24FC01_技术文档

24AA01/24LC01B

1K I²C^™Serial EEPROM

Device Selection Table

Description

The Microchip Technology Inc. 24AA01/24LC01B

Part

VCC

Max Clock

Temp

(24XX01*) is a 1 Kbit Electrically Erasable PROM. The

device is organized as one block of 128 x 8-bit memory

with a 2-wire serial interface. Low-voltage design

permits operation down to 1.8V with standby and active

currents of only 1 µA and 1 mA, respectively. The

24XX01 also has a page write capability for up to 8

bytes of data. The 24XX01 is available in the standard

8-pin PDIP, surface mount SOIC, TSSOP and MSOP

packages and is also available in the 5-lead SOT-23

package.

Number

Range

Frequency

Ranges

24AA01

1.8-5.5

2.5-5.5

400 kHz⁽¹⁾

400 kHz

I

24LC01B

I, E

Note 1: 100 kHz for VCC <2.5V

Features

• Single-supply with operation down to 1.8V

• Low-power CMOS technology

- 1 mA active current typical

Package Types

- 1 µA standby current typical (I-temp)

• Organized as 1 block of 128 bytes (1 x 128 x 8)

• 2-wire serial interface bus, I²C™ compatible

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

PDIP/SOIC/TSSOP/MSOP

SOT-23-5

A0

A1

1

2

3

4

8

7

6

5

VCC

WP

1

5

SCL

2

3

VSS

A2

SCL

SDA

• 100 kHz (24AA01) and 400 kHz (24LC01B)

compatibility

4

VCC

SDA

VSS

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 8 bytes

• 2 ms typical write cycle time for page write

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

Note:

Pins A0, A1 and A2 are not used by the

24XX01 (no internal connections).

Block Diagram

WP

HV Generator

• 1,000,000 erase/write cycles

• Data retention > 200 years

• 8-lead PDIP, SOIC, TSSOP and MSOP packages

• 5-lead SOT-23 package

I/O

Control

Logic

Memory

Control

Logic

EEPROM

Array

XDEC

• Standard and Pb-free finishes

Page Latches

• Available for extended temperature ranges:

- Industrial (I): -40°C to +85°C

I/O

SCL

- Automotive (E): -40°C to +125°C

YDEC

SDA

VCC

VSS

Sense Amp.

R/W Control

 2003 Microchip Technology Inc.

DS21711C-page 1

24AA01/24LC01B

1.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-65°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to

the device. This is a stress rating only and functional operation of the device at those or any other conditions

above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

TABLE 1-1:

DC CHARACTERISTICS

VCC = +1.8V to +5.5V

DC CHARACTERISTICS

Industrial (I):

TA = -40°C to +85°C

Automotive (E): TA = -40°C to +125°C

Param.

Sym

Characteristic

Min

Typ

Max

Units

Conditions

No.

—

D1

D2

D3

D4

VIH

—

WP, SCL and SDA pins

High-level input voltage

Low-level input voltage

—

V

—

0.7 VCC

—

VIL

0.3 VCC

—

V

—

VHYS

Hysteresis of Schmitt

Trigger inputs

0.05 VCC

V

(Note)

D5

D6

D7

D8

VOL

ILI

Low-level output voltage

Input leakage current

Output leakage current

—

0.40

±1

V

IOL = 3.0 mA, VCC = 2.5V

VIN =.1V to VCC

µA

pF

ILO

±1

VOUT =.1V to VCC

CIN,

Pin capacitance

10

VCC = 5.0V (Note)

COUT

(all inputs/outputs)

TA = 25°C, FCLK = 1 MHz

D9

ICC write Operating current

—

0.1

3

1

mA

VCC = 5.5V, SCL = 400 kHz

—

D10

D11

ICC read

0.05

ICCS

Standby current

—

0.01

—

1

5

µΑ

Industrial

Automotive

SDA = SCL = VCC

WP = VSS

Note:

This parameter is periodically sampled and not 100% tested.

DS21711C-page 2

 2003 Microchip Technology Inc.

24AA01/24LC01B

TABLE 1-2:

AC CHARACTERISTICS

VCC = +1.8V to +5.5V

Industrial (I): TA = -40°C to +85°C

Automotive (E): TA = -40°C to +125°C

AC CHARACTERISTICS

Param.

Sym

Characteristic

Clock frequency

Min

Typ

Max

Units

Conditions

No.

1

FCLK

THIGH

TLOW

TR

—

400

100

kHz 2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

2.5V ≤ VCC ≤ 5.5V

2

Clock high time

Clock low time

600

4000

—

ns

1.8V ≤ VCC <2.5V (24AA01)

3

1300

4700

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

4

SDA and SCL rise time

(Note 1)

—

300

1000

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

5

TF

SDA and SCL fall time

—

300

(Note 1)

6

THD:STA Start condition hold time

600

4000

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

7

TSU:STA Start condition setup

time

600

4700

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

8

THD:DAT Data input hold time

0

—

(Note 2)

9

TSU:DAT Data input setup time

100

250

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

10

11

12

TSU:STO Stop condition setup

time

600

4000

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

TAA

Output valid from clock

(Note 2)

—

900

3500

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

TBUF

Bus free-time: Time the

bus must be free before

a new transmission can

start

1300

4700

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

13

14

TOF

TSP

Output fall time from VIH 20+0.1CB

—

250

ns

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA01)

minimum to VIL

maximum

—

Input filter spike

suppression

—

50

(Notes 1 and 3)

(SDA and SCL pins)

15

16

TWC

—

Write cycle time

(byte or page)

—

5

ms

—

Endurance

1M

—

cycles 25°C, (Note 4)

Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a TI specification for standard operation.

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site:

www.microchip.com.

 2003 Microchip Technology Inc.

DS21711C-page 3

24AA01/24LC01B

FIGURE 1-1:

BUS TIMING DATA

5

4

2

3

SCL

7

8

9

10

6

SDA

IN

14

12

11

SDA

OUT

FIGURE 1-2:

BUS TIMING START/STOP

D4

SCL

SDA

6

7

10

Start

Stop

DS21711C-page 4

 2003 Microchip Technology Inc.

24AA01/24LC01B

3.4

Data Valid (D)

2.0

FUNCTIONAL DESCRIPTION

The state of the data line represents valid data when,

after a Start condition, the data line is stable for the

duration of the high period of the clock signal.

The 24XX01 supports a bidirectional, 2-wire bus and

data transmission protocol. A device that sends data

onto the bus is defined as transmitter, while defining a

device receiving data as a receiver. The bus has to be

controlled by a master device which generates the

serial clock (SCL), controls the bus access and

generates the Start and Stop conditions, while the

24XX01 works as slave. Both master and slave can

operate as transmitter or receiver, but the master

device determines which mode is activated.

The data on the line must be changed during the low

period of the clock signal. There is one clock pulse per

bit of data.

Each data transfer is initiated with a Start condition and

terminated with a Stop condition. The number of data

bytes transferred between the Start and Stop

conditions is determined by the master device and is,

theoretically, unlimited (although only the last sixteen

will be stored when doing a write operation). When an

overwrite does occur, it will replace data in a first-in

first-out (FIFO) fashion.

3.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus

is not busy.

3.5

Acknowledge

• During data transfer, the data line must remain

stable whenever the clock line is high. Changes in

the data line while the clock line is high will be

interpreted as a Start or Stop condition.

Each receiving device, when addressed, is obliged to

generate an acknowledge after the reception of each

byte. The master device must generate an extra clock

pulse which is associated with this Acknowledge bit.

Accordingly, the following bus conditions have been

defined (Figure 3-1).

Note:

The 24XX01 does not generate any

Acknowledge bits if an internal

programming cycle is in progress.

3.1

Bus not Busy (A)

The device that acknowledges has to pull down the

SDA line during the acknowledge clock pulse in such a

way that the SDA line is stable low during the high

period of the acknowledge-related clock pulse. Of

course, setup and hold times must be taken into

account. During reads, a master must signal an end of

data to the slave by not generating an Acknowledge bit

on the last byte that has been clocked out of the slave.

In this case, the slave (24XX01) will leave the data line

high to enable the master to generate the Stop

condition.

Both data and clock lines remain high.

3.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock

(SCL) is high determines a Start condition. All

commands must be preceded by a Start condition.

3.3

Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock

(SCL) is high determines a Stop condition. All

operations must be ended with a Stop condition.

FIGURE 3-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A)

(B)

(D)

(C) (A)

SCL

SDA

Start

Condition

Stop

Condition

Address or

Acknowledge

Valid

Data

Allowed

to Change

 2003 Microchip Technology Inc.

DS21711C-page 5

24AA01/24LC01B

FIGURE 3-2:

CONTROL BYTE

ALLOCATION

3.6

Device Addressing

A control byte is the first byte received following the

Start condition from the master device. The control byte

consists of a four-bit control code. For the 24XX01, this

is set as ‘1010’ binary for read and write operations.

The next three bits of the control byte are ‘don’t care’s’

for the 24XX01.

START

READ/WRITE

SLAVE ADDRESS

R/W

A

The last bit of the control byte defines the operation to

be performed. When set to ‘1’, a read operation is

selected. When set to ‘0’, a write operation is selected.

Following the Start condition, the 24XX01 monitors the

SDA bus checking the device type identifier being

transmitted. Upon receiving a ‘1010’ code, the slave

device outputs an Acknowledge signal on the SDA line.

Depending on the state of the R/W bit, the 24XX01 will

select a read or write operation.

1

0

1

0

X

X = ‘Don’t care’.

Control

Code

Operation

Block Select

R/W

Read

Write

1010

Block Address

1

0

DS21711C-page 6

 2003 Microchip Technology Inc.

24AA01/24LC01B

4.2

Page Write

4.0

4.1

WRITE OPERATION

Byte Write

The write control byte, word address and first data byte

are transmitted to the 24XX01 in the same way as in a

byte write. However, instead of generating a Stop

condition, the master transmits up to 8 data bytes to the

24XX01, which are temporarily stored in the on-chip

page buffer and will be written into the memory once

the master has transmitted a Stop condition. Upon

receipt of each word, the four lower-order address

pointer bits are internally incremented by ‘1’. The

higher-order 7 bits of the word address remain

constant. If the master should transmit more than 8

words prior to generating the Stop condition, the

address counter will roll over and the previously

received data will be overwritten. As with the byte write

operation, once the Stop condition is received, an

internal write cycle will begin (Figure 4-2).

Following the Start condition from the master, the

device code (4 bits), the block address (3 bits, don’t

cares) and the R/W bit, which is a logic low, is placed

onto the bus by the master transmitter. This indicates to

the addressed slave receiver that a byte with a word

address will follow after it has generated an Acknowl-

edge bit during the ninth clock cycle. Therefore, the

next byte transmitted by the master is the word address

and will be written into the address pointer of the

24XX01. After receiving another Acknowledge signal

from the 24XX01, the master device will transmit the

data word to be written into the addressed memory

location. The 24XX01 acknowledges again and the

master generates a Stop condition. This initiates the

internal write cycle, and, during this time, the 24XX01

will not generate Acknowledge signals (Figure 4-1).

Note:

Page write operations are limited to writing

bytes within single physical page

a

regardless of the number of bytes

actually being written. Physical page

boundaries start at addresses that are

integer multiples of the page buffer size (or

‘page size’) and end at addresses that are

integer multiples of [page size - 1]. If a

Page Write command attempts to write

across a physical page boundary, the

result is that the data wraps around to the

beginning of the current page (overwriting

data previously stored there), instead of

being written to the next page, as might be

expected. It is therefore necessary for the

application software to prevent page write

operations that would attempt to cross a

page boundary.

FIGURE 4-1:

BYTE WRITE

S

T

A

R

T

S

T

O

P

BUS ACTIVITY

MASTER

CONTROL

BYTE

WORD

ADDRESS

DATA

SDA LINE

S

P

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

FIGURE 4-2:

PAGE WRITE

S

T

BUS ACTIVITY

MASTER

CONTROL

BYTE

WORD

ADDRESS (n)

A

R

T

S

O

P

DATA (n)

DATA (n + 1)

DATA (n + 7)

SDA LINE

P

A

C

K

A

C

K

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

 2003 Microchip Technology Inc.

DS21711C-page 7

24AA01/24LC01B

5.0

ACKNOWLEDGE POLLING

6.0

WRITE-PROTECTION

Since the device will not acknowledge during a write

cycle, this can be used to determine when the cycle is

complete (this feature can be used to maximize bus

throughput). Once the Stop condition for a Write

command has been issued from the master, the device

initiates the internally-timed write cycle. ACK polling

can then be initiated immediately. This involves the

master sending a Start condition followed by the control

byte for a Write command (R/W = 0). If the device is still

busy with the write cycle, no ACK will be returned. If the

cycle is complete, the device will return the ACK and

the master can then proceed with the next Read or

Write command. See Figure 5-1 for a flow diagram of

this operation.

The 24XX01 can be used as a serial ROM when the

WP pin is connected to VCC. Programming will be

inhibited and the entire memory will be write-protected.

FIGURE 5-1:

ACKNOWLEDGE POLLING

FLOW

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

Did Device

Acknowledge

(ACK = 0)?

No

Yes

DS21711C-page 8

 2003 Microchip Technology Inc.

24AA01/24LC01B

7.3

Sequential Read

7.0

READ OPERATION

Sequential reads are initiated in the same way as a

random read, except that once the 24XX01 transmits

the first data byte, the master issues an acknowledge

(as opposed to a Stop condition in a random read). This

directs the 24XX01 to transmit the next sequentially

addressed 8-bit word (Figure 7-3).

Read operations are initiated in the same way as write

operations, with the exception that the R/W bit of the

slave address is set to ‘1’. There are three basic types

of read operations: current address read, random read

and sequential read.

7.1

Current Address Read

To provide sequential reads the 24XX01 contains an

internal address pointer which is incremented by one at

the completion of each operation. This address pointer

allows the entire memory contents to be serially read

during one operation.

The 24XX01 contains an address counter that

maintains the address of the last word accessed,

internally incremented by ‘1’. Therefore, if the previous

access (either a read or write operation) was to

address n, the next current address read operation

would access data from address n + 1. Upon receipt of

the slave address with R/W bit set to ‘1’, the 24XX01

issues an acknowledge and transmits the 8-bit data

word. The master will not acknowledge the transfer but

does generate a Stop condition and the 24XX01

discontinues transmission (Figure 7-1).

7.4

Noise Protection

The 24XX01 employs a VCC threshold detector circuit

which disables the internal erase/write logic if the VCC

is below 1.5V at nominal conditions.

The SCL and SDA inputs have Schmitt Trigger and

filter circuits which suppress noise spikes to assure

proper device operation even on a noisy bus.

7.2

Random Read

Random read operations allow the master to access

any memory location in a random manner. To perform

this type of read operation, the word address must first

be set. This is accomplished by sending the word

address to the 24XX01 as part of a write operation.

Once the word address is sent, the master generates a

Start condition following the acknowledge. This

terminates the write operation, but not before the inter-

nal address pointer is set. The master then issues the

control byte again, but with the R/W bit set to a ‘1’. The

24XX01 will then issue an acknowledge and transmits

the 8-bit data word. The master will not acknowledge

the transfer but does generate a Stop condition and the

24XX01 discontinues transmission (Figure 7-2).

FIGURE 7-1:

CURRENT ADDRESS READ

S

BUS ACTIVITY

MASTER

T

A

R

CONTROL

BYTE

S

T

DATA (n)

O

P

T

SDA LINE

S

P

A

C

K

N

O

BUS ACTIVITY

A

C

K

 2003 Microchip Technology Inc.

DS21711C-page 9

24AA01/24LC01B

FIGURE 7-2:

RANDOM READ

S

T

A

R

T

A

R

T

S

T

BUS ACTIVITY

MASTER

CONTROL

BYTE

WORD

ADDRESS (n)

CONTROL

BYTE

DATA (n)

O

P

S

P

S

SDA LINE

A

C

K

A

C

K

A

C

K

N

O

BUS ACTIVITY

A

C

K

FIGURE 7-3:

SEQUENTIAL READ

S

T

BUS ACTIVITY CONTROL

MASTER

BYTE

O

P

DATA (n)

DATA (n + 1)

DATA (n + 2)

DATA (n + X)

SDA LINE

P

A

C

K

A

C

K

A

C

K

N

O

C

BUS ACTIVITY

K

A

C

K

DS21711C-page 10

 2003 Microchip Technology Inc.

24AA01/24LC01B

8.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 8-1.

TABLE 8-1:

PIN FUNCTION TABLE

Name PDIP

SOIC

TSSOP MSOP SOT23

Description

Not Connected

A0

A1

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

—

2

Not Connected

Ground

A2

VSS

SDA

SCL

WP

VCC

3

Serial Address/Data I/O

Serial Clock

1

5

Write-Protect Input

4

+1.8V to 5.5V Power Supply

8.1

A0, A1, A2

8.3

Serial Clock (SCL)

The A0, A1 and A2 pins are not used by the 24XX01.

They may be left floating or tied to either VSS or VCC.

The SCL input is used to synchronize the data transfer

to and from the device.

8.2

Serial Address/Data Input/Output

(SDA)

8.4

Write-Protect (WP)

This pin must be connected to either VSS or VCC.

The SDA input is a bidirectional pin used to transfer

addresses and data into and out of the device. Since

it is an open-drain terminal, the SDA bus requires a

pull-up resistor to VCC (typical 10 kΩ for 100 kHz,

2 kΩ for 400 kHz).

If tied to VSS normal memory operation is enabled

(read/write the entire memory 00-7F).

If tied to VCC, write operations are inhibited. The entire

memory will be write-protected. Read operations are

not affected.

For normal data transfer, SDA is allowed to change

only during SCL low. Changes during SCL high are

reserved for indicating Start and Stop conditions.

This feature allows the user to use the 24XX01 as a

serial ROM when WP is enabled (tied to VCC).

 2003 Microchip Technology Inc.

DS21711C-page 11

24AA01/24LC01B

9.0

9.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

Example:

XXXXXXXX

T/XXXNNN

24LC01B

I/P13F

YYWW

0327

8-Lead SOIC (150 mil)

Example:

XXXXXXXX

T/XXYYWW

24LC01B

I/SN0327

NNN

13F

Example:

8-Lead TSSOP

4L1B

IYWW

NNN

XXXX

TYWW

NNN

TSSOP/MSOP

Marking Code

Example:

8-Lead MSOP

Part

Number

XXXXT

4L1BI

32713F

STD

Pb-Free

YWWNNN

24AA01

4A01

4L01

G4A1

G4L1

24LC01B

SOT-23

Example:

5-Lead SOT-23

Marking Code

STD Pb-Free

B1 B1

Part Number

24AA01

24LC01B-I

24LC01B-E

Note:

M1

N1

M1

N1

XXNN

M13F

Pb-free part number using

“G” suffix is marked on

carton.

Legend: XX...X Customer specific information*

T

Temperature grade (I,E)

YY

Y

Year code (last 2 digits of calendar year)

Year code (last digit of calendar year)

WW

NNN

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

*

Standard QTP marking consists of Microchip part number, year code, week code, and traceability code.

DS21711C-page 12

 2003 Microchip Technology Inc.

24AA01/24LC01B

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A2

A

L

c

A1

β

B1

B

p

eB

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

MAX

n

p

Number of Pins

Pitch

8

.100

.155

.130

2.54

3.94

3.30

Top to Seating Plane

A

.140

.170

3.56

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

5

.145

2.92

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

5

3.68

.313

.250

.373

.130

.012

.058

.018

.370

10

.325

.260

.385

.135

.015

.070

.022

.430

15

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

10

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

15

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

B1

B

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

§

eB

α

β

5

10

15

5

10

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

 2003 Microchip Technology Inc.

DS21711C-page 13

24AA01/24LC01B

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

n

1

h

α

45°

c

A2

A

φ

β

L

A1

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.050

.061

.056

.007

.237

.154

.193

.015

.025

4

1.27

Overall Height

A

.053

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

4

1.75

Molded Package Thickness

Standoff

A2

A1

E

.052

.004

.228

.146

.189

.010

.019

0

.061

.010

.244

.157

.197

.020

.030

8

1.55

0.25

6.20

3.99

5.00

0.51

0.76

8

§

0.10

5.79

3.71

4.80

0.25

0.48

0

Overall Width

Molded Package Width

Overall Length

E1

D

Chamfer Distance

Foot Length

h

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.008

.013

0

.009

.017

12

.010

.020

15

0.20

0.33

0

0.23

0.42

12

0.25

0.51

15

B

α

Mold Draft Angle Top

Mold Draft Angle Bottom

β

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

DS21711C-page 14

 2003 Microchip Technology Inc.

24AA01/24LC01B

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

E

E1

p

D

2

1

n

B

α

A

c

A1

A2

φ

β

L

Units

INCHES

NOM

MILLIMETERS*

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026

0.65

Overall Height

A

.043

1.10

0.95

0.15

6.50

4.50

3.10

0.70

8

Molded Package Thickness

Standoff

A2

A1

E

.033

.035

.004

.251

.173

.118

.024

4

.037

.006

.256

.177

.122

.028

8

0.85

0.05

0.90

0.10

6.38

4.40

3.00

0.60

4

§

.002

.246

.169

.114

.020

0

Overall Width

6.25

4.30

2.90

0.50

0

Molded Package Width

Molded Package Length

Foot Length

E1

D

L

φ

Foot Angle

c

Lead Thickness

.004

.007

0

.006

.010

5

.008

.012

10

0.09

0.19

0

0.15

0.25

5

0.20

0.30

10

Lead Width

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-086

 2003 Microchip Technology Inc.

DS21711C-page 15

24AA01/24LC01B

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

E

E1

p

D

2

B

n

1

α

A2

A

c

φ

A1

(F)

L

β

Units

Dimension Limits

INCHES

NOM

MILLIMETERS*

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026 BSC

0.65 BSC

Overall Height

A

A2

A1

E

-

.043

-

0.85

-

1.10

Molded Package Thickness

Standoff

.030

.000

.033

-

.037

.006

0.75

0.95

0.15

0.00

Overall Width

.193 TYP.

4.90 BSC

Molded Package Width

Overall Length

Foot Length

E1

D

.118 BSC

3.00 BSC

L

.016

.024

.037 REF

.031

0.40

0.60

0.95 REF

0.80

Footprint (Reference)

Foot Angle

F

φ

c

0°

.003

.009

5°

-

8°

.009

.016

15°

0°

0.08

0.22

5°

-

8°

0.23

0.40

15°

Lead Thickness

Lead Width

.006

B

α

β

.012

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

Notes:

-

5°

15°

5°

15°

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

DS21711C-page 16

 2003 Microchip Technology Inc.

24AA01/24LC01B

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)

E

E1

p

B

p1

D

n

1

α

c

A

A2

φ

A1

L

β

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

MAX

n

p

Number of Pins

5

Pitch

.038

.075

.046

.043

.003

.110

.064

.116

.018

5

0.95

1.90

1.18

1.10

0.08

2.80

1.63

2.95

0.45

5

p1

Outside lead pitch (basic)

Overall Height

A

A2

A1

E

.035

.000

.102

.059

.110

.014

0

.057

0.90

1.45

Molded Package Thickness

.051

.006

.118

.069

.122

.022

10

0.90

0.00

2.60

1.50

2.80

0.35

0

1.30

0.15

3.00

1.75

3.10

0.55

10

Standoff

§

Overall Width

Molded Package Width

Overall Length

E1

D

Foot Length

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.004

.014

0

.006

.017

5

.008

.020

10

0.09

0.35

0

0.15

0.43

5

0.20

0.50

10

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MO-178

Drawing No. C04-091

 2003 Microchip Technology Inc.

DS21711C-page 17

24AA01/24LC01B

APPENDIX A: REVISION HISTORY

Revision C

Corrections to Section 1.0, Electrical Characteristics.

Section 9.1, 24LC01B standard marking code.

DS21711C-page 18

 2003 Microchip Technology Inc.

24AA01/24LC01B

ON-LINE SUPPORT

SYSTEMS INFORMATION AND

UPGRADE HOT LINE

Microchip provides on-line support on the Microchip

World Wide Web site.

The Systems Information and Upgrade Line provides

system users a listing of the latest versions of all of

Microchip's development systems software products.

Plus, this line provides information on how customers

can receive the most current upgrade kits. The Hot Line

Numbers are:

The web site is used by Microchip as a means to make

files and information easily available to customers. To

view the site, the user must have access to the Internet

and a web browser, such as Netscape^®or Microsoft^®

Internet Explorer. Files are also available for FTP

download from our FTP site.

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

Connecting to the Microchip Internet

Web Site

042003

The Microchip web site is available at the following

URL:

www.microchip.com

The file transfer site is available by using an FTP

service to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of

services. Users may download files for the latest

Development Tools, Data Sheets, Application Notes,

User's Guides, Articles and Sample Programs. A vari-

ety of Microchip specific business information is also

available, including listings of Microchip sales offices,

distributors and factory representatives. Other data

available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked

Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to

Microchip Products

• Conferences for products, Development Systems,

technical information and more

• Listing of seminars and events

 2003 Microchip Technology Inc.

DS21711C-page 19

24AA01/24LC01B

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

24AA01/24LC01B

DS21711C

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21711C-page 20

 2003 Microchip Technology Inc.

24AA01/24LC01B

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

X

/XX

X

PART NO.

Device

Examples:

a) 24AA01-I/P: Industrial Temperature,1.8V

PDIP package

Temperature Package Lead Finish

Range

b) 24AA01-I/SN: Industrial Temperature,

1.8V, SOIC package

2

Device:

24AA01:

24AA01T:

=

1.8V, 1 Kbit I C™ Serial EEPROM

2

c)

24AA01T-I/OT: Industrial Temperature,

1.8V, SOT-23 package, tape and reel

1.8V, 1 Kbit I C Serial EEPROM

(Tape and Reel)

2

24LC01B:

=

2.5V, 1 Kbit I C Serial EEPROM

d) 24LC01B-I/P: Industrial Temperature,

2.5V, PDIP package

2

24LC01BT: = 2.5V, 1 Kbit I C Serial EEPROM

(Tape and Reel)

e) 24LC01B-E/SN: Extended Temperature,

2.5V, SOIC package

f)

24LC01BT-I/OT: Industrial Temperature,

1.8V, SOT-23 package, tape and reel

Temperature

Range:

I

E

= -40°C to +85°C

= -40°C to +125°C

g)

h)

24LC01B-I/PG: Industrial Temperature,

2.5V PDIP package, Pb-free

Package:

P

= Plastic DIP (300 mil body), 8-lead

24LC01BT-I/OTG: Industrial Temperature,

2.5V, SOT-23 package, tape and reel,

Pb-free

SN = Plastic SOIC (150 mil body), 8-lead

ST = Plastic TSSOP (4.4 mm), 8-lead

MS = Plastic Micro Small Outline (MSOP), 8-lead

OT = SOT-23, 5-lead (Tape and Reel only)

Lead finish Blank =Standard 63/37 SnPb

G

=Matte Tin (pure Sn)

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

2003 Microchip Technology Inc.

DS21711C-page21

24AA01/24LC01B

NOTES:

DS21711C-page 22

2003 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical com-

ponents in life support systems is not authorized except with

express written approval by Microchip. No licenses are con-

veyed, implicitly or otherwise, under any intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,

SEEVAL and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, microPort,

Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,

PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,

PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,

SmartSensor, SmartShunt, SmartTel and Total Endurance are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company’s quality system processes and

procedures are QS-9000 compliant for its

PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip’s quality system for the

design and manufacture of development

systems is ISO 9001 certified.

 2003 Microchip Technology Inc.

DS21711C-page 23

WORLDWIDE SALES AND SERVICE

Korea

AMERICAS

ASIA/PACIFIC

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or

82-2-558-5934

Corporate Office

Australia

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Suite 22, 41 Rawson Street

Epping 2121, NSW

Australia

Fax: 480-792-7277

Technical Support: 480-792-7627

Web Address: http://www.microchip.com

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Singapore

200 Middle Road

#07-02 Prime Centre

Singapore, 188980

Tel: 65-6334-8870 Fax: 65-6334-8850

China - Beijing

Unit 915

Bei Hai Wan Tai Bldg.

No. 6 Chaoyangmen Beidajie

Beijing, 100027, No. China

Tel: 86-10-85282100

Fax: 86-10-85282104

Atlanta

3780 Mansell Road, Suite 130

Alpharetta, GA 30022

Tel: 770-640-0034

Fax: 770-640-0307

Taiwan

Kaohsiung Branch

30F - 1 No. 8

Min Chuan 2nd Road

Kaohsiung 806, Taiwan

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Boston

China - Chengdu

2 Lan Drive, Suite 120

Westford, MA 01886

Tel: 978-692-3848

Fax: 978-692-3821

Rm. 2401-2402, 24th Floor,

Ming Xing Financial Tower

No. 88 TIDU Street

Chengdu 610016, China

Tel: 86-28-86766200

Taiwan

Taiwan Branch

11F-3, No. 207

Tung Hua North Road

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Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

Chicago

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Tel: 630-285-0071

Fax: 630-285-0075

Fax: 86-28-86766599

China - Fuzhou

Unit 28F, World Trade Plaza

No. 71 Wusi Road

Dallas

Fuzhou 350001, China

Tel: 86-591-7503506

Fax: 86-591-7503521

EUROPE

Austria

Durisolstrasse 2

A-4600 Wels

Austria

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

Regus Business Centre

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Tel: 972-818-7423

Fax: 972-818-2924

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza

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Tel: 852-2401-1200

Fax: 852-2401-3431

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250

China - Shanghai

Room 701, Bldg. B

Far East International Plaza

No. 317 Xian Xia Road

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Tel: 86-21-6275-5700

Fax: 86-21-6275-5060

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza

No. 5022 Binhe Road, Futian District

Shenzhen 518033, China

Tel: 86-755-82901380

Fax: 86-755-8295-1393

China - Shunde

Fax: 248-538-2260

Ballerup DK-2750 Denmark

Tel: 45-4420-9895 Fax: 45-4420-9910

Kokomo

France

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Kokomo, IN 46902

Tel: 765-864-8360

Fax: 765-864-8387

Parc d’Activite du Moulin de Massy

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91300 Massy, France

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Los Angeles

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Irvine, CA 92612

Tel: 949-263-1888

Fax: 949-263-1338

Germany

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D-85737 Ismaning, Germany

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Phoenix

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Tel: 480-792-7966

Fax: 480-792-4338

Room 401, Hongjian Building

No. 2 Fengxiangnan Road, Ronggui Town

Shunde City, Guangdong 528303, China

Tel: 86-765-8395507 Fax: 86-765-8395571

Italy

Via Quasimodo, 12

20025 Legnano (MI)

Milan, Italy

China - Qingdao

Rm. B505A, Fullhope Plaza,

No. 12 Hong Kong Central Rd.

Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

San Jose

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands

P. A. De Biesbosch 14

NL-5152 SC Drunen, Netherlands

Tel: 31-416-690399

2107 North First Street, Suite 590

San Jose, CA 95131

Tel: 408-436-7950

Fax: 408-436-7955

India

Toronto

Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada

Tel: 905-673-0699

Fax: 31-416-690340

United Kingdom

505 Eskdale Road

Winnersh Triangle

Fax: 905-673-6509

Wokingham

Berkshire, England RG41 5TU

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Benex S-1 6F

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

07/28/03

DS21711C-page 24

 2003 Microchip Technology Inc.


型号：	24FC01
厂家：	MICROCHIP
描述：	The Microchip Technology Inc. 24FC01 is a 1Kb Serial EEPROM capable of speeds up to 1MHz. The devi 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件：	总24页 (文件大小：325K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

24FC01 [MICROCHIP]

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