MAX9172ESA+T [MAXIM]

Line Receiver, 2 Func, 2 Rcvr, CMOS, PDSO8, MS-012AA, SOIC-8;
MAX9172ESA+T
型号: MAX9172ESA+T
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

Line Receiver, 2 Func, 2 Rcvr, CMOS, PDSO8, MS-012AA, SOIC-8

光电二极管 接口集成电路
文件: 总11页 (文件大小:220K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
19-2578; Rev 0; 10/02  
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
General Description  
Features  
The MAX9171/MAX9172 single/dual low-voltage differential  
signaling (LVDS) receivers are designed for high-speed  
applications requiring minimum power consumption,  
space, and noise. Both devices support switching rates  
exceeding 500Mbps while operating from a single 3.3V  
supply.  
Input Accepts LVDS and LVPECL  
In-Path Fail-Safe Circuit  
Space-Saving 8-Pin QFN and SOT23 Packages  
Fail-Safe Circuitry Sets Output High for Open,  
Undriven Shorted, or Undriven Terminated Output  
The MAX9171 is a single LVDS receiver and the  
MAX9172 is a dual LVDS receiver. Both devices con-  
form to the ANSI TIA/EIA-644 LVDS standard and con-  
vert LVDS to LVTTL/LVCMOS-compatible outputs. A  
fail-safe feature sets the outputs high when the inputs  
are undriven and open, terminated, or shorted. The  
MAX9171/MAX9172 are available in 8-pin SO packages  
and space-saving thin QFN and SOT23 packages.  
Flow-Through Pinout Simplifies PC Board Layout  
Guaranteed 500Mbps Data Rate  
Second Source to DS90LV018A and DS90LV028A  
(SO Packages Only)  
Conforms to ANSI TIA/EIA-644 Standard  
3.3V Supply Voltage  
For lower skew devices, refer to the MAX9111/ MAX9113  
data sheet.  
-40°C to +85°C Operating Temperature Range  
Low Power Dissipation  
Applications  
Multipoint Backplane Interconnect  
Ordering Information  
Laser Printers  
PIN-  
PACKAGE  
TOP  
MARK  
Digital Copiers  
PART  
TEMP RANGE  
Cellular Phone Base Stations  
LCD Displays  
MAX9171EKA-T  
MAX9171ESA  
MAX9171ETA*  
MAX9172EKA-T  
MAX9172ESA  
MAX9172ETA*  
-40°C to +85°C 8 SOT23-8  
-40°C to +85°C 8 SO  
AALX  
Network Switches/Routers  
Clock Distribution  
-40°C to +85°C 8 Thin QFN  
-40°C to +85°C 8 SOT23-8  
-40°C to +85°C 8 SO  
AALY  
-40°C to +85°C 8 Thin QFN  
*Future product—contact factory for availability.  
Pin Configurations  
MAX9171  
MAX9171  
MAX9172  
MAX9172  
V
V
IN-  
IN+  
1
2
3
4
CC  
1
2
3
4
8
7
6
5
1
2
3
4
1
2
3
4
V
IN1-  
IN1+  
IN2+  
IN2-  
8
7
6
5
IN-  
IN1-  
IN1+  
IN2+  
IN2-  
8
7
6
5
V
8
7
6
5
CC  
CC  
CC  
OUT  
N.C.  
GND  
GND  
OUT  
N.C.  
IN+  
GND  
OUT1  
OUT2  
OUT1  
OUT2  
GND  
N.C.  
N.C.  
N.C.  
N.C.  
SOT23  
SO/QFN*  
SO/QFN*  
SOT23  
________________________________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
ABSOLUTE MAXIMUM RATINGS  
CC  
IN_+, IN_- to GND .................................................-0.3V to +4.0V  
OUT_ to GND ............................................-0.3V to (V + 0.3V)  
V
to GND...........................................................-0.3V to +4.0V  
Operating Temperature Range ..........................-40°C to +85°C  
Junction Temperature .....................................................+150°C  
Storage Temperature Range ............................-65°C to +150°C  
ESD Protection  
CC  
Continuous Power Dissipation (T = +70°C)  
A
8-Pin SOT23 (derate 8.9mW/°C above +70°C) ...........714mW  
8-Pin SO (derate 5.9mW/°C above +70°C) .................471mW  
8-Pin QFN (derate 24.4mW/°C above +70°C) ..........1951mW  
Human Body Model (IN_+, IN_-) ................................... 13kV  
Lead Temperature (soldering, 10s) ................................+300°C  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(V  
= 3.0V to 3.6V, differential input voltage |V | = 0.1V to 1.2V, receiver input voltage = 0 to V , common-mode voltage V  
=
CC  
ID  
CC  
CM  
|V /2| to (V  
ID  
- |V /2|), T = -40°C to +85°C, unless otherwise noted. Typical values are at V  
= 3.3V, |V | = 0.2V, V  
= 1.2V,  
CC  
ID  
A
CC  
ID  
CM  
T
A
= +25°C.) (Notes 1, 2)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
LVDS INPUTS (IN_+, IN_-)  
Differential Input High Threshold  
Differential Input Low Threshold  
Input Current (Noninverting Input)  
V
Figure 1  
Figure 1  
Figure 1  
-40  
-40  
-2.1  
0
mV  
mV  
µA  
TH  
V
-100  
+0.5  
TL  
I
-5.0  
+0.5  
+10.0  
+0.5  
IN+  
Power-Off Input Current  
(Noninverting Input)  
V
= 0 to 3.6V, V = 0 to 3.6V, V  
= 0  
= 0  
IN+  
IN-  
CC  
I
-0.5  
-0.5  
-0.5  
0
+4.4  
0
µA  
µA  
µA  
IN+OFF  
or open (Figure 1)  
Input Current (Inverting Input)  
I
IN-  
Figure 1  
Power-Off Input Current  
(Inverting Input)  
V
= 0 to 3.6V, V = 0 to 3.6V, V  
IN+ IN-  
CC  
I
IN-OFF  
or open (Figure 1)  
LVCMOS/LVTTL OUTPUTS (OUT_)  
Open, undriven short, or  
undriven parallel termination  
2.7  
2.7  
3.2  
Output High Voltage  
V
I
I
= -4.0mA  
V
OH  
OH  
OL  
V
= 0V  
3.2  
0.1  
ID  
Output Low Voltage  
Output Short-Circuit Current  
POWER SUPPLY  
V
= 4.0mA, V = -100mV  
0.4  
V
OL  
ID  
I
V
= 0 (Note 3)  
-45  
-77  
-120  
mA  
OS  
OUT_  
MAX9171  
MAX9172  
3.6  
7.0  
6
9
Supply Current  
I
Inputs open  
mA  
CC  
2
_______________________________________________________________________________________  
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
SWITCHING CHARACTERISTICS  
(V  
= 3.0V to 3.6V, C = 15pF, |V | = 0.2V, V  
= 1.2V, T = -40°C to +85°C, unless otherwise noted. Typical values are at V  
CC  
=
CC  
L
ID  
CM  
A
3.3V, T = +25°C.) (Notes 4, 5, 6)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Differential Propagation Delay  
High to Low  
t
t
t
t
Figures 2, 3  
1.0  
1.65  
2.5  
ns  
PHLD  
PLHD  
SKD1  
SKD2  
Differential Propagation Delay  
Low to High  
Figures 2, 3  
1.0  
1.62  
30  
2.5  
400  
500  
ns  
ps  
ps  
ns  
Differential Pulse Skew  
Figures 2, 3 (Note 7)  
Figures 2, 3 (Note 8)  
|t  
- t  
|
PHLD PLHD  
Differential Channel-to-Channel  
Skew (MAX9172)  
40  
t
t
Figures 2, 3 (Note 9)  
Figures 2, 3 (Note 10)  
Figures 2, 3  
1
SKD3  
SKD4  
Differential Part-to-Part Skew  
1.5  
0.8  
0.8  
Rise Time  
Fall Time  
t
t
0.55  
0.51  
ns  
ps  
TLH  
THL  
Figures 2, 3  
All channels switching, V  
= 0.4V,  
OL(MAX)  
Maximum Operating Frequency  
f
250  
300  
MHz  
MAX  
V
= 2.7V, 40% < duty cycle < 60%  
OH(MIN)  
Note 1: Current into a pin is defined as positive. Current out of a pin is defined as negative. All voltages are referenced to GND  
except V , V , and V  
.
ID  
TH TL  
Note 2: All devices are 100% production tested at T = +25°C and are guaranteed by design for T = -40°C to +85°C, as specified.  
A
A
Note 3: Short only one output at a time. Do not exceed the absolute maximum junction temperature specification.  
Note 4: AC parameters are guaranteed by design and not production tested.  
Note 5: C includes scope probe and test jig capacitance.  
L
Note 6: Pulse generator output conditions: t = t < 1ns (0% to 100%), frequency = 250MHz, 50% duty cycle, V  
= 1.3V, V = 1.1V.  
OL  
R
F
OH  
Note 7: t  
Note 8: t  
is the magnitude of the difference of differential propagation delays in a channel. t  
= |t  
- t  
|.  
SKD1  
SKD2  
SKD1  
PHLD PLHD  
is the magnitude of the difference of the t  
or t  
of one channel and the t  
or t  
of the other channel  
PLHD  
PHLD  
PLHD  
PHLD  
on the same part.  
Note 9: t is the magnitude of the difference of any differential propagation delays between parts at the same V  
and within  
CC  
SKD3  
5°C of each other.  
Note 10: t is the magnitude of the difference of any differential propagation delays between parts operating over the rated  
SKD4  
supply and temperature ranges.  
_______________________________________________________________________________________  
3
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
Typical Operating Characteristics  
(V  
= 3.3V, V  
= 1.2V, |V | = 0.2V, f = 200MHz, C = 15pF, T = +25°C, unless otherwise specified.)  
CM ID IN L A  
CC  
OUTPUT HIGH VOLTAGE  
vs. SUPPLY VOLTAGE  
OUTPUT LOW VOLTAGE  
vs. SUPPLY VOLTAGE  
OUTPUT SHORT-CIRCUIT CURRENT  
vs. SUPPLY VOLTAGE  
3.6  
3.5  
100  
95  
90  
85  
80  
-65  
-70  
-75  
-80  
-85  
I
= -4mA  
I
= +4mA  
V = +200mV, OUTPUT  
ID  
SHORTED TO GROUND  
OH  
OL  
3.4  
3.3  
3.2  
3.1  
3.0  
2.9  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
SUPPLY VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
DIFFERENTIAL THRESHOLD VOLTAGE  
vs. SUPPLY VOLTAGE  
MAX9172 SUPPLY CURRENT  
vs. FREQUENCY  
MAX9172 SUPPLY CURRENT  
vs. TEMPERATURE  
-35  
-40  
-45  
-50  
-55  
40  
30  
20  
10  
0
9
8
7
6
f = 1MHz  
BOTH CHANNELS SWITCHING  
HIGH-LOW  
LOW-HIGH  
BOTH CHANNELS  
SWITCHING  
ONE CHANNEL  
SWITCHING  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
0.1  
1
10  
100  
1000  
-40  
-15  
10  
35  
60  
85  
SUPPLY VOLTAGE (V)  
FREQUENCY (MHz)  
TEMPERATURE (°C)  
DIFFERENTIAL PROPAGATION DELAY  
vs. TEMPERATURE  
DIFFERENTIAL PROPAGATION DELAY  
vs. SUPPLY VOLTAGE  
2.0  
1.9  
1.8  
1.7  
1.6  
1.5  
2.5  
2.0  
1.5  
1.0  
t
PHLD  
t
PHLD  
t
PLHD  
t
PLHD  
-40  
-15  
10  
35  
60  
85  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
TEMPERATURE (°C)  
SUPPLY VOLTAGE (V)  
4
_______________________________________________________________________________________  
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
Typical Operating Characteristics (continued)  
(V  
= 3.3V, V  
= 1.2V, |V | = 0.2V, f = 200MHz, C = 15pF, T = +25°C, unless otherwise specified.)  
CC  
CM  
ID  
IN  
L
A
DIFFERENTIAL PULSE SKEW  
vs. SUPPLY VOLTAGE  
DIFFERENTIAL PULSE SKEW  
vs. TEMPERATURE  
DIFFERENTIAL PROPAGATION DELAY  
vs. DIFFERENTIAL INPUT VOLTAGE  
120  
200  
160  
120  
80  
3.0  
2.5  
2.0  
1.5  
1.0  
f
IN  
= 20MHz  
90  
60  
30  
0
t
PHLD  
t
PLHD  
40  
0
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
-40  
-15  
10  
35  
60  
85  
100  
600  
1100  
1600  
2100  
2600  
SUPPLY VOLTAGE (V)  
TEMPERATURE (°C)  
DIFFERENTIAL INPUT VOLTAGE (mV)  
DIFFERENTIAL PROPAGATION DELAY  
vs. LOAD  
DIFFERENTIAL PROPAGATION DELAY  
vs. COMMON-MODE VOLTAGE  
TRANSITION TIME vs. TEMPERATURE  
2.5  
2.2  
1.9  
1.6  
1.3  
1.0  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
700  
600  
500  
400  
300  
f
= 20MHz  
f
IN  
= 20MHz  
IN  
t
TLH  
t
PHLD  
t
PHLD  
t
PLHD  
t
PLHD  
t
THL  
0.1  
0.6  
1.1  
1.6  
2.1  
2.6  
3.1  
10  
20  
30  
LOAD (pF)  
40  
50  
-40  
-15  
10  
35  
60  
85  
COMMON-MODE VOLTAGE (V)  
TEMPERATURE (°C)  
DIFFERENTIAL PULSE SKEW  
vs. INPUT TRANSITION TIME  
TRANSITION TIME vs. LOAD  
2100  
1700  
1300  
900  
300  
250  
200  
150  
100  
50  
t
TLH  
t
THL  
500  
100  
0
10  
20  
30  
LOAD (pF)  
40  
50  
1.0  
1.5  
2.0  
2.5  
3.0  
INPUT TRANSITION TIME (ns)  
_______________________________________________________________________________________  
5
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
MAX9171 Pin Description  
PIN  
NAME  
FUNCTION  
SOT23  
SO/QFN  
Positive Power-Supply Input. Bypass with a 0.1µF and a 0.001µF capacitor to GND with the  
smallest capacitor closest to the pin.  
1
8
V
CC  
2
5
GND  
OUT  
N.C.  
IN+  
IN-  
Ground  
3
4, 5, 6  
7
7
Receiver Output  
3, 4, 6  
No Connection. Not internally connected.  
Noninverting Differential Receiver Input  
Inverting Differential Receiver Input  
Exposed Paddle. Solder to PC board ground.  
2
1
8
(QFN only)  
EP  
MAX9172 Pin Description  
PIN  
NAME  
FUNCTION  
SOT23  
SO/QFN  
Positive Power-Supply Input. Bypass with a 0.1µF and a 0.001µF capacitor to GND with the  
smallest capacitor closest to the pin.  
1
8
V
CC  
2
3
5
GND  
OUT1  
OUT2  
IN2-  
Ground  
7
Receiver Output 1  
4
6
Receiver Output 2  
5
4
Inverting Differential Receiver Input 2  
Noninverting Differential Receiver Input 2  
Noninverting Differential Receiver Input 1  
Inverting Differential Receiver Input 1  
Exposed Paddle. Solder to PC board ground.  
6
3
IN2+  
IN1+  
IN1-  
7
2
1
8
(QFN only)  
EP  
signals to LVCMOS/LVTTL signals at rates in excess of  
500Mbps. These devices are capable of detecting dif-  
ferential signals as low as 100mV and as high as 1.2V  
Detailed Description  
LVDS Inputs  
The MAX9171/MAX9172 feature LVDS inputs for inter-  
facing high-speed digital circuitry. The LVDS interface  
standard is a signaling method intended for point-to-  
point communication over controlled-impedance  
media, as defined by the ANSI TIA/EIA-644 standards.  
The technology uses low-voltage signals to achieve fast  
transition times and minimize power dissipation and  
noise immunity. The MAX9171/MAX9172 convert LVDS  
within a 0 to V  
input voltage range. Table 1 is the  
CC  
input-output function table.  
Fail-Safe  
The MAX9171/MAX9172 fail-safe drives the receiver  
output high when the differential input is:  
Open  
Undriven and shorted  
Undriven and terminated  
Table 1. Input-Output Function Table  
INPUTS  
(IN_+) - (IN_-)  
0mV  
OUTPUT  
OUT_  
High  
Without fail-safe, differential noise at the input may  
switch the receiver and appear as data to the receiving  
system. An open input occurs when a cable and termi-  
nation are disconnected. An undriven, terminated input  
occurs when a cable is disconnected with the termina-  
tion still connected across the receiver inputs or when  
the driver of a receiver is in high impedance. An undriv-  
en, shorted input can occur due to a shorted cable.  
-100mV  
Low  
Open  
High  
Undriven short  
Undriven parallel termination  
High  
High  
6
_______________________________________________________________________________________  
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
In-Path vs. Parallel Fail-Safe  
The MAX9171/MAX9172 have in-path fail-safe that is  
compatible with in-path fail-safe receivers, such as the  
V
CC  
DS90LV018A and DS90LV028A. Refer to the MAX9111/  
MAX9113 data sheet for pin-compatible receivers with  
parallel fail-safe and lower jitter. Refer to the MAX9130  
data sheet for a single LVDS receiver with parallel fail-  
safe in an SC70 package.  
2.5µA  
IN_+  
IN_-  
OUT_  
The MAX9171/MAX9172 with in-path fail-safe are  
designed with a +40mV input offset voltage, a 2.5µA  
40mV  
current source between V  
and the noninverting  
CC  
input, and a 5µA current sink between the inverting  
input and ground (Figure 1). If the differential input is  
5µA  
open, the 2.5µA current source pulls the input to V  
-
CC  
0.7V and the 5µA source sink pulls the inverting input to  
ground, which drives the receiver output high. If the dif-  
ferential input is shorted or terminated with a typical  
value termination resistor, the +40mV offset drives the  
receiver output high. If the input is terminated and float-  
ing, the receiver output is driven high by the +40mV off-  
set, and the 2:1 current sink to current source ratio  
(5µA:2.5µA) pulls the inputs to ground. This can be an  
advantage when switching between drivers on a multi-  
point bus because the change in common-mode volt-  
age from ground to the typical driver offset voltage of  
Figure 1. Input with In-Path Fail-Safe Network Equivalent Circuit  
IN_+  
OUT_  
PULSE  
GENERATOR  
IN_-  
15pF  
50Ω  
50Ω  
1.2V is not as much as the change from V  
to 1.2V  
CC  
(parallel fail-safe pulls the bus to V ). Figure 2 shows  
CC  
the propagation delay and transition test time circuit  
and Figure 3 shows the propagation delay and transi-  
tion test time waveforms.  
Figure 2. Propagation Delay and Transition Test Time Circuit  
1.3V  
IN_-  
1.2V (0V DIFFERENTIAL)  
IN_+  
V = 0.2V  
ID  
1.1V  
t
t
PHLD  
PLHD  
V
OH  
80%  
80%  
1.5V  
1.5V  
20%  
20%  
OUT_  
V
OL  
t
t
THL  
TLH  
Figure 3. Propagation Delay and Transition Time Waveforms  
_______________________________________________________________________________________  
7
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
ESD Protection  
Termination  
ESD protection structures are incorporated on all pins  
to protect against electrostatic discharges encountered  
during handling and assembly. The receiver inputs of  
the MAX9171/MAX9172 have extra protection against  
static electricity. These pins are protected to 13kV  
without damage. The structures withstand ESD during  
normal operation and when powered down.  
The MAX9171/MAX9172 require an external termination  
resistor. The termination resistor should match the differ-  
ential impedance of the transmission line. Termination  
resistance values may range between 90to 132,  
depending on the characteristic impedance of the  
transmission medium.  
When using the MAX9171/MAX9172, minimize the dis-  
tance between the input termination resistors and the  
MAX9171/MAX9172 receiver inputs. Use a single 1%  
surface-mount resistor.  
The receiver inputs of these devices are characterized  
for protection to the limit of 13kV using the Human  
Body Model.  
Human Body Model  
Figure 4a shows the Human Body Model, and Figure  
4b shows the current waveform it generates when dis-  
charged into a low-impedance load. This model con-  
sists of a 100pF capacitor charged to the ESD test  
voltage, which is then discharged into the test device  
through a 1.5kresistor.  
Board Layout  
For LVDS applications, a four-layer PC board that pro-  
vides separate power, ground, LVDS signals, and out-  
put signals is recommended. Separate the input LVDS  
signals from the output signals to prevent crosstalk.  
Solder the exposed pad on the QFN package to a pad  
connected to the PC board ground plane by a matrix of  
vias. Connecting the exposed pad is not a substitute  
for connecting the ground pin. Always connect pin 5 on  
the QFN package to ground.  
Applications Information  
Supply Bypassing  
with high-frequency surface-mount ceram-  
Bypass V  
CC  
ic 0.1µF and 0.001µF capacitors in parallel, as close to  
the device as possible, with the 0.001µF capacitor clos-  
est to the device. For additional supply bypassing,  
place a 10µF tantalum or ceramic capacitor at the point  
where power enters the circuit board.  
R
C
1M  
R 1500Ω  
D
DISCHARGE  
RESISTANCE  
CHARGE-CURRENT  
LIMIT RESISTOR  
HIGH-  
VOLTAGE  
DC  
DEVICE  
UNDER  
TEST  
C
STORAGE  
CAPACITOR  
s
100pF  
SOURCE  
Differential Traces  
Input trace characteristics affect the performance of the  
MAX9171/MAX9172. Use controlled-impedance PC board  
traces to match the cable characteristic impedance.  
Figure 4a. Human Body ESD Test Modules  
Eliminate reflections and ensure that noise couples as  
common mode by running the differential traces close  
together. Reduce skew by matching the electrical  
length of traces.  
I
100%  
90%  
PEAK-TO-PEAK RINGING  
(NOT DRAWN TO SCALE)  
I
P
r
AMPERES  
Each channels differential signals should be routed  
close to each other to cancel their external magnetic  
field. Maintain a constant distance between the differ-  
ential traces to avoid discontinuities in differential  
impedance. Avoid 90° turns and minimize the number  
of vias to further prevent impedance discontinuities.  
36.8%  
10%  
0
TIME  
0
t
RL  
t
DL  
CURRENT WAVEFORM  
Cables and Connectors  
Transmission media typically have a controlled differen-  
tial impedance of about 100. Use cables and connec-  
tors that have matched differential impedance to  
minimize impedance discontinuities. Balanced cables  
tend to pick up noise as common mode, which is  
rejected by the LVDS receiver.  
Figure 4b. Human Body Current Waveform  
Chip Information  
TRANSISTOR COUNT: 624  
PROCESS: CMOS  
8
_______________________________________________________________________________________  
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
Package Information  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
_______________________________________________________________________________________  
9
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
Package Information (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
10 ______________________________________________________________________________________  
Single/Dual LVDS Line Receivers with  
“In-Path” Fail-Safe  
Package Information (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
PACKAGE OUTLINE, 6, 8 & 10L,  
QFN THIN (DUAL), EXPOSED PAD, 3x3x0.80 mm  
21-0137  
C
COMMON DIMENSIONS  
SYMBOL  
MIN.  
0.70  
2.90  
2.90  
0.00  
0.20  
MAX.  
A
D
E
A1  
L
0.80  
3.10  
3.10  
0.05  
0.40  
k
0.25 MIN  
0
A20.2 REF.  
PACKAGE VARIATIONS  
PKG. CODE  
T633-1  
N
6
D2  
E2  
e
JEDEC SPEC  
MO229 / WEEA  
MO229 / WEEC  
b
[(N/2)-1] x e  
1.90 REF  
1.95 REF  
1.50–0.10 2.30–0.10 0.95 BSC  
1.50–0.10 2.30–0.10 0.65 BSC  
0.40–0.05  
0.30–0.05  
T833-1  
8
T1033-1  
10  
1.50–0.10 2.30–0.10 0.50 BSC MO229 / WEED-3 0.25–0.05 2.00 REF  
PACKAGE OUTLINE, 6, 8 & 10L,  
QFN THIN (DUAL), EXPOSED PAD, 3x3x0.80 mm  
21-0137  
C
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11  
© 2002 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products.  

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