93LC76B_技术文档

93AA76A/B/C, 93LC76A/B/C,

93C76A/B/C

8K Microwire Compatible Serial EEPROM

Device Selection Table

Part Number

VCC Range

ORG Pin

PE Pin

Word Size

Temp Ranges

Packages

93AA76A

93AA76B

93LC76A

93LC76B

93C76A

1.8-5.5

1.8-5-5

2.5-5.5

4.5-5.5

1.8-5.5

2.5-5.5

4.5-5.5

No

8-bit

16-bit

I

OT

I

OT

No

8-bit

I, E

I

No

16-bit

OT

No

8-bit

OT

93C76B

No

16-bit

OT

93AA76C

93LC76C

93C76C

Yes

8 or 16-bit

P, SN, ST, MS

I, E

Features

Description

• Low-power CMOS technology

• ORG pin to select word size for ‘76C’ version

The Microchip Technology Inc. 93XX76A/B/C devices

are 8K bit, low-voltage, serial Electrically Erasable

PROMs (EEPROM). Word-selectable devices such as

the 93XX76C are dependent upon external logic

levels driving the ORG pin to set word size. For

dedicated 8-bit communication, the 93XX76A devices

are available, while the 93XX76B devices provide

dedicated 16-bit communication, available on SOT-23

devices only. A Program Enable (PE) pin allows the

user to write-protect the entire memory array.

Advanced CMOS technology makes these devices

ideal for low-power, nonvolatile memory applications.

The 93XX Series is available in standard packages

including 8-lead PDIP and SOIC, and advanced

packaging including 8-lead MSOP, 6-lead SOT-23,

and 8-lead TSSOP. Pb-free (Pure Matte Sn) finish is

also available.

• 1024 x 8-bit organization ‘A’ devices (no ORG)

• 512 x 16-bit organization ‘B’ devices (no ORG)

• Program Enable pin to write-protect the entire

array (except on SOT-23 packages)

• Self-timed ERASE/WRITE cycles (including

auto-erase)

• Automatic ERAL before WRAL

• Power-on/off data protection circuitry

• Industry standard 3-wire serial I/O

• Device Status signal (READY/BUSY)

• Sequential READ function

• 1,000,000 E/W cycles

• Data retention > 200 years

• Temperature ranges supported:

Package Types (not to scale)

- Industrial (I)

-40°C to +85°C

-40°C to +125°C

SOT-23

(OT)

PDIP/SOIC

(P, SN)

- Automotive (E)

Pin Function Table

CS

CLK

DI

1

2

3

4

8

7

6

5

V

CC

1

2

3

6

5

4

DO

V

CC

PE

VSS

CS

Name

Function

ORG

DI

CLK

CS

CLK

DI

Chip Select

DO

VSS

Serial Data Clock

Serial Data Input

Serial Data Output

Ground

TSSOP/MSOP

(ST, MS

)

DO

1

8

7

6

5

CS

CLK

DI

VCC

VSS

PE

2

3

4

PE

ORG

VSS

Program Enable

Memory Configuration

Power Supply

DO

ORG

VCC

 2004 Microchip Technology Inc.

DS21796D-page 1

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

1.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................7.0V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-40°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

TABLE 1-1:

DC CHARACTERISTICS

VCC = 1.8V to 5.5V

All parameters apply over the specified

ranges unless otherwise noted.

Industrial (I):

TA = -40°C to +85°C

Automotive (E): TA = -40°C to +125°C

Param.

No.

Symbol

Parameter

Min

Typ

Max

Units

Conditions

VCC ≥ 2.7V

D1

VIH1

VIH2

High-level input voltage

2.0

0.7 VCC

—

VCC +1

V

VCC < 2.7V

D2

D3

D4

VIL1

VIL2

Low-level input voltage

Low-level output voltage

High-level output voltage

-0.3

—

0.8

0.2 VCC

V

VCC ≥ 2.7V

VCC < 2.7V

VOL1

VOL2

—

0.4

0.2

V

IOL = 2.1 mA, VCC = 4.5V

IOL = 100 µA, VCC = 2.5V

VOH1

VOH2

2.4

VCC - 0.2

—

V

IOH = -400 µA, VCC = 4.5V

IOH = -100 µA, VCC = 2.5V

D5

D6

D7

ILI

Input leakage current

Output leakage current

—

±1

7

µA

pF

VIN = VSS to VCC

ILO

VOUT = VSS to VCC

CIN,

COUT

Pin capacitance (all inputs/

outputs)

VIN/VOUT = 0V (Note 1)

TA = 25°C, FCLK = 1 MHz

D8

D9

ICC write Write current

—

500

3

—

mA

µA

FCLK = 3 MHz, VCC = 5.5V

FCLK = 2 MHz, VCC = 2.5V

ICC read Read current

—

100

1

500

—

mA

µA

FCLK = 3 MHz, VCC = 5.5V

FCLK = 2 MHz, VCC = 3.0V

FCLK = 2 MHz, VCC = 2.5V

D10

D11

ICCS

Standby current

—

1

5

µA

I – Temp

E – Temp

CLK = Cs = 0V

ORG = DI = VSS or VCC

(Note 2) (Note 3)

VPOR

VCC voltage detect

93AA76A/B/C, 93LC76A/B/C

93C76A/B/C

—

1.5V

3.8V

—

V

(Note 1)

Note 1: This parameter is periodically sampled and not 100% tested.

2: ORG pin not available on ‘A’ or ‘B’ versions.

3: READY/BUSY status must be cleared from DO, see Section 3.4 “Data Out (DO)”.

DS21796D-page 2

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

TABLE 1-2:

AC CHARACTERISTICS

VCC = 1.8V to 5.5V

All parameters apply over the specified

ranges unless otherwise noted.

Industrial (I):

TA = -40°C to +85°C

Automotive (E): TA = -40°C to +125°C

Param.

No.

Symbol

Parameter

Clock frequency

Min

Max

Units

Conditions

A1

FCLK

—

3

2

1

MHz 4.5V ≤ VCC < 5.5V

MHz 2.5V ≤ VCC < 4.5V

MHz 1.8V ≤ VCC < 2.5V

A2

A3

A4

TCKH

TCKL

TCSS

Clock high time

200

250

450

—

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

Clock low time

100

200

450

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

Chip Select setup time

50

100

250

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

A5

A6

A7

TCSH

TCSL

TDIS

Chip Select hold time

Chip Select low time

Data input setup time

0

—

ns

1.8V ≤ VCC < 5.5V

250

50

100

250

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

A8

A9

TDIH

TPD

Data input hold time

50

100

250

—

ns

4.5V ≤ VCC < 5.5V

2.5V ≤ VCC < 4.5V

1.8V ≤ VCC < 2.5V

Data output delay time

—

100

250

400

ns

4.5V ≤ VCC < 5.5V, CL = 100 pF

2.5V ≤ VCC < 4.5V, CL = 100 pF

1.8V ≤ VCC < 2.5V, CL = 100 pF

A10

A11

TCZ

TSV

Data output disable time

Status valid time

—

100

200

ns

4.5V ≤ VCC < 5.5V, (Note 1)

1.8V ≤ VCC < 4.5V, (Note 1)

200

300

500

ns

4.5V ≤ VCC < 5.5V, CL = 100 pF

2.5V ≤ VCC < 4.5V, CL = 100 pF

1.8V ≤ VCC < 2.5V, CL = 100 pF

A12

A13

TWC

Program cycle time

—

5

ms

Erase/Write mode (AA and LC

versions)

2

ms

Erase/Write mode

(93C versions)

A14

A15

A16

TEC

TWL

—

6

ms

ERAL mode, 4.5V ≤ VCC ≤ 5.5V

WRAL mode, 4.5V ≤ VCC ≤ 5.5V

15

—

Endurance

1M

cycles 25°C, VCC = 5.0V, (Note 2)

Note 1: This parameter is periodically sampled and not 100% tested.

2: This application is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which may be obtained from

www.microchip.com.

 2004 Microchip Technology Inc.

DS21796D-page 3

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

FIGURE 1-1:

SYNCHRONOUS DATA TIMING

VIH

VIL

VIH

CS

TCSS

TCKH

TCKL

TCSH

CLK

DI

VIL

TDIS

TDIH

VIH

VIL

TCZ

TPD

VOH

DO

(READ)

VOL

VOH

TSV

DO

(PROGRAM)

STATUS VALID

VOL

Note: TSV is relative to CS.

TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1)

Req. CLK

Instruction SB Opcode

Address

Data In

Data Out

Cycles

READ

EWEN

ERASE

ERAL

WRITE

WRAL

EWDS

1

10

00

11

00

01

00

X

1

X

1

X

0

A8 A7 A6 A5 A4 A3 A2 A1 A0

—

D15 – D0

HIGH-Z

29

13

29

13

1

X

A8 A7 A6 A5 A4 A3 A2 A1 A0

(RDY/BSY)

0

X

A8 A7 A6 A5 A4 A3 A2 A1 A0 D15 – D0 (RDY/BSY)

1

0

X

D15 – D0 (RDY/BSY)

HIGH-Z

—

TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX76A OR 93XX76C WITH ORG = 0)

Req. CLK

Instruction SB Opcode

Address

Data In

Data Out

Cycles

READ

EWEN

ERASE

ERAL

WRITE

WRAL

EWDS

1

10

00

11

00

01

00

X

1

X

1

X

0

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

—

D7 – D0

HIGH-Z

22

14

22

14

1

X

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0

(RDY/BSY)

0

X

A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 – D0 (RDY/BSY)

1

0

X

D7 – D0 (RDY/BSY)

HIGH-Z

—

DS21796D-page 4

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

2.2

Data In/Data Out (DI/DO)

2.0

FUNCTIONAL DESCRIPTION

It is possible to connect the Data In and Data Out pins

together. However, with this configuration it is possible

for a “bus conflict” to occur during the “dummy zero”

that precedes the read operation, if A0 is a logic high-

level. Under such a condition the voltage level seen at

Data Out is undefined and will depend upon the relative

impedances of Data Out and the signal source driving

A0. The higher the current sourcing capability of the

driver, the higher the voltage at the Data Out pin. In

order to limit this current, a resistor should be

connected between DI and DO.

When the ORG* pin is connected to VCC, the (x16)

organization is selected. When it is connected to

ground, the (x8) organization is selected. Instructions,

addresses and write data are clocked into the DI pin on

the rising edge of the clock (CLK). The DO pin is

normally held in a HIGH-Z state except when reading

data from the device, or when checking the READY/

BUSY status during a programming operation. The

READY/BUSY status can be verified during an Erase/

Write operation by polling the DO pin; DO low indicates

that programming is still in progress, while DO high

indicates the device is ready. DO will enter the HIGH-Z

state on the falling edge of CS.

2.3

Data Protection

All modes of operation are inhibited when VCC is below

a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices

or 3.8V for ‘93C’ devices.

2.1

Start Condition

The Start bit is detected by the device if CS and DI are

both high with respect to the positive edge of CLK for

the first time.

The EWEN and EWDS commands give additional

protection against accidentally programming during

normal operation.

Before a Start condition is detected, CS, CLK and DI

may change in any combination (except to that of a

Start condition), without resulting in any device

operation (READ, WRITE, ERASE, EWEN, EWDS,

ERAL or WRAL). As soon as CS is high, the device is

no longer in Standby mode.

Note: For added protection, an EWDS command

should be performed after every write

operation.

After power-up, the device is automatically in the

EWDS mode. Therefore, an EWENinstruction must be

performed before the initial ERASEor WRITEinstruction

can be executed.

An instruction following a Start condition will only be

executed if the required opcode, address and data bits

for any particular instruction are clocked in.

Block Diagram

VCC

VSS

Address

Decoder

Memory

Array

Address

Counter

DO

Output

Buffer

Data Register

DI

Mode

Decode

Logic

ORG*

CS

PE*

Clock

Register

CLK

*ORG and PE inputs are not available on

A/B devices.

 2004 Microchip Technology Inc.

DS21796D-page 5

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

The DO pin indicates the READY/BUSY status of the

2.4

ERASE

device if CS is brought high after a minimum of 250 ns

low (TCSL). DO at logical ‘0’ indicates that programming

is still in progress. DO at logical ‘1’ indicates that the

register at the specified address has been erased and

the device is ready for another instruction.

The ERASEinstruction forces all data bits of the

specified address to the logical ‘1’ state. The rising

edge of CLK before the last address bit initiates the

write cycle.

Note:

Issuing a Start bit and then taking CS low

will clear the READY/BUSY status from

DO.

FIGURE 2-1:

ERASE TIMING

TCSL

CS

CHECK STATUS

CLK

DI

1

AN

AN-1 AN-2

A0

•••

1

TSV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

TWC

DS21796D-page 6

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

The DO pin indicates the READY/BUSY status of the

device, if CS is brought high after a minimum of 250 ns

2.5

ERASE ALL (ERAL)

The Erase All (ERAL) instruction will erase the entire

memory array to the logical ‘1’ state. The ERAL cycle is

identical to the ERASE cycle, except for the different

opcode. The ERAL cycle is completely self-timed. The

rising edge of CLK before the last data bit initiates the

write cycle. Clocking of the CLK pin is not necessary

after the device has entered the ERAL cycle.

low (TCSL).

Note:

Issuing a Start bit and then taking CS low

will clear the READY/BUSY status from

DO.

VCC must be ≥ 4.5V for proper operation of ERAL.

FIGURE 2-2:

ERAL TIMING

TCSL

CS

CHECK STATUS

CLK

DI

1

0

1

0

X

•••

TSV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

TEC

 2004 Microchip Technology Inc.

DS21796D-page 7

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

2.6

ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN)

The 93XX76A/B/C powers up in the ERASE/WRITE

Disable (EWDS) state. All programming modes must be

preceded by an ERASE/WRITE Enable (EWEN) instruc-

tion. Once the EWENinstruction is executed, program-

ming remains enabled until an EWDS instruction is

executed or VCC is removed from the device.

To protect against accidental data disturbance, the

EWDS instruction can be used to disable all ERASE/

WRITE functions and should follow all programming

operations. Execution of

a READ instruction is

independent of both the EWENand EWDSinstructions.

FIGURE 2-3:

EWDS TIMING

TCSL

CS

CLK

DI

•••

X

1

0

X

FIGURE 2-4:

EWEN TIMING

TCSL

CS

CLK

DI

•••

1

0

1

X

devices) output string. The output data bits will toggle on

the rising edge of the CLK and are stable after the spec-

ified time delay (TPD). Sequential read is possible when

CS is held high. The memory data will automatically cycle

to the next register and output sequentially.

2.7

READ

The READ instruction outputs the serial data of the

addressed memory location on the DO pin. A dummy

zero bit precedes the 8-bit (If ORG pin is low or A-Version

devices) or 16-bit (If ORG pin is high or B-version

FIGURE 2-5:

READ TIMING

CS

CLK

DI

An

•••

A0

0

1

0

HIGH-Z

DO

Dx

D0

Dx

D0

Dx

D0

•••

DS21796D-page 8

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

The DO pin indicates the READY/BUSY status of the

device, if CS is brought high after a minimum of 250 ns

2.8

WRITE

The WRITEinstruction is followed by 8 bits (If ORG is

low or A-version devices) or 16 bits (If ORG pin is high

or B-version devices) of data which are written into the

specified address. The self-timed auto-erase and

programming cycle is initiated by the rising edge of CLK

on the last data bit.

low (TCSL). DO at logical ‘0’ indicates that programming

is still in progress. DO at logical ‘1’ indicates that the

register at the specified address has been written with

the data specified and the device is ready for another

instruction.

Note:

Issuing a Start bit and then taking CS low

will clear the READY/BUSY status from

DO.

FIGURE 2-6:

WRITE TIMINGS

TCSL

CS

CLK

DI

0

1

An

A0

Dx

D0

•••

TSV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

Twc

 2004 Microchip Technology Inc.

DS21796D-page 9

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

The DO pin indicates the READY/BUSY status of the

device if CS is brought high after a minimum of 250 ns

low (TCSL).

2.9

WRITE ALL (WRAL)

The Write All (WRAL) instruction will write the entire

memory array with the data specified in the command.

The self-timed auto-erase and programming cycle is

initiated by the rising edge of CLK on the last data bit.

Clocking of the CLK pin is not necessary after the

device has entered the WRAL cycle. The WRAL

command does include an automatic ERAL cycle for

the device. Therefore, the WRAL instruction does not

require an ERALinstruction but the chip must be in the

EWEN status.

Note:

Issuing a Start bit and then taking CS low

will clear the READY/BUSY status from

DO.

VCC must be ≥ 4.5V for proper operation of WRAL.

FIGURE 2-7:

WRAL TIMING

TCSL

CS

CLK

DI

0

1

X

1

0

•••

Dx

•••

X

D0

TSV

TCZ

HIGH-Z

BUSY

READY

DO

HIGH-Z

TWL

DS21796D-page 10

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

3.0

PIN DESCRIPTIONS

TABLE 3-1:

Name

PIN DESCRIPTIONS

SOIC/PDIP/MSOP/

TSSOP

SOT-23

Function

CS

CLK

DI

1

2

3

4

5

6

7

8

5

4

Chip Select

Serial Clock

Data In

3

DO

1

Data Out

Ground

VSS

ORG

PE

2

N/A

6

Organization / 93XX76C

Program Enable

VCC

Power Supply

3.1

Chip Select (CS)

3.3

Data In (DI)

A high level selects the device; a low level deselects

the device and forces it into Standby mode. However, a

programming cycle which is already in progress will be

completed, regardless of the Chip Select (CS) input

signal. If CS is brought low during a program cycle, the

device will go into Standby mode as soon as the

programming cycle is completed.

Data In (DI) is used to clock in a Start bit, opcode,

address and data synchronously with the CLK input.

3.4

Data Out (DO)

Data Out (DO) is used in the Read mode to output data

synchronously with the CLK input (TPD after the

positive edge of CLK).

CS must be low for 250 ns minimum (TCSL) between

consecutive instructions. If CS is low, the internal

control logic is held in a Reset status.

This pin also provides READY/BUSY status informa-

tion during ERASE and WRITE cycles. READY/BUSY

status information is available on the DO pin if CS is

brought high after being low for minimum Chip Select

low time (TCSL) and an erase or write operation has

been initiated.

3.2

Serial Clock (CLK)

The Serial Clock is used to synchronize the communi-

cation between a master device and the 93XX series

device. Opcodes, address and data bits are clocked in

on the positive edge of CLK. Data bits are also clocked

out on the positive edge of CLK.

The Status signal is not available on DO, if CS is held

low during the entire ERASE or WRITE cycle. In this

case, DO is in the HIGH-Z mode. If status is checked

after the ERASE/WRITE cycle, the data line will be high

to indicate the device is ready.

CLK can be stopped anywhere in the transmission

sequence (at high or low-level) and can be continued

anytime with respect to clock high time (TCKH) and

clock low time (TCKL). This gives the controlling master

freedom in preparing opcode, address and data.

Note:

Issuing a Start bit and then taking CS low

will clear the READY/BUSY status from

DO.

CLK is a “don't care” if CS is low (device deselected). If

CS is high, but the Start condition has not been

detected (DI = 0), any number of clock cycles can be

received by the device without changing its status (i.e.,

waiting for a Start condition).

3.5

Organization (ORG)

When the ORG pin is connected to VCC or Logic HI, the

(x16) memory organization is selected. When the ORG

pin is tied to VSS or Logic LO, the (x8) memory

organization is selected. For proper operation, ORG

must be tied to a valid logic level.

CLK cycles are not required during the self-timed

WRITE (i.e., auto ERASE/WRITE) cycle.

93XX76A devices are always x8 organization and

93XX76B devices are always x16 organization.

After detection of a Start condition the specified number

of clock cycles (respectively low to high transitions of

CLK) must be provided. These clock cycles are

required to clock in all required opcode, address and

data bits before an instruction is executed. CLK and DI

then become don't care inputs waiting for a new Start

condition to be detected.

 2004 Microchip Technology Inc.

DS21796D-page 11

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

3.6

Program Enable (PE)

This pin allows the user to enable or disable the ability

to write data to the memory array. If the PE pin is tied

to VCC, the device can be programmed. If the PE pin is

tied to VSS, programming will be inhibited. PE is not

available on 93XX76A or 93XX76B. On those devices,

programming is always enabled. This pin cannot be

floated, it must be tied to VCC or VSS.

DS21796D-page 12

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

4.0

4.1

PACKAGING INFORMATION

Package Marking Information

MSOP 1st Line Marking Codes

Pb-free

8-Lead MSOP (150 mil)

Example:

Device

93AA76C

93LC76C

93C76C

std mark

3A76CT

3L76CT

3C76CT

mark

3L76I

2281L7

XXXXXXT

YWWNNN

GA76CT

GL76CT

GC76CT

T = blank for commercial, “I” for Industrial,

“E” for Extended.

Example:

4EL7

6-Lead SOT-23

XXNN

SOT23 Marking Codes

Device

I-temp

E-temp

93AA76A

93AA76B

93LC76A

93LC76B

93C76A

4BNN

4LNN

4ENN

4PNN

4HNN

4TNN

–

4FNN

4RNN

4JNN

4UNN

Example:

8-Lead PDIP

93C76B

93LC76

I/P 1L7

XXXXXXXX

XXXXXNNN

Pb-free topside mark is same; Pb-free

noted only on carton label.

0228

YYWW

Example:

8-Lead SOIC

93LC76

XXXXXXXX

I/SN 0228

XXXXYYWW

1L7

NNN

TSSOP 1st Line Marking Codes

Pb-free

Device

std mark

mark

93AA76C

93LC76C

93C76C

A76C

L76C

C76C

GADC

GLDC

GCDC

Example:

8-Lead TSSOP

L76

I228

1L7

XXXX

TYWW

NNN

Temperature grade is marked on line 2.

Legend: XX...X Part number

T

Temperature

Blank Commercial

I

E

Industrial

Extended

YY

Year code (last 2 digits of calendar year) except TSSOP

and MSOP which use only the last 1 digit

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

WW

NNN

Note: Custom marking available.

 2004 Microchip Technology Inc.

DS21796D-page 13

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

E

E1

p

D

2

B

n

1

α

A2

A

c

φ

A1

(F)

L

β

Units

Dimension Limits

INCHES

NOM

MILLIMETERS*

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026 BSC

0.65 BSC

Overall Height

A

A2

A1

E

-

.043

-

0.85

-

1.10

Molded Package Thickness

Standoff

.030

.000

.033

-

.037

.006

0.75

0.95

0.15

0.00

Overall Width

.193 TYP.

4.90 BSC

Molded Package Width

Overall Length

Foot Length

E1

D

.118 BSC

3.00 BSC

L

.016

.024

.037 REF

.031

0.40

0.60

0.95 REF

0.80

Footprint (Reference)

Foot Angle

F

φ

c

0°

.003

.009

5°

-

8°

.009

.016

15°

0°

0.08

0.22

5°

-

8°

0.23

0.40

15°

Lead Thickness

Lead Width

.006

B

α

β

.012

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

Notes:

-

5°

15°

5°

15°

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

DS21796D-page 14

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

6-Lead Plastic Small Outline Transistor (OT) (SOT-23)

E

E1

B

p1

D

n

1

α

c

A

A2

φ

A1

L

β

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

6

MAX

n

p

Number of Pins

Pitch

6

.038

.075

.046

.043

.003

.110

.064

.116

.018

5

0.95

1.90

p1

Outside lead pitch (basic)

Overall Height

A

A2

A1

E

.035

.057

0.90

1.18

1.10

0.08

2.80

1.63

2.95

0.45

5

1.45

1.30

0.15

3.00

1.75

3.10

0.55

10

Molded Package Thickness

Standoff

.035

.000

.102

.059

.110

.014

0

.051

.006

.118

.069

.122

.022

10

0.00

2.60

1.50

2.80

0.35

0

Overall Width

Molded Package Width

Overall Length

Foot Length

E1

D

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.004

.014

0

.006

.017

5

.008

.020

10

0.09

0.35

0

0.15

0.43

5

0.20

0.50

10

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

Notes:

0

5

10

0

5

10

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed .005" (0.127mm) per side.

JEITA (formerly EIAJ) equivalent: SC-74A

Drawing No. C04-120

 2004 Microchip Technology Inc.

DS21796D-page 15

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

8-Lead Plastic Du8-Lead Plastic Small Outline (al In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A2

A

L

c

A1

β

B1

B

p

eB

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.100

.155

.130

2.54

Top to Seating Plane

A

.140

.170

3.56

2.92

3.94

3.30

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

5

.145

3.68

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

5

.313

.250

.373

.130

.012

.058

.018

.370

10

.325

.260

.385

.135

.015

.070

.022

.430

15

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

10

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

15

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

B1

B

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

§

eB

α

β

5

10

15

5

10

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

DS21796D-page 16

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

n

1

h

α

45°

c

A2

A

φ

β

L

A1

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.050

.061

.056

.007

.237

.154

.193

.015

.025

4

1.27

Overall Height

A

.053

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

4

1.75

Molded Package Thickness

Standoff

A2

A1

E

.052

.004

.228

.146

.189

.010

.019

0

.061

.010

.244

.157

.197

.020

.030

8

1.55

0.25

6.20

3.99

5.00

0.51

0.76

8

§

0.10

5.79

3.71

4.80

0.25

0.48

0

Overall Width

Molded Package Width

Overall Length

E1

D

Chamfer Distance

Foot Length

h

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.008

.013

0

.009

.017

12

.010

.020

15

0.20

0.33

0

0.23

0.42

12

0.25

0.51

15

B

α

Mold Draft Angle Top

Mold Draft Angle Bottom

β

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

 2004 Microchip Technology Inc.

DS21796D-page 17

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

E

E1

p

D

2

1

n

B

α

A

c

A1

A2

φ

β

L

Units

INCHES

NOM

MILLIMETERS*

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026

0.65

Overall Height

A

.043

1.10

Molded Package Thickness

Standoff

A2

A1

E

.033

.035

.004

.251

.173

.118

.024

4

.037

.006

.256

.177

.122

.028

8

0.85

0.05

0.90

0.10

6.38

4.40

3.00

0.60

4

0.95

0.15

6.50

4.50

3.10

0.70

8

§

.002

.246

.169

.114

.020

0

Overall Width

6.25

4.30

2.90

0.50

0

Molded Package Width

Molded Package Length

Foot Length

E1

D

L

φ

Foot Angle

c

Lead Thickness

.004

.007

0

.006

.010

5

.008

.012

10

0.09

0.19

0

0.15

0.25

5

0.20

0.30

10

Lead Width

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-086

DS21796D-page 18

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

APPENDIX A: REVISION HISTORY

Revision C

Corrections to Section 1.0, Electrical Characteristics.

Section 4.1, 6-Lead SOT-23 package to OT.

Revision D

Corrections to Device Selection Table, Table 1-1, Table

1-2, Section 2.4, Section 2.5, Section 2.8 and Section

2.9. Added note to Figure 2-7.

 2004 Microchip Technology Inc.

DS21796D-page 19

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

NOTES:

DS21796D-page 20

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

ON-LINE SUPPORT

SYSTEMS INFORMATION AND

UPGRADE HOT LINE

Microchip provides on-line support on the Microchip

World Wide Web site.

The Systems Information and Upgrade Line provides

system users a listing of the latest versions of all of

Microchip's development systems software products.

Plus, this line provides information on how customers

can receive the most current upgrade kits.The Hot Line

Numbers are:

The web site is used by Microchip as a means to make

files and information easily available to customers. To

view the site, the user must have access to the Internet

and a web browser, such as Netscape^®or Microsoft^®

Internet Explorer. Files are also available for FTP

download from our FTP site.

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

Connecting to the Microchip Internet

Web Site

042003

The Microchip web site is available at the following

URL:

www.microchip.com

The file transfer site is available by using an FTP

service to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of

services. Users may download files for the latest

Development Tools, Data Sheets, Application Notes,

User's Guides, Articles and Sample Programs. A vari-

ety of Microchip specific business information is also

available, including listings of Microchip sales offices,

distributors and factory representatives. Other data

available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked

Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to

Microchip Products

• Conferences for products, Development Systems,

technical information and more

• Listing of seminars and events

 2004 Microchip Technology Inc.

DS21796D-page 21

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796D

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21796D-page 22

 2004 Microchip Technology Inc.

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

/XX

X

PART NO.

X

Examples:

a)

93AA76C-I/MS: 8K, 1024x8 or 512x16 Serial

EEPROM, MSOP package, 1.8V

Package

Device Tape & Reel

Lead Finish

Temperature

Range

b)

93AA76AT-I/OT: 8K, 1024x8 Serial EEPROM,

SOT-23 package, tape and reel, 1.8V

Device

93AA76A: 8K 1.8V Microwire Serial EEPROM (x8)

93AA76B: 8K 1.8V Microwire Serial EEPROM (x16)

93AA76C: 8K 1.8V Microwire Serial EEPROM w/ORG

c)

93AA76CT-I/MS: 8K, 1024x8 or 512x16 Serial

EEPROM, MSOP package, tape and reel, 1.8V

a)

b)

c)

93LC76C-I/MS: 8K, 1024x8 or 512x16 Serial

EEPROM, MSOP package, 2.5V

93LC76BT-I/OT: 8K, 512x16 Serial EEPROM,

SOT-23 package, tape and reel, 2.5V

93LC76CXT-I/SNG: 8K, 1024x8 or 512x16

Serial EEPROM, SOIC package, Industrial

temperature, tape and reel, Pb-free finish, 2.5V

93LC76A: 8K 2.5V Microwire Serial EEPROM (x8)

93LC76B: 8K 2.5V Microwire Serial EEPROM (x16)

93LC76C: 8K 2.5V Microwire Serial EEPROM w/ORG

93C76A: 8K 5.0V Microwire Serial EEPROM (x8)

93C76B: 8K 5.0V Microwire Serial EEPROM (x16)

93C76C: 8K 5.0V Microwire Serial EEPROM w/ORG

a)

b)

93C76C-I/MS: 8K, 1024x8 or 512x16 Serial

EEPROM, MSOP package, 5.0V

93C76AT-I/OT: 8K, 1024x8 Serial EEPROM,

SOT-23 package, tape and reel, 5.0V

Tape & Reel:

Temperature Range

Package

Blank

T

=

Standard pinout

Tape & Reel

I

E

=

-40°C to +85°C

-40°C to +125°C

MS

OT

P

SN

ST

=

Plastic MSOP (Micro Small outline, 8-lead)

SOT-23, 6-lead (Tape & Reel only)

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

TSSOP, 8-lead

Lead Finish:

Blank

G

=

Standard 63% / 37% SnPb

Pb-free (Matte Tin - Pure Sn)

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences

and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of

the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2004 Microchip Technology Inc.

DS21796D-page 23

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

NOTES:

DS21796D-page 24

 2004 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical

components in life support systems is not authorized except

with express written approval by Microchip. No licenses are

conveyed, implicitly or otherwise, under any intellectual

property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,

SEEVAL, SmartShunt and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net,

dsPICworks, ECAN, ECONOMONITOR, FanSense,

FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,

ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,

MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail,

PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC,

Select Mode, SmartSensor, SmartTel and Total Endurance

are trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in October

2003. The Company’s quality system processes and procedures are for

its PICmicro^®8-bit MCUs, KEELOQ^®code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

 2004 Microchip Technology Inc.

DS21796D-page 25

WORLDWIDE SALES AND SERVICE

China - Beijing

Korea

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support: 480-792-7627

Web Address: http://www.microchip.com

Unit 706B

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

Wan Tai Bei Hai Bldg.

No. 6 Chaoyangmen Bei Str.

Beijing, 100027, China

Tel: 86-10-85282100

Fax: 86-10-85282104

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or

82-2-558-5934

Singapore

200 Middle Road

#07-02 Prime Centre

Singapore, 188980

Tel: 65-6334-8870 Fax: 65-6334-8850

China - Chengdu

Rm. 2401-2402, 24th Floor,

Ming Xing Financial Tower

No. 88 TIDU Street

Chengdu 610016, China

Tel: 86-28-86766200

Atlanta

3780 Mansell Road, Suite 130

Alpharetta, GA 30022

Tel: 770-640-0034

Fax: 770-640-0307

Taiwan

Kaohsiung Branch

30F - 1 No. 8

Fax: 86-28-86766599

Boston

Min Chuan 2nd Road

Kaohsiung 806, Taiwan

Tel: 886-7-536-4818

Fax: 886-7-536-4803

China - Fuzhou

Unit 28F, World Trade Plaza

No. 71 Wusi Road

Fuzhou 350001, China

Tel: 86-591-7503506

Fax: 86-591-7503521

2 Lan Drive, Suite 120

Westford, MA 01886

Tel: 978-692-3848

Fax: 978-692-3821

Taiwan

Taiwan Branch

11F-3, No. 207

Tung Hua North Road

Taipei, 105, Taiwan

Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

Chicago

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Itasca, IL 60143

Tel: 630-285-0071

Fax: 630-285-0075

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

Kwai Fong, N.T., Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Dallas

EUROPE

Austria

Durisolstrasse 2

A-4600 Wels

Austria

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

Regus Business Centre

Lautrup hoj 1-3

4570 Westgrove Drive, Suite 160

Addison, TX 75001

Tel: 972-818-7423

Fax: 972-818-2924

China - Shanghai

Room 701, Bldg. B

Far East International Plaza

No. 317 Xian Xia Road

Shanghai, 200051

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250

Tel: 86-21-6275-5700

Fax: 86-21-6275-5060

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza

No. 5022 Binhe Road, Futian District

Shenzhen 518033, China

Tel: 86-755-82901380

Fax: 86-755-8295-1393

China - Shunde

Fax: 248-538-2260

Ballerup DK-2750 Denmark

Tel: 45-4420-9895 Fax: 45-4420-9910

Kokomo

France

2767 S. Albright Road

Kokomo, IN 46902

Tel: 765-864-8360

Fax: 765-864-8387

Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

Batiment A - ler Etage

91300 Massy, France

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Room 401, Hongjian Building, No. 2

Los Angeles

18201 Von Karman, Suite 1090

Irvine, CA 92612

Tel: 949-263-1888

Fax: 949-263-1338

Fengxiangnan Road, Ronggui Town, Shunde

District, Foshan City, Guangdong 528303, China

Tel: 86-757-28395507 Fax: 86-757-28395571

Germany

China - Qingdao

Rm. B505A, Fullhope Plaza,

No. 12 Hong Kong Central Rd.

Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

Steinheilstrasse 10

D-85737 Ismaning, Germany

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

San Jose

1300 Terra Bella Avenue

Mountain View, CA 94043

Tel: 650-215-1444

Italy

India

Via Quasimodo, 12

20025 Legnano (MI)

Milan, Italy

Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

Fax: 650-961-0286

Toronto

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands

P. A. De Biesbosch 14

NL-5152 SC Drunen, Netherlands

Tel: 31-416-690399

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada

Tel: 905-673-0699

Fax: 905-673-6509

Benex S-1 6F

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

ASIA/PACIFIC

Australia

Suite 22, 41 Rawson Street

Epping 2121, NSW

Australia

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Fax: 31-416-690340

United Kingdom

505 Eskdale Road

Winnersh Triangle

Wokingham

Berkshire, England RG41 5TU

Tel: 44-118-921-5869

Fax: 44-118-921-5820

01/26/04

DS21796D-page 26

 2004 Microchip Technology Inc.


型号：	93LC76B
厂家：	MICROCHIP
描述：	8K Microwire Compatible Serial EEPROM 8K的Microwire兼容串行EEPROM 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件：	总26页 (文件大小：396K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

93LC76B [MICROCHIP]

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