25C320TI/ST14 [MICROCHIP]
32K SPI Bus Serial EEPROM; 32K SPI总线串行EEPROM
| 型号： | 25C320TI/ST14 |
| 厂家： | 
MICROCHIP |
| 描述： | 32K SPI Bus Serial EEPROM |
| 文件： | 总24页 (文件大小：369K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
25AA320/25LC320/25C320
32K SPI™ Bus Serial EEPROM
Device Selection Table
Description:
The Microchip Technology Inc. 25AA320/25LC320/
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
25C320 (25XX320*) are 32 Kbit serial Electrically
Erasable PROMs. The memory is accessed via a
simple Serial Peripheral Interface (SPI™) compatible
serial bus. The bus signals required are a clock input
(SCK) plus separate data in (SI) and data out (SO)
lines. Access to the device is controlled through a Chip
Select (CS) input.
25AA320
25LC320
25C320
1.8-5.5V
2.5-5.5V
4.5-5.5V
1 MHz
2 MHz
3 MHz
I
I,E
I,E
Features:
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.
• Low-power CMOS technology:
- Write current: 3 mA maximum
- Read current: 500 µA typical
- Standby current: 500 nA typical
• 4096 x 8 bit organization
• 32 byte page
Block Diagram
Status
• Write cycle time: 5 ms maximum
• Self-timed erase and write cycles
• Block write protection:
HV Generator
Register
- Protect none, 1/4, 1/2 or all of array
• Built-in write protection:
EEPROM
Memory
- Power on/off data protection circuitry
- Write enable latch
I/O Control
Logic
Array
Control
Logic
XDEC
- Write-protect pin
Page
Latches
• Sequential read
• High reliability:
- Endurance: 1M E/W cycles
- Data retention: > 200 years
- ESD protection: > 4000V
• 8-pin PDIP, SOIC and TSSOP packages
• 14-lead TSSOP package
• Temperature ranges supported:
SI
Y Decoder
SO
CS
SCK
Sense Amp.
R/W Control
HOLD
WP
- Industrial (I):
-40°C to +85°C
VCC
VSS
- Automotive (E):
-40°C to +125°C
Package Types
PDIP, SOIC
TSSOP
TSSOP
1
2
3
4
5
6
7
14
13
12
11
10
9
VCC
CS
SO
CS
1
8
VCC
1
8
7
HOLD
VCC
SCK
SI
HOLD
NC
NC
2
3
4
SO
WP
VSS
2
3
4
7
6
5
HOLD
SCK
SI
NC
NC
NC
WP
6
5
CS
SO
VSS
WP
NC
SCK
SI
8
VSS
*25XX320 is used in this document as a generic part number for the 25AA320/25LC320/25C320 devices.
2004 Microchip Technology Inc.
DS21227E-page 1
25AA320/25LC320/25C320
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ........................................................................................................ -0.6V to VCC + 1.0V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias...............................................................................................................-40°C to 125°C
ESD protection on all pins..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I): TA = -40°C to +85°C VCC = 1.8V to 5.5V
Automotive (E):TA = -40°C to +125°C VCC = 2.5V to 5.5V
DC CHARACTERISTICS
Param.
Sym.
Characteristics
Min.
Max.
Units
Conditions
VCC ≥ 2.7V (Note)
No.
D1
VIH1
High-level input
voltage
2.0
0.7 VCC
-0.3
VCC+1
VCC+1
0.8
V
V
V
V
V
D2
D3
D4
D5
VIH2
VIL1
VIL2
VOL
VCC< 2.7V (Note)
Low-level input
voltage
VCC ≥ 2.7V (Note)
VCC < 2.7V (Note)
IOL = 1.0 mA, VCC < 2.5V
-0.3
0.3 VCC
0.2
Low-level output
voltage
—
D6
VOH
High-level output
voltage
VCC -0.5
—
V
IOH = -400 µA
D7
D8
ILI
Input leakage current
—
—
±1
±1
µA
µA
CS = VCC, VIN = VSS TO VCC
CS = VCC, VOUT = VSS TO VCC
ILO
Output leakage
current
D9
CINT
Internal Capacitance
(all inputs and
outputs)
—
7
pF
TA = 25°C, CLK = 1.0 MHz,
VCC = 5.0V (Note)
D10
ICC Read Operating Current
—
—
1
500
mA
µA
VCC = 5.5V; FCLK = 3.0 MHz;
SO = Open
VCC = 2.5V; FCLK = 2.0 MHz;
SO = Open
D11
D12
ICC Write
—
—
5
3
mA
mA
VCC = 5.5V
VCC = 2.5V
ICCS
Standby Current
—
—
5
1
µA
µA
CS = VCC = 5.5V, Inputs tied to VCC or
VSS
CS = VCC = 2.5V, Inputs tied to VCC or
VSS
Note:
This parameter is periodically sampled and not 100% tested.
DS21227E-page 2
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
Automotive (E):
TA = -40°C to +85°C
TA = -40°C to +125°C
VCC = 1.8V to 5.5V
VCC = 2.5V to 5.5V
AC CHARACTERISTICS
Param.
Sym.
No.
Characteristic
Min.
Max.
Units
Conditions
1
2
3
FCLK
TCSS
TCSH
Clock Frequency
CS Setup Time
CS Hold Time
—
—
—
3
2
1
MHz
MHz
MHz
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
100
250
500
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
150
250
475
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
4
5
TCSD
TSU
CS Disable Time
Data Setup Time
500
—
ns
—
30
50
50
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
6
THD
Data Hold Time
50
100
100
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
7
8
9
TR
TF
CLK Rise Time
CLK Fall Time
Clock High Time
—
—
2
2
µs
µs
(Note 1)
(Note 1)
THI
150
230
475
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
10
TLO
Clock Low Time
150
230
475
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
11
12
13
TCLD
TCLE
TV
Clock Delay Time
Clock Enable Time
50
50
—
—
ns
ns
—
—
Output Valid from
Clock Low
—
—
—
150
230
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
14
15
THO
TDIS
Output Hold Time
0
—
ns
(Note 1)
Output Disable Time
—
—
—
200
250
—
ns
ns
ns
VCC = 4.5V to 5.5V (Note 1)
VCC = 2.5V to 5.5V (Note 1)
VCC = 1.8V to 5.5V
16
17
18
19
THS
THH
THZ
THV
HOLD Setup Time
HOLD Hold Time
100
100
200
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
100
100
200
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
HOLD Low to Output
High-Z
100
150
200
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V (Note 1)
VCC = 2.5V to 5.5V (Note 1)
VCC = 1.8V to 5.5V
HOLD High to Output
Valid
100
150
200
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
20
21
TWC
—
Internal Write Cycle
Time
—
5
ms
—
Endurance
1M
—
E/W
(Note 2)
Cycles
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but established by characterization. For endurance estimates in a specific application,
please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at: www.microchip.com.
2004 Microchip Technology Inc.
DS21227E-page 3
25AA320/25LC320/25C320
FIGURE 1-1: HOLD TIMING
CS
17
16
16
17
SCK
SO
18
19
High-impedance
don’t care
n
n+2
n+2
n+1
n
n-1
5
n
n+1
n
n-1
SI
HOLD
FIGURE 1-2: SERIAL INPUT TIMING
4
CS
12
2
11
7
3
8
Mode 1,1
Mode 0,0
5
SCK
SI
6
MSB in
LSB in
High-impedance
SO
FIGURE 1-3: SERIAL OUTPUT TIMING
CS
3
9
10
Mode 1,1
Mode 0,0
SCK
13
15
ISB out
14
MSB out
SO
SI
don’t care
DS21227E-page 4
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
TABLE 1-3:
AC Waveform:
VLO = 0.2V
AC TEST CONDITIONS
FIGURE 1-4: AC TEST CIRCUIT
VCC
—
VHI = VCC - 0.2V
(Note 1)
(Note 2)
2.25 KΩ
VHI = 4.0V
Timing Measurement Reference Level
Input
SO
0.5 VCC
0.5 VCC
100 pF
1.8 KΩ
Output
Note 1: For VCC ≤ 4.0V
2: For VCC > 4.0V
2004 Microchip Technology Inc.
DS21227E-page 5
25AA320/25LC320/25C320
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
8-pin
TSSOP
14-lead
TSSOP
Name
PDIP
SOIC
Description
Chip Select Input
CS
SO
NC
1
2
1
2
3
4
1
2
Serial Data Output
Not Connected
—
—
—
3,4,5
WP
Vss
SI
3
4
3
4
5
6
6
Write-Protect Pin
Ground
7
5
5
7
8
9
Serial Data Input
Serial Clock Input
Not Connected
SCK
NC
6
6
8
—
—
—
10,11,12
HOLD
Vcc
7
8
7
8
1
2
13
14
Hold Input
Supply Voltage
The WP pin function is blocked when the WPEN bit in
the Status register is low. This allows the user to install
the 25XX320 in a system with WP pin grounded and
still be able to write to the Status register. The WP pin
functions will be enabled when the WPEN bit is set
high.
2.1
Chip Select (CS)
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
However, a programming cycle which is already
initiated or in progress will be completed, regardless of
the CS input signal. If CS is brought high during a
program cycle, the device will go into Standby mode as
soon as the programming cycle is complete. When the
device is deselected, SO goes to the high-impedance
state, allowing multiple parts to share the same SPI
bus. A low-to-high transition on CS after a valid write
sequence initiates an internal write cycle. After power-
up, a low level on CS is required prior to any sequence
being initiated.
2.4
Serial Input (SI)
The SI pin is used to transfer data into the device. It
receives instructions, addresses, and data. Data is
latched on the rising edge of the serial clock.
2.5
Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 25XX320. Instructions,
addresses, or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
2.2
Serial Output (SO)
The SO pin is used to transfer data out of the 25XX320.
During a read cycle, data is shifted out on this pin after
the falling edge of the serial clock.
2.6
Hold (HOLD)
The HOLD pin is used to suspend transmission to the
25XX320 while in the middle of a serial sequence with-
out having to re-transmit the entire sequence again. It
must be held high any time this function is not being
used. Once the device is selected and a serial
sequence is underway, the HOLD pin may be pulled
low to pause further serial communication without
resetting the serial sequence. The HOLD pin must be
brought low while SCK is low, otherwise the HOLD
function will not be invoked until the next SCK high-to-
low transition. The 25XX320 must remain selected dur-
ing this sequence. The SI, SCK, and SO pins are in a
high-impedance state during the time the device is
paused and transitions on these pins will be ignored. To
resume serial communication, HOLD must be brought
high while the SCK pin is low, otherwise serial
communication will not resume. Lowering the HOLD
line at any time will tri-state the SO line.
2.3
Write-Protect (WP)
This pin is used in conjunction with the WPEN bit in the
Status register to prohibit writes to the nonvolatile bits
in the Status register. When WP is low and WPEN is
high, writing to the nonvolatile bits in the Status register
is disabled. All other operations function normally.
When WP is high, all functions, including writes to the
nonvolatile bits in the Status register operate normally.
If the WPEN bit is set, WP low during a Status register
write sequence will disable writing to the Status
register. If an internal write cycle has already begun,
WP going low will have no effect on the write.
DS21227E-page 6
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
3.3
Write Sequence
3.0
3.1
FUNCTIONAL DESCRIPTION
Principles Of Operation
Prior to any attempt to write data to the 25XX320, the
write enable latch must be set by issuing the WREN
instruction (Figure 3-4). This is done by setting CS low
and then clocking out the proper instruction into the
25XX320. After all eight bits of the instruction are
transmitted, the CS must be brought high to set the
write enable latch. If the write operation is initiated
immediately after the WREN instruction without CS
being brought high, the data will not be written to the
array because the write enable latch will not have been
properly set.
The 25XX320 are 4096 byte Serial EEPROMs
designed to interface directly with the Serial Peripheral
Interface (SPI) port of many of today’s popular
microcontroller
families,
including
Microchip’s
PIC16C6X/7X microcontrollers. It may also interface
with microcontrollers that do not have a built-in SPI port
by using discrete I/O lines programmed properly with
the software.
The 25XX320 contains an 8-bit instruction register. The
device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low and the HOLD pin must be high for the entire
operation.
Once the write enable latch is set, the user may
proceed by setting the CS low, issuing a WRITE
instruction, followed by the 16-bit address, with the four
MSBs of the address being don’t care bits, and then the
data to be written. Up to 32 bytes of data can be sent to
the 25XX320 before a write cycle is necessary. The
only restriction is that all of the bytes must reside in the
same page. A page address begins with xxxx xxxx
xxx00000and ends with xxxxxxxxxxx11111.
If the internal address counter reaches xxxx xxxx
xxx11111and the clock continues, the counter will
roll back to the first address of the page and overwrite
any data in the page that may have been written.
Table 3-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses and data are transferred MSB first, LSB last.
Data is sampled on the first rising edge of SCK after CS
goes low. If the clock line is shared with other
peripheral devices on the SPI bus, the user can assert
the HOLD input and place the 25XX320 in ‘HOLD’
mode. After releasing the HOLD pin, operation will
resume from the point when the HOLD was asserted.
For the data to be actually written to the array, the CS
must be brought high after the least significant bit (D0)
of the nth data byte has been clocked in. If CS is
brought high at any other time, the write operation will
not be completed. Refer to Figure 3-2 and Figure 3-3
for more detailed illustrations on the byte write
sequence and the page write sequence respectively.
While the write is in progress, the Status register may
be read to check the status of the WPEN, WIP, WEL,
BP1 and BP0 bits (Figure 3-6). A read attempt of a
memory array location will not be possible during a
write cycle. When the write cycle is completed, the
write enable latch is reset.
3.2
Read Sequence
The device is selected by pulling CS low. The 8-bit
READ instruction is transmitted to the 25XX320 fol-
lowed by the 16-bit address, with the four MSBs of the
address being don’t care bits. After the correct READ
instruction and address are sent, the data stored in the
memory at the selected address is shifted out on the
SO pin. The data stored in the memory at the next
address can be read sequentially by continuing to pro-
vide clock pulses. The internal address pointer is auto-
matically incremented to the next higher address after
each byte of data is shifted out. When the highest
address is reached (0FFFh), the address counter rolls
over to address 0000h allowing the read cycle to be
continued indefinitely. The read operation is terminated
by raising the CS pin (Figure 3-1).
TABLE 3-1:
INSTRUCTION SET
Instruction Name
READ
Instruction Format
Description
Read data from memory array beginning at selected address
Write data to memory array beginning at selected address
Reset the write enable latch (disable write operations)
Set the write enable latch (enable write operations)
Read Status register
0000 0011
0000 0010
0000 0100
0000 0110
0000 0101
0000 0001
WRITE
WRDI
WREN
RDSR
WRSR
Write Status register
2004 Microchip Technology Inc.
DS21227E-page 7
25AA320/25LC320/25C320
FIGURE 3-1: READ SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
SI
instruction
16-bit address
1 15 14 13 12
0
0
0
0
0
0
1
2
1
0
data out
High-impedance
7
6
5
4
3
2
1
0
SO
FIGURE 3-2: BYTE WRITE SEQUENCE
CS
Twc
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
data byte
SCK
SI
instruction
16-bit address
15 14 13 12
0
0
0
0
0
0
1
0
2
1
0
7
6
5
4
3
2
1
0
High-impedance
SO
FIGURE 3-3: PAGE WRITE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9
10 11
21 22 23 24 25 26 27 28 29 30 31
data byte 1
SCK
SI
instruction
16-bit address
0
0
0
0
0
0
1
0 15 14 13 12
2
1
0
7
6
5
4
3
2
1
0
CS
32 33 34 35 36 37 38 39
data byte 2
41 42 43 44 45 46 47
data byte 3
40
7
SCK
SI
data byte n (32 max)
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
DS21227E-page 8
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
The following is a list of conditions under which the
write enable latch will be reset:
3.4
Write Enable (WREN) and Write
Disable (WRDI)
• Power-up
The 25XX320 contains a write enable latch.
See
• WRDIinstruction successfully executed
Table 3-3 for the Write-Protect Functionality Matrix.
This latch must be set before any write operation will be
completed internally. The WRENinstruction will set the
latch, and the WRDIwill reset the latch.
• WRSRinstruction successfully executed
• WRITEinstruction successfully executed
FIGURE 3-4: WRITE ENABLE SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
SI
0
0
0
0
0
1
1
0
High-impedance
SO
FIGURE 3-5: WRITE DISABLE SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
SI
0
0
0
0
0
0
1
0
High-impedance
SO
2004 Microchip Technology Inc.
DS21227E-page 9
25AA320/25LC320/25C320
The Write Enable Latch (WEL) bit indicates the status
of the write enable latch. When set to a ‘1’, the latch
allows writes to the array, when set to a ‘0’, the latch
prohibits writes to the array. The state of this bit can
always be updated via the WREN or WRDI commands
regardless of the state of write protection on the Status
register. This bit is read-only.
3.5
Read Status Register Instruction
(RDSR)
The Read Status Register instruction (RDSR) provides
access to the Status register. The Status register may
be read at any time, even during a write cycle. The
Status register is formatted as follows:
The Block Protection (BP0 and BP1) bits indicate
which blocks are currently write-protected. These bits
are set by the user issuing the WRSRinstruction. These
bits are nonvolatile.
7
6
5
4
3
2
1
0
WPEN
X
X
X
BP1
BP0
WEL
WIP
The Write-In-Process (WIP) bit indicates whether the
25XX320 is busy with a write operation. When set to a
‘1’, a write is in progress; when set to a ‘0’, no write is
in progress. This bit is read-only.
See Figure 3-6 for the RDSR timing sequence.
FIGURE 3-6: READ STATUS REGISTER TIMING SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
SI
instruction
0
0
0
0
0
1
0
1
data from Status register
High-impedance
SO
7
6
5
4
3
2
1
0
DS21227E-page 10
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
When the chip is hardware write-protected, only writes
3.6
Write Status Register Instruction
(WRSR)
to nonvolatile bits in the Status register are disabled.
See Table 3-3 for a matrix of functionality on the WPEN
bit.
The Write Status Register instruction (WRSR) allows the
user to select one of four levels of protection for the
array by writing to the appropriate bits in the Status
register. The array is divided up into four segments.
The user has the ability to write-protect none, one, two,
or all four of the segments of the array. The partitioning
is controlled as shown in Table 3-2.
See Figure 3-7 for the WRSR timing sequence.
TABLE 3-2:
BP1
ARRAY PROTECTION
Array Addresses
BP0
Write-Protected
The Write-Protect Enable (WPEN) bit is a nonvolatile
bit that is available as an enable bit for the WP pin. The
Write-Protect (WP) pin and the Write-Protect Enable
(WPEN) bit in the Status register control the program-
mable hardware write-protect feature. Hardware write
protection is enabled when WP pin is low and the
WPEN bit is high. Hardware write protection is disabled
when either the WP pin is high or the WPEN bit is low.
none
0
0
0
1
upper 1/4
(0C00h - 0FFFh)
upper 1/2
(0800h - 0FFFh)
1
1
0
1
all
(0000h - 0FFFh)
FIGURE 3-7: WRITE STATUS REGISTER TIMING SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
1
15
0
SCK
SI
instruction
data to Status register
7
6
5
4
3
2
0
0
0
0
0
0
0
1
High-impedance
SO
2004 Microchip Technology Inc.
DS21227E-page 11
25AA320/25LC320/25C320
3.7
Data Protection
3.8
Power-On State
The following protection has been implemented to
prevent inadvertent writes to the array:
The 25XX320 powers on in the following state:
• The device is in low-power Standby mode
• The write enable latch is reset on power-up
(CS= 1)
• A WRITE ENABLEinstruction must be issued to
• The write enable latch is reset
set the write enable latch
• SO is in high-impedance state
• After a byte write, page write or Status register
write, the write enable latch is reset
• A low level on CS is required to enter active state
• CS must be set high after the proper number of
clock cycles to start an internal write cycle
• Access to the array during an internal write cycle
is ignored and programming is continued
.
TABLE 3-3:
WPEN
WRITE-PROTECT FUNCTIONALITY MATRIX
WP
WEL
Protected Blocks
Protected
Unprotected Blocks
Protected
Status Register
Protected
Writable
x
0
1
x
x
x
0
1
1
1
Protected
Writable
Low
High
Protected
Writable
Protected
Writable
Protected
Writable
DS21227E-page 12
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
25LC320
/PNNN
YYWW
YYWW
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
25LC320
I/SNYYWW
NNN
Example:
8-Lead TSSOP
XXXX
XYWW
NNN
5LBX
IYWW
NNN
Example:
14-Lead TSSOP
XXXXXXXX
YYWW
25L32
YYWW
NNN
NNN
Legend: XX...X Customer specific information*
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, and traceability code. For
device markings beyond this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
2004 Microchip Technology Inc.
DS21227E-page 13
25AA320/25LC320/25C320
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21227E-page 14
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
1
B
n
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
Overall Height
A
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2004 Microchip Technology Inc.
DS21227E-page 15
25AA320/25LC320/25C320
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
A1
A2
φ
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026
0.65
Overall Height
A
.043
1.10
0.95
0.15
6.50
4.50
3.10
0.70
8
Molded Package Thickness
Standoff
A2
A1
E
.033
.035
.004
.251
.173
.118
.024
4
.037
.006
.256
.177
.122
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
3.00
0.60
4
§
.002
.246
.169
.114
.020
0
Overall Width
6.25
4.30
2.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
DS21227E-page 16
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
φ
A1
A2
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
14
MAX
n
p
Number of Pins
Pitch
14
.026
0.65
Overall Height
A
.043
1.10
0.95
0.15
6.50
4.50
5.10
0.70
8
Molded Package Thickness
Standoff
A2
A1
E
.033
.002
.246
.169
.193
.020
0
.035
.004
.251
.173
.197
.024
4
.037
.006
.256
.177
.201
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
5.00
0.60
4
§
Overall Width
6.25
4.30
4.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
2004 Microchip Technology Inc.
DS21227E-page 17
25AA320/25LC320/25C320
APPENDIX A: REVISION HISTORY
Revision D
Corrections to Section 1.0, Electrical Characteristics.
Revision E
Revise Endurance from 100K to 1M.
DS21227E-page 18
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
ON-LINE SUPPORT
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
Microchip provides on-line support on the Microchip
World Wide Web site.
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits. The Hot Line
Numbers are:
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
2004 Microchip Technology Inc.
DS21227E-page 19
25AA320/25LC320/25C320
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
25AA320/25LC320/25C320
DS21227E
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21227E-page 20
2004 Microchip Technology Inc.
25AA320/25LC320/25C320
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) 25LC320-I/SN: Industrial Temp.,
SOIC package
b) 25LC320T-I/SN: Tape and Reel,
Industrial Temp., SOIC package
c) 25LC320-E/SN: Extended Temp.,
SOIC package
Temperature
Range
Package
Device:
25AA320:
25AA320T:
32 Kbit 1.8V SPI Serial EEPROM
32 Kbit 1.8V SPI Serial EEPROM
(Tape and Reel)
25AA320X
32-bit 1.8V SPI Serial EEPROM
in alternate pinout (ST only)
d) 25C320-I/SN: Industrial Temp.,
SOIC package
25AA320XT 32-bit 1.8V SPI Serial EEPROM
in alternate pinout Tape and Reel
(ST only)
e) 25C320T-I/SN: Tape and Reel,
Industrial Temp., SOIC package
f)
25C320-I/ST: Industrial Temp.,
TSSOP package
25LC320:
32 Kbit 2.5V SPI Serial EEPROM
32 Kbit 2.5V SPI Serial EEPROM
(Tape and Reel)
25LC320T:
g) 25C320-E/SN: Extended Temp.,
SOIC package
25LC320X
32-bit 2.5V SPI Serial EEPROM
in alternate pinout (ST only)
25LC320XT 32-bit 2.5V SPI Serial EEPROM
in alternate pinout Tape and Reel
(ST only)
25C320:
25C320T:
32 Kbit 5V SPI Serial EEPROM
32 Kbit 5V SPI Serial EEPROM
(Tape and Reel)
25C320X
32-bit 5V SPI Serial EEPROM
in alternate pinout (ST only)
32-bit 5V SPI Serial EEPROM
in alternate pinout Tape and Reel
(ST only)
25C320XT
Temperature
Range:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
Package:
P
SN
=
=
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body),
8-lead
ST
=
Plastic TSSOP (4.4 mm body),
8-lead
ST14 =
Plastic TSSOP (4.4 mm body),
14-lead
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21227E-page 21
25AA320/25LC320/25C320
NOTES:
DS21227E-page 22
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21227E-page 23
WORLDWIDE SALES AND SERVICE
China - Beijing
Singapore
AMERICAS
Corporate Office
2355 West Chandler Blvd.
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Tel: 480-792-7200
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Technical Support: 480-792-7627
Web Address: www.microchip.com
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Tel: 86-10-85282100
Fax: 86-10-85282104
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Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Kaohsiung Branch
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Tel: 886-7-536-4816
Fax: 886-7-536-4817
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
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Tel: 86-28-86766200
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Fax: 86-28-86766599
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No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-22290061 Fax: 91-80-22290062
Japan
Fax: 650-961-0286
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
Waegenburghtplein 4
NL-5152 JR, Drunen, Netherlands
Tel: 31-416-690399
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Yusen Shin Yokohama Building 10F
3-17-2, Shin Yokohama, Kohoku-ku,
Yokohama, Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Fax: 905-673-6509
Fax: 31-416-690340
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd
Unit 32 41 Rawson Street
Epping 2121, NSW
Sydney, Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
United Kingdom
505 Eskdale Road
Winnersh Triangle
Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
07/12/04
DS21227E-page 24
2004 Microchip Technology Inc.
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