MAX3967A [MAXIM]
270Mbps SFP LED Driver;型号: | MAX3967A |
厂家: | MAXIM INTEGRATED PRODUCTS |
描述: | 270Mbps SFP LED Driver |
文件: | 总14页 (文件大小:836K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
19-3629; Rev 0; 3/05
270Mbps SFP LED Driver
General Description
Features
♦ TX_DISABLE for SFP Compatibility
♦ Single +2.97V to +5.5V Power Supply
♦ Adjustable Temperature Compensation
♦ Adjustable Modulation Current
The MAX3967A is a programmable LED driver for fiber
optic transmitters operating at data rates up to
270Mbps. The circuit contains a high-speed current dri-
ver with programmable temperature coefficient (temp-
co), adjustments for LED prebias voltage, and a disable
feature. The circuit accepts PECL data inputs, and
operates from a single +2.97V to +5.5V power supply.
♦ Complementary Output Reduces Supply Noise
♦ Programmable LED Prebias Voltage
♦ Available in 24-Pin Thin QFN or Die
The SFP LED driver can switch up to 100mA into typical
high-speed light-emitting diodes. As temperature
increases, the device’s modulation current increases
with a tempco that is programmable from 2500ppm/°C
to 12,000ppm/°C. The modulation current is pro-
grammed with a single external resistor.
The MAX3967A’s LED prebias voltage is programmable
from 400mV to 925mV. The prebias circuit produces
peaking current, which improves the LED switching
speed.
Ordering Information
PART
MAX3967AETG
MAX3967AE/D
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
24 Thin QFN
Dice*
Complementary current outputs help to maintain a con-
stant supply current, reducing EMI and supply noise
generated by the transmitter module. The MAX3967A is
available in die form, or in a 4mm x 4mm, 24-pin thin
QFN package.
*Dice are tested and guaranteed only at T = +25°C.
A
Applications
Pin Configuration
Multimode LED Transmitters
Fast Ethernet/FDDI
TOP VIEW
155Mbps LAN ATM Transceivers
ESCON Receivers
18
17
16
15
14
13
SFP Transceivers
V
N.C.
19
12
11
10
9
CC
IN- 20
OUT-
OUT-
OUT+
OUT+
21
22
23
IN+
MAX3967A
TX_DISABLE
Typical Operating Circuits appear at end of data sheet.
V
EE
8
V
TCMIN 24
7
EEOUT
1
2
3
4
5
6
THIN QFN (4mm x 4mm)
THE EXPOSED PAD MUST BE CONNECTED TO GROUND FOR
PROPER THERMAL AND ELECTRICAL PERFORMANCE
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
270Mbps SFP LED Driver
ABSOLUTE MAXIMUM RATINGS
Supply Voltage at V , V
Continuous Power Dissipation (T = +85°C)
A
CC CCOUT
(
,
= 0V) ..............................................-0.5V to +7V
24-Lead Thin QFN (derate 20.8mW/C°
VEE VEEOUT
Current into OUT+, OUT-................................-40mA to +160mA
Differential Output Voltage (OUT+ to OUT-) .........-3.3V to +3.3V
Voltage at PB1, PB2, PB3,
IN+, IN-, OUT+, OUT-, TX_DISABLE......-0.5V to (V
Voltage at TCMIN, TCNOM, TC, MODSET, MON ....-0.5V to +2V
above +85°C).............................................................1354mW
Operating Junction Temperature Range...........-40°C to +150°C
Die Attach Temperature...................................................+375°C
Storage Temperature Range.............................-50°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
+ 0.5V)
CC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(Load as specified in Figure 1; V
= +2.97V to +5.5V (at the V
pins); V
V
= 0V; T = -40°C to +85°C, unless otherwise
CC
CC
EE, EEOUT A
noted. Temperature coefficients are referenced to T = +25°C. Typical values are at V
= +3.3V, T = +25°C, unless otherwise
A
A
CC
noted. Dice are tested at T = +25°C only.)
A
PARAMETER
Data Input High Voltage
Data Input Low Voltage
Supply Current
SYMBOL
CONDITIONS
Referenced to V , DC-coupled input
MIN
TYP
MAX
-0.880
-1.475
39
UNITS
V
-1.165
-1.810
CC
Referenced to V , DC-coupled input
CC
V
I
(Note 1)
30
mA
µA
CC
Input Current at IN+ or IN-
-50
+50
T
T
T
T
T
T
= -40°C
= +25°C
= +85°C
= -40°C
= +25°C
= +85°C
109
126
140
15.3
19.8
24
A
A
A
A
A
A
R
= 698Ω
= 3.0kΩ
= 1.0kΩ
MODSET
112
126
140
155
(Note 2)
R
MODSET
Modulation Current
17.5
21.9
65
25
28.7
89
mA
(Note 2)
74
T
T
= -40°C
= +25°C V
A
R
MODSET
79
86
89
A
CC = 3.3V
(Note 2)
90
96
110
T
A
= +85°C
PB1, PB2, PB3 = (open, open, open)
PB1, PB2, PB3 = (V , V , open)
0.368
0.575
0.848
0.400 0.451
0.625 0.696
0.925 1.026
Prebias Voltage
V
EE EE
PB1, PB2, PB3 = (V , V , V
EE EE EE
)
Maximum tempco (TC open)
12,000
Temperature Coefficient of
Modulation Current
Nominal tempco (TC shorted to TCNOM)
Minimum tempco (TC shorted to TCMIN)
3600
2500
78
ppm/°C
Prebias Resistor
R
66
50
90
Ω
kΩ
V
PREBIAS
TX_DISABLE Resistance
TX_DISABLE High
TX_DISABLE Low
Resistance to V (Note 3)
65
100
EE
V
2.0
IH
V
0.8
V
IL
I
R
/ I
, V
< 1.1V,
MON MODSET MON
Monitor Gain
0.92
1
1.08
A/A
= 1kΩ, TC = TCMIN
MODSET
Note 1: R
= 1kΩ. Excludes I
+ and I
-, TX_DISABLE high or low.
OUT
EE
MODSET
OUT
Note 2: TC connected to TCMIN, PB1 = PB2 = V , PB3 = open.
Note 3: The TX_DISABLE pin is internally pulled low. The driver is enabled when TX_DISABLE is left open.
2
_______________________________________________________________________________________
270Mbps SFP LED Driver
AC ELECTRICAL CHARACTERISTICS
(Load as specified in Figure 1, unless otherwise noted. V
= +2.97V to +5.5V (at the V
pins), R
= 1kΩ, T = -40°C to
CC
CC
MODSET
A
+85°C. Input data shaped by 470MHz 4-pole filter, PB1 = PB2 = V , PB3 = open. Typical values are at V
= +3.3V, TC connected
EE
CC
to TCMIN, T = +25°C.) (Note 4)
A
PARAMETER
Data Input Range
SYMBOL
CONDITIONS
Differential input
MIN
500
300
TYP
MAX
2400
1230
UNITS
mV
P-P
Output-Current Edge Speed
20% to 80%, input is a 12.5MHz square wave
615
-90
ps
Output-Current Pulse-Width
Correction (PWC)
(Note 5)
ps
266Mbps (Note 6)
155Mbps (Note 7)
140
150
3
Output-Current Data-Dependent
Jitter
DJ
RJ
ps
P-P
250
Random Jitter
ps
RMS
Time from rising edge of TX_DISABLE to
output at 10% of steady state
TX_DISABLE Assert Time
t_off
0.01
0.01
0.1
0.5
0.5
2
µs
µs
Time from rising edge of TX_DISABLE to
output at 90% of steady state
TX_DISABLE Negate Time
Power-On Time
t_on
t_init
Time from V
> 2.97V to output at 90% of
CC
ms
steady state
Note 4: AC characteristics are guaranteed by design and characterization.
Note 5: PWC = (width - width ) / 2.
CURRENT ON
CURRENT OFF
Note 6: Test pattern is a K28.5 (0011 1110 1011 0000 0101) transmitted at 266Mbps.
Note 7: Test pattern is equivalent to a 213 - 1 PRBS containing 72 consecutive zeros or 72 consecutive ones.
V
CC
V
CC
FERRITE
BEAD
V
LED
L1
V
CC
1.55V
V
PREBIAS
OSCILLOSCOPE
0.22µF
0.22µF
OUT+
OUT+
OUT-
OUT-
OUT-
50Ω
50Ω
5Ω
MAX3967A
MAX3967A
MAX3967A
SWITCHING DIODE
OUT+
DC ELECTRICAL LOAD
(EXCEPT PREBIAS VOLTAGE)
DC ELECTRICAL LOAD
FOR PREBIAS VOLTAGE
AC ELECTRICAL LOAD
Figure 1. MAX3967A Output Test Loads
_______________________________________________________________________________________
3
270Mbps SFP LED Driver
Typical Operating Characteristics
(MAX3967AETG in Maxim evaluation board, V
= +3.3V, PB1 = PB2 = V , PB3 = open, TC connected to TCNOM, R
=
EE
CC
MODSET
1kΩ, T = +25°C, unless otherwise noted.)
A
SUPPLY CURRENT
vs. TEMPERATURE
MODULATION CURRENT
vs. TEMPERATURE
DIE MODULATION CURRENT
vs. TEMPERATURE
40
120
120
100
80
60
40
20
0
EXCLUDES CURRENT INTO OUT+ AND OUT-
38
NOMINAL TEMPCO
MINIMUM TEMPCO
100
80
60
40
20
0
MINIMUM TEMPCO
36
V
= 5.0V
34
32
30
28
26
24
22
20
CC
MAXIMUM TEMPCO
V
CC
= 3.3V
MAXIMUM TEMPCO
NOMINALTEMPCO
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
-40
-20
0
20
40
60
80
0
20
40
60
80 100 120 140
°
°
°
AMBIENT TEMPERATURE ( C)
AMBIENT TEMPERATURE ( C)
JUNCTION TEMPERATURE ( C)
MODULATION CURRENT TEMPCO
MODULATION CURRENT
DIE MODULATION CURRENT
vs. R
vs. R
vs. R
TC
MODSET
MODSET
100,000
10,000
1000
200
100
200
100
NOMINAL TEMPCO
MINIMUM TEMPCO
MINIMUM TEMPCO
NOMINAL TEMPCO
MAXIMUM TEMPCO
MAXIMUM TEMPCO
1k
10
10
1
10
100
500
1k
10k
500
8k
R
TC
(kΩ)
R
(Ω)
R
(Ω)
MODSET
MODSET
EYE DIAGRAM (OPTICAL)
155Mbps
EYE DIAGRAM (ELECTRICAL)
266Mbps
EYE DIAGRAM (OPTICAL)
155Mbps
MAX3967 toc09
MAX3967 toc07
MAX3967 toc08
1ns/div
500ps/div
PATTERN = 231 - 1 PRBS
1ns/div
°
°
RECEIVER BW = 200MHz, V = 5.5V, T = -40 C,
RECEIVER BW = 200MHz, V = 2.97V, T = +85 C,
CC
A
CC
A
= -17.1dBm, PATTERN = 231 - 1 PRBS
P
AVE
= -15.8dBm, PATTERN = 231 - 1 PRBS
P
AVE
4
_______________________________________________________________________________________
270Mbps SFP LED Driver
Typical Operating Characteristics (continued)
(MAX3967AETG in Maxim evaluation board, V
= +3.3V, PB1 = PB2 = V , PB3 = open, TC connected to TCNOM, R
EE
=
CC
MODSET
1kΩ, T = +25°C, unless otherwise noted.)
A
EYE DIAGRAM (OPTICAL)
RANDOM JITTER
EYE DIAGRAM (OPTICAL)
155Mbps
155Mbps
vs. TEMPERATURE
MAX3967 toc11
MAX3967 toc10
6
5
V
= 3.3V
CC
4
3
2
1
0
MAXIMUM TEMPCO
V
= 5.0V
CC
MINIMUM TEMPCO
1ns/div
RECEIVER BW = 200MHz, V = 2.97V, T = -40 C,
1ns/div
0
10 20 30 40 50 60 70 80 90
°
°
°
RECEIVER BW = 200MHz, V = 5.5V, T = +85 C,
AMBIENT TEMPERATURE ( C)
CC
A
CC
A
P
AVE
= -15.8dBm, PATTERN = 231 - 1 PRBS
P
AVE
= -17.1dBm, PATTERN = 231 - 1 PRBS
TX_DISABLE NEGATE TIME
TX_DISABLE ASSERT TIME
MAX3967 toc14
MAX3967 toc13
LED
LED
OUTPUT
OUTPUT
t_off
t_on
TX_DISABLE
TX_DISABLE
4ns/div
4ns/div
_______________________________________________________________________________________
5
270Mbps SFP LED Driver
Pin Description
PIN
NAME
FUNCTION
Shorting TC to TCNOM provides a modulation tempco of approximately 3600ppm/°C.
A resistor (R ) connected between the TC and TCMIN pins sets the tempco of the modulation
1
TCNOM
TC
2
TC
current. Leaving R unconnected provides the maximum tempco.
TC
3, 4, 5
6, 7
PB1, PB2, PB3 Programs the Prebias Voltage at the OUT+ Pin (Table 1)
V
Ground for the Output-Current Drivers
EEOUT
8, 9
OUT+
OUT-
N.C.
Current Output
10, 11
12, 16
13, 14
15, 19
17
Complementary Current Output
No Connection. Not internally connected.
Supply Connection for the Output-Current Drivers
Provides Current to the Internal Amplifiers
The Current Sourced from the MON Pin is Proportional to the Modulator Current
V
CCOUT
V
CC
MON
MODSET
IN-
18
A Resistor from MODSET to V Programs the LED Modulation Current
EE
20
Inverting Data Input
21
IN+
Noninverting Data Input
Transmit Disable. When high, the current at the OUT+ pins is in the low state. The transmitter is
enabled when TX_DISABLE is open.
22
TX_DISABLE
23
24
EP
V
Ground for internal amplifiers.
EE
TCMIN
Shorting TC to TCMIN provides the minimum modulation-current tempco.
Exposed Pad Connect the exposed pad to board ground for optimal correct electrical and thermal performance.
perature coefficient (tempco) is useful to compensate
for the temperature characteristics of typical fiber optic
Detailed Description
The MAX3967A provides a flexible current drive for the
modulation of fiber optic light-emitting diodes (LEDs).
The circuit is designed to be used with +3.3V or +5V
power supplies. The IC provides up to 100mA of modu-
lation current. An adjustable prebias current source sets
the LED prebias voltage. An integrated resistor provides
passive peaking and optical pulse-width compensation.
LEDs. The first source has a temperature-stable output.
The second source has a temperature-increasing output
with a tempco of approximately 12,000ppm/°C (relative
to +25°C). A resistor-divider between the two reference
generators programs the modulation-current tempco.
For maximum modulation-current tempco, leave the TC
pin disconnected. For a tempco of approximately
3600ppm/°C, connect TC to TCNOM. To obtain the mini-
mum tempco, connect TCMIN to TC. Intermediate temp-
co values can be programmed by connecting an
Figure 2 shows a block diagram of the MAX3967A,
which comprises a reference-voltage generator, modu-
lation-current generator, input buffer with disable, pre-
bias-current generator, main output driver,
complementary output driver, and LED-compensation
network.
external resistor (R ) between TCMIN and TC.
TC
Input Buffer
The inputs are connected to the PECL-compatible differ-
ential input buffer. If left unconnected, IN+ is internally
pulled to a PECL low and IN- is pulled to a PECL high,
causing low current at OUT+. The input impedance of
IN+ and IN- is approximately 50kΩ.
Temperature Compensation
The reference-voltage generator circuit provides two
voltage sources that create modulation-current tempera-
ture compensation. A positive modulation-current tem-
6
_______________________________________________________________________________________
270Mbps SFP LED Driver
TX_DISABLE
V
CCOUT
OUT-
MAX3967A
INPUT
BUFFER
5Ω
IN+
IN-
0
1
0
COMPLEMENTARY
OUTPUT
24X
R
PREBIAS
78Ω
MAIN
OUTPUT
24X
MODULATION-
CURRENT
GENERATOR
OUT+
GAIN 4X
V
CC
35Ω
REFERENCE-VOLTAGE GENERATOR
12pF
1.2V
V
PREBIAS-CURRENT
GENERATOR
50Ω
TEMP
TCMIN
TCNOM
TC
MODSET
MON
PB1
PB2
PB3
R
MODSET
Figure 2. Functional Diagram
Modulation-Current Generator
The modulation-current generator circuit provides con-
trol of the modulation-current amplitude. This amplitude
is determined by the voltage at the MODSET pin and
Prebias Current Generator
A prebias voltage (V ) can be applied to the
LED to improve switching speed. The prebias current
generator creates a current that flows through the 78Ω
prebias resistor in the output stage, creating a prebias
voltage. The prebias voltage can be adjusted by selec-
PREBIAS
external resistor R
MODSET.
Do not connect bypass capacitors at the MODSET pin.
Capacitance at this pin increases high-frequency out-
put noise. The MON pin provides an optional modula-
tion-current monitor. The current sourced from the MON
pin is 1/96 of the modulation current. If used, the pin
tively connecting pins PB1, PB2, and PB3 to V . Table 1
EE
describes the functions of PB1, PB2, and PB3.
Output Current Drivers
The modulation-current reference is switched and
amplified by the output stages.
should be connected to V
through a resistor. The
EE
resistance must be chosen so the voltage on MON
does not exceed 1.1V. If not used, leave MON open.
LED package lead inductance causes ringing and
overshoot, which can be compensated with an RC filter
network. The MAX3967A includes 35Ω and 12pF of
_______________________________________________________________________________________
7
270Mbps SFP LED Driver
See the Modulation Current Tempco vs. R
graph in
TC
Table 1. LED Prebias Voltage
the Typical Operating Characteristics to program a cus-
tom tempco. From the graph, determine the appropriate
resistor and connect it between TCMIN and TC.
PB1
PB2
PB3
PREBIAS (V)
Open
Open
Open
Open
Open
Open
Open
0.400
0.475
0.550
0.625
0.700
0.775
0.850
0.925
For example, if an LED requires a 5000ppm/°C tempco,
V
EE
choose R of 8.3kΩ.
TC
Open
V
V
EE
EE
Program the Modulation Current
Determine the required modulation current at T = +25°C.
V
EE
A
Open
Open
Open
V
V
V
V
EE
EE
EE
EE
Then select the appropriate value of R
from the
MODSET
graph in the Typical
V
EE
Modulation Current vs. R
MODSET
Operating Characteristics.
Open
V
V
EE
EE
V
EE
For example, to program 75mA modulation current, the
graph indicates an R
value of 750Ω for maxi-
MODSET
mum tempco (12,000ppm/°C) and 1kΩ for nominal
internal compensation. The compensation network can
be optimized by adding additional components
tempco (3600ppm/°C). By interpolation, choose an
R
of 792Ω for a tempco of 5000ppm/°C.
MODSET
between V
and OUT+.
CCOUT
Program Prebias Voltage
The MAX3967A includes a complementary output dri-
ver, which is switched 180° out of phase with the main
output. This configuration helps to maintain constant
current flow from the voltage supply, reducing noise
and EMI. A large diode and a 5Ω resistor are connect-
ed in series with the negative output (OUT-) to emulate
the LED load at OUT+.
Determine the LED prebias voltage that produces an
acceptable trade-off between peaking current and extinc-
tion ratio. See Table 1 for PB1, PB2, and PB3 settings.
Layout Considerations
For optimum performance, total load inductance should
not exceed 10nH. Load inductance includes LED
inductance, LED package lead inductance, and circuit-
board traces. Keep the connections between the
MAX3967A OUT pins and the LED as short as possible
to minimize inductance.
Peaking Current
The prebias resistor provides peaking current to improve
the LED switching speed. The peaking magnitude is
given by the following equation:
Chip-and-wire (hybrid) technology reduces package
inductance significantly, and provides the best possible
performance.
V
-V
78Ω
LED PREBIAS
I
=
PEAK
Use good high-frequency layout techniques and a
multilayer board with an uninterrupted ground plane.
Power supplies should be capacitively bypassed to the
ground plane with surface-mount capacitors located
near the power-supply pins.
The peaking amplitude is equal for rising and falling
data transitions.
Design Procedure
Select an LED
For best performance, select a high-efficiency, low-
inductance LED. LED inductance causes large voltage
swings and ringing.
Program the Modulation-Current Tempco
Select a modulation-current tempco that provides near-
ly constant LED output power as temperature varies.
For the minimum tempco, connect TCMIN to the TC pin.
For a tempco of approximately 3600ppm/°C, connect
TC to TCNOM and leave TCMIN unconnected. For the
maximum tempco, leave TCMIN, TCNOM, and TC
unconnected.
8
_______________________________________________________________________________________
270Mbps SFP LED Driver
Exposed-Pad Package
The exposed pad on the 24-pin TQFN provides a very
low thermal resistance path for heat removal from
the IC.
Input Terminations
MAX3967A
PECL
OUTPUT
Chip Information
IN+
TRANSISTOR COUNT: 331
50Ω
- 2V
SUBSTRATE CONNECTED TO V
EE
PROCESS: BIPOLAR
V
CC
V
CC
DIE THICKNESS: 15 mils
R1
MAX3967A
RF OR NON-PECL
OUTPUT
IN+
R2
V
R1
82
68
R2
CC
3.3
5.0
130
180
SINGLE-ENDED TERMINATION IS SHOWN. IN- SHOULD BE TERMINATED SIMILARLY.
Figure 3. Input Terminations
Applications Information
Wire-Bonding Die
The MAX3967A utilizes gold metalization, which pro-
vides high reliability. Make connections to the die with
gold wire only, using ball-bonding techniques. Use
caution if attempting wedge-bonding. Pad size is 4 mils
x 4 mils (100µm). Die thickness is typically 15 mils
(375µm).
_______________________________________________________________________________________
9
270Mbps SFP LED Driver
Typical Operating Circuits
SFP TRANSMITTER
+3.3V
FERRITE BEAD
10kΩ
V
V
CCOUT
CC
DISABLE
+3.3V
TX_DISABLE
OUT-
OUT+
+3.3V
82Ω
82Ω
MAX3967A
C
C
IN
IN+
IN-
DIFFERENTIAL
DATA
V
EEOUT
V
EE
IN
MODSET
PB1
PB2 PB3
TCMIN TC
TCNOM
120Ω
120Ω
R
MODSET
SFP TRANSMITTER WITH DIGITAL MONITOR
+3.3V
FERRITE BEAD
10kΩ
V
CC
V
CCOUT
DISABLE
+3.3V
TX_DISABLE
OUT-
OUT+
+3.3V
82Ω
82Ω
MAX3967A
C
C
IN
IN+
IN-
DIFFERENTIAL
DATA
V
EEOUT
V
EE
IN
MON
PB1
120Ω
120Ω
MODSET
PB2 PB3 TCNOM TCMIN TC
R
MODSET
DIAGNOSTIC
IC
R
MON
10 ______________________________________________________________________________________
270Mbps SFP LED Driver
Typical Operating Circuits (continued)
SFF TRANSMITTER WITH DISABLE
V
CC
FERRITE BEAD
V
CC
V
CCOUT
DISABLE
TX_DISABLE
IN+
OUT-
OUT+
PECL
DATA
MAX3967A
IN-
V
EEOUT
MON
V
EE
MODSET
PB1
PB2 PB3 TCNOM TCMIN
TC
R
MODSET
R
*
TC
*OPTIONAL COMPONENT
SFF TRANSMITTER WITHOUT DISABLE
V
CC
FERRITE BEAD
V
V
CCOUT
CC
TX_DISABLE
OUT-
OUT+
IN+
IN-
PECL
DATA
MAX3967A
V
EEOUT
MON
V
EE
MODSET
PB1
PB2 PB3 TCNOM TCMIN
TC
R
MODSET
______________________________________________________________________________________ 11
270Mbps SFP LED Driver
Chip Topography
Pad Coordinates
COORDINATES (µm)
PAD
NUMBER
TX_DISABLE
V
PAD NAME
IN+
IN-
EE
X
0
Y
BP1
BP2
TCMIN
TCNOM
TC
1464
1268
1060
876
744
560
116
0
0
TCMIN
V
CC
BP3
0
BP4
PB1
0
TCNOM
MODSET
MON
BP5
PB2
0
BP6
PB3
0
TC
BP7
V
V
0
EEOUT
EEOUT
BP8
0
PB1
PB2
BP9
OUT+
OUT+
OUT-
OUT-
180
296
480
596
804
804
804
804
804
804
624
492
308
176
0
1.85mm
(73.0 mils)
BP10
BP11
BP12
BP13
BP14
BP15
BP16
BP17
BP18
BP19
BP20
BP21
BP22
0
0
PB3
0
V
CC
V
0
CCOUT
CCOUT
V
124
528
1032
1240
1464
1464
1464
1464
1464
V
CC
MON
V
V
EEOUT
EEOUT
V
V
CCOUT
CCOUT
MODSET
V
CC
IN-
IN+
OUT+
OUT-
(0, 0)
OUT+
OUT-
TX_DISABLE
1.21mm
(48 mils)
V
EE
12 ______________________________________________________________________________________
270Mbps SFP LED Driver
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
PACKAGE OUTLINE,
12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
1
21-0139
D
2
PACKAGE
CODE
PART
PACKAGE TYPE
24 thin QFN
(4mm x 4mm x 0.8mm)
MAX3967AETG
T2444-4
______________________________________________________________________________________ 13
270Mbps SFP LED Driver
Package Information(continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
PACKAGE OUTLINE,
12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm
2
21-0139
D
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2005 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products, Inc.
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