TB10S [MDD]
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS Ideal for printed circuit board; 单相玻璃钝化桥式整流器理想的印刷电路板
| 型号： | TB10S |
| 厂家： | 
Chendahang Electronics Co., Ltd |
| 描述： | SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS Ideal for printed circuit board |
| 文件： | 总2页 (文件大小：273K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB2S THRU TB10S
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS
Voltage Range - 200 to 1000 Volts Current - 0.8/1.0 Ampere
FEATURES
TBS
Ideal for printed circuit board
Reliable low cost construction utilizing
molded plastic technique
5.0± 0.15
High temperature soldering guaranteed:
260 / 10 seconds at 5 lbs., (2.3kg) tension
Small size, simple installation
High surge current capability
Glass passivated chip junction
4.4± 0.15
6.5± 0.2
MECHANICAL DATA
0.65± 0.05
4.0± 0.1
0.6± 0.1
0.25± 0.05
Case: Molded plastic body
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on case
Mounting Position: Any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.
SYMBOLS
UNITS
TB2S
TB4S
TB6S
TB8S
TB10S
MDD Catalog
Number
Maximum repetitive peak reverse voltage
VRRM
VRMS
VDC
VOLTS
VOLTS
VOLTS
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
On glass-epoxy P.C.B.(Note1)
On aluminum substrate(Note2)
Peak forward surge current,
1000
IF(AV)
IFSM
0.8
Amps
1.0
30
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Amps
Volts
Maximum instantaneous forward voltage drop
per leg at 0.4A
VF
IR
0.95
Maximum DC reverse current
at rated DC blocking voltage
TA=25
uA
uA
5
TA=100
100
25
Typical thermal resistance(NOTE 3)
R JL
R JA
/W
80
Operating temperature range
storage temperature range
TJ
-55 to +150
-55 to +150
TSTG
NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads
2.On aluminum substrate P.C.B. with on area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad
3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)
copper pads.
MDD ELECTRONIC
RATINGS AND CHARACTERISTIC CURVES TB2S THRU TB10S
FIG.1 TYPICAL FORWARD CHARACTERISTICS
FIG.2 FORWARD DERATING CURVE
1.0
1.0
Aluminum Substrate
0.4
0.75
0.5
GLASS
EPOXY
P.C.B
0.1
0.25
RESISTIVE OR INDUCTIVE LOAD
0.01
0
0.7 0.8 0.9
1.0 1.1 1.2 1.3 1.4 1.5
0
25
50
75
100
125
150
Instantaneous Forward Voltage, ( V )
Ambient Temperature, (°C )
FIG.3 TYPICAL REVERSE CHARACTERISTICS
FIG.4 PEAK FORWARD SURGE CURRENT
35
30
100000
10000
1000
25
20
15
10
T
A
=100°
C
100
10
T
A
=25°C
5
0
1.0
0
20
40
60
80 100 120 140
1
10
100
Percent Of Rated Peak Reverse Voltage, %
Number Of Cycles At 60H
z
MDD ELECTRONIC
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