MAX6513TT075-T [MAXIM]
Analog Circuit, 1 Func, 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEA, TDFN-6;型号: | MAX6513TT075-T |
厂家: | MAXIM INTEGRATED PRODUCTS |
描述: | Analog Circuit, 1 Func, 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEEA, TDFN-6 |
文件: | 总8页 (文件大小:584K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
19-1819; Rev 2; 10/04
Low-Cost, Remote SOT Temperature Switches
General Description
Features
The MAX6511/MAX6512/MAX6513 are fully integrated,
remote temperature switches that use an external P-N
junction (typically a diode-connected transistor) as the
sensing element to measure the remote temperature.
These devices assert a logic signal when the tempera-
ture crosses a factory-programmed threshold. Available
trip thresholds are from +45°C to +125°C in 10°C incre-
♦ Continuously Measure External Junction
Temperature
♦ Factory-Programmed Temperature Threshold from
+45°C to +125°C in 10°C Increments
♦ Insensitive to Series Parasitic Resistance
♦ Active-Low CMOS Output (MAX6511) or Open-Drain
Output for Overtemperature Alarm (MAX6512) or
Active-High Output (MAX6513) for Direct Fan Control
ments. Accuracy is within 3°C (T = -5°C to +55°C) or
A
5°C (T = -40°C to +85°C). Hysteresis is pin selec-
A
table to 5°C or 10°C.
♦ <100ms Response Time
The MAX6511 has an active-low CMOS output and the
MAX6513 has an active-high CMOS output. The
MAX6512 has an open-drain output. The output is
asserted when the temperature exceeds the threshold
value. The active-low open-drain output is intended to
interface with a microprocessor (µP) reset or interrupt
input. The active-high CMOS output can directly drive a
power FET to control a cooling fan.
♦ Accuracy
3°C (T
5°C (T
+45°C to +125°C, T = -5°C to +55°C)
A
REMOTE =
REMOTE =
+45°C to +125°C, T = -40°C to +85°C)
A
♦ Pin-Selectable 5°C or 10°C Hysteresis
♦ 400µA Average Current Consumption
♦ +3.0V to +5.5V Supply Range
♦ 6-Pin SOT23 Package
The MAX6511/MAX6512/MAX6513 operate from a
+3.0V to +5.5V supply and typically consume 400µA of
supply current. They are available in the small 6-pin
SOT23. The MAX6513 is also available in a 6-pin lead-
free TDFN package.
♦ 6-Pin TDFN Package (Lead Free)
Ordering Information
________________________Applications
CPU Temperature Monitoring in High-Speed
Computers
PIN-
PACKAGE
PART*
TEMP RANGE
OUTPUT
Multichip Modules
Battery Packs
CMOS
(active low)
MAX6511UT_ _ _ -T -40°C to +85°C 6 SOT23-6
Temperature Control
Temperature Alarms
Fan Control
MAX6512UT_ _ _ -T -40°C to +85°C 6 SOT23-6 Open-drain
-40°C to +85°C 6 TDFN
CMOS
MAX6513_T_ _ _ -T
(active high)
-40°C to +85°C 6 SOT23-6
*These parts are offered in nine standard temperature versions
with a minimum order of 2500 pieces. To complete the suffix
information, select an available trip point in degrees centigrade
from the device marking codes table. For example, the
MAX6511UT065-T describes a MAX6511 in a 6-pin SOT23
package with a +65°C threshold.
Pin Configuration
TOP VIEW
V
1
2
3
6
5
4
DXP
DD
MAX6511
MAX6512
MAX6513
GND
DXN
HYST
TOVER (TOVER)
( ) ARE FOR MAX6513 SOT23 ONLY.
Typical Operating Circuit appears at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Low-Cost, Remote SOT Temperature Switches
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (V ) ...............................................-0.3V to +6V
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature
DD
DXP, DXN, HYST, TOVER (MAX6513),
TOVER (MAX6511/MAX6512) ................-0.3V to (V
TOVER (MAX6513), TOVER (MAX6511)
+ 0.3V)
DD
Output Current ....................................................-1mA/+50mA
DXN Input Current...................................................-1mA/+50mA
Current (all other pins)...................................................... 20mA
Vapor Phase (60s) .......................................................+215°C
Infrared (15s) ...............................................................+220°C
Continuous Power Dissipation (T = +70°C)
A
6-Pin SOT23-6 (derate 9.1mW/°C above +70°C) ........727mW
6-Pin TDFN (derate 24.4mW/°C above +70°C) .........1951mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
= +3.0V to +5.5V, C = 2200pF, T = -40°C to +85°C, T
= +45°C to +125°C (Note 1), unless otherwise noted. Typical
DD
S
A
REMOTE
values are at T = +25°C.) (Note 2)
A
PARAMETER
Supply Voltage Range
Supply Current
SYMBOL
CONDITIONS
MIN
TYP
MAX
5.5
UNITS
V
V
3.0
DD
DD
I
400
600
µA
T
T
= -5°C to +55°C
-3.0
-5.0
+3.0
+5.0
A
A
Temperature Threshold
Accuracy (Note 3)
∆T
°C
TH
= -40°C to +85°C
Power-Supply Sensitivity for
Temperature Trip Point
-0.6
°C/V
HYST = V
HYST = V
5
IL
Temperature Threshold
Hysteresis
T
°C
ms
V
HYST
10
70
IH
Response Time
120
0.2
0.2
V
0.2
-
DD
Input Voltage High
Input Voltage Low
Output Voltage High
Output Voltage Low
V
IH
V
V
IL
V
- 0.2
DD
V
MAX6511/MAX6513, I
= 1mA
V
OH
OUT
V
I
= 1mA
OUT
V
OL
Maximum DXP Source
Current
0.4V ≤ V
DXN = GND
≤ 2V,
DXP
270
9
µA
Minimum DXP Source
Current
0.4V ≤ V
DXN = GND
≤ 2V,
DXP
µA
Note 1: T
refers to the temperature of the remote-sensing junction. T refers to the temperature of the MAX6511/MAX6512/
A
REMOTE
MAX6513 package.
Note 2: All parameters are 100% production tested at T = +25°C. Specifications over temperature limits are guaranteed by design.
A
Note 3: This parameter is guaranteed by design to 3.5 sigma.
2
_______________________________________________________________________________________
Low-Cost, Remote SOT Temperature Switches
Typical Operating Characteristics
(V
DD
= +3.3V, C = 2200pF, T = +25°C, unless otherwise noted.)
S A
SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
TEMPERATURE TRIP THRESHOLD ERROR
TEMPERATURE TRIP THRESHOLD ERROR
vs. C CAPACITANCE
vs. AMBIENT TEMPERATURE T
S
A
14
0.2
0
440
12
10
8
420
400
380
360
340
320
300
-0.2
-0.4
-0.6
6
4
-0.8
-1.0
-1.2
-1.4
-1.6
(NOTE: SUPPLY CURRENT
INCLUDES EXTERNAL
DIODE-CONNECTED
TRANSISTOR)
2
0
-2
-4
-40
-15
10
35
60
85
0
10
20
30
40
50
60
-60 -40 -20
0
20 40 60 80 100 120 140
AMBIENT TEMPERATURE T (°C)
C
S
CAPACITANCE (nF)
AMBIENT TEMPERATURE T (°C)
A
A
TEMPERATURE TRIP THRESHOLD ERROR
vs. SERIES RESISTANCE
TEMPERATURE TRIP THRESHOLD
vs. SUPPLY VOLTAGE
1.0
0.5
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
-1.4
0
-0.5
-1.0
-1.5
-2.0
-1.6
-1.8
3.0
0
20 40 60 80 100 120 140 160 180 200
3.5
4.0
4.5
5.0
5.5
SERIES RESISTANCE (Ω)
SUPPLY VOLTAGE (V)
_______________________________________________________________________________________
3
Low-Cost, Remote SOT Temperature Switches
Pin Description
PIN
NAME
FUNCTION
MAX6511
MAX6512
MAX6513
Power-Supply Input, +3.0V to +5.5V. Bypass V
capacitor.
to GND with a 0.1µF
DD
1
1
V
DD
2
3
2
3
GND
Ground
HYST
Hysteresis Selection. Hysteresis is 10°C for HYST = V , 5°C for HYST = GND.
DD
CMOS Active-Low Output (MAX6511) or Open-Drain Active-Low Output
(MAX6512). TOVER goes low when the temperature exceeds the factory-
programmed temperature threshold. This pin can only sink current in the
MAX6512.
4
—
TOVER
CMOS Active-High Output (MAX6513). TOVER goes high when the temperature
exceeds the factory-programmed temperature threshold.
—
5
4
5
6
TOVER
DXN
This pin connects to the negative (cathode) terminal of the external P-N sense
junction. DXN must be connected to GND.
This pin connects to the positive (anode) terminal of the external P-N sense
junction.
6
DXP
The MAX6512 has an active-low, open-drain output struc-
Detailed Description
ture that can only sink current. The MAX6511 has an active-
low CMOS output structure, and the MAX6513 has an
active-high CMOS output.
The MAX6511/MAX6512/MAX6513 fully integrated tem-
perature switches incorporate a precision bandgap ref-
erence, a conversion block, a current source, and a
comparator (Figure 1). These devices use an external
P-N junction as the temperature-sensing element. They
steer bias currents through the external diode, measure
the forward voltages, and compute the temperature
using a precision chopper stabilized amplifier.
The MAX6511/MAX6512/MAX6513 are available with
preset temperature thresholds from +45°C to +125°C in
10°C increments.
Resistance values of less than 100Ω in series with the
external sense junction will result in trip-point errors
<1°C. The MAX6511/MAX6512/MAX6513 provide noise
immunity by integration and oversampling of the diode
voltage, but good design practice includes routing the
DXP and DXN lines away from noise sources, such as
high-speed digital lines, switching regulators, induc-
tors, and transformers. The DXP and DXN traces
should be paired together and surrounded by ground
plane whenever possible.
DXP
TEMPERATURE
CONVERSION
DXN
COMPAR-
ATOR
LATCH
TOVER
VOLTAGE
REFERENCE
BANDGAP
In applications where the temperature changes rapidly,
the measured temperature will be approximately equal
to the average value of the temperature during the
measurement period.
Figure 1. Functional Block Diagram
4
_______________________________________________________________________________________
Low-Cost, Remote SOT Temperature Switches
Table 1. Sensor Transistor Manufacturers
MANUFACTURER
Central Semiconductor (USA)
ON (USA)
MODEL NUMBER
CMPT3904
TRIP TEMPERATURE
TRIP TEMPERATURE HYSTERESIS
MMBT3904
Rohm Semiconductor (Japan)
Samsung (Korea)
SST3904
TOVER (MAX6511)
KST3904-TF
SMBT3904
Siemens (Germany)
Zetex (England)
TIME
FMMT3904CT-ND
Note: Transistors must be diode connected (base shorted to
Figure 2. Temperature Trip Threshold Hysteresis
collector).
cate the manufacturer has good process controls and
Hysteresis Input
that the devices have consistent V characteristics.
be
The HYST pin is a CMOS-compatible input that selects
The MAX6511/MAX6512/MAX6513 can also measure
the die temperature of CPUs and other integrated cir-
cuits having on-board temperature-sensing diodes.
Use the monitor’s output to reset the µP, assert an inter-
rupt, activate a cooling fan, or trigger an external alarm.
hysteresis at either a high level (10°C for HYST = V
)
DD
or a low level (5°C for HYST = GND). Hysteresis pre-
vents the output from chattering when the temperature
is near the trip point. The HYST pin must not float.
The output asserts when the temperature exceeds the
trip point and deasserts when the temperature falls
back below the trip point minus the hysteresis. For
example, if the trip point is 105°C, the output will assert
at 105°C and will not deassert until temperature falls
below 105°C minus the hysteresis (e.g., 95°C if 10°C
hysteresis is chosen) (Figure 2).
Noise Filtering Capacitors
A quality ceramic capacitor must be connected across
the DXP/DXN inputs to maintain temperature threshold
accuracy by filtering out noise. The capacitor should be
located physically close to the DXP/DXN pins and
should typically have a value of 2200pF. Larger capaci-
tor values can cause temperature measurement errors.
A 50% variation from the recommended capacitor
value can cause up to 1°C error.
Applications Information
Remote-Diode Selection
To ensure best accuracy, use a good-quality diode-
connected transistor. Suggested devices are listed in
Table 1. Large power transistors are not recommend-
ed. Tight specifications for forward current gain indi-
_______________________________________________________________________________________
5
Low-Cost, Remote SOT Temperature Switches
Typical Operating Circuit
3.3V
2µF
V
DD
µP
DXP
C
S
DXN
MAX6511
TOVER (TO MICROPROCESSOR FAN
CONTROLLER, SHUTDOWN, ETC.)
HYST
Device Marking Codes for SOT23-6 Package
TEMPERATURE TRIP
THRESHOLD (°C)
TEMPERATURE TRIP
THRESHOLD (°C)
DEVICE
CODE
DEVICE
CODE
MAX6511UT045
MAX6511UT055
MAX6511UT065
MAX6511UT075
MAX6511UT085
MAX6511UT095
MAX6511UT105
MAX6511UT115
MAX6511UT125
MAX6512UT045
MAX6512UT055
MAX6512UT065
MAX6512UT075
MAX6512UT085
MAX6512UT095
MAX6512UT105
MAX6512UT115
MAX6512UT125
AAOA
AAOB
AAOC
AAOD
AAOE
AAOF
AAOG
AAOH
AAOI
45
55
MAX6513UT045
MAX6513UT055
MAX6513UT065
MAX6513UT075
MAX6513UT085
MAX6513UT095
MAX6513UT105
MAX6513UT115
MAX6513UT125
MAX6513TT045
MAX6513TT055
MAX6513TT065
MAX6513TT075
MAX6513TT085
MAX6513TT095
MAX6513TT105
MAX6513TT115
MAX6513TT125
AAPD
AAPE
AAPF
AAPG
AAPH
AAPI
45
55
65
65
75
75
85
85
95
95
105
115
125
45
AAPJ
AAPK
AAPL
+ACU
+ACV
+ACW
+ACX
+ACY
+ACZ
+ADA
+ADB
+ADC
105
115
125
45
AAOJ
AAOK
AAOL
AAOM
AAON
AAOO
AAOP
AAOQ
AAOR
55
55
65
65
75
75
85
85
95
95
105
115
125
105
115
125
Chip Information
TRANSISTOR COUNT: 3300
6
_______________________________________________________________________________________
Low-Cost, Remote SOT Temperature Switches
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
_______________________________________________________________________________________
7
Low-Cost, Remote SOT Temperature Switches
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
D2
D
A2
PIN 1 ID
N
0.35x0.35
b
[(N/2)-1] x e
REF.
PIN 1
INDEX
AREA
E
E2
DETAIL A
e
A1
k
C
C
L
L
A
L
L
e
e
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
1
-DRAWING NOT TO SCALE-
21-0137
G
2
COMMON DIMENSIONS
SYMBOL
MIN.
0.70
2.90
2.90
0.00
0.20
MAX.
0.80
3.10
3.10
0.05
0.40
A
D
E
A1
L
k
0.25 MIN.
0.20 REF.
A2
PACKAGE VARIATIONS
DOWNBONDS
ALLOWED
PKG. CODE
T633-1
N
6
D2
E2
e
JEDEC SPEC
b
[(N/2)-1] x e
1.90 REF
1.90 REF
1.95 REF
1.95 REF
1.95 REF
2.00 REF
2.40 REF
2.40 REF
1.50±0.10 2.30±0.10 0.95 BSC
1.50±0.10 2.30±0.10 0.95 BSC
1.50±0.10 2.30±0.10 0.65 BSC
1.50±0.10 2.30±0.10 0.65 BSC
1.50±0.10 2.30±0.10 0.65 BSC
MO229 / WEEA
MO229 / WEEA
MO229 / WEEC
MO229 / WEEC
MO229 / WEEC
0.40±0.05
0.40±0.05
0.30±0.05
0.30±0.05
0.30±0.05
NO
NO
T633-2
6
T833-1
8
NO
T833-2
8
NO
T833-3
8
YES
NO
T1033-1
T1433-1
T1433-2
10
14
14
1.50±0.10 2.30±0.10 0.50 BSC MO229 / WEED-3 0.25±0.05
1.70±0.10 2.30±0.10 0.40 BSC
1.70±0.10 2.30±0.10 0.40 BSC
- - - -
- - - -
0.20±0.05
0.20±0.05
YES
NO
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
2
-DRAWING NOT TO SCALE-
21-0137
G
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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