ATTINY13A-MUR [MICROCHIP]

IC MCU 8BIT 1KB FLASH 20QFN;
ATTINY13A-MUR
型号: ATTINY13A-MUR
厂家: MICROCHIP    MICROCHIP
描述:

IC MCU 8BIT 1KB FLASH 20QFN

时钟 ATM 异步传输模式 PC 微控制器 外围集成电路 闪存
文件: 总20页 (文件大小:437K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
High Performance, Low Power AVR® 8-Bit Microcontroller  
Advanced RISC Architecture  
– 120 Powerful Instructions – Most Single Clock Cycle Execution  
– 32 x 8 General Purpose Working Registers  
– Fully Static Operation  
– Up to 20 MIPS Througput at 20 MHz  
High Endurance Non-volatile Memory segments  
– 1K Bytes of In-System Self-programmable Flash program memory  
– 64 Bytes EEPROM  
8-bit  
– 64 Bytes Internal SRAM  
Microcontroller  
with 1K Bytes  
In-System  
Programmable  
Flash  
– Write/Erase Cycles: 10,000 Flash/100,000 EEPROM  
– Data retention: 20 Years at 85°C/100 Years at 25°C (see page 6)  
– Programming Lock for Self-Programming Flash & EEPROM Data Security  
Peripheral Features  
– One 8-bit Timer/Counter with Prescaler and Two PWM Channels  
– 4-channel, 10-bit ADC with Internal Voltage Reference  
– Programmable Watchdog Timer with Separate On-chip Oscillator  
– On-chip Analog Comparator  
Special Microcontroller Features  
– debugWIRE On-chip Debug System  
– In-System Programmable via SPI Port  
– External and Internal Interrupt Sources  
– Low Power Idle, ADC Noise Reduction, and Power-down Modes  
– Enhanced Power-on Reset Circuit  
– Programmable Brown-out Detection Circuit with Software Disable Function  
– Internal Calibrated Oscillator  
ATtiny13A  
Summary  
I/O and Packages  
– 8-pin PDIP/SOIC: Six Programmable I/O Lines  
– 10-pad MLF: Six Programmable I/O Lines  
– 20-pad MLF: Six Programmable I/O Lines  
Operating Voltage:  
– 1.8 – 5.5V  
Speed Grade:  
– 0 – 4 MHz @ 1.8 – 5.5V  
– 0 – 10 MHz @ 2.7 – 5.5V  
– 0 – 20 MHz @ 4.5 – 5.5V  
Industrial Temperature Range  
Low Power Consumption  
– Active Mode:  
• 190 µA at 1.8 V and 1 MHz  
– Idle Mode:  
• 24 µA at 1.8 V and 1 MHz  
Rev. 8126FS–AVR–05/12  
1. Pin Configurations  
Figure 1-1. Pinout of ATtiny13A  
8-PDIP/SOIC  
(PCINT5/RESET/ADC0/dW) PB5  
1
2
3
4
8
7
6
5
VCC  
(PCINT3/CLKI/ADC3) PB3  
(PCINT4/ADC2) PB4  
GND  
PB2 (SCK/ADC1/T0/PCINT2)  
PB1 (MISO/AIN1/OC0B/INT0/PCINT1)  
PB0 (MOSI/AIN0/OC0A/PCINT0)  
20-QFN/MLF  
(PCINT5/RESET/ADC0/dW) PB5  
(PCINT3/CLKI/ADC3) PB3  
DNC  
1
15  
VCC  
2
3
4
5
14  
13  
12  
11  
PB2 (SCK/ADC1/T0/PCINT2)  
DNC  
DNC  
PB1 (MISO/AIN1/OC0B/INT0/PCINT1)  
PB0 (MOSI/AIN0/OC0A/PCINT0)  
(PCINT4/ADC2) PB4  
NOTE: Bottom pad should be soldered to ground.  
DNC: Do Not Connect  
10-QFN/MLF  
(PCINT5/RESET/ADC0/dW) PB5  
(PCINT3/CLKI/ADC3) PB3  
DNC  
1
2
3
4
5
10  
9
VCC  
PB2 (SCK/ADC1/T0/PCINT2)  
DNC  
8
(PCINT4/ADC2) PB4  
GND  
7
PB1 (MISO/AIN1/OC0B/INT0/PCINT1)  
PB0 (MOSI/AIN0/OC0A/PCINT0)  
6
NOTE: Bottom pad should be soldered to ground.  
DNC: Do Not Connect  
2
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
1.1  
Pin Description  
1.1.1  
VCC  
Supply voltage.  
1.1.2  
1.1.3  
GND  
Ground.  
Port B (PB5:PB0)  
Port B is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The  
Port B output buffers have symmetrical drive characteristics with both high sink and source  
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up  
resistors are activated. The Port B pins are tri-stated when a reset condition becomes active,  
even if the clock is not running.  
Port B also serves the functions of various special features of the ATtiny13A as listed on page  
55.  
1.1.4  
RESET  
Reset input. A low level on this pin for longer than the minimum pulse length will generate a  
reset, even if the clock is not running and provided the reset pin has not been disabled. The min-  
imum pulse length is given in Table 18-4 on page 120. Shorter pulses are not guaranteed to  
generate a reset.  
The reset pin can also be used as a (weak) I/O pin.  
3
8126FS–AVR–05/12  
2. Overview  
The ATtiny13A is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC  
architecture. By executing powerful instructions in a single clock cycle, the ATtiny13A achieves  
throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power con-  
sumption versus processing speed.  
2.1  
Block Diagram  
Figure 2-1. Block Diagram  
8-BIT DATABUS  
STACK  
POINTER  
CALIBRATED  
INTERNAL  
OSCILLATOR  
WATCHDOG  
OSCILLATOR  
SRAM  
WATCHDOG  
TIMER  
TIMING AND  
CONTROL  
VCC  
MCU CONTROL  
REGISTER  
PROGRAM  
COUNTER  
MCU STATUS  
REGISTER  
GND  
PROGRAM  
FLASH  
TIMER/  
COUNTER0  
INSTRUCTION  
REGISTER  
GENERAL  
PURPOSE  
REGISTERS  
INTERRUPT  
UNIT  
X
Y
Z
PROGRAMMING  
LOGIC  
INSTRUCTION  
DECODER  
DATA  
EEPROM  
CONTROL  
LINES  
ALU  
STATUS  
REGISTER  
ADC /  
ANALOG COMPARATOR  
DATA REGISTER  
PORT B  
DATA DIR.  
REG.PORT B  
PORT B DRIVERS  
RESET  
CLKI  
PB[0:5]  
4
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
The AVR core combines a rich instruction set with 32 general purpose working registers. All 32  
registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent  
registers to be accessed in one single instruction executed in one clock cycle. The resulting  
architecture is more code efficient while achieving throughputs up to ten times faster than con-  
ventional CISC microcontrollers.  
The ATtiny13A provides the following features: 1K byte of In-System Programmable Flash, 64  
bytes EEPROM, 64 bytes SRAM, 6 general purpose I/O lines, 32 general purpose working reg-  
isters, one 8-bit Timer/Counter with compare modes, Internal and External Interrupts, a 4-  
channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, and three soft-  
ware selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM,  
Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. The  
Power-down mode saves the register contents, disabling all chip functions until the next Inter-  
rupt or Hardware Reset. The ADC Noise Reduction mode stops the CPU and all I/O modules  
except ADC, to minimize switching noise during ADC conversions.  
The device is manufactured using Atmel’s high density non-volatile memory technology. The  
On-chip ISP Flash allows the Program memory to be re-programmed In-System through an SPI  
serial interface, by a conventional non-volatile memory programmer or by an On-chip boot code  
running on the AVR core.  
The ATtiny13A AVR is supported with a full suite of program and system development tools  
including: C Compilers, Macro Assemblers, Program Debugger/Simulators, and Evaluation kits.  
5
8126FS–AVR–05/12  
3. About  
3.1  
Resources  
A comprehensive set of drivers, application notes, data sheets and descriptions on development  
tools are available for download at http://www.atmel.com/avr.  
3.2  
Code Examples  
This documentation contains simple code examples that briefly show how to use various parts of  
the device. These code examples assume that the part specific header file is included before  
compilation. Be aware that not all C compiler vendors include bit definitions in the header files  
and interrupt handling in C is compiler dependent. Please confirm with the C compiler documen-  
tation for more details.  
3.3  
Data Retention  
Reliability Qualification results show that the projected data retention failure rate is much less  
than 1 PPM over 20 years at 85°C or 100 years at 25°C.  
6
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
4. Register Summary  
Address  
Name  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Page  
0x3F  
0x3E  
0x3D  
0x3C  
0x3B  
0x3A  
0x39  
0x38  
0x37  
0x36  
0x35  
0x34  
0x33  
0x32  
0x31  
0x30  
0x2F  
0x2E  
0x2D  
0x2C  
0x2B  
0x2A  
0x29  
0x28  
0x27  
0x26  
0x25  
0x24  
0x23  
0x22  
0x21  
0x20  
0x1F  
0x1E  
0x1D  
0x1C  
0x1B  
0x1A  
0x19  
0x18  
0x17  
0x16  
0x15  
0x14  
0x13  
0x12  
0x11  
0x10  
0x0F  
0x0E  
0x0D  
0x0C  
0x0B  
0x0A  
0x09  
0x08  
0x07  
0x06  
0x05  
0x04  
0x03  
0x02  
0x01  
0x00  
SREG  
Reserved  
SPL  
I
T
H
S
V
N
Z
C
page 9  
SP[7:0]  
page 11  
Reserved  
GIMSK  
INT0  
INTF0  
PCIE  
PCIF  
page 47  
page 48  
GIFR  
TIMSK0  
TIFR0  
OCIE0B  
OCF0B  
RFLB  
OCIE0A  
OCF0A  
PGWRT  
TOIE0  
TOV0  
PGERS  
page 75  
page 76  
SELFPR-  
SPMCSR  
OCR0A  
MCUCR  
MCUSR  
TCCR0B  
TCNT0  
CTPB  
page 98  
Timer/Counter – Output Compare Register A  
page 75  
PUD  
SE  
SM1  
SM0  
ISC01  
EXTRF  
CS01  
ISC00  
PORF  
CS00  
pages 33, 47, 57  
page 42  
WDRF  
WGM02  
BORF  
CS02  
FOC0A  
FOC0B  
page 73  
Timer/Counter (8-bit)  
page 74  
OSCCAL  
BODCR  
TCCR0A  
DWDR  
Oscillator Calibration Register  
page 27  
BODS  
BODSE  
WGM00  
page 33  
COM0A1  
COM0A0  
COM0B1  
COM0B0  
WGM01  
page 70  
DWDR[7:0]  
page 97  
Reserved  
Reserved  
Reserved  
Reserved  
OCR0B  
GTCCR  
Reserved  
CLKPR  
Timer/Counter – Output Compare Register B  
page 75  
page 78  
TSM  
PSR10  
CLKPCE  
CLKPS3  
CLKPS2  
CLKPS1  
PRTIM0  
CLKPS0  
PRADC  
page 28  
page 34  
PRR  
Reserved  
Reserved  
Reserved  
WDTCR  
Reserved  
Reserved  
EEARL  
WDTIF  
WDTIE  
WDP3  
WDCE  
WDE  
WDP2  
WDP1  
EEPE  
WDP0  
EERE  
page 42  
EEPROM Address Register  
EEPROM Data Register  
page 20  
page 20  
page 21  
EEDR  
EECR  
EEPM1  
EEPM0  
EERIE  
EEMPE  
Reserved  
Reserved  
Reserved  
PORTB  
DDRB  
PORTB5  
DDB5  
PORTB4  
DDB4  
PORTB3  
DDB3  
PORTB2  
DDB2  
PORTB1  
DDB1  
PORTB0  
DDB0  
page 57  
page 57  
PINB  
PINB5  
PINB4  
PINB3  
PINB2  
PINB1  
PINB0  
page 58  
PCMSK  
DIDR0  
PCINT5  
ADC0D  
PCINT4  
ADC2D  
PCINT3  
ADC3D  
PCINT2  
ADC1D  
PCINT1  
AIN1D  
PCINT0  
AIN0D  
page 48  
pages 81, 95  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
ACSR  
ACD  
ACBG  
REFS0  
ADSC  
ACO  
ACI  
ACIE  
ACIS1  
MUX1  
ADPS1  
ACIS0  
MUX0  
ADPS0  
page 80  
page 92  
ADMUX  
ADCSRA  
ADCH  
ADLAR  
ADATE  
ADEN  
ADIF  
ADIE  
ADPS2  
page 93  
ADC Data Register High Byte  
ADC Data Register Low Byte  
page 94  
ADCL  
page 94  
ADCSRB  
Reserved  
Reserved  
Reserved  
ACME  
ADTS2  
ADTS1  
ADTS0  
pages 80, 95  
7
8126FS–AVR–05/12  
 
 
 
Notes: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses  
should never be written.  
2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these  
registers, the value of single bits can be checked by using the SBIS and SBIC instructions.ome of the Status Flags are  
cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation  
the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work  
with registers 0x00 to 0x1F only.  
8
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
5. Instruction Set Summary  
Mnemonics  
Operands  
Description  
Operation  
Flags  
#Clocks  
ARITHMETIC AND LOGIC INSTRUCTIONS  
ADD  
ADC  
ADIW  
SUB  
SUBI  
SBC  
SBCI  
SBIW  
AND  
ANDI  
OR  
Rd, Rr  
Rd, Rr  
Rdl,K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd, K  
Rdl,K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd, K  
Rd, Rr  
Rd  
Add two Registers  
Add with Carry two Registers  
Add Immediate to Word  
Subtract two Registers  
Subtract Constant from Register  
Subtract with Carry two Registers  
Subtract with Carry Constant from Reg.  
Subtract Immediate from Word  
Logical AND Registers  
Logical AND Register and Constant  
Logical OR Registers  
Rd Rd + Rr  
Rd Rd + Rr + C  
Rdh:Rdl Rdh:Rdl + K  
Rd Rd - Rr  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,S  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,H  
Z,C,N,V,S  
Z,N,V  
1
1
2
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Rd Rd - K  
Rd Rd - Rr - C  
Rd Rd - K - C  
Rdh:Rdl Rdh:Rdl - K  
Rd Rd Rr  
Rd Rd K  
Z,N,V  
Rd Rd v Rr  
Z,N,V  
ORI  
Logical OR Register and Constant  
Exclusive OR Registers  
One’s Complement  
Rd Rd v K  
Z,N,V  
EOR  
COM  
NEG  
SBR  
CBR  
INC  
Rd Rd Rr  
Rd 0xFF Rd  
Rd 0x00 Rd  
Rd Rd v K  
Z,N,V  
Z,C,N,V  
Z,C,N,V,H  
Z,N,V  
Rd  
Two’s Complement  
Rd,K  
Rd,K  
Rd  
Set Bit(s) in Register  
Clear Bit(s) in Register  
Increment  
Rd Rd (0xFF - K)  
Rd Rd + 1  
Z,N,V  
Z,N,V  
DEC  
TST  
Rd  
Decrement  
Rd Rd 1  
Z,N,V  
Rd  
Test for Zero or Minus  
Clear Register  
Rd Rd Rd  
Rd Rd Rd  
Rd 0xFF  
Z,N,V  
CLR  
SER  
Rd  
Z,N,V  
Rd  
Set Register  
None  
BRANCH INSTRUCTIONS  
RJMP  
IJMP  
k
k
Relative Jump  
Indirect Jump to (Z)  
PC PC + k + 1  
PC Z  
None  
None  
None  
None  
None  
I
2
2
RCALL  
ICALL  
RET  
Relative Subroutine Call  
Indirect Call to (Z)  
PC PC + k + 1  
3
PC Z  
3
Subroutine Return  
PC STACK  
4
RETI  
Interrupt Return  
PC STACK  
4
CPSE  
CP  
Rd,Rr  
Compare, Skip if Equal  
Compare  
if (Rd = Rr) PC PC + 2 or 3  
Rd Rr  
None  
Z, N,V,C,H  
Z, N,V,C,H  
Z, N,V,C,H  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
1/2/3  
1
Rd,Rr  
CPC  
Rd,Rr  
Compare with Carry  
Rd Rr C  
1
CPI  
Rd,K  
Compare Register with Immediate  
Skip if Bit in Register Cleared  
Skip if Bit in Register is Set  
Skip if Bit in I/O Register Cleared  
Skip if Bit in I/O Register is Set  
Branch if Status Flag Set  
Branch if Status Flag Cleared  
Branch if Equal  
Rd K  
1
SBRC  
SBRS  
SBIC  
Rr, b  
if (Rr(b)=0) PC PC + 2 or 3  
if (Rr(b)=1) PC PC + 2 or 3  
if (P(b)=0) PC PC + 2 or 3  
if (P(b)=1) PC PC + 2 or 3  
if (SREG(s) = 1) then PCPC+k + 1  
if (SREG(s) = 0) then PCPC+k + 1  
if (Z = 1) then PC PC + k + 1  
if (Z = 0) then PC PC + k + 1  
if (C = 1) then PC PC + k + 1  
if (C = 0) then PC PC + k + 1  
if (C = 0) then PC PC + k + 1  
if (C = 1) then PC PC + k + 1  
if (N = 1) then PC PC + k + 1  
if (N = 0) then PC PC + k + 1  
if (N V= 0) then PC PC + k + 1  
if (N V= 1) then PC PC + k + 1  
if (H = 1) then PC PC + k + 1  
if (H = 0) then PC PC + k + 1  
if (T = 1) then PC PC + k + 1  
if (T = 0) then PC PC + k + 1  
if (V = 1) then PC PC + k + 1  
if (V = 0) then PC PC + k + 1  
if ( I = 1) then PC PC + k + 1  
if ( I = 0) then PC PC + k + 1  
1/2/3  
1/2/3  
1/2/3  
1/2/3  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
1/2  
Rr, b  
P, b  
P, b  
s, k  
s, k  
k
SBIS  
BRBS  
BRBC  
BREQ  
BRNE  
BRCS  
BRCC  
BRSH  
BRLO  
BRMI  
BRPL  
BRGE  
BRLT  
BRHS  
BRHC  
BRTS  
BRTC  
BRVS  
BRVC  
BRIE  
k
Branch if Not Equal  
k
Branch if Carry Set  
k
Branch if Carry Cleared  
Branch if Same or Higher  
Branch if Lower  
k
k
k
Branch if Minus  
k
Branch if Plus  
k
Branch if Greater or Equal, Signed  
Branch if Less Than Zero, Signed  
Branch if Half Carry Flag Set  
Branch if Half Carry Flag Cleared  
Branch if T Flag Set  
k
k
k
k
k
Branch if T Flag Cleared  
Branch if Overflow Flag is Set  
Branch if Overflow Flag is Cleared  
Branch if Interrupt Enabled  
Branch if Interrupt Disabled  
k
k
k
BRID  
k
BIT AND BIT-TEST INSTRUCTIONS  
SBI  
CBI  
P,b  
P,b  
Rd  
Rd  
Rd  
Set Bit in I/O Register  
Clear Bit in I/O Register  
Logical Shift Left  
I/O(P,b) 1  
I/O(P,b) 0  
None  
None  
2
2
1
1
1
LSL  
LSR  
ROL  
Rd(n+1) Rd(n), Rd(0) 0  
Rd(n) Rd(n+1), Rd(7) 0  
Rd(0)C,Rd(n+1)Rd(n),CRd(7)  
Z,C,N,V  
Z,C,N,V  
Z,C,N,V  
Logical Shift Right  
Rotate Left Through Carry  
9
8126FS–AVR–05/12  
Mnemonics  
Operands  
Description  
Operation  
Flags  
#Clocks  
ROR  
ASR  
SWAP  
BSET  
BCLR  
BST  
BLD  
SEC  
CLC  
SEN  
CLN  
SEZ  
CLZ  
SEI  
Rd  
Rd  
Rotate Right Through Carry  
Arithmetic Shift Right  
Swap Nibbles  
Rd(7)C,Rd(n)Rd(n+1),CRd(0)  
Z,C,N,V  
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Rd(n) Rd(n+1), n=0..6  
Z,C,N,V  
Rd  
Rd(3..0)Rd(7..4),Rd(7..4)Rd(3..0)  
None  
s
Flag Set  
SREG(s) 1  
SREG(s) 0  
T Rr(b)  
Rd(b) T  
C 1  
SREG(s)  
s
Flag Clear  
SREG(s)  
Rr, b  
Rd, b  
Bit Store from Register to T  
Bit load from T to Register  
Set Carry  
T
None  
C
C
N
N
Z
Clear Carry  
C 0  
Set Negative Flag  
N 1  
Clear Negative Flag  
Set Zero Flag  
N 0  
Z 1  
Clear Zero Flag  
Z 0  
Z
Global Interrupt Enable  
Global Interrupt Disable  
Set Signed Test Flag  
Clear Signed Test Flag  
Set Twos Complement Overflow.  
Clear Twos Complement Overflow  
Set T in SREG  
I 1  
I
CLI  
I 0  
I
SES  
CLS  
SEV  
CLV  
SET  
CLT  
SEH  
CLH  
S 1  
S
S 0  
S
V 1  
V
V 0  
V
T 1  
T
Clear T in SREG  
T 0  
T
Set Half Carry Flag in SREG  
Clear Half Carry Flag in SREG  
H 1  
H
H
H 0  
DATA TRANSFER INSTRUCTIONS  
MOV  
MOVW  
LDI  
LD  
Rd, Rr  
Rd, Rr  
Rd, K  
Move Between Registers  
Copy Register Word  
Rd Rr  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
None  
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
3
3
3
Rd+1:Rd Rr+1:Rr  
Load Immediate  
Rd K  
Rd (X)  
Rd, X  
Load Indirect  
LD  
Rd, X+  
Rd, - X  
Rd, Y  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect  
Rd (X), X X + 1  
X X - 1, Rd (X)  
Rd (Y)  
LD  
LD  
LD  
Rd, Y+  
Rd, - Y  
Rd,Y+q  
Rd, Z  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect with Displacement  
Load Indirect  
Rd (Y), Y Y + 1  
Y Y - 1, Rd (Y)  
Rd (Y + q)  
Rd (Z)  
LD  
LDD  
LD  
LD  
Rd, Z+  
Rd, -Z  
Rd, Z+q  
Rd, k  
Load Indirect and Post-Inc.  
Load Indirect and Pre-Dec.  
Load Indirect with Displacement  
Load Direct from SRAM  
Store Indirect  
Rd (Z), Z Z+1  
Z Z - 1, Rd (Z)  
Rd (Z + q)  
Rd (k)  
LD  
LDD  
LDS  
ST  
X, Rr  
(X) Rr  
ST  
X+, Rr  
- X, Rr  
Y, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect  
(X) Rr, X X + 1  
X X - 1, (X) Rr  
(Y) Rr  
ST  
ST  
ST  
Y+, Rr  
- Y, Rr  
Y+q,Rr  
Z, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect with Displacement  
Store Indirect  
(Y) Rr, Y Y + 1  
Y Y - 1, (Y) Rr  
(Y + q) Rr  
ST  
STD  
ST  
(Z) Rr  
ST  
Z+, Rr  
-Z, Rr  
Z+q,Rr  
k, Rr  
Store Indirect and Post-Inc.  
Store Indirect and Pre-Dec.  
Store Indirect with Displacement  
Store Direct to SRAM  
Load Program Memory  
Load Program Memory  
Load Program Memory and Post-Inc  
Store Program Memory  
In Port  
(Z) Rr, Z Z + 1  
Z Z - 1, (Z) Rr  
(Z + q) Rr  
ST  
STD  
STS  
LPM  
LPM  
LPM  
SPM  
IN  
(k) Rr  
R0 (Z)  
Rd, Z  
Rd (Z)  
Rd, Z+  
Rd (Z), Z Z+1  
(z) R1:R0  
Rd, P  
P, Rr  
Rr  
Rd P  
1
1
2
2
OUT  
PUSH  
POP  
Out Port  
P Rr  
Push Register on Stack  
Pop Register from Stack  
STACK Rr  
Rd STACK  
Rd  
MCU CONTROL INSTRUCTIONS  
NOP  
SLEEP  
WDR  
No Operation  
Sleep  
None  
None  
None  
None  
1
1
(see specific descr. for Sleep function)  
(see specific descr. for WDR/Timer)  
For On-chip Debug Only  
Watchdog Reset  
Break  
1
BREAK  
N/A  
10  
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
6. Ordering Information  
Speed (MHz)  
Power Supply (V)  
Ordering Code(1)  
Package(2)  
Operation Range  
ATtiny13A-PU  
ATtiny13A-SU  
8P3  
8S2  
ATtiny13A-SUR  
ATtiny13A-SH  
8S2  
8S2  
ATtiny13A-SHR  
ATtiny13A-SSU  
ATtiny13A-SSUR  
ATtiny13A-SSH  
ATtiny13A-SSHR  
ATtiny13A-MU  
ATtiny13A-MUR  
ATtiny13A-MMU(3)  
ATtiny13A-MMUR(3)  
8S2  
8S1  
8S1  
8S1  
Industrial  
(-40°C to +85°C)(4)  
8S1  
20M1  
20M1  
10M1(3)  
10M1(3)  
20  
1.8 - 5.5  
ATtiny13A-SN  
ATtiny13A-SNR  
ATtiny13A-SS7  
ATtiny13A-SS7R  
8S2  
8S2  
8S1  
8S1  
Industrial  
(-40°C to +105°C)(5)  
ATtiny13A-SF  
8S2  
8S2  
ATtiny13A-SFR  
ATtiny13A-MMF  
ATtiny13A-MMFR  
Industrial  
10M1(3)  
10M1(3)  
(-40°C to +125°C)(6)  
Notes: 1. Code indicators:  
– H or 7: NiPdAu lead finish  
– U, N or F: matte tin  
– R: tape & reel  
2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazard-  
ous Substances (RoHS).  
3. Topside marking for ATtiny13A:  
– 1st Line: T13  
– 2nd Line: Axx  
– 3rd Line: xxx  
4. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering informa-  
tion and minimum quantities.  
5. For typical and Electrical characteristics for this device please consult Appendix A, ATtiny13A Specification at 105°C.  
6. For typical and Electrical characteristics for this device please consult Appendix B, ATtiny13A Specification at 125°C.  
Package Type  
8P3  
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)  
8S2  
8-lead, 0.209" Wide, Plastic Small Outline Package (EIAJ SOIC)  
8-lead, 0.150" Wide, Plastic Gull-Wing Small Outline (JEDEC SOIC)  
20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF)  
10-pad, 3 x 3 x 1 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF)  
8S1  
20M1  
10M1  
11  
8126FS–AVR–05/12  
 
 
 
 
 
 
 
7. Packaging Information  
7.1  
8P3  
E
1
E1  
N
Top View  
c
eA  
End View  
COMMON DIMENSIONS  
(Unit of Measure = inches)  
D
e
MIN  
MAX  
NOM  
NOTE  
SYMBOL  
D1  
A2 A  
A
0.210  
0.195  
0.022  
0.070  
0.045  
0.014  
0.400  
2
A2  
b
0.115  
0.014  
0.045  
0.030  
0.008  
0.355  
0.005  
0.300  
0.240  
0.130  
0.018  
0.060  
0.039  
0.010  
0.365  
5
6
6
b2  
b3  
c
D
3
3
4
3
b2  
L
D1  
E
b3  
4 PLCS  
0.310  
0.250  
0.325  
0.280  
b
E1  
e
0.100 BSC  
0.300 BSC  
0.130  
Side View  
eA  
L
4
2
0.115  
0.150  
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.  
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.  
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.  
4. E and eA measured with the leads constrained to be perpendicular to datum.  
5. Pointed or rounded lead tips are preferred to ease insertion.  
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).  
01/09/02  
TITLE  
DRAWING NO.  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
8P3, 8-lead, 0.300" Wide Body, Plastic Dual  
In-line Package (PDIP)  
8P3  
B
R
12  
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
7.2  
8S2  
C
1
E
E1  
L
N
θ
TOP VVIIEEWW  
ENDD VVIIEEWW  
e
b
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A
MIN  
1.70  
0.05  
0.35  
0.15  
5.13  
5.18  
7.70  
0.51  
0°  
MAX  
2.16  
0.25  
0.48  
0.35  
5.35  
5.40  
8.26  
0.85  
8°  
NOM  
NOTE  
SYMBOL  
A1  
A
A1  
b
4
4
C
D
E1  
E
D
2
L
SIDDE VIEW  
θ
e
1.27 BSC  
3
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.  
2. Mismatch of the upper and lower dies and resin burrs aren't included.  
3. Determines the true geometric position.  
4. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.  
4/15/08  
GPC  
DRAWING NO.  
TITLE  
REV.  
8S2, 8-lead, 0.208” Body, Plastic Small  
Outline Package (EIAJ)  
Package Drawing Contact:  
packagedrawings@atmel.com  
STN  
8S2  
F
13  
8126FS–AVR–05/12  
7.3  
8S1  
1
4
3
2
H
N
Top View  
e
B
A
D
COMMON DIMENSIONS  
(Unit of Measure = mm)  
Side View  
MIN  
MAX  
1.75  
0.51  
0.25  
5.00  
4.00  
NOM  
NOTE  
SYMBOL  
A
B
C
D
E
e
A2  
L
C
1.27 BSC  
E
H
L
6.20  
1.27  
End View  
Note:  
This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc.  
2010-10-20  
TITLE  
DRAWING NO.  
REV.  
B
2325 Orchard Parkway  
San Jose, CA 95131  
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing  
8S1  
R
Small Outline (JEDEC SOIC)  
14  
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
7.4  
20M1  
D
1
2
Pin 1 ID  
SIDE VIEW  
E
3
TOP VIEW  
A2  
A1  
D2  
A
0.08  
C
1
2
3
Pin #1  
Notch  
(0.20 R)  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
E2  
MIN  
0.70  
MAX  
0.80  
0.05  
b
NOM  
0.75  
NOTE  
SYMBOL  
A
A1  
A2  
b
0.01  
L
0.20 REF  
0.23  
0.18  
2.45  
2.45  
0.35  
0.30  
2.75  
2.75  
0.55  
e
D
4.00 BSC  
2.60  
D2  
E
BOTTOM VIEW  
4.00 BSC  
2.60  
E2  
e
0.50 BSC  
0.40  
Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5.  
Note:  
L
10/27/04  
DRAWING NO. REV.  
20M1  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm,  
B
R
2.6 mm Exposed Pad, Micro Lead Frame Package (MLF)  
15  
8126FS–AVR–05/12  
7.5  
10M1  
D
y
Pin 1 ID  
E
SIDE VIEW  
TOP VIEW  
A1  
A
D1  
K
COMMON DIMENSIONS  
(Unit of Measure = mm)  
1
2
MIN  
MAX  
NOM  
NOTE  
SYMBOL  
A
0.80  
0.90  
1.00  
A1  
b
0.00  
0.18  
2.90  
1.40  
2.90  
2.20  
0.02  
0.25  
3.00  
0.05  
0.30  
3.10  
1.75  
3.10  
2.70  
b
E1  
D
D1  
E
e
3.00  
E1  
e
0.50  
L
0.30  
0.50  
0.08  
L
BOTTOM VIEW  
y
K
0.20  
Notes: 1. This package conforms to JEDEC reference MO-229C, Variation VEED-5.  
2. The terminal #1 ID is a Lasser-marked Feature.  
7/7/06  
DRAWING NO. REV.  
10M1  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
10M1, 10-pad, 3 x 3 x 1.0 mm Body, Lead Pitch 0.50 mm,  
A
R
1.64 x 2.60 mm Exposed Pad, Micro Lead Frame Package  
16  
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
8. Errata  
The revision letters in this section refer to the revision of the ATtiny13A device.  
8.1  
ATtiny13A Rev. G – H  
EEPROM can not be written below 1.9 Volt  
1. EEPROM can not be written below 1.9 Volt  
Writing the EEPROM at VCC below 1.9 volts might fail.  
Problem Fix/Workaround  
Do not write the EEPROM when VCC is below 1.9 volts.  
8.2  
8.3  
ATtiny13A Rev. E – F  
These device revisions were not sampled.  
ATtiny13 Rev. A – D  
These device revisions were referred to as ATtiny13/ATtiny13V.  
17  
8126FS–AVR–05/12  
 
9. Datasheet Revision History  
Please note that page numbers in this section refer to the current version of this document and  
may not apply to previous versions.  
9.1  
9.2  
Rev. 8126F – 05/12  
1. Updated Table 10-5 on page 57.  
2. Updated order codes on page 11.  
Rev. 8126E – 07/10  
1. Updated description in Section 6.4.2 “CLKPR – Clock Prescale Register” on page 28.  
2. Adjusted notes in Table 18-1, “DC Characteristics, TA = -40°C to +85°C,” on page 117.  
3. Updated plot order in Section 19. “Typical Characteristics” on page 124, added some  
plots, also some headers and figure titles adjusted.  
4. Updated Section 6. “Ordering Information” on page 11, added extended temperature  
part numbers, as well tape & reel part numbers. Notes adjusted.  
5. Updated bit syntax throughout the datasheet, e.g. from CS02:0 to CS0[2:0].  
9.3  
Rev. 8126D – 11/09  
1. Added note “If the RSTDISPL fuse is programmed...” in Startup-up Times Table 6-5  
and Table 6-6 on page 26.  
2. Added addresses in all Register Description tables and cross-references to Register  
Summary.  
3. Updated naming convention for -COM bits in tables from Table 11-2 on page 70 to  
Table 11-7 on page 72.  
4. Updated value for tWD_ERASE in Table 17-8, “Minimum Wait Delay Before Writing the Next  
Flash or EEPROM Location,” on page 108.  
5. Added NiPdAU note for -SH and -SSH in Section 6. “Ordering Information” on page 11.  
9.4  
9.5  
Rev. 8126C – 09/09  
1. Added EEPROM errata for rev. G - H on page 17.  
2. Added a note about topside marking in Section 6. “Ordering Information” on page 11.  
Rev. 8126B – 11/08  
1. Updated order codes on page 11 to reflect changes in material composition.  
2. Updated sections:  
“DIDR0 – Digital Input Disable Register 0” on page 81  
“DIDR0 – Digital Input Disable Register 0” on page 95  
3. Updated “Register Summary” on page 7.  
9.6  
Rev. 8126A – 05/08  
1. Initial revision, created from document 2535I – 04/08.  
2. Updated characteristic plots of section “Typical Characteristics” , starting on page 124.  
3. Updated “Ordering Information” on page 11.  
4. Updated section:  
“Speed” on page 118  
18  
ATtiny13A  
8126FS–AVR–05/12  
ATtiny13A  
5. Update tables:  
“DC Characteristics, TA = -40°C to +85°C” on page 117  
“Calibration Accuracy of Internal RC Oscillator” on page 119  
“Reset, Brown-out, and Internal Voltage Characteristics” on page 120  
“ADC Characteristics, Single Ended Channels. TA = -40°C to +85°C” on page 121  
“Serial Programming Characteristics, TA = -40°C to +85°C” on page 122  
6. Added description of new function, “Power Reduction Register”:  
– Added functional description on page 31  
– Added bit description on page 34  
– Added section “Supply Current of I/O Modules” on page 124  
– Updated Register Summary on page 7  
7. Added description of new function, “Software BOD Disable”:  
– Added functional description on page 31  
– Updated section on page 32  
– Added register description on page 33  
– Updated Register Summary on page 7  
8. Added description of enhanced function, “Enhanced Power-On Reset”:  
– Updated Table 18-4 on page 120, and Table 18-5 on page 120  
19  
8126FS–AVR–05/12  
Headquarters  
International  
Atmel Corporation  
2325 Orchard Parkway  
San Jose, CA 95131  
USA  
Tel: (+1)(408) 441-0311  
Fax: (+1)(408) 487-2600  
Atmel Asia Limited  
Unit 01-5 & 16, 19F  
BEA Tower, Millennium City 5  
418 Kwun Tong Road  
Kwun Tong, Kowloon  
HONG KONG  
Atmel Munich GmbH  
Business Campus  
Parkring 4  
D-85748 Garching b. Munich  
GERMANY  
Atmel Japan  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
JAPAN  
Tel: (+81)(3) 3523-3551  
Fax: (+81)(3) 3523-7581  
Tel: (+49) 89-31970-0  
Fax: (+49) 89-3194621  
Tel: (+852) 2245-6100  
Fax: (+852) 2722-1369  
Product Contact  
Web Site  
Technical Support  
Sales Contact  
www.atmel.com  
avr@atmel.com  
www.atmel.com/contacts  
Literature Requests  
www.atmel.com/literature  
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any  
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-  
TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY  
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR  
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-  
TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT  
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no  
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications  
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided  
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use  
as components in applications intended to support or sustain life.  
© 2012 Atmel Corporation. All rights reserved.  
Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms  
and product names may be trademarks of others.  
8126FS–AVR–05/12  

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