MAX77827BEFD+T [MAXIM]

5.5V Input, 1.8A/3.1A Switch Buck-Boost Converter with 6μA IQ;
MAX77827BEFD+T
型号: MAX77827BEFD+T
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

5.5V Input, 1.8A/3.1A Switch Buck-Boost Converter with 6μA IQ

文件: 总23页 (文件大小:998K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
EVALUATION KIT AVAILABLE  
Click here to ask about the production status of specific part numbers.  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
General Description  
Benefits and Features  
The MAX77827 is a high-efficiency buck-boost regulator  
targeted for one-cell Li-ion powered applications with the  
lowest typical quiescent current in the industry of 6μA. It  
supports input voltages of 1.8V to 5.5V and an output volt-  
age range of 2.3V to 5.3V. The IC provides two different  
switching current levels (1.8A and 3.1A) to optimize ex-  
ternal component sizing based on given load current re-  
quirements. With the 1.8A switching current-limit option,  
the IC can support up to 1.0A load current in buck mode  
● 1.8V to 5.5V Input Voltage Range  
● 2.3V to 5.3V Single Resistor Adjustable Output  
Voltage  
● 1.6A Maximum Output Current (3.1A I  
Buck Mode)  
Option,  
LIM  
● 900mA Maximum Output Current (1.8A I  
Option,  
LIM  
Boost Mode 3.0V , 3.3V  
)
IN  
OUT  
● 96% Peak Efficiency (3.3V , 3.3V  
)
OUT  
IN  
● SKIP Mode for Higher Light-Load Efficiency  
and 900mA in boost mode (V = 3.0V, V  
= 3.3V).  
● 6μA Ultra-Low Typical Quiescent Current (At T =  
IN  
OUT  
J
+25°C)  
The peak efficiency of 96% makes the IC one of the best  
solutions as a DC/DC converter to supply a rail for battery-  
powered portable applications.  
● 2.5MHz Nominal Switching Frequency  
● Enable Pin  
● GPIO Pins for System Design Convenience  
• FPWM (Forced PWM) Mode Selection Pin  
• POK Indicator Pin  
The IC features an adjustable output voltage, which can  
be programmed from 2.3V to 5.3V through a single resis-  
tor. Two GPIO pins are available to support force PWM  
enable function and power-OK (POK) indicator. A unique  
control algorithm allows high-efficiency, outstanding line/  
load transient response, and seamless transition between  
buck and boost modes. These options provide design flex-  
ibility that allow the IC to cover a wide range of applica-  
tions and use cases while minimizing board space.  
● UVLO, Soft-Start, Active-Output Discharge,  
Overcurrent, and Thermal Shutdown Protections  
● 1.61mm x 2.01mm, 12-Bump WLP  
● 2.5mm x 2.5mm, 14-Lead FC2QFN  
Ordering Information appears at end of data sheet.  
The MAX77827 is available in a 1.61mm x 2.01mm,  
12-bump wafer-level package (WLP), and a 2.5mm x  
2.5mm, 14-lead FC2QFN package.  
Applications  
● 1-Cell Li+ Battery Powered Equipment  
● Smartphones/Portable/Wearables  
● Internet of Things (IoT) Devices  
● LPWAN (LTE/NB-IoT, LTE/Cat-M1)  
Simplified Block Diagram  
L
1μH  
2
14.52mm SOLUTION SIZE  
1.8V TO 5.5V  
DC SOURCE  
LX1  
LX2  
IN  
OUT  
V
OUT  
C
22μF  
C
10μF  
OUT  
IN  
2.3V TO 5.3V  
MAX77827  
OUTS  
FPWM  
POK  
FPWM ENABLE  
POWER-OK  
ENABLE  
EN  
L
2012  
BIAS  
SEL  
C
BIAS  
4.00mm  
1μF  
*
AGND  
PGND  
R
SEL  
*CHOOSE R  
VALUE BASED ON VOUT, SEE TABLE 2  
SEL  
19-100546; Rev 5; 8/21  
 
 
 
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
TABLE OF CONTENTS  
General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Benefits and Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Simplified Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
12 WLP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
14 FC2QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Typical Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
12 WLP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
14 FC2QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Functional Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Function Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Start Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Immediate Shutdown Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Power Down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Buck-Boost Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Buck-Boost Control Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Output Voltage Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
FPWM Mode Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Power-OK (POK) Indicator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Protection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Undervoltage Lockout (UVLO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Soft-Start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Output Active Discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Overcurrent Protection (OCP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Applications Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Inductor Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Input Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Output Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
PCB Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
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Maxim Integrated | 2  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
TABLE OF CONTENTS (CONTINUED)  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
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Maxim Integrated | 3  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
LIST OF FIGURES  
Figure 1. Start-Up Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Figure 2. Buck-Boost H-Bridge Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Figure 3. Short-Circuit Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Figure 4. PCB Layout Example (WLP—B and D Options) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Figure 5. PCB Layout Example (FC2QFN—B and D Options) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
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Maxim Integrated | 4  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
LIST OF TABLES  
Table 1. I  
Levels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
LIM  
Table 2. R  
Selection Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
SEL  
Table 3. Inductor Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
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Maxim Integrated | 5  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Absolute Maximum Ratings  
IN, OUT, BIAS to PGND........................................... -0.3V to +6V  
Maximum Junction Temperature ......................................+150°C  
Storage Temperature Range ..............................-65°C to +150°C  
Soldering Temperature (reflow) ........................................+260°C  
Continuous Power Dissipation  
PGND to AGND..................................................... -0.3V to +0.3V  
EN, SEL, FPWM, POK to AGND................-0.3V to V  
FB to AGND................................................ -0.3V to V  
+ 0.3V  
+ 0.3V  
BIAS  
OUT  
LX1 to PGND......................................................... -0.3V to +6.0V  
LX2 to PGND......................................................... -0.3V to +6.0V  
IN, LX1, LX2, OUT Continuous RMS current ....................... 1.6A  
Operating Junction Temperature Range ............-40°C to +125°C  
WLP Package (T = +70°C, derate 13.73mW/°C above  
+70°C)......................................................................1098.4mW  
A
FC2QFN Package (T = +70°C, derate 15.77mW/°C above  
A
+70°C)......................................................................1261.8mW  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the  
device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect device reliability.  
Package Information  
12 WLP  
Package Code  
W121H2+1  
Outline Number  
21-100302  
Land Pattern Number  
Thermal Resistance, Four-Layer Board:  
Refer to Application Note 1891  
Junction to Ambient (θ  
)
72.82 C°/W  
N/A  
JA  
Junction to Case (θ  
)
JC  
14 FC2QFN  
Package Code  
Outline Number  
F142A2F+1  
21-100382  
90-100127  
Land Pattern Number  
Thermal Resistance, Four-Layer Board:  
Junction to Ambient (θ  
)
63.4°C/W  
N/A  
JA  
Junction to Case (θ  
)
JC  
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates  
RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.  
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal  
considerations, refer to www.maximintegrated.com/thermal-tutorial.  
www.maximintegrated.com  
Maxim Integrated | 6  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Electrical Characteristics  
(V = 3.8V, V  
IN  
= 3.3V, typicals are at T ≈ T = +25°C. Limits are 100% production tested at T = +25°C. Limits over the operating  
OUT  
A J J  
temperature range (T = -40°C to +125°C) are guaranteed by design and characterization, unless otherwise noted.)  
J
PARAMETER  
GENERAL  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
For A and D options  
For B and C options  
EN = Low, T = +25°C  
1.8  
2.6  
5.5  
5.5  
2
Input Voltage Range  
V
V
IN  
0.1  
3
Shutdown Supply  
Current  
J
I
µA  
SHDN  
EN = Low, T = -40°C to +125°C (Note 2)  
J
8
I
SKIP mode, no switching  
6
14  
6
µA  
Q_SKIP  
Input Supply Current  
I
FPWM mode, no load, no switching  
2
mA  
Q_PWM  
Active Discharge  
Resistance  
R
100  
165  
Ω
DISCHG  
Thermal Shutdown  
H-BRIDGE  
T
Rising, +20°C hysteresis  
°C  
SHDN  
Output Voltage Range  
V
External resistor programmable  
2.3  
-1  
5.3  
+1  
V
OUT  
PWM mode, T = +25°C  
J
V
Output Voltage  
Accuracy  
OUT_ACC1  
OUT_ACC2  
PWM mode, T = -40°C to +125°C  
-2  
+2  
%
J
V
SKIP mode, no load, T = +25°C  
-1  
+4.5  
J
V
V
= 1.8V to 5.5V (for A and D options)  
= 2.6V to 5.5V (for B and C options)  
0.4  
0.4  
IN  
Line Regulation  
Load Regulation  
%/V  
%/A  
IN  
Note 1  
0.25  
I
= 0.5A, V changes from 3.4V to  
OUT  
IN  
Line Transient  
Response  
V
V
/V  
2.9V in 25µs (20mV/µs), L = 1µH,  
C
50  
mV  
mV  
OS1 US1  
= 8µF (Note 1)  
OUT_NOM  
I
changes from 10mA to 0.5A in  
OUT  
Load Transient  
Response  
/V  
15µs, L = 1µH, C  
1)  
= 8µF (Note  
250  
OS2 US2  
OUT_NOM  
T = -40°C to +125°C, for A and C  
J
options  
2.5  
1.3  
10  
3.1  
1.8  
3.7  
2.3  
LX1/2 Current Limit  
I
A
LIM_LX  
T = -40°C to +125°C, for B and D  
J
options  
High-Side PMOS On  
Resistance  
R
I
= 100mA per switch  
= 100mA per switch  
130  
110  
mΩ  
mΩ  
DSON_P  
LX  
LX  
Low-Side NMOS On  
Resistance  
R
I
15  
DSON_N  
PWM mode, T = +25°C  
2.25  
2.2  
2.5  
2.5  
2.75  
2.8  
J
Switching Frequency  
f
MHz  
SW  
PWM mode, T = -40°C to +125°C  
J
From EN asserting to SEL detection  
(Note 2)  
Turn-On Delay Time  
SEL Detection Time  
t
100  
600  
µs  
µs  
ON_DLY  
After turn-on delay to LX switching (Note  
2)  
t
SEL  
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Maxim Integrated | 7  
 
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Electrical Characteristics (continued)  
(V = 3.8V, V  
IN  
= 3.3V, typicals are at T ≈ T = +25°C. Limits are 100% production tested at T = +25°C. Limits over the operating  
OUT  
A J J  
temperature range (T = -40°C to +125°C) are guaranteed by design and characterization, unless otherwise noted.)  
J
PARAMETER  
SYMBOL  
CONDITIONS  
= 10mA (Note  
MIN  
TYP  
MAX  
UNITS  
I
OUT  
1), for B and D  
options  
1500  
After SEL detection  
to soft-start timer  
finish  
Soft-Start Time  
t
µs  
SS  
I
= 10mA (Note  
OUT  
1), for A and C  
options  
200  
Minimum Effective  
Output Capacitance  
C
V
0A < I  
< 1A  
OUT  
8
µF  
µA  
EFF_MIN  
LX1, LX2 Leakage  
Current  
V
LX1/2  
= 0V or 5.5V, V  
= 5.5V, V  
=
IN  
OUT  
I
0.1  
2
LK_85  
5.5V, T = +85°C  
J
SYS rising, options B and C  
SYS rising, options A and D  
2.4  
1.70  
1.9  
2.5  
2.6  
1.80  
2.2  
UVLO_R  
1.75  
2.05  
1.68  
SYS Undervoltage-  
Lockout Threshold  
V
SYS falling, options B and C  
SYS falling, options A and D  
V
UVLO_F  
1.62  
1.74  
ENABLE INPUT (EN)  
EN Logic-Low Threshold  
V
0.4  
V
V
EN_L  
EN Logic-High  
Threshold  
V
EN_H  
1.3  
FPWM INPUT  
FPWM Logic-Low  
Threshold  
V
0.4  
V
V
IL  
FPWM Logic-High  
Threshold  
V
IH  
1.3  
FPWM Internal  
Pulldown Resistance  
R
PD  
Pulldown resistor to GND  
400  
800  
1600  
kΩ  
POK OUTPUT  
POK Output Low  
Voltage  
V
I
= 1mA  
0.4  
+1  
V
POK_L  
SINK  
POK Output High  
Leakage  
I
T = +25°C  
-1  
µA  
POK_25C  
J
V
of V  
rising, expressed as a percentage  
OUT  
I
92.5  
90  
POK_R  
OUT  
POK Threshold  
%
V
OUT  
falling, expressed as a percentage  
I
POK_F  
of V  
OUT  
Note 1: Guaranteed by ATE characterization. Not directly tested in production.  
Note 2: Guaranteed by design. Production tested through scan.  
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Maxim Integrated | 8  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Typical Operating Characteristics  
(V = 3.8V, V  
= 3.3V, L = 1μH (Coilcraft XAL4020-102ME), Skip Mode, I  
= 1.8A, T = +25°C, unless otherwise noted.)  
LIM_LX A  
IN  
OUT  
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Maxim Integrated | 9  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Typical Operating Characteristics (continued)  
(V = 3.8V, V  
= 3.3V, L = 1μH (Coilcraft XAL4020-102ME), Skip Mode, I  
= 1.8A, T = +25°C, unless otherwise noted.)  
LIM_LX A  
IN  
OUT  
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Maxim Integrated | 10  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Typical Operating Characteristics (continued)  
(V = 3.8V, V  
= 3.3V, L = 1μH (Coilcraft XAL4020-102ME), Skip Mode, I  
= 1.8A, T = +25°C, unless otherwise noted.)  
LIM_LX A  
IN  
OUT  
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Maxim Integrated | 11  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Pin Configurations  
12 WLP  
TOP VIEW  
(BUMP SIDE DOWN)  
MAX77827  
1
2
3
4
+
A
B
C
LX1  
PGND  
LX2  
IN  
BIAS  
AGND  
FPWM  
OUT  
POK  
SEL  
EN  
OUTS  
12 WLP  
(1.61mm x 2.01mm, 0.4mm PITCH)  
14 FC2QFN  
TOP VIEW  
+
14  
13  
11  
12  
10 LX2  
SEL  
1
2
3
9
8
POK  
EN  
PGND  
LX1  
MAX77827  
7
5
6
4
14 FC2QFN  
(2.5mm x 2.5mm x 0.55mm PITCH)  
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Maxim Integrated | 12  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Pin Description  
PIN  
NAME  
FUNCTION  
TYPE  
12 WLP  
A1  
14 FC2QFN  
8
6, 7  
5
LX1  
IN  
Switching Node 1  
Power  
A2  
Input. Bypass to PGND with a 10V 10μF capacitor.  
Internal Bias. Bypass to PGND with a 10V 1μF capacitor.  
Analog Ground  
Power  
Analog  
Ground  
Ground  
A3  
BIAS  
AGND  
PGND  
FPWM  
POK  
SEL  
A4  
4
B1  
9
Power Ground  
B2  
14  
2
FPWM Mode Selection (active-high)  
Power-OK Open-Drain Output (active-high)  
Select the output voltage with resistor (see Table 2).  
Switching Node 2  
Digital Input  
Digital Output  
Analog  
B3  
B4  
1
C1  
10  
11, 12  
13  
3
LX2  
Power  
C2  
OUT  
OUTS  
EN  
Output. Bypass to PGND with a 10V 22μF capacitor.  
Output Sense  
Power  
C3  
Analog  
C4  
Enable Pin  
Digital Input  
Functional Diagrams  
Function Diagram  
LX1  
LX2  
IN  
OUT  
CS1  
CS2  
CS2  
UVLO  
ILIM_PEAK  
OCP  
BIAS  
PGND  
OUT  
MAX77827  
ACTIVE  
DISCHARGE  
LOGIC  
CONTROL  
EN  
FPWM  
OUTS  
POK  
SLOPE  
COMPENSATION  
POK  
TSHDN  
CS1/CS2  
COMP  
TARGET  
OUTPUT  
SELECTOR  
EAMP  
SOFT-  
START  
SEL  
REF  
AGND  
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Maxim Integrated | 13  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Detailed Description  
Start Up  
When the EN pin is set to high, the IC turns on the internal bias circuitry which takes typically 100µs (t  
) to settle.  
ON_DLY  
After the internal bias circuitry is settled, the controller senses the SEL pin resistance to set the reference voltage. The  
R
reading takes about 600µs (typ). After the IC reads the R value, it begins the soft-start process. During the  
SEL  
SEL  
soft-start process, the IC lowers the I  
level from normal I  
level and ramps the output voltage. This prevents the  
LIM  
LIM  
buck-boost from drawing too much current from the input supply during start up. The soft-start process takes 1.5ms (typ)  
for options B and D, and takes 200µs (typ) for options A and C.  
EN  
V
OUT  
T
T
T
SS  
ON_DLY  
SEL  
ILIM  
ILIM_SS  
I
L
Figure 1. Start-Up Waveform  
The buck-boost is in FPWM mode for the entire duration of T . Current limit during soft-start (I  
) increases to I  
SS  
LIM_SS  
LIM  
LIM  
after approximately half of T . See Table 1 for a list of parts with their respective soft-start and normal operation I  
SS  
levels.  
Table 1. I  
Levels  
LIM  
PART NUMBER  
I
(A)  
I
(A)  
LIM  
LIM_SS  
MAX77827BEWC+T, MAX77827BEFD+T, MAX77827DEWC+T, MAX77827DEFD+T  
MAX77827AEWC+T, MAX77827AEFD+T, MAX77827CEWC+T, MAX77827CEFD+T  
1.15  
1.8  
3.1  
1.8  
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Maxim Integrated | 14  
 
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Immediate Shutdown Conditions  
The following events immediately shutdown the buck-boost:  
● Thermal Protection (T > +165°C)  
J
● V  
< SYS UVLO Falling Threshold (V  
)
UVLO_F  
SYS  
The events in this category shutdown the output until fault conditions are removed from the system.  
Power Down  
When EN pin is set to low, the IC stops switching and turns on the discharge switches until the output is discharged.  
Buck-Boost Regulator  
The IC buck-boost regulator utilizes a four-switch H-bridge configuration to realize buck and boost operating modes. This  
topology maintains output voltage regulation when the input voltage is greater than, equal to, or less than the output  
voltage. The buck-boost is ideal in one-cell Li-ion battery powered applications and two-cell Alkaline battery powered  
applications, providing 2.3V to 5.3V of output voltage range. High-switching frequency and a unique control algorithm  
allow for the smallest solution size, low output noise, and the highest-efficiency across a wide input voltage and output  
current range.  
Buck-Boost Control Scheme  
The buck-boost converter operates using a 2.5MHz fixed-frequency pulse-width modulated (PWM) control scheme with  
current-mode compensation. The buck-boost utilizes an H-bridge topology using a single inductor and output capacitor.  
The H-bridge topology has three switching phases. See Figure 2 for details.  
● Φ1 Switch period (Phase 1: HS1 = ON, LS2 = ON) stores energy in the inductor. Inductor current ramps up at a rate  
proportional to the input voltage divided by inductance: V /L.  
IN  
● Φ2 Switch period (Phase 2: HS1 = ON, HS2 = ON) ramps inductor current up or down depending on the differential  
voltage across the inductor: (V – V  
)/L.  
IN  
OUT  
● Φ3 Switch period (Phase 3: LS1 = ON, HS2 = ON) ramps inductor current down at a rate proportional to the output  
voltage divided by inductance: (-V /L).  
OUT  
Boost operation (V < V  
) utilizes phase 1 and phase 2 within a single clock period. See the representation of inductor  
IN  
OUT  
current waveform for boost mode operation in Figure 2.  
Buck operation (V > V ) utilizes phase 2 and phase 3 within a single clock period. See the representation of inductor  
IN  
OUT  
current waveform for buck mode operation in Figure 2.  
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Maxim Integrated | 15  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
BUCK-BOOST H-BRIDGE  
BUCK OPERATION  
TOPOLOGY  
Ф2  
Ф2  
IN  
OUT  
Ф3  
Ф3  
TSW  
TSW  
Ф2  
HS1  
HS2  
CHARGE/DISCHARGE L  
CLK  
CLK  
CLK  
BOOST OPERATION  
L
Ф3  
Ф1  
CHARGE L  
Ф1  
Ф2  
Ф1  
Ф2  
LS1  
LS2  
DISCHARGE L  
TSW  
TSW  
CLK  
CLK  
CLK  
Figure 2. Buck-Boost H-Bridge Topology  
Output Voltage Configuration  
The IC allows a SEL pin to configure the output voltage. Resistors with 1% tolerance (or better) should be chosen, with  
nominal values specified in Table 2.  
Table 2. R  
Selection Table  
SEL  
R
SEL  
(kΩ)  
V
(V)  
OUT  
909  
2.3  
768  
634  
536  
452  
383  
324  
267  
191  
133  
113  
95.3  
80.6  
66.5  
2.4  
2.5  
2.6  
2.7  
2.8  
2.8  
2.85  
2.9  
3
3
3.1  
3.15  
3.15  
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Maxim Integrated | 16  
 
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Table 2. R  
Selection Table (continued)  
SEL  
R
SEL  
(kΩ)  
V
(V)  
OUT  
56.2  
Open  
3.2  
3.3  
3.3  
3.4  
Short to GND  
47.5  
40.2  
34  
3.45  
3.5  
3.6  
3.7  
3.75  
3.8  
3.9  
4
28  
23.7  
20  
16.9  
14  
11.8  
10  
4.1  
4.2  
4.4  
4.5  
5
8.45  
7.15  
5.9  
4.99  
226  
5.2  
5.3  
162  
FPWM Mode Enable  
The IC automatically defaults to SKIP mode operation at no load and light load conditions. Transition from skip mode  
to PWM occurs when load current increases past a certain threshold. Another way to enable PWM operation is by  
connecting the FPWM pin to logic HIGH level. This forces PWM mode (FPWM) regardless of load current at the output.  
FPWM mode benefits applications where the lowest output ripple is required, whereas skip mode helps maximize the  
buck-boost regulator’s efficiency at light loads.  
Power-OK (POK) Indicator  
The device features an open-drain POK output to monitor the output voltage. The POK pin requires an external pull-  
up resistor and goes high (high-impedance) after the output increases above 92.5% (typ) of the target output voltage  
(V  
). The POK pin goes low when the regulator output drops below 90% (typ) of V  
.
OUT_TARGET  
OUT_TARGET  
Protection Features  
Undervoltage Lockout (UVLO)  
The device supports a UVLO feature that prevents operation in abnormal input voltage conditions when V falls below  
IN  
the V  
the V  
threshold. Regardless of the EN pin status, the device disables until the input voltage V rises above  
IN_UVLO_F  
IN_UVLO_R  
IN  
threshold.  
Soft-Start  
The IC is equipped with a soft-start feature to limit large input-current draw from the system supply during device start-up.  
During the soft-start time, the IC lowers the switching current-limit level from normal level and operates in FPWM mode.  
See Table 1 for the I  
levels of each part number.  
LIM  
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Maxim Integrated | 17  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Output Active Discharge  
The buck-boost provides an internal 100Ω switch for output active discharge function. The internal switch provides a path  
to discharge the energy stored in the output capacitor to PGND whenever the regulator is disabled. While the regulator  
remains enabled, the internal switch is disconnected from the output.  
Overcurrent Protection (OCP)  
The device features a robust switching current-limit scheme that protects the device and the inductor during overload and  
fast transient conditions. The current-sense circuit takes current information from the high-side MOSFETs to determine  
the peak-switching current (R  
x I ).  
DS(ON)  
L
The IC provides two different cycle-by-cycle current limit levels (1.8A (typ) and 3.1A (typ)) for the high-side MOSFET. If  
the switching current (I ) hits current limit for about 3ms, the IC shuts off the output for about 12ms, retries, and repeats  
LIM  
this cycle until the over-current condition is removed from the system.  
SHORT  
CIRCUIT  
V
OUT  
3ms  
3ms  
I
LIM  
I
L
12ms  
Figure 3. Short-Circuit Waveform  
Thermal Shutdown  
The device has an internal thermal-protection circuit which monitors die temperature. The buck-boost disables if the  
die temperature exceeds T  
approximately +20°C.  
(+165°C typ). The buck-boost enables again after the die temperature cools by  
SHDN  
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Maxim Integrated | 18  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Applications Information  
Inductor Selection  
Buck-boost is optimized for a 1µH inductance. The lower the inductor DCR, the higher the buck-boost efficiency. Users  
need to trade off inductor size with DCR value and choose a suitable inductor for the buck-boost.  
The saturation current of the inductor should be higher than the maximum switching current limit to avoid inductor  
saturation during operation. See the Electrical Characteristics table specifications for the maximum I  
of each IC option.  
LIM  
Table 3 lists recommended inductors for the IC. Always choose the inductor carefully by consulting the manufacturer’s  
latest released data sheet.  
Table 3. Inductor Recommendations  
CURRENT  
NOMINAL  
INDUCTANCE RESISTANCE  
TYPICAL DC  
CURRENT  
RATING (A)  
-30 (ΔL/L)  
RATING  
(A)  
ΔT = 40°C  
RISE  
DIMENSIONS  
L x W x H  
(mm)  
MFGR.  
SERIES  
OPTIONS  
(µH)  
(mΩ)  
Murata  
DFE18SBN1R0ME0  
1.0  
1.0  
120  
38  
3.1  
4.5  
2.4  
4.3  
1.6 x 0.8 x 0.8  
B, D  
Samsung CIGT201610EH1R0MNE  
2.0 x 1.6 x 1.0 A, B, C, D  
Taiyo-  
MEKK2016H1R0M  
Yuden  
1.0  
41  
4.5  
3.7  
2.0 x 1.6 x 1.0 A, B, C, D  
Cyntec  
HTEH20120H-1R0MSR  
1.0  
1.0  
1.0  
1.0  
45  
26  
26  
13  
3.8  
5.0  
8.7  
8.7  
3.5  
4.3  
9.6  
9.6  
2.0 x 1.2 x 0.8 A, B, C, D  
2.5 x 2.0 x 1.0 A, B, C, D  
4.3 x 4.3 x 2.1 A, B, C, D  
4.0 x 4.0 x 2.1 A, B, C, D  
Samsung CIGT252010EH1R0MNE  
Sumida CDMT40D20HF-1R0NC  
Coilcraft XAL4020-102MEB  
Input Capacitor Selection  
The input capacitor, C , reduces the current peaks drawn from the battery or input power source and reduces switching  
IN  
noise in the device. The impedance of C at the switching frequency should be kept very low. Ceramic capacitors with  
IN  
X5R or X7R dielectrics are highly recommended due to their small size, low ESR, and small temperature coefficients.  
For most applications, a 10V 10µF capacitor is sufficient.  
Output Capacitor Selection  
The output capacitor, C  
, is required to keep the output-voltage ripple small and to ensure regulation loop stability.  
OUT  
C
must have low impedance at the switching frequency. Ceramic capacitors with X5R or X7R dielectric are highly  
OUT  
recommended due to their small size, low ESR, and small temperature coefficients. For stable operation, the buck-boost  
requires 8µF of minimum effective output capacitance. Considering DC bias characteristic of ceramic capacitors, a 10V  
22µF capacitor is recommended for most applications.  
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Maxim Integrated | 19  
 
 
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
PCB Layout Guidelines  
Careful circuit board layout is critical to achieve low switching power losses and clean, stable operation. Figure 5 shows  
an example PCB layout for the MAX77827 FC2QFN package. For the WLP package, a high density interconnect (HDI)  
PCB is required. Figure 4 shows an example HDI PCB layout for the MAX77827 WLP package.  
When designing the PCB, follow these guidelines:  
1. Place the input capacitors C and output capacitors C  
immediately next to the IN pin and OUT pin, respectively,  
IN  
OUT  
of the IC. Since the IC operates at a high switching frequency, this placement is critical for minimizing parasitic  
inductance within the input and output current loops, which can cause high voltage spikes and can damage the  
internal switching MOSFETs.  
2. Place the inductor next to the LX bumps/pins (as close as possible) and make the traces between the LX bumps/pins  
and the inductor short and wide to minimize PCB trace impedance. Excessive PCB impedance reduces converter  
efficiency. When routing LX traces on a separate layer (as in the examples), make sure to include enough vias to  
minimize trace impedance. Routing LX traces on multiple layers is recommended to further reduce trace impedance.  
Furthermore, do not allow LX traces to take up an excessive amount of area. The voltage on this node switches very  
quickly and additional area creates more radiated emissions.  
3. Prioritize the low-impedance ground plane of the PCB directly underneath the IC, C  
Cutting this ground plane risks interrupting the switching current loops.  
, C , and the inductor.  
OUT  
IN  
4. AGND must carefully connect to PGND on the PCBs low-impedance ground plane. Connect AGND to the low-  
impedance ground plane on the PCB (the same net as PGND) away from any critical loops.  
5. The IC requires a supply input (BIAS) which is often the same net as IN. Carefully bypass BIAS to PGND with a  
dedicated capacitor (C  
) as close as possible to the IC. Route a dedicated trace between C  
and the BIAS  
BIAS  
BIAS  
bump/pin. Avoid connecting BIAS directly to the nearest IN bumps/pins without dedicated bypassing.  
6. Connect the OUTS bump/pin to the regulating point with a dedicated trace away from noisy nets such as LX1 and  
LX2.  
7. Keep the power traces and load connections short and wide. This is essential for high converter efficiency.  
8. Do not neglect ceramic capacitor DC voltage derating. Choose capacitor values and case sizes carefully. See the  
Output Capacitor Selection section and refer to Tutorial 5527 for more information.  
RSEL  
0402  
AGND  
LEGEND  
EN  
FPWM  
0805 (2012)  
IN  
OUT  
0603  
0402  
HDI µVIA  
L
2012  
6 mil hole, 12 mil pad  
LX1  
LX2  
COMPONENT SIZES LISTED IN  
IMPERIAL (METRIC)  
NOTE: PLACE C AND C  
CLOSE TO THE IC TO MINIMIZE  
OUT  
IN  
PARASITIC INDUCTANCE WITHIN THE LOOP  
Figure 4. PCB Layout Example (WLP—B and D Options)  
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Maxim Integrated | 20  
 
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
AGND  
RSEL  
0402  
LEGEND  
OUT  
0805 (2012)  
IN  
0603  
0402  
NON-HDI VIA  
8 mil hole, 18 mil pad  
COMPONENT SIZES LISTED IN  
IMPERIAL (METRIC)  
L
2012  
LX2  
LX1  
NOTE: PLACE C AND C  
CLOSE TO THE IC TO MINIMIZE  
OUT  
IN  
PARASITIC INDUCTANCE WITHIN THE LOOP  
Figure 5. PCB Layout Example (FC2QFN—B and D Options)  
Typical Application Circuits  
Typical Application Circuit  
L
1μH  
LX1  
LX2  
1.8V TO 5.5V  
DC SOURCE  
IN  
OUT  
V
OUT  
C
22μF  
C
IN  
OUT  
2.3V TO 5.3V  
10μF  
MAX77827  
OUTS  
FPWM  
POK  
FPWM ENABLE  
POWER-OK  
ENABLE  
EN  
BIAS  
SEL  
C
BIAS  
1μF  
*
R
SEL  
AGND  
PGND  
*CHOOSE R  
VALUE BASED ON V , SEE TABLE 2  
OUT  
SEL  
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Maxim Integrated | 21  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Ordering Information  
PART NUMBER  
TYP I  
(A)  
UVLO RISING MAX (V)  
PIN-PACKAGE  
12 WLP  
LIM  
MAX77827AEWC+T  
MAX77827BEWC+T  
MAX77827CEWC+T  
MAX77827DEWC+T  
MAX77827AEFD+T  
MAX77827BEFD+T  
MAX77827CEFD+T  
MAX77827DEFD+T  
3.1  
1.8  
2.6  
2.6  
1.8  
1.8  
2.6  
2.6  
1.8  
1.8  
3.1  
1.8  
3.1  
1.8  
3.1  
1.8  
12 WLP  
12 WLP  
12 WLP  
14 FC2QFN  
14 FC2QFN  
14 FC2QFN  
14 FC2QFN  
+Denotes a lead(Pb)-free/RoHS-compliant package.  
T = Tape and reel.  
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Maxim Integrated | 22  
MAX77827  
5.5V Input, 1.8A/3.1A Switch Buck-Boost  
Converter with 6μA I  
Q
Revision History  
REVISION REVISION  
PAGES  
CHANGED  
DESCRIPTION  
NUMBER  
DATE  
4/19  
5/19  
6/19  
0
1
2
Initial release  
22  
22  
Updated Ordering Information table  
Updated Ordering Information table  
Updated General Description, Applications, Benefits and Features, and Package  
Information sections, replaced all Typical Operating Characteristics and FC2QFN  
Pin Configuration, updated Pin Description table, Table 1, Figure 2, and Table 3,  
replaced PCB Layout Guidelines section, updated Ordering Information table  
1, 6, 9–13, 15,  
17, 20–22  
3
10/19  
Updated Electrical Characteristics table, Start Up section, Table 1, Table 3, and  
Ordering Information table  
4
5
3/20  
8/21  
7, 8, 15, 20, 23  
16, 17  
Updated Table 2  
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Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent  
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max  
limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.  
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© 2021 Maxim Integrated Products, Inc.  

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