24LC014I/MC [MICROCHIP]
128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8;
| 型号： | 24LC014I/MC |
| 厂家： | 
MICROCHIP |
| 描述： | 128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
| 文件： | 总36页 (文件大小：791K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
24AA014/24LC014
1K I2C™ Serial EEPROM
Description:
Device Selection Table
Part
Number
VCC
Range
Max
Clock
Temp.
Range
The Microchip Technology Inc. 24AA014/24LC014 is a
1 Kbit Serial Electrically Erasable PROM with opera-
tion down to 1.7V. The device is organized as a single
block of 128 x 8-bit memory with a 2-wire serial inter-
face. Low-current design permits operation with typical
standby and active currents of only 1 A and 1 mA,
respectively. The device has a page write capability for
up to 16 bytes of data. Functional address lines allow
the connection of up to eight 24AA014/24LC014
devices on the same bus for up to 8 Kbits of contiguous
EEPROM memory. The device is available in the
standard 8-pin PDIP, 8-pin SOIC (150 mil), TSSOP, 2x3
DFN and TDFN and MSOP packages. The 24AA014/
24LC014 is also available in the 6-lead SOT-23
package.
24AA014 1.7V - 5.5V 400 kHz(1)
24LC014 2.5V - 5.5V 400 kHz
Note 1: 100 kHz for VCC < 2.5V
I
I, E
Features:
• Single-Supply with Operation down to 1.7V
• Low-Power CMOS Technology:
- 1 mA active current, typical
- 1 A standby current, typical at 5.5V
• Organized as a Single Block of 128 Bytes
(128 x 8)
Package Types
• Hardware Write Protection for Entire Array
• 2-Wire Serial Interface Bus, I2C™ Compatible
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Buffer for up to 16 Bytes
• Self-Timed Write Cycle (including auto-erase)
• 5 ms max. Write Cycle Time
PDIP/SOIC/TSSOP/MSOP
DFN/TDFN
1
A0
A1
VCC
WP
8
7
6
5
A0
1
8
VCC
2
3
4
A1
A2
2
3
4
7
6
5
WP
SCL
SDA
A2
VSS
SCL
SDA
VSS
• Address Lines allow up to Eight Devices on Bus
• 1,000,000 Erase/Write Cycles
SOT-23
• ESD Protection > 4,000V
VCC
A0
SCL
6
1
2
3
• Data Retention > 200 Years
• 8-Lead PDIP, SOIC, TSSOP, DFN, TDFN and
MSOP Packages
VSS
5
4
A1
SDA
• 6-Lead SOT-23 Package
• Pb-Free and RoHS Compliant
• Available for Extended Temperature Ranges:
Block Diagram
- Industrial (I):
-40°C to +85°C
-40°C to +125°C
WP
A0 A1 A2
- Automotive (E)
HV Generator
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
XDEC
SDA
SCL
Write-Protect
Circuitry
VCC
VSS
YDEC
Sense Amp.
R/W Control
2010 Microchip Technology Inc.
DS21809G-page 1
24AA014/24LC014
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC SPECIFICATIONS
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
DC CHARACTERISTICS
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
Symbol
No.
Characteristic
Min.
Typ.
Max.
Units
Conditions
—
A0, A1, A2, SCL, SDA
and WP pins
—
—
—
—
—
—
D1
D2
D3
VIH
High-level input voltage
Low-level input voltage
0.7 VCC
—
—
—
—
—
0.3 VCC
—
V
V
V
VIL
0.2 VCC for VCC < 2.5V
VHYS
Hysteresis of Schmitt
Trigger inputs
0.05 VCC
(Note)
D4
D5
D6
D7
VOL
ILI
Low-level output voltage
Input leakage current
Output leakage current
—
—
—
—
—
—
—
—
0.40
±1
V
IOL = 3.0 mA, VCC = 2.5V
VIN = VSS or VCC
A
A
pF
ILO
±1
VOUT = VSS or VCC
CIN,
Pin capacitance
10
VCC = 5.5V (Note)
COUT
(all inputs/outputs)
TA = 25°C, FCLK = 1 MHz
D8
ICC write Operating current
ICC read
—
—
0.1
3
1
mA
mA
VCC = 5.5V, SCL = 400 kHz
—
D9
0.05
D10
ICCS
Standby current
—
—
0.01
—
1
5
A
A
Industrial
Automotive
SDA = SCL = VCC
A0, A1, A2, WP = VSS
Note: This parameter is periodically sampled and not 100% tested.
DS21809G-page 2
2010 Microchip Technology Inc.
24AA014/24LC014
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
AC CHARACTERISTICS
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
Symbol
No.
Characteristic
Clock frequency
Min.
Max.
Units
Conditions
1
2
3
4
5
6
7
FCLK
THIGH
TLOW
TR
—
—
100
400
kHz
1.7V VCC < 1.8V
1.8V VCC 5.5V
Clock high time
4000
600
—
—
ns
ns
ns
ns
ns
ns
1.7V VCC < 1.8V
1.8V VCC 5.5V
Clock low time
4700
1300
—
—
1.7V VCC < 1.8V
1.8V VCC 5.5V
SDA and SCL rise time (Note 1)
SDA and SCL fall time (Note 1)
Start condition hold time
Start condition setup time
—
—
1000
300
1.7V VCC < 1.8V
1.8V VCC 5.5V
TF
—
—
1000
300
1.7V VCC < 1.8V
1.8V VCC 5.5V
THD:STA
TSU:STA
4000
600
—
—
1.7V VCC < 1.8V
1.8V VCC 5.5V
4700
600
—
—
1.7V VCC < 1.8V
1.8V VCC 5.5V
8
9
THD:DAT
TSU:DAT
Data input hold time
Data input setup time
0
—
ns
ns
(Note 2)
250
100
—
—
1.7V VCC < 1.8V
1.8V VCC 5.5V
10
11
12
13
14
TSU:STO
TSU:WP
THD:WP
TAA
Stop condition setup time
WP setup time
4000
600
—
—
ns
ns
ns
ns
ns
1.7V VCC < 1.8V
1.8V VCC 5.5V
4000
600
—
—
1.7V VCC < 1.8V
1.8V VCC 5.5V
WP hold time
4700
600
—
—
1.7V VCC < 1.8V
1.8V VCC 5.5V
Output valid from clock (Note 2)
—
—
3500
900
1.7V VCC < 1.8V
1.8V VCC 5.5V
TBUF
Bus free time: Time the bus must
be free before a new transmission
can start
4700
1300
—
—
1.7V VCC < 1.8V
1.8V VCC 5.5V
16
TSP
Input filter spike suppression
(SDA and SCL pins)
—
50
ns
(Note 1 and Note 3)
17
18
TWC
—
Write cycle time (byte or page)
Endurance
—
5
ms
—
1M
—
cycles 25°C, VCC = 5.5V, Block mode
(Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike
suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please
consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.
2010 Microchip Technology Inc.
DS21809G-page 3
24AA014/24LC014
FIGURE 1-1:
BUS TIMING DATA
5
4
D4
2
SCL
7
3
10
8
9
SDA
In
6
16
14
12
13
SDA
Out
(protected)
WP
11
(unprotected)
DS21809G-page 4
2010 Microchip Technology Inc.
24AA014/24LC014
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
SOIC
Name
PDIP
TSSOP DFN(1) TDFN(1) MSOP SOT-23
Description
A0
A1
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
5
4
Chip Address Input
Chip Address Input
Chip Address Input
Ground
A2
—
2
VSS
SDA
SCL
WP
VCC
3
Serial Address/Data I/O
Serial Clock
1
—
6
Write-Protect Input
+1.7V to 5.5V Power Supply
Note 1: The exposed pad on the DFN/TDFN packages can be connected to VSS or left floating.
2.1
A0, A1, A2 Chip Address Inputs
2.3
Serial Clock (SCL)
The A0, A1 and A2 inputs are used by the 24AA014/
24LC014 for multiple device operation. The levels on
these inputs are compared with the corresponding bits
in the slave address. The chip is selected if the com-
pare is true.
The SCL input is used to synchronize the data transfer
from and to the device.
2.4
Write-Protect (WP)
This pin must be connected to either VSS or VCC. If tied
to VSS, write operations are enabled. If tied to VCC,
write operations are inhibited but read operations are
not affected.
Up to eight devices may be connected to the same bus
by using different Chip Select bit combinations. These
inputs must be connected to either VCC or VSS.
For the SOT-23 devices up to four devices may be con-
nected to the same bus using different Chip Select bit
combinations.
3.0
FUNCTIONAL DESCRIPTION
The 24AA014/24LC014 supports a bidirectional, 2-wire
bus and data transmission protocol. A device that
sends data onto the bus is defined as transmitter, while
a device receiving data is defined as a receiver. The
bus has to be controlled by a master device which gen-
erates the Serial Clock (SCL), controls the bus access
and generates the Start and Stop conditions, while the
24AA014/24LC014 works as slave. Both master and
slave can operate as transmitter or receiver, but the
master device determines which mode is activated.
In most applications, the chip address inputs A0, A1
and A2 are hard-wired to logic ‘0’ or logic ‘1’. For
applications in which these pins are controlled by a
microcontroller or other programmable device, the chip
address pins must be driven to logic ‘0’ or logic ‘1’
before normal device operation can proceed.
2.2
Serial Data (SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an open-
drain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 k for 100 kHz, 2 kfor 400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2010 Microchip Technology Inc.
DS21809G-page 5
24AA014/24LC014
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is,
theoretically, unlimited, though only the last sixteen will
be stored when doing a write operation. When an over-
write does occur, it will replace data in a first-in first-out
fashion.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.5
Acknowledge
4.1
Bus Not Busy (A)
Each receiving device, when addressed, is required to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse, which is associated with this Acknowledge bit.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
Note:
The 24AA014/24LC014 does not generate
any Acknowledge bits if an internal
programming cycle is in progress.
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge-related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an Acknowledge bit on the last
byte that has been clocked out of the slave. In this case,
the slave must leave the data line high to enable the
master to generate the Stop condition (Figure 4-2).
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS
(A)
(B)
(C)
(D)
(C) (A)
SCL
SDA
Start
Condition
Stop
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
FIGURE 4-2:
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
2
3
4
5
6
7
8
9
1
2
3
SCL
SDA
Data from transmitter
Data from transmitter
Transmitter must release the SDA line at this point allowing
the Receiver to pull the SDA line low to acknowledge the
previous eight bits of data.
Receiver must release the SDA line at this
point so the Transmitter can continue
sending data.
DS21809G-page 6
2010 Microchip Technology Inc.
24AA014/24LC014
FIGURE 5-1:
CONTROL BYTE FORMAT
5.0
DEVICE ADDRESSING
Read/Write Bit
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code; for
the 24AA014/24LC014 this is set as ‘1010’ binary for
read and write operations. The next three bits of the
control byte are the Chip Select bits (A2, A1, A0). The
Chip Select bits allow the use of up to eight 24AA014/
24LC014 devices on the same bus and are used to
select which device is accessed. The Chip Select bits
in the control byte must correspond to the logic levels
on the corresponding A2, A1 and A0 pins for the device
to respond. These bits are in effect the three Most
Significant bits of the word address.
Chip Select
Control Code
Bits
S
1
0
1
0
A2 A1 A0 R/W ACK
Slave Address
Acknowledge Bit
Start Bit
5.1
Contiguous Addressing Across
Multiple Devices
For the SOT-23 package, the A2 address pin is not
available. During device addressing, the A2 Chip
Select bit should be set to ‘0’.
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 8K bits
by adding up to eight 24AA014/24LC014 devices on
the same bus. In this case, software can use A0 of the
control byte as address bit A8, A1 as address bit A9,
and A2 as address bit A10. It is not possible to
sequentially read across device boundaries.
The last bit of the control byte defines the operation to
be performed. When set to a ‘1’, a read operation is
selected. When set to a ‘0’, a write operation is
selected. Following the Start condition, the 24AA014/
24LC014 monitors the SDA bus, checking the control
byte being transmitted. Upon receiving a ‘1010’ code
and appropriate Chip Select bits, the slave device out-
puts an Acknowledge signal on the SDA line. Depend-
ing on the state of the R/W bit, the 24AA014/24LC014
will select a read or write operation.
For the SOT-23 package, up to four 24AA014/24LC014
devices can be added for up to 4K bits of address
space. In this case, software can use A0 of the control
byte as address bit A8, and A1 as address bit A9. It is
not possible to sequentially read across device bound-
aries.
2010 Microchip Technology Inc.
DS21809G-page 7
24AA014/24LC014
The higher order four bits of the word address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an inter-
nal write cycle will begin (Figure 6-2). If an attempt is
made to write to the protected portion of the array when
the hardware write protection has been enabled, the
device will acknowledge the command, but no data will
be written. The write cycle time must be observed even
if write protection is enabled.
6.0
6.1
WRITE OPERATIONS
Byte Write
Following the Start signal from the master, the device
code(4 bits), the Chip Select bits (3 bits) and the R/W
bit (which is a logic low) are placed onto the bus by the
master transmitter. The device will acknowledge this
control byte during the ninth clock pulse. The next byte
transmitted by the master is the word address and will
be written into the Address Pointer of the 24AA014/
24LC014. After receiving another Acknowledge signal
from the 24AA014/24LC014, the master device will
transmit the data word to be written into the addressed
memory location. The 24AA014/24LC014 acknowl-
edges again and the master generates a Stop
condition. This initiates the internal write cycle and the
24AA014/24LC014 will not generate Acknowledge
signals during this time (Figure 6-1). If an attempt is
made to write to the protected portion of the array when
the hardware write protection has been enabled, the
device will acknowledge the command, but no data will
be written. The write cycle time must be observed even
if write protection is enabled.
Note:
Page write operations are limited to writ-
ing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page size’) and end at addresses that
are integer multiples of [page size – 1]. If
a Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary that
the application software prevent page
write operations that would attempt to
cross a page boundary.
6.2
Page Write
The write-control byte, word address and the first data
byte are transmitted to the 24AA014/24LC014 in the
same way as in a byte write. But instead of generating
a Stop condition, the master transmits up to 15 addi-
tional data bytes to the 24AA014/24LC014 that are
temporarily stored in the on-chip page buffer and will be
written into the memory once the master has transmit-
ted a Stop condition. Upon receipt of each word, the
four lower order Address Pointer bits are internally
incremented by one.
6.3
Write Protection
The WP pin must be tied to VCC or VSS. If tied to VCC,
the entire array will be write-protected. If the WP pin is
tied to VSS, write operations to all address locations are
allowed.
The WP pin is not available on the SOT-23 package.
FIGURE 6-1:
BYTE WRITE
S
T
A
R
T
S
Bus Activity
Master
Control
Byte
Word
Address
T
Data
O
P
SDA Line
S
P
A
C
K
A
C
K
A
C
K
Bus Activity
DS21809G-page 8
2010 Microchip Technology Inc.
24AA014/24LC014
FIGURE 6-2:
PAGE WRITE
S
T
A
R
T
S
T
Bus Activity
Master
Control
Byte
Word
Address (n)
O
Data (n)
Data (n +1)
Data (n + 15)
P
P
SDA Line
S
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Bus Activity
2010 Microchip Technology Inc.
DS21809G-page 9
24AA014/24LC014
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If no
ACK is returned, the Start bit and control byte must be
re-sent. If the cycle is complete, the device will return
the ACK and the master can then proceed with the next
Read or Write command. See Figure 7-1 for a flow
diagram of this operation.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21809G-page 10
2010 Microchip Technology Inc.
24AA014/24LC014
Once the word address is sent, the master generates a
Start condition following the acknowledge. This
terminates the write operation, but not before the
internal Address Pointer is set. The master then issues
the control byte again but with the R/W bit set to a ‘1’.
The 24AA014/24LC014 will then issue an acknowl-
edge and transmits the eight-bit data word. The master
will not acknowledge the transfer, but does generate a
Stop condition and the 24AA014/24LC014 discontin-
ues transmission (Figure 8-2). After this command, the
internal address counter will point to the address
location following the one that was just read.
8.0
READ OPERATIONS
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24AA014/24LC014 contains an address counter
that maintains the address of the last word accessed,
internally incremented by one. Therefore, if the
previous read access was to address n, the next
current address read operation would access data from
address n + 1. Upon receipt of the slave address with
the R/W bit set to ‘1’, the 24AA014/24LC014 issues an
acknowledge and transmits the 8-bit data word. The
master will not acknowledge the transfer, but does
generate a Stop condition and the 24AA014/24LC014
discontinues transmission (Figure 8-1).
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24AA014/24LC014
transmits the first data byte, the master issues an
acknowledge as opposed to a Stop condition in a
random read. This directs the 24AA014/24LC014 to
transmit the next sequentially addressed 8-bit word
(Figure 8-3).
8.2
Random Read
To provide sequential reads the 24AA014/24LC014
contains an internal Address Pointer which is
incremented by one at the completion of each opera-
tion. This Address Pointer allows the entire memory
contents to be serially read during one operation. The
internal Address Pointer will automatically roll over
from address 07Fh to address 000h.
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is done by sending the word address to the
24AA014/24LC014 as part of a write operation.
FIGURE 8-1:
CURRENT ADDRESS READ
S
T
A
R
T
S
T
O
P
Bus Activity
Master
Control
Byte
Data
SDA Line
P
S
A
C
K
N
O
A
C
Bus Activity
K
2010 Microchip Technology Inc.
DS21809G-page 11
24AA014/24LC014
FIGURE 8-2:
RANDOM READ
S
T
S
T
A
R
T
S
T
O
P
Bus Activity
Master
Control
A
Word
Address (n)
Control
Byte
Data (n)
Byte
R
T
S
P
S
SDA Line
N
O
A
C
K
A
C
K
A
C
K
A
C
K
Bus Activity
FIGURE 8-3:
SEQUENTIAL READ
S
T
O
P
Bus Activity
Master
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
Data (n + X)
P
SDA Line
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
Bus Activity
DS21809G-page 12
2010 Microchip Technology Inc.
24AA014/24LC014
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
24LC014
XXXXXXXX
T/XXXNNN
I/P
12F
e
3
YYWW
0521
8-Lead SOIC (3.90 mm)
Example:
24LC014I
XXXXXXXT
e
3
XXXXYYWW
SN
0521
NNN
12F
Example:
8-Lead TSSOP
4L14
I521
12F
XXXX
TYWW
NNN
Example:
4L14I
8-Lead MSOP
XXXXT
52112F
YWWNNN
8-Lead 2x3 DFN
Example:
XXX
YWW
NN
2N4
521
12
8-Lead 2x3 TDFN
Example:
XXX
YWW
NN
AN4
521
12
2010 Microchip Technology Inc.
DS21809G-page 13
24AA014/24LC014
1st Line Marking Codes
DFN TDFN
I-Temp E-Temp I-Temp E-Temp
Part Number
SOT-23
TSSOP
MSOP
I-Temp
E-Temp
24AA014
24LC014
Note:
4A14
4L14
4A14T
4L14T
2N1
2N4
—
AN1
AN4
—
HJNN
—
2N5
AN5
HGNN
HHNN
T = Temperature grade (I, E)
Example:
6-Lead SOT-23
HGEC
XXNN
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
YY
WW
NNN
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Note:
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21809G-page 14
2010 Microchip Technology Inc.
24AA014/24LC014
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢐꢁꢂꢋꢐꢃꢆꢑꢇꢒꢆꢓꢆꢔꢕꢕꢆꢖꢋꢈꢆꢗꢘꢅꢙꢆꢚꢇꢍꢏꢇꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
ꢯꢄꢃꢏꢇ
ꢰꢱꢝꢲꢠꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢶ
ꢁꢀꢣꢣꢅꢩꢛꢝ
ꢷ
ꢁꢀꢞꢣ
ꢷ
ꢁꢞꢀꢣ
ꢁꢙꢨꢣ
ꢁꢞꢺꢨ
ꢁꢀꢞꢣ
ꢁꢣꢀꢣ
ꢁꢣꢺꢣ
ꢁꢣꢀꢶ
ꢷ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢫꢕꢡꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢩꢉꢇꢌꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢛꢘꢕꢈꢊꢋꢌꢐꢅꢏꢕꢅꢛꢘꢕꢈꢊꢋꢌꢐꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢱ
ꢌ
ꢦ
ꢦꢙ
ꢦꢀ
ꢠ
ꢠꢀ
ꢟ
ꢳ
ꢖ
ꢔꢀ
ꢔ
ꢌꢩ
ꢷ
ꢁꢙꢀꢣ
ꢁꢀꢸꢨ
ꢷ
ꢁꢀꢀꢨ
ꢁꢣꢀꢨ
ꢁꢙꢸꢣ
ꢁꢙꢥꢣ
ꢁꢞꢥꢶ
ꢁꢀꢀꢨ
ꢁꢣꢣꢶ
ꢁꢣꢥꢣ
ꢁꢣꢀꢥ
ꢷ
ꢁꢞꢙꢨ
ꢁꢙꢶꢣ
ꢁꢥꢣꢣ
ꢁꢀꢨꢣ
ꢁꢣꢀꢨ
ꢁꢣꢻꢣ
ꢁꢣꢙꢙ
ꢁꢥꢞꢣ
ꢫꢃꢡꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢯꢡꢡꢌꢐꢅꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢳꢕꢗꢌꢐꢅꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢼꢕꢗꢅꢛꢡꢉꢖꢃꢄꢜꢅꢅꢚ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢚꢅꢛꢃꢜꢄꢃꢎꢃꢖꢉꢄꢏꢅꢝꢘꢉꢐꢉꢖꢏꢌꢐꢃꢇꢏꢃꢖꢁ
ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢁꢣꢀꢣꢤꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢥꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪꢅꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢀꢶꢩ
2010 Microchip Technology Inc.
DS21809G-page 15
24AA014/24LC014
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21809G-page 16
2010 Microchip Technology Inc.
24AA014/24LC014
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc.
DS21809G-page 17
24AA014/24LC014
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢑꢞꢜꢒꢆꢓꢆꢜꢄꢠꢠꢘꢡꢢꢆꢔꢣꢤꢕꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢞꢟꢏꢥꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
DS21809G-page 18
2010 Microchip Technology Inc.
24AA014/24LC014
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢦꢧꢋꢐꢆꢞꢧꢠꢋꢐꢨꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢑꢞꢦꢒꢆꢓꢆꢩꢣꢩꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢦꢞꢞꢟꢇꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
ꢯꢄꢃꢏꢇ
ꢢꢰꢳꢳꢰꢢꢠꢫꢠꢼꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢱ
ꢌ
ꢶ
ꢣꢁꢺꢨꢅꢩꢛꢝ
ꢴꢆꢌꢐꢉꢊꢊꢅꢲꢌꢃꢜꢘꢏ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢛꢏꢉꢄꢋꢕꢎꢎꢅ
ꢦ
ꢷ
ꢣꢁꢶꢣ
ꢣꢁꢣꢨ
ꢷ
ꢀꢁꢣꢣ
ꢷ
ꢀꢁꢙꢣ
ꢀꢁꢣꢨ
ꢣꢁꢀꢨ
ꢦꢙ
ꢦꢀ
ꢠ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢺꢁꢥꢣꢅꢩꢛꢝ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢳꢌꢄꢜꢏꢘ
ꢬꢕꢕꢏꢅꢳꢌꢄꢜꢏꢘ
ꢠꢀ
ꢟ
ꢳ
ꢥꢁꢞꢣ
ꢙꢁꢸꢣ
ꢣꢁꢥꢨ
ꢥꢁꢥꢣ
ꢞꢁꢣꢣ
ꢣꢁꢺꢣ
ꢥꢁꢨꢣ
ꢞꢁꢀꢣ
ꢣꢁꢻꢨ
ꢬꢕꢕꢏꢡꢐꢃꢄꢏ
ꢬꢕꢕꢏꢅꢦꢄꢜꢊꢌ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢳꢀ
ꢀ
ꢀꢁꢣꢣꢅꢼꢠꢬ
ꢣꢾ
ꢣꢁꢣꢸ
ꢣꢁꢀꢸ
ꢷ
ꢷ
ꢷ
ꢶꢾ
ꢖ
ꢔ
ꢣꢁꢙꢣ
ꢣꢁꢞꢣ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢣꢁꢀꢨꢅꢑꢑꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢼꢠꢬꢪ ꢼꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢡꢈꢐꢡꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢶꢺꢩ
2010 Microchip Technology Inc.
DS21809G-page 19
24AA014/24LC014
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21809G-page 20
2010 Microchip Technology Inc.
24AA014/24LC014
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢪꢋꢌꢠꢘꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢇꢄꢌꢨꢄꢫꢃꢆꢑꢪꢞꢒꢆꢚꢪꢞꢟꢇꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
D
N
E
E1
NOTE 1
2
b
1
e
c
φ
A2
A
L
L1
A1
ꢯꢄꢃꢏꢇ
ꢢꢰꢳꢳꢰꢢꢠꢫꢠꢼꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢱ
ꢌ
ꢶ
ꢣꢁꢺꢨꢅꢩꢛꢝ
ꢴꢆꢌꢐꢉꢊꢊꢅꢲꢌꢃꢜꢘꢏ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢛꢏꢉꢄꢋꢕꢎꢎꢅ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢬꢕꢕꢏꢅꢳꢌꢄꢜꢏꢘ
ꢦ
ꢷ
ꢣꢁꢻꢨ
ꢣꢁꢣꢣ
ꢷ
ꢣꢁꢶꢨ
ꢀꢁꢀꢣ
ꢣꢁꢸꢨ
ꢣꢁꢀꢨ
ꢦꢙ
ꢦꢀ
ꢠ
ꢠꢀ
ꢟ
ꢷ
ꢥꢁꢸꢣꢅꢩꢛꢝ
ꢞꢁꢣꢣꢅꢩꢛꢝ
ꢞꢁꢣꢣꢅꢩꢛꢝ
ꢣꢁꢺꢣ
ꢳ
ꢣꢁꢥꢣ
ꢣꢁꢶꢣ
ꢬꢕꢕꢏꢡꢐꢃꢄꢏ
ꢬꢕꢕꢏꢅꢦꢄꢜꢊꢌ
ꢳꢀ
ꢀ
ꢣꢁꢸꢨꢅꢼꢠꢬ
ꢷ
ꢣꢾ
ꢶꢾ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢖ
ꢔ
ꢣꢁꢣꢶ
ꢣꢁꢙꢙ
ꢷ
ꢷ
ꢣꢁꢙꢞ
ꢣꢁꢥꢣ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢣꢁꢀꢨꢅꢑꢑꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢼꢠꢬꢪ ꢼꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢡꢈꢐꢡꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢀꢀꢀꢩ
2010 Microchip Technology Inc.
DS21809G-page 21
24AA014/24LC014
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21809G-page 22
2010 Microchip Technology Inc.
24AA014/24LC014
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢬꢈꢄꢊꢢꢆꢜꢘꢆꢂꢃꢄꢅꢆꢇꢄꢌꢨꢄꢫꢃꢆꢑꢪꢥꢒꢆꢓꢆꢭꢮꢔꢮꢕꢣꢤꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢍꢬꢜꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
NOTE 2
A3
A1
ꢯꢄꢃꢏꢇ
ꢢꢰꢳꢳꢰꢢꢠꢫꢠꢼꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢶ
ꢣꢁꢨꢣꢅꢩꢛꢝ
ꢣꢁꢸꢣ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢲꢌꢃꢜꢘꢏ
ꢛꢏꢉꢄꢋꢕꢎꢎꢅ
ꢝꢕꢄꢏꢉꢖꢏꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢱ
ꢌ
ꢦ
ꢦꢀ
ꢦꢞ
ꢟ
ꢣꢁꢶꢣ
ꢣꢁꢣꢣ
ꢀꢁꢣꢣ
ꢣꢁꢣꢨ
ꢣꢁꢣꢙ
ꢣꢁꢙꢣꢅꢼꢠꢬ
ꢙꢁꢣꢣꢅꢩꢛꢝ
ꢞꢁꢣꢣꢅꢩꢛꢝ
ꢷ
ꢷ
ꢣꢁꢙꢨ
ꢠ
ꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋꢅꢳꢌꢄꢜꢏꢘ
ꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋꢅꢹꢃꢋꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢅꢹꢃꢋꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢅꢳꢌꢄꢜꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢽꢏꢕꢽꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋ
ꢟꢙ
ꢠꢙ
ꢔ
ꢳ
U
ꢀꢁꢞꢣ
ꢀꢁꢨꢣ
ꢣꢁꢙꢣ
ꢣꢁꢞꢣ
ꢣꢁꢙꢣ
ꢀꢁꢨꢨ
ꢀꢁꢻꢨ
ꢣꢁꢞꢣ
ꢣꢁꢨꢣ
ꢷ
ꢣꢁꢥꢣ
ꢷ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢂꢉꢖꢭꢉꢜꢌꢅꢑꢉꢒꢅꢘꢉꢆꢌꢅꢕꢄꢌꢅꢕꢐꢅꢑꢕꢐꢌꢅꢌꢍꢡꢕꢇꢌꢋꢅꢏꢃꢌꢅꢔꢉꢐꢇꢅꢉꢏꢅꢌꢄꢋꢇꢁ
ꢞꢁ ꢂꢉꢖꢭꢉꢜꢌꢅꢃꢇꢅꢇꢉꢗꢅꢇꢃꢄꢜꢈꢊꢉꢏꢌꢋꢁ
ꢥꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢼꢠꢬꢪ ꢼꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢡꢈꢐꢡꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢀꢙꢞꢝ
2010 Microchip Technology Inc.
DS21809G-page 23
24AA014/24LC014
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢬꢈꢄꢊꢢꢆꢜꢘꢆꢂꢃꢄꢅꢆꢇꢄꢌꢨꢄꢫꢃꢆꢑꢪꢥꢒꢆꢓꢆꢭꢮꢔꢮꢕꢣꢤꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢍꢬꢜꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
DS21809G-page 24
2010 Microchip Technology Inc.
24AA014/24LC014
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc.
DS21809G-page 25
24AA014/24LC014
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21809G-page 26
2010 Microchip Technology Inc.
24AA014/24LC014
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢬꢈꢄꢊꢢꢆꢜꢘꢆꢂꢃꢄꢅꢆꢇꢄꢌꢨꢄꢫꢃꢆꢑꢪꢜꢒꢆꢓꢆꢭꢮꢔꢮꢕꢣꢯꢰꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢦꢍꢬꢜꢛ
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2010 Microchip Technology Inc.
DS21809G-page 27
24AA014/24LC014
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DS21809G-page 28
2010 Microchip Technology Inc.
24AA014/24LC014
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc.
DS21809G-page 29
24AA014/24LC014
APPENDIX A: REVISION HISTORY
Revision B
Corrections to Section 1.0, Electrical Characteristics.
Revision C
Added DFN package.
Revision D (10/2007)
Add Pb-free to Features; Revise Section 8.3; Replace
Package Drawings; Update Product ID System.
Revision E (04/2008)
Replaced Package Drawings; Added TDFN package;
Revised Product ID section.
Revision F (10/2009)
Added 6-Lead SOT-23 Package; Removed Pin
Function Table; Revised Section 2.0; Revised Section
6.3.
Revision G (08/2010)
Revised Device Selection Table; Added Automotive
Temp; Revised Tables 1-1, 1-2, Figure 1-1, Package
Marking Drawings and Product ID System.
DS21809G-page 30
2010 Microchip Technology Inc.
24AA014/24LC014
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://support.microchip.com
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
2010 Microchip Technology Inc.
DS21809G-page 31
24AA014/24LC014
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
RE:
Technical Publications Manager
Reader Response
Total Pages Sent ________
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Literature Number: DS21809G
Application (optional):
Would you like a reply?
Y
N
Device: 24AA014/24LC014
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21809G-page 32
2010 Microchip Technology Inc.
24AA014/24LC014
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) 24AA014-I/P: Industrial Temperature,
1.7V, PDIP package.
Temperature Package
Range
b) 24AA014-I/SN: Industrial Temperature,
1.7V, SOIC Package.
c) 24AA014T-I/ST: Industrial Temperature,
1.7V, TSSOP Package, Tape and Reel.
Device:
24AA014: 1.7V, 1 Kbit Addressable Serial EEPROM
24AA014T: 1.7V, 1 Kbit Addressable Serial EEPROM
(Tape and Reel)
24LC014: 2.5V, 1 Kbit Addressable Serial EEPROM
24LC014T: 2.5V, 1 Kbit Addressable Serial EEPROM
(Tape and Reel)
a) 24LC014-I/P: Industrial Temperature,
2.5V, PDIP Package.
b) 24LC014T-I/SN: Industrial Temperature,
2.5V, SOIC Package, Tape and Reel.
c) 24LC014T-I/MS: Industrial Temperature,
2.5V, MSOP Package, Tape and Reel.
Temperature Range:
Package:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
OT
=
Plastic Small Outline (SOT-23), (Tape & Reel
only), 6-lead
P
SN
ST
MS
MC
MNY
=
=
=
=
=
=
Plastic DIP, (300 mil Body), 8-lead
Plastic SOIC, (3.90 mm Body)
TSSOP, 8-lead
MSOP, 8-lead
2x3 DFN, 8-lead
a) 24LC014T-E/MNY: Automotive Tempera-
ture, 2.5V, TDFN Package, Tape and
Reel.
b) 24LC014-E/MS: Automotive Tempera-
ture, 2.5V, MSOP Package.
(1)
Plastic Dual Flat (TDFN), No lead package,
2x3 mm body, 8-lead (Tape & Reel only)
Note 1: “Y” indicates a Nickel, Palladium, Gold (NiPdAu) finish.
2010 Microchip Technology Inc.
DS21809G-page 33
24AA014/24LC014
NOTES:
DS21809G-page 34
2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
PIC logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-464-3
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2010 Microchip Technology Inc.
DS21809G-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
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Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
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Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
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Tel: 678-957-9614
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Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
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Boston
China - Chengdu
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Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
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Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
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Tel: 216-447-0464
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Tel: 86-25-8473-2460
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Malaysia - Penang
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Fax: 60-4-227-4068
Dallas
Addison, TX
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Tel: 86-532-8502-7355
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Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
China - Shanghai
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Tel: 65-6334-8870
Fax: 65-6334-8850
Farmington Hills, MI
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Fax: 248-538-2260
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Fax: 886-7-330-9305
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
08/04/10
DS21809G-page 36
2010 Microchip Technology Inc.
相关型号：
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SI9137DB
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