MAX3841ETG+T [MAXIM]

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MAX3841ETG+T
型号: MAX3841ETG+T
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
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19-2905; Rev 0; 8/03  
12.5Gbps CML 2 × 2 Crosspoint Switch  
General Description  
Features  
The MAX3841 is a low-power, 12.5Gbps 2 × 2 cross-  
point switch IC for high-speed serial data loopback,  
redundancy, and switching applications. The MAX3841  
current-mode logic (CML) inputs and outputs have iso-  
Up to 12.5Gbps Operation  
Less Than 10ps Deterministic Jitter  
P-P  
Less Than 0.7ps  
Random Jitter  
RMS  
lated V  
connections to enable DC-coupled interfaces  
CC  
1.8V, 2.5V, and 3.3V DC-Coupled CML I/O  
Independent Output Power-Down  
4mm × 4mm Thin QFN Package  
-40°C to +85°C Operation  
to 1.8V, 2.5V, or 3.3V CML ICs. Fully differential signal  
paths and Maxim’s second-generation SiGe technology  
provide optimum signal integrity, minimizing jitter,  
crosstalk, and signal skew. The MAX3841 is ideal for  
serial OC-192 and 10GbE optical module, line card,  
switch fabric, and similar applications.  
+3.3V Core Supply  
The MAX3841 has 150mV  
sensitivity, and 500mV  
minimum differential input  
P-P  
nominal differential output  
215mW Power Consumption (Excluding  
P-P  
swing. Unused outputs can be powered down individu-  
ally to conserve power. In addition to functioning as a 2  
× 2 switch, the MAX3841 can be configured as a 2:1  
multiplexer, 1:2 buffer, or dual 1:1 buffer. The MAX3841  
is available in a 4mm × 4mm 24-pin thin QFN package,  
and consumes only 215mW with both outputs enabled.  
Termination Currents)  
Applications  
Ordering Information  
OC-192, 10GbE Switch/Line Cards  
OC-192, 10GbE Optical Modules  
System Redundancy/Self Test  
Clock Fanout  
PIN-  
PACKAGE  
PKG.  
CODE  
PART  
TEMP RANGE  
MAX3841ETG -40°C to +85°C  
24 Thin QFN  
T2444-1  
Pin Configuration appears at end of data sheet.  
Typical Application Circuit  
1.8V  
2.5V  
3.3V  
1.8V  
10Gbps  
CDR/SERDES  
ASIC  
3.3V  
2.5V  
V
CC  
VCC1OUT  
VCC2IN  
SDI+  
SDI-  
OUT1+  
IN2+  
IN2-  
SDO+  
SDO-  
SDI+  
SDI-  
10Gbps  
SERIAL  
OPTICAL  
MODULE  
OUT1-  
IN1+  
MAX3841  
OUT2+  
OUT2-  
SDO+  
SDO-  
IN1-  
2.5V  
1.8V  
VCC1IN  
VCC2OUT  
SEL1 SEL2 ENO1 ENO2 GND  
LOOPBACK  
________________________________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  
12.5Gbps CML 2 × 2 Crosspoint Switch  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage, V ..............................................-0.5V to +4.0V  
Continuous Power Dissipation (T = +85°C)  
CC  
A
CML Supply Voltage (VCC_IN, VCC_OUT)...........-0.5V to +4.0V  
Continuous Output Current (OUT1 , OUT2 )................... 25mA  
CML Input Voltage (IN1 , IN2 )...........-0.5V to (VCC_IN + 0.5V)  
LVCMOS Input Voltage (SEL1, SEL2,  
24-Pin Thin QFN (derate 20.8mW/°C  
above +85°C).............................................................1352mW  
Operating Temperature Range ...........................-40°C to +85°C  
Storage Temperature Range.............................-55°C to +150°C  
Lead Temperature (soldering, 10s) .................................+300°C  
ENO1, ENO2) .........................................-0.5V to (V  
+ 0.5V)  
CC  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(V  
= +3.0V to +3.6V, VCC_IN = +1.71V to V , VCC_OUT = +1.71V to V , T = -40°C to +85°C. Typical values are at V  
=
CC  
CC  
CC  
A
CC  
+3.3V, VCC_IN = VCC_OUT = 1.8V, T = +25°C, unless otherwise noted.)  
A
PARAMETER  
Core Supply Current  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
90  
UNITS  
mA  
I
Excluding CML termination currents  
(Note 1)  
65  
CC  
Data Rate  
0
12.5  
Gbps  
CML Input Differential  
CML Input Common Mode  
CML Input Termination  
CML Input Return Loss  
CML Output Differential  
CML Output Termination  
CML Output Transition Time  
Deterministic Jitter  
V
AC-coupled or DC-coupled (Note 2)  
DC-coupled  
150  
1200  
VCC_IN  
57.5  
mV  
P-P  
IN  
VCC_IN - 0.3  
V
Single ended  
42.5  
50  
Up to 10GHz  
12  
500  
50  
dB  
V
(Note 2)  
400  
600  
57.5  
30  
mV  
P-P  
OUT  
Single ended  
42.5  
t , t  
R
20% to 80% (Notes 1, 3)  
(Notes 1, 4)  
ps  
F
10  
ps  
P-P  
Random Jitter  
V
= 150mV  
(Notes 1, 5)  
0.3  
0.7  
140  
12  
ps  
RMS  
IN  
P-P  
Propagation Delay  
Any input to output (Note 1)  
(Note 1)  
100  
ps  
ps  
ps  
µA  
V
Channel-to-Channel Skew  
Output Duty-Cycle Skew  
LVCMOS Input Current  
LVCMOS Input High Voltage  
50% input duty cycle (Notes 1, 3)  
8
I
, I  
-10  
1.7  
+10  
IH IL  
V
IH  
Note 1: Guaranteed by design and characterization.  
Note 2: Differential swing is defined as V = (IN_+) - (IN_-) and V  
= (OUT_+) - (OUT_-). See Figure 1.  
OUT  
IN  
Note 3: Measured using a 0000011111 pattern at 12.5Gbps, and V = 400mV  
differential.  
IN  
P-P  
7
7
Note 4: Measured at 9.953Gbps using a pattern of 100 ones, 2 - 1 PRBS, 100 zeros, 2 - 1 PRBS, and at 12.5Gbps using a ±±28.5  
pattern. VCC_IN = VCC_OUT = 1.8V, and V = 400mV  
differential.  
IN  
P-P  
Note 5: Refer to Maxim application note HFAN-04.5.1: Measuring Random Jitter on a Digital Sampling Oscilloscope.  
2
_______________________________________________________________________________________  
12.5Gbps CML 2 × 2 Crosspoint Switch  
Typical Operating Characteristics  
(V  
= 3.3V, VCC_IN, VCC_OUT = 1.8V, V = 500mV , T = +25°C, unless otherwise noted.)  
IN P-P A  
CC  
OUTPUT EYE DIAGRAM  
(12.5Gbps, 223 - 1 PRBS)  
SUPPLY CURRENT vs. TEMPERATURE  
(CORE PLUS CML I/O CURRENTS)  
CORE SUPPLY CURRENT vs. TEMPERATURE  
(EXCLUDES CML I/O CURRENTS)  
MAX3841 toc03  
140  
130  
120  
110  
100  
90  
140  
130  
120  
110  
100  
90  
2 OUTPUTS ENABLE  
1 OUTPUT ENABLE  
0 OUTPUTS ENABLE  
1 OUTPUT ENABLE  
0 OUTPUTS ENABLE  
60mV/div  
2 OUTPUTS ENABLE  
80  
80  
70  
70  
60  
60  
50  
50  
CML INPUTS AND OUTPUTS AC-COUPLED  
40  
40  
14ps/div  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
OUTPUT EYE DIAGRAM  
(622Mbps, 223 - 1 PRBS)  
OUTPUT EYE DIAGRAM  
(10.7Gbps, 223 - 1 PRBS)  
OUTPUT EYE DIAGRAM  
(6.25Gbps, 223 - 1 PRBS)  
MAX3841 toc06  
MAX3841 toc04  
MAX3841 toc05  
60mV/div  
60mV/div  
60mV/div  
270ps/div  
16ps/div  
28ps/div  
DETERMINISTIC JITTER  
vs. TEMPERATURE  
DIFFERENTIAL OUTPUT SWING  
vs. TEMPERATURE  
PROPAGATION DELAY  
MAX3841 toc09  
550  
540  
530  
520  
510  
500  
490  
480  
470  
460  
450  
16  
14  
12  
10  
8
27 - 1 PRBS + 100CIDs  
AT 10.7Gbps  
IN1  
6
OUT1  
4
2
K28.5 AT 12.5Gbps  
0
100ps/div  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
_______________________________________________________________________________________  
3
12.5Gbps CML 2 × 2 Crosspoint Switch  
Pin Description  
PIN  
1, 12  
2, 5  
3
NAME  
FUNCTION  
V
+3.3V Core Supply Voltage  
CC  
VCC1IN  
IN1+  
Supply Voltage for CML Input IN1. Connect to 1.8V, 2.5V, or 3.3V.  
Positive Serial Data Input 1, CML  
4
IN1-  
Negative Serial Data Input 1, CML  
6
SEL1  
Output 1 Select, LVCMOS Input. See Table 1.  
Output 2 Select, LVCMOS Input. See Table 1.  
Supply Voltage for CML Input IN2. Connect to 1.8V, 2.5V, or 3.3V.  
Positive Serial Data Input 2, CML  
7
SEL2  
8, 11  
9
VCC2IN  
IN2+  
10  
IN2-  
Negative Serial Data Input 2, CML  
13, 24  
14, 17  
15  
GND  
Supply Ground  
VCC1OUT  
OUT1-  
OUT1+  
ENO1  
Supply Voltage for CML Output OUT1. Connect to 1.8V, 2.5V, or 3.3V.  
Negative Serial Data Output 1, CML  
16  
Positive Serial Data Output 1, CML  
18  
Output 1 Enable, LVCMOS Input. See Table 1.  
Output 2 Enable, LVCMOS Input. See Table 1.  
Supply Voltage for CML Output OUT2. Connect to 1.8V, 2.5V, or 3.3V.  
Negative Serial Data Output 2, CML  
19  
ENO2  
20, 23  
21  
VCC2OUT  
OUT2-  
OUT2+  
22  
Positive Serial Data Output 2, CML  
Ground. The exposed pad must be soldered to the circuit board ground for proper thermal and  
electrical performance.  
EP  
Exposed Pad  
The CML inputs accept serial NRZ data with differential  
Detailed Description  
amplitude from 150mV  
to 1200mV  
(see Figure 2).  
P-P  
P-P  
The MAX3841 contains a pair of CML inputs that drive  
two 2:1 multiplexers, with separate select inputs SEL1  
and SEL2, providing a 2 × 2 crosspoint data path. The  
outputs of the multiplexers each drive a high-perfor-  
mance CML output that can be disabled (powered  
down) using the ENO1/ENO2 inputs. All of the data  
paths are fully differential to minimize jitter, crosstalk,  
and signal skew. See Figure 1 for the functional diagram.  
The CML outputs provide 500mV  
swing, resulting in low power consumption.  
nominal differential  
P-P  
2
IN1  
IN2  
CML  
1
0
2
2
OUT1  
CML  
CML  
ENO1  
SEL1  
CML Input and Output Buffers  
The MAX3841 input and output buffers are terminated  
with 50to independent supply lines, and are also com-  
patible with 100differential terminations. (See Figures 3  
and 4.) Separate power-supply connections are provided  
for the core, input buffers, and output buffers to allow DC-  
coupling to 1.8V, 2.5V, or 3.3V CML ICs. If desired, the  
CML inputs and outputs can be AC-coupled.  
2
CML  
1
0
OUT2  
ENO2  
SEL2  
MAX3841  
Figure 1. Functional Diagram  
4
_______________________________________________________________________________________  
12.5Gbps CML 2 × 2 Crosspoint Switch  
Table 1. Output Controls  
V-  
75mV  
MIN  
ENO1  
ENO2  
SEL1  
SEL2  
OUT1  
IN2  
OUT2  
IN1  
600mV  
MAX  
0
0
0
0
1
0
0
0
0
1
0
0
1
1
X
0
1
0
1
X
IN2  
IN2  
V+  
IN1  
IN1  
IN1  
IN2  
Disabled  
Disabled  
150mV  
MIN  
(V+) - (V-)  
1200mV  
MAX  
Applications Information  
Select and Enable Controls  
The MAX3841 provides two LVCMOS-compatible  
select inputs, SEL1 and SEL2. Either data input can be  
connected to either or both data outputs. The MAX3841  
provides two LVCMOS-compatible enable inputs,  
ENO1 and ENO2, so each output can be disabled  
independently. The MAX3841 can also be used as a  
1:2 driver, 2:1 multiplexer, or a dual 1:1 buffer by using  
the LVCMOS control inputs accordingly (see Table 1).  
Figure 2. Definition of Differential Voltage Swing  
VCC_IN  
50  
50Ω  
Power-Supply Connections  
Each of the input and output power-supply connections  
(VCC1IN, VCC2IN, VCC1OUT, VCC2OUT) is indepen-  
dent and need not be connected to the same voltage.  
The input and output supplies can be connected to  
IN_+  
IN_-  
1.8V, 2.5V, or 3.3V, but the core supply (V ) must be  
CC  
MAX3841  
connected to 3.3V for proper operation.  
Input and Output Interfaces  
The MAX3841 inputs and outputs can be AC-coupled  
or DC-coupled according to the application. If an input  
or output is not used it should be terminated with 50Ω  
to the correct input or output supply voltage. For more  
information about interfacing with logic families, refer to  
Maxim application note HFAN-01.0: Introduction to  
LVDS, PECL, and CML.  
Figure 3. Equivalent CML Input Circuit  
VCC_OUT  
50Ω  
50Ω  
Package and Layout Considerations  
The MAX3841 is packaged in a 4mm × 4mm 24-pin thin  
QFN with exposed pad. The exposed pad provides  
thermal and electrical connectivity to the IC and must  
be soldered to a high-frequency ground plane. Use  
multiple vias to connect the exposed pad underneath  
the package to the PC board ground plane.  
OUT_+  
OUT_-  
Use good layout techniques for the 10Gbps PC board  
transmission lines, and configure the layout near the IC to  
minimize impedance discontinuities. Power-supply  
decoupling capacitors should be located as close as  
possible to the IC.  
MAX3841  
Figure 4. Equivalent CML Output Circuit  
_______________________________________________________________________________________  
5
12.5Gbps CML 2 × 2 Crosspoint Switch  
Pin Configuration  
Chip Information  
TRANSISTOR COUNT: 950  
PROCESS: SiGe BiCMOS  
TOP VIEW  
24 23 22 21 20 19  
V
1
2
3
4
5
6
CC  
18  
17  
16  
15  
14  
13  
ENO1  
VCC1IN  
IN1+  
VCC1OUT  
OUT1+  
OUT1-  
MAX3841  
IN1-  
VCC1IN  
SEL1  
VCC1OUT  
GND  
7
8
9
10 11 12  
THIN QFN*  
*THE EXPOSED PAD OF THE QFN PACKAGE MUST BE  
SOLDERED TO GROUND FOR PROPER THERMAL AND  
ELECTRICAL OPERATION.  
6
_______________________________________________________________________________________  
12.5Gbps CML 2 × 2 Crosspoint Switch  
Package Information  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information  
go to www.maxim-ic.com/packages.)  
PACKAGE OUTLINE  
12,16,20,24L QFN THIN, 4x4x0.8 mm  
21-0139  
A
_______________________________________________________________________________________  
7
12.5Gbps CML 2 × 2 Crosspoint Switch  
Package Information (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information  
go to www.maxim-ic.com/packages.)  
PACKAGE OUTLINE  
12,16,20,24L QFN THIN, 4x4x0.8 mm  
21-0139  
A
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600  
© 2003 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products.  

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