2SD669 [MCC]
NPN Silicon Plastic-Encapsulate Transistor; NPN硅塑封装晶体管
| 型号： | 2SD669 |
| 厂家： | 
Micro Commercial Components |
| 描述： | NPN Silicon Plastic-Encapsulate Transistor |
| 文件： | 总2页 (文件大小：267K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2SD669(A)
2SD669(A)-B
2SD669(A)-C
2SD669-D
M C C
Micro Commercial Components
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Features
·
Lead Free Finish/RoHS Compliant (Note1) ("P" Suffix designates
NPN Silicon
Plastic-Encapsulate
Transistor
RoHS Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
Capable of 1 Watts of Power Dissipation.
Collector-current 1.5A
·
·
•
•
•
•
Collector-base Voltage 180V
Operating and storage junction temperature range: -55OC to +150OC
ꢀꢁꢂꢃꢄꢅꢆ
K
A
O
Electrical Characteristics @ 25 C Unless Otherwise Specified
N
Symbol
Parameter
Min
Max
Units
OFF CHARACTERISTICS
V(BR)CEO
D
Collector-Emitter Breakdown Voltage
(I =10mAdc, IB=0)
---
---
2SD669
2SD669A
120
160
Vdc
Vdc
C
ꢀ
E
M
B
---
V(BR)CBO
V(BR)EBO
Collector-Base Breakdown Voltage
180
Vdc
(I =1mAdc, IE=0)
C
ꢀ
ꢀ
ꢀ
ꢀ
Emitter-Base Breakdown Voltage
(I =1mAdc, IC=0)
5.0
---
---
---
10
10
Vdc
uAdc
uAdc
E
1
2
3
I
Collector Cutoff Current
(VCB=160Vdc, IE=0)
Emitter Cutoff Current
CBO
L
G
IEBO
(VEB=4Vdc, I =0)
C
ON CHARACTERISTICS
hFE-1
DC Current Gain
C
---
---
(I =150mAdc, VCE=5Vdc)
C
2SD669
2SD669A
60
60
320
200
hFE-2
DC Current Gain
30
---
---
---
---
Vdc
Vdc
(I =500mAdc, VCE=5Vdc)
C
VCE(sat)
VBE
fT
Cob
Collector-Emitter Saturation Voltage
1.0
1.5
(I =500mAdc, IB=50mAdc)
C
F
Q
Base-Emitter Saturation Voltage
(VCE=5Vdc, IC=150mAdc)
PIN 1.
PIN 2.
PIN 3.
EMITTER
COLLECTOR
BASE
J
TransitionFrequency
(VCE=5Vdc, IC=150mAdc)
MHz
pF
140(TYP)
14(TYP)
DIMENSIONS
Collectoroutputcapacitance
(VCB=10Vdc, IE=0,f=1MHz)
ꢀꢁꢂꢃꢄꢅꢆ
ꢇꢀꢁꢆ
ꢇꢇꢆ
ꢈꢀꢇꢆ
ꢇꢉꢊꢆ
ꢇꢀꢁꢆ
7.40
10.60
15.30
3.90
3.00
0.66
1.17
ꢇꢉꢊꢆ
ꢁꢋꢌꢄꢆ
ꢉꢆ
ꢍ
0.291
0.417
0.602
ꢎꢏꢐꢑ4
0.118
0.026
0.046
0.307ꢆ
0.433
0.618
ꢎꢏꢐꢒ1
0.126
0.034
0.054
7.80
11.00
15.70
4.10
3.20
0.86
1.37
FE
ꢂꢆ
ꢈꢆ
ꢄꢆ
ꢓ
CLASSIFICATION OF H
Rank
B
C
D
Range 2SD669
60-120
100-200
160-320
ꢔ
2SD669A
60-120
100-200
ꢕꢆ
0.090TYP
0.098
0.083
0.000
0.043
2.290TYP
ꢖꢆ
0.114
2.50
2.90
Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7.
L
M
N
0.091
0.012
0.059
2.10
0.00
1.10
2.30
0.30
1.50
Q
0.018
0.024
0.45
0.60
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Revision: A
2011/01/01
M C C
Micro Commercial Components
TM
Ordering Information :
Device
Packing
Part Number-BP
Bulk;1Kpcs/Box
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make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components
Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
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represented on our website, harmless against all damages.
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approval of Micro Commercial Components Corporation.
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our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine
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distributors.
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Revision: A
2011/01/01
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