MLX80051_技术文档

MLX80050/51/30/31

LIN System Basis ICs

Datasheet

1

2

3

4

8

7

5

VS

EN

VCC

NRES

TxD

Features

MLX80030/50

o

LIN 2.x / SAE J2602 compliant

Operating voltage V_SUP= 5 ... 27 V

3 modes: Normal, Silent and Sleep

Linear low drop voltage regulator:

MLX80030/31:

GND

LIN

RxD

.

Normal mode 3.3V/70mA ±2%

Silent mode 3.3V/20mA ±2%

MLX80050/51:

.

Normal mode 5V/70mA ±2%

Silent mode 5V/20mA ±2

o

Low current consumption (typ)

.

Sleep mode 20 A

.

Silent mode “noload” 45 A

o

Output current limitation

LIN-Bus Transceiver

.

Baud rate up to 20 kBaud

Slew rate control for best EME behaviour

Low slew mode for optimized SAE J2602 transmission

High impedance LIN pin in case of loss of ground or battery

Bus input voltages -24V to 30V independent from VBat

o

Remote and local wake up source recognition

VCC undervoltage detection at NRES output (start-up delay 4ms)

.

Vres threshold 3.0 V (MLX80030/31); Vres threshold 4.1V (MLX80050/51)

o

Programmable Window Watchdog (only MLX80031/51)

VSUP undervoltage detection (POR), Over temperature shutdown

TxD dominant time out function, Standby mode time out after 350ms

Automotive temperature range of –40°C to 125°C

Interface I/O’s independent from voltage regulator output

Enhanced ESD robustness according to IEC 61000-4-2

o

Direct discharge for pin LIN >20kV (only Lin cap connected) and for pin VBAT >15kV

Indirect discharge for pin LIN >15kV

o

Load dump protected (40V)

Order Code

Temp. Range

Package

Delivery

Remark

MLX80050 KDC-CAA-000-RE

MLX80051 KLW-CAA-000-RE

MLX80030 KDC-CAA-000-RE

MLX80031 KLW-CAA-000-RE

-40 - 125 °C

SOIC8

QFN_WF20/5x5

SOIC8

Reel

Silent Mode enabled

QFN_WF20/5x5

Short Description

The MLX8005x/3x consist of a low-drop voltage regulator 5V/3.3V/70mA combined with a Reset/Watchdog unit and a

LIN bus transceiver. The LIN transceiver is suitable for LIN bus systems conform to LIN specification revision 2.x and SAE

J2602. The watchdog times of the integrated window watchdog can be adapted on application needs via external resis-

tors. With the help of an external bipolar transistor it is possible to extend the output current of the integrated voltage

regulator. The combination of voltage regulator and bus transceiver as well as watchdog unit makes it possible to de-

velop simple, but powerful and cheap slave nodes in LIN Bus systems.

MLX80050/51/30/31 – Datasheet

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LIN System Basis ICs

Datasheet

Contents

1. LIST OF TABLES................................................................................................................................................................ 4

2. LIST OF FIGURES.............................................................................................................................................................. 4

3. ELECTRICAL SPECIFICATION ............................................................................................................................................ 5

3.1. DC CHARACTERISTICS.................................................................................................................................................... 6

3.2. AC CHARACTERISTICS .................................................................................................................................................. 11

3.3. TIMING DIAGRAMS...................................................................................................................................................... 14

4. PIN CONFIGURATION.................................................................................................................................................... 15

4.1. MLX80030 AND MLX80050 - SOIC8 ......................................................................................................................... 15

4.2. MLX80031 AND MLX80051 IN QFN20...................................................................................................................... 16

3. FUNCTIONAL DESCRIPTION........................................................................................................................................... 17

3.1. SUPPLY PIN VS........................................................................................................................................................... 19

3.2. EN INPUT PIN ............................................................................................................................................................ 19

3.3. GROUND PIN GND ..................................................................................................................................................... 19

3.4. LIN 19

3.5. RECEIVER OUTPUT RXD............................................................................................................................................... 19

3.6. TRANSMIT INPUT TXD ................................................................................................................................................. 19

3.6.1. TxD dominant time-out feature.................................................................................................................. 19

3.7. OUTPUT NRES .......................................................................................................................................................... 20

3.8. VOLTAGE REGULATOR PINS VCC AND RTG...................................................................................................................... 20

3.9. INH OUTPUT (ONLY MLX80031/51) ........................................................................................................................... 20

3.10. WAKE INPUT (ONLY MLX80031/51)......................................................................................................................... 20

3.11. KL15 INPUT (ONLY MLX80031/51)........................................................................................................................... 20

3.12. WATCHDOG TRIGGER INPUT NWDI (ONLY MLX80031/51)........................................................................................... 20

3.13. WATCHDOG OSCILLATOR RESISTOR RB_WD(ONLY MLX80031/51) ................................................................................... 20

3.14. MODE INPUT MODE (ONLY MLX80031/51) .............................................................................................................. 20

4. OPERATIONAL MODES.................................................................................................................................................. 21

4.1. MODES OVERVIEW ..................................................................................................................................................... 22

4.2. INITIALISATION AND STANDBY MODE .............................................................................................................................. 23

4.3. NORMAL MODE ......................................................................................................................................................... 23

4.4. SILENT MODE ............................................................................................................................................................ 24

4.5. SLEEP MODE ............................................................................................................................................................. 25

4.6. INIT-STATE ................................................................................................................................................................ 27

5. WAKE UP PROCEDURES ................................................................................................................................................ 28

5.1. WAKE UP SOURCE RECOGNITION IN MLX80031/51 ....................................................................................................... 28

6. FUNCTIONALITY ............................................................................................................................................................ 29

6.1. RESET BEHAVIOUR OF MLX8003X/5X.......................................................................................................................... 29

6.2. THERMAL SHUTDOWN................................................................................................................................................. 29

6.3. VS UNDER VOLTAGE RESET ........................................................................................................................................... 30

6.4. LIN-TRANSCEIVER ...................................................................................................................................................... 30

6.5. VOLTAGE REGULATOR ................................................................................................................................................. 31

7. WINDOW-WATCHDOG (ONLY MLX80031/51).............................................................................................................. 32

7.1. MLX80031/51 WATCHDOG BEHAVIOUR ...................................................................................................................... 32

7.2. ALL WATCHDOG START-UP SCENARIOS ............................................................................................................................ 33

7.2.1. After power-on and initialization................................................................................................................ 33

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Datasheet

7.2.2. Wake up indicated transition to Standby Mode from Sleep or Silent Mode.............................................. 33

7.2.3. Undervoltage reset on VCC on Normal Mode or Silent Mode.................................................................... 33

7.2.4. EN indicated transition from Silent Mode to Normal Mode....................................................................... 33

7.3. CALCULATION OF WATCHDOG PERIOD............................................................................................................................ 34

8. FAIL-SAFE FEATURES..................................................................................................................................................... 36

9. APPLICATION HINTS...................................................................................................................................................... 37

9.1. SAFE OPERATING AREA................................................................................................................................................ 37

9.2. APPLICATION CIRCUITRY............................................................................................................................................... 38

10. ESD AND EMC ............................................................................................................................................................. 39

10.1. RECOMMENDATIONS FOR ACTUATOR PRODUCTS ............................................................................................................ 39

10.1.1. Automotive Qualification Test Pulses ......................................................................................................... 40

10.1.2. Test Pulses On supply Lines ........................................................................................................................ 40

10.1.3. Test pulses on Pin LIN ................................................................................................................................. 41

10.1.4. Test pulses on signal lines........................................................................................................................... 41

10.1.5. EMV Test pulse definition ........................................................................................................................... 42

10.2. TYPICAL APPLICATION CIRCUITRY ................................................................................................................................. 43

10.2.1. External Circuitry on Supply Lines............................................................................................................... 44

10.2.2. External Circuitry on LIN Lines .................................................................................................................... 44

10.2.3. External Circuitry on Signal Lines ................................................................................................................ 44

11. MECHANICAL SPECIFICATION ..................................................................................................................................... 45

11.1. SOIC8 PACKAGE ...................................................................................................................................................... 45

11.2. QFN20 5X5 PACKAGE............................................................................................................................................... 46

12. REVISION HISTORY...................................................................................................................................................... 47

13. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS WITH DIFFERENT SOLDERING

PROCESSES........................................................................................................................................................................ 49

14. DISCLAIMER ................................................................................................................................................................ 50

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LIN System Basis ICs

Datasheet

1. List of Tables

Table 1: Absolute maximum ratings ................................................................................................................................... 5

Table 2: Voltage Regulator and Reset Unit......................................................................................................................... 6

Table 3: LIN DC Characteristics ......................................................................................................................................... 10

Table 4: AC Characteristics ............................................................................................................................................... 11

Table 5: MLX80050/30 pin list in SOIC8............................................................................................................................ 15

Table 6: MLX80051/31 pin list in QFN20 .......................................................................................................................... 16

Table 7: MLX80050/30 Operation Modes ........................................................................................................................ 22

Table 8: MLX80051/31 Operation Modes ........................................................................................................................ 22

Table 9: Parameters of Window Watchdog...................................................................................................................... 35

Table 10: Window Watchdog Timing Selection ................................................................................................................ 35

Table 11: Test pulses Supply Line ..................................................................................................................................... 40

Table 12: Test pulses LIN .................................................................................................................................................. 41

Table 13: Test pulses signal lines ...................................................................................................................................... 41

Table 14: Test pulses shapes ISO7637-2........................................................................................................................... 42

Table 15: Test pulses shapes ISO7637-3........................................................................................................................... 43

Table 12: SOIC8 dimensions.............................................................................................................................................. 45

Table 13: QFN20 Package Dimensions.............................................................................................................................. 46

2. List of Figures

Figure 1: LIN propagation delays ...................................................................................................................................... 14

Figure 2: LIN duty cycles ................................................................................................................................................... 14

Figure 3: MLX80050/30 Block Diagram ............................................................................................................................ 17

Figure 4: MLX80051/31 Block Diagram ............................................................................................................................ 18

Figure 5: MLX8005x3x state diagram of modes of operation........................................................................................... 21

Figure 6: LIN wake-up from Silent Mode .......................................................................................................................... 24

Figure 7 Local Wake-up from Silent Mode via WAKE ....................................................................................................... 25

Figure 8: Remote wake-up from Sleep Mode................................................................................................................... 26

Figure 9: Local wake-up from Sleep Mode ....................................................................................................................... 27

Figure 10: VCC reset behavior .......................................................................................................................................... 29

Figure 11: MLX80031/51 Watchdog behavior.................................................................................................................. 32

Figure 12: Watchdog timing ............................................................................................................................................. 33

Figure 13: Watchdog open and close window tolerances................................................................................................ 34

Figure 14: Safe operating area for MLX80030/50 in SOIC-8 for Vsup up to 18V.............................................................. 37

Figure 15: Safe operating area for MLX80031/51 in QFN20 for Vsup up to 18V.............................................................. 38

Figure 16: Application circuit with MLX80050 or MLX80030 (slave node)....................................................................... 38

Figure 17: Application circuit with MLX80031 or MLX80051 (slave node)....................................................................... 39

Figure 19: SOIC8 Drawing ................................................................................................................................................. 45

Figure 20: QFN20 Drawing................................................................................................................................................ 46

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LIN System Basis ICs

Datasheet

3. Electrical Specification

All voltages are referenced to ground (GND), positive currents flow into the IC.

Absolute Maximum Ratings

Table 1: Absolute maximum ratings

Parameter

Symbol

Condition

Min

-0.3

-100

-150

Max

40

Unit

V

Supply voltage at VS

Transient voltage ISO 7637/2

V_S

Respective to GND

pulse 1, 2

100

V

pulse 3A; 3B, coupling 1nF

V

Respective to GND and VS

Loss of Ground (VGND = VS)

-20

-30

40

DC voltage LIN

V_{LIN_DC}

V

Respective to GND and VS

Loss of Ground (VGND = VS)

-20

-30

40

DC voltage WAKE

V_{WAKE_DC}

DC voltage INH

DC voltage VCC

DC voltage RTG

V_{INH_DC}

V_{VCC_DC}

V_{RTG_DC}

-0.3

V_S+0.3

V

7

Input voltage at low voltage I/O’s (EN, TxD, RxD,

NRES, WDI, RB_WD, MODE)

V_IN

-0.3

7

V

IEC 61000-4-2, direct ESD

Pin LIN with LIN cap 220pF

Pin VS to GND

V_ESDIEC

20

15

kV

IEC 61000-4-2, indirect ESD

Pin LIN with LIN cap 220pF

V_ESDIECind

15

kV

ESD voltage

HBM (CDF-AEC-Q100-002)

Pin LIN

Pin WAKE, KL15, VS

Other pins

±6

±4

±2

kV

V_ESDHBM

V_ESDCDM

CDM (AEC-Q100-011)

±500

V

Internal limited^,see

also chapter 9.1

Power dissipation

P₀

JEDEC 1s0p board, no air

flow

Thermal resistance from junction to ambient

R_{THJA_SOIC8}

R_{THJA_QFN20}

150

50

K/W

JEDEC 1s0p board, no air

flow

Junction temperature

Storage temperature

T_J

-40

-55

150

°C

T_STG

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LIN System Basis ICs

Datasheet

3.1. DC Characteristics

Unless otherwise specified all values in the following tables are valid for V_S= 5 to 27V and

T_AMB= -40 to 125^oC. All voltages are referenced to ground (GND), positive currents flow into the IC.

For MLX80031/51 apply: RTG connected to VCC.

Table 2: Voltage Regulator and Reset Unit

Parameter

Symbol

Condition

Min

Typ

Max

Unit T^[1]

Supply Voltage Pin VS

Nominal DC operating voltage

V_Sunder voltage reset

V_S

5

27

5.0

4.8

V

A

1.01

1.02

V_{SUVR_OFF}V_Sramp up

4.1

3.7

V_Sunder voltage reset

V_{SUVR_ON}V_Sramp down

V_Sunder voltage reset hystere-

sis

1.03

V_{SUVR_HYS}V_{SUVR_OFF}- V_{SUVR_ON}

0.04

0.3

0.7

V

A

Supply currents MLX80030, MLX80050

V_S 14V, V_EN> 2V _,

LIN recessive, no load at

VCC

2.00

Supply current, normal mode

I_{VS_nor}

400

750

1500

A

V_S 14V

T_A= -40 °C

30

20

30

45

T_A= 25 °C

T_A 85 ° C

T_A 125 °C

2.01

2.02

Supply current, sleep mode

Supply current, silent mode

I_{VS_sleep}

A

15

65

I_{VS_sil}

V_S 14V, LIN recessive

no load at VCC

T_A= -40 °C

T_A= 25 °C

85

95

A

A

T_A 85 ° C

T_A 125 °C

100

125

Supply currents MLX80031, MLX80051

V_S 14V, V_EN> 2V ,RB_WD

60k

=

2.00

Supply current, normal mode

I_{VS_nor}

400

750

15

1500

A

A

LIN recessive, no load at

VCC

V_S 14V

T_A= -40 °C

T_A= 25 °C

30

20

30

45

2.01

2.02

Supply current, sleep mode

Supply current, silent mode

I_{VS_sleep}

A

T_A 85 ° C

T_A 125 °C

I_{VS_sil}

V_S 14V, LIN recessive

no load at VCC

T_A= -40 °C

T_A= 25 °C

85

95

A

65

T_A 85 ° C

T_A 125 °C

100

125

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Datasheet

Voltage Regulator Pin VCC

MLX80050, MLX80051 (RTG connected to VCC)

6V  V_S 18V

1mA  I_LOAD 70mA

T_A= 25°C

3.01

Output voltage VCC

V_CCn5

4.90

4.85

5.10

5.15

5.0

V

A

C

T_A= -40°C to 125°C

Output voltage VCC under

disturbances functional state A

6V  V_S 18V, T_A= 25°C

R_LOAD= 330 

V_CCndis5

4.75

5.25

3.02

3.03

3.04

V_{D10_5}

V_{D30_5}

V_{D70_5}

75

120

350

800

mV

C

V_S 4V , I_VCC= 10mA

V_S 4V , I_VCC= 30mA

V_S 4V , I_VCC= 70mA

Drop-out voltage ^[2]

Line regulation

220

500

6V  V_S 18V, I_VCC= 30mA

6V  V_S 18V, I_VCC= 70mA

20

100

3.05

V_LNR5

mV

A

3.06

3.07

3.08

V_{LDR10_5}1 mA < I_LOAD< 10 mA

V_{LDR30_5}1 mA < I_LOAD< 30 mA

V_{LDR70_5}1 mA < I_LOAD< 70 mA

V_S> 6V

50

90

mV

A

Load regulation

150

3.09

Output current limitation ^[3]

Load capacity

I_{VCCLIM_5}

-135

-150

-110

22

-75

-80

mA

A

D

T_A= -40 °C

25 °C  T_A 125 °C

3.10

C_LOAD

2.2

F

MLX80030, MLX80031 (RTG connected to VCC)

4 V  V_S 18 V

1m A  I_LOAD 70 mA

T_A= 25 °C

3.01

Output voltage VCC

V_CCn3

V

A

C

3.234

3.201

3.366

3.399

3.3

T_A= -40 °C to 125 °C

Output voltage VCC under

disturbances functional state A

6 V  V_S 18 V, T_A= 25 °C

R_LOAD= 330 

V_CCndis3

3.135

3.465

3.02

3.03

3.04

Drop-out voltage ^[2]

V_{D10_3}

V_{D30_3}

V_{D70_3}

100

300

700

mV

C

V_S 3 V , I_VCC= 10 mA

V_S 3 V , I_VCC= 30 mA

V_S 3 V , I_VCC= 70 mA

5 V  V_S 18 V, I_VCC= 30mA

5V  V_S 18V, I_VCC= 70mA

20

100

3.05

Line regulation

Load regulation

V_{LNR_3}

mV

A

3.06

3.07

3.08

V_{LDR10_3}1 mA < I_LOAD< 10 mA

V_{LDR30_3}1 mA < I_LOAD< 30 mA

V_{LDR70_3}1 mA < I_LOAD< 70 mA

V_S> 4 V

50

90

mV

A

150

3.09

3.10

Output current limitation ^[3]

Load capacity

I_{VCCLIM_3}

-135

-150

-110

22

-75

-80

mA

A

D

T_A= -40 °C

25 °C  T_A 125 °C

C_LOAD

2.2

F

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Datasheet

Output Pin NRES

4.01

4.02

4.03

Output voltage low

Leakage current low

Leakage current high

V_{OL_NRES}I_NRES= 1 mA

0.25

5

V

A

I_{leak_RxD}

V_NRES= 0 V

V_NRES= V_CC

-5

µA

5

Output voltage high NRES

under disturbances to fulfil

functional state A

V_{OH_NRES}R_load= 2.7 k to VCC

V_CC-1

V

C

MLX80050, MLX80051

VCC reset threshold on NRES

5.01

5.02

V_RES5V

t > t_rr

3.9

4.10

2.95

4.3

V

A

C

V_RESHysteresis

V_RESHYS5V

200

mV

V_RESHYS= |V_RES(ON)– V_RES(OFF)

|

MLX80030, MLX80031

VCC reset threshold on NRES

5.01

5.02

V_RES3V

t > t_rr

2.75

3.15

100

V

A

C

V_RESHysteresis

V_RESHYS3V

mV

V_RESHYS= |V_RES(ON)– V_RES(OFF)

|

Input Pin EN

6.01

6.02

6.03

6.04

Input voltage low

V_{IL_EN}

V_{IH_EN}

0.8

V

A

C

A

Input voltage high

Hysteresis

2.0

50

V_{HYS_EN}

R_{pd_EN}

100

125

700

250

mV

k

Pull-down resistor

V_EN=VCC

Input Pin WAKE (MLX80031, MLX80051)

7.01

7.02

7.03

7.04

High level input voltage

Low level input voltage

Pull up current WAKE

V_{IH_WAKE}Sleep mode

V_{IL_WAKE}Sleep mode

I_{WAKE_PU}Normal & sleep

V_S-1V

V

A

V_S-3.3V

-30

-5

-15

-1

5

µA

Leakage current WAKE high

I_{WAKE_lk}

V_S= 18V

Input Pin KL15 (MLX80031, MLX80051)

8.01

8.02

8.03

High level input voltage

Low level input voltage

Pull down current KL15

V_{IH_KL15}

V_{IL_KL15}

I_{KL15_PD}

4

V_S+0.3V

V

A

Rv = 50k

-1

2

30

65

µA

Input Pin MODE (MLX80031, MLX80051)

23.01 Input voltage low

23.02 Input voltage high

23.03 Hysteresis

V_{IL_MODE}

V_{IH_MODE}

V_{HYS_MODE}

0.8

V

A

C

A

2.0

50

100

600

mV

k

23.04 Pull-down resistor

R_{pd_MODE}V_MODE= VCC

200

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Input Pin NWDI (MLX80031, MLX80051)

9.01

9.02

9.03

9.04

9.05

Input voltage low

Input voltage high

Hysteresis

V_{IL_NWDI}

0.8

V

A

C

A

D

V_{IH_NWDI}

2.0

50

125

1

V_{HYS_NWDI}

100

250

600

375

mV

k

1

Pull-up resistor to VCC

Min low pulse width

R_{pu_NWDI}VN_WDI= 0V

T_{minlow_NWDI}one WD_OSC clock period

Watchdog Oscillator pin RBWD (MLX80031, MLX80051)

V_RBwd

RB_WD

10.01 Voltage at RB_WD

1.2

20

V

A

B

I_OUT= -50 A

10.02 Range of RB_WDresistance

20

0

150

330

k

RB_WDshort resistance thresh-

10.03

RB_WDSHsee paragraph 7.3

B



old to enable fail-safe state

Output INH (MLX80031, MLX80051)

R_{ON_INH}V_S= 12V

11.01 ON Resistance

60

5

A



I_{leakH_INH}Sleep Mode, V_INH= 18V,

V_S= 18V

11.02

11.03

Leakage current INH high

Leakage current INH low

-5

µA

I_{leakL_INH}Sleep Mode, V_INH= 0V,

V_S= 18V

5

µA

A

Thermal Protection

Thermal shutdown

Thermal hysteresis

T_JSHD

T_JHYS

155

170

10

190

30

°C

D

Notes:

[1]

[2]

[3]

A = 100% serial test, B = Operating parameter, C = characterization data,

D = Value guaranteed by design

The nominal VCC voltage is measured at VSUP = 12V. If the VCC voltage is 100mV below its nominal value then the voltage drop is VD =

VSUP – VCC

Functionality range of current limitation at silent mode is limited by reset threshold VRES. Below them the IC change to normal mode.

Validity for IVCC_MAXsil: VCCn (min) ≤ VCC ≤ VRES

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Datasheet

Table 3: LIN DC Characteristics

Parameter

Symbol

Condition

Min

Typ

Max

Unit

T^[1]

General

12.01 Pull up current LIN (recessive)

12.02 Pull up resistor LIN

I_INLINpu

R_LINpu

V_LIN= 18 V, V_S= 6V

V_S= 12V, V_LIN= 0V

80

60

A

A

k

20

30

Reverse current LIN

(dominant)

12.03

V_S= 12V, V_LIN= 0V

-400

µA

A

I_INLINdom

I_INLINrec

I_{INLIN_lob}

I_{INLIN_log}

V_LINV_S,8V  V_LIN





Reverse current LIN

(recessive)

12.04

18V,

0

23

µA

8V  V_S 18V

Reverse current LIN

12.05

V_S= 0V, 0V  V_LIN

18V



0

23

50

µA

A

(loss of battery)

Reverse current LIN

12.06

V_S= 12V, 0V  V_LIN

18V



-10

(loss of ground)

Voltage drop serial Diode

Battery Shift

0.4

0

0.7

1.0

11.5

8

V

%

D

V_SerDiode

V_{Shift_BAT}

V_{Shift_GND}

V_{Shift_diff}

related to VS

Ground Shift

0

Ground-Battery shift difference

0

Receiver

Receiver dominant voltage

12.07

V_BUSdom

V_BUSrec

0.4*V_S

A

Receiver recessive voltage

0.6*V_S

Centre point of receiver

threshold V

=

V

7.0 V  V_S 18 V

12.08

12.09

thr_cnt

V_{thr_cnt}

0.475*V_S0.5*V_S0.525*V_S

0.15*V_S0.175*V_S

A

(V

+V

)/2

thr_rec thr_dom

Receiver Hysteresis

= V -V

V_hys

V

hys thr_rec thr_dom

Transmitter

0

1.2

0.2*V_S

200

D

A

R_load= 500, V_S= 5V

12.10 Transmitter dominant voltage

VoI_bus

V

R_load= 500, V_S>=

7V

12.11 Current limitation LIN

I_LIM

V_LIN= V_S, TxD = 0V

40

120

mA

V

No load, V_EN= 0/5V,

VTxD = 5V

12.12 Transmitter recessive voltage

Voh_BUS

0.8*V_S

V_S

Input/Output Pin TxD

13.01

13.02

Input voltage low TxD

Input voltage high TxD

V_{IL_TxD}

V_{IH_TxD}

rising

0.8

V

A

2

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13.03

13.04

Hysteresis

V_{HYS_TxD}

R_{pu_TxD}

50

700

375

mV

C

A

Pull-up resistor to VCC

V_TxD= 0V

125

250

k

local wake-up request;

standby mode;

V_TxD= 0.4V

13.06

Low level output current

I_{OL_TxD}

1.5

mA

A

Output Pin RxD

14.01

14.02

14.03

Output voltage low RxD

V_{OL_RxD}

R_{pu_RxD}

I_{leak_RxD}

I_RxD= 2 mA

V_RxD= 0V

0.6

7

V

A

Pull-up resistor to VCC

Leakage current high

3

5

k

µA

V_RxD= VCC

-5

5

Output voltage high RxD

under disturbances to fulfil

functional state A

V_{OH_RxD}

R_load= 2.7k to VCC

V_CC-1

V

C

Notes:

[1] A = 100% serial test, B = Operating parameter, C = characterization data,

D = Value guaranteed by design

3.2. AC Characteristics

6V  V_S 27V, -40°C  T_A 125°C, RTG connected to VCC, unless otherwise specified

Table 4: AC Characteristics

Parameter

Symbol

Condition

Min

Typ

Max

Unit

T^[1]

Reset parameter on NRES

16.01

16.02

Reset time

t_Res

t_rr

V_S= 14V

2.5

3.0

4

5.5

12

ms

A

Reset rising time

V_S= 14V

6.5

s

Watchdog parameter on NRES (MLX80031, MLX80051)

17.01

17.02

t_WDOSC20

t_WDOSC60

6.87

8.09

9.30

A

RB_WD= 20k1%

RB_WD= 51k1%

s

16.06

18.90

21.73

RB_WD

100k1%

=

Watchdog-Oscillator Period

17.03

17.04

t_WDOSC100

30.58

45.40

35.98

53.41

1053

41.37

61.42

A

D

s

RB_WD

150k1%

=

t_WDOSC150

t_CW

tCW = cycles *

tWDOSC

Watchdog Close Window

cycles

t_OW

tOW = cycles *

tWDOSC

Watchdog Open Window

Watchdog Reset Low Time

Watchdog Lead Window

1105

4

cycles

ms

D

A

D

17.05

17.06

t_WDres

t_LDT

3

5

tOWS = cycles *

tWDOSC

7895

cycles

t_WDsafety

RBWD open /

RBWD gnd

Watchdog Safety Oscillator

30

50

75

µs

A

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Parameter

Symbol

Condition

Min

Typ

Max

Unit

T^[1]

Wake-up and Mode Control

18.01

Remote Wake-up filter time

t_{wu_remote}

t_{wu_WAKE}

30

10

70

150

50

A

s

s

Sleep or Silent

Mode,

WAKE falling edge

Wake-up filter time on WAKE

(only MLX80051,MLX80031)

18.02

Sleep or Silent

Mode,

KL15 rising edge

Wake-up filter time on KL15

(only MLX80051,MLX80031)

18.03

t_{wu_KL15}

80

168

250

A

s

Propagation delay from Normal

Mode to Sleep Mode via EN

18.04

18.05

18.06

t_{pd_sleep}

t_{pd_norm}

t_{pd_sil_n}

V_EN= 0V

V_EN= 5V

5

15

20

40

A

s

Propagation delay from Standby

Mode to Normal Mode via EN

Propagation delay from Silent

Mode to Normal Mode via EN

V_EN= 5V

Silicon Revision C

check falling edge

on RBwd, EN = 0V

Silicon Revision C

Propagation delay: go to

silent mode after EN=H/L

18.07

t_{pd_sil}

20

A

B

s

s

Setup time TxD to EN for low

slew mode

t_{set_TxD_EN}

5

Hold time TxD after EN for low

slew mode

t_{hold_TxD_EN}

t_{deb_EN}

20

2

B

A

s

ms

18.08

18.09

Debouncing time EN

TxD dominant time out

5

20

60

Normal Mode,

V_TxD= 0V

t_{TxD_to}

27

Standby Mode,

V_EN= 0V

18.10

18.11

Standby time out

t_{sby_to}

t_{wu_EN}

150

2

500

20

ms

A

Wake form sleep

via EN=L/H

Wake up time vs. EN

s

General LIN Parameter

t_{dr_RxD}

t_{df_RxD}

Receiver propagation delay

LIN -> RxD

19.01

C_L(RXD)= 50 pF

t_{dr_RXD}- t_{df_RXD}

6

A

s

19.02

19.03

Symmetry prop. delay LIN->RxD

Receiver debouncing time

t_{dsym_RxD}

t_{deb_LIN}

-2

2

A

D

s

1.5

2.8

4.0

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Normal Mode

LIN-Load: 1kΩ/1nF

slew rate rising edge LIN

dV/dTrise

19.04

C

1.0

1.5

2.5

V/s

slew rate falling edge LIN

slew rate rising edge LIN

slew rate falling edge LIN

dV/dTfall

dV/dTrise

dV/dTfall

19.05

19.06

19.07

C

-2.5

0.3

-1.5

0.8

-1.0

1.3

V/s

Low Slew Mode

LIN-Load: 1kΩ/1nF

-1.3

-0.8

-0.3

Pulse at LIN via

10kOhm with 0/10V;

VS = open

Internal capacity

C_LIN

25

35

pF

D

LIN transceiver parameter according to LIN Physical Layer Spec. rev. 2.0, table 3.4 (20kbit/s)

Conditions:

Normal slew mode; V_S=7.0V to 18V; LIN loads: 1k/1nF; 660/6.8nF; 500/10nF

TxD signal: t_Bit= 50µs, t_wH= T_wL= t_Bit; t_rise= t_fall< 100ns

Minimal recessive bit time

Maximum recessive bit time

Duty cycle 1

t_rec(min)

t_rec(max)

D₁

40

50

58

s

20.01

20.02

D₁= t_rec(min)/ (2*t_Bit)

D₂= t_rec(max)/ (2*t_Bit)

0.396

A

Duty cycle 2

D₂

0.581

Transceiver parameter according to LIN Physical Layer Spec. rev. 2.0, table 3.4 (10.4kbit/s)

Conditions:

Low slew mode; V_S=7.0V to 18V; LIN loads: 1k/1nF; 660/6.8nF; 500/10nF

TxD signal: t_Bit= 96µs, t_wH= T_wL= t_Bit; t_rise= t_fall< 100ns

Minimal recessive bit time

t_rec(min)

t_rec(max)

D₃

80

96

113

s

Maximum recessive bit time

Duty cycle 1

21.01

21.02

D₃= t_rec(min)/ (2*t_Bit)

D₄= t_rec(max)/ (2*t_Bit)

0.417

A

Duty cycle 2

D₄

0.590

LIN transceiver parameter according to SAE J2602 (10.4kbit/s)

Conditions:

Low slew mode; V_S=7.0V to 18V; LIN loads: 1k/1nF;660/6.8nF;500/10nF

TxD signal: t_Bit= 96µs, t_wH= T_wL= t_Bit; t_rise= t_fall< 100ns

Minimal recessive delay

TxD -> LIN

22.01

22.02

22.03

22.04

t_{x_rec_min}

t_{x_rec_max}

t_{x_dom_min}

t_{x_dom_max}

48

A

s

Maximum recessive delay

TxD -> LIN

Minimal dominant delay

TxD -> LIN

Maximum dominant delay

TxD -> LIN

22.05

22.06

Maximum rec. to dom. delay

Maximum dom. to rec. delay

T_{r_d_max}

T_{d_r_max}

t_{x_rec_max}- t_{x_dom_min}

t_{x_dom_max}- t_{x_rec_min}

15.9

17.2

A

s

Notes:

[1] A = 100% serial test, B = Operating parameter, C = characterization data,

D = Value guaranteed by design

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3.3. Timing diagrams

50%

TxD

t_{df_TXD}

t_{dr_TXD}

V_BUS

100%

95%

LIN

50%

5%

0%

t_{dr_RXD}

t_{df_RXD}

RxD

50%

transceiver_delays.vsd

Figure 1: LIN propagation delays

t_Bit

TxD

t_{x_rec_max}

t_{x_dom_max}

t_rec(min)

t_{x_dom_min}

t_{x_rec_min}

t_dom(max)

100%

V_SUP

74.4%

(77.8%)

t_dom(min)

58.1%

(61.6%)

58.1%

(61.6%)

LIN

42.2%

(38.9%)

Level for LSM in brackets

28.4%

(25.1%)

28.4%

(25.1%)

t_rec(max)

0%

V_SS

timing_lin20.vsd

Figure 2: LIN duty cycles

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4. Pin Configuration

4.1. MLX80030 and MLX80050 - SOIC8

1

8

7

5

VS

VCC

NRES

TxD

2

EN

MLX80030/50

3

4

GND

LIN

RxD

Table 5: MLX80050/30 pin list in SOIC8

Pin Name IO-Typ

Description

1

2

3

VS

EN

P

I

Battery supply voltage

Mode control pin, enables the normal operation mode when HIGH

Ground

GND

G

LIN bus transmitter/receiver pin,

(low = dominant)

4

LIN

I/O

5

6

7

RxD

TxD

I/O

O

Received data from LIN bus, low in dominant state; internal pull-up resistor

Transmit data input (low = dominant)

Undervoltage reset output (open drain),

low active

NRES

8

VCC

P

Voltage regulator output

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4.2. MLX80031 and MLX80051 in QFN20

Table 6: MLX80051/31 pin list in QFN20

Name IO-Typ

Description

Mode control pin, enables the normal

operation mode when HIGH

1

EN

I

2

3

4

5

6

NC

NWDI

WAKE

GND

NC

not connected

I

Watchdog trigger input; negative edge; pull-up

High voltage input for local wake up, negative edge triggered

G

Ground

not connected

LIN bus transmitter/receiver pin,

(low = dominant)

7

LIN

I/O

8

NC

RxD

INH

not connected

9

I/O

O

Received data from LIN bus, low in dominant state; internal pull-up resistor

High side switch; High voltage

10

11

12

13

14

15

16

17

18

19

20

TxD

NRES

RB_WD

NC

I/O

O

Transmit data input (low = dominant)

Reset output (open drain), low active

Bias resistor for watchdog oscillator

not connected

I/O

MODE

KL15

NC

I

Input to control window watchdog

High voltage input for local wake up, positive edge triggered

not connected

VCC

RTG

VS

I

Voltage regulator sense input

P

G

Voltage regulator output

Battery supply voltage

EP

Exposed pad should be connected to Ground

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3. Functional Description

The MLX8003x/5x consists of a low drop 3.3V/5V voltage regulator capable to drive 70mA and a LIN bus transceiver,

which is a bi-directional bus interface for data transfer between LIN bus and the LIN protocol controller. Additionally

integrated is a Window-Watchdog/RESET unit with a fixed power-on-reset delay of 4 ms and an adjustable watchdog

time defined by an external bias resistor.

VS

VCC

control

amplifier

Aux.

Supply

current

limitation

Reset

Generator

3

5

VBG

BG

POR

4.1 V /

2.9V

Temp.

Protection

Adjust

ment

VS

RESET-

Buffer

TSHD

Under-

voltage

Reset

NRES

Reset

POR-

Timer

UVR

Mode

Control

EN

Standby

timer

fosc

350k

RC

osc.

VSS

VCC

Wake-Filter

Receiver

5k

70s

VSUP

Vaux

RxD-

RxD

TxD

Buffer

Rec-Filter

30k

VCC

250k

Transmitter

SBY

POR

LIN

Driver

control

TxD-

Timeout

Figure 3: MLX80050/30 Block Diagram

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VS

RTG

VCC

Vaux

control

Aux.

amplifier

Supply

current

limitation

Reset

Generator

VBG

3

BG

Vaux

POR

4.1 V /

2.9V

Vaux

POR

5

Adjust

ment

5V / 3.3V

TSHD

VSUP

RC

osc.

Vaux

Under-

voltage

Reset

TSHD

POR

VS

91kHz

INH

UVR

SBY

fosc

ZZ

Control

Standby

timer

Reset

POR-

Timer

RESET-

Buffer

Test logic

NRES

TxD-

Timeout

timer

Window

watchdog

EN

Mode

VCC

350k

Control

VS

fwdosc

VBG

RxD-

control

WD

Osc

Wake_sig

KL15_sig

RB_WD

WAKE

KL15

VCC

250k

WDI_sig

NWDI

Vaux

MODE

Wake-Filter

70s

250k

VCC

Receiver

VS

Vaux

Rec-

Filter

5k

RxD-

RxD

Buffer

RxD_out

30k

Transmitter

SBY

VCC

250k

LIN

Driver

control

UVR_POR

VSS

TxD

VSS

Figure 4: MLX80051/31 Block Diagram

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3.1. Supply Pin VS

VS is the operational voltage pin of MLX8005x/3x. The voltage range is VS = 6 to 18V. After switching on VS, the

MLX8003x/5x starts at Standby Mode and the VCC voltage regulator ramps up. An undervoltage detection unit prevent

an undefined operation for Vs < 4V.

VS- Power-ON

If VS is switched on, the MLX8003x/5x starts in Standby Mode. A combination of dynamic POR and under voltage reset

circuitry generates a POR signal, which switches the MLX8003x/5x on. This power on behaviour is independent from the

status of the EN-pin.

Power-on reset and under-voltage reset operate independent from each other, which secures the independence from

the rise time of VS.

3.2. EN input pin

The ENable input is the mode control pin of MLX8003x/5x in combination with the TxD input.

The MLX8003x/5x is switched into the Sleep Mode with a falling edge and into normal mode with a rising edge at the

EN pin. The state machine goes to Normal Mode after t_Res(see also Table 4: AC Characteristics). The Normal Mode will

be kept as long as EN remains high.

The Normal Mode can be entered from Standby Mode, when the pin EN is driven HIGH. To prevent unwanted mode

transitions, the EN input contains a debounce filter as specified (t_{EN_deb}).

The pin EN contains a weak pull down resistor. The input thresholds are compatible to 3.3V and 5V supply systems.

MLX80031/51:

Additionally the positive edge on pin EN results in an immediate reset of the active low interrupt on pin RxD as well as

the wake-up source recognition flag on pin TxD.

3.3. Ground pin GND

This is the reference pin of the IC. The absence of GND connection will not influence or disturb the communication be-

tween other LIN bus nodes.

3.4. LIN

This bidirectional pin consists of a low side driver in the output path and a high-voltage comparator in the input

path. Furthermore is integrated a LIN pull-up resistor between LIN and VS pin. Low side driver consist a cur-

rent limitation.

3.5. Receiver Output RxD

The pin RxD is a buffered open drain output. Output signals can be shifted by the external pull up resistor to 3.3V and

5V supply systems.

3.6. Transmit Input TxD

The transmit data stream of the LIN protocol controller applied to the pin TxD is converted into the LIN bus signal with

slew rate control in order to minimize electromagnetic emissions.

The pin TxD contains a weak pull up resistor. The input thresholds are compatible to 3.3V and 5V supply systems. To

enable the transmit path, the TxD pin has to be driven recessive (HIGH) after or during the normal mode has been en-

tered.

3.6.1. TxD dominant time-out feature

With the first dominant level on pin TxD after the transmit path has been enabled, the dominant time-out counter is

started. In case of a faulty blocked permanent dominant level on pin TxD the transmit path will be disabled after the

specified time t_{TxD_to}. The time-out counter is reset by the first negative edge on pin TxD.

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3.7. Output NRES

The NRES pin outputs the reset state as well as the watchdog condition in MLX80031 and MLX80051.

3.8. Voltage regulator pins VCC and RTG

The MLX80030/50 has an integrated low drop linear regulator with a p-channel-MOSFET as driving transistor. This regu-

lator outputs a voltage of 5V ±2% (MLX80050/51) or 3.3V ±2% (MLX80030/31) with a load current of max. 70mA. The

current limitation unit limits the output current for short circuits or overload to 130mA by decreasing the VCC voltage.

This way the power dissipation is held constant at a maximum value.

The voltage regulator has two pins, output pin RTG and sense input pin VCC. For MLX80030/50 both, RTG and VCC, are

commonly bonded to pin VCC on the package.

Devices MLX80031/51 has both pins bonded and provides the possibility to use an external npn transistor to boost the

maximum load current. In this case the basis of the npn transistor has to be connected to the RTG pin and the emitter

to the VCC pin. In case of using the internal voltage regulator, both pins have to be connected to each other.

3.9. INH Output (only MLX80031/51)

INH switches to high (VS connected to INH) in case of Standby or Normal Mode. INH is switched off at Silent and Sleep

Mode. The pin will be used for switch on an external power supply or for switch off the external 1k master resistor in

master node applications.

3.10. WAKE Input (only MLX80031/51)

High voltage input pin for local wake-up functionality. With a falling edge on WAKE the IC wakes-up from Silent Mode

or Sleep Mode to Standby Mode.

The pin WAKE provides a weak pull up current source towards Vs which provides a HIGH level on the pin in case of open

circuit failures or if no local wake-up feature is required. In such applications it is recommended to connect the pin

WAKE directly to pin Vs in order to prevent influences due to EMI.

3.11. KL15 Input (only MLX80031/51)

High voltage input pin for local wake-up functionality. With a rising edge on KL15 the IC wakes-up from Silent Mode or

Sleep Mode to Standby Mode.

The pin KL15 provides a weak current sink towards GND which provides a LOW level on the pin in case of open circuit

failures or if no local wake-up feature is required. In such applications it is recommended to connect the pin KL15 di-

rectly to GND in order to prevent influences due to EMI. KL15 is typically connected to the ignition terminal and gener-

ates a local wake-up at start of ignition.

3.12. Watchdog Trigger Input NWDI (only MLX80031/51)

This input is used to trigger the integrated window watchdog in MLX80031/51. Every falling edge on NWDI in watchdog

open window is used to reset the watchdog timer. An internal pull up resistor of 250k secures a stable high condition if

this pin is open. The NWDI input is a low voltage CMOS input. The minimum low time of NWDI is one WD_OSC clock

period to allow falling edge detection.

3.13. Watchdog Oscillator Resistor RB_WD(only MLX80031/51)

A resistor between RBWD and GND defines the window watchdog times as trigger time.

3.14. Mode Input MODE (only MLX80031/51)

Special pin for to disable the window watchdog function. For normal watchdog operation connect the MODE pin to

GND directly or via external resistor. With MODE pin on 3.3V/5V the window watchdog is switched off.

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4. Operational Modes

The MLX8003x/5x provides four main operating modes “Standby”, “Normal”, “Silent” and “Sleep”. The main modes are

fixed states defined by basic actions (VS start, EN or wake-up).

Start Vaux;

Regulator OFF

VSUP power on

Init

Regulator on; VCC ramp up

VCC cross reset threshold -> start tres

LIN transmitter off

LIN termination 30k

---------------------------------------------------

after power on:

End of Initialization

RxD: high

TxD: high

after wake up:

RxD: low

TxD: wake source output

Standby

Local wake-up or

Remote wake-up

or EN = L/H

Local wake-up or

Remote wake-up or

Vcc < V_RES

EN = H^[2]or L/H ^[1]

t > t_sby(350ms) &

Vcc > V_RES

Sleep-

Mode

Silent

Mode

EN = H/L & TxD =H

EN = L/H

EN = H/L & TxD=L

Regulator off

Regulator on

LIN transmitter off

LIN termination 200k

-----------------------------------------------

RxD: floating (0V)

LIN transmitter off

LIN termination 30k

------------------------------------------

RxD = high

Normal

Mode

TxD: floating (0V)

TxD = high

Regulator on

NRES = H

LIN transmitter on

LIN termination 30k

------------------------------------------------

RxD:= data output

TxD:= data input

[1] Set Slew Mode:

[2] Only after Wake-up from Sleep mode

with EN=L/H

Normal => EN=L/H & TxD=H (default)

Low Slew => EN=L/H & TxD=L

Figure 5: MLX8005x3x state diagram of modes of operation

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4.1. Modes Overview

Table 7: MLX80050/30 Operation Modes

Mode

VCC

TxD

RxD

LIN

remarks

Standby

3.3V/5V

high

recessive

entered after power

on or wake up

[1]

Normal

3.3V/5V

input for

transmit data

stream

output for LIN data

stream

follows TxD

Silent

Sleep

3.3V/5V

0

high

recessive

high = 3.3V/5V

floating

remote wake up to

enter Standby Mode,

EN = H to go to Nor-

mal Mode

[1]

Normal mode will be entered form Standby Mode by a low -> high transition on pin EN and from Sleep Mode by EN = H after startup of the

regulator. When recessive level (high) on pin TxD is present the transmit path will be enabled

Table 8: MLX80051/31 Operation Modes

Mode

VCC

TxD

RxD

LIN

INH

ON

Watchdog

ON

remarks

Standby

3.3V/5V

High/ active

low^[1]

high/

active

low^[2]

recessive

entered after

power on or

wake up

[3] [4] [5]

Normal

3.3V/5V

input for

transmit

data stream

output for

LIN data

stream

follows

TxD

ON

Silent

Sleep

3.3V/5V

0

high

recessive

OFF

floating

Local or remote

wake up to

enter Standby

Mode, EN = H to

go to Normal

Mode

[1]

[2]

[3]

[4]

[5]

Indicates the wake up flag in case of local wake up

After power on RxD is going high via pull-up to Vcc. If any wake up(local or remote) occurs it will be indicated by active low

Active low interrupt at pin RxD will be removed when entering normal mode

Wake up source flag at pin TxD will be removed when entering normal mode

Normal mode will be entered from Standby Mode by a low -> high transition on pin EN and from Sleep Mode by EN = H after startup of the

regulator. When recessive level (high) on pin TxD is present the transmit path will be enabled

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4.2. Initialisation and Standby mode

When the battery supply voltage VS exceeds the specified threshold V_{SUVR_OFF}, the MLX8003x/5x automatically enters

the Standby Mode. Following internal procedure is running:

First:



Start of internal supply Vaux and POR of Vaux

Start of internal RC oscillator

Second and parallel after POR:

Start of voltage regulator



The output voltage V_CCramps up to nominal value. The pin RxD is floating and the integrated slave pull up resistor with

decoupling diode pulls the pin LIN. The transmitter as well as the receiver is disabled.

If there occurs no mode change to Normal Mode via an EN LOW to HIGH transition within the time stated (typically

350ms), the IC enters the most power saving Sleep Mode.

Furthermore the standby mode will be entered after a valid local or remote wake up event, when the MLX8003x/5x is

in Sleep or Silent mode. The entering of the standby mode after wake up will be indicated by an active LOW interrupt

on pin RxD.

4.3. Normal Mode

This mode is the base mode. The bus transceiver is able to send with a max baud rate of 20kbit/s.

The whole MLX8003x/5x is active. The incoming bus traffic is detected by the receiver and transferred via the RxD out-

put pin to the microcontroller.

Exit the Normal Mode with one of the following conditions:

1. High-to-low edge on EN pin with TxD = H -> switch to Silent Mode

2. High-to-low edge on EN pin with TxD = L -> switch to Sleep Mode

3. Undervoltage monitor on VCC detects a low voltage reset condition (VCC < V_RES) -> switch back to

stand-by mode.

Low Slew Mode

The first rising edge on EN after power-on defines the slew rate of the device. With TxD = High at this point works the

MLX8003x/5x with normal slew rate (default state). TxD = Low activates the Low Slew Mode, as long as VS > V_{SUVR_OFF}

.

In this mode the slew rate is switched from the normal value of typ. 1.6V/µs to a low value of typ. 0.8V/µs. This mode is

optimized to send with a maximum baud rate of 10.4kbit/s (acc. to SAE J2602). Because of this reduction of the slew

rate the EME behaviour is improved especially in the frequency range of 100 kHz to 10MHz.

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4.4. Silent Mode

The Silent Mode is a special mode for application with active Sleep Mode on LIN, but the connected MCU still needs to

be supplied with VCC.

With a falling edge on EN input in combination with TxD=high switches the MLX8003x/5x from Normal Mode to the

Silent Mode with reduced internal current consumption.

In Silent Mode the voltage regulator is on with a 2% tolerance. The transmitter is disabled and the pin RxD is discon-

nected from the receive path and is floating. The slave termination resistor (LIN pull up resistor with decoupling diode

between pins LIN and VS) is disconnected; only a weak current source is applied to the LIN bus. Value is typical -75uA,

limits -20…-100uA.

Exit the silent mode with one of the following conditions:

1. Low-to-high edge on the EN pin -> switch back to normal mode

2. Remote wake up (all versions) or local wake up request (MLX80031/51 only) -> switch to standby

mode

3. Undervoltage monitor on VCC detects a low voltage reset condition (VCC < V_RES) -> switch back to

stand-by mode.

Normal Mode

Silent Mode

Standby Mode

Normal Mode

EN

t_{pd_sil}

TxD

Regulator ON

VCC

t_{wu_remote}

Transmitter ON

LIN

Transmitter ON

RxD

Transmitter OFF

Low

NRES

Watchdog ON

Watchdog OFF

Start watchdog lead time

Watchdog *

* only for MLX80031/51

timing_silent_mode.vsd

Figure 6: LIN wake-up from Silent Mode

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Normal Mode

Silent Mode

Standby Mode

Normal Mode

EN

t_{pd_sil}

TxD

low *

VCC

Regulator ON

t_{wu_WAKE}

WAKE *

Transmitter ON

Transmitter OFF

LIN

RxD

low

Undervoltage detection active

Watchdog OFF

NRES

Watchdog ON

Start watchdog lead time

Watchdog *

* only for MLX80031/51

timing_sleep_mode_locwu.vsd

Figure 7 Local Wake-up from Silent Mode via WAKE

4.5. Sleep Mode

The most power saving mode of the MLX8003x/5x is the Sleep Mode. The MLX8003x/5x offers two procedures to enter

the sleep mode:



The mode is selected from normal mode with a falling edge on EN in combination with

TxD = L.



If the MLX8003x/5x is in Standby Mode after power-on or wake-up, a sleep counter is started and switches the

transceiver into Sleep Mode after the specified time (typ. 350ms) even when the microcontroller of the ECU

will not confirm the normal operation by setting the EN pin to logic HIGH. This new feature allows faulty

blocked LIN nodes to reach always the most power saving mode.

Being in Sleep Mode the voltage regulator switched off in order to minimize the current consumption of the complete

LIN node. The transmitter is disabled and the pin RxD is disconnected from the receive path and is low (follows VCC).

The slave termination resistor (LIN pull up resistor with decoupling diode between pins LIN and VS) is disconnected,

only a weak current source is applied to the LIN bus (see chapter 8 fail-safe features)

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Exit the Sleep Mode with the following condition:

1. Remote (all versions) or local wake up request (MLX80031/51 only) -> Switch to Standby Mode

2. EN = L/H -> Switch to Standby Mode

Figure 8: Remote wake-up from Sleep Mode

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Normal Mode

Sleep Mode

Standby Mode

Normal Mode

EN

TxD

low *

VCC

t_{pd_sleep}

t_{wu_WAKE}

WAKE *

Transmitter ON

Transmitter OFF

floating

LIN

RxD

low

Reset time

NRES

Watchdog ON

Watchdog OFF

Start watchdog lead time

Watchdog *

* only for MLX80031/51

timing_sleep_mode_locwu.vsd

Figure 9: Local wake-up from Sleep Mode

4.6. Init-State

This is an intermediate state, which will pass through after switch on of VS or after undervoltage detection VS with VS <

V_{SUVR_ON}. The internal supply voltage Vaux ramp up and the initial readout procedure of zenerzap storage are started. At

the end of this phase the VCC voltage definition and the definition of MLX8003x5x version is established. This Init-State

changes to Standby Mode with the start of VCC regulator.

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5. Wake Up Procedures

The MLX80030/50 versions offer only remote wake-up:

After a falling edge on the LIN bus followed by a dominant voltage level for longer than the specified value (t_{wu_remote}

)

and a rising edge on pin LIN will cause a remote wake up. The device switches to Standby Mode and the wake-up re-

quest is indicated by an active LOW on pin RxD.

The MLX80031/51 versions offer three wake-up procedures:



In applications with continuously powered ECU a wake up via mode transition to normal mode is possible (see

chapter 4.3 Normal Mode).



Remote wake-up via LIN bus traffic

After a falling edge on the LIN bus followed by a dominant voltage level for longer than the specified

value(t_{wu_remote}) and a rising edge on pin LIN will cause a remote wake up.



Local wake-up via a falling edge on pin WAKE

A falling edge on the pin WAKE and a dominant voltage level for longer than the specified time (t_{wu_WAKE}) will

cause a local wake-up. The current for an external switch has to be provided by an external pull up resistor

R_WK. For a reverse current limitation in case of a closed external switch and a negative ground shift or an ECU

loss of ground a protection resistor R_{WK_prot}between pin WAKE and the switch is recommended.

Local wake-up via a rising edge on pin KL15

A positive edge on the pin KL15 followed by a high voltage level for a time period t_{wu_KL15}> 250µs results in a

local wake-up request. The MLX80031/51 switches to the Standby Mode. The long debouncing time on KL15

suppresses unintentional transients. A high level on KL15 has no influence of switching between modes with

EN input. Before a new local wake-up request via KL15 can be started, KL15 have to be switched to low level

for a time > 250µs.

5.1. Wake Up Source Recognition in MLX80031/51

The device can distinguish between a local wake-up event (pin WAKE or pin KL15) and a remote wake-up event. The

wake-up source flag is set after a local wake-up event and is indicated by an active LOW on pin TxD.

The wake-up flag can be read if an external pull up resistor towards the microcontroller supply voltage has been added

and the MLX80031/51 is still in standby mode:

•

LOW level indicates a local wake-up event

HIGH level indicates a remote wake up event

The wake-up request is indicated by an active LOW on pin RxD and can be used for an interrupt.

When the microcontroller confirms a normal mode operation by setting the pin EN to HIGH, both the wake-up request

on pin RxD as well as the wake-up source flag on pin TxD are reset immediately.

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6. Functionality

6.1. RESET behaviour of MLX8003x/5x

The MLX8003x/5x contains a reset unit which controls the initialization and generation of the reset signal. The NRES pin

flags the reset state of the MLX8003x/5x. The POR timer will be started if V_Sis switched on and V_CC> V_RESthreshold.

After the time t_Resthe NRES output is switched from low to high.

The reset unit combines a VCC low voltage detection unit with fixed reset timer. This output is switched from low to

high if V_Sis switched on and after the time t_Resis V_CC> V_RES

.

A drop of the V_CCvoltage will be detected by the low voltage reset unit which generates a reset signal. The

MLX8003x/5x will be reinitialized if the V_CCvoltage rises above the low voltage limit.

If the voltage V_CCdrops below V_RESthen the NRES output is switched from high to low after the time t_rr. This filters short breaks

of the V_CCvoltage and avoids uncontrolled reset generation.

VSUP spike

VS

V_{SUP_UVR}

VCC spike

T>Tj

T<Tj

t<t_rr

Unterspannung an

VSUP

VCC overload

t<t_rr

VCC

V_RES

t_Res

t_rr

NRES

thermal

shutdown

power-on

reset_timing_8003x5x.vsd

Figure 10: VCC reset behavior

The MLX80031/51 version combines the reset behaviour described above with a window-watchdog unit.

The NRES pin outputs the reset state as well as the watchdog condition. The POR timer will be started if V_SUPis switched

on and V_CC> POR threshold. After the time t_Resthe RESET output is switched from low to high. The watchdog is disabled

during this POR procedure. After the POR delay, the NRES output is switched from low to high and the watchdog starts.

In normal mode the NRES pin flags the status of the window watchdog.

6.2. Thermal Shutdown

If the junction temperature T_Jis higher than T_JSHD, the MLX8003x/5x switches from any mode into Standby Mode. Dur-

ing TSD all functions are switched-off. The transceiver is completely disabled; no wake-up functionality is available.

If T_Jfalls below the thermal recovery temperature T_JREC, MLX8003x/5x resumes operation starting from Standby Mode.

If EN=H at recovery, chip switches to NORMAL after VCC>VRES and tres. SBY-timeout timer is disabled during TSD.

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6.3. VS under voltage reset

The under voltage detection unit prevents an undefined behaviour of the MLX8003x/5x under low voltage condition (VS

< V_{SUVR_ON}). If VS drops below V_{SUVR_ON}, the under voltage detection becomes active and the IC will be switched from

every state to Init-State followed by Standby Mode with the same behaviour like after VS power-on. With the following

increase of VS above V_{SUVR_OFF}the MLX8003x5x remains in Standby Mode and the voltage regulator starts with the ini-

tialization sequence (Vcc available). If EN=H at power-up, the chip switches to NORMAL after VCC>VRES and tres.

Remark: In case Vs drops below 5V but still remains above V_{SUVR_ON}, Vcc follows Vs. Vcc is switched off during Vs Un-

dervoltage reset.

6.4. LIN-Transceiver

The MLX8003x/5x has an integrated bi-directional bus interface device for data transfer between LIN bus and the LIN

protocol controller.

The transceiver consists of a driver with slew rate control, wave shaping and current limitation and a receiver with high

voltage comparator followed by a debouncing unit.

Transmit Mode

During transmission the data at the pin TxD will be transferred to the LIN driver to generate a bus signal. To minimize

the electromagnetic emission of the bus line, the LIN driver has an integrated slew rate control and wave shaping unit.

Transmitting will be interrupted in the following cases:

-

Sleep Mode

Silent Mode

Thermal Shutdown active

Power on Reset

The recessive LIN bus level is generated from the integrated 30k pull up resistor in serial with an active diode This diode

prevents the reverse current of V_LINduring differential voltage between VS and LIN (V_LIN>V_S).

No additional termination resistor is necessary to use the MLX8003x/5x in LIN slave nodes. If this ICs are used for LIN

master nodes it is necessary that the LIN pin is terminated via an external 1k resistor in series with a diode to VBAT.

Receive Mode

The data signals from the LIN pin will be transferred continuously to the pin RxD. Short spikes on the bus signal are sup-

pressed by the implemented debouncing circuit.

Slew Modes and Data rates

The MLX8003x/5x consists a constant slew rate transceiver which means that the bus driver works with a mode de-

pended slew rate. In normal mode the slew rate is typical 1.6 V/µs (max. baud rate 20kbit/s) and in low slew mode typi-

cal 0.8 V/µs. The lower slew rate in low slew mode associated with a baud rate of 10.4kbit/s improves the EME behav-

iour.

The LIN transceiver of MLX8003x/5x is compatible to the physical layer specification according to LIN 2.x specification

for data rates up to 20kbit/s and the SAE specification J2602 for data rates up to 10.4kbit/s.

The constant slew rate principle is very robust against voltage drops and can operate with RC- oscillator systems with a

clock tolerance up to ±2% between 2 nodes.

Low Slew Mode

In this mode the slew rate is switched from the normal value of typical 1.6V/µs to a low value of typical 0.8V/µs. This

mode is optimized to send with a maximum baud rate of 10.4kbit/s (acc. to SAE J2602). Because of this reduction of the

slew rate the EME behaviour is improved especially in the frequency range of 100 kHz to 10MHz.

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6.5. Voltage Regulator

The MLX8003x/5x has an integrated low drop linear regulator with a p-channel-MOSFET as driving transistor. This regu-

lator outputs a voltage of 3.3V/5V ±2% and a current of 70mA within an input voltage range of 6V ≤ V_SUP≤ 18V. The

current limitation unit limits the output current for short circuits or overload to 130mA respectively drop-down of the

V_CCvoltage.

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7. Window-Watchdog (only MLX80031/51)

The integrated window watchdog unit observes the correct function of the connected Microcontroller. The required

timing can be programmed with an external resistor connected to the pin RB_WD. This resistor defines together with an

internal capacitor the watchdog oscillator frequency. The watchdog is re-triggered by the Microcontroller via the NWDI

input. The watchdog status is represented by the NRES pin.

Negative edges on NWDI reset the watchdog timer. If no pulse is received at NWDI, the MLX80051/31 generates low

pulses on the NRES output with a pulse width of t_WDresand a period of t_WDper

.

7.1. MLX80031/51 Watchdog Behaviour

After power-on and elapsed reset time t_res, the window watchdog starts operation with a rising edge on pin NRES. This

start is independent from Standby or Normal Mode.

VS,

VCC

V_RES

t_WRes

t_rr

t_OWS

t_CW

t_OW

t_Res

NRES

NWDI

Start-up

POR delay

Watchdog Lead Window

Watchdog Sequence

Power-off

init_mlx8003151-all.vsd

Figure 11: MLX80031/51 Watchdog behavior

In case of leaving Silent or Sleep Mode via remote wake-up (LIN) or local wake-up (WAKE or KL15), the window watch-

dog starts immediately after entering Standby Mode.

After t_resthe window watchdog unit starts with the Lead Time State. In this state the watchdog clock periods (1/f_wdosc

)

are counted 7895(=nlead) times. A falling edge on NWDI pin within this lead time stops the lead counter and activates

the Closed Window State with ncw=1053. Thereafter follows the Open Window State with counter start value of

now=1105. In case the lead counter elapses, the watchdog enters the Reset State and starts the reset timer with time

tres.

Close Window State and Open Window State are the normal states of the window watchdog. At each of these states

runs a counter with the watchdog clock signal. The CWT counter runs always to the end. The watchdog does not trigger

when

the

NWDI

trigger

signal

arrives

within

the

Open

Window

State.

A NWDI trigger pulse outside the Open Window State generates a reset condition and the NRES output switches to low

for the time t_WDres(see Figure 12).

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t_OW

t_WDres

t_CW

t_OW

t_CW

t_OW

t_CW

NWDI

NRES

NWDI = High or Low

t_WD

watchdog_timing.vsd

3 correct watchdog services

2 Twd > tcw+tow at NWDI= High or Low

Twd < tcw

Figure 12: Watchdog timing

7.2. All watchdog start-up scenarios

7.2.1. After power-on and initialization

Watchdog starts after VCC ramp up and elapsed time of reset timer (typ. 4ms) with Lead Time State. MLX80031/51 is in

Standby or Normal Mode.

7.2.2. Wake up indicated transition to Standby Mode from Sleep or Silent

Mode

Watchdog starts immediately with activation of Standby Mode (SBY_MODE = 1). Waking up from Sleep Mode the VCC

regulator ramps up and the reset timer starts. The reset timer has in this case no influence on the watchdog start.

7.2.3. Undervoltage reset on VCC on Normal Mode or Silent Mode

MLX80031/51 goes to Standby Mode. Running watchdog process is stopped and cleared. With active undervoltage

reset the signal the output pin NRES goes to low. Leaving undervoltage reset starts the reset timer (4ms) and thereafter

starts a new watchdog cycle.

7.2.4. EN indicated transition from Silent Mode to Normal Mode

Mode control changes from Silent Mode to Normal Mode. Watchdog starts immediately with activation of Normal

Mode in Closed Window State.

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7.3. Calculation of Watchdog Period

The RC-oscillator of MLX80031/51 which generates the responsible timing of the watchdog has a tolerance of ±15%.

This has the consequence that also the watchdog window times t_CWand t_OWvariants with this tolerance.

t_WD

-Δt_WD

+Δt_WD

CW

OW

0

t

t_CWmax

t_CWmint_CW

t_CW+t_OW

(t_CW+t_{OW min}

)

(t_CW+t_{OW max}

)

Figure 13: Watchdog open and close window tolerances

The ideal watchdog period can be calculated with:

1

t

WD_id  t_CW t_OW

2

The average value t_WDof the real usable watchdog trigger time under consideration of the oscillator tolerance is:

[EQ1]

tWD  (tCW min tOW min tCW max) 2

The allowed tolerance t_WDis:

[EQ2]

tWD  (tCW min tOW min tCW max) 2

With the definition of t_CW= ncw * (1± TOL) * t_WDOSCand t_OW= now * (1± TOL) * t_WDOSCfrom [EQ1] t_WDcan be calculated

with:

[EQ3]

tWD  tWDOSC(2ncw  now(1TOL)) 2

and with [EQ2]:

tWD  tWDOSC (now(1TOL)2TOLncw) 2

[EQ4]

The variation Δt_WDwill be normalized to the mean value t_WDand both counter values set in a relationship of

a=now/ncw, then follows for the relative deviation:

a(1TOL)  2TOL

tWDTOL



[EQ5]

2  a(1TOL)

The watchdog trigger time as well as the tolerance depends only on the oscillator frequency respectively the period

t_WDOSC, if there are fixed values for both counters (ncw and now) and oscillator tolerance.

Implemented in MLX80031/51 is a precision RC oscillator with a tolerance of TOL = 15%. Combined with the relation

of counter values a=1.04 reached them a tolerance of trigger time of 20%.

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Table 9: Parameters of Window Watchdog

Symbol

TOL

Parameter

Value

15%

1053

Tolerance WD oscillator

Close window counter

Open window counter

Tolerance WD-trigger time

ncw

1105

now

t_WDTOL

20%

With the predefined counter values (ncw and now) and the oscillator tolerance TOL are the trigger time of watchdog

and them tolerance only be calculated by the selection of oscillator frequency, or their period t_WDOSC

.

Fort the used precision RC-oscillator the oscillator period is shown as a linear function of the external resistor RB_WD

[EQ6]

The trigger period can be calculated with the help of EQ3 together with Table 9 – Parameter of Window Watchdog

.

t

WDOSC[s] 0.3486 RBWD[k]1.117

[EQ7]

tWD[ms] 0.99477 RBWD[k]5.58462

Or convert to RB_WD

:

[EQ8]

RBWD[k] 1.00526tWD[ms]5.61398

Some samples of different RD_WDvalues and the corresponding watchdog times:

Table 10: Window Watchdog Timing Selection

Lead Time

t_LEAD[ms]

Open Window

t_OW[ms]

Trigger Period

t_WD[ms]

RB_WD

[k]

t_WDOSC

[s]

Close Window

t_CW[ms]

20

30

8.09

11.58

18.90

27.26

35.98

42.95

53.41

63.9

91.4

8.52

12.19

19.90

28.71

37.88

45.23

56.24

8.94

12.79

20.88

30.12

39.75

47.46

59.01

25.48

35.42

51

149.2

215.2

284.0

339.1

421.6

56.31

75

80.19

100

120

150

105.06

124.95

154.80

Short or open circuit on RB_WD

The MLX80031/51 can detect a short circuit against GND on the RB_WDpin or an open RB_WDpin. If on pin a resistor RB_WD

<330 or RB_WD>10M detected, then the MLX80031/51 checks during the initialization phase a fail-safe state. The

watchdog oscillator will be set in a fail-safe mode with an oscillator period of about 50s. RBWD values between 150k

and 10M are not allowed.

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8. Fail-safe features

Loss of battery

If the ECU is disconnected from the battery, the LIN bus pin is in high impedance state. There is no impact to the bus

traffic and to the ECU itself. Reverse current is limited to < 20µA

Loss of Ground

In case of an interrupted ECU ground connection there is no influence to the bus line. The current from the ECU to the

LIN bus is limited by the weak pull up resistor of the pin LIN. The slave termination resistor is disconnected in order to

fulfil the SAE J2602 requirements for the loss of ground current (<100µA @12V).

Short circuit to battery

The transmitter output current is limited to the specified value in case of short circuit to battery in order to prevent

high current densities and thermal hot spots in the LIN driver.

Short circuit to ground

If the LIN bus wiring is shorted to negative shifted ground levels, there is no current flow from the ECU ground to the

bus and no distortion of the bus traffic occurs.

If the controller detects a short circuit of the LIN bus to ground the transceiver can be set into sleep mode. Additionally

the internal slave termination resistor is switched off and only a weak pull up termination is applied to the LIN bus (typ.

50µA). If the failure disappears, the bus level will become recessive again and will wake up the system even if no local

wake up occurs or is possible.

Thermal overload

All MLX8003x/5x versions are protected against thermal overloads. If the chip temperature exceeds the specified value,

the transmitter is disabled until thermal recovery and the following recessive to dominant transition on pin TxD. The

receiver is still working while thermal shutdown.

Undervoltage lock out

If the battery supply voltage is missing or decreases below the specified value (VS_UV), the transmitter is disabled to

prevent undefined bus traffic. While in sleep mode, the MLX8003x/5x enters the Standby Mode if Vs drops below the

internal power on reset threshold.

Open Circuit protection

•

The pin TxD provides a pull up resistor to VCC. The transmitter cannot be enabled.

The pin EN provides a pull down resistor to prevent undefined normal mode transitions.

The pin NWDI provides a pull up resistor to VCC. The window watchdog generates NRES pulse.

The pin MODE provides a pull down resistor to GND. No influence on window watchdog.

If the battery supply voltage is disconnected, the pin RxD is floating.

The pin WAKE provides a weak pull up current towards supply voltage Vs to prevent

local wake-up requests.

•

The pin KL15 provides a weak pull down current towards GND to prevent local wake-up requests.

Short circuit RxD, NRES against GND or VCC

Both outputs are short circuit proof to VCC and ground.

RBWD short circuit against GND or open

The watchdog oscillator runs with an internal controlled frequency and guarantees a reset.

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9. Application Hints

9.1. Safe Operating Area

The linear regulator of the MLX8003x/5x operates with input voltages up to 27 V and can output a current of 70 mA.

The maximum power dissipation limits the maximum output current at high input voltages and high ambient tempera-

tures. The output current of 70 mA at an ambient temperature of T_A= 125°C is only possible with small voltage differ-

ences between V_Sand V_CC.

80

maximum current

Safe Operating Area

70

60

50

40

30

20

10

0

MLX80030

T_A= +105 ^oC

MLX80050

T_A= +105 ^oC

MLX80030

T_A= +125 ^oC

MLX80050

T_A= +125 ^oC

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

VSUP [V]

Figure 14: Safe operating area for MLX80030/50 in SOIC-8 for Vsup up to 18V

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80

maximum current

Safe Operating Area

70

MLX80051

T_A= +105 ^oC

MLX80031

T_A= +105 ^oC

60

50

MLX80051

T_A= +125 ^oC

40

30

20

10

0

MLX80031

T_A= +125 ^oC

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

VSUP [V]

Figure 15: Safe operating area for MLX80031/51 in QFN20 for Vsup up to 18V

9.2. Application Circuitry

100n

10k

2.2u

MCU

+5V/

3.3V

MLX80050/30

2.2u ..100u

V_BAT

VCC

NRES

TxD

VS

100n

EN

100n

GND

RxD

BUS

LIN

220p

Figure 16: Application circuit with MLX80050 or MLX80030 (slave node)

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Ignition

2.2u

C_L

100n

VBAT

CIN

2.2u ..100u

100n

Debug

2

0

1

9

1

8

1

7

1

6

10k

60k

EN

MODE

1

2

3

4

5

15

14

13

12

11

MLX80031/51

uC

VDD

NWDI

WAKE

GND

RBwd

NRES

TxD

QFN 5 mm x5 mm

0. 65 mm pitch

20 lead

RESET

RxD

33k

TxD

WD Trig

EN

1

0

6

7

8

9

INH

LIN-

BUS

220p

Figure 17: Application circuit with MLX80031 or MLX80051 (slave node)

To minimize the influence of EMI on the bus line an 220pF capacitor should be connected directly to the LIN pin (see

Figure 17). This EMI-Filter assures that the RF injection into the IC from the LIN bus line has no effect or will be limited.

It is also possible to use LC- or RC-filters. The dimensions of C-L or R-L depend on the corner frequency, the maximum

LIN bus capacitance (10nF) and the compliance with the DC- and AC LIN bus parameters.

10. ESD and EMC

10.1. Recommendations for Actuator products

In order to minimize EMC influences, the PCB has to be designed according to EMC guidelines. Actuators products are

ESD sensitive devices and have to be handled according to the rules in IEC61340-5-2.

Actuators products will apply the requirements in the application according to the specification, to ISO7637-2, -3 and

ISO16750-2.

Prototype samples of actuators products will be evaluated according AEC-Q100-002. The result will be published after

qualification. After ESD stress single parameters may be shifted out of their limit, but IC function will still be correctly.

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10.1.1. Automotive Qualification Test Pulses

That means that automotive test pulses are applied to the module in the application environment and not to the single

IC. Therefore attention must be taken, that only protected pins (protection by means of the IC itself or by means of

external components) are wired to a module connector. In the recommended application diagrams, the reverse polarity

diode together with the capacitors on supply pins, the protection resistors in several lines and the load dump protected

IC itself will protect the module against the below listed automotive test pulses. The exact value of the capacitors for

the application has to be figured out during design-in of the product according to the automotive requirements.

For the LIN pin the specification “LIN Physical Layer Spec 2.1 (Nov. 24, 2006)” is valid.

Supply Pin VS is protected via the reverse polarity diode and the supply capacitors. No damage will occur for defined

test pulses. A deviation of characteristics is allowed during pulse 1 and 2; but the module will recover to the normal

function after the pulse without any additional action. During test pulse 3a, 3b, 5 the module will work within charac-

teristic limits.

10.1.2. Test Pulses On supply Lines

Table 11: Test pulses Supply Line

test condition,

functional status

Parameter

Symbol

Min

Max

Dim

Coupling

Transient test pulses in accordance to ISO7637-2 (supply lines) & , VS=13.5V, TA=(23 5)°C

& (Document: “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”; Audi,

BMW, Daimler, Porsche, VW; 2009-12-02)

5000 pulses,

functional state C

5000 pulses,

functional state A

1h,functional state A

Test pulse #1

Test pulse #2a

vpulse1

-100

V

Direct

vpulse2a

75

Test pulse #3a

Test pulse #3b

vpulse3a

vpulse3b

-150

V

Direct

100

Load dump test pulse in accordance to ISO16750-2 (supply lines), VS=13.0V, TA=(23 5)°C

1 pulse clamped to

27V (+13V (VS)),

(32V (+13V (VS))for

applications for north

America),

65

87

Test pulse #5b

vpulse5b

V

Direct

(+13V (VS))

functional state C

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10.1.3. Test pulses on Pin LIN

Table 12: Test pulses LIN

test condition,

functional status

Parameter

Symbol

Min

Max

Dim

Coupling

Transient test pulses in accordance to ISO7637-3, VS=13.5V, TA=(23 5)°C

& (Document: “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”; Audi,

BMW, Daimler, Porsche, VW; 2009-12-02)

Direct capacitive

Vpulse_

slow+

1000 pulses,

functional state D

Test pulse ‘DCC slow –‘

Test pulse ‘DCC slow +‘

Test pulse ‘DCC fast a’

Test pulse ‘DCC fast b’

-100

-150

V

coupled:

1nF

Direct capacitive

coupled:

Vpulse_

slow-

1000 pulses,

functional state D

75

1nF

Direct capacitive

coupled:

Vpulse_

fast_a

10 min,

functional state D

1nF

Direct capacitive

coupled:

Vpulse_

fast_b

10 min,

functional state D

100

1nF

10.1.4. Test pulses on signal lines

Table 13: Test pulses signal lines

test condition,

functional status

Parameter

Symbol

Min

Max

Dim

Coupling

Transient test pulses in accordance to ISO7637-3 (signal lines). VS=13.5V, TA=(23 5)°C

Direct capacitive

Vpulse_

slow+

1000 pulses,

functional state C

Test pulse ‘DCC slow –‘

Test pulse ‘DCC slow +‘

Test pulse ‘DCC fast a’

Test pulse ‘DCC fast b’

-30

+8

-8

+30

-10

40

V

coupled:

100nF

Direct capacitive

coupled:

100nF

Direct capacitive

coupled:

100pF

Direct capacitive

coupled:

Vpulse_

slow-

1000 pulses,

functional state A

Vpulse_

fast_a

10 min,

functional state A

-60

10

Vpulse_

fast_b

10 min,

functional state A

100pF

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Description of functional state

A:

B:

All functions of the device are performed as designed during and after the disturbance occurs.

All functions of the device are performed as designed during the disturbance occurs. One or more functions

can violate the specified tolerances. All functions return automatically within their normal limits after the dis-

turbances is removed..

C:

A function of a device does not perform as designed during the disturbance occurs but returns automatically

to the normal operation after the disturbances is removed.

D:

A function of a device does not perform as designed during the disturbance occurs and does not return auto-

matically to the normal operation after the disturbances is removed. The device needs to be reset by a simple

operation/action to return to the specified limits/function.

E:

One or more functions of a device do not perform as designed during and after the disturbance occurs and

does not return automatically to the normal operation after the disturbances is removed. After a reset of the

device, it does not return to the specified limits/function. The device needs to be repaired or replaced.

10.1.5. EMV Test pulse definition

Table 14: Test pulses shapes ISO7637-2

Test Pulse 1

Ri = 10 Ohm

Test pulse 2a

Ri = 2 Ohm

200 ms

0.5...5s

V

<

100 µs

50 µs

1 µs

V

12 V

0 V

t

10%

90%

vpulse1

a

vpulse2

90%

10%

12V

1 µs

2 ms

0 V

t

0.5...5s

200 ms

Test Pulse 3a

Ri = 50 Ohm

Test Pulse 3b

Ri = 50 Ohm

100 ns

5

ns

V

90%

V

vpulse3b

12V

10%

0

V

t

vpulse3a

vpulse3b

vpulse3a

10%

12V

0 V

100 µs

10 ms

100 µs

10 ms

t

5 ns

90 ms

90%

90 ms

100 ns

Test Pulse 5a (Load Dump)

Ri = 0.5Ohm (clamped to 45V during test)

V

Pulse 5

90%

vpulse5

Pulse 5 at

device

40V

12V

10%

t

tr = 0.1...10ms

td = 40...400ms

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Table 15: Test pulses shapes ISO7637-3

EMV Test Pulse shapes (ISO7637-3 (non-supply lines))

Test Pulse ‘DCC slow -’

Test pulse ‘DCC slow +’

Ri = 2 Ohm

Test Pulse ‘Fast a, DCC’

Test Pulse ‘Fast b, DCC’

Ri = 50 Ohm

10.2. Typical Application Circuitry

In order to minimize EMC influences, the external application circuitry shall be designed as followed:

D12)

VS

+

C11)

C22)

C32)

C61)

VS

R12)

R22)

Signal-

line

Signal

-line

LIN

Actuators

Product

C41)

C52)

C71)

D21)

D31)

GND

1) optional implemented

2) mandatory implemented

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10.2.1. External Circuitry on Supply Lines

In order to minimize EMC influences, the external application circuitry shall be designed as followed:

Name

C1

Mounting

Min

-

Recommended

100

Max

-

Dim

nF

Comment

Ceramic SMD: 10%, 0805, ≥50V;

close to the connector

recommended

D1

C2

mandatory

Inverse-polarity protection diode

Tantal SMD: 10%, 7343, 35V

Ceramic SMD: 10%, 0805, ≥50V;

1

-

22

100

-

μF

C3

mandatory

100

nF

close to the pin

10.2.2. External Circuitry on LIN Lines

In order to minimize EMC influences, the external application circuitry shall be designed as followed:

Name

D2

Mounting

no

Min

-

Recommended

PESD1LIN

Max

-

Dim

Comment

ESD protection Diode: SOD323

close to the connector;

optional part

Ceramic SMD: 10%, 0805, ≥50V;

C_Slave≤ C_D2+C₄+C₅+C₆+C_IC

C_Slave≤250pF;

C4

no

-

pF

optional part

Serial resistor: 0805;

or optional Ferrite

Ceramic SMD: 10%, 0805, ≥50V;

C_Slave≤ C_D2+C₄+C₅+C₆+C_IC

C_Slave≤250pF

R1

C5

mandatory

-

0

-

Ω

220

pF

Ceramic SMD: 10%, 0805, ≥50V;

C_Slave≤ C_D2+C₄+C₅+C₆+C_IC

C_Slave≤250pF;

C6

no

-

pF

optional part

10.2.3. External Circuitry on Signal Lines

In order to minimize EMC influences, the external application circuitry shall be designed as followed:

Name

C7

Mounting

no

Min

0.1

Recommended

1

Max

100

Dim

nF

Comment

Ceramic SMD: 10%, 0805, ≥50V;

optional part

Serial resistor: 0805;

or optional Ferrite

ESD protection Diode: SOD323

close to the connector;

optional part

R2

D3

mandatory

no

0

-

560

1000

-

Ω

PESD1LIN

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11. Mechanical Specification

11.1. SOIC8 package

Figure 18: SOIC8 Drawing

Table 16: SOIC8 dimensions

Small Outline Integrated Circiut (SOIC), SOIC 8, 150 mil

A1

B

C

D

E

e

H

h

L

A

ZD

A2



All Dimension in mm, coplanarity < 0.1 mm

min

max

0.10

0.25

0.36

0.46

0.19

0.25

4.80

4.98

3.81

3.99

5.80

6.20

0.25

0.50

0.41

1.27

1.52

1.72

0°

8°

1.37

1.57

1.27

0.53

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11.2. QFN20 5x5 package

1

2

N

Bottom

Exposed Pad

D

D2

e

b

Figure 19: QFN20 Drawing

Table 17: QFN20 Package Dimensions

Symbol

A

A1

0

A3

b

D

D2

E

E2

e

K

L

N ^[3]ND ^[4]NE ^[4]

[1]

[2]

0.80

1.00

0.25

0.35

3.00

3.25

3.00

3.25

0.45

0.65

min

max

0.20

5.00

0.65

0.20

20

5

0.05

[1] Dimensions and tolerances conform to ASME Y14.5M-1994

[2] All dimensions are in Millimeters. All angels are in degrees

[3] N is the total number of terminals

[4] ND and NE refer to the number of terminals on each D and E side respectively

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12. Revision History

Version

001

Changes

Remark

1^stRelease

Date

First Release

April 2012

June 2012

002



For TSD added: "If EN=H at recovery, chip switches to NORMAL

after VCC>VRES and tres" and "SBY-timeout timer is disabled dur-

ing TSD"



For TSD removed explicit values and kept parameter name only.

For Vs_uvr added: "If EN=H at power-up, chip switches to NORMAL

after VCC>VRES and tres"



Changed state diagram: sleep mode can be left with EN = H (was a

L-H transition in A version of the device), refers to Errata 80050AA-

07.

003

004

Dec 2012

Mar 2013



ESD robustness level adapted to Conformance Test Report

Static Characteristics adapted to CPK-Values

Block Diagram updated

Corrected short description of product



Removed 06.05, 09.05, 13.05

Changed 05.02 to 200mV (5V) and 100mV (3.3V)

Changed 06.03 and 13.03 to 700mV

Changed 09.03 to 600mV

Added MODE pin to parameter list

Changed 15.05 to LL = 2.7V and UL to 3.3V

Changed 14.01 to 0.6V at 2mA

Changed 08.03 to LL = 30

Changed 02.00 to LL = 400 and UL to 1500

Changed Tjshd to 155/170/190°C

Changed 12.04 and 12.05 UL to 20uA

Changed 03.05 to relevance “C” (only for characterization)

Added 17.06 Watchdog safety oscillator

Changed 3.01 for 80030/31 to UL = 3.201 and UL = 3.399

005

006

Apr 2013

July 2013



Corrected value “e” of QFN package data to “0.65”



Changed 15.01

Changed 1.03 LL to 40mV

Changed 3.09 LL to -135mA and UL to -75mA

Changed ESD capability of LIN pin to +/-6kV

007

008

Feb 2014



Changed operating voltage to max. 27V

Changed table 2, nominal operating voltage, max to 27V

Update 3.09: split temperature ranges

Changed 12.03 to min: -400µA

Changed 12.06 to min: -10µA, max: 50µA

Changed 6.04 to typ: 125 k, max: 250 k

Changed 12.01 to 80µA

April 2014



Added condition for thermal resistance

Updated chapter 4.1, tables 7 and 8 for TxD and RxD values de-

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pending on the mode and EN = H transition from Sleep Mode to

Normal Mode



Changed operating voltage to 27V max in application hints 9.1

Re-phrased information to EMC compliance in 9.2.2

LIN: Changed parameter 12.10 and added parameter 12.12 to Lin

spec 2.x and compatible to SAE J2602, split parameter 12.07 into

dominant and recessive

009

010

Nov 2014

Feb 2015



Updated product codes to “wettable flanks”



Silent Mode for Silicon Version B not supported

Silicon Version C added, support of silent mode

011

Jun 2016



Silicon Version B removed

Changed 1.01, 1.02 VS under voltage reset

Changed 2.01 supply current sleep mode

Changed 2.02 supply current silent mode

Addition of 18.11 Wake up time vs. EN

Update state diagram (Fig 5)

Update of paragraph ESD and EMC

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13. Standard information regarding manufacturability of

Melexis products with different soldering processes

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level

according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)



IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

(classification reflow profiles according to table 5-2)

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)



EN60749-20

Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat

EIA/JEDEC JESD22-B106 and EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Iron Soldering THD’s (Through Hole Devices)



EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)



EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, tem-

perature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with

Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive

strength between device and board.

Melexis recommends reviewing on our web site the General Guidelines soldering recommendation

(http://www.melexis.com/Quality_soldering.aspx) as well as trim&form recommendations

(http://www.melexis.com/Assets/Trim-and-form-recommendations-5565.aspx).

Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information

on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Haz-

ardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx

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14. Disclaimer

Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term

of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set

forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the

right to change specifications and prices at any time and without notice. Therefore, prior to designing this prod-

uct into a system, it is necessary to check with Melexis for current information. This product is intended for use in

normal commercial applications. Applications requiring extended temperature range, unusual environmental

requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment

are specifically not recommended without additional processing by Melexis for each application.

The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable

to recipient or any third party for any damages, including but not limited to personal injury, property damage,

loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any

kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No ob-

ligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other

services.

For the latest version of this document, go to our website at

www.melexis.com

Or for additional information contact Melexis Direct:

Europe, Africa, Asia:

America:

Phone: +32 1367 0495

Phone: +1 248 306 5400

E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com

ISO/TS 16949 and ISO14001 Certified

MLX80050/51/30/31 – Datasheet

3901080050

Page 50

Jun 2016

011


型号：	MLX80051
厂家：	Melexis Microelectronic Systems
描述：	LIN System Basis ICs
文件：	总50页 (文件大小：1634K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MLX80051 [MELEXIS]

相关型号：

MLX80051KLW-BAA-000-RE

MLX80051KLW-BAA-000-SP

MLX80051KLW-CAA-000-RE

MLX80051KLW-CAA-000-SP

MLX80104

MLX80104KLQ-DAG-000-RE

MLX80104KLW-DAG-000-RE

MLX80105

MLX80105KLQ-EAA-000-RE

MLX80105KLW-EAA-000-RE

MLX81100

MLX81100KLQBAA000RE