24C65T-I/SM305G [MICROCHIP]

8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8;
24C65T-I/SM305G
型号: 24C65T-I/SM305G
厂家: MICROCHIP    MICROCHIP
描述:

8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路
文件: 总24页 (文件大小:296K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
24AA65/24LC65/24C65  
64K I2CSmart SerialEEPROM  
Device Selection Table  
Part Number  
VCC Range  
Page Size  
Temp. Ranges  
Packages  
24AA65  
24LC65  
24C65  
1.8-6.0V  
2.5-6.0V  
4.5-6.0V  
64 Bytes  
64 Bytes  
64 Bytes  
C
P, SM  
P, SM  
P, SM  
C, I  
C, I, E  
Features  
Description  
• Voltage operating range: 1.8V to 6.0V  
- Peak write current 3 mA at 6.0V  
- Maximum read current 150 µA at 6.0V  
- Standby current 1 µA typical  
• Industry standard two-wire bus protocol I2C™  
compatible  
The Microchip Technology Inc. 24AA65/24LC65/  
24C65 (24XX65)* is a “smart” 8K x 8 Serial Electrically  
Erasable PROM. This device has been developed for  
advanced, low-power applications such as personal  
communications, and provides the systems designer  
with flexibility through the use of many new user-pro-  
grammable features. The 24XX65 offers a relocatable  
4K bit block of ultra-high-endurance memory for data  
that changes frequently. The remainder of the array, or  
60K bits, is rated at 1,000,000 erase/write (E/W) cycles  
ensured. The 24XX65 features an input cache for fast  
write loads with a capacity of eight pages, or 64 bytes.  
This device also features programmable security  
options for E/W protection of critical data and/or code  
of up to fifteen 4K blocks. Functional address lines  
allow the connection of up to eight 24XX65's on the  
same bus for up to 512K bits contiguous EEPROM  
memory. Advanced CMOS technology makes this  
device ideal for low-power nonvolatile code and data  
applications. The 24XX65 is available in the standard  
8-pin plastic DIP and 8-pin surface mount SOIC  
package.  
• 8-byte page, or byte modes available  
• 2 ms typical write cycle time, byte or page  
• 64-byte input cache for fast write loads  
• Up to 8 devices may be connected to the same  
bus for up to 512K bits total memory  
• Including 100 kHz (1.8V Vcc < 4.5V) and 400  
kHz (4.5V VCC 6.0V) compatibility  
• Programmable block security options  
• Programmable endurance options  
• Schmitt Trigger, filtered inputs for noise  
suppression  
• Output slope control to eliminate ground bounce  
• Self-timed erase and write cycles  
• Power-on/off data protection circuitry  
• Endurance:  
Package Types  
- 10,000,000 E/W cycles for a High Endurance  
Block  
PDIP  
A0  
A1  
1
2
8
7
VCC  
- 1,000,000 E/W cycles for a Standard  
Endurance Block  
NC  
• Electrostatic discharge protection > 4000V  
• Data retention > 200 years  
A2  
3
4
6
5
SCL  
SDA  
VSS  
• 8-pin PDIP/SOIC packages  
Temperature ranges  
SOIC  
- Commercial (C):  
- Industrial (I)  
- Automotive (E)  
0°C to +70°C  
-40°C to +85°C  
-40°C to +125°C  
1
2
8
7
A0  
V
CC  
A1  
A2  
NC  
3
4
6
5
SCL  
SDA  
VSS  
*24XX65 is used in this document as a generic part  
number for the 24AA65/24LC65/24C65 devices.  
2003 Microchip Technology Inc.  
DS21073J-page 1  
24AA65/24LC65/24C65  
Block Diagram  
Pin Function Table  
A0 A1 A2  
Name  
Function  
HV Generator  
A0, A1, A2  
VSS  
User Configurable Chip Selects  
Ground  
I/O  
Control  
Logic  
Memory  
Control  
Logic  
EEPROM  
Array  
SDA  
Serial Address/Data/I/O  
Serial Clock  
XDEC  
SCL  
Page Latches  
VCC  
+1.8V to 6.0V Power Supply  
No Internal Connection  
NC  
I/O  
SCL  
Cache  
YDEC  
SDA  
VCC  
VSS  
Sense Amp.  
R/W Control  
DS21073J-page 2  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
1.0  
ELECTRICAL CHARACTERISTICS  
(†)  
Absolute Maximum Ratings  
VCC.............................................................................................................................................................................7.0V  
All inputs and outputs w.r.t. VSS ..........................................................................................................-0.6V to VCC +1.0V  
Storage temperature ...............................................................................................................................-65°C to +150°C  
Ambient temperature with power applied................................................................................................-65°C to +125°C  
ESD protection on all pins ......................................................................................................................................................≥ 4 kV  
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device. This is a stress rating only and functional operation of the device at those or any other conditions above those  
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an  
extended period of time may affect device reliability.  
TABLE 1-1:  
DC CHARACTERISTICS  
VCC = +1.8V to +6.0V  
Commercial  
Industrial  
Automotive  
(C): TA =  
(I): TA =  
(E): TA =  
0°C to +70°C  
-40°C to +85°C  
-40°C to +125°C  
DC CHARACTERISTICS  
Parameter  
Sym  
Min  
Max  
Units  
Conditions  
A0, A1, A2, SCL and SDA pins:  
High-level input voltage  
VIH  
VIL  
.7 VCC  
.05 VCC  
.3 VCC  
V
V
V
V
Low-level input voltage  
Hysteresis of Schmitt Trigger inputs VHYS  
Low-level output voltage  
(Note 1)  
IOL = 3.0 mA  
VOL  
.40  
Input leakage current  
ILI  
±1  
±1  
10  
µA  
µA  
pF  
VIN = .1V to VCC  
VOUT = .1V to VCC  
Output leakage current  
ILO  
Pin capacitance  
CIN, COUT  
VCC = 5.0V (Note 1)  
(all inputs/outputs)  
TA = 25°C, FCLK = 1 MHz  
Operating current  
ICC Write  
ICC Read  
3
150  
mA  
µA  
VCC = 6.0V, SCL = 400 kHz  
VCC = 6.0V, SCL = 400 kHz  
Standby current  
ICCS  
5
µA  
VCC = 5.0V, SCL = SDA = VCC  
A0, A1, A2 = VSS  
Note 1: This parameter is periodically sampled and not 100% tested.  
FIGURE 1-1:  
BUS TIMING START/STOP  
VHYS  
SCL  
THD:STA  
TSU:STA  
TSU:STO  
SDA  
START  
STOP  
2003 Microchip Technology Inc.  
DS21073J-page 3  
24AA65/24LC65/24C65  
TABLE 1-2:  
AC CHARACTERISTICS  
VCC = 1.8V-6.0V VCC = 4.5-6.0V  
STD. Mode FAST Mode  
Parameter  
Symbol  
Units  
Remarks  
Min  
Max  
Min  
Max  
Clock frequency  
FCLK  
THIGH  
TLOW  
TR  
4000  
4700  
100  
600  
1300  
400  
kHz  
ns  
Clock high time  
Clock low time  
ns  
SDA and SCL rise time  
SDA and SCL fall time  
Start condition setup time  
1000  
300  
300  
300  
ns  
(Note 1)  
TF  
ns  
(Note 1)  
THD:STA 4000  
600  
ns  
After this period the first  
clock pulse is generated  
Start condition setup time  
TSU:STA  
4700  
600  
ns  
Only relevant for  
repeated Start condition  
Data input hold time  
Data input setup time  
Stop condition setup time  
Output valid from clock  
Bus free time  
THD:DAT  
TSU:DAT  
TSU:STO  
TAA  
0
0
ns  
ns  
ns  
ns  
ns  
250  
4000  
100  
600  
3500  
900  
(Note 2)  
TBUF  
4700  
1300  
Time the bus must be  
free before a new  
transmission can start  
Output fall time from VIH min to TOF  
VIL max  
50  
250  
5
20 + 0.1  
CB  
250  
5
ns  
ns  
(Note 1), CB 100 pF  
Input filter spike suppression  
(SDA and SCL pins)  
TSP  
50  
(Note 3)  
Write cycle time  
TWR  
ms/page (Note 4)  
Endurance  
High Endurance Block  
Rest of Array  
10M  
1M  
10M  
1M  
cycles 25°C, (Note 5)  
Note 1: Not 100 percent tested. CB = total capacitance of one bus line in pF.  
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region  
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.  
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved  
noise and spike suppression. This eliminates the need for a Ti specification for standard operation.  
4: The times shown are for a single page of 8 bytes. Multiply by the number of pages loaded into the write  
cache for total time.  
5: This parameter is not tested but ensured by characterization. For endurance estimates in a specific  
application, please consult the Total Endurance™ Model which can be downloaded at www.microchip.com.  
FIGURE 1-2:  
BUS TIMING DATA  
TF  
TR  
THIGH  
TLOW  
THD:STA  
SCL  
TSU:STA  
THD:DAT  
TSU:DAT  
TSU:STO  
SDA  
IN  
TSP  
TBUF  
TAA  
TAA  
SDA  
OUT  
DS21073J-page 4  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
3.3  
Stop Data Transfer (C)  
2.0  
FUNCTIONAL DESCRIPTION  
A low-to-high transition of the SDA line while the clock  
(SCL) is high determines a Stop condition. All  
operations must be ended with a Stop condition.  
The 24XX65 supports a bidirectional two-wire bus and  
data transmission protocol. A device that sends data  
onto the bus is defined as transmitter, and a device  
receiving data as receiver. The bus must be controlled  
by a master device which generates the serial clock  
(SCL), controls the bus access and generates the Start  
and Stop conditions, while the 24XX65 works as slave.  
Both master and slave can operate as transmitter or  
receiver, but the master device determines which mode  
is activated.  
3.4  
Data Valid (D)  
The state of the data line represents valid data when,  
after a Start condition, the data line is stable for the  
duration of the high period of the clock signal.  
The data on the line must be changed during the low  
period of the clock signal. There is one clock pulse per  
bit of data.  
3.0  
BUS CHARACTERISTICS  
Each data transfer is initiated with a Start condition and  
terminated with a Stop condition. The number of the  
data bytes transferred between the Start and Stop  
conditions is determined by the master device.  
The following bus protocol has been defined:  
• Data transfer may be initiated only when the bus  
is not busy.  
• During data transfer, the data line must remain  
stable whenever the clock line is high. Changes in  
the data line while the clock line is high will be  
interpreted as a Start or Stop condition.  
3.5  
Acknowledge  
Each receiving device, when addressed, is obliged to  
generate an acknowledge after the reception of each  
byte. The master device must generate an extra clock  
pulse which is associated with this Acknowledge bit.  
Accordingly, the following bus conditions have been  
defined (Figure 3-1).  
Note:  
The 24XX65 does not generate any  
Acknowledge bits if an internal program-  
ming cycle is in progress.  
3.1  
Bus not Busy (A)  
Both data and clock lines remain high.  
A device that acknowledges must pull down the SDA  
line during the Acknowledge clock pulse in such a way  
that the SDA line is stable low during the high period of  
the acknowledge related clock pulse. Of course, setup  
and hold times must be taken into account. During  
reads, a master must signal an end of data to the slave  
by NOT generating an Acknowledge bit on the last byte  
that has been clocked out of the slave. In this case, the  
slave (24XX65) must leave the data line high to enable  
the master to generate the Stop condition.  
3.2  
Start Data Transfer (B)  
A high-to-low transition of the SDA line while the clock  
(SCL) is high determines a Start condition. All  
commands must be preceded by a Start condition.  
FIGURE 3-1:  
DATA TRANSFER SEQUENCE ON THE SERIAL BUS  
(A)  
(B)  
(D)  
(D)  
(C)  
(A)  
SCL  
SDA  
Start  
Condition  
Stop  
Condition  
Address or  
Acknowledge  
Valid  
Data  
Allowed  
To Change  
2003 Microchip Technology Inc.  
DS21073J-page 5  
24AA65/24LC65/24C65  
3.6  
Device Addressing  
4.0  
4.1  
WRITE OPERATION  
Byte Write  
A control byte is the first byte received following the  
Start condition from the master device. The control byte  
consists of a four-bit control code, for the 24XX65 this  
is set as ‘1010’ binary for read and write operations.  
The next three bits of the control byte are the device  
select bits (A2, A1, A0). They are used by the master  
device to select which of the eight devices are to be  
accessed. These bits are in effect the three Most  
Significant bits of the word address. The last bit of the  
control byte defines the operation to be performed.  
When set to a one a read operation is selected, when  
set to a zero a write operation is selected. The next two  
bytes received define the address of the first data byte  
(Figure 4-1). Because only A12..A0 are used, the  
upper three address bits must be zeros. The Most  
Significant bit of the Most Significant Byte is transferred  
first. Following the Start condition, the 24XX65  
monitors the SDA bus checking the device type  
identifier being transmitted. Upon receiving a ‘1010’  
code and appropriate device select bits, the slave  
device (24XX65) outputs an Acknowledge signal on the  
SDA line. Depending upon the state of the R/W bit, the  
24XX65 will select a read or write operation.  
Following the Start condition from the master, the con-  
trol code (four bits), the device select (three bits), and  
the R/W bit which is a logic low, is placed onto the bus  
by the master transmitter. This indicates to the  
addressed slave receiver (24XX65) that a byte with a  
word address will follow after it has generated an  
Acknowledge bit during the ninth clock cycle. There-  
fore, the next byte transmitted by the master is the  
high-order byte of the word address and will be written  
into the address pointer of the 24XX65. The next byte  
is the Least Significant Address Byte. After receiving  
another Acknowledge signal from the 24XX65, the  
master device will transmit the data word to be written  
into the addressed memory location. The 24XX65  
acknowledges again and the master generates a Stop  
condition. This initiates the internal write cycle, and  
during this time the 24XX65 will not generate  
Acknowledge signals (Figure 4-1).  
4.2  
Page Write  
The write control byte, word address and the first data  
byte are transmitted to the 24XX65 in the same way as  
in a byte write. But instead of generating a Stop  
condition, the master transmits up to eight pages of  
eight data bytes each (64 bytes total), which are  
temporarily stored in the on-chip page cache of the  
24XX65. They will be written from the cache into the  
EEPROM array after the master has transmitted a Stop  
condition. After the receipt of each word, the six lower  
order address pointer bits are internally incremented by  
one. The higher order seven bits of the word address  
remain constant. If the master should transmit more  
than eight bytes prior to generating the Stop condition  
(writing across a page boundary), the address counter  
(lower three bits) will roll over and the pointer will be  
incremented to point to the next line in the cache. This  
can continue to occur up to eight times or until the cache  
is full, at which time a Stop condition should be  
generated by the master. If a Stop condition is not  
received, the cache pointer will roll over to the first line  
(byte 0) of the cache, and any further data received will  
overwrite previously captured data. The Stop condition  
can be sent at any time during the transfer. As with the  
byte write operation, once the Stop condition is received  
an internal write cycle will begin. The 64-byte cache will  
continue to capture data until a Stop condition occurs or  
the operation is aborted (Figure 4-2).  
Operation Control Code Device Select R/W  
Read  
Write  
1010  
1010  
Device Address  
DeviceAddress  
1
0
FIGURE 3-2:  
CONTROL BYTE  
ALLOCATION  
START  
READ/WRITE  
SLAVE ADDRESS  
R/W  
A
1
0
1
0
A2  
A1  
A0  
DS21073J-page 6  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
FIGURE 4-1:  
BYTE WRITE  
S
T
A
R
T
S
BUS ACTIVITY  
MASTER  
WORD  
ADDRESS (0)  
WORD  
ADDRESS (1)  
T
CONTROL  
BYTE  
DATA  
O
P
0 0 0  
S
SDA LINE  
P
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY  
FIGURE 4-2:  
PAGE WRITE (FOR CACHE WRITE, SEE FIGURE 8-2)  
S
T
A
R
T
S
T
O
P
WORD  
ADDRESS (1)  
WORD  
ADDRESS (0)  
CONTROL  
BYTE  
BUS  
ACTIVITY  
MASTER  
DATA n  
DATA n + 7  
S
P
SDA LINE  
0 0 0  
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
BUS  
ACTIVITY:  
FIGURE 4-3:  
CURRENT ADDRESS READ  
S
T
S
T
BUS ACTIVITY  
MASTER  
CONTROL  
BYTE  
A
R
T
DATA n  
O
P
SDA LINE  
S
P
A
C
K
N
O
BUS ACTIVITY  
A
C
K
2003 Microchip Technology Inc.  
DS21073J-page 7  
24AA65/24LC65/24C65  
FIGURE 4-4:  
RANDOM READ  
S
T
A
R
T
S
T
A
R
T
S
T
O
P
WORD  
ADDRESS (1)  
CONTROL  
BYTE  
WORD  
ADDRESS (0)  
CONTROL  
BYTE  
DATA n  
0 0 0  
P
SDA LINE  
BUS  
S
S
N
O
A
C
K
A
C
K
A
C
K
A
C
K
ACTIVITY  
A
C
K
FIGURE 4-5:  
SEQUENTIAL READ  
S
T
O
P
BUS ACTIVITYCONTROL  
DATA n  
DATA n + 1  
DATA n + 2  
DATA n + X  
MASTER  
BYTE  
SDA LINE  
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
BUS ACTIVITY  
A
C
K
DS21073J-page 8  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
5.4  
Contiguous Addressing Across  
Multiple Devices  
5.0  
READ OPERATION  
Read operations are initiated in the same way as write  
operations with the exception that the R/W bit of the  
slave address is set to one. There are three basic types  
of read operations: current address read, random read  
and sequential read.  
The device select bits A2, A1, A0 can be used to  
expand the contiguous address space for up to 512K  
bits by adding up to eight 24XX65's on the same bus.  
In this case, software can use A0 of the control byte as  
address bit A13, A1 as address bit A14 and A2 as  
address bit A15.  
5.1  
Current Address Read  
The 24XX65 contains an address counter that main-  
tains the address of the last word accessed, internally  
incremented by one. Therefore, if the previous access  
(either a read or write operation) was to address n (n is  
any legal address), the next current address read  
operation would access data from address n + 1. Upon  
receipt of the slave address with R/W bit set to one, the  
24XX65 issues an acknowledge and transmits the  
eight-bit data word. The master will not acknowledge  
the transfer but does generate a Stop condition and the  
24XX65 discontinues transmission (Figure 4-3).  
5.5  
Noise Protection  
The SCL and SDA inputs have filter circuits which  
suppress noise spikes to assure proper device  
operation even on a noisy bus. All I/O lines incorporate  
Schmitt Triggers for 400 kHz (Fast mode) compatibility.  
5.6  
High Endurance Block  
The location of the high endurance block within the  
memory map is programmed by setting the leading bit  
7 (S/HE) of the configuration byte to ‘0’. The upper bits  
of the address loaded in this command will determine  
which 4K block within the memory map will be set to  
high endurance. This block will be capable of  
10,000,000 erase/write cycles typical (Figure 8-1).  
5.2  
Random Read  
Random read operations allow the master to access  
any memory location in a random manner. To perform  
this type of read operation, first the word address must  
be set. This is done by sending the word address to the  
24XX65 as part of a write operation (R/W bit set to ‘0’).  
After the word address is sent, the master generates a  
Start condition following the acknowledge. This  
terminates the write operation, but not before the  
internal address pointer is set. Then the master issues  
the control byte again, but with the R/W bit set to a one.  
The 24XX65 will then issue an acknowledge and  
transmit the eight-bit data word. The master will not  
acknowledge the transfer, but does generate a Stop  
condition which causes the 24XX65 to discontinue  
transmission (Figure 4-4).  
The high endurance block will retain its value as the  
high endurance block even if it resides within the  
security block range. The high endurance setting  
always takes precedence to the security setting.  
Note:  
The high endurance block cannot be  
changed after the security option has been  
set with a length greater than zero. If the  
H.E. block is not programmed by the user,  
the default location is the highest block of  
memory which starts at location 0x1E00  
and ends at 0x1FFF.  
5.3  
Sequential Read  
Sequential reads are initiated in the same way as a  
random read except that after the 24XX65 transmits the  
first data byte, the master issues an acknowledge as  
opposed to the Stop condition used in a random read.  
This acknowledge directs the 24XX65 to transmit the  
next sequentially addressed 8-bit word (Figure 4-5).  
Following the final byte transmitted to the master, the  
master will NOT generate an acknowledge, but will  
generate a Stop condition.  
To provide sequential reads the 24XX65 contains an  
internal address pointer which is incremented by one at  
the completion of each operation. This address pointer  
allows the entire memory contents to be serially read  
during one operation.  
2003 Microchip Technology Inc.  
DS21073J-page 9  
24AA65/24LC65/24C65  
acknowledge the second, and then send a Stop bit to  
end the sequence. The upper four bits of both of these  
bytes will always be read as ‘1’s. The lower four bits of  
the first byte contains the starting secure block. The  
lower four bits of the second byte contains the number  
of secure blocks. The default starting secure block is  
fifteen and the default number of secure blocks is zero  
(Figure 8-1).  
5.7  
Security Options  
The 24XX65 has a sophisticated mechanism for write  
protecting portions of the array. This write-protect  
function is programmable and allows the user to protect  
0-15 contiguous 4K blocks. The user sets the security  
option by sending to the device the starting block  
number for the protected region and the number of  
blocks to be protected. All parts will come from the  
factory in the default configuration with the starting  
block number set to 15 and the number of protected  
blocks set to zero. THE SECURITY OPTION CAN BE  
SET ONLY ONCE WITH A LENGTH GREATER THAN  
ZERO.  
6.0  
ACKNOWLEDGE POLLING  
Since the device will not acknowledge during a write  
cycle, this can be used to determine when the cycle is  
complete (this feature can be used to maximize bus  
throughput). Once the Stop condition for a Write  
command has been issued from the master, the device  
initiates the internally timed write cycle. ACK polling  
can be initiated immediately. This involves the master  
sending a Start condition followed by the control byte  
for a Write command (R/W = 0). If the device is still  
busy with the write cycle, then no ACK will be returned.  
If the cycle is complete, then the device will return the  
ACK and the master can then proceed with the next  
Read or Write command. See Figure 6-1 for flow  
diagram.  
To invoke the security option, a Write command is sent  
to the device with the leading bit (bit 7) of the first  
address byte set to a ‘1’ (Figure 8-1). Bits 1-4 of the first  
address byte define the starting block number for the  
protected region.  
For example, if the starting block number is to be set to  
5, the first address byte would be 1XX0101X. Bits 0, 5  
and 6 of the first address byte are disregarded by the  
device and can be either high or low. The device will  
acknowledge after the first address byte. A byte of don’t  
care bits is then sent by the master, with the device  
acknowledging afterwards. The third byte sent to the  
device has bit 7 (S/HE) set high and bit 6 (R) set low.  
Bits 4 and 5 are don’t cares and bits 0-3 define the  
number of blocks to be write-protected. For example, if  
three blocks are to be protected, the third byte would be  
10XX0011. After the third byte is sent to the device, it  
will acknowledge and a Stop bit is then sent by the mas-  
ter to complete the command.  
FIGURE 6-1:  
ACKNOWLEDGE  
POLLING FLOW  
Send  
Write Command  
If one of the security blocks coincides with the high  
endurance block, the high endurance setting will take  
precedence. Also, if the range of the security blocks  
encompass the high endurance block when the secu-  
rity option is set, the security block range will be set  
accordingly, but the high endurance block will continue  
to retain the high endurance setting. As a result, the  
memory blocks preceding the high endurance block will  
be set as secure sections.  
Send Stop  
Condition to  
Initiate Write Cycle  
Send Start  
During a normal write sequence, if an attempt is made  
to write to a protected address, no data will be written  
and the device will not report an error or abort the  
command. If a Write command is attempted across a  
secure boundary, unprotected addresses will be written  
and protected addresses will not.  
Send Control Byte  
with R/W = 0  
Did Device  
Acknowledge  
(ACK = 0)?  
NO  
5.8  
Security Configuration Read  
The status of the secure portion of memory can be read  
by using the same technique as programming this  
option except the read bit (bit 6) of the configuration  
byte is set to a one. After the configuration byte is sent,  
the device will acknowledge and then send two bytes of  
data to the master just as in a normal read sequence.  
The master must acknowledge the first byte and not  
YES  
Next  
Operation  
DS21073J-page 10  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
fully loaded cache of 64 bytes. Since the cache started  
loading at byte 2, the last two bytes loaded into the  
cache will ‘roll over' and be loaded into the first two  
bytes of page 0 (of the cache). When the Stop bit is  
sent, page 0 of the cache is written to page 3 of the  
array. The remaining pages in the cache are then  
loaded sequentially to the array. A write cycle is  
executed after each page is written. If a partially loaded  
page in the cache remains when the Stop bit is sent,  
only the bytes that have been loaded will be written to  
the array.  
7.0  
PAGE CACHE AND ARRAY  
MAPPING  
The cache is a 64-byte (8 pages x 8 bytes) FIFO buffer.  
The cache allows the loading of up to 64 bytes of data  
before the write cycle is actually begun, effectively  
providing a 64-byte burst write at the maximum bus  
rate. Whenever a Write command is initiated, the cache  
starts loading and will continue to load until a Stop bit is  
received to start the internal write cycle. The total  
length of the write cycle will depend on how many  
pages are loaded into the cache before the Stop bit is  
given. Maximum cycle time for each page is 5 ms. Even  
if a page is only partially loaded, it will still require the  
same cycle time as a full page. If more than 64 bytes of  
data are loaded before the Stop bit is given, the  
address pointer will ‘wrap around’ to the beginning of  
cache page 0 and existing bytes in the cache will be  
overwritten. The device will not respond to any  
commands while the write cycle is in progress.  
7.3  
Power Management  
The design incorporates a power Standby mode when  
not in use and automatically powers off after the normal  
termination of any operation when a Stop bit is received  
and all internal functions are complete. This includes  
any error conditions (i.e., not receiving an Acknowl-  
edge or Stop condition per the two-wire bus specifica-  
tion). The device also incorporates VDD monitor  
circuitry to prevent inadvertent writes (data corruption)  
during low voltage conditions. The VDD monitor circuitry  
is powered off when the device is in Standby mode in  
order to further reduce power consumption.  
7.1  
Cache Write Starting at a Page  
Boundary  
If a Write command begins at a page boundary  
(address bits A2, A1 and A0 are zero), then all data  
loaded into the cache will be written to the array in  
sequential addresses. This includes writing across a  
4K block boundary. In the example shown below,  
(Figure 8-2) a Write command is initiated starting at  
byte 0 of page 3 with a fully loaded cache (64 bytes).  
The first byte in the cache is written to byte 0 of page 3  
(of the array), with the remaining pages in the cache  
written to sequential pages in the array. A write cycle is  
executed after each page is written. Since the write  
begins at page 3 and 8 pages are loaded into the  
cache, the last 3 pages of the cache are written to the  
next row in the array.  
8.0  
8.1  
PIN DESCRIPTIONS  
A0, A1, A2 Chip Address Inputs  
The A0..A2 inputs are used by the 24XX65 for multiple  
device operation and conform to the two-wire bus  
standard. The levels applied to these pins define the  
address block occupied by the device in the address  
map. A particular device is selected by transmitting the  
corresponding bits (A2, A1, A0) in the control byte  
(Figure 3-2 and Figure 8-1).  
8.2  
SDA Serial Address/Data Input/  
Output  
7.2  
Cache Write Starting at a  
Non-Page Boundary  
This is a bidirectional pin used to transfer addresses  
and data into and data out of the device. It is an open  
drain terminal, therefore the SDA bus requires a pull-up  
resistor to VCC (typical 10 Kfor 100 kHz, 2 Kfor 400  
kHz).  
When a Write command is initiated that does not begin  
at a page boundary (i.e., address bits A2, A1 and A0  
are not all zero), it is important to note how the data is  
loaded into the cache, and how the data in the cache is  
written to the array. When a Write command begins, the  
first byte loaded into the cache is always loaded into  
page 0. The byte within page 0 of the cache where the  
load begins is determined by the three Least Significant  
Address bits (A2, A1, A0) that were sent as part of the  
Write command. If the Write command does not start at  
byte 0 of a page and the cache is fully loaded, then the  
last byte(s) loaded into the cache will roll around to  
page 0 of the cache and fill the remaining empty bytes.  
If more than 64 bytes of data are loaded into the cache,  
data already loaded will be overwritten. In the example  
shown in Figure 8-3, a Write command has been  
initiated starting at byte 2 of page 3 in the array with a  
For normal data transfer SDA is allowed to change only  
during SCL low. Changes during SCL high are  
reserved for indicating the Start and Stop conditions.  
8.3  
SCL Serial Clock  
This input is used to synchronize the data transfer from  
and to the device.  
2003 Microchip Technology Inc.  
DS21073J-page 11  
24AA65/24LC65/24C65  
FIGURE 8-1:  
CONTROL SEQUENCE BIT ASSIGNMENTS  
Control Byte  
Address Byte 1  
Address Byte 0  
Configuration Byte  
A
7
A
0
A A  
A
0
A
A A A A  
B B B B  
2
3 1 0  
X
R X  
1
0
1
0
S
0
0
R/W  
2
1
12 1110 9  
8
S/HE  
Slave Device  
Address Select  
Bits  
Block  
Count  
Security Read  
Acknowledge  
from  
No  
ACK  
S
Master  
S
t
Acknowledges from Device  
t
a
r
Data from Device  
Data from Device  
o
p
R
t
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
A A  
A
0
B
2
N N N N  
1
1
B
3
B B  
X X X X X  
X X X X X X X  
X
X
X X X  
1
1
0
1
0
0
1
X X  
X
1
1 X  
1
1
1
1
1
2
1
3
2
1 0  
1
0
S/HE  
Starting Block  
Number  
Number of  
Blocks to  
Protect  
Security Write  
S
S
t
t
Acknowledges from Device  
a
r
o
p
t
R
A
C
K
A
C
K
A
C
K
A
C
K
A A  
A
0
N N N N  
X
B B B  
B
0
X
X X X X X X X  
1
0
1
0
0
1
X X  
X
1
0 X  
2
1
2
3 1 0  
3
2
1
S/HE  
Starting Block  
Number  
Number of  
Blocks to  
Protect  
No  
High Endurance Block Read  
ACK  
S
t
S
t
a
r
t
Acknowledges from Device  
o
p
Data from Device  
R
A
C
K
A
C
K
A
C
K
A
C
K
A A  
A
0
B
2
B
3
B B  
0
X X X X X  
X X X X X X X  
X
X
X X X  
1
1
1
0
1
0
0
1
X X  
X
0
1 X  
1
1
2
1
1
S/HE  
High Endurance  
Block Number  
High Endurance Block Write  
S
S
t
t
Acknowledges from Device  
a
r
o
p
t
R
0
A
C
K
A
C
K
A
C
K
A
C
K
A A  
A
0
B B B  
B
0
X
X X X X X X X  
X 0 0 0  
0
X
1
0
1
0
0
1
X X  
X
0
2
1
3
2
1
S/HE  
High Endurance  
Block Number  
DS21073J-page 12  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
FIGURE 8-2:  
CACHE WRITE TO THE ARRAY STARTING AT A PAGE BOUNDARY  
1
Write command initiated at byte 0 of page 3 in the array;  
First data byte is loaded into the cache byte 0.  
2 64 bytes of data are loaded into cache.  
cache page 0  
cache cache  
byte 0 byte 1  
cache cache page 1 cache page 2  
byte 7 bytes 8-15 bytes 16-23  
cache page 7  
bytes 56-63  
• • •  
• • •  
3
Write from cache into array initiated by STOP bit.  
Page 0 of cache written to page 3 of array.  
4
Remaining pages in cache are written  
to sequential pages in array.  
Write cycle is executed after every page is written.  
array row n  
page 0 page 1 page 2 byte 0 byte 1  
• • • byte 7 page 4 • • • page 7  
array row n + 1  
page 0 page 1 page 2  
page 3 page 4 • • • page 7  
5
Last page in cache written to page 2 in next row.  
FIGURE 8-3:  
CACHE WRITE TO THE ARRAY STARTING AT A NON-PAGE BOUNDARY  
1
Write command initiated; 64 bytes of data  
loaded into cache starting at byte 2 of page 0.  
2
Last 2 bytes loaded 'roll over'  
to beginning.  
3
Last 2 bytes  
loaded into  
cache cache cache  
byte 0 byte 1 byte 2  
cache cache page 1 cache page 2  
byte 7 bytes 8-15 bytes 16-23  
cache page 7  
bytes 56-63  
page 0 of cache.  
• • •  
• • •  
4
Write from cache into array initiated by STOP bit.  
Page 0 of cache written to page 3 of array.  
5
Remaining bytes in cache are  
written sequentially to array.  
Write cycle is executed after every page is written.  
array  
page 0 page 1 page 2  
page 0 page 1 page 2  
• • •  
page 4 • • • page 7  
page 4 • • • page 7  
byte 0 byte 1 byte 2 byte 3 byte 4  
page 3  
byte 7  
row n  
array  
row  
n + 1  
6
Last 3 pages in cache written to next row in array.  
2003 Microchip Technology Inc.  
DS21073J-page 13  
24AA65/24LC65/24C65  
9.0  
9.1  
PACKAGING INFORMATION  
Package Marking Information  
8-Lead PDIP (300 mil)  
Example:  
24LC65  
I/P017  
XXXXXXXX  
T/XXXNNN  
YYWW  
0310  
8-Lead SOIC (208 mil)  
Example:  
XXXXXXXX  
T/XXXXXX  
YYWWNNN  
24LC65  
I/SM  
0110017  
Legend: XX...X Customer specific information*  
Y
Year code (last digit of calendar year)  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
Temperature grade (Blank = Commercial, I = Industrial,  
E = Automotive)  
YY  
WW  
NNN  
T
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line thus limiting the number of available characters  
for customer specific information.  
*
Standard PICmicro device marking consists of Microchip part number, year code, week code, and  
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check  
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP  
price.  
DS21073J-page 14  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)  
E1  
D
2
n
1
α
E
A2  
A
L
c
A1  
β
B1  
p
eB  
B
Units  
INCHES*  
NOM  
MILLIMETERS  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
8
MAX  
n
p
Number of Pins  
Pitch  
8
.100  
.155  
.130  
2.54  
Top to Seating Plane  
A
.140  
.170  
3.56  
2.92  
3.94  
3.30  
4.32  
Molded Package Thickness  
Base to Seating Plane  
Shoulder to Shoulder Width  
Molded Package Width  
Overall Length  
A2  
A1  
E
.115  
.015  
.300  
.240  
.360  
.125  
.008  
.045  
.014  
.310  
5
.145  
3.68  
0.38  
7.62  
6.10  
9.14  
3.18  
0.20  
1.14  
0.36  
7.87  
5
.313  
.250  
.373  
.130  
.012  
.058  
.018  
.370  
10  
.325  
.260  
.385  
.135  
.015  
.070  
.022  
.430  
15  
7.94  
6.35  
9.46  
3.30  
0.29  
1.46  
0.46  
9.40  
10  
8.26  
6.60  
9.78  
3.43  
0.38  
1.78  
0.56  
10.92  
15  
E1  
D
Tip to Seating Plane  
Lead Thickness  
L
c
Upper Lead Width  
B1  
B
Lower Lead Width  
Overall Row Spacing  
Mold Draft Angle Top  
Mold Draft Angle Bottom  
§
eB  
α
β
5
10  
15  
5
10  
15  
* Controlling Parameter  
§ Significant Characteristic  
Notes:  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.010” (0.254mm) per side.  
JEDEC Equivalent: MS-001  
Drawing No. C04-018  
2003 Microchip Technology Inc.  
DS21073J-page 15  
24AA65/24LC65/24C65  
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)  
E
E1  
p
D
2
n
1
B
α
c
A2  
A
φ
A1  
L
β
Units  
INCHES*  
NOM  
MILLIMETERS  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
8
MAX  
n
p
Number of Pins  
Pitch  
8
.050  
.075  
.074  
.005  
.313  
.208  
.205  
.025  
4
1.27  
Overall Height  
A
.070  
.080  
1.78  
1.75  
1.97  
1.88  
0.13  
7.95  
5.28  
5.21  
0.64  
4
2.03  
Molded Package Thickness  
Standoff  
A2  
A1  
E
.069  
.002  
.300  
.078  
.010  
.325  
.212  
.210  
.030  
8
1.98  
0.25  
8.26  
5.38  
5.33  
0.76  
8
§
0.05  
7.62  
5.11  
5.13  
0.51  
0
Overall Width  
Molded Package Width  
Overall Length  
E1  
D
.201  
.202  
.020  
0
Foot Length  
L
φ
Foot Angle  
c
Lead Thickness  
Lead Width  
.008  
.014  
0
.009  
.017  
12  
.010  
.020  
15  
0.20  
0.36  
0
0.23  
0.43  
12  
0.25  
0.51  
15  
B
α
Mold Draft Angle Top  
Mold Draft Angle Bottom  
β
0
12  
15  
0
12  
15  
* Controlling Parameter  
§ Significant Characteristic  
Notes:  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.010” (0.254mm) per side.  
Drawing No. C04-056  
DS21073J-page 16  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
APPENDIX A: REVISION HISTORY  
Revision J  
Corrections to Section 1.0, Electrical Characteristics.  
2003 Microchip Technology Inc.  
DS21073J-page 17  
24AA65/24LC65/24C65  
NOTES:  
DS21073J-page 18  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
ON-LINE SUPPORT  
SYSTEMS INFORMATION AND  
UPGRADE HOT LINE  
Microchip provides on-line support on the Microchip  
World Wide Web site.  
The Systems Information and Upgrade Line provides  
system users a listing of the latest versions of all of  
Microchip's development systems software products.  
Plus, this line provides information on how customers  
can receive the most current upgrade kits. The Hot Line  
Numbers are:  
The web site is used by Microchip as a means to make  
files and information easily available to customers. To  
view the site, the user must have access to the Internet  
and a web browser, such as Netscape® or Microsoft®  
Internet Explorer. Files are also available for FTP  
download from our FTP site.  
1-800-755-2345 for U.S. and most of Canada, and  
1-480-792-7302 for the rest of the world.  
Connecting to the Microchip Internet  
Web Site  
042003  
The Microchip web site is available at the following  
URL:  
www.microchip.com  
The file transfer site is available by using an FTP  
service to connect to:  
ftp://ftp.microchip.com  
The web site and file transfer site provide a variety of  
services. Users may download files for the latest  
Development Tools, Data Sheets, Application Notes,  
User's Guides, Articles and Sample Programs. A vari-  
ety of Microchip specific business information is also  
available, including listings of Microchip sales offices,  
distributors and factory representatives. Other data  
available for consideration is:  
• Latest Microchip Press Releases  
Technical Support Section with Frequently Asked  
Questions  
• Design Tips  
• Device Errata  
• Job Postings  
• Microchip Consultant Program Member Listing  
• Links to other useful web sites related to  
Microchip Products  
• Conferences for products, Development Systems,  
technical information and more  
• Listing of seminars and events  
2003 Microchip Technology Inc.  
DS21073J-page 19  
24AA65/24LC65/24C65  
READER RESPONSE  
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-  
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation  
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.  
Please list the following information, and use this outline to provide us with your comments about this document.  
To:  
Technical Publications Manager  
Reader Response  
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RE:  
From:  
Name  
Company  
Address  
City / State / ZIP / Country  
Telephone: (_______) _________ - _________  
FAX: (______) _________ - _________  
Application (optional):  
Would you like a reply?  
Y
N
24AA65/24LC65/24C65  
DS21073J  
Literature Number:  
Device:  
Questions:  
1. What are the best features of this document?  
2. How does this document meet your hardware and software development needs?  
3. Do you find the organization of this document easy to follow? If not, why?  
4. What additions to the document do you think would enhance the structure and subject?  
5. What deletions from the document could be made without affecting the overall usefulness?  
6. Is there any incorrect or misleading information (what and where)?  
7. How would you improve this document?  
DS21073J-page 20  
2003 Microchip Technology Inc.  
24AA65/24LC65/24C65  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
PART NO.  
Device  
X
/XX  
XXX  
Examples:  
Temperature  
Range  
Package  
Pattern  
a) 24LC65T-I/SM: 64 Kbit Smart Serial,  
Tape and Reel, 207 mil SOIC package,  
Industrial temperature, 2.5V  
b) 24LC65-I/P: 64 Kbit Smart Serial,  
Industrial temperature, PDIP package,  
2.5V  
Device  
24AA65 - 64K I2C 1.8V Serial EEPROM (100 kHz)  
24AA65T - 64K I2C 1.8V Serial EEPROM (100 kHz)  
24LC65 - 64K I2C Serial EEPROM (100 kHz/400 kHz)  
24LC65T - 64K I2C Serial EEPROM (Tape and Reel)  
24C65 - 64K I2C 4.5V Serial EEPROM (400 kHz)  
24C65T - 64K I2C 4.5V Serial EEPROM (Tape and Reel)  
c) 24AA65T-/SM: 64 Kbit Smart Serial,  
Tape and Reel, 207 mil SOIC package,  
Commercial temperature, 1.8V  
d) 24C65-E/P: 64 Kbit Smart Serial,  
Automotive temperature, PDIP, 5V  
Temperature Range Blank  
=
=
=
0°C to +70°C  
-40°C to +85°C  
-40°C to +125°C  
I
E
Package  
P
SM  
=
=
Plastic DIP (300 mil Body)  
Plastic SOIC (207 mil Body, EIAJ standard)  
Sales and Support  
Data Sheets  
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and  
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:  
1. Your local Microchip sales office  
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277  
3. The Microchip Worldwide Site (www.microchip.com)  
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.  
New Customer Notification System  
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  
2003 Microchip Technology Inc.  
DS21073J-page 21  
24AA65/24LC65/24C65  
NOTES:  
DS21073J-page 22  
2003 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is intended through suggestion only  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
No representation or warranty is given and no liability is  
assumed by Microchip Technology Incorporated with respect  
to the accuracy or use of such information, or infringement of  
patents or other intellectual property rights arising from such  
use or otherwise. Use of Microchip’s products as critical com-  
ponents in life support systems is not authorized except with  
express written approval by Microchip. No licenses are con-  
veyed, implicitly or otherwise, under any intellectual property  
rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, Accuron,  
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,  
PRO MATE and PowerSmart are registered trademarks of  
Microchip Technology Incorporated in the U.S.A. and other  
countries.  
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,  
SEEVAL and The Embedded Control Solutions Company are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A.  
Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,  
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,  
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,  
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,  
PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,  
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,  
SmartSensor, SmartShunt, SmartTel and Total Endurance are  
trademarks of Microchip Technology Incorporated in the  
U.S.A. and other countries.  
Serialized Quick Turn Programming (SQTP) is a service mark  
of Microchip Technology Incorporated in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2003, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received QS-9000 quality system  
certification for its worldwide headquarters,  
design and wafer fabrication facilities in  
Chandler and Tempe, Arizona in July 1999  
and Mountain View, California in March 2002.  
The Company’s quality system processes and  
procedures are QS-9000 compliant for its  
PICmicro® 8-bit MCUs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals,  
non-volatile memory and analog products. In  
addition, Microchip’s quality system for the  
design and manufacture of development  
systems is ISO 9001 certified.  
2003 Microchip Technology Inc.  
DS21073J-page 23  
WORLDWIDE SALES AND SERVICE  
Korea  
AMERICAS  
ASIA/PACIFIC  
168-1, Youngbo Bldg. 3 Floor  
Samsung-Dong, Kangnam-Ku  
Seoul, Korea 135-882  
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or  
82-2-558-5934  
Corporate Office  
Australia  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Suite 22, 41 Rawson Street  
Epping 2121, NSW  
Australia  
Fax: 480-792-7277  
Technical Support: 480-792-7627  
Web Address: http://www.microchip.com  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
Singapore  
200 Middle Road  
#07-02 Prime Centre  
Singapore, 188980  
Tel: 65-6334-8870 Fax: 65-6334-8850  
China - Beijing  
Unit 915  
Bei Hai Wan Tai Bldg.  
No. 6 Chaoyangmen Beidajie  
Beijing, 100027, No. China  
Tel: 86-10-85282100  
Fax: 86-10-85282104  
Atlanta  
3780 Mansell Road, Suite 130  
Alpharetta, GA 30022  
Tel: 770-640-0034  
Fax: 770-640-0307  
Taiwan  
Kaohsiung Branch  
30F - 1 No. 8  
Min Chuan 2nd Road  
Kaohsiung 806, Taiwan  
Tel: 886-7-536-4818  
Fax: 886-7-536-4803  
Boston  
China - Chengdu  
2 Lan Drive, Suite 120  
Westford, MA 01886  
Tel: 978-692-3848  
Fax: 978-692-3821  
Rm. 2401-2402, 24th Floor,  
Ming Xing Financial Tower  
No. 88 TIDU Street  
Chengdu 610016, China  
Tel: 86-28-86766200  
Taiwan  
Taiwan Branch  
11F-3, No. 207  
Tung Hua North Road  
Taipei, 105, Taiwan  
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139  
Chicago  
333 Pierce Road, Suite 180  
Itasca, IL 60143  
Tel: 630-285-0071  
Fax: 630-285-0075  
Fax: 86-28-86766599  
China - Fuzhou  
Unit 28F, World Trade Plaza  
No. 71 Wusi Road  
Dallas  
Fuzhou 350001, China  
Tel: 86-591-7503506  
Fax: 86-591-7503521  
EUROPE  
Austria  
Durisolstrasse 2  
A-4600 Wels  
Austria  
Tel: 43-7242-2244-399  
Fax: 43-7242-2244-393  
Denmark  
Regus Business Centre  
Lautrup hoj 1-3  
4570 Westgrove Drive, Suite 160  
Addison, TX 75001  
Tel: 972-818-7423  
Fax: 972-818-2924  
China - Hong Kong SAR  
Unit 901-6, Tower 2, Metroplaza  
223 Hing Fong Road  
Kwai Fong, N.T., Hong Kong  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
Detroit  
Tri-Atria Office Building  
32255 Northwestern Highway, Suite 190  
Farmington Hills, MI 48334  
Tel: 248-538-2250  
China - Shanghai  
Room 701, Bldg. B  
Far East International Plaza  
No. 317 Xian Xia Road  
Shanghai, 200051  
Tel: 86-21-6275-5700  
Fax: 86-21-6275-5060  
China - Shenzhen  
Rm. 1812, 18/F, Building A, United Plaza  
No. 5022 Binhe Road, Futian District  
Shenzhen 518033, China  
Tel: 86-755-82901380  
Fax: 86-755-8295-1393  
China - Shunde  
Fax: 248-538-2260  
Ballerup DK-2750 Denmark  
Tel: 45-4420-9895 Fax: 45-4420-9910  
Kokomo  
France  
2767 S. Albright Road  
Kokomo, IN 46902  
Tel: 765-864-8360  
Fax: 765-864-8387  
Parc d’Activite du Moulin de Massy  
43 Rue du Saule Trapu  
Batiment A - ler Etage  
91300 Massy, France  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
Los Angeles  
18201 Von Karman, Suite 1090  
Irvine, CA 92612  
Tel: 949-263-1888  
Fax: 949-263-1338  
Germany  
Steinheilstrasse 10  
D-85737 Ismaning, Germany  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Phoenix  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7966  
Fax: 480-792-4338  
Room 401, Hongjian Building  
No. 2 Fengxiangnan Road, Ronggui Town  
Shunde City, Guangdong 528303, China  
Tel: 86-765-8395507 Fax: 86-765-8395571  
Italy  
Via Quasimodo, 12  
20025 Legnano (MI)  
Milan, Italy  
China - Qingdao  
Rm. B505A, Fullhope Plaza,  
No. 12 Hong Kong Central Rd.  
Qingdao 266071, China  
Tel: 86-532-5027355 Fax: 86-532-5027205  
San Jose  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
Netherlands  
P. A. De Biesbosch 14  
NL-5152 SC Drunen, Netherlands  
Tel: 31-416-690399  
2107 North First Street, Suite 590  
San Jose, CA 95131  
Tel: 408-436-7950  
Fax: 408-436-7955  
India  
Toronto  
Divyasree Chambers  
1 Floor, Wing A (A3/A4)  
No. 11, O’Shaugnessey Road  
Bangalore, 560 025, India  
Tel: 91-80-2290061 Fax: 91-80-2290062  
Japan  
6285 Northam Drive, Suite 108  
Mississauga, Ontario L4V 1X5, Canada  
Tel: 905-673-0699  
Fax: 31-416-690340  
United Kingdom  
505 Eskdale Road  
Winnersh Triangle  
Fax: 905-673-6509  
Wokingham  
Berkshire, England RG41 5TU  
Tel: 44-118-921-5869  
Fax: 44-118-921-5820  
Benex S-1 6F  
3-18-20, Shinyokohama  
Kohoku-Ku, Yokohama-shi  
Kanagawa, 222-0033, Japan  
Tel: 81-45-471- 6166 Fax: 81-45-471-6122  
07/28/03  
DS21073J-page 24  
2003 Microchip Technology Inc.  

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