24LCS52IPG [MICROCHIP]
2K 2.2V I2C Serial EEPROM with Software Write-Protect; 2K 2.2V I2C串行EEPROM与软件写保护
| 型号： | 24LCS52IPG |
| 厂家： | 
MICROCHIP |
| 描述： | 2K 2.2V I2C Serial EEPROM with Software Write-Protect |
| 文件： | 总22页 (文件大小：330K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
24AA024/24LC024/24AA025/24LC025
2K I2C™ Serial EEPROM
Description
Device Selection Table
The Microchip Technology Inc. 24AA024/24LC024/
24AA025/24LC025 is a 2 Kbit Serial Electrically
Erasable PROM with a voltage range of 1.8V to 5.5V.
Part
Number
Max
Clock
Temp. Write
Range Protect
VCC Range
24AA024 1.8V - 5.5V 400 KHz(1)
24AA025 1.8V - 5.5V 400 KHz(1)
24LC024 2.5V - 5.5V 400 KHz
24LC025 2.5V - 5.5V 400 KHz
Note 1: 100 KHz for VCC < 2.5V
I
I
I
I
Yes
No
The device is organized as a single block of 256 x 8-bit
memory with a 2-wire serial interface. Low current
design permits operation with typical standby and
active currents of only 1 µA and 1 mA, respectively.
The device has a page write capability for up to 16
bytes of data. Functional address lines allow the
connection of up to eight 24AA024/24LC024/
24AA025/24LC025 devices on the same bus for up to
16K bits of contiguous EEPROM memory. The device
is available in the standard 8-pin PDIP, 8-pin SOIC
(150 mil), TSSOP and MSOP packages.
Yes
No
Features
• Single supply with operation from 1.8V to 5.5V
• Low-power CMOS technology
Package Types
- 1 mA active current typical
- 1 µA standby current typical at 5.5V
PDIP/SOIC
A0
1
8
VCC
• Organized as a single block of 256 bytes (256 x 8)
A1
A2
2
3
4
7
6
5
WP*
SCL
SDA
• Hardware write protection for entire array
(24XX024)
• 2-wire serial interface bus, I2C™ compatible
• 100 kHz and 400 kHz clock compatibility
• Page write buffer for up to 16 bytes
• Self-timed write cycle (including auto-erase)
• 10 ms max. write cycle time
VSS
TSSOP/MSOP
1
8
A0
A1
A2
VCC
WP*
SCL
SDA
2
3
4
7
6
5
• Address lines allow up to eight devices on bus
• 1,000,000 erase/write cycles
VSS
• ESD protection > 4,000V
Block Diagram
• Data retention > 200 years
WP*
A0 A1 A2
• 8-pin PDIP, SOIC, TSSOP and MSOP packages
• Available for extended temperature ranges
- Industrial (I): -40°C to +85°C
HV Generator
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
XDEC
Pin Function Table
Name
Function
SDA
SCL
VSS
Ground
Write-Protect
Circuitry
SDA
Serial Data
Serial Clock
VCC
YDEC
SCL
VSS
VCC
1.8V to 5.5V Power Supply
Chip Selects
Sense Amp.
R/W Control
A0, A1, A2
WP
Hardware Write-Protect (24LC024)
Note:
*WP pin available only on 24XX024. This pin
has no internal connection on 24XX025.
2004 Microchip Technology Inc.
DS21210G-page 1
24AA024/24LC024/24AA025/24LC025
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All parameters apply across the
specified operating ranges unless
otherwise noted.
VCC = 1.8V to 5.5V
Industrial (I): TA = -40°C to +85°C
Parameter
Symbol
Min.
Max.
Units
Conditions
SCL and SDA pins:
High-level input voltage
VIH
VIL
0.7 VCC
—
—
0.3 VCC
—
V
V
V
V
—
Low-level input voltage
—
Hysteresis of Schmitt Trigger inputs VHYS
0.05 VCC
—
(Note)
Low-level output voltage
VOL
0.40
IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, VCC = 2.5V
Input leakage current
ILI
—
—
—
±1
±1
10
µA
µA
pF
VIN = 0.1V to 5.5V, WP = VSS
VOUT = 0.1V to 5.5V
Output leakage current
ILO
Pin capacitance (all inputs/outputs)
CIN, COUT
VCC = 5.0V (Note)
TA = 25°C, f = 1 MHz
Operating current
Standby current
ICC Read
ICC Write
ICCS
—
—
—
1
3
1
mA
mA
µA
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V
VCC = 5.5V, SDA = SCL = VCC
WP = VSS, A0, A1, A2 = VSS
Note:
This parameter is periodically sampled and not 100% tested.
DS21210G-page 2
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
TABLE 1-2:
AC CHARACTERISTICS
VCC = 1.8V to 5.5V
Industrial (I):
All parameters apply across the specified
operating ranges unless otherwise noted.
TA = -40°C to +85°C
Vcc = 2.5V - 5.5V
FAST MODE
STD MODE
Parameter
Symbol
Units
Remarks
Min.
Max.
Min.
Max.
Clock frequency
FCLK
THIGH
TLOW
TR
—
4000
4700
—
100
—
—
600
1300
—
400
—
kHz
ns
—
Clock high time
—
Clock low time
—
—
ns
—
SDA and SCL rise time
SDA and SCL fall time
Start condition hold time
1000
300
—
300
300
—
ns
(Note 1)
(Note 1)
TF
—
—
ns
THD:STA
4000
600
ns
After this period the first
clock pulse is generated
Start condition setup time
TSU:STA
4700
—
600
—
ns
Only relevant for repeated
Start condition
Data input hold time
Data input setup time
Stop condition setup time
Output valid from clock
Bus free time
THD:DAT
TSU:DAT
TSU:STO
TAA
0
—
—
0
—
—
ns
ns
ns
ns
ns
(Note 2)
—
250
4000
—
100
600
—
—
—
—
3500
—
900
—
(Note 2)
TBUF
4700
1300
Time the bus must be free
before a new transmission
can start
Output fall time from VIH
minimum to VIL maximum
TOF
—
—
250
50
20 +0.1
CB
250
50
ns
ns
(Note 1), CB ≤ 100 pF
Input filter spike suppression TSP
(SDA and SCL pins)
—
(Note 3)
Write-cycle time
Endurance
TWC
—
10
—
—
10
—
ms Byte or Page mode
1M
1M
cycles 25°C, (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be downloaded at
www.microchip.com.
FIGURE 1-1:
BUS TIMING DATA
THIGH
TF
TR
SCL
TSU:STA
TLOW
THD:DAT
TSU:DAT
TSU:STO
SDA
IN
THD:STA
TSP
TBUF
TAA
SDA
OUT
2004 Microchip Technology Inc.
DS21210G-page 3
24AA024/24LC024/24AA025/24LC025
2.0
2.1
PIN DESCRIPTIONS
SDA Serial Data
3.0
FUNCTIONAL DESCRIPTION
The 24AA024/24LC024/24AA025/24LC025 supports
a bidirectional, 2-wire bus and data transmission
protocol. A device that sends data onto the bus is
defined as transmitter, while a device receiving data
is defined as receiver. The bus has to be controlled
by a master device which generates the serial clock
(SCL), controls the bus access and generates the
Start and Stop conditions, while the 24AA024/
24LC024/24AA025/24LC025 works as slave. Both
master and slave can operate as transmitter or
receiver, but the master device determines which
mode is activated.
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open-drain
terminal, therefore the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2.2
SCL Serial Clock
The SCL input is used to synchronize the data transfer
from and to the device.
2.3
A0, A1, A2
The levels on the A0, A1 and A2 inputs are compared
with the corresponding bits in the slave address. The
chip is selected if the compare is true.
Up to eight 24AA024/24LC024/24AA025/24LC025
devices may be connected to the same bus by using
different Chip Select bit combinations. These inputs
must be connected to either VCC or VSS.
2.4
WP (24XX024 Only)
WP is the hardware write-protect pin. It must be tied to
VCC or VSS. If tied to Vcc, hardware write protection is
enabled. If WP is tied to Vss, the hardware write
protection is disabled. Note that the WP pin is available
only on the 24XX024. This pin is not internally
connected on the 24LC025.
2.5
Noise Protection
The 24AA024/24LC024/24AA025/24LC025 employs a
VCC threshold detector circuit which disables the inter-
nal erase/write logic if the VCC is below 1.5 volts at
nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
DS21210G-page 4
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is,
theoretically, unlimited, (though only the last sixteen will
be stored when performing a write operation). When an
overwrite does occur, it will replace data in a first-in
first-out fashion.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.5
Acknowledge
4.1
Bus Not Busy (A)
Each receiving device, when addressed, is required to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
Note:
The 24AA024/24LC024/24AA025/
24LC025 does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
4.3
Stop Data Transfer (C)
The device that acknowledges has to pull down the SDA
line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of
the acknowledge-related clock pulse. Of course, setup
and hold times must be taken into account. A master
must signal an end of data to the slave by not generating
an Acknowledge bit on the last byte that has been
clocked out of the slave. In this case, the slave must
leave the data line high to enable the master to generate
the Stop condition (Figure 4-2).
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS
(A) (B)
(C)
(D)
(C) (A)
SCL
SDA
Start
Condition
Stop
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
FIGURE 4-2:
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
2
3
4
5
6
7
8
9
1
2
3
SCL
SDA
Data from transmitter
Data from transmitter
Transmitter must release the SDA line at this point allowing
the Receiver to pull the SDA line low to acknowledge the
previous eight bits of data.
Receiver must release the SDA line at this
point so the Transmitter can continue
sending data.
2004 Microchip Technology Inc.
DS21210G-page 5
24AA024/24LC024/24AA025/24LC025
FIGURE 5-1:
CONTROL BYTE FORMAT
5.0
DEVICE ADDRESSING
Read/Write Bit
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code. For
the 24AA024/24LC024/24AA025/24LC025, this is set
as ‘1010’ binary for read and write operations. The next
three bits of the control byte are the Chip Select bits
(A2, A1, A0). The Chip Select bits allow the use of up
Chip Select
Bits
Control Code
S
1
0
1
0
A2 A1 A0 R/W ACK
to
eight
24AA024/24LC024/24AA025/24LC025
Slave Address
Acknowledge Bit
devices on the same bus and are used to select which
device is accessed. The Chip Select bits in the control
byte must correspond to the logic levels on the corre-
sponding A2, A1 and A0 pins for the device to respond.
These bits are in effect the three Most Significant bits of
the word address.
Start Bit
5.1
Contiguous Addressing Across
Multiple Devices
The last bit of the control byte defines the operation to
be performed. When set to a one, a read operation is
selected. When set to a zero, a write operation is
selected. Following the Start condition, the 24AA024/
24LC024/24AA025/24LC025 monitors the SDA bus
checking the control byte being transmitted. Upon
receiving a ‘1010’ code and appropriate Chip Select
bits, the slave device outputs an Acknowledge signal
on the SDA line. Depending on the state of the R/W bit,
the 24AA024/24LC024/24AA025/24LC025 will select a
read or write operation.
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 16K bits
by adding up to eight 24AA024/24LC024/24AA025/
24LC025 devices on the same bus. In this case, soft-
ware can use A0 of the control byte as address bit A8,
A1 as address bit A9 and A2 as address bit A10. It is
not possible to sequentially read across device
boundaries.
DS21210G-page 6
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
The higher-order four bits of the word address remain
6.0
6.1
WRITE OPERATIONS
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte-write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 6-2). If an attempt
is made to write to the protected portion of the array
when the hardware write protection has been enabled,
the device will acknowledge the command but no data
will be written. The write cycle time must be observed
even if write protection is enabled.
Byte Write
Following the Start signal from the master, the device
code(4 bits), the Chip Select bits (3 bits) and the R/W
bit (which is a logic-low) is placed onto the bus by the
master transmitter. The device will acknowledge this
control byte during the ninth clock pulse. The next byte
transmitted by the master is the word address and will
be written into the address pointer of the 24AA024/
24LC024/24AA025/24LC025. After receiving another
Acknowledge signal from the 24AA024/24LC024/
24AA025/24LC025, the master device will transmit the
data word to be written into the addressed memory
location. The 24AA024/24LC024/24AA025/24LC025
acknowledges again and the master generates a Stop
condition. This initiates the internal write cycle and, dur-
ing this time, the 24AA024/24LC024/24AA025/
24LC025 will not generate Acknowledge signals
(Figure 6-1). If an attempt is made to write to the
protected portion of the array when the hardware write
protection (24XX024 only) has been enabled, the
device will acknowledge the command but no data will
be written. The write cycle time must be observed even
if write protection is enabled.
Note:
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size - 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
6.2
Page Write
The write control byte, word address and the first data
byte are transmitted to the 24AA024/24LC024/
24AA025/24LC025 in the same way as in a byte write.
However, instead of generating a Stop condition, the
master transmits up to 15 additional data bytes to the
24AA024/24LC024/24AA025/24LC025, which are
temporarily stored in the on-chip page buffer and will be
written into the memory once the master has transmit-
ted a Stop condition. Upon receipt of each word, the
four lower-order address pointer bits are internally
incremented by one.
6.3
Write Protection
The WP pin (available on 24XX024 only) must be tied
to VCC or VSS. If tied to VCC, the entire array will be
write-protected. If the WP pin is tied to VSS, write
operations to all address locations are allowed.
FIGURE 6-1:
BYTE WRITE
S
T
A
R
T
S
BUS ACTIVITY
MASTER
CONTROL
BYTE
WORD
ADDRESS
T
DATA
O
P
SDA LINE
S
P
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
FIGURE 6-2:
PAGE WRITE
S
T
A
R
T
S
T
BUS ACTIVITY
MASTER
CONTROL
BYTE
WORD
O
P
ADDRESS (n)
DATA (n)
DATA (n +1)
DATA (n + 15)
SDA LINE
S
P
A
A
A
C
K
A
C
K
A
BUS ACTIVITY
C
C
C
K
K
K
2004 Microchip Technology Inc.
DS21210G-page 7
24AA024/24LC024/24AA025/24LC025
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle, with ACK
polling being initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If no
ACK is returned, the Start bit and control byte must be
re-sent. If the cycle is complete, the device will return
the ACK and the master can then proceed with the next
Read or Write command. See Figure 7-1 for a flow
diagram of this operation.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21210G-page 8
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
sent, the master generates a Start condition following
8.0
READ OPERATIONS
the acknowledge. This terminates the write operation,
but not before the internal address pointer is set. The
master then issues the control byte again, but with the
R/W bit set to a ‘1’. The 24AA024/24LC024/24AA025/
24LC025 will then issue an acknowledge and transmits
the eight bit data word. The master will not acknowl-
edge the transfer but does generate a Stop condition
and the 24AA024/24LC024/24AA025/24LC025 dis-
continues transmission (Figure 8-2). After this com-
mand, the internal address counter will point to the
address location following the one that was just read.
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24AA024/24LC024/24AA025/24LC025 contains
an address counter that maintains the address of the
last word accessed, internally incremented by one.
Therefore, if the previous read access was to address
n, the next current address read operation would
access data from address n + 1. Upon receipt of the
slave address with the R/W bit set to ‘1’, the 24AA024/
24LC024/24AA025/24LC025 issues an acknowledge
and transmits the 8-bit data word. The master will not
acknowledge the transfer but does generate a Stop
condition and the 24AA024/24LC024/24AA025/
24LC025 discontinues transmission (Figure 8-1).
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24AA024/24LC024/
24AA025/24LC025 transmits the first data byte, the
master issues an acknowledge (as opposed to a Stop
condition in a random read). This directs the 24AA024/
24LC024/24AA025/24LC025 to transmit the next
sequentially-addressed 8-bit word (Figure 8-3).
To provide sequential reads, the 24AA024/24LC024/
24AA025/24LC025 contains an internal address
pointer that is incremented by one upon completion of
each operation. This address pointer allows the entire
memory contents to be serially read during one
operation. The internal address pointer will
automatically roll over from address 0FFh to address
000h.
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24AA024/24LC024/24AA025/24LC025
as part of a write operation. Once the word address is
FIGURE 8-1:
CURRENT ADDRESS READ
S
T
S
T
O
P
BUS ACTIVITY
MASTER
CONTROL
A
R
T
DATA
BYTE
SDA LINE
P
S
N
O
A
C
K
A
C
K
BUS ACTIVITY
2004 Microchip Technology Inc.
DS21210G-page 9
24AA024/24LC024/24AA025/24LC025
FIGURE 8-2:
RANDOM READ
S
T
S
T
A
R
T
S
T
BUS ACTIVITY
CONTROL
WORD
ADDRESS (n)
CONTROL
BYTE
A
R
T
DATA (n)
MASTER
BYTE
O
P
S
P
S
SDA LINE
N
O
A
C
K
A
C
K
A
A
C
K
C
K
BUS ACTIVITY
FIGURE 8-3:
SEQUENTIAL READ
S
T
BUS ACTIVITY
MASTER
CONTROL
BYTE
DATA (n)
DATA (n + 1)
DATA (n + 2)
DATA (n + X)
O
P
P
SDA LINE
N
A
C
K
A
C
K
A
A
O
C
C
BUS ACTIVITY
K
K
A
C
K
DS21210G-page 10
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
T/XXXNNN
24LC024
I/P13F
YYWW
0319
8-Lead SOIC (150 mil)
Example:
24LC024
I/SN0319
XXXXXXXX
T/XXYYWW
13F
NNN
Example:
8-Lead TSSOP
Part
TSSOP
Number
Marking Code
4L24
I319
13F
XXXX
TYWW
NNN
24AA024
24LC024
24AA025
24LC025
4A24
L24
4A25
L25
Example:
8-Lead MSOP
Part
MSOP
Number
Marking Code
XXXXT
4L24I
31913F
24AA024
24LC024
24AA025
24LC025
4A24I
4L24I
4A25I
4L25I
YWWNNN
Legend: XX...X Customer specific information*
T
Temperature grade
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
2004 Microchip Technology Inc.
DS21210G-page 11
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21210G-page 12
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
1
B
n
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
Overall Height
A
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2004 Microchip Technology Inc.
DS21210G-page 13
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
A1
A2
φ
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026
0.65
Overall Height
A
.043
1.10
0.95
0.15
6.50
4.50
3.10
0.70
8
Molded Package Thickness
Standoff
A2
A1
E
.033
.035
.004
.251
.173
.118
.024
4
.037
.006
.256
.177
.122
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
3.00
0.60
4
§
.002
.246
.169
.114
.020
0
Overall Width
6.25
4.30
2.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
DS21210G-page 14
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
1
B
n
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026 BSC
0.65 BSC
Overall Height
A
A2
A1
E
-
-
.043
-
-
0.85
-
1.10
Molded Package Thickness
Standoff
.030
.000
.033
-
.037
.006
0.75
0.95
0.15
0.00
Overall Width
.193 TYP.
4.90 BSC
Molded Package Width
Overall Length
E1
D
.118 BSC
.118 BSC
3.00 BSC
3.00 BSC
Foot Length
L
.016
.024
.037 REF
.031
0.40
0.60
0.95 REF
0.80
Footprint (Reference)
Foot Angle
F
φ
c
0°
.003
.009
-
8°
.009
.016
15°
0°
0.08
0.22
5°
-
-
-
-
-
8°
0.23
0.40
15°
Lead Thickness
Lead Width
.006
.012
-
B
α
β
5°
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
5°
5°
5°
-
-
-
15°
5°
15°
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-111
2004 Microchip Technology Inc.
DS21210G-page 15
24AA024/24LC024/24AA025/24LC025
APPENDIX A: REVISION HISTORY
Revision F
Corrections to Section 1.0, Electrical Characteristics.
Revision G
Added part number 24AA025 to document.
Correction to Section 1.0, Ambient Temperature.
DS21210G-page 16
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
ON-LINE SUPPORT
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
Microchip provides on-line support on the Microchip
World Wide Web site.
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits. The Hot Line
Numbers are:
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
2004 Microchip Technology Inc.
DS21210G-page 17
24AA024/24LC024/24AA025/24LC025
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
24AA024/24LC024/24AA025/24LC025
DS21210G
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21210G-page 18
2004 Microchip Technology Inc.
24AA024/24LC024/24AA025/24LC025
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) 24AA024-I/P: Industrial Temperature,
1.8V, PDIP Package
Temperature Package
Range
b) 24AA024-I/SN: Industrial Temperature,
1.8V, SOIC Package
c) 24AA025T-I/ST: Industrial Temperature,
1.8V, TSSOP Package, Tape and Reel,
no WP
Device:
24AA024: 1.8V, 2 Kbit Addressable Serial EEPROM with
WP pin.
24AA024T:1.8V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with WP pin.
d) 24LC024-I/P: Industrial Temperature,
2.5V, PDIP Package
24LC024: 2.5V, 2 Kbit Addressable Serial EEPROM with
WP pin.
24LC024T:2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with WP pin.
24AA025: 1.8V, 2 Kbit Addressable Serial EEPROM with
no WP pin.
24AA025T:1.8V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
e) 24LC024-I/MS: Industrial Temperature,
2.5V, MSOP Package, Tape and Reel
f)
24LC025-T-I/SN: Industrial Temperature,
2.5V, SOIC Package, Tape and Reel, No
WP
24LC025: 2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
24LC025T:2.5V, 2 Kbit Addressable Serial EEPROM
(Tape and Reel) with no WP pin.
Temperature Range:
Package:
I
=
-40°C to +85°C
P
=
=
=
=
Plastic DIP, (300 mil Body), 8-lead
Plastic SOIC, (150 mil Body)
TSSOP, 8-lead
SN
ST
MS
MSOP, 8-lead
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21210G-page 19
24AA024/24LC024/24AA025/24LC025
NOTES:
DS21210G-page 20
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21210G-page 21
WORLDWIDE SALES AND SERVICE
China - Beijing
Korea
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Unit 706B
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Fax: 86-28-86766599
Boston
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Dallas
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
China - Shunde
Fax: 248-538-2260
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
Kokomo
France
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Room 401, Hongjian Building, No. 2
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
Fengxiangnan Road, Ronggui Town, Shunde
District, Foshan City, Guangdong 528303, China
Tel: 86-757-28395507 Fax: 86-757-28395571
Germany
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
San Jose
1300 Terra Bella Avenue
Mountain View, CA 94043
Tel: 650-215-1444
Italy
India
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-22290061 Fax: 91-80-22290062
Japan
Fax: 650-961-0286
Toronto
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
02/17/04
DS21210G-page 22
2004 Microchip Technology Inc.
相关型号：
©2020 ICPDF网 联系我们和版权申明