA
CC
I/O SPECIFICATIONS
Differential Input Voltage
Common-Mode Input Voltage
Differential Input Resistance
V
V
= (V +) - (V -), Figure 1
200
2400
mV
P-P
ID
ID
IN
IN
0.6 ×V
V
CC
85
100
115
10.0
15
Ω
TX_DISABLE Input Pullup
Resistance
R
4.7
7.4
kΩ
PULL
V
V
= V
HIGH
LOW
CC
TX_DISABLE Input Current
µA
= GND, V
= 3.3V, R
= 7.4kΩ
PULL
-450
CC
TX_DISABLE Input High Voltage
TX_DISABLE Input Low Voltage
TX_FAULT Output High Voltage
TX_FAULT Output Low Voltage
SHUTDOWN Output High Voltage
SHUTDOWN Output Low Voltage
BIAS GENERATOR
V
2
V
V
V
V
V
V
IH
V
0.8
0.4
0.4
IL
V
I
I
I
I
= 100µA sourcing (Note 3)
= 1mA sinking (Note 3)
= 100µA sourcing
2.4
OH
OH
OL
OH
OL
V
OL
V
V
- 0.4
OH
CC
1
V
= 100µA sinking
OL
Bias On-Current Range
I
Current into BIAS pin
100
100
mA
µA
BIAS
Current into BIAS pin during TX_FAULT or
TX_DISABLE
Bias Off-Current
Bias Overshoot
I
BIASOFF
During SFP module hot plugging
(Notes 4, 5, 11)
10
%
mA/A
%
External resistor to GND defines the voltage
gain, I
10.0
12
13
13.5
= 1mA, R
= 69.28kΩ
Bias-Current Monitor Gain
I
BIAS
BC_MON
BC_MON
I
= 100mA, R
= 693.25Ω
11.5
-8
13.5
+8
BIAS
BC_MON
MAX3735
Bias-Current Monitor Gain
Stability
1mA ≤ I
(Notes 4, 6)
≤ 100mA
BIAS
MAX3735A
-6
+6
2
_______________________________________________________________________________________
2.7Gbps, Low-Power SFP Laser Drivers
ELECTRICAL CHARACTERISTICS (continued)
(V
= +2.97V to +3.63V, T = -40°C to +85°C. Typical values at V
= +3.3V, I
= 20mA, I
= 30mA, T = +25°C, unless
MOD A
CC
A
CC
BIAS
otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
AUTOMATIC POWER-CONTROL LOOP
MD Reverse Bias Voltage
18µA ≤ I
≤ 1500µA
1.6
18
V
MD
MD Average Current Range
I
Average current into MD pin
1500
+880
µA
MD
I
= 1mA
BIAS
-880
(MAX3735)
APC closed loop
(Notes 4, 7)
Average Power-Setting Stability
ppm/°C
%
I
= 1mA
BIAS
-110
-650
-16
+110
+650
+16
(MAX3735A)
I
= 100mA
BIAS
APC Closed Loop
Average Power Setting Accuracy
MD-Current Monitor Gain
1mA ≤ I
≤ 100mA (Note 8)
BIAS
External resistor to GND
defines the voltage gain;
MAX3735
0.8
0.9
1
1
1.23
1.1
I
= 18µA, R
=
MD
PC_MON
I
A/A
%
PC_MON
MAX3735A
50kΩ
I
= 1.5mA, R = 600Ω
PC_MON
0.95
-10
-4
1.05
+10
+4
MD
MAX3735
18µA ≤ I
≤ 1500µA
MD
MD-Current Monitor Gain Stability
(Notes 4, 6)
MAX3735A
LASER MODULATOR
Current into OUT+ pin; R ≤ 15Ω, V
,
L
OUT+
10
10
60
85
V
≥ 0.6V (DC-coupled)
OUT-
Modulation On-Current Range
I
mA
MOD
Current into OUT+ pin; R ≤ 15Ω_, V
,
L
OUT+
V
≥ 2.0V (AC-coupled)
OUT-
Current into OUT+ pin during TX_FAULT or
TX_DISABLE
Modulation Off-Current
I
100
µA
ppm/°C
%
MODOFF
I
I
= 10mA
= 60mA
-480
-255
+480
+255
MOD
Modulation-Current Stability
(Note 4)
MOD
Modulation-Current Absolute
Accuracy
10mA ≤ I
≤ 60mA (Note 8)
-15
+15
MOD
Modulation-Current Rise Time
Modulation-Current Fall Time
t
20% to 80%, 10mA ≤ I
20% to 80%, 10mA ≤ I
≤ 60mA (Note 4)
≤ 60mA (Note 4)
42
50
65
80
ps
ps
R
MOD
t
F
MOD
10mA ≤ I
(Notes 4, 9, 10)
≤ 60mA at 2.67Gbps
MOD
18
38
Deterministic Jitter
Random Jitter
At 1.25Gbps (K28.5 pattern)
At 622Mbps (Note 9)
At 155Mbps (Note 9)
11.5
18
ps
40
RJ
10mA ≤ I
≤ 60mA (Note 4)
0.7
1.0
ps
RMS
MOD
_______________________________________________________________________________________
3
2.7Gbps, Low-Power SFP Laser Drivers
ELECTRICAL CHARACTERISTICS (continued)
(V
= +2.97V to +3.63V, T = -40°C to +85°C. Typical values at V
= +3.3V, I
= 20mA, I
= 30mA, T = +25°C, unless
MOD A
CC
A
CC
BIAS
otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
1.30
1.30
MAX
1.39
1.39
UNITS
SAFETY FEATURES
TX_FAULT always occurs for V
1.38V, TX_FAULT never occurs for
≤ 1.22V
≥
≥
BC_MON
Excessive Bias-Current
Comparator Threshold Range
1.22
V
V
V
BC_MON
TX_FAULT always occurs for V
1.38V, TX_FAULT never occurs for
≤ 1.22V
PC_MON
Excessive MD-Current
Comparator Threshold Range
1.22
V
PC_MON
SFP TIMING REQUIREMENTS
Time from rising edge of TX_DISABLE to
TX_DISABLE Assert Time
t_off
t_on
I
= I
and I
= I
MODOFF
0.14
5
µs
BIAS
BIASOFF
MOD
(Note 4)
Time from falling edge
of TX_DISABLE to
C
= 2.7nF,
APC
1
ms
µs
MAX3735 (Note 4)
I
and I
at 95%
BIAS
MOD
TX_DISABLE Negate Time
of steady state when
TX_FAULT = 0 before
reset
MAX3735A
(Note 11)
600
Time from falling edge of TX_DISABLE to
and I at 95% of steady state when
TX_FAULT = 1 before reset (Note 4)
TX_DISABLE Negate Time
During FAULT Recovery
I
t_onFAULT
60
200
ms
BIAS
MOD
TX_FAULT Reset Time or Power-
On Time
From power-on or negation of TX_FAULT
using TX_DISABLE (Note 4)
t_init
60
200
50
5
ms
µs
µs
Time from fault to TX_FAULT on, C
≤
FAULT
TX_FAULT Assert Time
TX_DISABLE to Reset
t_fault
3.3
20pF, R
= 4.7kΩ (Note 4)
FAULT
Time TX_DISABLE must be held high to
reset TX_FAULT (Note 4)
Note 1: Specifications at -40°C are guaranteed by design and characterization. Dice are tested at T = +25°C only.
A
Note 2: Maximum value is specified at I
= 60mA, I
= 100mA.
MOD
BIAS
Note 3: TX_FAULT is an open-collector output and must be pulled up with a 4.7kΩ to 10kΩ resistor.
Note 4: Guaranteed by design and characterization.
Note 5:
V
CC
turn-on time must be ≤ 0.8s, DC-coupled interface.
Note 6: Gain stability is defined by the digital diagnostic document (SFF-8472, rev. 9.0) over temperature and supply variation.
Note 7: Assuming that the laser diode to photodiode transfer function does not change with temperature.
Note 8: Accuracy refers to part-to-part variation.
23
Note 9: Deterministic jitter is measured using a 2 - 1 PRBS or equivalent pattern.
Note 10: Broadband noise is filtered through the network as shown in Figure 3. One capacitor,
C < 0.47µF, and one 0603 ferrite bead or inductor can be added (optional). This supply voltage filtering reduces the hot-
plugging inrush current. The supply noise must be < 100mV
up to 2MHz.
P-P
Note 11: C
values chosen as shown in Table 4 (MAX3735A).
APC
4
_______________________________________________________________________________________
2.7Gbps, Low-Power SFP Laser Drivers
V
V
CC
CC
VOLTAGE
V
+
OUT
30Ω
30Ω
(100mV min,
1200mV max)
V
-
OUT
MAX3735
MAX3735A
OUT-
(V +) - (V -)
IN
IN
(200mV min,
P-P
30Ω
75Ω
2400mV max)
P-P
0.5pF
OUT+
OUT+
I
+
CURRENT
OUT
OSCILLOSCOPE
I +
OUT
I
MOD
50Ω
TIME
Figure 1. Required Input Signal and Output Polarity
Figure 2. Output Termination for Characterization
HOST BOARD
MODULE
FILTER DEFINED BY SFP MSA
TO LASER
L1
1µH
SOURCE
NOISE
DRIVER V
CC
OPTIONAL
OPTIONAL
VOLTAGE
SUPPLY
C1
0.1µF
C2
10µF
C3
0.1µF
Figure 3. Supply Filter
_______________________________________________________________________________________
5
2.7Gbps, Low-Power SFP Laser Drivers
Typical Operating Characteristics
(V
= +3.3V, C
= 0.01µF, I
= 20mA, and I
= 30mA, T = +25°C, unless otherwise noted.)
CC
APC
BIAS
MOD A
OPTICAL EYE
OPTICAL EYE
MAX3735 toc01
MAX3735 toc02
E
= 8.2dB, 2.7Gbps, 2.3GHz FILTER
E
= 8.2dB, 1.25Gbps, 900MHz FILTER
R
R
7
2 - 1 PRBS, 1310nm FP LASER
K28.5 PATTERN, 1310nm FP LASER
54ps/div
115ps/div
OPTICAL EYE
ELECTRICAL EYE
MAX3735 toc03
MAX3735 toc04
7
2.7Gbps, 2 - 1 PRBS,
E
= 12dB, 155Mbps, 117MHz FILTER
R
7
30mA MODULATION
2 - 1 PRBS, 1310nm FP LASER
85mV/div
919ps/div
58ps/div
BIAS-CURRENT MONITOR GAIN
vs. TEMPERATURE
SUPPLY CURRENT vs. TEMPERATURE
20
18
16
14
12
10
EXCLUDES I
BIAS
AND I
MOD
70
55
40
25
10
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
6
_______________________________________________________________________________________
2.7Gbps, Low-Power SFP Laser Drivers
Typical Operating Characteristics (continued)
(V
= +3.3V, C
= 0.01µF, I
= 20mA, and I
= 30mA, T = +25°C, unless otherwise noted.)
CC
APC
BIAS
MOD A
PHOTOCURRENT MONITOR GAIN
vs. TEMPERATURE
MODULATION CURRENT vs. R
MONITOR DIODE CURRENT vs. R
MODSET
APCSET
3.0
100
90
80
70
60
50
40
30
20
10
0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2.5
2.0
1.5
1.0
0.5
0
-40
-15
10
35
60
85
1
10
100
0
1
10
100
TEMPERATURE (°C)
R
(kΩ)
R
(kΩ)
MODSET
APCSET
DETERMINISTIC JITTER
vs. MODULATION CURRENT
RANDOM JITTER
vs. MODULATION CURRENT
EDGE TRANSITION TIME
vs. MODULATION CURRENT
60
50
40
30
20
3.0
2.5
2.0
1.5
1.0
0.5
0
80
70
60
50
40
30
20
FALL TIME
RISE TIME
DJ (INCLUDING PWD)
PWD
10
0
10
20
30
40
(mA)
50
60
10
20
30
40
(mA)
50
60
10
20
30
40
(mA)
50
60
I
I
MOD
I
MOD
MOD
HOT PLUG WITH TX_DISABLE LOW
STARTUP WITH SLOW RAMPING SUPPLY
TRANSMITTER ENABLE
MAX3735 toc15
MAX3735 toc13
MAX3735 toc14
3.3V
LOW
3.3V
3.3V
V
CC
0V
V
0V
CC
V
CC
FAULT
LOW
LOW
FAULT
FAULT
TX_DISABLE HIGH
t_on = 44µs
12µs/div
LOW
LOW
LOW
TX_DISABLE
TX_DISABLE
t_init = 60ms
20ms/div
LASER
OUTPUT
LASER
OUTPUT
LASER
OUTPUT
20ms/div
_______________________________________________________________________________________
7
2.7Gbps, Low-Power SFP Laser Drivers
Typical Operating Characteristics (continued)
(V
= +3.3V, C
= 0.01µF, I
= 20mA, and I
= 30mA, T = +25°C, unless otherwise noted.)
CC
APC
BIAS
MOD A
RESPONSE TO FAULT
TRANSMITTER DISABLE
MAX3735 toc17
MAX3735 toc16
EXTERNALLY
FORCED FAULT
3.3V
V
CC
V
PC_MON
t_fault = 0.9µs
HIGH
LOW
FAULT
LOW
LOW
FAULT
TX_DISABLE
LOW
TX_DISABLE
HIGH
t_off = 134ns
LASER
OUTPUT
LASER
OUTPUT
1µs/div
40ns/div
FAULT RECOVERY TIME
FREQUENT ASSERTION OF TX_DISABLE
MAX3735 toc18
MAX3735 toc19
V
V
PC_MON
PC_MON
EXTERNAL
FAULT REMOVED
EXTERNALLY
FORCED FAULT
HIGH
FAULT
FAULT
LOW
LOW
TX_DISABLE
HIGH
TX_DISABLE
LOW
t_init = 60ms
LASER
OUTPUT
LASER
OUTPUT
100ms/div
4µs/div
8
_______________________________________________________________________________________
2.7Gbps, Low-Power SFP Laser Drivers
Pin Description
PIN
NAME
FUNCTION
1, 4, 8, 14, 18
V
+3.3V Supply Voltage
Noninverted Data Input
Inverted Data Input
CC
2
3
IN+
IN-
Photodiode Current Monitor Output. Current out of this pin develops a ground-referenced voltage
across an external resistor that is proportional to the monitor diode current.
5
PC_MON
Bias Current Monitor Output. Current out of this pin develops a ground-referenced voltage across an
external resistor that is proportional to the bias current.
6
7, 12, 22
9
BC_MON
GND
Ground
Shutdown Driver Output. Voltage output to control an external transistor for optional shutdown
circuitry.
SHUTDOWN
10
11
13
TX_FAULT Open-Collector Transmit Fault Indicator (Table 1).
MODSET
BIAS
A resistor connected from this pad to ground sets the desired modulation current.
Laser Bias Current Output
Noninverted Modulation Current Output. Connect pins 15 and 16 externally to minimize parasitic
15, 16
17
OUT+
OUT-
MD
inductance of the package. I
flows into this pin when input data is high.
MOD
Inverted Modulation Current Output. I
flows into this pin when input data is low.
MOD
Monitor Diode Input. Connect this pin to the anode of a monitor photodiode. A capacitor to ground is
required to filter the high-speed AC monitor photocurrent.
19
Connect a capacitor (C
pole of the APC feedback loop.
) between pin 20 (APCFILT1) and pin 21 (APCFILT2) to set the dominant
APC
20
APCFILT1
21
23
APCFILT2
APCSET
See APCFILT1
A resistor connected from this pin to ground sets the desired average optical power.
Transmitter Disable, TTL. Laser output is disabled when TX_DISABLE is asserted high or left
unconnected. The laser output is enabled when this pin is asserted low.
24
EP
TX_DISABLE
Exposed
Pad
Ground. Must be soldered to the circuit board ground for proper thermal and electrical performance
(see the Exposed Pad Package section).
To interface with the laser diode, a damping resistor
Detailed Description
(R ) is required for impedance matching. The com-
D
The MAX3735/MAX3735A laser drivers consist of three
parts: a high-speed modulation driver, a laser-biasing
block with automatic power control (APC), and safety
circuitry (Figure 4). The circuit design is optimized for
high-speed and low-voltage (+3.3V) operation.
bined resistance of the series damping resistor and the
equivalent series resistance of the laser diode should
equal 15Ω. To reduce optical output aberrations and
duty-cycle distortion caused by laser diode parasitic
inductance, an RC shunt network might be necessary.
Refer to Maxim Application Note HFAN 02.0: Interfacing
Maxim’s Laser Drivers to Laser Diodes for more informa-
tion.
High-Speed Modulation Driver
The output stage are composed of a high-speed differ-
ential pair and a programmable modulation current
source. The MAX3735/MAX3735A are optimized for dri-
ving a 15Ω load; the minimum instantaneous voltage
required at OUT+ is 0.6V. Modulation current swings up
to 60mA are possible when the laser diode is DC-cou-
pled to the driver and up to 85mA when the laser diode
is AC-coupled to the driver.
At data rates of 2.7Gbps, any capacitive load at the
cathode of a laser diode degrades optical output perfor-
mance. Because the BIAS output is directly connected
to the laser cathode, minimize the parasitic capacitance
associated with the pin by using an inductor to isolate
the BIAS pin parasitics from the laser cathode.
_______________________________________________________________________________________
9
2.7Gbps, Low-Power SFP Laser Drivers
V
CC
SHUTDOWN
V
CC
MAX3735
MAX3735A
INPUT BUFFER
15Ω
OUT-
IN+
IN-
DATA
PATH
100Ω
R
D
OUT+
BIAS
I
MOD
V
CC
V
CC
I
MD
1
I
BIAS
V
CC
PC_MON
I
I
BIAS
MOD
ENABLE
V
BG
APCSET
MD
ENABLE
x38
I
R
APCSET
APCSET
R
PC_MON
V
CC
X270
SAFETY LOGIC
AND
I
BIAS
76
I
MD
C
MD
POWER
DETECTOR
V
BG
V
CC
BC_MON
x1
(4.7kΩ
TO 10kΩ)
R
BC_MON
MODSET
APCFILT1
APCFILT2
R
MODSET
TX_FAULT
TX_DISABLE
SHUTDOWN
C
APC
Figure 4. Functional Diagram
response to various single-point failures. The transmit
fault condition is latched until reset by a toggle of
Laser-Biasing and APC
To maintain constant average optical power, the
MAX3735/MAX3735A incorporate an APC loop to com-
pensate for the changes in laser threshold current over
temperature and lifetime. A back-facet photodiode
mounted in the laser package is used to convert the
optical power into a photocurrent. The APC loop
adjusts the laser bias current so that the monitor cur-
TX_DISABLE or V . The laser driver offers redundant
CC
laser diode shutdown through the optional shutdown
circuitry (see the Typical Applications Circuit). The
TX_FAULT pin should be pulled high with a 4.7kΩ to
10kΩ resistor to V
as required by the SFP MSA.
CC
Safety Circuitry Current Monitors
The MAX3735/MAX3735A feature monitors (BC_MON,
rent is matched to a reference current set by R
.
APCSET
The time constant of the APC loop is determined by an
external capacitor (C ). For possible C values,
PC_MON) for bias current (I
MD
) and photo current
BIAS
APC
APC
(I ). The monitors are realized by mirroring a fraction
see the Applications Information section.
of the currents and developing voltages across external
resistors connected to ground. Voltages greater than
1.38V at PC_MON or BC_MON result in a fault state.
For example, connecting a 100Ω resistor to ground on
each monitor output gives the following relationships:
Safety Circuitry
The safety circuitry contains an input disable
(TX_DISABLE), a latched fault output (TX_FAULT), and
fault detectors (Figure 5). This circuitry monitors the
operation of the laser driver and forces a shutdown if a
fault is detected (Table 1). A single-point fault can be a
V
V
= (I
/ 76) x 100Ω
x 100Ω
BC_MON
PC_MON
BIAS
= I
MD
short to V
or GND. See Table 2 to view the circuit
CC
10 ______________________________________________________________________________________
2.7Gbps, Low-Power SFP Laser Drivers
V
CC
POR AND COUNTER
FOR t_init
MAX3735
MAX3735A
I
MOD
ENABLE
TX_DISABLE
I
BIAS
ENABLE
100ns DELAY
COUNTER FOR
t_onfault
V
V
CC
CC
R
S
Q
I
MD
1
V
V
BG
PC_MON
RS
LATCH
COMP
COMP
R
R
PC_MON
SHUTDOWN
TX_FAULT
BG
CMOS
I
BIAS
76
BC_MON
MODSET
SHORT-
CIRCUIT
TTL
BC_MON
OPEN COLLECTOR
DETECTOR
Figure 5. Safety Circuitry
section, and select the value of R
that corre-
MODSET
Table 1. Typical Fault Conditions
sponds to the required current at +25°C.
If any of the I/O pins is shorted to GND or V (single-
CC
point failure, see Table 2), and the bias current or the
photocurrent exceed the programmed threshold.
Programming the APC Loop
1.
Program the average optical power by adjusting -R
SET
APC-
. To select the resistance, determine the desired moni-
tor current to be maintained over temperature and
lifetime. See the Monitor Diode Current vs. R
End-of-life (EOL) condition of the laser diode. The bias
current and/or the photocurrent exceed the
programmed threshold.
APCSET
2.
3.
4.
graph in the Typical Operating Characteristics section,
and select the value of R
required current.
that corresponds to the
APCSET
Laser cathode is grounded and the photocurrent
exceeds the programmed thresholds.
Interfacing with Laser Diodes
To minimize optical output aberrations caused by sig-
nal reflections at the electrical interface to the laser
No feedback for the APC loop (broken interconnection,
defective monitor photodiode), and the bias current
exceeds the programmed threshold.
diode, a series-damping resistor (R ) is required
D
(Figure 4). Additionally, the MAX3735/MAX3735A out-
Design Procedure
puts are optimized for a 15Ω load. Therefore, the series
combination of R and R , where R represents the
D
L
L
When designing a laser transmitter, the optical output
usually is expressed in terms of average power and
extinction ratio. Table 3 shows relationships helpful in
converting between the optical average power and the
modulation current. These relationships are valid if the
mark density and duty cycle of the optical waveform
are 50%.
laser-diode resistance, should equal 15Ω. Typical val-
ues for R are 8Ω to 13Ω. For best performance, place
D
a bypass capacitor (0.01µF typ) as close as possible to
the anode of the laser diode. An RC shunt network
between the laser cathode and ground minimizes opti-
cal output aberrations. Starting values for most coaxial
lasers are R
= 50Ω in series with C
= 8pF.
COMP
COMP
Programming the Modulation Current
Adjust these values experimentally until the optical out-
put waveform is optimized. Refer to Maxim Application
Note: HFAN 02.0: Interfacing Maxim’s Laser Drivers to
Laser Diodes for more information.
For a given laser power (P
), slope efficiency (η), and
AVG
extinction ratio (r ), the modulation current can be calcu-
e
lated using Table 3. See the Modulation Current vs.
R
graph in the Typical Operating Characteristics
MODSET
______________________________________________________________________________________ 11
2.7Gbps, Low-Power SFP Laser Drivers
Table 2. Circuit Responses to Various Single-Point Faults
CIRCUIT RESPONSE TO OVERVOLTAGE
OR SHORT TO V
CIRCUIT RESPONSE TO UNDERVOLTAGE
OR SHORT TO GROUND
PIN NAME
CC
TX_FAULT
Does not affect laser power.
Does not affect laser power.
Normal condition for circuit operation.
The optical average power increases and a fault occurs The optical average power decreases and the APC
if V exceeds the threshold. The APC loop loop responds by increasing the bias current. A fault
state occurs if V exceeds the threshold voltage.
TX_DISABLE
Modulation and bias currents are disabled.
IN+
IN-
PC_MON
responds by decreasing the bias current.
BC_MON
The optical average power decreases and the APC
loop responds by increasing the bias current. A fault
The optical average power increases and a fault occurs
if V exceeds the threshold. The APC loop
PC_MON
state occurs if V
exceeds the threshold voltage. responds by decreasing the bias current.
BC_MON
The APC circuit responds by increasing bias current
MD
SHUTDOWN
BIAS
Disables bias current. A fault state occurs.
until a fault is detected, then a fault state* occurs.
Does not affect laser power.
Does not affect laser power. If the shutdown circuitry is
used, laser current is disabled and a fault state* occurs.
In this condition, laser forward voltage is 0V and no light Fault state* occurs. If the shutdown circuitry is used, the
is emitted. laser current is disabled.
The APC circuit responds by increasing the bias current Fault state* occurs. If the shutdown circuitry is used,
OUT+
until a fault is detected, then a fault state* occurs.
laser current is disabled.
OUT-
Does not affect laser power.
Fault state* occurs.
Does not affect laser power.
Does not affect laser power.
Does not affect laser power.
PC_MON
BC_MON
Fault state* occurs.
IBIAS increases until V
voltage.
exceeds the threshold
exceeds the threshold
IBIAS increases until V
voltage.
exceeds the threshold
exceeds the threshold
BC_MON
BC_MON
BC_MON
APCFILT1
APCFILT2
IBIAS increases until V
voltage.
IBIAS increases until V
voltage.
BC_MON
MODSET
APCSET
Does not affect laser power.
Does not affect laser power.
Fault state* occurs.
Fault state* occurs.
*A fault state asserts the TX_FAULT pin, disables the modulation and bias currents, and asserts the SHUTDOWN pin.
Pattern-Dependent Jitter
Table 3. Optical Power Definitions
To minimize the pattern-dependent jitter associated
with the APC loop time constant, and to guarantee loop
stability, connect a capacitor between APCFILT1 and
APCFILT2 (see the Applications Information section for
PARAMETER
Average Power
SYMBOL
RELATION
= (P + P ) / 2
P
P
AVG
AVG
0
1
more information about choosing C
values). A
Extinction Ratio
r
r = P / P
APC
e
e
1
0
AVG
AVG
capacitor attached to the photodiode anode (C ) is
MD
Optical Power High
Optical Power Low
Optical Amplitude
P
P
P = 2P
1
x r / (r + 1)
e e
1
0
also recommended to filter transient currents that origi-
nate from the photodiode. To maintain stability and
proper phase margin associated with the two poles
P = 2P
0
/ (r + 1)
e
P
P
= P - P
P-P 1 0
P-P
created by C
and C
, C
should be 20x
APC
APC
MD
Laser Slope
Efficiency
η
η = P
/ I
P-P MOD
greater than C
for the MAX3735. C
should be 4x
MD
APC
to 20x greater than C
for the MAX3735A.
MD
Modulation Current
I
I
= P
/ η
P-P
MOD
MOD
12 ______________________________________________________________________________________
2.7Gbps, Low-Power SFP Laser Drivers
Input Termination Requirements
The MAX3735/MAX3735A data inputs are SFP MSA
compliant. On-chip 100Ω differential input impedance is
provided for optimal termination (Figure 6). Because of
the on-chip biasing network, the MAX3735/MAX3735A
inputs self-bias to the proper operating point to accom-
modate AC-coupling.
Determine R
APCSET
The desired monitor diode current is estimated by I
MD
= P
SET
x ρ
= 200µA. The Monitor Diode vs. R
AVG
MON APC-
graph in the Typical Operating Characteristics sec-
should be 3kΩ. The value can
tion shows that R
APCSET
also be estimated using the equation below:
I
= 1.23 / (2 × R )
APCSET
MD
Optional Shutdown Output Circuitry
The SHUTDOWN control output features extended eye
safety when the laser cathode is grounded. An external
transistor is required to implement this circuit (Figure 4).
In the event of a fault, SHUTDOWN asserts high, plac-
ing the optional shutdown transistor in cutoff mode and
thereby shutting off the laser current.
Determine R
MODSET
To achieve a minimum extinction ratio (r ) of 6.6 over
e
temperature and lifetime, calculate the required extinc-
tion ratio at +25°C. Assuming the results of the calcula-
tion are r = 20 at +25°C, the peak-to-peak optical
e
P-P
power P
= 1.81mW, according to Table 3. The
required modulation current is 1.81mW / (0.05mW/mA)
= 36.2mA. The Modulation Current vs. R graph
MODSET
Applications Information
An example of how to set up the MAX3735/MAX3735A
follows:
in the Typical Operating Characteristics section shows
that R should be 9.5kΩ. The value can also be
estimated using the equation below:
MODSET
Select a communications-grade laser for 2.488Gbps.
I
= 1.23 / (0.0037 × R
)
MODSET
MOD
Assume that the laser output average power is P
=
AVG
Determine C
APC
0dBm, the operating temperature is -40°C to +85°C,
minimum extinction ratio is 6.6 (8.2dB), and the laser
diode has the following characteristics:
In order to meet SFP timing requirements and minimize
pattern-dependent jitter, the CAPC capacitor value is
determined by the laser-to-monitor transfer and other
variables. The following equations and table can be
used to choose the CAPC values for the MAX3735 and
MAX3735A, respectively. The equations and table
assume a DC-coupled laser. Refer to Maxim
Application Note HFDN 23.0: Choosing the APC Loop
Wavelength: λ = 1.3µm
Threshold current: I = 22mA at +25°C
TH
Threshold temperature coefficient: β = 1.3% / °C
TH
Laser-to-monitor transfer: ρ
= 0.2A/W
MON
Laser slope efficiency: η = 0.05mW/mA at +25°C
V
CC
V
CC
MAX3735
MAX3735A
16kΩ
PACKAGE
0.81nH
0.11pF
MAX3735
MAX3735A
V
CC
OUT-
OUT+
PACKAGE
0.97nH
IN+
0.11pF
50Ω
50Ω
0.99nH
0.11pF
V
CC
0.97nH
IN-
OUT+
0.99nH
0.11pF
0.11pF
24kΩ
K = 0.3
Figure 6. Simplified Input Structure
Figure 7. Simplified Output Structure
______________________________________________________________________________________ 13
2.7Gbps, Low-Power SFP Laser Drivers
Capacitors Used with MAX3735/MAX3735A SFP Module
isolates laser forward voltage from the output circuitry
Designs for more information on choosing C
for DC-
and allows the output at OUT+ to swing above and
APC
and AC-coupled laser interfaces.
below the supply voltage (V ). When AC-coupled, the
CC
MAX3735/MAX3735A modulation current can be pro-
grammed from 10mA to 85mA. Refer to Maxim
Application Note HFAN 02.0: Interfacing Maxim’s Laser
Drivers to Laser Diodes for more information on AC-
coupling laser drivers to laser diodes.
MAX3735
Use the following equation to find the C
using the MAX3735:
value when
APC
C
APC
= 4.04 × 10-9 × t
× η × ρ
(29.3 + 20.6 I
-
_on
MON
- 7.78 I
TH
0.22 I 2) × (1947 + 833 I
2 + 0.103
MOD
TH
MOD
Interface Models
Figures 6 and 7 show simplified input and output cir-
cuits for the MAX3735/MAX3735A laser driver. If dice
are used, replace package parasitic elements with
bondwire parasitic elements.
3
I
)
MOD
where units are:
C
APC
in µF, I , and I
in mA and t
in µs. C
MD
can
APC
TH
MOD
ON
then be chosen as approximately 20x smaller than C
for the MAX3735.
Wire Bonding Die
The MAX3735 uses gold metalization with a thickness of
5µm (typ). Maxim characterized this circuit with gold wire
ball bonding (1-mil diameter wire). Die-pad size is 94 mil
(2388µm) square, and die thickness is 15 mil (381µm).
Refer to Maxim Application Note HFAN-08.0.1:
Understanding Bonding Coordinates and Physical Die
Size for additional information.
MAX3735A
when using the MAX3735A.
Use Table 4 to choose C
APC
APC
C
should be chosen according to the highest gain of
the lasers (generally at cold temperature). C
selec-
APC
tion assumes a 34% reduction in the gain of the lasers at
+85°C from the cold (-40°C) values.
Table 4. MAX3735A CAPC Selection
Layout Considerations
To minimize inductance, keep the connections between
the MAX3735 output pins and laser diode as close as
possible. Optimize the laser diode performance by
placing a bypass capacitor as close as possible to the
laser anode. Use good high-frequency layout tech-
niques and multiple-layer boards with uninterrupted
ground planes to minimize EMI and crosstalk.
LASER GAIN (A/A)
C
(µF)
APC
0.005
0.007
0.010
0.020
0.030
0.040
0.039
0.047
0.068
0.100
0.120
0.120
Exposed-Pad Package
The exposed pad on the 24-pin QFN provides a very
low thermal resistance path for heat removal from the IC.
The pad is also electrical ground on the MAX3735/
MAX3735A and must be soldered to the circuit board
ground for proper thermal and electrical performance.
Refer to Maxim Application Note HFAN-08.1: Thermal
Considerations for QFN and Other Exposed-Pad
Packages for additional information.
where Gain = I /(I
- I + 0.5 x I
) for DC-cou-
MD BIAS TH
MOD
pled lasers. C
can then be chosen as approximately
MD
4x to 20x smaller than C
for the MAX3735A
APC
Using the MAX3735/MAX3735A
with Digital Potentiometers
For more information on using the MAX3735/MAX3735A
with the Dallas DS1858/DS1859 SFP controller, refer to
Maxim Application Note HFAN 2.3.3: Optimizing the
Resolution of Laser Driver Setting Using Linear Digital
Potentiometers for more information.
Laser Safety and IEC 825
Using the MAX3735/MAX3735A laser driver alone does
not ensure that a transmitter design is compliant with IEC
825. The entire transmitter circuit and component selec-
tions must be considered. Each user must determine the
level of fault tolerance required by the application, recog-
nizing that Maxim products are neither designed nor
authorized for use as components in systems intended
for surgical implant into the body, for applications intend-
ed to support or sustain life, or for any other application
in which the failure of a Maxim product could create a
situation where personal injury or death may occur.
Modulation Currents Exceeding 60mA
For applications requiring a modulation current greater
than 60mA, headroom is insufficient for proper opera-
tion of the laser driver if the laser is DC-coupled. To
avoid this problem, the MAX3735/MAX3735A’s modula-
tion output can be AC-coupled to the cathode of a laser
diode. An external pullup inductor is necessary to DC-
bias the modulation output at V . Such a configuration
CC
14 ______________________________________________________________________________________
2.7Gbps, Low-Power SFP Laser Drivers
MAX3735 Chip Topography
0.079"
(2.007mm)
GND
7
TX_DISABLE APCSET
GND
10
APCFILT2 APCFILT1
MD
13
GND
14
8
9
11
12
V
6
5
4
3
CC
15
16
17
V
CC
OUT-
OUT-
0.060"
(1.524mm)
OUT+
IN+
IN-
18
19
20
V
CC
OUT+
V
CC
PC_MON
BC_MON
2
1
21
BIAS
29
28
27
26
25
24
23
22
INDEX
PAD
GND
GND
V
CC
SHUTDOWN TX_FAULT MODSET
GND
GND
______________________________________________________________________________________ 15
2.7Gbps, Low-Power SFP Laser Drivers
Bonding Coordinates
Pin Configuration
Table 5. MAX3735 Bondpad Locations
TOP VIEW
COORDINATES
PAD
NAME
X
Y
1*
2
BC_MON
PC_MON
47
47
24
23
22
21
20
19
47
229
514
696
878
1063
1149
1149
1149
1149
1149
1149
1149
1149
1032
888
742
579
433
289
93
V
1
2
3
4
5
6
18
17
16
15
14
13
V
CC
CC
3
V
47
CC
IN+
IN-
OUT-
OUT+
OUT+
4
IN-
47
5
IN+
47
MAX3735
MAX3735A
6
V
47
CC
V
CC
7
GND
TX_DISABLE
APCSET
GND
242
452
636
819
1008
1193
1383
1567
1758
1758
1758
1758
1758
1758
1758
1578
1401
1205
1016
818
623
435
245
PC_MON
BC_MON
V
CC
8
9
BIAS
10
11
12
13
14
15
16**
17**
18**
19**
20
21
22
23
24
25
26
27
28
29
7
8
9
10
11
12
APCFILT2
APCFILT1
MD
GND
Thin QFN*
(4mm x 4mm)
V
CC
OUT-
OUT-
OUT+
OUT+
*THE EXPOSED PAD MUST BE CONNECTED TO CIRCUIT BOARD GROUND FOR PROPER
THERMAL AND ELECTRICAL PERFORMANCE.
Chip Information
TRANSISTOR COUNT: 327
V
CC
BIAS
GND
SUBSTRATE CONNECTED TO GND
DIE SIZE: 60 mils x 79 mils
-64
GND
-64
PROCESS: SiGe Bipolar
MODSET
TX_FAULT
SHUTDOWN
-64
-64
-64
V
-64
CC
GND
GND
-64
-64
*Index pad. Orient the die with this pad in the lower-left corner.
**Bond out both pairs of OUT- and OUT+ to minimize series
inductance.
16 ______________________________________________________________________________________
2.7Gbps, Low-Power SFP Laser Drivers
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
PACKAGE OUTLINE
12,16,20,24L QFN, 4x4x0.90 MM
1
21-0106
E
2
PACKAGE OUTLINE
12,16,20,24L QFN, 4x4x0.90 MM
2
21-0106
E
2
______________________________________________________________________________________ 17
2.7Gbps, Low-Power SFP Laser Drivers
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
PACKAGE OUTLINE
12,16,20,24L QFN THIN, 4x4x0.8 mm
21-0139
A
PACKAGE OUTLINE
12,16,20,24L QFN THIN, 4x4x0.8 mm
21-0139
A
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
18 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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