24AA16TE/MNY [MICROCHIP]
IC,SERIAL EEPROM,2KX8,CMOS,LLCC,8PIN,PLASTIC;
| 型号： | 24AA16TE/MNY |
| 厂家： | 
MICROCHIP |
| 描述： | IC,SERIAL EEPROM,2KX8,CMOS,LLCC,8PIN,PLASTIC 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
| 文件： | 总40页 (文件大小：1172K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
24AA16/24LC16B
16K I2C™ Serial EEPROM
Description:
Device Selection Table
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
The Microchip Technology Inc. 24AA16/24LC16B
(24XX16*) is a 16 Kbit Electrically Erasable PROM.
The device is organized as eight blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V with standby
and active currents of only 1 A and 1 mA,
respectively. The 24XX16 also has a page write
capability for up to 16 bytes of data. The 24XX16 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN, 2x3 TDFN and MSOP pack-
ages, and is also available in the 5-lead SOT-23, and
Chip Scale packages.
24AA16
1.7-5.5
2.5-5.5
400 kHz(1)
400 kHz
I, E
I, E
24LC16B
Note 1: 100 kHz for VCC <2.5V.
Features:
• Single Supply with Operation down to 1.7V
for 24AA16 Devices, 2.5V for 24LC16B Devices
• Low-Power CMOS Technology:
- Active current 1 mA, typical
Block Diagram
- Standby current, 1 A, typical
HV
Generator
• 2-Wire Serial Interface, I2C™ Compatible
• Schmitt Trigger inputs for Noise Suppression
• Output Slope Control to eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 5 ms Max.
WP
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
XDEC
• Self-Timed Erase/Write Cycle
Page
Latches
• 16-Byte Page Write Buffer
I/O
• Hardware Write-Protect
SCL
YDEC
• ESD Protection > 4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention > 200 Years
SDA
VCC
VSS
• Factory Programming Available
Sense Amp.
R/W Control
• Packages include 8-lead PDIP, SOIC, TSSOP,
MSOP, DFN, TDFN, 5-lead SOT-23 and Chip Scale
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
CS (Chip Scale)(1)
PDIP/MSOP/SOIC/TSSOP
SOT-23
DFN/TDFN
A0
1
8
VCC
SCL
VSS
WP
5
4
1
2
3
A0
A1
1
VCC
WP
8
VCC
VSS
1
4
2
5
7
6
5
2
3
4
A1
A2
2
3
7
6
WP
WP
SCL
3
SCL
SDA
A2
VSS
SDA
SCL
VCC
SDA
(Top Down View,
Balls Not Visible)
VSS
4
5
SDA
Note 1: Pins A0, A1 and A2 are not used by the 24XX16 (no internal connections).
2: Available in I-temp, “AA” only.
*24XX16 is used in this document as a generic part number for the 24AA16/24LC16B devices.
2002-2012 Microchip Technology Inc.
DS21703L-page 1
24AA16/24LC16B
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
DC CHARACTERISTICS
Automotive (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V
Param.
Symbol
No.
Characteristic
Min.
Typ.
Max.
Units
Conditions
WP, SCL and SDA pins
High-level input voltage
Low-level input voltage
—
—
—
—
—
—
—
—
V
—
D1
D2
D3
VIH
0.7 VCC
—
—
VIL
0.3 VCC
—
V
—
VHYS
Hysteresis of Schmitt
Trigger inputs
0.05 VCC
V
(Note 1)
D4
D5
D6
D7
VOL
ILI
Low-level output voltage
Input leakage current
Output leakage current
—
—
—
—
—
—
—
—
0.40
±1
V
IOL = 3.0 mA, VCC = 2.5V
VIN = VSS or VCC
A
A
pF
ILO
±1
VOUT = VSS or VCC
CIN,
Pin capacitance
10
VCC = 5.0V (Note 1)
COUT
(all inputs/outputs)
TA = 25°C, FCLK = 1 MHz
D8
ICC write Operating current
—
—
—
3
1
mA
mA
VCC = 5.5V, SCL = 400 kHz
—
D9
ICC read
0.01
D10
ICCS
Standby current
—
—
0.3
0.01
1
5
A
A
Industrial
Automotive
SDA = SCL = VCC
WP = VSS
Note 1: This parameter is periodically sampled and not 100% tested.
2: Typical measurements taken at room temperature.
DS21703L-page 2
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
Automotive (E):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
TA = -40°C to +125°C, VCC = +1.7V to +5.5V
AC CHARACTERISTICS
Param.
Symbol
No.
Characteristic
Clock frequency
Min.
Max.
Units
Conditions
1
2
3
4
FCLK
THIGH
TLOW
TR
—
—
400
100
kHz
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
Clock high time
Clock low time
600
4000
—
—
ns
ns
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
1300
4700
—
—
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
SDA and SCL rise time
(Note 1)
—
—
300
1000
2.5V VCC 5.5V (Note 1)
1.7V VCC 2.5V (24AA16)
(Note 1)
5
6
TF
SDA and SCL fall time
—
300
ns
ns
(Note 1)
THD:STA Start condition hold time
600
4000
—
—
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
7
TSU:STA Start condition setup time
600
4700
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
8
9
THD:DAT Data input hold time
TSU:DAT Data input setup time
0
—
ns
ns
(Note 2)
100
250
—
—
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
10
11
12
TSU:STO Stop condition setup time
600
4000
—
—
ns
ns
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
TAA
Output valid from clock
—
—
900
3500
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
(Note 2)
TBUF
Bus free time: Time the bus
must be free before a new
transmission can start
1300
4700
—
—
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
13
14
15
16
TOF
TSP
TWC
—
Output fall time from VIH
minimum to VIL maximum
20+0.1CB
—
250
250
ns
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA16)
Input filter spike suppression
(SDA and SCL pins)
—
50
(Notes 1 and 3)
Write cycle time
(byte or page)
—
5
ms
—
Endurance
1M
—
cycles 25°C, (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
2002-2012 Microchip Technology Inc.
DS21703L-page 3
24AA16/24LC16B
FIGURE 1-1:
BUS TIMING DATA
5
4
2
3
SCL
7
8
9
10
6
SDA
IN
14
12
11
SDA
OUT
FIGURE 1-2:
BUS TIMING START/STOP
D3
SCL
SDA
6
7
10
Start
Stop
DS21703L-page 4
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
SOIC TSSOP DFN
Name
PDIP
TDFN MSOP SOT-23
CS
Description
Not Connected
A0
A1
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
—
—
—
2
—
—
—
2
Not Connected
A2
Not Connected
VSS
SDA
SCL
WP
VCC
Ground
3
5
Serial Address/Data I/O
Serial Clock
1
4
5
3
Write-Protect Input
+1.7V to 5.5V Power Supply
4
1
2.1
Serial Address/Data Input/Output
(SDA)
2.3
Write-Protect (WP)
The WP pin must be connected to either VSS or VCC.
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an open-
drain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 k for 100 kHz, 2 k for 400 kHz).
If tied to VSS, normal memory operation is enabled
(read/write the entire memory 000-7FF).
If tied to VCC, write operations are inhibited. The entire
memory will be write-protected. Read operations are
not affected.
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
2.4
A0, A1, A2
The A0, A1 and A2 pins are not used by the 24XX16.
They may be left floating or tied to either VSS or VCC.
2.2
Serial Clock (SCL)
The SCL input is used to synchronize the data transfer
to and from the device.
2002-2012 Microchip Technology Inc.
DS21703L-page 5
24AA16/24LC16B
4.4
Data Valid (D)
3.0
FUNCTIONAL DESCRIPTION
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The 24XX16 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX16 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically,
unlimited (although only the last sixteen will be stored
when doing a write operation). When an overwrite does
occur it will replace data in a first-in first-out (FIFO)
fashion.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
4.5
Acknowledge
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Each receiving device, when addressed, is obliged to
generate an Acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
Note:
The 24XX16 does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
4.1
Bus Not Busy (A)
The device that acknowledges, has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable-low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX16) will leave the data line
high to enable the master to generate the Stop
condition.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
(D)
(C) (A)
SCL
SDA
Start
Condition
Stop
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
DS21703L-page 6
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
5.0
DEVICE ADDRESSING
Control
Code
Operation
Block Select
R/W
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code.
For the 24XX16, this is set as ‘1010’ binary for read
and write operations. The next three bits of the control
byte are the block-select bits (B2, B1, B0). They are
used by the master device to select which of the eight
256 word-blocks of memory are to be accessed.
These bits are in effect the three Most Significant bits
(MSb) of the word address. It should be noted that the
protocol limits the size of the memory to eight blocks
of 256 words, therefore, the protocol can support only
one 24XX16 per system.
Read
Write
Block Address
Block Address
1010
1010
1
0
FIGURE 5-1:
CONTROL BYTE
ALLOCATION
Read/Write Bit
Block
Select
Bits
Control Code
The last bit of the control byte defines the operation to
be performed. When set to ‘1’, a read operation is
selected. When set to ‘0’, a write operation is selected.
Following the Start condition, the 24XX16 monitors the
SDA bus, checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code, the
slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX16 will select a read or write operation.
S
1
0
1
0
B2 B1 B0 R/W ACK
Slave Address
Acknowledge Bit
Start Bit
FIGURE 5-2:
ADDRESS SEQUENCE BIT ASSIGNMENTS
Control Byte
Address Low Byte
B
2
B
1
B
0
A
7
A
0
•
•
•
•
•
•
1
0
1
0
R/W
Control
Code
Block
Select
bits
2002-2012 Microchip Technology Inc.
DS21703L-page 7
24AA16/24LC16B
6.2
Page Write
6.0
6.1
WRITE OPERATION
Byte Write
The write control byte, word address and the first data
byte are transmitted to the 24XX16 in the same way as
in a byte write. However, instead of generating a Stop
condition, the master transmits up to 16 data bytes to
the 24XX16, which are temporarily stored in the on-
chip page buffer and will be written into memory once
the master has transmitted a Stop condition. Upon
receipt of each word, the four lower-order Address
Pointer bits are internally incremented by ‘1’. The
higher-order 7 bits of the word address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received an
internal write cycle will begin (Figure 6-2).
Following the Start condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic-low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmit-
ted by the master is the word address and will be
written into the Address Pointer of the 24XX16. After
receiving another Acknowledge signal from the
24XX16, the master device will transmit the data word
to be written into the addressed memory location. The
24XX16 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX16 will not
generate Acknowledge signals (Figure 6-1).
Note:
Page write operations are limited to writ-
ing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page-size’) and end at addresses that
are integer multiples of [page size – 1]. If
a page write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
6.3
Write Protection
The WP pin allows the user to write-protect the entire
array (000-7FF) when the pin is tied to VCC. If tied to
VSS the write protection is disabled.
FIGURE 6-1: BYTE WRITE
S
S
T
A
R
T
Bus Activity
Master
Control
Byte
Word
Address
T
O
P
Data
0
SDA Line
1
0
1
0 B2 B1 B0
S
P
A
C
K
A
C
K
A
C
K
Block
Select
Bits
Bus Activity
DS21703L-page 8
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
FIGURE 6-2: PAGE WRITE
S
T
A
R
T
S
T
Bus Activity
Master
Control
Byte
Word
Address (n)
O
Data (n)
Data (n + 1)
Data (n + 15)
P
SDA Line
1 0 1 0B2 B00
B1
S
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Bus Activity
Block
Select
Bits
2002-2012 Microchip Technology Inc.
DS21703L-page 9
24AA16/24LC16B
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next read or write
command. See Figure 7-1 for a flow diagram of this
operation.
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21703L-page 10
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
8.3
Sequential Read
8.0
READ OPERATION
Sequential reads are initiated in the same way as a
random read, except that once the 24XX16 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX16 to transmit the next sequentially-
addressed 8-bit word (Figure 8-3).
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
To provide sequential reads, the 24XX16 contains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
The 24XX16 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous access
(either a read or write operation) was to address n, the
next current address read operation would access data
from address n + 1. Upon receipt of the slave address
with R/W bit set to ‘1’, the 24XX16 issues an acknowl-
edge and transmits the 8-bit data word. The master will
not acknowledge the transfer, but does generate a Stop
condition and the 24XX16 discontinues transmission
(Figure 8-1).
8.4
Noise Protection
The 24XX16 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24XX16 as part of a write operation.
Once the word address is sent, the master generates a
Start condition following the acknowledge. This
terminates the write operation, but not before the inter-
nal Address Pointer is set. The master then issues the
control byte again, but with the R/W bit set to a ‘1’. The
24XX16 will then issue an acknowledge and transmit
the 8-bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
24XX16 will discontinue transmission (Figure 8-2).
FIGURE 8-1:
CURRENT ADDRESS READ
S
Bus Activity
Master
T
A
R
Control
Byte
S
T
Data (n)
O
P
T
SDA Line
0
1
0
1
1
S
B2 B1
P
B0
A
C
K
N
o
Bus Activity
Block
Select
Bits
A
C
K
2002-2012 Microchip Technology Inc.
DS21703L-page 11
24AA16/24LC16B
FIGURE 8-2:
RANDOM READ
S
S
T
A
R
T
T
A
R
T
S
T
O
P
Bus Activity
Master
Control
Byte
Word
Address (n)
Control
Byte
Data (n)
1 0 1 0B2B1B00
1
1 0
B2B1B0
S
0
P
S
1
SDA Line
A
C
K
A
C
K
A
C
K
N
o
Block
Select
Bits
Block
Select
Bits
Bus Activity
A
C
K
FIGURE 8-3:
SEQUENTIAL READ
S
T
O
P
Bus Activity
Master
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
Data (n + x)
1
SDA Line
P
A
C
K
A
C
K
A
C
K
A
C
K
N
o
Bus Activity
A
C
K
DS21703L-page 12
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
24LC16B
XXXXXXXX
T/XXXNNN
I/P
13F
e
3
YYWW
0527
Example:
24LC16BI
8-Lead SOIC (3.90 mm)
XXXXXXXT
XXXXYYWW
SN
e
3
0527
NNN
13F
Example:
8-Lead TSSOP
XXXX
TYWW
NNN
4L16
I527
13F
Example:
8-Lead MSOP
XXXXXT
4L16I
YWWNNN
52713F
Example:
8-Lead 2x3 DFN
254
527
13
XXX
YWW
NN
Example:
8-Lead 2x3 TDFN
A54
527
13
XXX
YWW
NN
Example:
B53F
5-Lead SOT-23
XXNN
2002-2012 Microchip Technology Inc.
DS21703L-page 13
24AA16/24LC16B
5-Lead Chip Scale
XW
Example:
57
1st Line Marking Codes
SOT-23 DFN
Part Number
TDFN
TSSOP
MSOP
I Temp.
E Temp.
I Temp.
E Temp.
I Temp.
E Temp.
24AA16
24LC16B
Note:
4A16
4L16
4A16T
4L16T
B5NN
M5NN
7VNN
N5NN
251
254
—
A51
A54
EE9
A55
255
T = Temperature grade (I, E)
NN = Alphanumeric traceability code
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
YY
WW
NNN
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Note:
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21703L-page 14
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢐꢁꢂꢋꢐꢃꢆꢑꢇꢒꢆꢓꢆꢔꢕꢕꢆꢖꢋꢈꢆꢗꢘꢅꢙꢆꢚꢇꢍꢏꢇꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
ꢯꢄꢃꢏꢇ
ꢰꢱꢝꢲꢠꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢶ
ꢁꢀꢣꢣꢅꢩꢛꢝ
ꢷ
ꢁꢀꢞꢣ
ꢷ
ꢁꢞꢀꢣ
ꢁꢙꢨꢣ
ꢁꢞꢺꢨ
ꢁꢀꢞꢣ
ꢁꢣꢀꢣ
ꢁꢣꢺꢣ
ꢁꢣꢀꢶ
ꢷ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢫꢕꢡꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢩꢉꢇꢌꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢛꢘꢕꢈꢊꢋꢌꢐꢅꢏꢕꢅꢛꢘꢕꢈꢊꢋꢌꢐꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢱ
ꢌ
ꢦ
ꢦꢙ
ꢦꢀ
ꢠ
ꢠꢀ
ꢟ
ꢳ
ꢖ
ꢔꢀ
ꢔ
ꢌꢩ
ꢷ
ꢁꢙꢀꢣ
ꢁꢀꢸꢨ
ꢷ
ꢁꢀꢀꢨ
ꢁꢣꢀꢨ
ꢁꢙꢸꢣ
ꢁꢙꢥꢣ
ꢁꢞꢥꢶ
ꢁꢀꢀꢨ
ꢁꢣꢣꢶ
ꢁꢣꢥꢣ
ꢁꢣꢀꢥ
ꢷ
ꢁꢞꢙꢨ
ꢁꢙꢶꢣ
ꢁꢥꢣꢣ
ꢁꢀꢨꢣ
ꢁꢣꢀꢨ
ꢁꢣꢻꢣ
ꢁꢣꢙꢙ
ꢁꢥꢞꢣ
ꢫꢃꢡꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢯꢡꢡꢌꢐꢅꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢳꢕꢗꢌꢐꢅꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢼꢕꢗꢅꢛꢡꢉꢖꢃꢄꢜꢅꢅꢚ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢚꢅꢛꢃꢜꢄꢃꢎꢃꢖꢉꢄꢏꢅꢝꢘꢉꢐꢉꢖꢏꢌꢐꢃꢇꢏꢃꢖꢁ
ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢁꢣꢀꢣꢤꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢥꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪꢅꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢀꢶꢩ
2002-2012 Microchip Technology Inc.
DS21703L-page 15
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21703L-page 16
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21703L-page 17
24AA16/24LC16B
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢑꢞꢜꢒꢆꢓꢆꢜꢄꢠꢠꢘꢡꢢꢆꢔꢣꢤꢕꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢞꢟꢏꢥꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
DS21703L-page 18
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢦꢧꢋꢐꢆꢞꢧꢠꢋꢐꢨꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢑꢞꢦꢒꢆꢓꢆꢩꢣꢩꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢦꢞꢞꢟꢇꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
ꢯꢄꢃꢏꢇ
ꢢꢰꢳꢳꢰꢢꢠꢫꢠꢼꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢱ
ꢌ
ꢶ
ꢣꢁꢺꢨꢅꢩꢛꢝ
ꢴꢆꢌꢐꢉꢊꢊꢅꢲꢌꢃꢜꢘꢏ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢛꢏꢉꢄꢋꢕꢎꢎꢅ
ꢦ
ꢷ
ꢣꢁꢶꢣ
ꢣꢁꢣꢨ
ꢷ
ꢀꢁꢣꢣ
ꢷ
ꢀꢁꢙꢣ
ꢀꢁꢣꢨ
ꢣꢁꢀꢨ
ꢦꢙ
ꢦꢀ
ꢠ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢺꢁꢥꢣꢅꢩꢛꢝ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢳꢌꢄꢜꢏꢘ
ꢬꢕꢕꢏꢅꢳꢌꢄꢜꢏꢘ
ꢠꢀ
ꢟ
ꢳ
ꢥꢁꢞꢣ
ꢙꢁꢸꢣ
ꢣꢁꢥꢨ
ꢥꢁꢥꢣ
ꢞꢁꢣꢣ
ꢣꢁꢺꢣ
ꢥꢁꢨꢣ
ꢞꢁꢀꢣ
ꢣꢁꢻꢨ
ꢬꢕꢕꢏꢡꢐꢃꢄꢏ
ꢬꢕꢕꢏꢅꢦꢄꢜꢊꢌ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢳꢀ
ꢀ
ꢀꢁꢣꢣꢅꢼꢠꢬ
ꢣꢾ
ꢣꢁꢣꢸ
ꢣꢁꢀꢸ
ꢷ
ꢷ
ꢷ
ꢶꢾ
ꢖ
ꢔ
ꢣꢁꢙꢣ
ꢣꢁꢞꢣ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢣꢁꢀꢨꢅꢑꢑꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢼꢠꢬꢪ ꢼꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢡꢈꢐꢡꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢶꢺꢩ
2002-2012 Microchip Technology Inc.
DS21703L-page 19
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21703L-page 20
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢪꢈꢄꢊꢢꢆꢜꢘꢆꢂꢃꢄꢅꢆꢇꢄꢌꢨꢄꢫꢃꢆꢑꢬꢥꢒꢆꢓꢆꢭꢮꢔꢮꢕꢣꢤꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢍꢪꢜꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
NOTE 2
A3
A1
ꢯꢄꢃꢏꢇ
ꢢꢰꢳꢳꢰꢢꢠꢫꢠꢼꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢶ
ꢣꢁꢨꢣꢅꢩꢛꢝ
ꢣꢁꢸꢣ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢲꢌꢃꢜꢘꢏ
ꢛꢏꢉꢄꢋꢕꢎꢎꢅ
ꢝꢕꢄꢏꢉꢖꢏꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢱ
ꢌ
ꢦ
ꢦꢀ
ꢦꢞ
ꢟ
ꢣꢁꢶꢣ
ꢣꢁꢣꢣ
ꢀꢁꢣꢣ
ꢣꢁꢣꢨ
ꢣꢁꢣꢙ
ꢣꢁꢙꢣꢅꢼꢠꢬ
ꢙꢁꢣꢣꢅꢩꢛꢝ
ꢞꢁꢣꢣꢅꢩꢛꢝ
ꢷ
ꢷ
ꢣꢁꢙꢨ
ꢠ
ꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋꢅꢳꢌꢄꢜꢏꢘ
ꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋꢅꢹꢃꢋꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢅꢹꢃꢋꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢅꢳꢌꢄꢜꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢽꢏꢕꢽꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋ
ꢟꢙ
ꢠꢙ
ꢔ
ꢳ
U
ꢀꢁꢞꢣ
ꢀꢁꢨꢣ
ꢣꢁꢙꢣ
ꢣꢁꢞꢣ
ꢣꢁꢙꢣ
ꢀꢁꢨꢨ
ꢀꢁꢻꢨ
ꢣꢁꢞꢣ
ꢣꢁꢨꢣ
ꢷ
ꢣꢁꢥꢣ
ꢷ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢂꢉꢖꢭꢉꢜꢌꢅꢑꢉꢒꢅꢘꢉꢆꢌꢅꢕꢄꢌꢅꢕꢐꢅꢑꢕꢐꢌꢅꢌꢍꢡꢕꢇꢌꢋꢅꢏꢃꢌꢅꢔꢉꢐꢇꢅꢉꢏꢅꢌꢄꢋꢇꢁ
ꢞꢁ ꢂꢉꢖꢭꢉꢜꢌꢅꢃꢇꢅꢇꢉꢗꢅꢇꢃꢄꢜꢈꢊꢉꢏꢌꢋꢁ
ꢥꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢼꢠꢬꢪ ꢼꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢡꢈꢐꢡꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢀꢙꢞꢝ
2002-2012 Microchip Technology Inc.
DS21703L-page 21
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21703L-page 22
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21703L-page 23
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21703L-page 24
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢪꢈꢄꢊꢢꢆꢜꢘꢆꢂꢃꢄꢅꢆꢇꢄꢌꢨꢄꢫꢃꢆꢑꢬꢜꢒꢆꢓꢆꢭꢮꢔꢮꢕꢣꢯꢰꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢦꢍꢪꢜꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
2002-2012 Microchip Technology Inc.
DS21703L-page 25
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21703L-page 26
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21703L-page 27
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21703L-page 28
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
ꢰꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢦꢠꢄꢐꢉꢋꢉꢊꢘꢠꢆꢑꢟꢦꢒꢆꢚꢞꢟꢦꢁꢭꢔꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
b
N
E
E1
3
2
1
e
e1
D
A2
c
A
φ
A1
L
L1
ꢯꢄꢃꢏꢇ
ꢢꢰꢳꢳꢰꢢꢠꢫꢠꢼꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢳꢌꢉꢋꢅꢂꢃꢏꢖꢘ
ꢱ
ꢌ
ꢨ
ꢣꢁꢸꢨꢅꢩꢛꢝ
ꢴꢈꢏꢇꢃꢋꢌꢅꢳꢌꢉꢋꢅꢂꢃꢏꢖꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢲꢌꢃꢜꢘꢏ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢛꢏꢉꢄꢋꢕꢎꢎ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢬꢕꢕꢏꢅꢳꢌꢄꢜꢏꢘ
ꢬꢕꢕꢏꢡꢐꢃꢄꢏ
ꢬꢕꢕꢏꢅꢦꢄꢜꢊꢌ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢌꢀ
ꢦ
ꢦꢙ
ꢦꢀ
ꢠ
ꢠꢀ
ꢟ
ꢳ
ꢀꢁꢸꢣꢅꢩꢛꢝ
ꢣꢁꢸꢣ
ꢣꢁꢶꢸ
ꢣꢁꢣꢣ
ꢙꢁꢙꢣ
ꢀꢁꢞꢣ
ꢙꢁꢻꢣ
ꢣꢁꢀꢣ
ꢣꢁꢞꢨ
ꢣꢾ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢀꢁꢥꢨ
ꢀꢁꢞꢣ
ꢣꢁꢀꢨ
ꢞꢁꢙꢣ
ꢀꢁꢶꢣ
ꢞꢁꢀꢣ
ꢣꢁꢺꢣ
ꢣꢁꢶꢣ
ꢞꢣꢾ
ꢳꢀ
ꢀ
ꢖ
ꢔ
ꢣꢁꢣꢶ
ꢣꢁꢙꢣ
ꢣꢁꢙꢺ
ꢣꢁꢨꢀ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢣꢁꢀꢙꢻꢅꢑꢑꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢙꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢸꢀꢩ
2002-2012 Microchip Technology Inc.
DS21703L-page 29
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21703L-page 30
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21703L-page 31
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Please contact your local Microchip representative for specific details.
DS21703L-page 32
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21703L-page 33
24AA16/24LC16B
APPENDIX A: REVISION HISTORY
Revision D (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Revision E (3/2005)
Added DFN package.
Revision F (9/2005)
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 7-
2 Random Read; Figure 7-3 Sequential Read; Section
8.3 Write-Protect (WP).
Revision G (02/2007)
Changed 1.8V to 1.7V; Revised Features Section;
Replaced Package Drawings; Revised Product ID
Section.
Revision H (01/2009)
Added TDFN Package; Updated Package Drawings.
Revision J (10/2009)
Added 5-Lead Chip Scale Package.
Revision K (01/2012)
Added Chip Scale Package; Revised Product ID
System.
Revision L (12/2012)
Revised Automotive E-temp.; Product ID System.
DS21703L-page 34
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://microchip.com/support
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2002-2012 Microchip Technology Inc.
DS21703L-page 35
24AA16/24LC16B
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
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RE:
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Device: 24AA16/24LC16B
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DS21703L-page 36
2002-2012 Microchip Technology Inc.
24AA16/24LC16B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Examples:
a) 24AA16-I/P: Industrial Temperature,1.7V,
PDIP package
Temperature Package
Range
b) 24AA16-I/SN: Industrial Temperature,1.7V,
SOIC package
2
24AA16:
24AA16T:
=
=
1.7V, 16 Kbit I C Serial EEPROM
1.7V, 16 Kbit I C Serial EEPROM
(Tape and Reel)
2.5V, 16 Kbit I C Serial EEPROM
2
c) 24AA16T-I/OT: Industrial Temperature,
1.7V, SOT-23 package, Tape and Reel
2
24LC16B:
=
d) 24AA16T-I/CS16K: Industrial Temperature,
1.7V, Chip Scale package, Tape and Reel
2
24LC16BT: = 2.5V, 16 Kbit I C Serial EEPROM
(Tape and Reel)
e) 24LC16B-I/P: Industrial Temperature, 2.5V,
PDIP package
f)
24LC16B-E/SN: Automotive Temp.,2.5V
SOIC package
Temperature
Range:
I
E
= -40°C to +85°C
= -40°C to +125°C
g) 24LC16BT-I/OT: Industrial Temperature,
2.5V, SOT-23 package, Tape and Reel
Package:
h) 24AA16T-E/SN: Automotive Temperature,
1.7V, SOIC package, Tape and Reel
P
=
=
=
=
Plastic DIP (300 mil body), 8-lead
SN
ST
MS
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Micro Small Outline (MSOP),
8-lead
OT
=
Plastic SOT-23, 5-lead (Tape and Reel
only)
MC
MNY
=
=
Plastic DFN (2x3x0.90 mm body), 8-lead
Plastic TDFN, (2x3x0.75 mm body),
8-lead
Chip Scale (CS), 5-lead (I-temp, “AA”
Tape and Reel only)
(1)
(2)
CS16K
=
Note 1: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
2: “16K” indicates 160K technology.
2002-2012 Microchip Technology Inc.
DS21703L-page 37
24AA16/24LC16B
NOTES:
DS21703L-page 38
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767634
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
DS21703L-page 39
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/12
DS21703L-page 40
2002-2012 Microchip Technology Inc.
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