PHY1095 [MAXIM]
1.25Gbps High Sensitivity Transimpedance Amplifier;
| 型号： | PHY1095 |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | 1.25Gbps High Sensitivity Transimpedance Amplifier |
| 文件： | 总10页 (文件大小：329K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-5689; Rev 1/11
PHY1095-01
A Maxim Integrated Products Brand
1.25Gbps High Sensitivity Transimpedance Amplifier
Features
• -32dBm Sensitivity
• Up to 1.25Gbps (NRZ) data rates
• 60nA rms typical input referred noise
• Automatic gain control
Description
The PHY1095 is a transimpedance amplifier
designed for use within small form factor fibre
optic modules targeted at Gigabit Enabled
Passive Optical Network (GEPON) applications.
Working from a 3.3V power supply the PHY1095
integrates a low noise transimpedance amplifier,
with a typical differential transimpedance of
60kΩ, an AGC and an output stage.
• Flexible bond pad layout and output signal
inversion for simple ROSA layout
• Received Signal Strength Indicator output
with selectable direction of current flow
The RSSI pad can be used to implement a signal
strength monitor circuit. This is designed to sink
or source a current equal to the photodiode
current for ease of interfacing.
• -40 to +95°C operating temperature range
Sensitivity of -32dBm can be achieved at
Applications
• GEPON Optical Network Unit (ONU)
• Gigabit Ethernet
1.25Gbps using
a
photodiode with 0.5pF
capacitance and a responsivity of 0.8A/W at a
wavelength of 1490nm.
The PHY1095 is available in die form for
mounting on a header to create a ROSA when
combined with suitable optics and photo-detector
diode.
VCC
Voltage
Regulator
5Ω0
5Ω0
Signal Detect
& DC Restore
PDC1/2
R
F
RX+
RX-
AGC
Amp
O/P
Buffer
PDA
GND
Amplifier
Signal
Strength
Indicator
RSSI_DIR
RSSI
AGC
DATA_INVERT
Figure 1: Outline block diagram
Figure 2: Device pad layout
PHY1095-01-RD-1.1
Datasheet
Page 1
1 Ordering Information
Part Number
Description
Package
PHY1095-01DS-WR
1.25G High Sensitivity TIA
Bare die in waffle pack
PHY1095-01DS-FR
1.25G High Sensitivity TIA
Film on grip ring
2 Pad Description
Number
Name
Type
Description
1
GND1
PWR
Analog
Analog
Analog
PWR
Connect to Analog Ground
2
3
4
5
PDC1
PDA
Regulated Power supply to Photodiode Cathode
Connect to Photodiode anode, input to TIA stage
Regulated Power supply to Photodiode Cathode
Connect to Analog Ground
PDC2
GND2
Received Signal Strength output. Sinks or sources current
equal to PD current
6
RSSI
Analog Out
7
8
VCC1
VCC2
RX-
PWR
PWR
3.3 Volt Power supply connection
3.3 Volt Power supply connection
9
Analog Out Differential Analog Output pair with RX+
10
11
12
GND3
GND4
GND5
GND
GND
GND
Connect to Analog Ground
Connect to Analog Ground
Connect to Analog Ground
Analog
Input
13
DATA_INVERT
Inverts polarity of data output pins RX+ and RX-
14
15
16
17
18
19
20
GND6
GND7
GND8
RX+
GND
GND
GND
Connect to Analog Ground
Connect to Analog Ground
Connect to Analog Ground
Analog Out Differential Analog Output pair with RX-
AGC
Analog
PWR
Disables AGC amplifier function when connected to GND
VCC3
VCC4
3.3 Volt Power supply connection
3.3 Volt Power supply connection
PWR
Selects whether RSSI output is a current sink or source.
Open circuit is a current sink, connect to Ground for current
source
Analog
Input
21
RSSI_DIR
PHY1095-01-RD-1.1
Datasheet
Page 2
3 Device Specifications
3.1 Absolute Maximum Ratings
Exceeding these limits may cause permanent damage. Correct operation under these conditions is not implied. Extended periods of
operation under these conditions may affect device reliability.
Parameter
Conditions
Min
Max
Unit
Supply voltage
-0.5
4.0
V
Maximum Voltage on signal pins
Device Operating Temperature
Storage Temperature
-0.5
-55
Vcc + 0.5V
+115
V
Measured on Die
°C
°C
°C
150
Die Attach Temperature
400
Average input current, VCC > 3.0V, PIN
photodiode biased internally from PDC,
ER=10dB
3.0
mA
PDA Input Current1
ESD Performance
Ramp time of input current to maximum
(0mA to 3mA) from initial optical input
200
µs
Human Body Model (excluding PDA pin)
Human Body Model (PDA pin)
2.0
0.5
kV
kV
Notes: 1 See section 4.1 in case of external Vpd biasing of the photodiode
3.2 Recommended Operating Conditions
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage
3.0
3.3
3.6
V
Current consumption
Including output termination
30
42
55
95
mA
°C
Ambient Operating temperature
Photodiode Capacitance
-40
Photodiode bias voltage 1.8V
1.0
pF
PHY1095-01-RD-1.1
Datasheet
Page 3
3.3 Parametric Performance
Parameter
Conditions
Min
Typ
Max
Unit
High-speed data input rate
CIN = 0.5pF
1.25
Gbps
CIN = 0.5pF, Responsivity = 0.8A/W,
BER = 10-12 ER = 10dB
-31.5
dBm
Sensitivity Examples
CIN = 0.5pF, Responsivity = 0.8A/W,
BER = 10-10 ER = 10dB
-32.0
60
dBm
C
IN = 0.5pF, Measured into a 940MHz, 4th
Input referred noise
90
nA rms
order Bessel filter.
Small Signal Bandwidth (-3dB)
Low frequency cut-off
Relative to 100MHz, CIN = 0.5pF
Relative to +100MHz
1MHz to 630MHz
750
320
860
25
MHz
kHz
dB
Gain Variation with Frequency
±2
Input current > 8µA pp
100Ω differential load, 1.25Gbps
Differential Output Swing 1
400
480
mVp-p
Parameter
Conditions
Min
Typ
Max
Unit
Transimpedance (differential)
Input current <8µAp-p
50k
60k
70k
Ω
Deterministic Jitter
Overshoot
K28.5 Pattern
25
50
mUIp-p
%
27-1PRBS (wrt to average 0/1 level)
27-1PRBS (wrt average 0/1 level)
DJ within spec
±15
±15
Undershoot
%
Input Overload, a.c.
Input Overload d.c.
AGC settling time
1.5
1.0
mApp
mA
µs
DJ within spec
50
120
Output resistance
Photodiode Cathode Voltage
Photodiode Anode Voltage
RSSI Current Accuracy
Differential RX+ to RX-
80
100
2.6
0.8
Ω
0.3µA photodiode current
2.5
2.7
V
1.0
V
Measured relative to photodiode current
Source mode, IIN=0.5mA
Sink mode, IIN=0.5mA
±20
%
0
1.1
V
RSSI Compliance Voltage
0.7
30
VDD-0.8
V
Power Supply Rejection Ratio
100kHz - 4MHz
40
dB
Notes: 1 Expected load is 2 x 50 ohms
PHY1095-01-RD-1.1
Datasheet
Page 4
4 Device Description
The PHY1095 implements a complete analog front end, converting the photo-detector current, into a
differential analog voltage signal.
The PHY1095 also provides a filtered bias current to the photo-detector to increase the level of component
integration as well as the signal processing functions.
4.1 Photodiode Connection
The recommended method to connect a PIN photodiode to PHY1095 is using the internal voltage reference
to bias the Photodiode as shown in figure 3. The internal reference supplies a low noise output with high
power supply rejection to 4GHz.
Connection of a PIN photodiode to the PDA input with an external Vpd bias supply can produce inconsistent
sensitivity and bandwidth operation. The maximum damage level for the PDA input is reduced to <1mA when
PDA is connected in this way.
The voltage across the photodiode is equal to the power supply voltage, Vpdc minus the input bias voltage of
the input of the PHY1095, equal to Vpda. The anode voltage, Vpda is sensitive to temperature and has a
typical value of 0.8V.
3.3V
Vcc
RSSI
MON
Internal Voltage
Reference
PDC1
Vpdc
PDA
Vpda
0V
PHY1095
Figure 3 – Photodiode biased by internal voltage regulator
4.2 DC Cancellation
The removal of the direct current component of the input signal is necessary to reduce the pulse width
distortion for signals with a 50% mark density.
The DC cancellation block provides low frequency feedback using an internally compensated amplifier,
removing the need for external compensation capacitors.
PHY1095-01-RD-1.1
Datasheet
Page 5
4.3 Transimpedance Amplifier (TIA)
The transimpedance (current to voltage) stage is a very low noise amplifier with a feedback resistor to set the
gain. This stage features automatic gain control, where the transimpedance depends on the output signal
level. This ensures that the output does not overload the subsequent stage in the signal path.
An internal voltage regulator is used to power the front-end transimpedance amplifier in order to improve the
rejection of power supply noise.
4.4 Output Gain Stage
The output gain stage features a voltage amplifier, a single ended to differential converter and a supply
referenced differential output buffer.
The PHY1095 has a 50Ω single ended output impedance, which is suitable for the majority of applications.
For optimum supply-noise rejection, the PHY1095 should be terminated differentially.
4.5 Output Data Polarity
The data polarity pin has an internal 8kΩ pull-up resistor. In normal non-inverting operation, where there is no
external connection, the pin pulls to VDD. In this mode an optical '1' gives maximum input current and a
voltage '1' on the positive output pin Rx+. Connection of the pad to ground selects an inverted sense output.
4.6 Received Signal Strength Indication (RSSI)
The PHY1095 provides a RSSI output which can be used to measure the strength of the received optical
signal. The photodiode current is proportional to the received optical power. The PHY1095 generates an
output current which is a mirror of the photodiode current. The RSSI output is either a current sink or a
current source.
The direction of current flow is selected by using the RSSI_DIR bond. Leaving this bond pad unconnected
selects a current sink, connecting this bond pad to ground selects a current source.
An alternative method of measuring the received signal power is by using the received Optical Modulation
Amplitude (OMA). This method is provided by the PHY1078 integrated burst mode laser driver and post
amplifier device.
PHY1095-01-RD-1.1
Datasheet
Page 6
5 Typical Application
VCC
PHY1095
PHY1078
Voltage
Regulator
5Ω0
5Ω0
Signal Detect
& DC Restore
PDC1/2
PDA
R
F
RX+
RX-
RXIN+
RXIN-
RXOUT+
RXOUT-
O/P
Buffer
CML
Output
Input
Amp
Low Pass
Filter
AGC
Amp
Amplifier
Signal
Strength
Indicator
Overload
GND
RSSI
AGC
DATA_INVERT
Figure 4 - Typical Application: GEPON ONU Receiver path
Figure 4 shows a typical application for the PHY1095. In this application the output of the PHY1095 is
connected to the Phyworks PHY1078 PON Laser Driver and Post Amplifier circuit to form the receive path for
a fibre optic module.
The PHY1078 provides the receive signal monitoring functions such as loss of signal and converts the input
data into a variety of electrical formats.
5.1 Layout and Bonding
In order to achieve the best performance it is necessary to minimise noise pickup and to reduce the effects of
parasitic components.
Noise is picked up through the signal paths or through the power supply. Noise at the input of the TIA will be
amplified and mixed with the wanted signal. This can be a result of noise pickup in the other components
connected to the TIA input, such as the photodiode, the capacitors and the bond wires.
Noise picked up in the signal path can be reduced by keeping bond wires short and by making sure the
output and input bond wires are not close and are orthogonal to each other,
Power supply noise will be present as a result of the power supply design, the quality of decoupling
precautions and pickup in the bond wires.
To effectively de-couple supply rail noise to ground a capacitor may be placed inside the ROSA. This should
be placed as close as possible to the VCC pin on the TIA. This reduces the effect of the bond wire
inductance.
The high PSRR performance of PHY1095 enables the decoupling capacitor to be omitted and fewer ground
bonds used without degradation to sensitivity. See Figure 6 and 7 for this low cost bonding option.
Decoupling for supply and RSSI is recommended to be used on the optical host board.
Noise on the power supply can also be a result of coupling between the TIA output and the power supply.
This coupling takes place between the output bond wires and the power supply bond wires. As a result these
must also be kept as short as possible and be routed orthogonally to each other.
The PHY1095 provides alternative bonding options through the replication of some device inputs and
outputs, allowing a variety of ROSA pin outs to be realised without compromising performance.
PHY1095-01-RD-1.1
Datasheet
Page 7
6 Mechanical Specifications
6.1 TO-Can Connections
Top-view: looking into the CD header. The diagrams below show an internal power supply decoupling
capacitor and illustrate the optimum bondwire lengths and orientation. The value of the supply de-coupling
capacitor should be 250 – 500 pF.
RX-
RX+
Capacitor
VCC
Photodiode
MON
Figure 5 - 5 pin ROSA with decoupling
RX-
RX+
RX-
RX+
Photodiode
Photodiode
VCC
MON
VCC
GND
Figure 6 – Low Cost 4 pin ROSA
Figure 7 – Low Cost 5 pin ROSA
PHY1095-01-RD-1.1
Datasheet
Page 8
7 Pad Positions and Sizes
Die Size:
1100µm x 900µm
Thickness:
290µm +/- 10 µm
Pad Opening: 80 µm x 80 µm measured between parallel sides
Pad centres
Number
Name
X
Y
1
2
GND1
PDC1
-439.5
221.5
-439.5
-412.5
-439.5
-439.5
-320.095
-219.5
-121.5
55.09
113
0
3
PDA
4
PDC2
-113
5
GND2
RSSI
-221.5
-339.5
-339.5
-339.5
-339.5
-339.5
-339.5
-221.5
-123.5
0
6
7
VCC1
8
VCC2
9
AGC
10
11
12
13
14
15
16
17
18
19
20
21
RX-
222.1
GND3
GND4
GND5
DATA_INVERT
GND6
GND7
GND8
RX+
321.5
439.5
439.5
439.5
439.5
123.5
221.5
339.5
339.5
339.5
339.5
339.5
439.5
321.5
222.1
VCC3
-121.5
-219.5
-320.095
VCC4
RSSI_DIR
Table 1: PHY1095 pad coordinates
Figure 8: PHY1095 Die image
PHY1095-01-RD-1.1
Datasheet
Page 9
8 Contact Information
For technical support, contact Maxim at www.maxim-ic.com/support.
Disclaimer
This datasheet contains preliminary information and is subject to change.
This document does not transfer or license any intellectual property rights to the user. It does not imply any
commitment to produce the device described and is intended as a proposal for a new device.
Phyworks Ltd assumes no liability or warranty for infringement of patent, copyright or other intellectual
property rights through the use of this product.
Phyworks Ltd assumes no liability for fitness for particular use or claims arising from sale or use of its
products.
Phyworks Ltd products are not intended for use in life critical or sustaining applications.
PHY1095-01-RD-1.1
Datasheet
Page 10
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent
licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, Inc. 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
2011 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
相关型号：
©2020 ICPDF网 联系我们和版权申明