24C00T-E/OTVAO [MICROCHIP]

16 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN;


型号：	24C00T-E/OTVAO
厂家：	MICROCHIP
描述：	16 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, ROHS COMPLIANT, PLASTIC, SOT-23, 5 PIN 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件：	总18页 (文件大小：254K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

24AA00/24LC00/24C00

128 Bit I²C^™Bus Serial EEPROM

Device Selection Table

Package Types

8-PIN PDIP/SOIC

Device

VCC Range

Temp Range

Vss

VCC

24AA00

24LC00

24C00

1.8 - 5.5

2.5 - 5.5

4.5 - 5.5

C,I

C,I,E

SCL

SDA

Features

8-PIN TSSOP

• Low-power CMOS technology

- 500 µA typical active current

- 250 nA typical standby current

• Organized as 16 bytes x 8 bits

• 2-wire serial interface bus, I²C™ compatible

• 100 kHz (1.8V) and 400 kHz (5V) compatibility

• Self-timed write cycle (including auto-erase)

• 4 ms maximum byte write cycle time

• 1,000,000 erase/write cycles

VCC

SCL

SDA

VSS

5-PIN SOT-23

VCC

SCL

VSS

SDA

• ESD protection > 4 kV

• Data retention > 200 years

• 8L DIP, SOIC, TSSOP and 5L SOT-23 packages

• Standard or Pb-free finish available

• Temperature ranges available:

Block Diagram

HV Generator

- Commercial (C):

- Industrial (I):

- Automotive (E):

0°C to +70°C

-40°C to +85°C

-40°C to +125°C

I/O

Control

Logic

Memory

Control

Logic

EEPROM

Array

XDEC

Description

SCL

SDA

YDEC

The Microchip Technology Inc. 24AA00/24LC00/

24C00 (24XX00*) is a 128-bit Electrically Erasable

PROM memory organized as 16 x 8 with a 2-wire serial

interface. Low voltage design permits operation down

to 1.8 volts for the 24XX00 version, and every version

maintains a maximum standby current of only 1 µA and

typical active current of only 500 µA. This device was

designed for where a small amount of EEPROM is

needed for the storage of calibration values, ID

numbers or manufacturing information, etc. The

24XX00 is available in 8-pin PDIP, 8-pin SOIC (150

mil), 8-pin TSSOP and the 5-pin SOT-23 packages.

VCC

VSS

Sense AMP

R/W Control

Pin Function Table

Name

Function

VSS

SDA

SCL

VCC

Ground

Serial Data

Serial Clock

+1.8V to 5.5V (24AA00)

+2.5V to 5.5V (24LC00)

+4.5V to 5.5V (24C00)

No Internal Connection

I C is a trademark of Philips Corporation.

*24XX00 is used in this document as a generic part number for

the 24AA00/24LC00/24C00 devices.

 2003 Microchip Technology Inc.

DS21178D-page 1

24AA00/24LC00/24C00

1.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-65°C to +125°C

ESD protection on all pins..........................................................................................................................................4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to

the device. This is a stress rating only and functional operation of the device at those or any other conditions

above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

TABLE 1-1:

DC CHARACTERISTICS

All Parameters apply across the

recommended operating ranges unless Industrial (I):

Commercial (C): TA = 0°C to +70°C,

TA = -40°C to +85°C,

VCC = 1.8V to 5.5V

otherwise noted

Parameter

Automotive (E)

TA = -40°C to +125°C, VCC = 4.5V to 5.5V

Symbol

Min.

Max.

Units

Conditions

SCL and SDA pins:

VIH

0.7 VCC

.05 VCC

(Note)

High-level input voltage

Low-level input voltage

VIL

0.3 VCC

—

Hysteresis of Schmitt Trigger

inputs

VHYS

VCC ≥ 2.5V (Note)

Low-level output voltage

VOL

0.4

IOL = 3.0 mA, VCC = 4.5V

IOL = 2.1 mA, VCC = 2.5V

Input leakage current

ILI

—

±1

µA

VIN = VCC or VSS

Output leakage current

ILO

VOUT = VCC or VSS

Pin capacitance (all inputs/outputs)

CIN,

VCC = 5.0V (Note)

COUT

TA = 25°C, f = 1 MHz

Operating current

ICC Write

ICC Read

ICCS

—

µA

VCC = 5.5V, SCL = 400 kHz

VCC = 5.5V, SDA = SCL = VCC

Standby current

Note:

This parameter is periodically sampled and not 100% tested.

FIGURE 1-1:

BUS TIMING DATA

THIGH

TSU:STA

SCL

TSU:STO

THD:DAT

TSU:DAT

TLOW

THD:STA

SDA

TSP

TBUF

TAA

SDA

OUT

DS21178D-page 2

 2003 Microchip Technology Inc.

24AA00/24LC00/24C00

TABLE 1-2:

AC CHARACTERISTICS

All Parameters apply across all

recommended operating ranges Industrial (I):

unless otherwise noted

Commercial (C):

TA = 0°C to +70°C, VCC = 1.8V to 5.5V

TA = -40°C to +85°C, VCC = 1.8V to 5.5V

TA = -40°C to +125°C, VCC = 4.5V to 5.5V

Automotive (E):

Parameter

Symbol

Min

Max

Units

Conditions

Clock frequency

FCLK

—

100

400

kHz

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Clock high time

Clock low time

THIGH

TLOW

4000

600

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

4700

1300

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

SDA and SCL rise time

(Note 1)

—

1000

300

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

SDA and SCL fall time

Start condition hold time

—

300

(Note 1)

THD:STA

4000

600

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Start condition setup time

TSU:STA

4700

600

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Data input hold time

Data input setup time

THD:DAT

TSU:DAT

—

(Note 2)

250

100

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Stop condition setup time

TSU:STO

TAA

4000

600

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Output valid from clock

(Note 2)

—

3500

900

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Bus free time: Time the bus must TBUF

be free before a new transmis-

sion can start

4700

1300

—

4.5V ≤ Vcc ≤ 5.5V (E Temp range)

1.8V ≤ Vcc ≤ 4.5V

4.5V ≤ Vcc ≤ 5.5V

Output fall time from VIH

minimum to VIL maximum

TOF

TSP

TWC

20+0.1

250

(Note 1), CB ≤ 100 pF

Input filter spike suppression

(SDA and SCL pins)

—

(Notes 1, 3)

Write cycle time

Endurance

—

cycles (Note 4)

Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a TI specification for standard operation.

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be obtained on www.microchip.com.

 2003 Microchip Technology Inc.

DS21178D-page 3

24AA00/24LC00/24C00

2.0

2.1

PIN DESCRIPTIONS

SDA Serial Data

4.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus

is not busy.

This is a bidirectional pin used to transfer addresses

and data into and data out of the device. It is an open

drain terminal, therefore the SDA bus requires a pull-up

resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for

400 kHz).

• During data transfer, the data line must remain

stable whenever the clock line is high. Changes in

the data line while the clock line is high will be

interpreted as a Start or Stop condition.

For normal data transfer SDA is allowed to change only

during SCL low. Changes during SCL high are

reserved for indicating the Start and Stop conditions.

Accordingly, the following bus conditions have been

defined (Figure 4-1).

4.1

Bus Not Busy (A)

2.2

SCL Serial Clock

Both data and clock lines remain high.

This input is used to synchronize the data transfer from

and to the device.

4.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock

(SCL) is high determines a Start condition. All

commands must be preceded by a Start condition.

2.3

Noise Protection

The SCL and SDA inputs have Schmitt Trigger and

filter circuits which suppress noise spikes to assure

proper device operation even on a noisy bus.

4.3

Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock

(SCL) is high determines a Stop condition. All

operations must be ended with a Stop condition.

3.0

FUNCTIONAL DESCRIPTION

The 24XX00 supports a bidirectional 2-wire bus and

data transmission protocol. A device that sends data

onto the bus is defined as a transmitter, and a device

receiving data as a receiver. The bus has to be

controlled by a master device which generates the

serial clock (SCL), controls the bus access, and

generates the Start and Stop conditions, while the

24XX00 works as slave. Both master and slave can

operate as transmitter or receiver, but the master

device determines which mode is activated.

4.4

Data Valid (D)

The state of the data line represents valid data when,

after a Start condition, the data line is stable for the

duration of the high period of the clock signal.

The data on the line must be changed during the low

period of the clock signal. There is one bit of data per

clock pulse.

Each data transfer is initiated with a Start condition and

terminated with a Stop condition. The number of the

data bytes transferred between the Start and Stop

conditions is determined by the master device and is

theoretically unlimited.

DS21178D-page 4

 2003 Microchip Technology Inc.

24AA00/24LC00/24C00

The device that acknowledges has to pull down the

SDA line during the Acknowledge clock pulse in such a

way that the SDA line is stable low during the high

period of the acknowledge related clock pulse. Of

course, setup and hold times must be taken into

account. A master must signal an end of data to the

slave by not generating an Acknowledge bit on the last

byte that has been clocked out of the slave. In this

case, the slave must leave the data line high to enable

the master to generate the Stop condition (Figure 4-2).

4.5

Acknowledge

Each receiving device, when addressed, is obliged to

generate an acknowledge after the reception of each

byte. The master device must generate an extra clock

pulse which is associated with this Acknowledge bit.

Note:

The 24XX00 does not generate any

Acknowledge bits if an internal program-

ming cycle is in progress.

FIGURE 4-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A)

(B)

(C)

(D)

(C)

(A)

SCL

SDA

START

CONDITION

STOP

CONDITION

ADDRESS OR

ACKNOWLEDGE

VALID

DATA

ALLOWED

TO CHANGE

FIGURE 4-2:

ACKNOWLEDGE TIMING

Acknowledge

Bit

SCL

SDA

Data from transmitter

Receiver must release the SDA line at this point

so the Transmitter can continue sending data.

Transmitter must release the SDA line at this point

allowing the Receiver to pull the SDA line low to

acknowledge the previous eight bits of data.

 2003 Microchip Technology Inc.

DS21178D-page 5

24AA00/24LC00/24C00

5.0

DEVICE ADDRESSING

6.0

6.1

WRITE OPERATIONS

Byte Write

After generating a Start condition, the bus master

transmits a control byte consisting of a slave address

and a Read/Write bit that indicates what type of

operation is to be performed. The slave address for the

24XX00 consists of a 4-bit device code ‘1010’ followed

by three don't care bits.

Following the Start signal from the master, the device

code (4 bits), the don't care bits (3 bits), and the R/W bit

(which is a logic low) are placed onto the bus by the

master transmitter. This indicates to the addressed

slave receiver that a byte with a word address will

follow after it has generated an Acknowledge bit during

the ninth clock cycle. Therefore, the next byte transmit-

ted by the master is the word address and will be

written into the address pointer of the 24XX00. Only the

lower four address bits are used by the device, and the

upper four bits are don’t cares. The 24XX00 will

acknowledge the address byte and the master device

will then transmit the data word to be written into the

addressed memory location. The 24XX00 acknowl-

edges again and the master generates a Stop

condition. This initiates the internal write cycle, and

during this time the 24XX00 will not generate Acknowl-

edge signals (Figure 7-2). After a byte Write command,

the internal address counter will not be incremented

and will point to the same address location that was just

written. If a Stop bit is transmitted to the device at any

point in the Write command sequence before the entire

sequence is complete, then the command will abort

and no data will be written. If more than 8 data bits are

transmitted before the Stop bit is sent, then the device

will clear the previously loaded byte and begin loading

the data buffer again. If more than one data byte is

transmitted to the device and a Stop bit is sent before a

full eight data bits have been transmitted, then the

Write command will abort and no data will be written.

The 24XX00 employs a VCC threshold detector circuit

which disables the internal erase/write logic if the VCC

is below 1.5V (24AA00 and 24LC00) or 3.8V (24C00)

at nominal conditions.

The last bit of the control byte determines the operation

to be performed. When set to a one a read operation is

selected, and when set to a zero a write operation is

selected. (Figure 5-1). The 24XX00 monitors the bus

for its corresponding slave address all the time. It

generates an Acknowledge bit if the slave address was

true and it is not in a Programming mode.

FIGURE 5-1:

CONTROLBYTEFORMAT

Read/Write Bit

Device Select

Bits

Don’t Care

Bits

X R/W ACK

Slave Address

Acknowledge Bit

Start Bit

DS21178D-page 6

 2003 Microchip Technology Inc.

24AA00/24LC00/24C00

FIGURE 7-1:

ACKNOWLEDGE

POLLING FLOW

7.0

ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write

cycle, this can be used to determine when the cycle is

complete (this feature can be used to maximize bus

throughput). Once the Stop condition for a Write

command has been issued from the master, the device

initiates the internally timed write cycle. ACK polling

can be initiated immediately. This involves the master

sending a Start condition followed by the control byte

for a Write command (R/W = 0). If the device is still

busy with the write cycle, then no ACK will be returned.

If no ACK is returned, then the Start bit and control byte

must be re-sent. If the cycle is complete, then the

device will return the ACK and the master can then

proceed with the next Read or Write command. See

Figure 7-1 for flow diagram.

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

Did Device

Acknowledge

(ACK = 0)?

YES

Operation

FIGURE 7-2:

BYTE WRITE

BUS ACTIVITY

MASTER

CONTROL

BYTE

WORD

ADDRESS

DATA

SDA LINE

X X

BUS ACTIVITY

X = Don’t Care Bit

 2003 Microchip Technology Inc.

DS21178D-page 7

24AA00/24LC00/24C00

After the word address is sent, the master generates a

Start condition following the acknowledge. This termi-

nates the write operation, but not before the internal

address pointer is set. Then the master issues the

control byte again but with the R/W bit set to a one. The

24XX00 will then issue an acknowledge and transmits

the eight bit data word. The master will not acknowl-

edge the transfer but does generate a Stop condition

and the device discontinues transmission (Figure 8-2).

After this command, the internal address counter will

point to the address location following the one that was

just read.

8.0

READ OPERATIONS

Read operations are initiated in the same way as write

operations with the exception that the R/W bit of the

slave address is set to one. There are three basic types

of read operations: current address read, random read,

and sequential read.

8.1

Current Address Read

The 24XX00 contains an address counter that main-

tains the address of the last word accessed, internally

incremented by one. Therefore, if the previous read

access was to address n, the next current address read

operation would access data from address n + 1. Upon

receipt of the slave address with the R/W bit set to one,

the device issues an acknowledge and transmits the

eight-bit data word. The master will not acknowledge

the transfer but does generate a Stop condition and the

device discontinues transmission (Figure 8-1).

8.3

Sequential Read

Sequential reads are initiated in the same way as a

random read except that after the device transmits the

first data byte, the master issues an acknowledge as

opposed to a Stop condition in a random read. This

directs the device to transmit the next sequentially

addressed 8-bit word (Figure 8-3).

8.2

Random Read

To provide sequential reads the 24XX00 contains an

internal address pointer which is incremented by one at

the completion of each read operation. This address

pointer allows the entire memory contents to be serially

read during one operation.

Random read operations allow the master to access

any memory location in a random manner. To perform

this type of read operation, first the word address must

be set. This is done by sending the word address to the

device as part of a write operation.

FIGURE 8-1:

CURRENT ADDRESS READ

BUS ACTIVITY

CONTROL

BYTE

DATA

MASTER

SDA LINE

S 1 0 1 0 X X X 1

BUS ACTIVITY

X = Don’t Care Bit

DS21178D-page 8

 2003 Microchip Technology Inc.

24AA00/24LC00/24C00

FIGURE 8-2:

RANDOM READ

BUS ACTIVITY

MASTER

CONTROL

BYTE

WORD

ADDRESS (n)

CONTROL

BYTE

DATA (n)

X X X X

S 1 0 1 0 X X X 0

S 1 0 1 0 X X X 1

SDA LINE

BUS ACTIVITY

X = Don’t Care Bit

FIGURE 8-3:

SEQUENTIAL READ

BUS ACTIVITY

MASTER

CONTROL

DATA n

BYTE

DATA n + 1

DATA n + 2

DATA n + X

SDA LINE

BUS ACTIVITY

 2003 Microchip Technology Inc.

DS21178D-page 9

24AA00/24LC00/24C00

9.0

9.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

Example:

XXXXXXXX

T/XXXNNN

24LC00

I/P13F

YYWW

0327

8-Lead SOIC (150 mil)

Example:

24LC00

XXXXXXXX

T/XXYYWW

I/SN0327

NNN

13F

Example:

8-Lead TSSOP

4L00

I327

13F

XXXX

TYWW

NNN

TSSOP Marking

Code

Part

Number

STD

Pb-Free

24AA00

24LC00

4A00

4L00

G4A0

G4L0

SOT-23 Marking Code

Example:

5-Lead SOT-23

Part Number

24AA00

24LC00

—

24C00

XXNN

M03F

Note:

Pb-free parts are marked same as

standard finish. Pb-free part number using

“G” suffix is marked on carton..

Legend: XX...X Customer specific information*

Temperature grade (I,E)

NNN

Year code (last 2 digits of calendar year)

Year code (last digit of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

Standard QTP marking consists of Microchip part number, year code, week code, and traceability code.

DS21178D-page 10

 2003 Microchip Technology Inc.

24AA00/24LC00/24C00

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

.155

.130

2.54

Top to Seating Plane

.140

.170

3.56

2.92

3.94

3.30

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

.145

3.68

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

.313

.250

.373

.130

.012

.058

.018

.370

.325

.260

.385

.135

.015

.070

.022

.430

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

Tip to Seating Plane

Lead Thickness

Upper Lead Width

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

 2003 Microchip Technology Inc.

DS21178D-page 11

24AA00/24LC00/24C00

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

45°

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.050

.061

.056

.007

.237

.154

.193

.015

.025

1.27

Overall Height

.053

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

1.75

Molded Package Thickness

Standoff

.052

.004

.228

.146

.189

.010

.019

.061

.010

.244

.157

.197

.020

.030

1.55

0.25

6.20

3.99

5.00

0.51

0.76

0.10

5.79

3.71

4.80

0.25

0.48

Overall Width

Molded Package Width

Overall Length

Chamfer Distance

Foot Length

Foot Angle

Lead Thickness

Lead Width

.008

.013

.009

.017

.010

.020

0.20

0.33

0.23

0.42

0.25

0.51

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

DS21178D-page 12

 2003 Microchip Technology Inc.

24AA00/24LC00/24C00

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

Units

INCHES

NOM

MILLIMETERS*

Dimension Limits

MIN

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.026

0.65

Overall Height

.043

1.10

0.95

0.15

6.50

4.50

3.10

0.70

Molded Package Thickness

Standoff

.033

.035

.004

.251

.173

.118

.024

.037

.006

.256

.177

.122

.028

0.85

0.05

0.90

0.10

6.38

4.40

3.00

0.60

.002

.246

.169

.114

.020

Overall Width

6.25

4.30

2.90

0.50

Molded Package Width

Molded Package Length

Foot Length

Foot Angle

Lead Thickness

.004

.007

.006

.010

.008

.012

0.09

0.19

0.15

0.25

0.20

0.30

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-086

 2003 Microchip Technology Inc.

DS21178D-page 13

24AA00/24LC00/24C00

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.038

.075

.046

.043

.003

.110

.064

.116

.018

0.95

1.90

Outside lead pitch (basic)

Overall Height

.035

.000

.102

.059

.110

.014

.057

0.90

1.18

1.10

0.08

2.80

1.63

2.95

0.45

1.45

Molded Package Thickness

.051

.006

.118

.069

.122

.022

1.30

0.15

3.00

1.75

3.10

0.55

Standoff

0.00

2.60

1.50

2.80

0.35

Overall Width

Molded Package Width

Overall Length

Foot Length

Foot Angle

Lead Thickness

Lead Width

.004

.014

.006

.017

.008

.020

0.09

0.35

0.15

0.43

0.20

0.50

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MO-178

Drawing No. C04-091

DS21178D-page 14

 2003 Microchip Technology Inc.

24AA00/24LC00/24C00

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

/XX

PART NO.

Device

Examples:

a) 24AA00-I/P: Industrial Temperature,1.8V

PDIP package

Temperature Package Lead Finish

Range

b) 24AA00-I/SN: Industrial Temperature,

1.8V, SOIC package

Device:

24AA00:

24AA00T:

1.8V, 128 bit I C™ Serial EEPROM

1.8V, 128 bit I C Serial EEPROM

24AA00T-I/OT: Industrial Temperature,

1.8V, SOT-23 package, tape and reel

(Tape and Reel)

24LC00:

24LC00T:

2.5V, 128 bit I C Serial EEPROM

d) 24LC00-I/P: Industrial Temperature,

2.5V, PDIP package

2.5V, 128 bit I C Serial EEPROM

(Tape and Reel)

5V, 128 bit I C™ Serial EEPROM

(Tape and Reel)

e) 24C00-E/SN: Extended Temperature,

5V, SOIC package

24C00:

24C00T:

24LC00T-I/OT: Industrial Temperature,

2.5V, SOT-23 package, tape and reel

24LC00-I/PG: Industrial Temperature, 2.5V

PDIP package, Pb-free

Temperature Blank

0°C to 70°C

-40°C to +85°C

-40°C to +125°C

Range:

24LC00T-I/OTG: Industrial Temperature,

2.5V, SOT-23 package, tape and reel,

Pb-free

Package:

= Plastic DIP (300 mil body), 8-lead

SN = Plastic SOIC (150 mil body), 8-lead

ST = Plastic TSSOP (4.4 mm), 8-lead

OT = SOT-23, 5-lead (Tape and Reel only)

Lead finish

Blank =Standard 63/37 SnPb

=Matte Tin (pure Sn)

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

2003 Microchip Technology Inc.

DS21178D-page15

24AA00/24LC00/24C00

NOTES:

DS21178D-page 16

2003 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical com-

ponents in life support systems is not authorized except with

express written approval by Microchip. No licenses are con-

veyed, implicitly or otherwise, under any intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,

SEEVAL and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, microPort,

Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,

PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,

PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,

SmartSensor, SmartShunt, SmartTel and Total Endurance are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company’s quality system processes and

procedures are QS-9000 compliant for its

PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip’s quality system for the

design and manufacture of development

systems is ISO 9001 certified.

 2003 Microchip Technology Inc.

DS21178D-page 17

WORLDWIDE SALES AND SERVICE

Korea

AMERICAS

ASIA/PACIFIC

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or

82-2-558-5934

Corporate Office

Australia

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Suite 22, 41 Rawson Street

Epping 2121, NSW

Australia

Fax: 480-792-7277

Technical Support: 480-792-7627

Web Address: http://www.microchip.com

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Singapore

200 Middle Road

#07-02 Prime Centre

Singapore, 188980

Tel: 65-6334-8870 Fax: 65-6334-8850

China - Beijing

Unit 915

Bei Hai Wan Tai Bldg.

No. 6 Chaoyangmen Beidajie

Beijing, 100027, No. China

Tel: 86-10-85282100

Fax: 86-10-85282104

Atlanta

3780 Mansell Road, Suite 130

Alpharetta, GA 30022

Tel: 770-640-0034

Fax: 770-640-0307

Taiwan

Kaohsiung Branch

30F - 1 No. 8

Min Chuan 2nd Road

Kaohsiung 806, Taiwan

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Boston

China - Chengdu

2 Lan Drive, Suite 120

Westford, MA 01886

Tel: 978-692-3848

Fax: 978-692-3821

Rm. 2401-2402, 24th Floor,

Ming Xing Financial Tower

No. 88 TIDU Street

Chengdu 610016, China

Tel: 86-28-86766200

Taiwan

Taiwan Branch

11F-3, No. 207

Tung Hua North Road

Taipei, 105, Taiwan

Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

Chicago

333 Pierce Road, Suite 180

Itasca, IL 60143

Tel: 630-285-0071

Fax: 630-285-0075

Fax: 86-28-86766599

China - Fuzhou

Unit 28F, World Trade Plaza

No. 71 Wusi Road

Dallas

Fuzhou 350001, China

Tel: 86-591-7503506

Fax: 86-591-7503521

EUROPE

Austria

Durisolstrasse 2

A-4600 Wels

Austria

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

Regus Business Centre

Lautrup hoj 1-3

4570 Westgrove Drive, Suite 160

Addison, TX 75001

Tel: 972-818-7423

Fax: 972-818-2924

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

Kwai Fong, N.T., Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250

China - Shanghai

Room 701, Bldg. B

Far East International Plaza

No. 317 Xian Xia Road

Shanghai, 200051

Tel: 86-21-6275-5700

Fax: 86-21-6275-5060

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza

No. 5022 Binhe Road, Futian District

Shenzhen 518033, China

Tel: 86-755-82901380

Fax: 86-755-8295-1393

China - Shunde

Fax: 248-538-2260

Ballerup DK-2750 Denmark

Tel: 45-4420-9895 Fax: 45-4420-9910

Kokomo

France

2767 S. Albright Road

Kokomo, IN 46902

Tel: 765-864-8360

Fax: 765-864-8387

Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

Batiment A - ler Etage

91300 Massy, France

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Los Angeles

18201 Von Karman, Suite 1090

Irvine, CA 92612

Tel: 949-263-1888

Fax: 949-263-1338

Germany

Steinheilstrasse 10

D-85737 Ismaning, Germany

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Phoenix

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7966

Fax: 480-792-4338

Room 401, Hongjian Building

No. 2 Fengxiangnan Road, Ronggui Town

Shunde City, Guangdong 528303, China

Tel: 86-765-8395507 Fax: 86-765-8395571

Italy

Via Quasimodo, 12

20025 Legnano (MI)

Milan, Italy

China - Qingdao

Rm. B505A, Fullhope Plaza,

No. 12 Hong Kong Central Rd.

Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

San Jose

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands

P. A. De Biesbosch 14

NL-5152 SC Drunen, Netherlands

Tel: 31-416-690399

2107 North First Street, Suite 590

San Jose, CA 95131

Tel: 408-436-7950

Fax: 408-436-7955

India

Toronto

Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada

Tel: 905-673-0699

Fax: 31-416-690340

United Kingdom

505 Eskdale Road

Winnersh Triangle

Fax: 905-673-6509

Wokingham

Berkshire, England RG41 5TU

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Benex S-1 6F

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

07/28/03

DS21178D-page 18

 2003 Microchip Technology Inc.

24C00T-E/OTVAO [MICROCHIP]

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