W3E32M72SR-266BMF [MERCURY]

DDR DRAM,;
W3E32M72SR-266BMF
型号: W3E32M72SR-266BMF
厂家: MERCURY UNITED ELECTRONICS INC    MERCURY UNITED ELECTRONICS INC
描述:

DDR DRAM,

动态存储器 双倍数据速率
文件: 总2页 (文件大小:918K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Density Secure Memory  
DDR SDRAM  
Available From 128MB to 512MB  
• Advanced miniaturization technology  
• Data transfer speed up to 333 Mb/s  
• -55 to +125°C operating temperature  
• Manufactured in a DMEA-trusted US facility  
• Programmable Burst lengths: 2, 4, or 8  
• Concurrent Auto Precharge option  
• Auto Refresh and Self Refresh Modes  
Mercury Systems’ advanced design and packaging techniques  
miniaturize DDR SDRAM memory in a compact, highly ruggedized  
package. These devices are ideally suited for military and  
commercial aerospace applications requiring high-speed DDR  
memory optimized for size, weight, and power.  
Benefits  
• Up to 75% space savings vs discrete chip packages  
Military-grade performance without sacrificing the benefits of  
Mercury Systems is currently engaging with customers in design  
opportunities requiring DDR memory performance. To participate  
in this design program, please contact your Mercury Systems  
representative or contact us at Secure.Memory@mrcy.com  
DDR3 memory  
• Up to 88% component reduction  
• 100% burn-in and electrical test for the highest quality assurance  
• Available component End of Life management for long-term supply  
continuity  
Product Features  
Package  
• DDR SDRAM Rate = 333, 266, 200 Mbs  
• Core Supply Voltage = 2.5V  
• 10mm x 12.5mm - 60 plastic ball grid array (PBGA); 13mm x 22mm  
- 208 PBGA; 21mm x 21mm - 219 PBGA; 32mm x 26mm - 219  
PBGA; 32mm x 25mm - 219 PBGA  
• I/O Supply Voltage = 2.5V - (SSTL_2 compatible)  
• Bidirectional data strobe (DQS) per byte  
• Internal, pipelined, double data rate architecture  
Differential Clock Inputs  
• 1mm or 1.27mm pitch  
• Solder ball composition: Eutectic, lead free upon request  
• Moisture Sensitivity Level (MSL): 3  
• DLL for alignment of DQ and DQS transitions with clock signal  
• Four internal banks for concurrent operation (Per DDR SDRAM  
Die)  
* This product is subject to change without notice.  
.
• Data Mask (DM) for masking write data per byte  
• Programmable IOL/IOH  
Mercury Systems is a leading commercial provider of secure sensor and  
safety-critical processing subsystems. Optimized for customer and mission  
success, Mercury’s solutions power a wide variety of critical defense and  
intelligence programs.  
100101010  
001101011  
110101100  
ACQUIRE  
DIGITIZE  
PROCESS  
STORAGE  
EXPLOIT
DISSEMINATE  
Figure 1 - Part Numbers  
DDR SDRAM MCPs  
Size  
Organization  
Part Number  
Data Rate (Mb/s)  
Voltage (V)  
Package  
Dimensions  
Temperature  
128MB  
256MB  
256MB  
256MB  
256MB  
256MB  
256MB  
512MB  
64M x 16  
32M x 64  
32M x 64  
32M x 64  
32M x 72  
32M x 72  
32M x 72  
64M x 72  
W3E64M16S-XBX  
W3E32M64S-XB2X  
W3E32M64S-XB3X  
W3E32M64SA-XB2X  
W3E32M72S-XBX  
W3E32M72S-XB3X  
W3E32M72SR-XBX  
W3E64M72S-XBX  
200-333  
200-333  
200-333  
200-333  
200-333  
200-333  
200-266  
200-266  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
60 PBGA  
219 PBGA  
208 PBGA  
219 PBGA  
219 PBGA  
208 PBGA  
208 PBGA  
219 PBGA  
10mm x 12.5mm  
21mm x 21mm  
13mm x 22mm  
21mm x 21mm  
32mm x 26mm  
13mm x 22mm  
13mm x 22mm  
32mm x 25mm  
C, I, M  
C, I, M  
C, I, M  
C, I, M  
C, I, M  
C, I, M  
C, I, M  
C, I, M  
Figure 2 - Part Numbering Matrix  
W 3E XXMXX S X - X XX X X  
MERCURY SYSTEMS  
DDR SDRAM:  
CONFIGURATION:  
128MB  
256MB  
512MB  
=
=
=
64M x 16  
32M x 64, 32M x 72  
64M x 72  
2.5V POWER SUPPLY:  
OPTIONS:  
R
A
=
=
REGISTERED:  
ALTERNATE PINOUT:  
DATA RATE (Mbs):  
200  
250  
266  
333  
=
=
=
=
100MHz/200Mbs  
125MHz/250Mbs  
133MHz/266Mbs  
166MHz/333Mbs  
PACKAGE:  
XBX  
=
Various PBGA packages  
DEVICE GRADE:  
M
I
=
=
=
Military  
-55°C to +125°C  
-40°C to +85°C  
Industrial  
C
Commercial 0°C to +70°C  
SOLDER BALL COMPOSITION:  
Blank  
F
=
=
Leaded  
Lead Free (contact factory for availability)  
Example Part Number: W3E64M72S-333B3M  
Need More Help?  
Contact Mercury’s Secure Memory application engineering team at  
secure.memory@mrcy.com  
Innovation That Matters and Mercury Systems are trademarks of Mercury Systems, Inc. Other product and company names mentioned may be trademarks and/or registered trademarks of their respective holders. Mercury  
Systems, Inc. believes this information is accurate as of its publication date and is not responsible for any inadvertent errors. The information contained herein is subject to change without notice.  
Copyright © 2019 Mercury Systems, Inc.  
www.mrcy.com/ddr  
5025.01E_0119_DDR[1]-Product-Family-flyer  
corporate HeadquarterS  
50 Minuteman Road  
Andover, MA 01810-1008 USA  
+1 (978) 967-1401  
+1 (866) 627-6951  
Fax +1 (978) 256-3599  
Microelectronic Secure SolutionS  
3601 East University Drive  
Phoenix, AZ 85034-7217 USA  
+1 (602) 437-1520  
INNOVATION THAT MATTERS ™  
Fax +1 (602) 437-1731  

相关型号:

W3E32M72SR-266SBC

32Mx72 REGISTERED DDR SDRAM

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WEDC

W3E32M72SR-266SBC

DDR DRAM, 32MX72, 0.75ns, CMOS, PBGA208, 16 X 25 MM, PLASTIC, BGA-208

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MICROSEMI

W3E32M72SR-266SBI

32Mx72 REGISTERED DDR SDRAM

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WEDC

W3E32M72SR-266SBI

DDR DRAM, 32MX72, 0.75ns, CMOS, PBGA208, 16 X 25 MM, PLASTIC, BGA-208

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MICROSEMI

W3E32M72SR-266SBM

32Mx72 REGISTERED DDR SDRAM

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WEDC

W3E32M72SR-XSBX

32Mx72 REGISTERED DDR SDRAM

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
WEDC

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MERCURY

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MERCURY

W3E64M16S-200NBC

DDR DRAM, 64MX16, 0.8ns, CMOS, PBGA60, 10 X 12.50 MM, 1.50 MM HEIGHT, PLASTIC, BGA-60

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MICROSEMI

W3E64M16S-200NBI

DDR DRAM, 64MX16, 0.8ns, CMOS, PBGA60, 10 X 12.50 MM, 1.50 MM HEIGHT, PLASTIC, BGA-60

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MICROSEMI

W3E64M16S-200NBM

DDR DRAM, 64MX16, 0.8ns, CMOS, PBGA60, 10 X 12.50 MM, 1.50 MM HEIGHT, PLASTIC, BGA-60

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MICROSEMI

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
MERCURY