93C86CT-E/SNG [MICROCHIP]

1K X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8;


型号：	93C86CT-E/SNG
厂家：	MICROCHIP
描述：	1K X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件：	总20页 (文件大小：214K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Not recommended for new designs –

Please use 93LC76C or 93LC86C.

93C76/86

8K/16K 5.0V Microwire Serial EEPROM

Features:

Package Types

• Single 5.0V supply

PDIP Package

• Low-power CMOS technology

- 1 mA active current typical

• ORG pin selectable memory configuration

1024 x 8- or 512 x 16-bit organization (93C76)

2048 x 8- or 1024 x 16-bit organization (93C86)

VCC

CLK

ORG

VSS

• Self-timed erase and write cycles

(including auto-erase)

• Automatic ERAL before WRAL

• Power on/off data protection circuitry

• Industry standard 3-wire serial I/O

• Device status signal during erase/write cycles

• Sequential read function

SOIC Package

CLK

VCC

ORG

VSS

• 1,000,000 erase/write cycles ensured

• Data retention > 200 years

• 8-pin PDIP/SOIC package

• Temperature ranges supported

- Commercial (C):

- Industrial (I):

- Automotive (E)

0°C to +70°C

-40°C to +85°C

-40°C to +125°C

Block Diagram

VCC VSS

Description:

The Microchip Technology Inc. 93C76/86 are 8K and

16K low voltage serial Electrically Erasable PROMs.

The device memory is configured as x8 or x16 bits

depending on the ORG pin setup. Advanced CMOS

technology makes these devices ideal for low power

nonvolatile memory applications. These devices also

have a Program Enable (PE) pin to allow the user to

write protect the entire contents of the memory array.

The 93C76/86 is available in standard 8-pin PDIP and

8-pin surface mount SOIC packages.

Address

Decoder

Memory

Array

Address

Counter

Data

Output

Buffer

Mode

Decode

Logic

Clock

Generator

CLK

 1996-2012 Microchip Technology Inc.

DS21132F-page 1

93C76/86

1.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................7.0V

All inputs and outputs w.r.t. VSS ........................................................................................................-0.6V to Vcc + 1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-40°C to +125°C

Soldering temperature of leads (10 seconds) .......................................................................................................+300°C

ESD protection on all pins..........................................................................................................................................4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at these or any other conditions above those

indicated in the operational listings of this specification is not implied. Exposure to Absolute Maximum Rating

conditions for extended periods may affect device reliability.

1.1

AC Test Conditions

AC Waveform:

VLO = 2.0V

VHI = Vcc - 0.2V

VHI = 4.0V for

(Note 1)

(Note 2)

Timing Measurement Reference Level

Input

0.5 VCC

Output

Note 1: For VCC  4.0V

2: For VCC > 4.0V

DS21132F-page 2

 1996-2012 Microchip Technology Inc.

93C76/86

TABLE 1-1:

DC CHARACTERISTICS

Applicable over recommended operating ranges shown below unless otherwise noted:

VCC = +4.5V to +5.5V

DC CHARACTERISTICS Commercial (C): TA = 0°C to -40°C

Industrial

(I): TA = -40°C to +85°C

Automotive

(E): TA = -40C to +125C

Parameter

Symbol

Min.

Max.

Units

Conditions

High-level input voltage

Low-level input voltage

Low-level output voltage

VIH1

VIL1

VOL1

VOL2

VOH1

VOH2

ILI

2.0

-0.3

—

VCC +1

0.8

0.4

0.2

—

IOL = 2.1 mA; VCC = 4.5V

IOL =100 A; VCC = 4.5V

IOH = -400 A; VCC = 4.5V

IOH = -100 A; VCC = 4.5V.

VIN = 0.1V to VCC

—

High-level output voltage

2.4

VCC-0.2

-10

—

Input leakage current

Output leakage current

A

ILO

-10

VOUT = 0.1V to VCC

Pin capacitance

CINT

—

(Note 1)

(all inputs/outputs)

TA = +25°C, FCLK = 1 MHz

Operating current

ICC write

ICC read

ICCS

—

A

FCLK = 2 MHz; VCC = 5.5V

1.5

100

Standby current

CLK = CS = 0V; VCC = 5.5V

DI = PE = VSS

ORG = VSS or VCC

Note 1: This parameter is periodically sampled and not 100% tested.

TABLE 1-2: AC CHARACTERISTICS

Applicable over recommended operating ranges shown below unless otherwise noted:

VCC = +4.5V to +5.5V

AC CHARACTERISTICS Commercial (C): TA = 0°C to -40°C

Industrial

(I): TA = -40°C to +85°C

Automotive

(E): TA = -40C to +125C

Parameter

Clock frequency

Symbol

Min.

Max.

Units

Conditions

FCLK

TCKH

TCKL

TCSS

TCSH

TCSL

TDIS

TDIH

TPD

—

300

200

—

MHz

Vcc  4.5V

Clock high time

Clock low time

—

Chip select setup time

Chip select hold time

Chip select low time

Data input setup time

Data input hold time

Data output delay time

Data output disable time

Status valid time

—

Relative to CLK

—

250

100

—

Relative to CLK

CL = 100 pF

—

400

100

500

—

TCZ

—

(Note 1)

T_SV

—

CL = 100 pF

Program cycle time

TWC

TEC

—

Erase/Write mode (Note 2)

ERAL mode

—

TWL

—

WRAL mode

Endurance

cycles 25°C, VCC = 5.0V, Block mode

(Note 3)

Note 1: This parameter is periodically sampled and not 100% tested.

2: Typical program cycle is 4 ms per word.

3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance^™Model which can be obtained from Microchip’s web site

at www.microchip.com.

 1996-2012 Microchip Technology Inc.

DS21132F-page 3

93C76/86

TABLE 1-3:

INSTRUCTION SET FOR 93C76: ORG=1 (X16 ORGANIZATION)

Instruction SB Opcode

Address

Data In

Data Out

Req. CLK Cycles

READ

EWEN

ERASE

ERAL

WRITE

WRAL

EWDS

X A8 A7 A6 A5 A4 A3 A2 A1 A0

1 1 X X X X X X X X

X A8 A7 A6 A5 A4 A3 A2 A1 A0

1 0 X X X X X X X X

X A8 A7 A6 A5 A4 A3 A2 A1 A0

0 1 X X X X X X X X

0 0 X X X X X X X X

—

D15 - D0

High-Z

(RDY/BSY)

D15 - D0 (RDY/BSY)

—

High-Z

TABLE 1-4:

INSTRUCTION SET FOR 93C76: ORG=0 (X8 ORGANIZATION)

Req. CLK

Cycles

Instruction SB Opcode

Address

Data In

Data Out

READ

EWEN

ERASE

ERAL

WRITE

WRAL

EWDS

X A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

1 1 X X X X X X X X X

X A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

1 0 X X X X X X X X X

X A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

0 1 X X X X X X X X X

0 0 X X X X X X X X X

—

D7 - D0

High-Z

(RDY/BSY)

D7 - D0 (RDY/BSY)

—

High-Z

TABLE 1-5:

INSTRUCTION SET FOR 93C86: ORG=1 (X16 ORGANIZATION)

Instruction SB Opcode

Address

Data In

Data Out

Req. CLK Cycles

READ

EWEN

ERASE

ERAL

WRITE

WRAL

EWDS

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

1 1 X X X X X X X X

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

1 0 X X X X X X X X

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

0 1 X X X X X X X X

0 0 X X X X X X X X

—

D15 - D0

High-Z

(RDY/BSY)

D15 - D0 (RDY/BSY)

—

High-Z

TABLE 1-6:

INSTRUCTION SET FOR 93C86: ORG=0 (X8 ORGANIZATION)

Instruction SB Opcode

Address

Data In

Data Out Req. CLK Cycles

READ

EWEN

ERASE

ERAL

WRITE

WRAL

EWDS

A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

1 1 X X X X X X X X X

A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

1 0 X X X X X X X X X

—

D7 - D0

High-Z

(RDY/BSY)

A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 - D0 (RDY/BSY)

0 1 X X X X X X X X X

0 0 X X X X X X X X X

D7 - D0 (RDY/BSY)

High-Z

—

DS21132F-page 4

 1996-2012 Microchip Technology Inc.

93C76/86

2.3

Erase/Write Enable and Disable

(EWEN, EWDS)

2.0

PRINCIPLES OF OPERATION

When the ORG pin is connected to VCC, the x16 orga-

nization is selected. When it is connected to ground,

the x8 organization is selected. Instructions, addresses

and write data are clocked into the DI pin on the rising

edge of the clock (CLK). The DO pin is normally held in

a high-Z state except when reading data from the

device, or when checking the Ready/Busy status

during a programming operation. The Ready/Busy

status can be verified during an erase/write operation

by polling the DO pin; DO low indicates that program-

ming is still in progress, while DO high indicates the

device is ready. The DO will enter the high-impedance

state on the falling edge of the CS.

The 93C76/86 powers up in the Erase/Write Disable

(EWDS) state. All programming modes must be

preceded by an Erase/Write Enable (EWEN) instruction.

Once the EWEN instruction is executed, programming

remains enabled until an EWDS instruction is executed

or VCC is removed from the device. To protect against

accidental data disturb, the EWDS instruction can be

used to disable all erase/write functions and should

follow all programming operations. Execution of a READ

instruction is independent of both the EWEN and EWDS

instructions.

2.4

Data Protection

2.1

Start Condition

During power-up, all programming modes of operation

are inhibited until VCC has reached a level greater than

1.4V. During power-down, the source data protection

circuitry acts to inhibit all programming modes when

VCC has fallen below 1.4V.

The Start bit is detected by the device if CS and DI are

both high with respect to the positive edge of CLK for

the first time.

Before a Start condition is detected, CS, CLK and DI

may change in any combination (except to that of a

Start condition), without resulting in any device opera-

tion (Read, Write, Erase, EWEN, EWDS, ERAL and

WRAL). As soon as CS is high, the device is no longer

in the Standby mode.

The EWEN and EWDS commands give additional

protection against accidentally programming during

normal operation.

After power-up, the device is automatically in the

EWDS mode. Therefore, an EWEN instruction must be

performed before any ERASE or WRITE instruction can

be executed.

An instruction following a Start condition will only be

executed if the required amount of opcode, address

and data bits for any particular instruction are clocked

in.

After execution of an instruction (i.e., clock in or out of

the last required address or data bit) CLK and DI

become “don't care” bits until a new Start condition is

detected.

2.2

DI/DO

It is possible to connect the Data In and Data Out pins

together. However, with this configuration it is possible

for a “bus conflict” to occur during the “dummy zero”

that precedes the read operation, if A0 is a logic high

level. Under such a condition the voltage level seen at

Data Out is undefined and will depend upon the relative

impedances of Data Out and the signal source driving

A0. The higher the current sourcing capability of A0,

the higher the voltage at the Data Out pin.

 1996-2012 Microchip Technology Inc.

DS21132F-page 5

93C76/86

3.4

Erase All (ERAL)

3.0

3.1

DEVICE OPERATION

The ERAL instruction will erase the entire memory array

to the logical “1” state. The ERAL cycle is identical to

the erase cycle except for the different opcode. The

ERAL cycle is completely self-timed and commences

on the rising edge of the last address bit (A0). Note that

the Least Significant 8 or 9 address bits are "don’t care"

bits, depending on selection of x16 or x8 mode. Clock-

ing of the CLK pin is not necessary after the device has

entered the self clocking mode. The ERAL instruction is

ensured at Vcc = +4.5V to +5.5V.

Read

The READ instruction outputs the serial data of the

addressed memory location on the DO pin. A dummy

zero bit precedes the 16-bit (x16 organization) or 8-bit

(x8 organization) output string. The output data bits will

toggle on the rising edge of the CLK and are stable

after the specified time delay (TPD). Sequential read is

possible when CS is held high and clock transitions

continue. The memory address pointer will automati-

cally increment and output data sequentially.

The DO pin indicates the Ready/Busy status of the

device if the CS is high. The Ready/Busy status will be

displayed on the DO pin until the next Start bit is

received as long as CS is high. Bringing the CS low will

place the device in Standby mode and cause the DO

pin to enter the high-impedance state. DO at logical “0”

indicates that programming is still in progress. DO at

logical “1” indicates that the entire device has been

erased and is ready for another instruction.

3.2

Erase

The ERASE instruction forces all data bits of the

specified address to the logical “1” state. The self-timed

programming cycle is initiated on the rising edge of

CLK as the last address bit (A0) is clocked in. At this

point, the CLK, CS and DI inputs become “don’t cares”.

The DO pin indicates the Ready/Busy status of the

device if the CS is high. The Ready/Busy status will be

displayed on the DO pin until the next Start bit is

received as long as CS is high. Bringing the CS low will

place the device in Standby mode and cause the DO

pin to enter the high-impedance state. DO at logical “0”

indicates that programming is still in progress. DO at

logical “1” indicates that the register at the specified

address has been erased and the device is ready for

another instruction.

The ERAL cycle takes 15 ms maximum (8 ms typical).

3.5

Write All (WRAL)

The WRAL instruction will write the entire memory array

with the data specified in the command. The WRAL

cycle is completely self-timed and commences on the

rising edge of the last address bit (A0). Note that the

Least Significant 8 or 9 address bits are “don’t cares”,

depending on selection of x16 or x8 mode. Clocking of

the CLK pin is not necessary after the device has

entered the self clocking mode. The WRAL command

does include an automatic ERAL cycle for the device.

Therefore, the WRAL instruction does not require an

ERAL instruction but the chip must be in the EWEN

status. The WRAL instruction is ensured at Vcc = +4.5V

to +5.5V.

The erase cycle takes 3 ms per word (typical).

3.3

Write

The WRITE instruction is followed by 16 bits (or by 8

bits) of data to be written into the specified address.

The self-timed programming cycle is initiated on the

rising edge of CLK as the last data bit (D0) is clocked

in. At this point, the CLK, CS and DI inputs become

“don’t cares”.

The DO pin indicates the Ready/Busy status of the

device if the CS is high. The Ready/Busy status will be

displayed on the DO pin until the next Start bit is

received as long as CS is high. Bringing the CS low will

place the device in Standby mode and cause the DO

pin to enter the high-impedance state. DO at logical “0”

indicates that programming is still in progress. DO at

logical “1” indicates that the entire device has been

written and is ready for another instruction.

The DO pin indicates the Ready/Busy status of the

device if the CS is high. The Ready/Busy status will be

displayed on the DO pin until the next Start bit is

received as long as CS is high. Bringing the CS low will

place the device in Standby mode and cause the DO

pin to enter the high-impedance state. DO at logical “0”

indicates that programming is still in progress. DO at

logical “1” indicates that the register at the specified

address has been written and the device is ready for

another instruction.

The WRAL cycle takes 30 ms maximum (16 ms

typical).

The write cycle takes 3 ms per word (typical).

DS21132F-page 6

 1996-2012 Microchip Technology Inc.

93C76/86

FIGURE 3-1:

SYNCHRONOUS DATA TIMING

VIH

CLK

TCSS

TCKH

TCKL

VIL

VIH

TCSH

TDIH

VIL

TDIS

VIH

VIL

TCZ

TPD

VOH

(Read)

VOL

VOH

VOL

TCZ

TSV

(Program)

Status Valid

The memory automatically cycles to the next register.

FIGURE 3-2:

READ

TCSL

CLK

...

A_N

A₀

High-impedance

...

D_N

D₀

D_N

D₀

FIGURE 3-3:

EWEN

TCSL

CLK

...

ORG = VCC, 8 X’S

ORG = VSS, 9 X’S

 1996-2012 Microchip Technology Inc.

DS21132F-page 7

93C76/86

FIGURE 3-4:

EWDS

TCSL

CLK

...

ORG = VCC, 8 X’s

ORG = VSS, 9 X’S

FIGURE 3-5:

WRITE

Standby

CLK

...

A_N

A₀

D_N

D₀

TCZ

High-impedance

Busy

Ready

TWC

FIGURE 3-6:

WRAL

Standby

CLK

...

D_N

D₀

TCZ

High-impedance

Busy

Ready

TWL

ORG = VCC, 8 X’s

ORG = VSS, 9 X’s

Ensure at Vcc = +4.5V to +5.5V.

DS21132F-page 8

 1996-2012 Microchip Technology Inc.

93C76/86

FIGURE 3-7:

ERASE

Standby

CLK

...

A_N

A₀

TCZ

High-impedance

Busy

Ready

TWC

FIGURE 3-8:

ERAL

Standby

CLK

...

TCZ

High-impedance

Busy

Ready

TEC

ORG = VCC, 8 X’s

ORG = VSS, 9 X’s

Ensure at VCC = +4.5V to +5.5V.

 1996-2012 Microchip Technology Inc.

DS21132F-page 9

93C76/86

After detection of a Start condition the specified number

of clock cycles (respectively low-to-high transitions of

CLK) must be provided. These clock cycles are

required to clock in all opcode, address, and data bits

before an instruction is executed (see Table 1-3

through Table 1-6 for more details). CLK and DI then

become don't care inputs waiting for a new Start

condition to be detected.

4.0

PIN DESCRIPTIONS

TABLE 4-1:

Name

PIN FUNCTION TABLE

Function

CLK

Chip Select

Serial Data Clock

Serial Data Input

Serial Data Output

Ground

Note:

CS must go low between consecutive

instructions, except when performing a

sequential read (Refer to Section 3.1

“Read” for more detail on sequential

reads).

VSS

ORG

Memory Configuration

Program Enable

Power Supply

VCC

4.3

Data In (DI)

4.1

Chip Select (CS)

Data In is used to clock in a Start bit, opcode, address

and data synchronously with the CLK input.

A high level selects the device. A low level deselects

the device and forces it into Standby mode. However, a

programming cycle which is already initiated will be

completed, regardless of the CS input signal. If CS is

brought low during a program cycle, the device will go

into Standby mode as soon as the programming cycle

is completed.

4.4

Data Out (DO)

Data Out is used in the Read mode to output data

synchronously with the CLK input (TPD after the

positive edge of CLK).

This pin also provides Ready/Busy status information

during erase and write cycles. Ready/Busy status

information is available when CS is high. It will be

displayed until the next Start bit occurs as long as CS

stays high.

CS must be low for 250 ns minimum (TCSL) between

consecutive instructions. If CS is low, the internal

control logic is held in a RESET status.

4.2

Serial Clock (CLK)

The Serial Clock is used to synchronize the communi-

cation between a master device and the 93C76/86.

Opcode, address and data bits are clocked in on the

positive edge of CLK. Data bits are also clocked out on

the positive edge of CLK.

4.5

Organization (ORG)

When ORG is connected to VCC, the x16 memory

organization is selected. When ORG is tied to VSS, the

x8 memory organization is selected. There is an

internal pull-up resistor on the ORG pin that will select

x16 organization when left unconnected.

CLK can be stopped anywhere in the transmission

sequence (at high or low level) and can be continued

anytime with respect to clock high time (TCKH) and

clock low time (TCKL). This gives the controlling master

freedom in preparing opcode, address and data.

4.6

Program Enable (PE)

This pin allows the user to enable or disable the ability

to write data to the memory array. If the PE pin is

floated or tied to VCC, the device can be programmed.

If the PE pin is tied to VSS, programming will be

inhibited. There is an internal pull-up on this device that

enables programming if this pin is left floating.

CLK is a “don't care” if CS is low (device deselected). If

CS is high, but Start condition has not been detected,

any number of clock cycles can be received by the

device without changing its status (i.e., waiting for Start

condition).

CLK cycles are not required during the self-timed write

(i.e., auto erase/write) cycle.

DS21132F-page 10

 1996-2012 Microchip Technology Inc.

93C76/86

5.0

5.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP

Example

XXXXXXXX

XXXXXNNN

YYWW

93C76

017

0410

Example

93C86

8-Lead SOIC (.150”)

XXXXXXXX

XXXXYYWW

/SN0410

017

NNN

Legend: XX...X Customer-specific information

NNN

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

 1996-2012 Microchip Technology Inc.

DS21132F-page 11

93C76/86

8-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging





Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.130

.170

3.56

2.92

3.94

3.30

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

.145

3.68

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

.313

.250

.373

.130

.012

.058

.018

.370

.325

.260

.385

.135

.015

.070

.022

.430

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

Tip to Seating Plane

Lead Thickness

Upper Lead Width

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom





* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

DS21132F-page 12

 1996-2012 Microchip Technology Inc.

93C76/86

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging



45





Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.050

1.27

Overall Height

.053

.061

.056

.007

.237

.154

.193

.015

.025

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

1.75

Molded Package Thickness

Standoff

.052

.004

.228

.146

.189

.010

.019

.061

.010

.244

.157

.197

.020

.030

1.55

0.25

6.20

3.99

5.00

0.51

0.76

0.10

5.79

3.71

4.80

0.25

0.48

Overall Width

Molded Package Width

Overall Length

Chamfer Distance

Foot Length



Foot Angle

Lead Thickness

Lead Width

.008

.013

.009

.017

.010

.020

0.20

0.33

0.23

0.42

0.25

0.51





Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

 1996-2012 Microchip Technology Inc.

DS21132F-page 13

93C76/86

APPENDIX A: REVISION HISTORY

Revision E

Added note to page 1 header (Not recommended for

new designs).

Added Section 5.0: Package Marking Information.

Added On-line Support page.

Updated document format.

Revision F

Added a note to each package outline drawing.

DS21132F-page 14

 1996-2012 Microchip Technology Inc.

93C76/86

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

Customers

should

contact

their

distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

Technical support is available through the web site

at: http://microchip.com/support

• Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the

registration instructions.

 1996-2012 Microchip Technology Inc.

DS21132F-page 15

93C76/86

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

documentation can better serve you, please FAX your comments to the Technical Publications Manager at

(480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

TO:

RE:

Technical Publications Manager

Reader Response

Total Pages Sent ________

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Literature Number: DS21132F

Application (optional):

Would you like a reply?

Device: 93C76/86

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21132F-page 16

 1996-2012 Microchip Technology Inc.

93C76/86

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

Device

/XX

XXX

Temperature

Range

Package

Pattern

Device

93C76/86: Microwire Serial EEPROM

93C76T/86T: Microwire Serial EEPROM (Tape and Reel)

Temperature Range Blank

0C to +70C

-40C to +85C

-40C to +125C

Package

Plastic DIP (300 mil Body), 8-lead

Plastic SOIC (150 mil Body), 8-lead

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

 1996-2012 Microchip Technology Inc.

DS21132F-page 17

93C76/86

NOTES:

DS21132F-page 18

 1996-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash

and UNI/O are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MTP, SEEVAL and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,

chipKIT, chipKIT logo, CodeGuard, dsPICDEM,

dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,

Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA

and Z-Scale are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip

Technology Germany II GmbH & Co. & KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 9781620767412

QUALITY MANAGEMENT SYSTEM

CERTIFIED BY DNV

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

== ISO/TS 16949 ==

 1996-2012 Microchip Technology Inc.

DS21132F-page 19

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Web Address:

www.microchip.com

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Osaka

Tel: 81-66-152-7160

Fax: 81-66-152-9310

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

China - Beijing

Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Korea - Seoul

China - Hangzhou

Tel: 86-571-2819-3187

Fax: 86-571-2819-3189

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Cleveland

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Los Angeles

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-213-7828

Fax: 886-7-330-9305

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Taipei

Tel: 886-2-2508-8600

Fax: 886-2-2508-0102

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Toronto

Mississauga, Ontario,

Canada

China - Xiamen

Tel: 905-673-0699

Fax: 905-673-6509

Tel: 86-592-2388138

Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

10/26/12

DS21132F-page 20

 1996-2012 Microchip Technology Inc.

93C86CT-E/SNG [MICROCHIP]

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