AT25080B-MEHL-T [MICROCHIP]

EEPROM, 1KX8, Serial;
AT25080B-MEHL-T
型号: AT25080B-MEHL-T
厂家: MICROCHIP    MICROCHIP
描述:

EEPROM, 1KX8, Serial

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 内存集成电路
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AT25080B and AT25160B  
SPI Serial EEPROMs  
8K (1,024 x 8) and 16K (2,048 x 8)  
DATASHEET  
Features  
Serial Peripheral Interface (SPI) Compatible  
Supports SPI Modes 0 (0,0) and 3 (1,1)  
̶
Datasheet Describes Mode 0 Operation  
Low-voltage and Standard-voltage Operation  
1.8 (VCC = 1.8V to 5.5V)  
̶
20MHz Clock Rate (5V)  
32-byte Page Mode  
Block Write Protection  
̶
Protect 1/4, 1/2, or Entire Array  
Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and  
Software Data Protection  
Self-timed Write Cycle (5ms max)  
High Reliability  
̶
̶
Endurance: 1,000,000 Write Cycles  
Data Retention: 100 Years  
Green (Pb/Halide-free/RoHS Compliant) Packaging Options  
Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers  
Description  
The Atmel® AT25080B/160B provides 8,192/16,384 bits of Serial Electrically-  
Erasable Programmable Read-Only Memory (EEPROM) organized as  
1,024/2,048 words of 8 bits each. The device is optimized for use in many  
industrial and commercial applications where low-power and low-voltage  
operation are essential. The AT25080B/160B is available in space-saving 8-lead  
JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN, 8-ball VFBGA, and  
8-ball WLCSP packages.  
The AT25080B/160B is enabled through the Chip Select pin (CS) and accessed  
via a 3-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO),  
and Serial Clock (SCK). All programming cycles are completely self-timed, and no  
separate erase cycle is required before write.  
Block Write protection is enabled by programming the status register with one of  
four blocks of write protection. Separate program enable and program disable  
instructions are provided for additional data protection. Hardware data protection  
is provided via the WP pin to protect against inadvertent write attempts to the  
status register. The HOLD pin may be used to suspend any serial communication  
without resetting the serial sequence.  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
1.  
Pin Configurations and Pinouts  
Table 1.  
Pin Configurations  
8-lead TSSOP  
(Top View)  
8-lead SOIC  
(Top View)  
Pin Name Function  
CS  
SO  
VCC  
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
CS  
SO  
WP  
VCC  
CS  
Chip Select  
HOLD  
SCK  
SI  
HOLD  
SCK  
SI  
WP  
GND  
HOLD  
SCK  
SO  
Ground  
GND  
GND  
Suspends Serial Input  
Serial Data Clock  
Serial Data Output  
Serial Data Input  
Write Protect  
8-ball VFBGA  
(Top View)  
8-pad UDFN/XDFN  
(Top View)  
SI  
1
2
3
4
8
7
6
5
CS  
SO  
VCC  
CS  
SO  
WP  
VCC  
1
2
3
4
8
7
6
5
WP  
VCC  
HOLD  
SCK  
SI  
HOLD  
SCK  
SI  
WP  
Power Supply  
GND  
GND  
8-ball WLSCP  
(Top View)  
GND  
SO  
SI  
WP  
SCK  
VCC  
HOLD  
CS  
Note: Drawings are not to scale.  
2.  
Absolute Maximum Ratings*  
*Notice: Stresses beyond those listed under “Absolute  
Operating Temperature . . . . . . . . . . .-55C to +125C  
Maximum Ratings” may cause permanent damage  
to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device  
reliability.  
Storage Temperature . . . . . . . . . . . . .-65°C to +150°C  
Voltage on Any Pin  
with Respect to Ground . . . . . . . . . . . . -1.0V to +7.0V  
Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V  
DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA  
2
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
3.  
Block Diagram  
Figure 3-1.  
Block Diagram  
VCC  
GND  
Status  
Register  
Memory Array  
1,024/2,048 x 8  
Address  
Decoder  
Data  
Register  
SI  
Output  
Buffer  
Mode  
Decode  
Logic  
CS  
WP  
Clock  
Generator  
SO  
SCK  
HOLD  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
3
4.  
Memory Organization  
4.1  
Pin Capacitance  
Table 4-1.  
Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = +5.0V (unless otherwise noted).  
Pin Capacitance(1)  
Symbol  
COUT  
CIN  
Test Conditions  
Max  
8
Units  
pF  
Conditions  
VOUT = 0V  
VIN = 0V  
Output Capacitance (SO)  
Input Capacitance (CS, SCK, SI, WP, HOLD)  
6
pF  
Note:  
1. This parameter is characterized and is not 100% tested.  
4.2  
DC Characteristics  
Table 4-2.  
DC Characteristics  
Applicable over recommended operating range from TAI = -40°C to +85°C, VCC = 1.7V to 5.5V (unless otherwise noted).  
Symbol Parameter  
Test Condition  
Min  
1.8  
2.5  
4.5  
Typ  
Max  
5.5  
5.5  
5.5  
Units  
VCC1  
VCC2  
VCC3  
Supply Voltage  
V
V
V
Supply Voltage  
Supply Voltage  
VCC = 5.0V at 20MHz,  
SO = Open and Read  
ICC1  
ICC2  
ICC3  
Supply Current  
Supply Current  
Supply Current  
7.5  
4.0  
4.0  
10.0  
10.0  
6.0  
mA  
mA  
mA  
VCC = 5.0V at 20MHz,  
SO = Open, Read, and Write  
VCC = 5.0V at 5MHz,  
SO = Open, Read, and Write  
ISB1  
ISB2  
ISB3  
IIL  
Standby Current  
Standby Current  
Standby Current  
Input Leakage  
VCC = 1.8V, CS = VCC  
VCC = 2.5V, CS = VCC  
VCC = 5.0V, CS = VCC  
VIN = 0V to VCC  
< 0.1  
0.3  
6.0(2)  
7.0(2)  
μA  
μA  
μA  
μA  
μA  
V
2.0  
10.0(2)  
3.0  
-3.0  
-3.0  
IOL  
Output Leakage  
VIN = 0V to VCC, TAC = 0°C to 70°C  
3.0  
(1)  
VIL  
Input Low-voltage  
Input High-voltage  
Output Low-voltage  
Output High-voltage  
Output Low-voltage  
Output High-voltage  
-0.6  
VCC x 0.3  
VCC + 0.5  
0.4  
(1)  
VIH  
VCC x 0.7  
V
VOL1  
VOH1  
VOL2  
VOH2  
IOL = 3.0mA  
3.6V VCC 5.5V  
V
IOH = 1.6mA  
VCC - 0.8  
VCC - 0.2  
V
IOL = 0.15mA  
1.8V VCC 3.6V  
0.2  
V
IOH = 100μA  
V
Notes: 1. VIL min and VIH max are reference only and are not tested.  
2. Worst case measured at 85C.  
4
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
4.3  
AC Characteristics  
Table 4-3.  
AC Characteristics  
Applicable over recommended operating range from TAI = -40C to +85C, VCC = as specified,  
CL = 1 TTL gate and 100pF (unless otherwise noted).  
Symbol  
Parameter  
Voltage  
Min  
Max  
Units  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
0
0
0
20  
10  
5
fSCK  
SCK Clock Frequency  
MHz  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
2
2
2
tRI  
Input Rise Time  
Input Fall Time  
μs  
μs  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
2
2
2
tFI  
20  
40  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
tWH  
SCK High Time  
SCK Low Time  
ns  
ns  
80  
20  
40  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
tWL  
80  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
25  
50  
100  
tCS  
tCSS  
tCSH  
tSU  
tH  
CS High Time  
ns  
ns  
ns  
ns  
ns  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
25  
50  
100  
CS Setup Time  
CS Hold Time  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
25  
50  
100  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
5
10  
20  
Data In Setup Time  
Data In Hold Time  
HOLD Setup Time  
HOLD Hold Time  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
5
10  
20  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
5
10  
20  
tHD  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
5
10  
20  
tCD  
ns  
ns  
20  
40  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
0
0
0
tV  
Output Valid  
80  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
5
Table 4-3.  
AC Characteristics (Continued)  
Applicable over recommended operating range from TAI = -40C to +85C, VCC = as specified,  
CL = 1 TTL gate and 100pF (unless otherwise noted).  
Symbol  
Parameter  
Voltage  
Min  
Max  
Units  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
0
0
0
tHO  
Output Hold Time  
ns  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
0
0
0
25  
50  
100  
tLZ  
HOLD to Output Low Z  
HOLD to Output High Z  
Output Disable Time  
ns  
ns  
ns  
ms  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
40  
80  
200  
tHZ  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
40  
80  
200  
tDIS  
4.5 to 5.5  
2.5 to 5.5  
1.8 to 5.5  
5
5
5
tWC  
Write Cycle Time  
Write  
Cycles  
Endurance(1)  
3.3V, 25°C, Page Mode  
1M  
Note:  
1. This parameter is characterized and is not 100% tested.  
6
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
5.  
Serial Interface Description  
Table 5-1.  
Interface  
Serial Interface Description  
Description  
Master  
The device that generates the Serial Clock.  
Because the Serial Clock pin (SCK) is always an input, the AT25080B/160B always operates  
as a slave.  
Slave  
The AT25080B/160B has separate pins designated for data transmission (SO) and  
reception (SI).  
Transmitter/Receiver  
MSB  
The Most Significant Bit (MSB) is the first bit transmitted and received.  
After the device is selected with CS going low, the first byte will be received. This byte contains  
the opcode that defines the operations to be performed.  
Serial Opcode  
Invalid Opcode  
Chip Select  
If an invalid opcode is received, no data will be shifted into the AT25080B/160B, and the serial  
output pin (SO) will remain in a high-impedance state until the falling edge of CS is detected.  
This will reinitialize the serial communication.  
The AT25080B/160B is selected when the CS pin is low. When the device is not selected, data  
will not be accepted via the SI pin, and the Serial Output pin (SO) will remain in a  
high-impedance state.  
The HOLD pin is used in conjunction with the CS pin to select the AT25080B/160B. When the  
device is selected and a serial sequence is underway, Hold can be used to pause the serial  
communication with the master device without resetting the serial sequence. To pause, the  
HOLD pin must be brought low while the SCK pin is low. To resume serial communication, the  
HOLD pin is brought high while the SCK pin is low (SCK may still toggle during Hold). Inputs to  
the SI pin will be ignored while the SO pin is in the high impedance state.  
Hold  
The Write Protect pin (WP) allows normal Read and Write operations when held high. When  
the WP pin is brought low and WPEN bit is one, all write operations to the status register are  
inhibited. When the WP is low while CS is low, it will interrupt a Write to the status register. If  
the internal write cycle has already been initiated, WP going low will have no effect on any  
Write operation to the status register. The WP pin function is blocked when the WPEN bit in the  
status register is zero. This will allow the user to install the AT25080B/160B in a system with  
the WP pin tied to ground, and it will be able to write to the status register. All WP pin functions  
are enabled when the WPEN bit is set to one.  
Write Protect  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
7
Figure 5-1.  
SPI Serial Interface  
Master:  
Slave:  
Microcontroller  
Data Out (MOSI)  
Data In (MISO)  
Serial Clock (SPI CK)  
SS0  
AT25080B/160B  
SI  
SO  
SCK  
CS  
SS1  
SI  
SS2  
SO  
SCK  
CS  
SS3  
SI  
SO  
SCK  
CS  
SI  
SO  
SCK  
CS  
8
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
6.  
Functional Description  
The AT25080B/160B is designed to interface directly with the synchronous Serial Peripheral Interface (SPI) of  
the 6805 and 68HC11 microcontroller series.  
The AT25080B/160B utilizes an 8-bit instruction register. The list of instructions and their operation codes are  
contained in the table below. All instructions, addresses, and data are transferred with the MSB first and starts  
with a high-to-low CS transition.  
Table 6-1.  
Instruction Set for the AT25080B/160B  
Instruction Name  
Instruction Format  
0000 X110  
Operation  
WREN  
WRDI  
RDSR  
WRSR  
Read  
Set Write Enable Latch  
Reset Write Enable Latch  
Read Status Register  
Write Status Register  
Read Data from Memory Array  
Write Data to Memory Array  
0000 X100  
0000 X101  
0000 X001  
0000 X011  
Write  
0000 X010  
Write Enable (WREN): The device will power up in the Write Disable state when VCC is applied. All  
programming instructions must therefore be preceded by a Write Enable instruction.  
Write Disable (WRDI): To protect the device against inadvertent writes, the WRDI instruction disables all  
programming modes. The WRDI instruction is independent of the status of the WP pin.  
Read Status Register (RDSR): The RDSR instruction provides access to the status register. The Ready/Busy  
and Write Enable status of the device can be determined by the RDSR instruction. Similarly, the Block Write  
Protection bits indicate the extent of protection employed. These bits are set by using the WRSR instruction.  
Table 6-2.  
Status Register Format  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
WPEN  
X
X
X
BP1  
BP0  
WEN  
RDY  
Table 6-3.  
Bit  
Read Status Register Bit Definition  
Definition  
If zero, it indicates the device is ready.  
Bit 0 (RDY)  
Bit 1 (WEN)  
If one, it indicates the write cycle is in progress.  
If zero, it indicates the device is not write enabled.  
If one, it indicates the device is write enabled.  
Bit 2 (BP0)  
Bit 3 (BP1)  
Bits 4 to 6  
See Table 6-4 on page 10.  
See Table 6-4.  
These are zeros when device is not in an internal write cycle.  
See Table 6-5 on page 10  
Bit 7 (WPEN)  
Bits 0 to 7  
These are ones during an internal write cycle.  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
9
Write Status Register (WRSR): The WRSR instruction allows the user to select one of four levels of protection.  
The AT25080B/160B is divided into four array segments. One-quarter (1/4), one-half (1/2), or all of the memory  
segments can be protected. Any of the data within any selected segment will be read-only. The block write  
protection levels and corresponding status register control bits are shown in Table 6-4.  
The three bits BP0, BP1, and WPEN are nonvolatile cells that have the same properties and functions as the  
regular memory cells (e.g., WREN, tWC, RDSR).  
Table 6-4.  
Block Write Protect Bits  
Status Register Bits  
Array Addresses Protected  
AT25080B AT25160B  
None None  
Level  
BP1  
BP0  
0
0
0
1
1
0
1
0
1
1(1/4)  
0300 03FF  
0200 03FF  
0000 03FF  
0600 07FF  
0400 07FF  
0000 07FF  
2(1/2)  
3(All)  
The WRSR instruction allows the user to enable or disable the Write Protect (WP) pin through the use of the  
Write Protect Enable (WPEN) bit. Hardware Write protection is enabled when the WP pin is low and the WPEN  
bit is one. Hardware Write protection is disabled when either the WP pin is high or the WPEN bit is zero. When  
the device is hardware write protected, writes to the status register, including the block protect bits and the  
WPEN bit, and the block-protected sections in the memory array are disabled. Writes are only allowed to  
sections of the memory that are not block-protected.  
Note: When the WPEN bit is Hardware Write protected, it cannot be changed back to zero as long as the WP  
pin is held low.  
Table 6-5.  
WPEN Operation  
Protected  
Blocks  
Unprotected  
Blocks  
Status  
Register  
WPEN  
WP  
X
WEN  
0
0
1
1
X
X
0
1
0
1
0
1
Protected  
Protected  
Protected  
Protected  
Protected  
Protected  
Protected  
Writeable  
Protected  
Writeable  
Protected  
Writeable  
Protected  
Writeable  
Protected  
Protected  
Protected  
Writeable  
X
Low  
Low  
High  
High  
10  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
Read Sequence (Read): Reading the AT25080B/160B via the Serial Output (SO) pin requires the following  
sequence. After the CS line is pulled low to select a device, the read opcode is transmitted via the SI line  
followed by the byte address to be read (A15 to A0, see Table 6-6). Upon completion, any data on the SI line will  
be ignored. The data (D7 to D0) at the specified address is then shifted out onto the SO line. If only one byte is  
to be read, the CS line should be driven high after the data comes out. The read sequence can be continued  
since the byte address is automatically incremented and data will continue to be shifted out. When the highest  
address is reached, the address counter will roll-over to the lowest address allowing the entire memory to be  
read in one continuous read cycle.  
Write Sequence (Write): In order to program the AT25080B/160B, two separate instructions must be executed.  
First, the device must be write enabled via the WREN instruction, and then a Write instruction can be  
executed. The address of the memory location(s) to be programmed must be outside the protected address field  
location selected by the block write protection level. During an internal write cycle, all commands will be ignored  
except the RDSR instruction.  
A Write instruction requires the following sequence. After the CS line is pulled low to select the device, the Write  
opcode is transmitted via the SI line followed by the byte address (A15 to A0) and the data (D7 to D0) to be  
programmed (see Table 6-6). Programming will start after the CS pin is brought high. The low-to-high transition  
of the CS pin must occur during the SCK low-time immediately after clocking in the D0 (LSB) data bit.  
The Ready/Busy status of the device can be determined by initiating a RDSR instruction. If Bit 0 is one, the write  
cycle is still in progress. If Bit 0 is zero, the write cycle has ended. Only the RDSR instruction is enabled during  
the write programming cycle.  
The AT25080B/160B is capable of a 32-byte Page Write operation. After each byte of data is received, the five  
low-order address bits are internally incremented by one; the high-order bits of the address will remain constant.  
If more than 32 bytes of data are transmitted, the address counter will roll-over and the previously written data  
will be overwritten. The AT25080B/160B is automatically returned to the write disable state at the completion of  
a write cycle.  
Note: If the device is not write-enabled (WREN), the device will ignore the Write instruction and will return to  
the standby state when CS is brought high. A new CS falling edge is required to reinitiate the serial  
communication.  
Table 6-6.  
Address Key  
Address  
AN  
AT25080B  
A9 – A0  
AT25160B  
A10 – A0  
Don’t Care Bits  
A15 – A10  
A15 – A11  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
11  
7.  
Timing Diagrams  
Figure 7-1.  
Synchronous Data Timing (for Mode 0)  
tCS  
VIH  
CS  
VIL  
tCSS  
tCSH  
VIH  
tWH  
tWL  
SCK  
VIL  
tSU  
tH  
VIH  
Valid In  
SI  
VIL  
tHO  
tDIS  
tV  
VOH  
HI-Z  
HI-Z  
SO  
VOL  
Figure 7-2.  
WREN Timing  
CS  
SCK  
SI  
WREN Opcode  
HI-Z  
SO  
Figure 7-3.  
WRDI Timing  
CS  
SCK  
SI  
WRDI Opcode  
HI-Z  
SO  
12  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
Figure 7-4.  
RDSR Timing  
CS  
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
SCK  
SI  
Instruction  
Data Out  
High-impedance  
SO  
7
6
5
4
3
2
1
0
MSB  
Figure 7-5.  
WRSR Timing  
CS  
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
SCK  
SI  
Data In  
Instruction  
7
6
5
4
3
2
1
0
High-impedance  
SO  
Figure 7-6.  
Read Timing  
CS  
0
1
2
3
4
5
6
7
8
9
10 11 20 21 22 23 24 25 26 27 28 29 30 31  
SCK  
SI  
Byte Address  
...  
Instruction  
15 14 13  
3
2
1
0
Data Out  
High-impedance  
SO  
7
6
5
4
3
2
1
0
MSB  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
13  
Figure 7-7.  
Write Timing  
CS  
0
1
2
3
4
5
6
7
8
9 10 11 20 21 22 23 24 25 26 27 28 29 30 31  
SCK  
SI  
Byte Address  
Data In  
...  
Instruction  
15 14 13  
3
2
1
0
7
6
5
4
3
2
1
0
High-impedance  
SO  
Figure 7-8.  
HOLD Timing  
CS  
tCD  
tCD  
SCK  
HOLD  
SO  
tHD  
tHD  
tHZ  
tLZ  
14  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
8.  
Ordering Code Detail  
A T 2 5 0 8 0 B - S S H L x x - B  
Atmel Designator  
Product Family  
Shipping Carrier Option  
B
T
E
= Bulk (Tubes)  
= Tape and Reel, Standard Quantity Option  
= Tape and Reel, Expanded Quantity Option  
25 = Standard SPI  
Serial EEPROM  
Product Variation  
xx  
= Applies to select packages only.  
See ordering code table for  
variation details.  
Device Density  
080 = 8-kilobit  
160 = 16-kilobit  
Operating Voltage  
L
= 1.8V to 5.5V  
Device Revision  
Packaged Device Grade or  
Wafer/Die Thickness  
H
= Green, NiPdAu Lead Finish  
Temperature Range -40°C to +85°C  
= Green, Matte Sn Lead Finish  
Temperature Range -40°C to +85°C  
= 11mil Wafer Thickness  
U
11  
Package Option  
SS = JEDEC SOIC  
X
= TSSOP  
MA = UDFN  
ME = XDFN  
C
U
= VFBGA  
= WLCSP  
WWU = Wafer Unsawn  
WDT = Die in Tape and Reel  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
15  
9.  
Part Markings  
AT25080B and AT25160B: Package Marking Information  
8-lead TSSOP  
8-lead SOIC  
8-pad UDFN  
2.0 x 3.0 mm Body  
ATHYWW  
AAAAAAA  
###  
ATMLHYWW  
###%  
AAAAAAAA  
###% @  
H%@  
YXX  
@
8-pad XDFN  
8-ball VFBGA  
8-ball WLCSP  
1.8 x 2.2 mm Body  
1.5 x 2.0 mm Body  
@U  
###  
YXX  
###  
###U  
YMXX  
YXX  
PIN 1  
Note 1:  
designates pin 1  
Note 2: Package drawings are not to scale  
Catalog Number Truncation  
AT25080B  
AT25160B  
Truncation Code ###: 58B  
Truncation Code ###: 5AB  
Date Codes  
Voltages  
Y = Year  
M = Month  
WW = Work Week of Assembly  
% = Minimum Voltage  
4: 2014  
5: 2015  
6: 2016  
7: 2017  
8: 2018  
9: 2019  
0: 2020  
1: 2021  
A: January  
B: February  
...  
02: Week 2  
04: Week 4  
...  
L: 1.8V min  
L: December  
52: Week 52  
Country of Assembly  
Lot Number  
AAA...A = Atmel Wafer Lot Number  
Grade/Lead Finish Material  
@ = Country of Assembly  
H: Industrial/NiPdAu  
Trace Code  
Atmel Truncation  
XX = Trace Code (Atmel Lot Numbers Correspond to Code)  
Example: AA, AB.... YZ, ZZ  
AT: Atmel  
ATM: Atmel  
ATML: Atmel  
6/10/14  
TITLE  
DRAWING NO.  
25080-160BSM  
REV.  
25080-160BSM, AT25080B and AT25160B Package Marking  
Package Mark Contact:  
Information  
B
DL-CSO-Assy_eng@atmel.com  
16  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
10. Ordering Information  
Delivery Information  
Operation  
Range  
Atmel Ordering Code  
AT25080B-SSHL-B  
AT25080B-SSHL-T  
AT25080B-XHL-B  
AT25080B-XHL-T  
Lead Finish  
Package  
Form  
Quantity  
Bulk (Tubes)  
Tape and Reel  
Bulk (Tubes)  
100 per Tube  
4,000 per Reel  
100 per Tube  
5,000 per Reel  
5,000 per Reel  
8S1  
8X  
NiPdAu  
(Lead-free/Halogen-free)  
Tape and Reel  
Tape and Reel  
Industrial  
Temperature  
(-40 to 85C)  
AT25080B-MAHL-T  
AT25080B-MAHL-E  
AT25080B-MEHL-T  
AT25080B-CUL-T  
8MA2  
Tape and Reel 15,000 per Reel  
8ME1  
8U3-1  
Tape and Reel  
Tape and Reel  
Tape and Reel  
5,000 per Reel  
5,000 per Reel  
5,000 per Reel  
SnAgCu  
(Lead-free/Halogen-free)  
AT25080B-UUL0B-T(1)  
AT25080B-WWU11L(2)  
8U-12  
N/A  
Wafer Sale  
Note 2  
AT25160B-SSHL-B  
AT25160B-SSHL-T  
AT25160B-XHL-B  
Bulk (Tubes)  
Tape and Reel  
Bulk (Tubes)  
100 per Tube  
4,000 per Reel  
100 per Tube  
5,000 per Reel  
5,000 per Reel  
8S1  
8X  
NiPdAu  
(Lead-free/Halogen-free)  
AT25160B-XHL-T  
Tape and Reel  
Tape and Reel  
Industrial  
Temperature  
(-40 to 85C)  
AT25160B-MAHL-T  
AT25160B-MAHL-E  
AT25160B-MEHL-T  
AT25160B-CUL-T  
8MA2  
Tape and Reel 15,000 per Reel  
8ME1  
8U3-1  
Tape and Reel  
Tape and Reel  
Tape and Reel  
5,000 per Reel  
5,000 per Reel  
5,000 per Reel  
SnAgCu  
(Lead-free/Halogen-free)  
AT25160B-UUL0B-T(1)  
AT25160B-WWU11L(2)  
Notes: 1. WLCSP Package:  
8U-12  
N/A  
Wafer Sale  
Note 2  
This device includes a backside coating to increase product robustness.  
CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in the EEPROM cells.  
Therefore, customers who use a WLCSP product must ensure that exposure to ultraviolet light  
does not occur.  
2. Contact Atmel Sales for Wafer sales.  
Package Type  
8S1  
8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)  
8X  
8-lead, 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP)  
8-pad, 2.0mm x 3.0mm x 0.6mm body, Thermally Enhanced Plastic Ultra Thin Dual Flat Dual No Lead (UDFN)  
8-pad 1.8mm x 2.2mm body, Extra Thin DFN (XDFN)  
8MA2  
8ME1  
8U3-1  
8U-12  
8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very Thin, Fine-Pitch Ball Grid Array (VFBGA)  
8-ball, 5 x 3 grid array, 0.40mm pitch, Wafer Level Chip Scale Package (WLCSP)  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
17  
11. Packaging Information  
11.1 8S1 — 8-lead JEDEC SOIC  
C
1
E
E1  
L
N
Ø
TOP VIEW  
END VIEW  
e
b
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A
MIN  
1.35  
0.10  
MAX  
1.75  
0.25  
NOM  
NOTE  
SYMBOL  
A1  
A
A1  
b
0.31  
0.17  
4.80  
3.81  
5.79  
0.51  
0.25  
5.05  
3.99  
6.20  
C
D
E1  
E
e
D
SIDE VIEW  
Notes: This drawing is for general information only.  
Refer to JEDEC Drawing MS-012, Variation AA  
for proper dimensions, tolerances, datums, etc.  
1.27 BSC  
L
0.40  
0°  
1.27  
8°  
Ø
6/22/11  
DRAWING NO. REV.  
8S1  
TITLE  
GPC  
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing  
Small Outline (JEDEC SOIC)  
SWB  
G
Package Drawing Contact:  
packagedrawings@atmel.com  
18  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
11.2 8X — 8-lead TSSOP  
C
1
Pin 1 indicator  
this corner  
E1  
E
L1  
N
L
Top View  
End View  
A
b
A1  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
e
A2  
D
SYMBOL  
MIN  
-
NOM  
-
MAX  
1.20  
0.15  
1.05  
3.10  
NOTE  
2, 5  
A
Side View  
A1  
A2  
D
0.05  
0.80  
2.90  
-
Notes: 1. This drawing is for general information only.  
1.00  
Refer to JEDEC Drawing MO-153, Variation AA, for proper  
dimensions, tolerances, datums, etc.  
3.00  
2. Dimension D does not include mold Flash, protrusions or gate  
burrs. Mold Flash, protrusions and gate burrs shall not exceed  
0.15mm (0.006in) per side.  
E
6.40 BSC  
4.40  
E1  
b
4.30  
0.19  
4.50  
0.30  
3, 5  
4
3. Dimension E1 does not include inter-lead Flash or protrusions.  
Inter-lead Flash and protrusions shall not exceed 0.25mm  
(0.010in) per side.  
4. Dimension b does not include Dambar protrusion.  
Allowable Dambar protrusion shall be 0.08mm total in excess  
of the b dimension at maximum material condition. Dambar  
cannot be located on the lower radius of the foot. Minimum  
space between protrusion and adjacent lead is 0.07mm.  
5. Dimension D and E1 to be determined at Datum Plane H.  
0.25  
e
0.65 BSC  
0.60  
L
0.45  
0.09  
0.75  
0.20  
L1  
C
1.00 REF  
-
2/27/14  
TITLE  
GPC  
TNR  
DRAWING NO.  
REV.  
8X, 8-lead 4.4mm Body, Plastic Thin  
Shrink Small Outline Package (TSSOP)  
8X  
E
Package Drawing Contact:  
packagedrawings@atmel.com  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
19  
11.3 8MA2 — 8-pad UDFN  
E
1
8
7
6
5
Pin 1 ID  
2
3
4
D
C
TOP VIEW  
E2  
SIDE VIEW  
A2  
A
A1  
b (8x)  
8
1
2
3
4
COMMON DIMENSIONS  
(Unit of Measure = mm)  
7
6
5
Pin#1 ID  
D2  
MIN  
0.50  
MAX  
0.60  
NOM  
0.55  
NOTE  
SYMBOL  
A
A1  
A2  
D
0.0  
-
0.02  
-
0.05  
0.55  
2.10  
1.60  
3.10  
1.40  
0.30  
e (6x)  
L (8x)  
BOTTOM VIEW  
K
1.90  
1.40  
2.90  
1.20  
0.18  
2.00  
D2  
E
1.50  
3.00  
Notes:  
1. This drawing is for general information only. Refer to  
Drawing MO-229, for proper dimensions, tolerances,  
datums, etc.  
E2  
b
1.30  
0.25  
3
2. The Pin #1 ID is a laser-marked feature on Top View.  
3. Dimensions b applies to metallized terminal and is  
measured between 0.15 mm and 0.30 mm from the  
terminal tip. If the terminal has the optional radius on  
the other end of the terminal, the dimension should  
not be measured in that radius area.  
C
1.52 REF  
0.35  
L
0.30  
0.20  
0.40  
-
e
0.50 BSC  
-
K
4. The Pin #1 ID on the Bottom View is an orientation  
feature on the thermal pad.  
11/26/14  
TITLE  
DRAWING NO.  
REV.  
GPC  
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally  
YNZ  
8MA2  
G
Package Drawing Contact:  
packagedrawings@atmel.com  
Enhanced Plastic Ultra Thin Dual Flat No-Lead  
Package (UDFN)  
20  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
11.4 8ME1 — 8-pad XDFN  
D
7
5
4
6
3
8
E
PIN #1 ID  
2
1
A1  
Top View  
A
Side View  
e1  
b
L
COMMON DIMENSIONS  
(Unit of Measure = mm)  
SYMBOL  
MIN  
NOM  
MAX  
0.40  
0.05  
1.90  
2.30  
0.25  
NOTE  
A
A1  
D
E
0.10  
PIN #1 ID  
0.00  
1.70  
2.10  
0.15  
1.80  
0.15  
2.20  
b
0.20  
b
e
0.40 TYP  
1.20 REF  
0.30  
e
e1  
L
0.35  
0.26  
End View  
9/10/2012  
TITLE  
DRAWING NO.  
REV.  
GPC  
8ME1, 8-pad (1.80mm x 2.20mm body) Extra Thin DFN  
(XDFN)  
8ME1  
B
DTP  
Package Drawing Contact:  
packagedrawings@atmel.com  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
21  
11.5 8U3-1 — 8-ball VFBGA  
E
D
2.  
b
PIN 1 BALL PAD CORNER  
A1  
A2  
A
TOP VIEW  
SIDE VIEW  
PIN 1 BALL PAD CORNER  
4
3
1
2
d
(d1)  
6
5
8
7
COMMON DIMENSIONS  
(Unit of Measure - mm)  
e
(e1)  
SYMBOL  
NOM  
MIN  
MAX  
NOTE  
2
0.73  
0.09  
0.40  
0.20  
0.79  
0.85  
0.19  
0.50  
0.30  
A
A1  
A2  
b
BOTTOM VIEW  
8 SOLDER BALLS  
0.14  
0.45  
Notes:  
0.25  
1. This drawing is for general information only.  
1.50 BSC  
2.0 BSC  
0.50 BSC  
0.25 REF  
1.00 BSC  
0.25 REF  
D
E
2. Dimension ‘b’ is measured at maximum solder ball diameter.  
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.  
e
e1  
d
d1  
6/11/13  
REV.  
TITLE  
DRAWING NO.  
8U3-1  
GPC  
GXU  
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,  
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)  
F
Package Drawing Contact:  
packagedrawings@atmel.com  
22  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
11.6 8U-12 — 8-ball WLCSP  
TOP VIEW  
BALL SIDE  
1
1
3
2
2
3
A1 CORNER  
A
A1 CORNER  
A
e2  
e1  
B
C
B
C
E
D
E
D
E
d2  
d1  
-B-  
D
-A-  
k 0.015 (4X)  
db (4X)  
d0.015 C  
d0.05 C A B  
v
SIDE VIEW  
A3  
A2  
A
-C-  
k 0.075 C  
SEATING PLANE  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A1  
MIN  
MAX  
TYP  
NOTE  
SYMBOL  
A
A1  
A2  
A3  
D
0.313  
0.094  
0.175  
0.334  
-
0.355  
0.124  
0.225  
PIN ASSIGNMENT MATRIX  
1
2
n/a  
3
0.200  
0.025 REF  
A
B
C
D
E
GND  
n/a  
SI  
n/a  
Contact Atmel for details  
WP  
n/a  
d1  
d2  
E
0.693  
SO  
n/a  
SCK  
n/a  
0.400  
Contact Atmel for details  
0.400  
HOLD  
n/a  
CS  
Vcc  
e1  
e2  
b
0.400  
0.148  
0.168  
0.188  
9/15/14  
TITLE  
8U-12, 8-ball, 0.40 mm Pitch, 5 x 3 Array,  
Wafer Level Chip Scale Package (WLCSP) with BSC  
DRAWING NO.  
REV.  
GPC  
GZA  
8U-12  
B
Package Drawing Contact:  
packagedrawings@atmel.com  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
23  
12. Revision History  
Doc. Rev.  
Date  
Comments  
Add the AT25080B-MAHL-E and AT25160B-MAHL-E package options.  
Update the 8MA2 and 8U-12 package drawings and the ordering information.  
5228G  
01/2015  
Add WLSCP package option.  
5228F  
07/2014  
Update 8X, 8MA2, 8ME1, and 8U3-1 package drawings.  
Update template, Atmel logos, disclaimer page.  
5228E  
5228D  
5228C  
5228B  
5228A  
03/2012  
04/2010  
08/2009  
07/2008  
09/2007  
Update 8A2 to 8X and 8S1, 8MA2, 8U3-1 package drawings.  
Update Ordering Code Detail and Ordering Information.  
Change Catalog Scheme and add Marking Details.  
Change ‘Endurance’ parameter on page 6.  
Initial document release.  
24  
AT25080B/160B [DATASHEET]  
Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015  
X X  
X X X X  
Atmel Corporation  
1600 Technology Drive, San Jose, CA 95110 USA  
T: (+1)(408) 441.0311  
F: (+1)(408) 436.4200  
|
www.atmel.com  
© 2015 Atmel Corporation. / Rev.: Atmel-5228G-SEEPROM-AT25080B-160B-Datasheet_012015.  
Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and  
other countries. Other terms and product names may be trademarks of others.  
DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right  
is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE  
ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT  
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contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended,  
authorized, or warranted for use as components in applications intended to support or sustain life.  
SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where  
the failure of such products would reasonably be expected to result in significant personal injury or death (“Safety-Critical Applications”) without an Atmel officer's specific written  
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