93AA56CT-I/STG_技术文档

93AA56A/B/C, 93LC56A/B/C,

93C56A/B/C

2K Microwire^®-Compatible Serial EEPROM

Device Selection Table

Part Number

VCC Range

ORG Pin

Word Size

Temp Ranges

Packages

93AA56A

93AA56B

93LC56A

93LC56B

93C56A

1.8-5.5

1.8-5-5

2.5-5.5

4.5-5.5

1.8-5.5

2.5-5.5

4.5-5.5

No

8-bit

16-bit

I

P, SN, ST, MS, OT

P, SN, ST, MS

I

No

8-bit

I, E

I

No

16-bit

No

8-bit

93C56B

No

16-bit

93AA56C

93LC56C

93C56C

Yes

8 or 16-bit

I, E

P, SN, ST, MS

Features

Description

• Low power CMOS technology

The Microchip Technology Inc. 93XX56A/B/C devices

are 2K bit low voltage serial Electrically Erasable

PROMs (EEPROM). Word-selectable devices such as

the 93AA56C, 93LC56C or 93C56C are dependent

upon external logic levels driving the ORG pin to set

word size. For dedicated 8-bit communication, the

93AA56A, 93LC56A or 93C56A devices are available,

while the 93AA56B, 93LC56B and 93C56B devices

provide dedicated 16-bit communication. Advanced

CMOS technology makes these devices ideal for low

power, non-volatile memory applications. The entire

93XX Series is available in standard packages includ-

ing 8-lead PDIP and SOIC, and advanced packaging

including 8-lead MSOP, 6-lead SOT-23, and 8-lead

TSSOP. Pb-free (Pure Matte Sn) finish is also

available.

• ORG pin to select word size for ‘56C version

• 256 x 8-bit organization ‘A’ ver. devices (no ORG)

• 128 x 16-bit organization ‘B’ ver. devices (no

ORG)

• Self-timed ERASE/WRITE cycles (including

auto-erase)

• Automatic ERAL before WRAL

• Power on/off data protection circuitry

• Industry standard 3-wire serial I/O

• Device status signal (READY/BUSY)

• Sequential READ function

• 1,000,000 E/W cycles

• Data retention > 200 years

• Temperature ranges supported:

Package Types (not to scale)

- Industrial (I)

-40°C to +85°C

-40°C to +125°C

ROTATED SOIC

(ex: 93LC56BX)

PDIP/SOIC

(P, SN)

- Automotive (E)

NC

Pin Function Table

1

2

3

4

8

7

6

5

ORG*

CS

CLK

DI

VCC

1

2

3

4

8

7

6

5

VCC

VSS

NC

CS

DO

DI

Name

Function

ORG*

CLK

DO

VSS

CS

CLK

DI

Chip Select

Serial Data Clock

Serial Data Input

Serial Data Output

Ground

TSSOP/MSOP

(ST, MS)

SOT-23

(OT)

1

2

3

4

8

7

6

5

DO

V^SS

CS

CLK

DI

V

CC

1

2

3

6

5

4

DO

V

CC

NC

ORG*

VSS

CS

DO

VSS

NC

No internal connection

Memory Configuration

Power Supply

DI

CLK

* ORG pin is NC on A/B devices

Microwire is a registered trademark of National Semiconductor.

ORG

V^CC

 2003 Microchip Technology Inc.

DS21794A-page 1

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings†

VCC.............................................................................................................................................................................7.0V

All inputs and outputs w.r.t. V^SS......................................................................................................... -0.6V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-40°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4 kV

†NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This

is a stress rating only and functional operation of the device at those or any other conditions above those indicated in

the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods

may affect device reliability.

DC CHARACTERISTICS

V^CC= range by device (see Table on Page 1)

Industrial (I): T^AMB= -40°C to +85°C

Automotive (E): T^AMB= -40°C to +125°C

All parameters apply over the specified

ranges unless otherwise noted.

Param.

Symbol

Parameter

Min

Typ

Max

Units

Conditions

V^CC≥ 2.7V

V^CC< 2.7V

No.

D1

V^IH1

V^IH2

High level input voltage

Low level input voltage

Low level output voltage

High level output voltage

2.0

0.7 VCC

—

VCC +1

V^CC+1

V

D2

D3

D4

V^IL1

V^IL2

-0.3

—

0.8

0.2 VCC

V

VCC ≥ 2.7V

V^CC< 2.7V

Vol1

Vol2

—

0.4

0.2

V

I^OL= 2.1 mA, VCC = 4.5V

I^OL= 100 µA, VCC = 2.5V

V^OH1

V^OH2

2.4

VCC - 0.2

—

V

I^OH= -400 µA, VCC = 4.5V

I^OH= -100 µA, VCC = 2.5V

D5

D6

D7

I^LI

Input leakage current

Output leakage current

—

10

7

µA

pF

VIN = VSS to VCC

ILO

VOUT = VSS to VCC

CIN,

Pin capacitance (all inputs/

outputs)

VIN/VOUT = 0V (Note 1)

C^OUT

T^AMB= 25°C, FCLK = 1 MHz

D8

D9

I^CCwrite Write current

—

500

2

—

mA

µA

FCLK = 3 MHz, Vcc = 5.5V

F^CLK= 2 MHz, Vcc = 2.5V

I^CCread Read current

—

1

mA

µA

FCLK = 3 MHz, VCC = 5.5V

F^CLK= 2 MHz, VCC = 3.0V

F^CLK= 2 MHz, VCC = 2.5V

500

—

100

D10

D11

I^CCS

Standby current

—

1

5

µA

I – Temp

E – Temp

CLK = Cs = 0V

ORG = DI = V^SSor VCC

(Note 2) (Note 3)

V^POR

VCC voltage detect

93AA56A/B/C, 93LC56A/B/C

93C56A/B/C

—

1.5V

3.8V

—

V

(Note 1)

Note 1: This parameter is periodically sampled and not 100% tested.

2: ORG pin not available on ‘A’ or ‘B’ versions.

3: READY/BUSY status must be cleared from DO, see Section 3.4.

DS21794A-page 2

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

AC CHARACTERISTICS

V^CC= range by device (see Table on Page 1)

Industrial (I): T^AMB= -40°C to +85°C

Automotive (E): T^AMB= -40°C to +125°C

All parameters apply over the specified

ranges unless otherwise noted.

Param.

No.

Symbol

Parameter

Clock frequency

Min

Max

Units

Conditions

A1

F^CLK

—

3

2

1

MHz 4.5V ≤ VCC < 5.5V, 93XX56C only

MHz 2.5V ≤ V^CC< 5.5V

MHz 1.8V ≤ V^CC< 2.5V

A2

A3

A4

T^CKH

T^CKL

T^CSS

Clock high time

200

250

450

—

ns

4.5V ≤ V^CC< 5.5V, 93XX56C only

2.5V ≤ V^CC< 5.5V

1.8V ≤ V^CC< 2.5V

Clock low time

100

200

450

ns

4.5V ≤ VCC < 5.5V, 93XX56C only

2.5V ≤ V^CC< 5.5V

1.8V ≤ V^CC< 2.5V

Chip select setup time

50

ns

4.5V ≤ V^CC< 5.5V

2.5V ≤ V^CC< 4.5V

1.8V ≤ V^CC< 2.5V

100

250

A5

A6

A7

T^CSH

T^CSL

T^DIS

Chip select hold time

Chip select low time

Data input setup time

0

—

ns

1.8V ≤ VCC < 5.5V

250

50

ns

4.5V ≤ V^CC< 5.5V, 93XX56C only

2.5V ≤ V^CC< 5.5V

1.8V ≤ V^CC< 2.5V

100

250

A8

A9

T^DIH

Data input hold time

50

—

ns

4.5V ≤ V^CC< 5.5V, 93XX56C only

2.5V ≤ V^CC< 5.5V

1.8V ≤ V^CC< 2.5V

100

250

T^PD

Data output delay time

—

200

250

400

ns

4.5V ≤ V^CC< 5.5V, CL = 100 pF

2.5V ≤ V^CC< 4.5V, CL = 100 pF

1.8V ≤ V^CC< 2.5V, CL = 100 pF

A10

A11

T^CZ

T^SV

Data output disable time

Status valid time

—

100

200

ns

4.5V ≤ VCC < 5.5V, (Note 1)

1.8V ≤ V^CC< 4.5V, (Note 1)

200

300

500

ns

4.5V ≤ V^CC< 5.5V, CL = 100 pF

2.5V ≤ V^CC< 4.5V, CL = 100 pF

1.8V ≤ V^CC< 2.5V, CL = 100 pF

A12

A13

T^WC

Program cycle time

—

6

ms

ERASE/WRITE mode (AA and LC

versions)

2

ms

ERASE/WRITE mode

(93C versions)

A14

A15

A16

T^EC

T^WL

—

6

ms

ERAL mode, 4.5V ≤ VCC ≤ 5.5V

WRAL mode, 4.5V ≤ VCC ≤ 5.5V

15

—

Endurance

1M

cycles 25°C, V^CC= 5.0V, (Note 2)

Note 1: This parameter is periodically sampled and not 100% tested.

2: This application is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance Model which may be obtained on www.microchip.com.

 2003 Microchip Technology Inc.

DS21794A-page 3

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

FIGURE 1-1:

SYNCHRONOUS DATA TIMING

V^IH

VIL

VIH

CS

T^CSS

TCKH

TCKL

TCSH

CLK

DI

VIL

TDIS

TDIH

VIH

VIL

TCZ

TPD

VOH

DO

(READ)

VOL

VOH

T^SV

DO

(PROGRAM)

STATUS VALID

VOL

Note: TSV is relative to CS.

TABLE 1-1: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX56B OR 93XX56C WITH ORG = 1)

Instruction

SB Opcode

Address

Data In

Data Out Req. CLK Cycles

ERASE

ERAL

1

11

00

10

01

00

X

1

0

1

X

0

A6 A5 A4 A3 A2 A1 A0

—

(RDY/BSY)

HIGH-Z

11

27

0

1

X

EWDS

EWEN

READ

WRITE

WRAL

HIGH-Z

A6 A5 A4 A3 A2 A1 A0

D15 – D0

A6 A5 A4 A3 A2 A1 A0 D15 – D0 (RDY/BSY)

D15 – D0 (RDY/BSY)

1

X

TABLE 1-2: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX56A OR 93XX56C WITH ORG = 0)

Req. CLK

Cycles

Instruction

SB Opcode

Address

Data In

Data Out

ERASE

ERAL

1

11

00

10

01

00

X

1

0

1

X

0

A7 A6 A5 A4 A3 A2 A1 A0

—

(RDY/BSY)

HIGH-Z

12

20

0

1

X

EWDS

EWEN

READ

WRITE

WRAL

HIGH-Z

A7 A6 A5 A4 A3 A2 A1 A0

D7 – D0

A7 A6 A5 A4 A3 A2 A1 A0 D7 – D0 (RDY/BSY)

D7 – D0 (RDY/BSY)

1

X

DS21794A-page 4

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

2.2

Data In/Data Out (DI/DO)

2.0

FUNCTIONAL DESCRIPTION

It is possible to connect the Data In and Data Out pins

together. However, with this configuration it is possible

for a “bus conflict” to occur during the “dummy zero”

that precedes the READ operation, if A0 is a logic

HIGH level. Under such a condition the voltage level

seen at Data Out is undefined and will depend upon the

relative impedances of Data Out and the signal source

driving A0. The higher the current sourcing capability of

A0, the higher the voltage at the Data Out pin. In order

to limit this current, a resistor should be connected

between DI and DO.

When the ORG* pin is connected to VCC, the (x16)

organization is selected. When it is connected to

ground, the (x8) organization is selected. Instructions,

addresses and write data are clocked into the DI pin on

the rising edge of the clock (CLK). The DO pin is

normally held in a HIGH-Z state except when reading

data from the device, or when checking the READY/

BUSY status during a programming operation. The

READY/BUSY status can be verified during an Erase/

Write operation by polling the DO pin; DO low indicates

that programming is still in progress, while DO high

indicates the device is ready. DO will enter the HIGH-Z

state on the falling edge of CS.

2.3

Data Protection

All modes of operation are inhibited when VCC is below

a typical voltage of 1.5V for '93AA' and '93LC' devices

or 3.8V for '93C' devices.

2.1

START Condition

The START bit is detected by the device if CS and DI

are both HIGH with respect to the positive edge of CLK

for the first time.

The EWEN and EWDS commands give additional

protection against accidentally programming during

normal operation.

Before a START condition is detected, CS, CLK, and DI

may change in any combination (except to that of a

START condition), without resulting in any device

operation (READ, WRITE, ERASE, EWEN, EWDS,

ERAL, or WRAL). As soon as CS is HIGH, the device

is no longer in Standby mode.

Note: For added protection, an EWDS command

should be performed after every write

operation.

After power-up, the device is automatically in the

EWDS mode. Therefore, an EWENinstruction must be

performed before the initial ERASEor WRITEinstruction

can be executed.

An instruction following a START condition will only be

executed if the required opcode, address and data bits

for any particular instruction are clocked in.

Block Diagram

V^CC

VSS

Address

Decoder

Memory

Array

Address

Counter

DO

Output

Buffer

Data Register

DI

Mode

Decode

Logic

ORG*

CS

Clock

Register

CLK

*ORG input is not available on A/B devices

 2003 Microchip Technology Inc.

DS21794A-page 5

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

The DO pin indicates the READY/BUSY status of the

2.4

ERASE

device if CS is brought high after a minimum of 250 ns

low (T^CSL). DO at logical “0” indicates that program-

ming is still in progress. DO at logical “1” indicates that

the register at the specified address has been erased

and the device is ready for another instruction.

The ERASEinstruction forces all data bits of the speci-

fied address to the logical “1” state. CS is brought low

following the loading of the last address bit. This falling

edge of the CS pin initiates the self-timed program-

ming cycle, except on ‘93C’ devices where the rising

edge of CLK before the last address bit initiates the

write cycle.

Note:

Issuing a START bit and then taking CS low

will clear the READY/BUSY status from

DO.

FIGURE 2-1:

ERASE TIMING FOR 93AA AND 93LC DEVICES

T^CSL

CS

CHECK STATUS

CLK

1

A^N

AN-1 AN-2

A0

•••

DI

1

T^SV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

T^WC

FIGURE 2-2:

ERASE TIMING FOR 93C DEVICES

T^CSL

CS

CHECK STATUS

CLK

1

A^N

AN-1 AN-2

A0

•••

DI

1

T^SV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

T^WC

DS21794A-page 6

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

The DO pin indicates the READY/BUSY status of the

device, if CS is brought high after a minimum of 250 ns

low (T^CSL).

2.5

ERASE ALL (ERAL)

The Erase All (ERAL) instruction will erase the entire

memory array to the logical “1” state. The ERAL cycle

is identical to the ERASE cycle, except for the different

opcode. The ERAL cycle is completely self-timed and

commences at the falling edge of the CS, except on

‘93C’ devices where the rising edge of CLK before the

last data bit initiates the write cycle. Clocking of the

CLK pin is not necessary after the device has entered

the ERAL cycle.

Note:

Issuing a START bit and then taking CS low

will clear the READY/BUSY status from

DO.

V^CCmust be ≥ 4.5V for proper operation of ERAL.

FIGURE 2-3:

ERAL TIMING FOR 93AA AND 93LC DEVICES

T^CSL

CS

CHECK STATUS

CLK

1

0

1

0

X

DI

•••

T^SV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

VCC must be ≥ 4.5V for proper operation of ERAL.

T^EC

FIGURE 2-4:

ERAL TIMING FOR 93C DEVICES

T^CSL

CS

CHECK STATUS

CLK

1

0

1

0

X

DI

•••

T^SV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

T^EC

 2003 Microchip Technology Inc.

DS21794A-page 7

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

2.6

ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN)

The 93XX56A/B/C powers up in the ERASE/WRITE

Disable (EWDS) state. All Programming modes must be

preceded by an ERASE/WRITE Enable (EWEN) instruc-

tion. Once the EWENinstruction is executed, program-

ming remains enabled until an EWDS instruction is

executed or Vcc is removed from the device. To protect

against accidental data disturbance, the EWDSinstruc-

tion can be used to disable all ERASE/WRITE

functions and should follow all programming opera-

tions. Execution of a READinstruction is independent of

both the EWENand EWDSinstructions.

FIGURE 2-5:

EWDS TIMING

T^CSL

CS

CLK

•••

1

0

X

DI

FIGURE 2-6:

EWEN TIMING

TCSL

CS

CLK

•••

1

0

1

X

DI

devices) output string. The output data bits will toggle on

the rising edge of the CLK and are stable after the spec-

ified time delay (T^PD). Sequential read is possible when

CS is held high. The memory data will automatically cycle

to the next register and output sequentially.

2.7

READ

The READ instruction outputs the serial data of the

addressed memory location on the DO pin. A dummy

zero bit precedes the 8-bit (If ORG pin is low or A-Version

devices) or 16-bit (If ORG pin is high or B-version

FIGURE 2-7:

READ TIMING

CS

CLK

DI

•••

A0

An

1

0

HIGH-Z

DO

0

Dx

D0

Dx

D0

Dx

D0

•••

DS21794A-page 8

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

The DO pin indicates the READY/BUSY status of the

device, if CS is brought high after a minimum of 250 ns

2.8

WRITE

The WRITEinstruction is followed by 8 bits (If ORG is

low or A-version devices) or 16 bits (If ORG pin is high

or B-version devices) of data which are written into the

specified address. For 93AA56A/B/C and 93LC56A/B/C

devices, after the last data bit is clocked into DI, the

falling edge of CS initiates the self-timed auto-erase and

programming cycle. For 93C56A/B/C devices, the self-

timed auto-erase and programming cycle is initiated by

the rising edge of CLK on the last data bit.

low (T^CSL). DO at logical “0” indicates that program-

ming is still in progress. DO at logical “1” indicates that

the register at the specified address has been written

with the data specified and the device is ready for

another instruction.

Note:

Issuing a START bit and then taking CS low

will clear the READY/BUSY status from

DO.

FIGURE 2-8:

WRITE TIMING FOR 93AA AND 93LC DEVICES

T^CSL

CS

CLK

DI

0

1

An

A0

Dx

D0

•••

TSV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

Twc

FIGURE 2-9:

WRITE TIMING FOR 93C DEVICES

T^CSL

CS

CLK

DI

0

1

An

A0

Dx

D0

•••

TSV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

Twc

 2003 Microchip Technology Inc.

DS21794A-page 9

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

automatic ERAL cycle for the device. Therefore, the

WRALinstruction does not require an ERALinstruction

but the chip must be in the EWEN status.

2.9

WRITE ALL (WRAL)

The Write All (WRAL) instruction will write the entire

memory array with the data specified in the command.

For 93AA56A/B/C and 93LC56A/B/C devices, after the

last data bit is clocked into DI, the falling edge of CS

initiates the self-timed auto-erase and programming

cycle. For 93C56A/B/C devices, the self-timed auto-

erase and programming cycle is initiated by the rising

edge of CLK on the last data bit. Clocking of the CLK

pin is not necessary after the device has entered the

WRAL cycle. The WRAL command does include an

The DO pin indicates the READY/BUSY status of the

device if CS is brought high after a minimum of 250 ns

low (T^CSL).

Note:

Issuing a START bit and then taking CS low

will clear the READY/BUSY status from

DO.

V^CCmust be ≥ 4.5V for proper operation of WRAL.

FIGURE 2-10:

WRAL TIMING FOR 93AA AND 93LC DEVICES

TCSL

CS

CLK

DI

0

1

X

1

0

•••

Dx

•••

X

D0

TSV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

T^WL

VCC must be ≥ 4.5V for proper operation of WRAL.

FIGURE 2-11:

WRAL TIMING FOR 93C DEVICES

TCSL

CS

CLK

DI

0

1

X

1

0

•••

Dx

•••

X

D0

TSV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

T^WL

DS21794A-page 10

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

3.0

PIN DESCRIPTIONS

TABLE 3-1:

PIN DESCRIPTIONS

SOIC/PDIP/

MSOP/TSSOP

Name

SOT-23

Rotated SOIC

Function

CS

1

2

3

4

5

6

5

4

3

4

5

6

7

8

Chip Select

Serial Clock

Data In

CLK

DI

3

DO

1

Data Out

Ground

V^SS

2

ORG/NC

N/A

Organization / 93XX56C

No Internal Connection / 93XX56A/B

NC

7

8

N/A

6

1

2

No Internal Connection

Power Supply

V^CC

3.1

Chip Select (CS)

3.3

Data In (DI)

A high level selects the device; a low level deselects

the device and forces it into Standby mode. However, a

programming cycle which is already in progress will be

completed, regardless of the Chip Select (CS) input

signal. If CS is brought low during a program cycle, the

device will go into Standby mode as soon as the

programming cycle is completed.

Data In (DI) is used to clock in a START bit, opcode,

address and data synchronously with the CLK input.

3.4

Data Out (DO)

Data Out (DO) is used in the READ mode to output

data synchronously with the CLK input (T^PDafter the

positive edge of CLK).

CS must be low for 250 ns minimum (T^CSL) between

consecutive instructions. If CS is low, the internal

control logic is held in a RESET status.

This pin also provides READY/BUSY status informa-

tion during ERASE and WRITE cycles. READY/BUSY

status information is available on the DO pin if CS is

brought high after being low for minimum chip select

low time (T^CSL) and an ERASE or WRITE operation

has been initiated.

3.2

Serial Clock (CLK)

The Serial Clock is used to synchronize the communi-

cation between a master device and the 93XX series

device. Opcodes, address and data bits are clocked in

on the positive edge of CLK. Data bits are also clocked

out on the positive edge of CLK.

The status signal is not available on DO, if CS is held

low during the entire ERASE or WRITE cycle. In this

case, DO is in the HIGH-Z mode. If status is checked

after the ERASE/WRITE cycle, the data line will be high

to indicate the device is ready.

CLK can be stopped anywhere in the transmission

sequence (at high or low level) and can be continued

anytime with respect to clock high time (T^CKH) and

clock low time (T^CKL). This gives the controlling master

freedom in preparing opcode, address and data.

Note:

Issuing a START bit and then taking CS low

will clear the READY/BUSY status from

DO.

CLK is a “Don't Care” if CS is low (device deselected).

If CS is high, but the START condition has not been

detected (DI = 0), any number of clock cycles can be

received by the device without changing its status (i.e.,

waiting for a START condition).

3.5

Organization (ORG)

When the ORG pin is connected to VCC or Logic HI, the

(x16) memory organization is selected. When the ORG

pin is tied to VSS or Logic LO, the (x8) memory

organization is selected. For proper operation, ORG

must be tied to a valid logic level.

CLK cycles are not required during the self-timed

WRITE (i.e., auto ERASE/WRITE) cycle.

93XX56A devices are always x8 organization and

93XX56B devices are always x16 organization.

After detection of a START condition the specified

number of clock cycles (respectively low to high transi-

tions of CLK) must be provided. These clock cycles are

required to clock in all required opcode, address and

data bits before an instruction is executed. CLK and DI

then become don't care inputs waiting for a new START

condition to be detected.

 2003 Microchip Technology Inc.

DS21794A-page 11

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

4.0

PACKAGING INFORMATION

4.1

Package Marking Information

MSOP 1st Line Marking Codes

Pb-free

8-Lead MSOP (150 mil)

Example:

Device

std mark

mark

3L56BI

2281L7

93AA56A

93AA56B

93AA56C

93LC56A

93LC56B

93LC56C

93C56A

XXXXXXT

YWWNNN

3A56AT

3A56BT

3A56CT

3L56AT

3L56BT

3L56CT

3C56AT

3C56BT

3C56CT

GA56AT

GA56BT

GA56CT

GL56AT

GL56BT

GL56CT

GC56AT

93C56B

93C56C

GC56BT

GC56CT

Example:

6-Lead SOT-23

T = blank for commercial, “I” for Industrial,

“E” for Extended.

2EL7

XXNN

SOT23 Marking Codes

Device

I-temp

E-temp

Example:

8-Lead PDIP

93AA56A

93AA56B

93LC56A

93LC56B

93C56A

2BNN

2LNN

2ENN

2PNN

2HNN

2TNN

–

93LC56B

I/P 1L7

2FNN

2RNN

2JNN

2UNN

XXXXXXXX

XXXXXNNN

0228

YYWW

93C56B

Pb-free topside mark is same; Pb-free

noted only on carton label.

Example:

8-Lead SOIC

93LC56B

I/SN 0228

XXXXXXXX

TSSOP 1st Line Marking Codes

Pb-free

XXXXYYWW

1L7

NNN

Device

std mark

mark

93AA56A

93AA56B

93AA56C

93LC56A

93LC56B

93LC56C

93C56A

A56A

A56B

A56C

L56A

L56B

L56C

C56A

C56B

C56C

GABA

GABB

GABC

GLBA

GLBB

GLBC

GCBA

Example:

8-Lead TSSOP

L56B

I228

1L7

XXXX

TYWW

NNN

93C56B

93C56C

GCBB

GCBC

Temperature grade is marked on line 2.

Legend: XX...X Part number

T Temperature

Blank Commercial

I

Industrial

Extended

E

YY

Year code (last 2 digits of calendar year) except TSSOP

and MSOP which use only the last 1 digit

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

WW

NNN

Note: Custom marking available.

DS21794A-page 12

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

E

E1

p

D

2

B

n

1

α

A2

A

c

φ

A1

(F)

L

β

Units

Dimension Limits

INCHES

NOM

MILLIMETERS*

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026 BSC

0.65 BSC

Overall Height

A

A2

A1

E

-

.043

-

0.85

-

1.10

Molded Package Thickness

Standoff

.030

.000

.033

-

.037

.006

0.75

0.95

0.15

0.00

Overall Width

.193 TYP.

4.90 BSC

Molded Package Width

Overall Length

Foot Length

E1

D

.118 BSC

3.00 BSC

L

.016

.024

.037 REF

.031

0.40

0.60

0.95 REF

0.80

Footprint (Reference)

Foot Angle

F

φ

c

0°

.003

.009

5°

-

8°

.009

.016

15°

0°

0.08

0.22

5°

-

8°

0.23

0.40

15°

Lead Thickness

Lead Width

.006

B

α

β

.012

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

Notes:

-

5°

15°

5°

15°

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

 2003 Microchip Technology Inc.

DS21794A-page 13

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

6-Lead Plastic Small Outline Transistor (CH) (SOT23)

E

E1

B

p1

D

n

1

α

c

A

A2

φ

A1

L

β

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

6

MAX

n

p

Number of Pins

Pitch

6

.038

.075

.046

.043

.003

.110

.064

.116

.018

5

0.95

1.90

p1

Outside lead pitch (basic)

Overall Height

A

A2

A1

E

.035

.057

0.90

1.18

1.10

0.08

2.80

1.63

2.95

0.45

5

1.45

1.30

0.15

3.00

1.75

3.10

0.55

10

Molded Package Thickness

Standoff

.035

.000

.102

.059

.110

.014

0

.051

.006

.118

.069

.122

.022

10

0.00

2.60

1.50

2.80

0.35

0

Overall Width

Molded Package Width

Overall Length

Foot Length

E1

D

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.004

.014

0

.006

.017

5

.008

.020

10

0.09

0.35

0

0.15

0.43

5

0.20

0.50

10

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

Notes:

0

5

10

0

5

10

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed .005" (0.127mm) per side.

JEITA (formerly EIAJ) equivalent: SC-74A

Drawing No. C04-120

DS21794A-page 14

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A2

A

L

c

A1

β

B1

B

p

eB

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.100

.155

.130

2.54

Top to Seating Plane

A

.140

.170

3.56

2.92

3.94

3.30

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

5

.145

3.68

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

5

.313

.250

.373

.130

.012

.058

.018

.370

10

.325

.260

.385

.135

.015

.070

.022

.430

15

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

10

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

15

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

B1

B

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

§

eB

α

β

5

10

15

5

10

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

 2003 Microchip Technology Inc.

DS21794A-page 15

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

n

1

h

α

45°

c

A2

A

φ

β

L

A1

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.050

.061

.056

.007

.237

.154

.193

.015

.025

4

1.27

Overall Height

A

.053

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

4

1.75

Molded Package Thickness

Standoff

A2

A1

E

.052

.004

.228

.146

.189

.010

.019

0

.061

.010

.244

.157

.197

.020

.030

8

1.55

0.25

6.20

3.99

5.00

0.51

0.76

8

§

0.10

5.79

3.71

4.80

0.25

0.48

0

Overall Width

Molded Package Width

Overall Length

E1

D

Chamfer Distance

Foot Length

h

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.008

.013

0

.009

.017

12

.010

.020

15

0.20

0.33

0

0.23

0.42

12

0.25

0.51

15

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

DS21794A-page 16

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

E

E1

p

D

2

1

n

B

α

A

c

A1

A2

φ

β

L

Units

INCHES

NOM

MILLIMETERS*

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026

0.65

Overall Height

A

.043

1.10

Molded Package Thickness

Standoff

A2

A1

E

.033

.035

.004

.251

.173

.118

.024

4

.037

.006

.256

.177

.122

.028

8

0.85

0.05

0.90

0.10

6.38

4.40

3.00

0.60

4

0.95

0.15

6.50

4.50

3.10

0.70

8

§

.002

.246

.169

.114

.020

0

Overall Width

6.25

4.30

2.90

0.50

0

Molded Package Width

Molded Package Length

Foot Length

E1

D

L

φ

Foot Angle

c

Lead Thickness

.004

.007

0

.006

.010

5

.008

.012

10

0.09

0.19

0

0.15

0.25

5

0.20

0.30

10

Lead Width

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-086

 2003 Microchip Technology Inc.

DS21794A-page 17

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

NOTES:

DS21794A-page 18

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

ON-LINE SUPPORT

SYSTEMS INFORMATION AND

UPGRADE HOT LINE

Microchip provides on-line support on the Microchip

World Wide Web site.

The Systems Information and Upgrade Line provides

system users a listing of the latest versions of all of

Microchip's development systems software products.

Plus, this line provides information on how customers

can receive the most current upgrade kits.The Hot Line

Numbers are:

The web site is used by Microchip as a means to make

files and information easily available to customers. To

view the site, the user must have access to the Internet

®

and a web browser, such as Netscape or Microsoft

Internet Explorer. Files are also available for FTP

download from our FTP site.

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

Connecting to the Microchip Internet

Web Site

042003

The Microchip web site is available at the following

URL:

www.microchip.com

The file transfer site is available by using an FTP ser-

vice to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of

services. Users may download files for the latest

Development Tools, Data Sheets, Application Notes,

User's Guides, Articles and Sample Programs. A vari-

ety of Microchip specific business information is also

available, including listings of Microchip sales offices,

distributors and factory representatives. Other data

available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked

Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to

Microchip Products

• Conferences for products, Development Systems,

technical information and more

• Listing of seminars and events

 2003 Microchip Technology Inc.

DS21794A-page 19

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

DS21794A

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21794A-page 20

 2003 Microchip Technology Inc.

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

/XX

X

PART NO.

Device

X

Examples:

a)

b)

c)

93AA56C-I/MS: 2K, 256x8 or 128x16 Serial

Package

Lead Finish

Tape & Reel Temperature

Range

Pinout

EEPROM, MSOP package, 1.8V

93AA56B-I/MS: 2K, 128x16 Serial EEPROM,

MSOP package, 1.8V

93AA56AT-I/OT: 2K, 256x8 Serial EEPROM,

SOT-23 package, tape and reel, 1.8V

Device

93AA56A: 2K 1.8V Microwire Serial EEPROM

93AA56B: 2K 1.8V Microwire Serial EEPROM

93AA56C: 2K 1.8V Microwire Serial EEPROM w/ORG

d)

93AA56CT-I/MS: 2K, 256x8 or 128x16 Serial

EEPROM, MSOP package, tape and reel, 1.8V

93LC56A: 2K 2.5V Microwire Serial EEPROM

93LC56B: 2K 2.5V Microwire Serial EEPROM

93LC56C: 2K 2.5V Microwire Serial EEPROM w/ORG

a)

b)

c)

93LC56A-I/MS: 2K, 256x8 Serial EEPROM,

MSOP package, 2.5V

93C56A: 2K 5.0V Microwire Serial EEPROM

93C56B: 2K 5.0V Microwire Serial EEPROM

93C56C: 2K 5.0V Microwire Serial EEPROM w/ORG

93LC56BT-I/OT: 2K, 128x16 Serial EEPROM,

SOT-23 package, tape and reel, 2.5V

93LC56B-I/MS: 2K, 128x16 Serial EEPROM,

MSOP package, 2.5V

Pinout:

Blank

X

=

Standard pinout

Rotated pinout

d)

93LC56BXT-I/SNG: 2K, 128x16 Serial

EEPROM, SOIC package, rotated pinout,

Industrial temperature, Pb-free finish, 2.5V

Tape & Reel:

Temperature Range

Package

Blank

T

=

Standard packaging

Tape & Reel

a)

b)

c)

93C56B-I/MS: 2K, 128x16 Serial EEPROM,

MSOP package, 5.0V

93C56C-I/MS: 2K, 256x8 or 128x16 Serial

EEPROM, MSOP package, 5.0V

I

E

=

-40°C to +85°C

-40°C to +125°C

93C56AT-I/OT: 2K, 256x8 Serial EEPROM,

SOT-23 package, tape and reel, 5.0V

MS

OT

P

SN

ST

=

Plastic MSOP (Micro Small outline, 8-lead)

SOT-23, 6-lead (Tape & Reel only)

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

TSSOP, 8-lead

Lead Finish:

Blank

G

=

Standard 63% / 37% SnPb

Pure Matte Sn

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences

and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of

the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2003 Microchip Technology Inc.

DS21794A-page 21

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

NOTES:

DS21794A-page 22

 2003 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications. No

representation or warranty is given and no liability is assumed by

Microchip Technology Incorporated with respect to the accuracy

or use of such information, or infringement of patents or other

intellectual property rights arising from such use or otherwise.

Use of Microchip’s products as critical components in life

support systems is not authorized except with express written

approval by Microchip. No licenses are conveyed, implicitly or

otherwise, under any intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, K^EELOQ,

MPLAB, PIC, PICmicro, PICSTART, PRO MATE and

PowerSmart are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL

and The Embedded Control Solutions Company are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

Accuron, Application Maestro, dsPIC, dsPICDEM,

dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,

fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,

microPort, Migratable Memory, MPASM, MPLIB, MPLINK,

MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,

PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,

SmartSensor, SmartShunt, SmartTel and Total Endurance are

trademarks of Microchip Technology Incorporated in the U.S.A.

and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark of

Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company’s quality system processes and

procedures are QS-9000 compliant for its

®

PICmicro 8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip’s quality system for the

design and manufacture of development

systems is ISO 9001 certified.

 2003 Microchip Technology Inc.

DS21794A - page 23

WORLDWIDE SALES AND SERVICE

Japan

Microchip Technology Japan K.K.

Benex S-1 6F

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

AMERICAS

ASIA/PACIFIC

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200 Fax: 480-792-7277

Technical Support: 480-792-7627

Web Address: http://www.microchip.com

Australia

Microchip Technology Australia Pty Ltd

Marketing Support Division

Suite 22, 41 Rawson Street

Epping 2121, NSW

Australia

Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

Korea

Atlanta

Microchip Technology Korea

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

China - Beijing

3780 Mansell Road, Suite 130

Alpharetta, GA 30022

Tel: 770-640-0034 Fax: 770-640-0307

Microchip Technology Consulting (Shanghai)

Co., Ltd., Beijing Liaison Office

Unit 915

Tel: 82-2-554-7200 Fax: 82-2-558-5934

Boston

Bei Hai Wan Tai Bldg.

Singapore

2 Lan Drive, Suite 120

Westford, MA 01886

Tel: 978-692-3848 Fax: 978-692-3821

No. 6 Chaoyangmen Beidajie

Beijing, 100027, No. China

Tel: 86-10-85282100 Fax: 86-10-85282104

Microchip Technology Singapore Pte Ltd.

200 Middle Road

#07-02 Prime Centre

Singapore, 188980

Tel: 65-6334-8870 Fax: 65-6334-8850

Chicago

China - Chengdu

333 Pierce Road, Suite 180

Itasca, IL 60143

Tel: 630-285-0071 Fax: 630-285-0075

Microchip Technology Consulting (Shanghai)

Co., Ltd., Chengdu Liaison Office

Rm. 2401-2402, 24th Floor,

Ming Xing Financial Tower

No. 88 TIDU Street

Taiwan

Microchip Technology (Barbados) Inc.,

Taiwan Branch

11F-3, No. 207

Tung Hua North Road

Taipei, 105, Taiwan

Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

Dallas

4570 Westgrove Drive, Suite 160

Addison, TX 75001

Tel: 972-818-7423 Fax: 972-818-2924

Chengdu 610016, China

Tel: 86-28-86766200 Fax: 86-28-86766599

China - Fuzhou

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250 Fax: 248-538-2260

Microchip Technology Consulting (Shanghai)

Co., Ltd., Fuzhou Liaison Office

Unit 28F, World Trade Plaza

No. 71 Wusi Road

Fuzhou 350001, China

Tel: 86-591-7503506 Fax: 86-591-7503521

EUROPE

Austria

Microchip Technology Austria GmbH

Durisolstrasse 2

A-4600 Wels

Kokomo

2767 S. Albright Road

Kokomo, Indiana 46902

Tel: 765-864-8360 Fax: 765-864-8387

China - Hong Kong SAR

Austria

Microchip Technology Hongkong Ltd.

Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

Kwai Fong, N.T., Hong Kong

Tel: 852-2401-1200 Fax: 852-2401-3431

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

Microchip Technology Nordic ApS

Regus Business Centre

Lautrup hoj 1-3

Los Angeles

18201 Von Karman, Suite 1090

Irvine, CA 92612

Tel: 949-263-1888 Fax: 949-263-1338

China - Shanghai

Microchip Technology Consulting (Shanghai)

Co., Ltd.

Room 701, Bldg. B

Far East International Plaza

No. 317 Xian Xia Road

Shanghai, 200051

Ballerup DK-2750 Denmark

Tel: 45 4420 9895 Fax: 45 4420 9910

Phoenix

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7966 Fax: 480-792-4338

France

Microchip Technology SARL

Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

Batiment A - ler Etage

91300 Massy, France

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

San Jose

Microchip Technology Inc.

2107 North First Street, Suite 590

San Jose, CA 95131

Tel: 86-21-6275-5700 Fax: 86-21-6275-5060

China - Shenzhen

Microchip Technology Consulting (Shanghai)

Co., Ltd., Shenzhen Liaison Office

Rm. 1812, 18/F, Building A, United Plaza

No. 5022 Binhe Road, Futian District

Shenzhen 518033, China

Tel: 408-436-7950 Fax: 408-436-7955

Germany

Microchip Technology GmbH

Steinheilstrasse 10

D-85737 Ismaning, Germany

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Toronto

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada

Tel: 905-673-0699 Fax: 905-673-6509

Tel: 86-755-82901380 Fax: 86-755-82966626

China - Qingdao

Rm. B505A, Fullhope Plaza,

Italy

No. 12 Hong Kong Central Rd.

Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

Microchip Technology SRL

Via Quasimodo, 12

20025 Legnano (MI)

Milan, Italy

India

Microchip Technology Inc.

India Liaison Office

Marketing Support Division

Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Tel: 39-0331-742611 Fax: 39-0331-466781

United Kingdom

Microchip Ltd.

505 Eskdale Road

Winnersh Triangle

Wokingham

Berkshire, England RG41 5TU

Tel: 44 118 921 5869 Fax: 44-118 921-5820

03/25/03

DS21794A-page 24

 2003 Microchip Technology Inc.


型号：	93AA56CT-I/STG
厂家：	MICROCHIP
描述：	128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟光电二极管内存集成电路
文件：	总24页 (文件大小：486K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

93AA56CT-I/STG [MICROCHIP]

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