MXB7846EEE [MAXIM]

2.375V to 5.25V, 4-Wire Touch-Screen Controller with Internal Reference and Temperature Sensor; 2.375V至5.25V , 4线触摸屏控制器,内置电压基准及温度传感器
MXB7846EEE
型号: MXB7846EEE
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

2.375V to 5.25V, 4-Wire Touch-Screen Controller with Internal Reference and Temperature Sensor
2.375V至5.25V , 4线触摸屏控制器,内置电压基准及温度传感器

转换器 模数转换器 传感器 温度传感器 光电二极管 信息通信管理 控制器
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中文:  中文翻译
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19-2436; Rev 1; 5/04  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
General Description  
Features  
The MXB7846 is an industry-standard 4-wire touch-  
screen controller. It contains a 12-bit sampling analog-  
to-digital converter (ADC) with a synchronous serial  
interface and low on-resistance switches for driving  
resistive touch screens. The MXB7846 uses an internal  
+2.5V reference or an external reference. The  
MXB7846 can make absolute or ratiometric measure-  
ments. In addition, this device has an on-chip tempera-  
ture sensor, a battery-monitoring channel, and has the  
ability to perform touch-pressure measurements without  
external components. The MXB7846 has one auxiliary  
ADC input. All analog inputs are fully ESD protected,  
eliminating the need for external TransZorb™ devices.  
ESD-Protected ADC Inputs  
±15kV IEC 61000-4-2 Air-Gap Discharge  
±8kV IEC 61000-4-2 Contact Discharge  
Pin Compatible with MXB7843  
+2.375V to +5.25V Single Supply  
Internal +2.5V Reference  
Direct Battery Measurement (0 to 6V)  
On-Chip Temperature Measurement  
Touch-Pressure Measurement  
4-Wire Touch-Screen Interface  
Ratiometric Conversion  
The MXB7846 is guaranteed to operate with a supply  
voltage down to +2.375V when used with an external  
reference or +2.7V with an internal reference. In shut-  
down mode, the typical power consumption is reduced  
to under 0.5µW, while the typical power consumption at  
125ksps throughput and a +2.7V supply is 650µW.  
SPI™/QSPI™, 3-Wire Serial Interface  
Programmable 8-/12-Bit Resolution  
Auxiliary Analog Input  
Automatic Shutdown Between Conversions  
Low-power operation makes the MXB7846 ideal for bat-  
tery-operated systems, such as personal digital assis-  
tants with resistive touch screens and other portable  
equipment. The MXB7846 is available in 16-pin QSOP  
and TSSOP packages, and is guaranteed over the  
-40°C to +85°C temperature range.  
Low Power (External Reference)  
270µA at 125ksps  
115µA at 50ksps  
25µA at 10ksps  
5µA at 1ksps  
2µA Shutdown Current  
Applications  
Personal Digital Assistants  
Portable Instruments  
Point-of-Sales Terminals  
Pagers  
Ordering Information  
PART  
TEMP RANGE  
-40°C to +85°C  
-40°C to +85°C  
PIN-PACKAGE  
16 QSOP  
MXB7846EEE  
MXB7846EUE  
16 TSSOP  
Touch-Screen Monitors  
Cellular Phones  
Pin Configuration  
Typical Application Circuit appears at end of data sheet.  
TOP VIEW  
V
DD  
X+  
Y+  
X-  
Y-  
1
2
3
4
5
6
7
8
16 DCLK  
15 CS  
TransZorb is a trademark of Vishay Intertechnology, Inc.  
SPI/QSPI are trademarks of Motorola, Inc.  
14 DIN  
MXB7846  
13 BUSY  
12 DOUT  
11 PENIRQ  
GND  
BAT  
AUX  
10  
9
V
DD  
REF  
QSOP/TSSOP  
________________________________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
ABSOLUTE MAXIMUM RATINGS  
Continuous Power Dissipation (T = +70°C)  
A
V
DD  
, VBAT, DIN, CS, DCLK to GND ........................-0.3V to +6V  
16-Pin QSOP (derate 8.30mW/°C above +70°C).........667mW  
16-Pin TSSOP (derate 5.70mW/°C above +70°C) .......456mW  
Operating Temperature Range ...........................-40°C to +85°C  
Junction Temperature......................................................+150°C  
Storage Temperature Range.............................-65°C to +150°C  
Lead Temperature (soldering, 10s) .................................+300°C  
Digital Outputs to GND...............................-0.3V to (V  
+ 0.3V)  
+ 0.3V)  
DD  
DD  
V
, X+, X-, Y+, Y-, AUX to GND..............-0.3V to (V  
REF  
Maximum Current into Any Pin ......................................... 50mA  
Maximum ESD per IEC-61000-4-2 (per MIL STD-883 HBM)  
X+, X-, Y+, Y-, VBAT, AUX......................................15kV (4kV)  
All Other Pins ..........................................................2kV (500V)  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(V  
= 2.7V to 3.6V, V  
= 2.5V, f  
= 2MHz (50% duty cycle), f  
= 125kHz, 12-bit mode, 0.1µF capacitor at REF, T =  
SAMPLE A  
DD  
REF  
DCLK  
T
MIN  
to T  
, unless otherwise noted. Typical values are at T = +25°C.)  
MAX A  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
12  
UNITS  
DC ACCURACY (Note 1)  
Resolution  
Bits  
Bits  
LSB  
LSB  
LSB  
LSB  
No Missing Codes  
Relative Accuracy  
Differential Nonlinearity  
Offset Error  
11  
12  
1
INL  
(Note 2)  
(Note 3)  
2
DNL  
1
6
4
Gain Error  
Noise  
Including internal reference  
70  
µV  
RMS  
CONVERSION RATE  
Conversion Time  
Track/Hold Acquisition Time  
Throughput Rate  
Multiplexer Settling Time  
Aperture Delay  
t
12 clock cycles (Note 4)  
3 clock cycles  
6
µs  
µs  
CONV  
t
1.5  
ACQ  
f
16 clock conversion  
125  
kHz  
ns  
SAMPLE  
500  
30  
ns  
Aperture Jitter  
100  
100  
ps  
Channel-to-Channel Isolation  
Serial Clock Frequency  
Duty Cycle  
V
= 2.5V  
at 50kHz  
dB  
MHz  
%
IN  
P-P  
f
0.1  
40  
2.0  
60  
DCLK  
ANALOG INPUT (X+, X-, Y+, Y-, AUX)  
Input Voltage Range  
0
V
V
REF  
1
Input Capacitance  
25  
pF  
µA  
Input Leakage Current  
SWITCH DRIVERS  
On/off leakage, V = 0 to V  
IN  
0.1  
DD  
Y+, X+  
Y-, X-  
7
9
On-Resistance (Note 5)  
INTERNAL REFERENCE  
Reference Output Voltage  
V
V
= 2.7V to 5.25V, T = +25°C  
2.45  
2.50  
50  
2.55  
V
REF  
DD  
A
REF Output Tempco  
TCV  
ppm°/C  
mA  
REF  
REF Short-Circuit Current  
REF Output Impedance  
18  
250  
2
_______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
ELECTRICAL CHARACTERISTICS (continued)  
(V  
= 2.7V to 3.6V, V  
= 2.5V, f  
= 2MHz (50% duty cycle), f  
= 125kHz, 12-bit mode, 0.1µF capacitor at REF, T =  
SAMPLE A  
DD  
REF  
DCLK  
T
MIN  
to T  
, unless otherwise noted. Typical values are at T = +25°C.)  
MAX A  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
EXTERNAL REFERENCE (Internal reference disabled, reference applied to REF)  
Reference Input Voltage Range  
Input Resistance  
(Note 7)  
1
V
V
DD  
1
G  
f
f
f
= 125kHz  
= 12.5kHz  
13  
2.5  
40  
3
SAMPLE  
SAMPLE  
µA  
Input Current  
= 0  
DCLK  
BATTERY MONITOR (BAT)  
Input Voltage Range  
Input Resistance  
0
6
V
During acquisition  
= 2.5V  
10  
kΩ  
V
±2  
±3  
REF  
Accuracy  
%
Internal reference  
TEMPERATURE MEASUREMENT  
Resolution  
Differential method (Note 8)  
Single-conversion method  
Differential method (Note 8)  
Single-conversion method  
1.6  
0.3  
±2  
°C  
°C  
°C  
°C  
Accuracy  
±3  
DIGITAL INPUTS (DCLK, CS, DIN)  
Input High Voltage  
V
V
0.7  
V
V
IH  
DD  
Input Low Voltage  
V
0.8  
1
IL  
Input Hysteresis  
V
100  
15  
mV  
µA  
pF  
HYST  
Input Leakage Current  
Input Capacitance  
I
IN  
C
IN  
DIGITAL OUTPUT (DOUT, BUSY)  
Output Voltage Low  
V
I
I
= 250µA  
0.4  
V
V
OL  
SINK  
Output Voltage High  
V
= 250µA  
V
- 0.5  
DD  
OH  
SOURCE  
PENIRQ Output Low Voltage  
Three-State Leakage Current  
Three-State Output Capacitance  
POWER REQUIREMENTS  
V
50kpullup to V  
0.8  
10  
V
OL  
DD  
I
CS = V  
CS = V  
1
µA  
pF  
L
DD  
DD  
C
15  
OUT  
External reference  
2.375  
2.70  
5.250  
5.25  
650  
Supply Voltage  
V
V
DD  
DD  
Internal reference  
f
= 125ksps  
= 12.5ksps  
= 0  
270  
220  
150  
780  
720  
650  
SAMPLE  
SAMPLE  
SAMPLE  
SAMPLE  
SAMPLE  
SAMPLE  
External  
reference  
µA  
f
f
f
Supply Current  
I
= 125ksps  
= 12.5ksps  
= 0  
950  
3
Internal  
reference  
f
µA  
f
Shutdown Supply Current  
I
DCLK = CS = V  
µA  
dB  
SHDN  
DD  
Power-Supply Rejection Ratio  
P
V
= 2.7V to 3.6V full scale  
DD  
70  
SRR  
_______________________________________________________________________________________  
3
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
TIMING CHARACTERISTICS (Figure 1)  
(V  
= 2.7V to 3.6V, V  
= 2.5V, f  
= 2MHz (50% duty cycle), f  
= 125kHz, 12-bit mode, 0.1µF capacitor at REF, T =  
SAMPLE A  
DD  
REF  
DCLK  
T
MIN  
to T  
, unless otherwise noted. Typical values are at T = +25°C.)  
MAX A  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
TIMING CHARACTERISTICS (Figure 1)  
Acquisition Time  
t
1.5  
500  
200  
200  
100  
0
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ACQ  
DCLK Clock Period  
t
CP  
CH  
DCLK Pulse Width High  
DCLK Pulse Width Low  
DIN-to-DCLK Setup Time  
DIN-to-DCLK Hold Time  
CS Fall-to-DCLK Rise Setup Time  
CS Rise-to-DCLK Rise Ignore  
DCLK Falling-to-DOUT Valid  
CS Rise-to-DOUT Disable  
CS Fall-to-DOUT Enable  
DCLK Falling-to-BUSY Rising  
CS Falling-to-BUSY Enable  
CS Rise-to-BUSY Disable  
t
t
CL  
DS  
DH  
t
t
t
100  
0
CSS  
CSH  
t
t
C
C
C
= 50pF  
= 50pF  
= 50pF  
200  
200  
200  
200  
200  
200  
DO  
LOAD  
LOAD  
LOAD  
t
TR  
DV  
BD  
t
t
t
BDV  
t
BTR  
Note 1: Tested at V  
= 2.7V.  
DD  
Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range has  
been calibrated.  
Note 3: Offset nulled.  
Note 4: Conversion time is defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle.  
Note 5: Resistance measured from the source to drain of the switch.  
Note 6: External load should not change during conversion for specified accuracy.  
Note 7: ADC performance is limited by the conversion noise floor, typically 300µV . An external reference below 2.5V can com-  
P-P  
promise the ADC performance.  
Note 8: Difference between Temp0 and Temp1. No calibration necessary.  
4
_______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Typical Operating Characteristics  
(V  
= 2.7V, V  
= 2.5V  
, f  
= 2MHz, f  
= 125kHz, C  
= 50pF, 0.1µF capacitor at REF, T = +25°C, unless  
DD  
REF  
EXTERNAL DCLK  
SAMPLE  
LOAD A  
otherwise noted.)  
INTEGRAL NONLINEARITY  
vs. DIGITAL OUTPUT CODE  
DIFFERENTIAL NONLINEARITY  
vs. DIGITAL OUTPUT CODE  
CHANGE IN OFFSET ERROR  
vs. SUPPLY VOLTAGE  
0.5  
0.4  
0.3  
0.2  
0.1  
0
1.0  
0.8  
2.0  
1.5  
1.0  
0.5  
0
0.6  
0.4  
0.2  
0
-0.2  
-0.5  
-1.0  
-1.5  
-2.0  
-0.1  
-0.2  
-0.3  
-0.4  
-0.4  
-0.6  
-0.8  
-1.0  
0
0
500 1000 1500 2000 2500 3000 3500 4000  
OUTPUT CODE  
500 1000 1500 2000 2500 3000 3500 4000  
OUTPUT CODE  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
SUPPLY VOLTAGE (V)  
CHANGE IN GAIN ERROR  
vs. SUPPLY VOLTAGE  
CHANGE IN GAIN ERROR  
vs. TEMPERATURE  
CHANGE IN OFFSET ERROR  
vs. TEMPERATURE  
1.0  
0.5  
1.0  
0.5  
0
3
2
0
1
-0.5  
-1.0  
-1.5  
-2.0  
0
-1  
-2  
-3  
-0.5  
-1.0  
-40 -25 -10  
5
20 35 50 65 80  
-40 -25 -10  
5
20 35 50 65 80  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
SUPPLY VOLTAGE (V)  
INTERNAL REFERENCE  
vs. SUPPLY VOLTAGE  
SWITCH ON-RESISTANCE vs. SUPPLY VOLTAGE  
SWITCH ON-RESISTANCE vs. TEMPERATURE  
(X+, Y+ : +V TO PIN; X-, Y- : PIN TO GND)  
(X+, Y+ : +V TO PIN; X-, Y- : TO GND)  
DD  
DD  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
14  
12  
10  
8
12  
C = 0.1µf  
L
11  
10  
9
X-  
Y-  
X-  
X+  
8
7
Y+  
Y-  
X+  
Y+  
6
6
5
4
4
3
2
2
1
0
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
SUPPLY VOLTAGE (V)  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
-40 -25 -10  
5
20 35 50 65 80  
SUPPLY VOLTAGE (V)  
TEMPERATURE (°C)  
_______________________________________________________________________________________  
5
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Typical Operating Characteristics (continued)  
(V  
= 2.7V, V  
= 2.5V  
, f  
= 2MHz, f  
= 125kHz, C  
= 50pF, 0.1µF capacitor at REF, T = +25°C, unless  
DD  
REF  
EXTERNAL DCLK  
SAMPLE  
LOAD A  
otherwise noted.)  
INTERNAL REFERENCE VOLTAGE  
vs. TEMPERATURE  
INTERNAL VOLTAGE REFERENCE  
vs. TURN-ON TIME  
INTERNAL VOLTAGE REFERENCE  
vs. TURN-ON TIME  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
2.5  
2.0  
1.5  
1.0  
0.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
C = 1µF  
V
= 2.7V  
L
DD  
NO CAPACITOR  
(30µs) 12-BIT SETTLING  
(1060µs) 12-BIT SETTLING  
C = 0.1µF  
L
0
0
-40 -25 -10  
5
20 35 50 65 80  
200 400 600 800 1000 1200  
0
5
10 15 20 25 30 35 40  
TEMPERATURE (°C)  
TURN-ON TIME (µs)  
TURN-ON TIME (µs)  
REFERENCE CURRENT  
vs. SUPPLY VOLTAGE  
REFERENCE CURRENT vs. TEMPERATURE  
REFERENCE CURRENT vs. SAMPLE RATE  
8.3  
8.2  
8.1  
8.0  
7.9  
7.8  
7.7  
8.3  
8.2  
8.1  
8.0  
7.9  
7.8  
7.7  
10  
9
8
7
6
5
4
3
2
1
0
EXTERNAL REFERENCE  
C = 0.1µF  
= 125kHz  
EXTERNAL REFERENCE  
L
f
SAMPLE  
V
= 2.7V  
DD  
C = 0.1µF  
L
f
= 125kHz  
SAMPLE  
EXTERNAL REFERENCE  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
-40 -25 -10  
5
20 35 50 65 80  
0
25  
50  
75  
100  
125  
SUPPLY VOLTAGE (V)  
TEMPERATURE (°C)  
SAMPLE RATE (kHz)  
TEMP1 DIODE VOLTAGE  
vs. SUPPLY VOLTAGE  
TEMP0 DIODE VOLTAGE  
vs. SUPPLY VOLTAGE  
TEMP DIODE VOLTAGE  
vs. TEMPERATURE  
590  
589  
588  
587  
586  
585  
705  
704  
703  
702  
701  
700  
699  
698  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
TEMP1  
TEMP0  
TEMP1  
TEMP2  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
-40 -25 -10  
5
20 35 50 65 80  
SUPPLY VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
TEMPERATURE (°C)  
6
_______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Typical Operating Characteristics (continued)  
(V  
= 2.7V, V  
= 2.5V  
, f  
= 2MHz, f  
= 125kHz, C  
= 50pF, 0.1µF capacitor at REF, T = +25°C, unless  
DD  
REF  
EXTERNAL DCLK  
SAMPLE  
LOAD A  
otherwise noted.)  
SUPPLY CURRENT  
vs. SUPPLY VOLTAGE  
SUPPLY CURRENT vs. TEMPERATURE  
SUPPLY CURRENT vs. SAMPLE RATE  
290  
285  
280  
275  
270  
265  
260  
255  
250  
250  
225  
200  
175  
150  
125  
100  
250  
225  
200  
175  
150  
V
V
= 2.7V  
= 2.5V  
DD  
REF  
f
V
= 125kHz  
= 2.7V  
f
= 12.5kHz  
SAMPLE  
DD  
SAMPLE  
-40 -25 -10  
5
20 35 50 65 80  
0
25  
50  
75  
100  
125  
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
SUPPLY VOLTAGE (V)  
TEMPERATURE (°C)  
SAMPLE RATE (kHz)  
MAXIMUM SAMPLE RATE  
vs. SUPPLY VOLTAGE  
SHUTDOWN CURRENT  
vs. SUPPLY VOLTAGE  
SHUTDOWN CURRENT vs. TEMPERATURE  
300  
250  
200  
150  
100  
50  
1000  
100  
10  
120  
110  
100  
90  
DCLK = CS = V = 3V  
DD  
DCLK = CS = V  
DD  
80  
70  
60  
1
50  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
SUPPLY VOLTAGE (V)  
-40 -25 -10  
5
20 35 50 65 80  
SUPPLY VOLTAGE (V)  
TEMPERATURE (°C)  
_______________________________________________________________________________________  
7
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Pin Description  
PIN  
1
NAME  
FUNCTION  
V
Positive Supply Voltage. Connect to pin 10.  
X+ Position Input, ADC Input Channel 1  
Y+ Position Input, ADC Input Channel 2  
X- Position Input  
DD  
2
X+  
3
Y+  
X-  
4
5
Y-  
Y- Position Input  
6
GND  
BAT  
AUX  
Ground  
7
Battery Monitoring Inputs; ADC Input Channel 3  
Auxiliary Input to ADC; ADC Input Channel 4  
8
Voltage Reference Output/Input. Reference voltage for analog-to-digital conversion. In internal  
reference mode, the reference buffer provides a 2.50V nominal output. In external reference mode,  
9
REF  
apply a reference voltage between 1V and V . Bypass REF to GND with a 0.1µF capacitor.  
DD  
Positive Supply Voltage, +2.375V (2.70V) to +5.25V. External (internal) reference. Bypass with a 1µF  
capacitor. Connect to pin 1.  
10  
11  
12  
V
DD  
PENIRQ  
Pen Interrupt Output. Open anode output. 10kto 100kpullup resistor required to V  
.
DD  
Serial Data Output. Data changes state on the falling edge of DCLK. High impedance when CS is  
HIGH.  
DOUT  
Busy Output. BUSY pulses high for one clock period before the MSB decision. High impedance when  
CS is HIGH.  
13  
14  
15  
BUSY  
DIN  
CS  
Serial Data Input. Data clocked in on the rising edge of DCLK.  
Active-Low Chip Select. Data is only clocked into DIN when CS is low. When CS is HIGH, DOUT and  
BUSY are high impedance.  
Serial Clock Input. Clocks data in and out of the serial interface and sets the conversion speed (duty  
cycle must be 40% to 60%).  
16  
DCLK  
CS  
t
CH  
t
t
CP  
t
CSS  
CSH  
t
CL  
DCLK  
t
DO  
t
DS  
t
DH  
DIN  
t
TR  
t
DV  
DOUT  
t
t
BDV  
BTR  
BUSY  
t
BD  
Figure 1. Detailed Serial Interface Timing  
_______________________________________________________________________________________  
8
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
During the acquisition interval, the selected channel  
Detailed Description  
charges the sampling capacitance. The acquisition  
The MXB7846 uses a successive-approximation conver-  
interval starts on the fifth falling clock edge and ends  
on the eighth falling clock edge.  
sion technique to convert analog signals to a 12-bit digi-  
tal output. An SPI/QSPI/MICROWIRE™-compatible serial  
interface provides easy communication to a micro-  
processor (µP). It features an internal 2.5V reference, an  
on-chip temperature sensor, a battery monitor, and a  
4-wire touch-screen interface (Functional Diagram).  
The time required for the T/H to acquire an input signal  
is a function of how quickly its input capacitance is  
charged. If the input signal’s source impedance is high,  
the acquisition time lengthens, and more time must be  
allowed between conversions. The acquisition time  
Analog Inputs  
Figure 2 shows a block diagram of the analog input sec-  
tion that includes the input multiplexer of the MXB7846,  
the differential signal inputs of the ADC, and the differ-  
ential reference inputs of the ADC. The input multiplexer  
switches between X+, X-, Y+, Y-, AUX, BAT, and the  
internal temperature sensor.  
(t  
) is the maximum time the device takes to acquire  
ACQ  
the input signal to 12-bit accuracy. Calculate t  
the following equation:  
with  
ACQ  
t
= 8.4 × R + R  
× 25pF  
(
)
ACQ  
S
IN  
where R = 2kand R is the source impedance of  
IN  
S
the input signal.  
In single-ended mode, conversions are performed using  
REF as the reference. In differential mode, ratiometric  
conversions are performed with REF+ connected to X+ or  
Y+, and REF- connected to X- or Y-. Configure the refer-  
ence and switching matrix according to Tables 1 and 2.  
Source impedances below 1kdo not significantly affect  
the ADC’s performance. Accommodate higher source  
impedances by either slowing down DCLK or by placing  
a 1µF capacitor between the analog input and GND.  
+V  
DD  
V
REF  
PENIRQ  
TEMP1  
TEMP0  
MXB7846  
A2–A0  
(SHOWN 001 )  
SER/DFR  
(SHOWN HIGH)  
B
X+  
X-  
REF ON/OFF  
Y+  
Y-  
REF+  
12-BIT ADC  
-IN  
+IN  
REF-  
2.5V  
REFERENCE  
7.5k  
V
BAT  
2.5kΩ  
BATTERY  
ON  
AUX  
GND  
Figure 2. Equivalent Input Circuit  
MICROWIRE is a trademark of National Semiconductor Corp.  
_______________________________________________________________________________________  
9
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Functional Diagram  
V
DD  
PENIRQ  
X+  
X-  
TEMPERATURE  
SENSOR  
DOUT  
BUSY  
Y+  
Y-  
PENIRQ  
6-TO-1  
MUX  
SERIAL  
DATA  
INTERFACE  
12-BIT ADC  
DCLK  
DIN  
BATTERY  
MONITOR  
BAT  
CS  
AUX  
2.5V  
REFERENCE  
REF  
Table 1. Input Configuration, Single-Ended Reference Mode (SER/DFR HIGH)  
A2  
A1  
A0  
MEASUREMENT  
Temp0  
Y position  
BAT  
ADC INPUT CONNECTION  
DRIVERS ON  
0
0
0
Temp0  
X+  
Y+, Y-  
0
0
1
0
1
0
BAT  
X+  
0
1
1
Z1  
X-, Y+  
X-, Y+  
X-, X+  
1
0
0
Z2  
Y-  
1
0
1
X- position  
AUX  
Y+  
1
1
0
AUX  
Temp1  
1
1
1
Temp1  
Table 2. Input Configuration, Differential Reference Mode (SER/DFR LOW)  
ADC +REF  
ADC -REF  
ADC INPUT  
MEASUREMENT  
PERFORMED  
A2  
A1  
A0  
DRIVER ON  
CONNECTION TO CONNECTION TO CONNECTION TO  
0
0
0
1
0
1
1
0
1
1
0
1
Y+  
Y+  
X+  
X+  
Y-  
Y-  
X-  
X-  
X+  
X+  
Y-  
Y position  
Z1 position  
Z2 position  
X position  
Y+, Y-  
Y+, X-  
Y+, X-  
X+, X-  
Y+  
10 ______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
resistive-divider created by the touch screen and the  
on-resistance of the X and Y drivers result in both an  
offset and a gain shift. Also, the on-resistance of the X  
and Y drivers does not track the resistance of the touch  
screen over temperature and supply. This results in fur-  
ther measurement errors.  
Input Bandwidth and Anti-Aliasing  
The ADCs input tracking circuitry has a 25MHz small-  
signal bandwidth, so it is possible to digitize high-  
speed transient events. To avoid high-frequency sig-  
nals being aliased into the frequency band of interest,  
anti-alias filtering is recommended.  
Differential Measurement Mode  
Figure 4 shows the switching matrix configuration for  
Y-coordinate measurement. The REF+ and REF- inputs  
are connected directly to the Y+ and Y- pins, respec-  
tively. Differential mode uses the voltage at the Y+ pin  
as the REF+ voltage and voltage at the Y- pin as REF-  
voltage. This conversion is ratiometric and independent  
of the voltage drop across the drivers and variation in  
the touch-screen resistance. In differential mode, the  
touch screen remains biased during the acquisition and  
conversion process. This results in additional supply  
current and power dissipation during conversion when  
compared to the absolute measurement mode.  
Analog Input Protection  
Internal protection diodes, which clamp the analog input  
to V  
and GND, allow the analog input pins to swing  
DD  
from GND - 0.3V to V  
+ 0.3V without damage. Analog  
DD  
inputs must not exceed V  
by more than 50mV or be  
DD  
lower than GND by more than 50mV for accurate con-  
version. If an off-channel analog input voltage exceeds  
the supplies, limit the input current to 50mA. The analog  
input pins are ESD protected to 8kV using the Contact  
Discharge method and 15kV using the Air-Gap  
method specified in IEC 61000-4-2.  
Touch-Screen Conversion  
The MXB7846 provides two conversion methods—differ-  
ential and single ended. The SER/DFR bit in the control  
word selects either mode. A logic 1 selects a single-  
ended conversion, while a logic 0 selects a differential  
conversion.  
PEN Interrupt Request (PENIRQ)  
Figure 5 shows the block diagram for the PENIRQ func-  
tion. When used, PENIRQ requires a 10kto 100kΩ  
pullup to +V . If enabled, PENIRQ goes low whenever  
DD  
the touch screen is touched. The PENIRQ output can  
be used to initiate an interrupt to the microprocessor,  
which can write a control word to the MXB7846 to start  
a conversion.  
Differential vs. Single Ended  
Changes in operating conditions can degrade the accu-  
racy and repeatability of touch-screen measurements.  
Therefore, the conversion results representing X and Y  
coordinates may be incorrect. For example, in single-  
ended measurement mode, variation in the touch-screen  
driver voltage drops results in incorrect input reading.  
Differential mode minimizes these errors.  
Figure 6 shows the timing diagram for the PENIRQ pin  
function. The diagram shows that once the screen is  
touched while CS is high, the PENIRQ output goes low  
after a time period indicated by t  
. The t  
TOUCH  
TOUCH  
value changes for different touch-screen parasitic  
capacitance and resistance. The microprocessor  
receives this interrupt and pulls CS low to initiate a con-  
version. At this instant, the PENIRQ pin should be  
masked, as transitions can occur due to a selected  
input channel or the conversion mode. The PENIRQ pin  
functionality becomes valid when either the last data bit  
is clocked out, or CS is pulled high.  
Single-Ended Mode  
Figure 3 shows the switching matrix configuration for  
Y-coordinate measurement in single-ended mode. The  
MXB7846 measures the position of the pointing device  
by connecting X+ to IN+ of the ADC, enabling Y+ and  
Y- drivers, and digitizing the voltage on X+. The ADC  
performs a conversion with REF+ = REF and REF- =  
GND. In single-ended measurement mode, the bias to  
the touch screen can be turned off after the acquisition  
to save power. The on-resistance of the X and Y drivers  
results in a gain error in single-ended measurement  
mode. Touch-screen resistance ranges from 200to  
900(depending on the manufacturer), whereas the  
on-resistance of the X and Y drivers is 8(typ). Limit  
the touch-screen current to less than 50mA by using a  
touch screen with a resistance higher than 100. The  
Touch-Pressure Measurement  
The MXB7846 provides two methods for measuring the  
pressure applied to the touch screen (Figure 7). By  
measuring R  
, it is possible to differentiate  
TOUCH  
between a finger or stylus in contact with the touch  
screen. Although 8-bit resolution is typically sufficient,  
the following calculations use 12-bit resolution demon-  
strating the maximum precision of the MXB7846.  
______________________________________________________________________________________ 11  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
V
DD  
V
DD  
Y+  
X+  
Y-  
REF  
Y+  
X+  
Y-  
+IN  
-IN  
REF+  
+IN  
-IN  
REF+  
12-BIT ADC  
12-BIT ADC  
REF-  
REF-  
GND  
GND  
Figure 3. Single-Ended Y-Coordinate Measurement  
Figure 4. Ratiometric Y-Coordinate Measurement  
+V  
DD  
100k  
OPEN CIRCUIT  
Y+  
PENIRQ  
TOUCH SCREEN  
X+  
Y-  
ON  
PENIRQ  
ENABLE  
Figure 5. PENIRQ Functional Block Diagram  
12 ______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
SCREEN TOUCHED HERE  
PENIRQ  
CS  
DCLK  
DIN  
1
2
3
4
5
6
7
8
1
2
3
12  
13  
14  
15  
16  
S
A2  
A1  
A0  
M
S/D PD1 PD0  
INTERRUPT PROCESSOR  
NO RESPONSE TO TOUCHMASK PENIRQ  
PENIRQ ENABLED  
t
TOUCH  
Figure 6. PENIRQ Timing Diagram  
The first method performs pressure measurements  
using a known X-plate resistance. After completing  
three conversions (X-position, Z1, and Z2), use the fol-  
MEASURE X- POSITION  
X+  
Y+  
lowing equation to calculate R  
:
TOUCH  
+
-
R
Z
TOUCH  
X
POSITION  
4096  
2
R
= R  
(
×
×
1  
)
V
TOUCH  
XPLATE  
Z
1
X- POSITION  
The second method requires knowing both the X-plate  
and Y-plate resistance. Three conversions are required in  
this method: the X-position, Y-position, and Z1-position.  
X-  
Y-  
OPEN CIRCUIT  
MEASURE Z1  
Use the following equation to calculate R  
TOUCH:  
X+  
Y+  
R
X
4096  
Z
1
XPLATE  
POSITION  
4096  
+
1  
R
=
×
×
TOUCH  
R
TOUCH  
Z
1
V
-
Y
POSITION  
4096  
R  
  
×
YPLATE  
X-  
Y-  
OPEN CIRCUIT  
Internal Temperature Sensor  
OPEN CIRCUIT  
X+  
The MXB7846 provides two temperature measurement  
options: single-ended conversion and differential con-  
version. Both temperature measurement techniques rely  
on the semiconductor junction’s temperature character-  
Y+  
+
R
TOUCH  
V
-
istics. The forward diode voltage (V ) vs. temperature  
BE  
is a well-defined characteristic. The ambient tempera-  
ture can be calculated by knowing the value of V at a  
BE  
X-  
Y-  
fixed temperature and then monitoring the change in  
that voltage as the temperature changes. The single  
conversion method requires calibration at a known tem-  
perature, but only needs a single reading to calculate  
the ambient temperature. First, the PENIRQ diode for-  
SENSE LINE  
MEASURE Z2  
Figure 7. Pressure Measurement Block Diagram  
______________________________________________________________________________________ 13  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
ward bias voltage is measured by the ADC with an  
address of A2 = 0, A1 = 0, and A0 = 0 at a known tem-  
perature. Subsequent diode measurements provide an  
estimate of the ambient temperature through extrapola-  
tion. This assumes a temperature coefficient of  
-2.1mV/°C. The single conversion method results in a  
resolution of 0.3°C/LSB and a typical accuracy of 3°C.  
Battery Voltage Monitor  
A dedicated analog input (BAT) allows the MXB7846 to  
monitor the system battery voltage. Figure 8 shows the  
battery voltage monitoring circuitry. The MXB7846 mon-  
itors battery voltages from 0 to 6V. An internal resistor  
network divides down V  
by 4 so that a 6.0V battery  
BAT  
voltage results in 1.5V at the ADC input. To minimize  
power consumption, the divider is only enabled during  
The differential conversion method uses two measure-  
ment points. The first measurement (Temp0) is per-  
formed with a fixed bias current into the PENIRQ diode.  
The second measurement (Temp1) is performed with a  
fixed multiple of the original bias current with an  
address of A2 = 1, A1 = 1, and A0 = 1. The voltage dif-  
ference between the first and second conversion is  
proportional to the absolute temperature and is  
expressed by the following formula:  
the sampling of V  
.
BAT  
Internal Reference  
Enable the internal 2.5V reference by setting PD1 in the  
control byte to a logic 1 (see Tables 3 and 4). The  
MXB7846 uses the internal reference for single-ended  
measurement mode, battery monitoring, temperature  
measurement, and for measurement on the auxiliary  
input. To minimize power consumption, disable the inter-  
nal reference by setting PD1 to a logic 0 when performing  
ratiometric position measurements. The internal 2.5V ref-  
erence typically requires 10ms to settle (with no external  
load). For optimum performance, connect a 0.1µF capac-  
itor from REF to GND. This internal reference can be over-  
driven with an external reference. For best performance,  
the internal reference should be disabled when the exter-  
nal reference is applied. The internal reference of the  
MXB7846 must also be disabled to maintain compatibility  
with the MXB7843. To disable the internal reference of the  
MXB7846 after power-up, a control byte with PD1 = 0 is  
required. (See Typical Operating Characteristics for  
power-up time of the reference from power down.)  
VREF  
4096  
T(°C)= 2.60 × (T1 T0)  
× 1000  
273  
where T0 (Temp0) and T1 (Temp1) are the conversion  
results.  
This differential conversion method can provide much  
improved absolute temperature measurement; however,  
the resolution is reduced to 1.6°C/LSB.  
External Reference  
Although the internal reference may be overdriven with  
an external reference, the internal reference should be  
disabled (PD1 = 0) for best performance when using  
an external reference. During conversion, an external  
reference at REF must deliver up to 40µA DC load cur-  
rent. If the reference has a higher output impedance or  
is noisy, bypass it close to the REF pin with a 0.1µF and  
a 4.7µF capacitor. Temperature measurements are  
always performed using the internal reference.  
DC/DC  
CONVERTER  
+2.375V TO +5.25V  
BATTERY  
0 TO 6.0V  
V
DD  
BAT  
0 TO 1.5V  
12-BIT ADC  
7.5kΩ  
Digital Interface  
Initialization After Power-Up and Starting a  
Conversion  
2.5kΩ  
The digital interface consists of three inputs, DIN, DCLK,  
CS, and one output, DOUT. A logic-high on CS disables  
the MXB7846 digital interface and places DOUT in a  
high-impedance state. Pulling CS low enables the  
MXB7846 digital interface.  
BATTERY  
MEASUREMENT ON  
Figure 8. Battery Measurement Functional Block Diagram  
14 ______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Table 3. Control Byte Format  
BIT 7  
BIT 6  
A2  
BIT 5  
A1  
BIT 4  
A0  
BIT 3  
BIT 2  
BIT 1  
PD1  
BIT 0  
PD0  
START  
MODE  
SER/DFR  
BIT  
7
NAME  
START  
A2  
DESCRIPTION  
Start bit  
Address (Tables 1 and 2)  
6
5
A1  
4
A0  
3
MODE  
SER/DFR  
PD1  
Conversion resolution: 1 = 8 bits, 0 = 12 bits  
2
Conversion mode: 1 = single ended, 0 = differential  
1
Power-down mode (Table 4)  
0
PD0  
Start a conversion by clocking a control byte into DIN  
(Table 3) with CS low. Each rising edge on DCLK  
clocks a bit from DIN into the MXB7846’s internal shift  
register. After CS falls, the first arriving logic 1 bit  
defines the control byte’s START bit. Until the START bit  
arrives, any number of logic 0 bits can be clocked into  
DIN with no effect.  
Figure 9 shows the timing for this sequence. Byte RB2  
and RB3 contain the result of the conversion, padded  
with four trailing zeros. The total conversion time is a  
function of the serial-clock frequency and the amount of  
idle timing between 8-bit transfers.  
Digital Output  
The MXB7846 outputs data in straight binary format. Data  
is clocked out on the falling edge of the DCLK MSB first.  
The MXB7846 is compatible with SPI/QSPI/MICROWIRE  
devices. For SPI, select the correct clock polarity and  
sampling edge in the SPI control registers of the micro-  
controller: set CPOL = 0 and CPHA = 0. MICROWIRE,  
SPI, and QSPI all transmit a byte and receive a byte at  
the same time. The simplest software interface requires  
only three 8-bit transfers to perform a conversion (one 8-  
bit transfer to configure the ADC, and two more 8-bit  
transfers to read the conversion result; Figure 9).  
Serial Clock  
The external clock not only shifts data in and out, but it  
also drives the analog-to-digital conversion steps.  
BUSY pulses high for one clock period after the last bit  
of the control byte. Successive-approximation bit deci-  
sions are made and appear at DOUT on each of the  
next 12 DCLK falling edges. BUSY and DOUT go into a  
high-impedance state when CS goes high.  
Simple Software Interface  
Make sure the CPU’s serial interface runs in master  
mode so the CPU generates the serial clock. Choose a  
clock frequency from 500kHz to 2MHz:  
The conversion must complete in 500µs or less; if not,  
droop on the sample-and-hold capacitors can degrade  
conversion results.  
1) Set up the control byte and call it TB. TB should be  
in the format: 1XXXXXXX binary, where X denotes  
the particular channel, selected conversion mode,  
and power mode (Tables 3, 4).  
Data Framing  
The falling edge of CS does not start a conversion. The  
first logic high clocked into DIN is interpreted as a start  
bit and defines the first bit of the control byte. A conver-  
sion starts on DCLK’s falling edge, after the eighth bit of  
the control byte is clocked into DIN.  
2) Use a general-purpose I/O line on the CPU to pull  
CS low.  
The first logic 1 clocked into DIN after bit 6 of a conver-  
sion in progress is clocked onto the DOUT pin and is  
treated as a START bit (Figure 10).  
3) Transmit TB and simultaneously receive a byte; call  
it RB1.  
4) Transmit a byte of all zeros ($00 hex) and simultane-  
ously receive byte RB2.  
Once a start bit has been recognized, the current con-  
version must be completed.  
5) Transmit a byte of all zeros ($00 hex) and simultane-  
ously receive byte RB3.  
6) Pull CS high.  
______________________________________________________________________________________ 15  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Table 4. Power-Mode Selection  
SUPPLY CURRENT (typ) (µA)  
PD1  
PD0  
PENIRQ  
STATUS  
DURING  
CONVERSION  
200  
AFTER  
CONVERSION  
1
0
0
1
1
0
1
0
1
Enabled  
Disabled  
Disabled  
Disabled  
ADC is ON during conversion, OFF between conversion  
ADC is always ON, reference is always OFF  
ADC is always OFF, reference is always ON  
ADC is always ON, reference is always ON  
200  
400  
600  
200  
400  
600  
CS  
T
R
R
B3  
B
B2  
t
ACQ  
DCLK  
DIN  
1
4
8
9
12  
16  
20  
24  
SER/  
DFR  
S
A2  
IDLE  
A1  
A0 MODE  
PD1 PD0  
ACQUIRE  
CONVERSION  
IDLE  
(START)  
BUSY  
DOUT  
RB1  
11  
10  
9
8
7
6
5
4
3
2
1
0
(MSB)  
(LSB)  
A/D STATE  
IDLE  
CONVERSION  
IDLE  
ACQUIRE  
DRIVERS 1 AND 2  
(SER/DFR HIGH)  
OFF  
OFF  
ON  
OFF  
ON  
DRIVERS 1 AND 2  
(SER/DFR LOW)  
OFF  
Figure 9. Conversion Timing, 24-Clock per Conversion, 8-Bit Bus Interface  
8-Bit Conversion  
The fastest the MXB7846 can run with CS held continu-  
The MXB7846 provides an 8-bit conversion mode  
selected by setting the MODE bit in the control byte  
high. In the 8-bit mode, conversions complete four  
clock cycles earlier than in the 12-bit output mode,  
resulting in 25% faster throughput. This can be used in  
conjunction with serial interfaces that provide 12-bit  
transfers, or two conversions could be accomplished  
with three 8-bit transfers. Not only does this shorten each  
conversion by 4 bits, but each conversion can also  
occur at a faster clock rate since settling to better than 8  
bits is all that is required. The clock rate can be as much  
as 25% faster. The faster clock rate and fewer clock  
cycles combine to increase the conversion rate.  
ously low is 15 clock conversions. Figure 10 shows the  
serial-interface timing necessary to perform a conver-  
sion every 15 DCLK cycles. If CS is connected low and  
DCLK is continuous, guarantee a start bit by first clock-  
ing in 16 zeros.  
Most microcontrollers (µCs) require that data transfers  
occur in multiples of eight DCLK cycles; 16 clocks per  
conversion is typically the fastest that a µC can drive the  
MXB7846. Figure 11 shows the serial interface timing nec-  
essary to perform a conversion every 16 DCLK cycles.  
16 ______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
and Y- drivers are turned on, connecting one side of  
the vertical resistive layer to V and the other side to  
Data Format  
The MXB7846 output data is in straight binary format as  
shown in Figure 12. This figure shows the ideal output  
code for the given input voltage and does not include  
the effects of offset, gain, or noise.  
DD  
ground. In this case, the horizontal resistive layer func-  
tions as a sense line. One side of this resistive layer  
gets connected to the X+ input, while the other side is  
left open or floating. The point where the touch screen  
is pressed brings the two resistive layers in contact and  
forms a voltage-divider at that point. The data converter  
senses the voltage at the point of contact through the  
X+ input and digitizes it. The horizontal layer resistance  
does not introduce any error in the conversion because  
no DC current is drawn.  
Applications Information  
Basic Operation of the MXB7846  
The 4-wire touch-screen controller works by creating a  
voltage gradient across the vertical or horizontal resis-  
tive network connected to the MXB7846, as shown in  
the Typical Application Circuit. The touch screen is  
biased through internal MOSFET switches that connect  
The conversion process of the analog input voltage to  
digital output is controlled through the serial interface  
between the A/D converter and the µP. The processor  
controls the MXB7846 configuration through a control  
byte (see Tables 3 and 4). Once the processor instructs  
each resistive layer to V  
and ground on an alternate  
DD  
basis. For example, to measure the Y position when a  
pointing device presses on the touch screen, the Y+  
CS  
1
8
15  
1
8
15  
1
DCLK  
DIN  
S
CONTROL BYTE 0  
S
CONTROL BYTE 1  
S
CONTROL BYTE 2  
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0  
CONVERSION RESULT 1  
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0  
CONVERSION RESULT 0  
DOUT  
BUSY  
Figure 10. 15-Clock/Conversion Timing  
. . .  
. . .  
. . .  
CS  
1
8
16  
1
8
16  
DCLK  
DIN  
S
CONTROL BYTE 0  
S
CONTROL BYTE 1  
B6 . . .  
. . .  
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0  
CONVERSION RESULT 0  
B11 B10 B9 B8 B7  
CONVERSION RESULT 1  
DOUT  
BUSY  
Figure 11. 16-Clock/Conversion Timing  
______________________________________________________________________________________ 17  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
the MXB7846 to initiate a conversion, the MXB7846  
biases the touch screen through the internal switches at  
the beginning of the acquisition period. The voltage  
transient at the touch screen needs to settle down to a  
stable voltage before the acquisition period is over.  
After the acquisition period is over, the A/D converter  
goes into a conversion period with all internal switches  
turned off if the device is in single-ended mode. If the  
device is in differential mode, the internal switches  
remain on from the start of the acquisition period to the  
end of the conversion period.  
The power-up wait before conversion period is depen-  
dent on the power-down state. When exiting software  
low-power modes, conversion can start immediately  
when running at decreased clock rates. Upon power-  
on reset, the MXB7846 is in power-down mode with  
PD1 = 0 and PD0 = 0. When exiting software shutdown,  
the MXB7846 is ready to perform a conversion in 10µs  
with an external reference. When using the internal ref-  
erence, allow enough time for reference to settle to 12-  
bit accuracy when exiting full power-down mode, as  
shown in the Typical Operating Characteristics.  
Power-On Reset  
When power is first applied, internal power-on circuitry  
resets the MXB7846. Allow 10µs for the first conversion  
after the power supplies stabilize. If CS is low, the first  
logic 1 on DIN is interpreted as a start bit. Until a con-  
version takes place, DOUT shifts out zeros. On power-  
up, allow time for the reference to stabilize.  
PD1 = 1, PD0 = 1  
In this mode, the MXB7846 is always powered up and  
both the reference and the ADC are always on. The  
device remains fully powered after the current conver-  
sion completes.  
PD1 = 0, PD0 = 0  
In this mode, the MXB7846 powers down after the cur-  
rent conversion completes or on the next rising edge of  
CS, whichever occurs first. The next control byte  
received on DIN powers up the MXB7846. At the start  
of a new conversion, it instantly powers up. When each  
conversion is finished, the part enters power-down  
mode, unless otherwise indicated. The first conversion  
after the ADC returns to full power is valid for differen-  
tial conversions and single-ended measurement con-  
versions when using an external reference.  
Power Modes  
Save power by placing the converter in one of two low-  
current operating modes or in full power down between  
conversions. Select the power-down mode through  
PD1 and PD0 of the control byte (Tables 3 and 4).  
The software power-down modes take effect after the  
conversion is completed. The serial interface remains  
active while waiting for a new control byte to start a con-  
version and switches to full-power mode. After complet-  
ing its conversion, the MXB7846 enters the programmed  
power mode until a new control byte is received.  
When operating at full speed and 16 clocks per conver-  
sion, the difference in power consumption between  
PD1 = 0, PD0 = 1, and PD1 = 0, PD0 = 0 is negligible.  
Also, in the case where the conversion rate is  
decreased by slowing the frequency of the DCLK input,  
the power consumption between these two modes is  
not very different. When the DCLK frequency is kept at  
the maximum rate during a conversion, conversions are  
done less often. There is a significant difference in  
power consumption between these two modes.  
OUTPUT CODE  
FULL-SCALE  
TRANSITION  
11…111  
11…110  
11…101  
FS = (V  
- V )  
REF-  
REF+  
PD1 = 1, PD0 = 0  
In this mode, the MXB7846 is powered down. This  
mode becomes active after the current conversion  
completes or on the next rising edge of CS, whichever  
occurs first. The next command byte received on the  
DIN returns the MXB7846 to full power. The first conver-  
sion after the ADC returns to full power is valid.  
(V  
- V  
)
REF+  
REF-  
1LSB =  
4096  
00…011  
00…010  
00…001  
PD1 = 0, PD0 = 1  
This mode turns the internal reference off and leaves  
the ADC on to perform conversions using an external  
reference.  
00…000  
0
1
2
3
FS  
FS-3/2LSB  
INPUT VOLTAGE (LSB) = [(V ) - (V )]  
+IN -IN  
Figure 12. Ideal Input Voltages and Output Codes  
18 ______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Hardware Power-Down  
CS also places the MXB7846 into power-down. When  
I/O  
SCK  
CS  
CS goes HIGH, the MXB7846 immediately powers  
down and aborts the current conversion. The internal  
reference does not turn off when CS goes high. To dis-  
able the internal reference, an additional command  
byte is required before CS goes high (PD1 = 0). Set  
PD1 = 0 before CS goes high.  
DCLK  
DOUT  
MISO  
MICROWIRE  
MXB7846  
MOSI  
DIN  
MASKABLE  
INTERRUPT  
BUSY  
Touch-Screen Settling  
There are two key touch-screen characteristics that can  
degrade accuracy. First, the parasitic capacitance  
between the top and bottom layers of the touch screen  
can result in electrical ringing. Second, vibration of the  
top layer of the touch screen can cause mechanical  
contact bouncing.  
Figure 13. MICROWIRE Interface  
I/O  
SCK  
CS  
External filter capacitors may be required across the  
touch screen to filter noise induced by the LCD panel  
or backlight circuitry, etc. These capacitors lengthen  
the settling time required when the panel is touched  
and can result in a gain error, as the input signal may  
not settle to its final steady-state value before the ADC  
samples the inputs. Two methods to minimize or elimi-  
nate this issue are described below.  
DCLK  
DOUT  
MISO  
QSPI/SPI  
MXB7846  
MOSI  
DIN  
MASKABLE  
INTERRUPT  
BUSY  
One option is to lengthen the acquisition time by stopping  
or slowing down DCLK, allowing for the required touch-  
screen settling time. This method solves the settling time  
problem for both single-ended and differential modes.  
Figure 14. QSPI/SPI Interface  
The second option is to operate the MXB7846 in the dif-  
ferential mode only for the touch screen, and perform  
additional conversions with the same address until the  
input signal settles. The MXB7846 can then be placed  
in the power-down state on the last measurement.  
XF  
CLKX  
CLKR  
CS  
SCLK  
TMS320LC3x  
MXB7846  
DIN  
DX  
DR  
Connection to Standard Interface  
DOUT  
BUSY  
MICROWIRE Interface  
When using the MICROWIRE- (Figure 13) or SPI-com-  
patible interface (Figure 14), set the CPOL = CPHA = 0.  
Two consecutive 8-bit readings are necessary to obtain  
the entire 12-bit result from the ADC. DOUT data transi-  
tions occur on the serial clock’s falling edge and are  
clocked into the µP on the DCLK’s rising edge. The first  
8-bit data stream contains the first 8 bits of the current  
conversion, starting with the MSB. The second 8-bit  
data stream contains the remaining 4 result bits fol-  
lowed by 4 trailing zeros. DOUT then goes high imped-  
ance when CS goes high.  
FSR  
Figure 15. TMS320 Serial Interface  
TMS320LC3x Interface  
Figure 15 shows an example circuit to interface the  
MXB7846 to the TMS320. The timing diagram for this  
interface circuit is shown in Figure 16.  
Use the following steps to initiate a conversion in the  
MXB7846 and to read the results:  
1) The TMS320 should be configured with CLKX (trans-  
mit clock) as an active-high output clock and CLKR  
(TMS320 receive clock) as an active-high input  
clock. CLKX and CLKR on the TMS320 are connect-  
ed to the MXB7846 DCLK input.  
QSPI/SPI Interface  
The MXB7846 can be used with the QSPI/SPI interface  
using the circuit in Figure 14 with CPOL = 0 and CPHA  
= 0. This interface can be programmed to do a conver-  
sion on any analog input of the MXB7846.  
______________________________________________________________________________________ 19  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
CS  
DCLK  
DIN  
START  
A2  
A1  
A0  
MODE  
SER/DEF  
PD1  
PD0  
BUSY  
DOUT  
HIGH IMPEDANCE  
HIGH IMPEDANCE  
MSB  
B10  
B1  
B0  
Figure 16. MXB7846-to-TMS320 Serial Interface Timing Diagram  
Power-supply decoupling is also crucial for optimal  
device performance. A good way to decouple analog  
supplies is to place a 10µF tantalum capacitor in paral-  
lel with a 0.1µF capacitor bypassed to GND. To maxi-  
mize performance, place these capacitors as close as  
possible to the supply pin of the device. Minimize  
capacitor lead length for best supply-noise rejection. If  
the supply is very noisy, a 10resistor can be connect-  
ed in series as a lowpass filter.  
2) The MXB7846’s CS pin is driven low by the TMS320’s  
XF I/O port to enable data to be clocked into the  
MXB7846’s DIN pin.  
3) An 8-bit word (1XXXXXXX) should be written to the  
MXB7846 to initiate a conversion and place the  
device into normal operating mode. See Table 3 to  
select the proper XXXXXXX bit values for your spe-  
cific applications.  
4) The MXB7846’s BUSY output is monitored through  
the TMS320’s FSR input. A falling edge on the BUSY  
output indicates that the conversion is in progress  
and data is ready to be received from the device.  
While using the MXB7846, the interconnection between  
the converter and the touch screen should be as short  
as possible. Since touch screens have low resistance,  
longer or loose connections may introduce error. Noise  
can also be a major source of error in touch-screen  
applications (e.g., applications that require a backlight  
LCD panel). EMI noise coupled through the LCD panel  
to the touch screen may cause flickering of the convert-  
ed data. Utilizing a touch screen with a bottom-side  
metal layer connected to ground decouples the noise  
to ground. In addition, the filter capacitors from Y+, Y-,  
X+, and X- inputs to ground also help further reduce  
the noise. Caution should be observed for settling time  
of the touch screen, especially operating in the single-  
ended measurement mode and at high data rates.  
5) The TMS320 reads in 1 data bit on each of the next  
16 rising edges of DCLK. These bits represent the  
12-bit conversion result followed by 4 trailing bits.  
6) Pull CS high to disable the MXB7846 until the next  
conversion is initiated.  
Layout, Grounding, and Bypassing  
For best performance, use printed circuit (PC) boards  
with good layouts; wire-wrap boards are not recommend-  
ed. Board layout should ensure that digital and analog  
signal lines are separated from each other. Do not run  
analog and digital (especially clock) lines parallel to one  
another, or digital lines underneath the ADC package.  
Definitions  
Establish a single-point analog ground (star ground  
point) at GND. Connect all analog grounds to the star  
ground. Connect the digital system ground to the star  
ground at this point only. For lowest noise operation,  
minimize the length of the ground return to the star  
ground’s power supply.  
Integral Nonlinearity  
Integral nonlinearity (INL) is the deviation of the values  
on an actual transfer function from a straight line. This  
straight line can be either a best-straight-line fit or a line  
drawn between the endpoints of the transfer function,  
once offset and gain errors have been nullified. The  
static linearity parameters for the MXB7846 are mea-  
sured using the end-point method.  
20 ______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Differential Nonlinearity  
Differential nonlinearity (DNL) is the difference between  
an actual step width and the ideal value of 1LSB. A  
DNL error specification of less than 1LSB guarantees  
no missing codes and a monotonic transfer function.  
Aperture Delay  
Aperture delay (t ) is the time defined between the  
AD  
falling edge of the sampling clock and the instant when  
an actual sample is taken.  
Chip Information  
TRANSISTOR COUNT: 12,000  
Aperture Jitter  
Aperture jitter (t ) is the sample-to-sample variation in  
AJ  
PROCESS: 0.6µm BiCMOS  
the time between the samples.  
Typical Application Circuit  
2.375V TO 5.5V  
1µF TO 10µF  
0.1µF  
OPTIONAL  
1
2
3
4
+V  
X+  
Y+  
X-  
Y-  
DCLK 16  
CS 15  
SERIAL/CONVERSION CLOCK  
CHIP SELECT  
DD  
SERIAL DATA IN  
DIN 14  
CONVERTER STATUS  
SERIAL DATA OUT  
PEN INTERRUPT  
MXB7846 BUSY 13  
DOUT 12  
TOUCH  
5
6
7
8
SCREEN  
TO BATTERY  
GND  
BAT  
AUX  
PENIRQ 11  
+V  
10  
9
DD  
50kΩ  
AUXILIARY  
INPUT  
REF  
0.1µF  
VOLTAGE  
REGULATOR  
______________________________________________________________________________________ 21  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Package Information  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
PACKAGE OUTLINE, QSOP .150", .025" LEAD PITCH  
1
21-0055  
E
1
22 ______________________________________________________________________________________  
2.375V to 5.25V, 4-Wire Touch-Screen Controller  
with Internal Reference and Temperature Sensor  
Package Information (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 23  
© 2004 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products.  

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