24AA00T/OTG_技术文档

24AA00/24LC00/24C00

128-Bit I²C^™Bus Serial EEPROM

Device Selection Table

Package Types

Device

VCC Range

Temp Range

8-PIN PDIP/SOIC

24AA00

24LC00

24C00

1.8-5.5

2.5-5.5

4.5-5.5

C,I

NC

Vss

1

2

3

4

8

7

6

5

VCC

NC

C,I,E

SCL

SDA

Features:

8-PIN TSSOP

• Low-power CMOS technology:

- 500 μA typical active current

- 250 nA typical standby current

• Organized as 16 bytes x 8 bits

• 2-wire serial interface bus, I²C™ compatible

• 100 kHz (1.8V) and 400 kHz (5V) compatibility

• Self-timed write cycle (including auto-erase)

• 4 ms maximum byte write cycle time

• 1,000,000 erase/write cycles

1

8

7

6

5

NC

VCC

NC

2

3

4

NC

SCL

SDA

VSS

5-PIN SOT-23

DFN

VCC

NC

SCL

VSS

1

NC

VCC

NC

1

2

5

4

8

7

6

5

2

3

4

NC

SCL

SDA

NC

VSS

• ESD protection > 4 kV

SDA

3

• Data retention > 200 years

• 8L PDIP, SOIC, TSSOP, DFN and 5L SOT-23

packages

Block Diagram

• Pb-free finish available

HV Generator

• Temperature ranges available:

- Commercial (C):

- Industrial (I):

- Automotive (E):

0°C to +70°C

-40°C to +85°C

-40°C to +125°C

I/O

Control

Logic

Memory

Control

Logic

EEPROM

Array

XDEC

Description:

SCL

SDA

The Microchip Technology Inc. 24AA00/24LC00/

24C00 (24XX00*) is a 128-bit Electrically Erasable

PROM memory organized as 16 x 8 with a 2-wire

serial interface. Low-voltage design permits operation

down to 1.8 volts for the 24AA00 version, and every

version maintains a maximum standby current of only

1 μA and typical active current of only 500 μA. This

device was designed for where a small amount of

EEPROM is needed for the storage of calibration

values, ID numbers or manufacturing information, etc.

The 24XX00 is available in 8-pin PDIP, 8-pin SOIC

(150 mil), 8-pin TSSOP, 8-pin 2x3 DFN and the 5-pin

SOT-23 packages.

YDEC

VCC

VSS

Sense AMP

R/W Control

Pin Function Table

Name

Function

VSS

SDA

SCL

VCC

Ground

Serial Data

Serial Clock

+1.8V to 5.5V (24AA00)

+2.5V to 5.5V (24LC00)

+4.5V to 5.5V (24C00)

No Internal Connection

2

I C is a trademark of Philips Corporation.

NC

*24XX00 is used in this document as a generic part number for

the 24AA00/24LC00/24C00 devices.

DS21178E-page 1

24AA00/24LC00/24C00

1.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-65°C to +125°C

ESD protection on all pins..........................................................................................................................................4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to

the device. This is a stress rating only and functional operation of the device at those or any other conditions

above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

TABLE 1-1:

DC CHARACTERISTICS

All Parameters apply across the

recommended operating ranges unless Industrial (I):

Commercial (C): TA = 0°C to +70°C,

TA = -40°C to +85°C,

VCC = 1.8V to 5.5V

otherwise noted

Parameter

Automotive (E)

TA = -40°C to +125°C, VCC = 4.5V to 5.5V

Symbol

Min.

Max.

Units

Conditions

SCL and SDA pins:

VIH

0.7 VCC

—

V

(Note)

High-level input voltage

Low-level input voltage

VIL

—

0.3 VCC

—

V

Hysteresis of Schmitt Trigger

inputs

VHYS

.05 VCC

VCC ≥ 2.5V (Note)

Low-level output voltage

VOL

—

0.4

V

IOL = 3.0 mA, VCC = 4.5V

IOL = 2.1 mA, VCC = 2.5V

Input leakage current

ILI

—

±1

10

μA

pF

VIN = VCC or VSS

Output leakage current

ILO

VOUT = VCC or VSS

Pin capacitance (all inputs/outputs)

CIN,

VCC = 5.0V (Note)

COUT

TA = 25°C, FCLK = 1 MHz

Operating current

ICC Write

ICC Read

ICCS

—

2

1

mA

μA

VCC = 5.5V, SCL = 400 kHz

VCC = 5.5V, SDA = SCL = VCC

Standby current

Note:

This parameter is periodically sampled and not 100% tested.

FIGURE 1-1:

BUS TIMING DATA

THIGH

TF

TR

TSU:STA

SCL

TSU:STO

THD:DAT

TSU:DAT

TLOW

THD:STA

SDA

IN

TSP

TBUF

TAA

SDA

OUT

DS21178E-page 2

24AA00/24LC00/24C00

TABLE 1-2:

AC CHARACTERISTICS

All Parameters apply across all

recommended operating ranges Industrial (I):

unless otherwise noted

Commercial (C):

TA = 0°C to +70°C, VCC = 1.8V to 5.5V

TA = -40°C to +85°C, VCC = 1.8V to 5.5V

TA = -40°C to +125°C, VCC = 4.5V to 5.5V

Automotive (E):

Parameter

Symbol

Min

Max

Units

Conditions

Clock frequency

FCLK

—

100

400

kHz

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Clock high time

Clock low time

THIGH

TLOW

TR

4000

600

—

ns

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

4700

1300

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

SDA and SCL rise time

(Note 1)

—

1000

300

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

SDA and SCL fall time

Start condition hold time

TF

—

300

ns

(Note 1)

THD:STA

4000

600

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Start condition setup time

TSU:STA

4700

600

—

ns

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Data input hold time

Data input setup time

THD:DAT

TSU:DAT

0

—

ns

(Note 2)

250

100

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Stop condition setup time

TSU:STO

TAA

4000

600

—

ns

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Output valid from clock

(Note 2)

—

3500

900

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Bus free time: Time the bus must TBUF

be free before a new transmis-

sion can start

4700

1300

—

Output fall time from VIH

minimum to VIL maximum

TOF

TSP

TWC

20+0.1

CB

250

ns

(Note 1), CB ≤ 100 pF

Input filter spike suppression

(SDA and SCL pins)

—

50

(Notes 1, 3)

Write cycle time

Endurance

—

4

ms

1M

—

cycles (Note 4)

Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a TI specification for standard operation.

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be obtained at www.microchip.com.

DS21178E-page 3

24AA00/24LC00/24C00

2.0

2.1

PIN DESCRIPTIONS

SDA Serial Data

4.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus

is not busy.

This is a bidirectional pin used to transfer addresses

and data into and data out of the device. It is an open

drain terminal, therefore the SDA bus requires a pull-up

resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for

400 kHz).

• During data transfer, the data line must remain

stable whenever the clock line is high. Changes in

the data line while the clock line is high will be

interpreted as a Start or Stop condition.

For normal data transfer SDA is allowed to change only

during SCL low. Changes during SCL high are

reserved for indicating the Start and Stop conditions.

Accordingly, the following bus conditions have been

defined (Figure 4-1).

4.1

Bus Not Busy (A)

2.2

SCL Serial Clock

Both data and clock lines remain high.

This input is used to synchronize the data transfer from

and to the device.

4.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock

(SCL) is high determines a Start condition. All

commands must be preceded by a Start condition.

2.3

Noise Protection

The SCL and SDA inputs have Schmitt Trigger and

filter circuits which suppress noise spikes to assure

proper device operation even on a noisy bus.

4.3

Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock

(SCL) is high determines a Stop condition. All

operations must be ended with a Stop condition.

3.0

FUNCTIONAL DESCRIPTION

The 24XX00 supports a bidirectional 2-wire bus and

data transmission protocol. A device that sends data

onto the bus is defined as a transmitter, and a device

receiving data as a receiver. The bus has to be

controlled by a master device which generates the

Serial Clock (SCL), controls the bus access, and

generates the Start and Stop conditions, while the

24XX00 works as slave. Both master and slave can

operate as transmitter or receiver, but the master

device determines which mode is activated.

4.4

Data Valid (D)

The state of the data line represents valid data when,

after a Start condition, the data line is stable for the

duration of the high period of the clock signal.

The data on the line must be changed during the low

period of the clock signal. There is one bit of data per

clock pulse.

Each data transfer is initiated with a Start condition and

terminated with a Stop condition. The number of the

data bytes transferred between the Start and Stop

conditions is determined by the master device and is

theoretically unlimited.

DS21178E-page 4

24AA00/24LC00/24C00

The device that acknowledges has to pull down the

SDA line during the Acknowledge clock pulse in such a

way that the SDA line is stable low during the high

period of the acknowledge related clock pulse. Of

course, setup and hold times must be taken into

account. A master must signal an end of data to the

slave by not generating an Acknowledge bit on the last

byte that has been clocked out of the slave. In this

case, the slave must leave the data line high to enable

the master to generate the Stop condition (Figure 4-2).

4.5

Acknowledge

Each receiving device, when addressed, is obliged to

generate an acknowledge after the reception of each

byte. The master device must generate an extra clock

pulse which is associated with this Acknowledge bit.

Note:

The 24XX00 does not generate any

Acknowledge bits if an internal program-

ming cycle is in progress.

FIGURE 4-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A)

(B)

(C)

(D)

(C) (A)

SCL

SDA

Start

Condition

Stop

Condition

Address or

Acknowledge

Valid

Data

Allowed

to Change

FIGURE 4-2:

ACKNOWLEDGE TIMING

Acknowledge

Bit

1

2

3

4

5

6

7

8

9

1

2

3

SCL

SDA

Data from transmitter

Receiver must release the SDA line at this point

so the Transmitter can continue sending data.

Transmitter must release the SDA line at this point

allowing the Receiver to pull the SDA line low to

acknowledge the previous eight bits of data.

DS21178E-page 5

24AA00/24LC00/24C00

5.0

DEVICE ADDRESSING

6.0

6.1

WRITE OPERATIONS

Byte Write

After generating a Start condition, the bus master

transmits a control byte consisting of a slave address

and a Read/Write bit that indicates what type of

operation is to be performed. The slave address for the

24XX00 consists of a 4-bit device code ‘1010’ followed

by three “don’t care” bits.

Following the Start signal from the master, the device

code (4 bits), the “don’t care” bits (3 bits), and the R/W

bit (which is a logic low) are placed onto the bus by the

master transmitter. This indicates to the addressed

slave receiver that a byte with a word address will

follow after it has generated an Acknowledge bit during

the ninth clock cycle. Therefore, the next byte transmit-

ted by the master is the word address and will be

written into the Address Pointer of the 24XX00. Only

the lower four address bits are used by the device, and

the upper four bits are “don’t cares.” The 24XX00 will

acknowledge the address byte and the master device

will then transmit the data word to be written into the

addressed memory location. The 24XX00 acknowl-

edges again and the master generates a Stop

condition. This initiates the internal write cycle, and

during this time the 24XX00 will not generate Acknowl-

edge signals (Figure 7-2). After a byte Write command,

the internal address counter will not be incremented

and will point to the same address location that was just

written. If a Stop bit is transmitted to the device at any

point in the Write command sequence before the entire

sequence is complete, then the command will abort

and no data will be written. If more than 8 data bits are

transmitted before the Stop bit is sent, then the device

will clear the previously loaded byte and begin loading

the data buffer again. If more than one data byte is

transmitted to the device and a Stop bit is sent before a

full eight data bits have been transmitted, then the

Write command will abort and no data will be written.

The 24XX00 employs a VCC threshold detector circuit

which disables the internal erase/write logic if the VCC

is below 1.5V (24AA00 and 24LC00) or 3.8V (24C00)

at nominal conditions.

The last bit of the control byte determines the operation

to be performed. When set to a one a read operation is

selected, and when set to a zero a write operation is

selected (Figure 5-1). The 24XX00 monitors the bus for

its corresponding slave address all the time. It

generates an Acknowledge bit if the slave address was

true and it is not in a programming mode.

FIGURE 5-1:

CONTROLBYTEFORMAT

Read/Write Bit

Device Select

Bits

Don’t Care

Bits

S

1

0

1

0

x

x R/W ACK

Slave Address

Acknowledge Bit

Start Bit

DS21178E-page 6

24AA00/24LC00/24C00

FIGURE 7-1:

ACKNOWLEDGE

POLLING FLOW

7.0

ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write

cycle, this can be used to determine when the cycle is

complete (this feature can be used to maximize bus

throughput). Once the Stop condition for a Write

command has been issued from the master, the device

initiates the internally timed write cycle. ACK polling

can be initiated immediately. This involves the master

sending a Start condition followed by the control byte

for a Write command (R/W = 0). If the device is still

busy with the write cycle, then no ACK will be returned.

If no ACK is returned, then the Start bit and control byte

must be re-sent. If the cycle is complete, then the

device will return the ACK and the master can then

proceed with the next Read or Write command. See

Figure 7-1 for flow diagram.

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

Did Device

Acknowledge

(ACK = 0)?

No

Yes

FIGURE 7-2:

BYTE WRITE

S

T

A

R

T

S

T

O

P

BUS ACTIVITY

MASTER

Control

Byte

Word

Address

Data

SDA LINE

P

S

1

0

1

0

x

0

x

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

x = “don’t care” bit

DS21178E-page 7

24AA00/24LC00/24C00

After the word address is sent, the master generates a

Start condition following the acknowledge. This termi-

nates the write operation, but not before the internal

Address Pointer is set. Then the master issues the

control byte again, but with the R/W bit set to a one.

The 24XX00 will then issue an acknowledge and trans-

mits the eight bit data word. The master will not

acknowledge the transfer, but does generate a Stop

condition and the device discontinues transmission

(Figure 8-2). After this command, the internal address

counter will point to the address location following the

one that was just read.

8.0

READ OPERATIONS

Read operations are initiated in the same way as write

operations with the exception that the R/W bit of the

slave address is set to one. There are three basic types

of read operations: current address read, random read

and sequential read.

8.1

Current Address Read

The 24XX00 contains an address counter that main-

tains the address of the last word accessed, internally

incremented by one. Therefore, if the previous read

access was to address n, the next current address read

operation would access data from address n + 1. Upon

receipt of the slave address with the R/W bit set to one,

the device issues an acknowledge and transmits the

eight-bit data word. The master will not acknowledge

the transfer, but does generate a Stop condition and the

device discontinues transmission (Figure 8-1).

8.3

Sequential Read

Sequential reads are initiated in the same way as a

random read except that after the device transmits the

first data byte, the master issues an acknowledge as

opposed to a Stop condition in a random read. This

directs the device to transmit the next sequentially

addressed 8-bit word (Figure 8-3).

8.2

Random Read

To provide sequential reads the 24XX00 contains an

internal Address Pointer which is incremented by one

at the completion of each read operation. This Address

Pointer allows the entire memory contents to be serially

read during one operation.

Random read operations allow the master to access

any memory location in a random manner. To perform

this type of read operation, first the word address must

be set. This is done by sending the word address to the

device as part of a write operation.

FIGURE 8-1:

CURRENT ADDRESS READ

S

T

S

BUS ACTIVITY

A

Control

Byte

T

Data

MASTER

R

O

P

T

SDA LINE

S 1 0 1 0 x x x 1

P

A

C

K

N

O

BUS ACTIVITY

A

C

K

x = “don’t care” bit

DS21178E-page 8

24AA00/24LC00/24C00

FIGURE 8-2:

RANDOM READ

S

T

A

R

T

S

T

A

R

T

S

T

O

P

BUS ACTIVITY

MASTER

Control

Byte

Word

Address(n)

Control

Byte

Data (n)

x x x x

P

S 1 0 1 0 x x x 0

S 1 0 1 0 x x x 1

SDA LINE

A

C

K

A

C

K

A

C

K

N

O

BUS ACTIVITY

A

C

K

x = “don’t care” bit

FIGURE 8-3:

SEQUENTIAL READ

S

T

O

P

BUS ACTIVITY

MASTER

Control

Byte

Data n

Data n + 1

Data n + 2

Data n + x

SDA LINE

P

A

C

K

A

C

K

A

C

K

A

C

K

N

O

BUS ACTIVITY

A

C

K

DS21178E-page 9

24AA00/24LC00/24C00

9.0

9.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

Example:

24LC00

XXXXXXXX

T/XXXNNN

I/P

13F

e

3

YYWW

0527

8-Lead SOIC (150 mil)

Example:

24LC00I

XXXXXXXT

XXXXYYWW

e

3

SN

0527

NNN

13F

Example:

8-Lead TSSOP

XXXX

4L00

I527

13F

TYWW

NNN

Example:

8-Lead 2x3 DFN

204

527

13

XXX

YWW

NN

Example:

M03F

5-Lead SOT-23

XXNN

DS21178E-page 10

24AA00/24LC00/24C00

1st Line Marking Codes

Part Number

SOT-23

I Temp.

DFN

TSSOP

C Temp.

E Temp.

I Temp.

E Temp.

24AA00

4A00

4L00

4C00

A0NN

L0NN

C0NN

B0NN

M0NN

D0NN

—

201

204

207

—

24LC00

24C00

Note:

E0NN

208

NN = Alphanumeric traceability code

Legend: XX...X Part number or part number code

T

Temperature (I, E)

Y

Year code (last digit of calendar year)

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

e

3

Note:

For very small packages with no room for the Pb-free JEDEC designator

, the marking will only appear on the outer carton or reel label.

e

3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Note:

Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

DS21178E-page 11

24AA00/24LC00/24C00

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A2

A

L

c

A1

β

B1

B

p

eB

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.100

.155

.130

2.54

Top to Seating Plane

A

.140

.170

3.56

2.92

3.94

3.30

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

5

.145

3.68

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

5

.313

.250

.373

.130

.012

.058

.018

.370

10

.325

.260

.385

.135

.015

.070

.022

.430

15

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

10

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

15

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

B1

B

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

§

eB

α

β

5

10

15

5

10

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

DS21178E-page 12

24AA00/24LC00/24C00

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

1

B

n

h

α

45°

c

A2

A

φ

β

L

A1

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.050

.061

.056

.007

.237

.154

.193

.015

.025

4

1.27

Overall Height

A

.053

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

4

1.75

Molded Package Thickness

Standoff

A2

A1

E

.052

.004

.228

.146

.189

.010

.019

0

.061

.010

.244

.157

.197

.020

.030

8

1.55

0.25

6.20

3.99

5.00

0.51

0.76

8

§

0.10

5.79

3.71

4.80

0.25

0.48

0

Overall Width

Molded Package Width

Overall Length

E1

D

Chamfer Distance

Foot Length

h

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.008

.013

0

.009

.017

12

.010

.020

15

0.20

0.33

0

0.23

0.42

12

0.25

0.51

15

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

DS21178E-page 13

24AA00/24LC00/24C00

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

E

E1

p

D

2

1

n

B

α

A

c

A1

A2

φ

β

L

Units

INCHES

NOM

MILLIMETERS*

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026

0.65

Overall Height

A

.043

1.10

0.95

0.15

6.50

4.50

3.10

0.70

8

Molded Package Thickness

Standoff

A2

A1

E

.033

.035

.004

.251

.173

.118

.024

4

.037

.006

.256

.177

.122

.028

8

0.85

0.05

0.90

0.10

6.38

4.40

3.00

0.60

4

§

.002

.246

.169

.114

.020

0

Overall Width

6.25

4.30

2.90

0.50

0

Molded Package Width

Molded Package Length

Foot Length

E1

D

L

φ

Foot Angle

c

Lead Thickness

.004

.007

0

.006

.010

5

.008

.012

10

0.09

0.19

0

0.15

0.25

5

0.20

0.30

10

Lead Width

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-086

DS21178E-page 14

24AA00/24LC00/24C00

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

p

D

b

n

L

E

E2

EXPOSED

METAL

PAD

2

1

PIN 1

ID INDEX

AREA

D2

(NOTE 2)

BOTTOM VIEW

TOP VIEW

A

A1

A3

EXPOSED

TIE BAR

(NOTE 1)

Units

Dimension Limits

INCHES

NOM

8

MILLIMETERS*

NOM

MIN

MAX

MIN

MAX

n

p

Number of Pins

Pitch

8

.020 BSC

0.50 BSC

0.90

Overall Height

Standoff

A

A1

A3

D

.031

.035

.001

.008 REF.

.039

.002

0.80

0.00

1.00

.000

0.02

0.05

Contact Thickness

Overall Length

0.20 REF.

2.00 BSC

--

.079 BSC

--

(Note 3)

Exposed Pad Length

Overall Width

D2

E

.055

.064

1.39

1.62

.118 BSC

--

3.00 BSC

--

(Note 3)

Exposed Pad Width

Contact Width

E2

b

.047

.008

.012

.071

.012

.020

1.20

0.20

0.30

1.80

0.30

0.50

.010

0.25

Contact Length

L

.016

0.40

*Controlling Parameter

Notes:

1. Package may have one or more exposed tie bars at ends.

2. Pin 1 visual index feature may vary, but must be located within the hatched area.

3. Exposed pad dimensions vary with paddle size.

4. JEDEC equivalent: MO-229

Drawing No. C04-123

Revised 05/24/04

DS21178E-page 15

24AA00/24LC00/24C00

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)

E

E1

p

B

p1

D

n

1

α

c

A

A2

φ

A1

L

β

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

5

MAX

n

p

Number of Pins

5

Pitch

.038

.075

.046

.043

.003

.110

.064

.116

.018

5

0.95

1.90

p1

Outside lead pitch (basic)

Overall Height

A

A2

A1

E

.035

.000

.102

.059

.110

.014

0

.057

0.90

1.18

1.10

0.08

2.80

1.63

2.95

0.45

5

1.45

Molded Package Thickness

.051

.006

.118

.069

.122

.022

10

1.30

0.15

3.00

1.75

3.10

0.55

10

Standoff

§

0.00

2.60

1.50

2.80

0.35

0

Overall Width

Molded Package Width

Overall Length

E1

D

Foot Length

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.004

.014

0

.006

.017

5

.008

.020

10

0.09

0.35

0

0.15

0.43

5

0.20

0.50

10

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MO-178

Drawing No. C04-091

DS21178E-page 16

24AA00/24LC00/24C00

APPENDIX A: REVISION HISTORY

Revision E

Added DFN package.

DS21178E-page 17

24AA00/24LC00/24C00

NOTES:

DS21178E-page 18

24AA00/24LC00/24C00

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

• Development Systems Information Line

Customers

should

contact

their

distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

Technical support is available through the web site

at: http://support.microchip.com

• Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

In addition, there is

a

Development Systems

Information Line which lists the latest versions of

Microchip’s development systems software products.

This line also provides information on how customers

can receive currently available upgrade kits.

The Development Systems Information Line

numbers are:

CUSTOMER CHANGE NOTIFICATION

SERVICE

1-800-755-2345 – United States and most of Canada

1-480-792-7302 – Other International Locations

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com, click on Customer Change

Notification and follow the registration instructions.

DS21178E-page 19

24AA00/24LC00/24C00

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

24AA00/24LC00/24C00

DS21178E

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21178E-page 20

24AA00/24LC00/24C00

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

X

/XX

PART NO.

Device

Examples:

a) 24AA00-I/P: Industrial Temperature,1.8V

PDIP package

Lead Finish

Temperature Package

Range

b) 24AA00-I/SN: Industrial Temperature,

1.8V, SOIC package

2

Device:

24AA00:

24AA00T:

=

1.8V, 128 bit I C™ Serial EEPROM

2

1.8V, 128 bit I C Serial EEPROM

c)

24AA00T-I/OT: Industrial Temperature,

1.8V, SOT-23 package, tape and reel

(Tape and Reel)

2

24LC00:

24LC00T:

=

2.5V, 128 bit I C Serial EEPROM

d) 24LC00-I/P: Industrial Temperature,

2.5V, PDIP package

2

2.5V, 128 bit I C Serial EEPROM

(Tape and Reel)

5V, 128 bit I C™ Serial EEPROM

(Tape and Reel)

e) 24C00-E/SN: Extended Temperature,

5V, SOIC package

2

24C00:

24C00T:

=

2

f)

24LC00T-I/OT: Industrial Temperature,

2.5V, SOT-23 package, tape and reel

Temperature Blank

=

0°C to 70°C

-40°C to +85°C

-40°C to +125°C

Range:

I

E

Package:

P

= Plastic DIP (300 mil body), 8-lead

SN = Plastic SOIC (150 mil body), 8-lead

ST = Plastic TSSOP (4.4 mm), 8-lead

OT = SOT-23, 5-lead (Tape and Reel only)

MC = 2x3 DFN, 8-lead

Lead Finish Blank= Pb-free – Matte Tin (see Note 1)

= Pb-free – Matte Tin only

G

Note 1: Most products manufactured after January 2005 will have a Matte Tin (Pb-free) finish. Most products manufactured

before January 2005 will have a finish of approximately 63% Sn and 37% Pb (Sn/Pb).

Please visit www.microchip.com for the latest information on Pb-free conversion, including conversion date codes.

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

DS21178E-page21

24AA00/24LC00/24C00

NOTES:

DS21178E-page 22

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. Use of Microchip’s products as critical components in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,

MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,

PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance and WiperLock are trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS21178E-page 23

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

India - Bangalore

Tel: 91-80-2229-0061

Fax: 91-80-2229-0062

Austria - Weis

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Denmark - Ballerup

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-5160-8631

Fax: 91-11-5160-8632

China - Chengdu

Tel: 86-28-8676-6200

Fax: 86-28-8676-6599

France - Massy

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Japan - Kanagawa

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Atlanta

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Germany - Ismaning

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Korea - Seoul

Alpharetta, GA

Tel: 770-640-0034

Fax: 770-640-0307

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Boston

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

England - Berkshire

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Dallas

Addison, TX

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Tel: 972-818-7423

Fax: 972-818-2924

Taiwan - Hsinchu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

China - Shunde

Detroit

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Qingdao

Tel: 86-532-502-7355

Fax: 86-532-502-7205

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

San Jose

Mountain View, CA

Tel: 650-215-1444

Fax: 650-961-0286

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

03/01/05

DS21178E-page 24


型号：	24AA00T/OTG
厂家：	MICROCHIP
描述：	IC,SERIAL EEPROM,16X8,CMOS,TSOP,5PIN,PLASTIC 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件：	总24页 (文件大小：316K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

24AA00T/OTG [MICROCHIP]

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