BM64SPKS1MC2_技术文档

BM62/64

Bluetooth^®4.2 Stereo Audio Module

• Packet loss concealment (PLC)

Features

• Supports Serial Copy Management System

(SCMS-T) content protection

• Qualified for Bluetooth v4.2 specifications

• Worldwide regulatory certifications are planned

• Supports HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2,

AVRCP 1.6

FIGURE 1:

BM62 MODULE

• Supports Bluetooth (BR/EDR/BLE) specifications

(FW dependent)

• Stand-alone module with on-board PCB antenna

and Bluetooth stack

• Supports high resolution up to 24-bit, 96 kHz

audio data format

• Supports to connect two hosts with HFP/A2DP

profiles simultaneously

• Transparent UART mode for seamless serial data

over UART interface

• Supports virtual UART cable transport between

host MCU and smartphone applications by Blue-

tooth SPP or BLE link

• Easy to configure with Windows^®GUI or directly

by external MCU

• Supports firmware field upgrade

• Supports 1 microphone

FIGURE 2:

BM64 MODULE

• Compact surface mount module:

- BM62: 29 x 15 x 2.5 mm

- BM64: 32 x 15 x 2.5 mm

• Castellated surface mount pads for easy and

reliable host PCB mounting

• RoHS compliant

• Ideal for portable battery operated devices

• Internal battery regulator circuitry

RF/Analog

• Frequency spectrum: 2.402 GHz to 2.480 GHz

• Receive sensitivity: -90 dBm (2 Mbps EDR)

• Class 2 output power (+2 dBm typical) for BM62,

BM64 and Class 1 output power (+15 dBm typi-

cal) for BM64

Audio Codec

DSP Audio Processing

• SBC and optional AAC decoding

• Supports 64 kbps A-Law, -Law PCM format/

• 20-bit digital-to-analog (DAC) with 96 dB SNR

• 16-bit analog-to-digital (ADC) with 90 dB SNR

• Up to 24-bit, 96 kHz I²S digital audio

Continuous Variable Slope Delta (CVSD) Modula-

tion for SCO channel operation

• Supports 8/16 kHz noise suppression

• Supports 8/16 kHz echo cancellation

• SBC and optional AAC decoding

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DS60001403A - Page 1

BM62/64

Peripherals

Description

• Built-in lithium-ion and lithium-polymer battery

charger (up to 350 mA)

The BM62/64 Stereo Audio module is a fully qualified

Bluetooth 4.2 dual-mode module for designers to add

wireless audio and voice applications to their products.

The BM62/64 module is a Bluetooth Special Interest

Group (SIG) certified module that provides a complete

wireless solution with Bluetooth stack, integrated PCB

antenna, and worldwide radio certifications in a

compact surface-mount package.

• Integrated 1.8V and 3V configurable switching

regulator and low-dropout (LDO)

• Built-in ADC for battery monitoring and voltage

sense

• Built-in ADC for charger thermal protection

• Built-in undervoltage protection (UVP)

• An AUX-In port for external audio input

• Two LED drivers

The BM62/64 module has several SKUs. The BM62 is

a Class 2 device and the BM64 is available in both

Class 1 and Class 2 versions.

• Multiple I/O pins for control and status

HCI Interface

• High-speed HCI-UART interface (supports up to

921,600 bps)

MAC/Baseband Processor

• Supports Bluetooth 4.2 dual mode (FW depen-

dent)

- BR/EDR transport for audio, voice, and SPP

data exchange

- BLE transport for proprietary transparent

service and ANCS data exchange

Operating Condition

• Operating voltage: 3.2V to 4.2V

• Operating temperature: -20°C to +70°C

Compliance

• Bluetooth SIG QDID: 83345 (BM62, BM64 Class

2) and 83336 (BM64 Class 1)

• Certifications planned for the United States

(FCC), Canada (IC), European Economic Area

(CE), Korea (KCC), Taiwan (NCC), Japan (JRF),

and China (SRRC)

Applications

• Soundbar and Subwoofer

• Bluetooth speaker

• Multi-speaker

DS60001403A - Page 2

 2016 Microchip Technology Inc.

BM62/64

Table of Content

1.0 Device Overview ...................................................................................................................................................... 5

2.0 Audio...................................................................................................................................................................... 15

3.0 Transceiver ............................................................................................................................................................ 19

4.0 Power Management Unit ....................................................................................................................................... 21

5.0 Application Information .......................................................................................................................................... 23

6.0 Printed Antenna Information .................................................................................................................................. 39

7.0 Physical Dimensions............................................................................................................................................... 43

8.0 Electrical Characteristics ........................................................................................................................................ 47

9.0 Soldering Recommendations................................................................................................................................. 55

10.0 Ordering Information............................................................................................................................................ 57

Appendix A: Certification Notices................................................................................................................................. 59

Appendix B: Revision History....................................................................................................................................... 65

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The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current

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 2016 Microchip Technology Inc.

DS60001403A - Page 3

BM62/64

NOTES:

DS60001403A - Page 4

 2016 Microchip Technology Inc.

BM62/64

BM62/64 module using the UI tool and DSP tool, a Win-

dows-based utility. Figure 1-1 illustrates a typical

example of the BM62 module which is connected to an

external audio amplifier and the MCU.

1.0

DEVICE OVERVIEW

The BM62 and BM64 Stereo Audio modules are built

around Microchip Technology IS2062 and IS2064

SoCs.

The IS2062/64 SoC integrates the Bluetooth 4.2 dual-

mode radio transceiver, Power Management Unit

(PMU), crystal and DSP. Users can configure the

FIGURE 1-1:

APPLICATION USING BM62 MODULE

Figure 1-2 illustrates a typical example of the Class 1

BM64 module which is connected to an external MCU

and a DSP/codec.

FIGURE 1-2:

APPLICATION USING BM64 MODULE

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DS60001403A - Page 5

BM62/64

Figure 1-3 and Figure 1-4 illustrate the BM64 module in

Soundbar or Subwoofer applications.

FIGURE 1-3:

SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64

FIGURE 1-4:

SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64, SMARTPHONE

Figure 1-5 illustrates the BM64 module in

multi-speaker application.

a

FIGURE 1-5:

MULTI-SPEAKER APPLICATION USING BM64

DS60001403A - Page 6

 2016 Microchip Technology Inc.

BM62/64

Table 1-1 provides the key features of the BM62/64

module.

TABLE 1-1:

Feature

BM62/64 KEY FEATURES

BM62 CLASS2

BM64 CLASS2

BM64 CLASS1

Application

Stereo/mono

Pin count

Headset/Speaker

Multi-speaker/Soundbar/Subwoofer

Stereo

37

Stereo

43

Dimensions (mm²)

15 x 29

Yes

2 dBm

2 Channel

-98

15 x 32

Yes

15 dBm

2 Channel

-98

PCB antenna

Yes

Tx power (typical)

Audio DAC output

DAC (single-ended) SNR at 2.8V (dB)

DAC (capless) SNR at 2.8V (dB)

ADC SNR at 2.8V (dB)

I²S digital interface

Analog AUX-In

2 dBm

2 Channel

-98

-92

No

Yes

1

Yes

1

Yes

Mono MIC

1

External audio amplifier interface

UART

Yes

2

Yes

2

Yes

LED driver

2

Internal DC-DC Step-down regulator

DC 5V adapter input

Battery charger (350 mA max.)

ADC for thermal charger protection

Undervoltage protection (UVP)

GPIO

Yes

10

Yes

12

Yes

12

Button support

6

NFC (triggered by external NFC)

EEPROM

Yes

Store in EEPROM

Yes

Customized voice prompt

Multi-tone

Yes

DSP sound effect

Bluetooth profiles

HFP

Yes

1.6

1.3

1.2

1.6

1.3

1.2

1.6

1.3

1.2

AVRCP

A2DP

HSP

SPP

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DS60001403A - Page 7

BM62/64

Figure 1-6 illustrates the pin diagram of the BM62

module.

FIGURE 1-6:

BM62 PIN DIAGRAM

DS60001403A - Page 8

 2016 Microchip Technology Inc.

BM62/64

Table 1-2 provides the pin description of the BM62

module.

TABLE 1-2:

Pin No

BM62 PIN DESCRIPTION

Pin Type

Pin Name

Description

1

I/O

P0_0

Configurable control or indication pin

(internally pulled-up if configured as an input)

• Slide switch detector

• UART TX_IND

2

I

EAN

External address-bus negative

System configuration pin along with the P2_0 and

P2_4 pins, used to set the module in any one of the fol-

lowing three modes:

• Application mode (for normal operation)

• Test mode (to change EEPROM values)

• Write Flash mode (to enter a new firmware into the

module), refer to Table 5-1

ROM: Must be pulled high to VDD_IO

Flash: Must be pulled down with 4.7 kOhm to GND

3

4

I/O

P3_0

P2_0

Configurable control or indication pin

(Internally pulled-up, if configured as an input)

AUX-In detector

System configuration pin along with P2_4 and EAN

pins, used to set the module in any one of the following

three modes:

• Application mode (for normal operation)

• Test mode (to change EEPROM values),

• Write Flash mode (to enter a new firmware into the

module), refer toTable 5-1

5

6

I/O

P1_5

P0_4

Configurable control or indication pin

(Internally pulled-up, if configured as an input)

• NFC detection pin

• Out_Ind_1

• Slide switch detector

Configurable control or indication pin

(Internally pulled-up, if configured as an input)

• NFC detection pin

• Out_Ind_1

7

8

O

P

SPKR

AOHPM

SPKL

Analog headphone output, right channel

Headphone common mode output/sense input

Analog headphone output, left channel

9

10

VDDA

Analog reference voltage. Do not connect, for internal

use only

11

12

13

14

15

16

17

I

MIC1_P

MIC1_N

MIC1_BIAS

AIR

MIC1 mono differential analog positive input

MIC1 mono differential analog negative input

Electric microphone biasing voltage

Right-channel, single-ended analog input

Left-channel, single-ended analog input

System Reset (active-low)

P

I

AIL

I

RST_N

NC

-

No connection

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DS60001403A - Page 9

BM62/64

TABLE 1-2:

Pin No

BM62 PIN DESCRIPTION (CONTINUED)

Pin Type

Pin Name

Description

18

I/O

P0_1

Configurable control or indication pin

(Internally pulled-up, if configured as an input)

FWD key

19

P

VDD_IO

I/O positive supply. Do not connect. For internal use

only

20

21

22

23

24

25

P

ADAP_IN

BAT_IN

5V power adaptor input

Battery input, voltage range: 3.2V to 4.2V

Analog input for ambient temperature detection

Ground reference

AMB_DET

GND

SYS_PWR

BK_OUT

System power output

1.8V buck output. Do not connect to other devices. For

internal use only,

26

27

28

29

I

MFB

LED1

LED2

P2_4

Multi-function button

LED Driver 1

I

LED Driver 2

I/O

System configuration pin along with P2_0 and EAN

pins, used to set the module in any one of the following

three modes:

• Application mode (for normal operation)

• Test mode (to change EEPROM values)

• Write Flash mode (to enter the new firmware into

the module), refer to Table 5-1

30

31

I/O

P0_2

P0_3

Configurable control or indication pin

(Internally pulled-up if configured as an input)

Play/Pause key as the default setting

Configurable control or indication pin

(Internally pulled-up if configured as an input)

• REV key

• Buzzer signal output

• Out_Ind_2

32

33

I/O

HCI_TXD

HCI_RXD

HCI UART data output

Configurable control or indication pin

(Internally pulled-up if configured as an input)

Volume-down key (default)

34

I/O

P0_5

Configurable control or indication pin

(Internally pulled-up if configured as an input)

Volume-up key (default)

35

I/O

P2_7

36

37

38

39

-

P

-

NC

GND

NC

No connection

Ground reference

No connection

-

NC

40

-

NC

Legend:

I= Input pin

O= Output pin

I/O= Input/Output pin

P= Power pin

Note:

These pins can be configured using the UI tool, a Windows utility.

DS60001403A - Page 10

 2016 Microchip Technology Inc.

BM62/64

Figure 1-7 illustrates the pin diagram of the BM64

module.

FIGURE 1-7:

BM64 PIN DIAGRAM

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DS60001403A - Page 11

BM62/64

Table 1-3 provides the BM64 pin descriptions.

TABLE 1-3:

Pin No

BM64 PIN DESCRIPTION

Pin Type

Name

Description

I²S interface: Digital left/right data

I²S interface: Left/right cock

1

2

I

I/O

O

I

DR0

RFS0

3

SCLK0

DT0

I²S interface: Bit clock

4

I²S interface: Digital left/right data

Headphone output, right channel

Headphone common mode output/sense input

Headphone output, left channel

MIC1 mono differential analog negative input

MIC1 mono differential analog positive input

Electric microphone biasing voltage

Right-channel single-ended analog input

Left-channel single-ended analog input

System Reset (active-low)

5

AOHPR

AOHPM

AOHPL

MIC_N1

MIC_P1

MIC_BIAS

AIR

6

7

8

9

I

10

11

12

13

14

15

16

P

I

AIL

I

RST_N

GND

P

Ground reference

I/O

P1_2

EEPROM clock SCL

P1_3

EEPROM data SDA

Configurable control or indication pin

17

I/O

P0_4

(Internally pulled-up if configured as an input)

NFC detection pin, active-low, Out_Ind_1

Configurable control or indication pin

(Internally pulled-up if configured as an input)

18

I/O

P1_5

• NFC detection pin

• SLIDE SWITCH detector, active-high

• Out_Ind_1.

• Multi-SPK Master/Slave mode control (FW dependent)

HCI-UART data input

19

20

21

22

23

24

25

26

I

HCI_RXD

HCI_TXD

VDD_IO

BAT_IN

O

P

I

HCI-UART data output

I/O positive supply. Do not connect, for internal use only

Battery input. Voltage range: 3.2V to 4.2V

5V power adaptor input

ADAP_IN

SYS_PWR System power output

AMB_DET Analog input for ambient temperature detection

MFB

Multi-function button and power-on key

UART RX_IND, active high

27

28

I

LED2

LED1

LED driver 2

LED Ddiver 1

Configurable control or indication pin

(Internally pulled-up if configured as an input)

UART TX_IND, active-low

29

I/O

P3_7

30

I/O

P3_5

Configurable control or indication pin

(Internally pulled-up if configured as an input)

Slide switch detector, active-high

Configurable control or indication pin

31

I/O

P0_0

(Internally pulled-up if configured as an input)

Slide switch detector, active-high, Out_Ind_0

DS60001403A - Page 12

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BM62/64

TABLE 1-3:

Pin No

32

BM64 PIN DESCRIPTION (CONTINUED)

Pin Type

Name

Description

I

EAN

External address-bus negative

System configuration pin along with the P2_0 pin used to set

the module in any one of these modes:

• Application mode (for normal operation)

• Test mode (to change EEPROM values)

• Write Flash mode (to enter new firmware into the module)

refer to Table 5-1

ROM: Must be pulled high to VDD_IO

Flash: must be pulled down with 4.7 kOhm to GND

33

34

I/O

DM

DP

Differential data-minus USB

Differential data-plus USB

Configurable control or indication pin

(Internally pulled-up if configured as an input)

Volume-down key (default)

35

36

37

38

39

I/O

P0_5

P3_0

P3_1

P3_3

P3_6

Configurable control or indication pin

(Internally pulled-up if configured as an input)

AUX-In Detector

Configurable control or indication pin

(Internally pulled-up if configured as an input)

REV key (default), active low

Configurable control or indication pin

(Internally pulled-up if configured as an input)

FWD key, active-low

Configurable control or indication pin

(Internally pulled-up if configured as an input)

Multi-SPK Master/Slave mode control, FW dependent

Configurable control or indication pin

(Internally pulled-up if configured as an input)

Play/Pause key as the default setting

40

41

I/O

P0_2

P2_0

System configuration pin along with EAN pin, used to set the

module in any one of the following modes:

• Application mode (for normal operation)

• Test mode (to change EEPROM values)

• Write Flash mode (to enter the new firmware into the

module), refer to Table 5-1

Configurable control or indication pin

(Internally pulled-up if configured as an input)

Volume-up key (default)

42

I/O

P

P2_7

GND

43

Ground reference

Legend:

I= Input pin

O= Output pin

I/O= Input/Output pin

P= Power pin

Note:

These pins can be configured by using the UI tool, a Windows utility.

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DS60001403A - Page 13

BM62/64

NOTES:

DS60001403A - Page 14

 2016 Microchip Technology Inc.

BM62/64

and help echo cancellation, an outgoing signal level to

the speaker will exceed the threshold (and therefore

likely to create echo). This may result in suppression of

the signal. Adaptive filtering is also applied to track the

echo path impulse in response to provide echo free and

full-duplex user experience. The embedded noise

reduction algorithm helps to extract clean speech sig-

nals from the noisy inputs captured by microphones

and improves mutual understanding in communication.

Advanced audio features, such as multi-band dynamic

range control, parametric multi-band equalizer, audio

widening and virtual bass are in-built. The audio effect

algorithms are to improve the user’s audio listening

experience in terms of better quality after audio signal

processing.

2.0

AUDIO

The input and output audios have different stages and

each stage can be programmed to vary the gain

response characteristics. For microphone, both sin-

gle-ended inputs and differential inputs are supported.

To maintain a high quality signal, a stable bias voltage

source to the condenser microphone’s FET is provided.

DC blocking capacitors can be used at both positive

and negative sides of a input. Internally, this analog sig-

nal is converted to 16-bit, 8 kHz linear PCM data.

2.1

Digital Signal Processor

A Digital Signal Processor (DSP) is used to perform

speech and audio processing. The advanced speech

features, such as acoustic echo cancellation and noise

reduction are in-built. To reduce nonlinear distortion

Figure 2-1 and Figure 2-2 illustrate the processing flow

of speaker-phone applications for speech and audio

signal processing.

FIGURE 2-1:

SPEECH PROCESSING

FIGURE 2-2:

AUDIO PROCESSING

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DS60001403A - Page 15

BM62/64

The DSP parameters can be configured using the DSP

tool. For additional information, refer to the “IS206X

DSP Application Note”.

2.2

Codec

The built-in codec has a high signal-to-noise ratio

(SNR) performance. This built-in codec consist of an

analog-to-digital converter (ADC), a digital-to-analog

converter (DAC) and an additional analog circuitry.

Figure 2-3 through Figure 2-6 illustrate the dynamic

range and frequency response of the codec.

Note:

The DSP tool is a windows-based config-

uration tool, which is available for down-

load from the Microchip web site at:

www.microchip.com/BM62 and

www.microchip.com/BM64.

FIGURE 2-3:

CODEC DAC DYNAMIC RANGE

Note:

The data corresponds to 16 ohm load with 2.8V operating voltage at 25°C room temperature.

FIGURE 2-4:

CODEC DAC THD+N VERSUS INPUT POWER

Note:

The data corresponds to 16 ohm load with 2.8V operating voltage at 25°C room temperature.

DS60001403A - Page 16

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BM62/64

FIGURE 2-5:

CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE)

FIGURE 2-6:

CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE)

Note:

The frequency response corresponds to Single-Ended mode with a 47 uF DC block capacitor.

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DS60001403A - Page 17

BM62/64

2.4

Analog Speaker Output

2.3

Auxiliary Port

The BM62/64 module supports the following speaker

output modes:

The BM62/64 module supports one analog (line-in) sig-

nal from external audio source. The analog (line-in) sig-

nal can be processed by the DSP to generate different

sound effects (Multi-band dynamic range compression

and audio widening), which can be set up by using the

DSP tool.

• Capless mode — Commended for headphone

applications in which capless output connection

helps to save the BOM cost by avoiding a large

DC blocking capacitor. Figure 2-7 illustrates the

analog speaker output capless mode.

• Single-ended mode — Used for driving an exter-

nal audio amplifier where a DC blocking capacitor

is required. Figure 2-8 illustrates the analog

speaker output single-ended mode.

FIGURE 2-7:

CAPLESS MODE

FIGURE 2-8:

SINGLE-ENDED MODE

DS60001403A - Page 18

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BM62/64

3.4

Modem

3.0

TRANSCEIVER

For Bluetooth 1.2 specification and below, 1 Mbps was

the standard data rate based on Gaussian Frequency

Shift Keying (GFSK) modulation scheme. This basic

rate modem meets Basic Data Rate (BDR) require-

ments of Bluetooth 2.0 with Enhanced Data Rate

(EDR) specification.

The BM62/64 module is designed and optimized for

Bluetooth 2.4 GHz system. It contains a complete radio

frequency transmitter/receiver section. An internal syn-

thesizer generates a stable clock for synchronizing with

another device.

For Bluetooth 2.0 and above specifications, EDR has

been introduced to provide data rates of 2 Mbps, 3

Mbps and 1 Mbps. For baseband, both BDR and EDR

utilize the same 1 MHz symbol rate and 1.6 kHz slot

rate. For BDR, symbol 1 represents 1-bit. However,

each symbol in the payload part of EDR packet rep-

resents 2/3 bits. This is achieved by using two different

modulations, π/4 DQPSK and 8 DPSK.

3.1

Transmitter

The internal power amplifier (PA) has a maximum out-

put power of +4 dBm. This is applied for Class 2 or

Class 3 radios without an external RF PA.

The transmitter performs IQ conversion to minimize the

frequency drift.

3.2

Receiver

3.5

Adaptive Frequency Hopping

(AFH)

The low-noise amplifier (LNA) operates with TR-com-

bined mode for single port application. It can save a pin

on package without having an external Tx/Rx switch.

The BM62/64 module has AFH function to avoid RF

interference. It has an algorithm to check the nearby

interference and to choose clear channel for

transceiver Bluetooth signal.

The ADC is used to sample the input analog signal and

convert it into digital signal for de-modulator analysis. A

channel filter has been integrated into receiver channel

before the ADC, which is used to reduce the external

component count and increase the anti-interference

capability. The image rejection filter is used to reject

image frequency for low-IF architecture. This filter for

low-IF architecture is intented to reduce external Band

Pass Filter (BPF) component for super heterodyne

architecture.

Received Signal Strength Indicator (RSSI) signal feed-

back to the processor is used to control the RF output

power to make a good trade-off for effective distance

and current consumption.

3.3

Synthesizer

A synthesizer generates a clock for radio transceiver

operation. There is a VCO inside, with a tunable inter-

nal LC tank that can reduce variation for components.

A crystal oscillator with internal digital trimming circuit

provides a stable clock for synthesizer.

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DS60001403A - Page 19

BM62/64

NOTES:

DS60001403A - Page 20

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BM62/64

4.1

Charging a Battery

4.0

POWER MANAGEMENT UNIT

The BM62/64 module has a built-in battery charger

which is optimized for lithium-ion and lithium-polymer

batteries.

The on-chip Power Management Unit (PMU) has two

main features: lithium-ion and lithium-polymer battery

charger, and voltage regulation. A power switch is used

to switch over the power source between the battery

and adaptor. Also, the PMU provides current to drive

two LEDs.

The charger includes a current sensor for charging

control, user programmable current regulation, and

high accuracy voltage regulation. The charging current

parameters are configured by the UI tool. Reviving,

pre-charging, constant current and constant voltage

modes, and re-charging functions are included. The

maximum charging current is 350 mA. Figure 4-1 illus-

trates the charging curve of a battery.

FIGURE 4-1:

CHARGING CURVE

4.2

Voltage Monitoring

4.3

LED Driver

A 10-bit, successive approximation ADC (SAR ADC)

provides a dedicated channel for voltage level detec-

tion. The warning level can be programmed by using

the UI tool. The ADC provides a granular resolution to

enable the MCU to take control over the charging pro-

cess.

Two dedicated LED drivers control the LEDs.They pro-

vide enough sink current (16 step control and 0.35 mA

for each step), thus LEDs can be connected directly

with the BM62/64 module. LED settings can be config-

ured using the UI tool. Figure 4-2 illustrates the LED

drivers in the BM62/64 module.

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BM62/64

FIGURE 4-2:

LED DRIVER

4.5

Ambient Detection

4.4

Under Voltage Protection

When the SYS_PWR voltage is less than 2.9V, the sys-

tem will shutdown.

The BM62/64 module has a built-in ADC for charger

thermal protection. Figure 4-3 illustrates the suggested

circuit and thermistor, Murata NCP15WF104F. The

charger thermal protection can avoid battery charge in

restricted temperature range. The upper and lower

limits for temperature values can be configured using

the UI tool.

FIGURE 4-3:

AMBIENT DETECTION

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BM62/64

Refer to the “UART_CommandSet” document for a list

of functions the BM62/64 module supports, and how to

use the UI tool to configure UART and UART Com-

mand Set tool.

5.0

5.1

APPLICATION INFORMATION

Host MCU Interface

The BM62/64 module supports UART commands. The

UART commands enable an external MCU to control

the BM62/64 module. Figure 5-1 illustrates the UART

interface between the BM62/64 module and MCU.

Note:

The UART Command set tool (SPKCom-

mandSetTool v160.xx) is available for

download from the Microchip web site at:

www.microchip.com/BM62

www.microchip.com/BM64.

and

An external MCU can control the BM62/64 module over

the UART interface and wake-up the module with the

MFB pins, P0_0 (BM62) and P3_7 (BM64).

FIGURE 5-1:

HOST MCU INTERFACE OVER UART

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BM62/64

FIGURE 5-3:

RX TIMING SEQUENCE (POWER- ON STATE)

FIGURE 5-4:

TIMING SEQUENCE (POWER OFF STATE)

Note 1: EEPROM clock = 100 kHz.

2: For a byte write: 0.01 ms x 32 clock x 2 = 640 μs.

3: It is recommended to have ramp-down time more than 640 μs during power-off sequence

to ensure safe operation of the device.

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BM62/64

FIGURE 5-5:

TIMING SEQUENCE OF POWER ON (NACK)

FIGURE 5-6:

RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU

Note:

When MCU sends the UART command and the BM62/64 module does not respond, the MCU

resends the UART command. If the BM62/64 module does not respond within 5 secs, the MCU will

force the system to Reset.

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BM62/64

FIGURE 5-7:

TIMING SEQUENCE OF POWER DROP PROTECTION

Note 1: It is recommended to use battery to provide the power supply at BAT_IN in to the module.

2: If an external power source or a power adapter is utilized to provide power to the module (ADAP_IN), it

is recommended to use a voltage supervisor IC.

3: The Reset IC output pin, RST_N, must be “Open drain” with delay time ≦ 10 ms and recommended part

is G691L293T73

.

Figure 5-8 and Figure 5-9 illustrate the I²S signal con-

nection between the BM64 module and an external

DSP. Use the DSP tool to configure the BM64 module

as a Master/Slave.

2

5.2

I S Mode Application

The BM64 module provides an I²S digital audio output

interface to connect with the external codec/DSP. It

provides 8, 16, 44.1, 48, 88.2, and 96 kHz sampling

rate for 16-bit and 24-bit data formats. The I²S setting

can be configured by using the UI and DSP tools.

For additional information on timing specifications,

refer to 8.2“Timing specifications”.

FIGURE 5-8:

BM64 in I²S Master Mode

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BM62/64

FIGURE 5-9:

SLAVE MODE REFERENCE CONNECTION

Note:

The UI and DSP tools can be down-

loaded from the Microchip web site:

www.microchip.com/BM62

www.microchip.com/BM64.

and

5.3

Reset

The BM62/64 module provides a watchdog timer

(WDT) to Reset the chip. It has an integrated Power-on

Reset (POR) circuit that resets all circuits to a known

Power-on state. This action can also be driven by an

external Reset signal which is used to control the

device externally by forcing it into a POR state. The

RST_N signal input is active-low and no connection is

required in most applications.

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BM62/64

5.4

External Configuration and

Programming

The BM62/64 module can be configured using an

external configuration tool (EEPROM tool) and firm-

ware is programmed using a programming tool (Flash

tool).

Note:

The EEPROM tool and Flash tool are

available for download from the Microchip

web site at: www.microchip.com/BM62

and www.microchip.com/BM64.

Figure 5-10 illustrates the configuration and firmware

programming interface on the BM62 module. It is

recommended to include a header pin on the main PCB

for development.

FIGURE 5-10:

EXTERNAL PROGRAMMING HEADER CONNECTIONS

Configuration and firmware programming modes are

entered according to the system configuration I/O pins.

Table 5-1 provides the system configuration settings.

The P2_0, P2_4 and EAN pins have internal pull up.

TABLE 5-1:

P2_0

SYSTEM CONFIGURATION SETTINGS

P2_4

EAN

Operating Mode

High

Low

High

Low

Low (Flash), High (ROM)

High

APP mode (Normal operation)

Test mode (Write EEPROM)

Write Flash (BM62 only)

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BM62/64

FIGURE 5-13:

BM62 REFERENCE CIRCUIT FOR STEREO HEADSET

Note:

The section “NFC (Optional)” contains built-in rectifier circuit of NXP 203F NFC type.

DS60001403A - Page 32

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BM62/64

FIGURE 5-14:

BM62 REFERENCE CIRCUIT FOR STEREO HEADSET

Note:

All ESD diodes in the schematics are reserved for testing.

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BM62/64

FIGURE 5-17:

BM64 REFERENCE CIRCUIT FOR STEREO HEADSET

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BM62/64

FIGURE 5-18:

BM64 REFERENCE CIRCUIT FOR STEREO HEADSET

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BM62/64

NOTES:

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BM62/64

Figure 6-2 illustrates the radiation pattern of the PCB

printed antenna.

6.0

6.1

PRINTED ANTENNA

INFORMATION

Antenna RadiationPattern

The BM62/64 module has one PCB printed antenna, see

Figure 6-1.

FIGURE 6-1:

KEEP OUT AREA RECOMMENDED FOR ANTENNA

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BM62/64

FIGURE 6-2:

ANTENNA 3D RADIATION PATTERN AT 2441 MHZ

TABLE 6-1:

Parameter

BM62/64 ANTENNA

CHARACTERISTICS

Values

Frequency

Peak Gain

Efficiency

2400 MHz ~ 2480 MHz

1.927 dBi

73.41%

6.2

Module Placement Guidelines

For a Bluetooth product, the antenna placement

affects the performance of the whole system. The antenna

requires free space to radiate RF signals and it cannot be

surrounded by the ground plane. Microchip recommends

that the areas underneath the antenna on the host PCB

must not contain copper on top, inner, or bottom layer as

illustrated in Figure 6-1.

A low-impedance ground plane will ensure the best radio

performance (best range, lowest noise). The ground

plane can be extended beyond the minimum recommen-

dation, as required for the main PCB EMC noise reduc-

tion. For the best range performance, keep all external

metal at least 15 mm away from the on-board PCB trace

antenna.

Figure 6-3 and Figure 6-4 illustrate examples of good

and poor placement of the BM62/64 module on a host

board with GND plane.

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 2016 Microchip Technology Inc.

BM62/64

FIGURE 6-3:

MODULE PLACEMENT GUIDELINES

FIGURE 6-4:

GND PLANE ON MAIN APPLICATION BOARD

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BM62/64

NOTES:

DS60001403A - Page 42

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BM62/64

7.0

PHYSICAL DIMENSIONS

Figure 7-1 illustrates the BM62 module PCB dimension

and Figure 7-2 illustrates the BM64 module PCB

dimension.

FIGURE 7-1:

BM62 PCB DIMENSION

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BM62/64

FIGURE 7-2:

BM64 PCB DIMENSION

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 2016 Microchip Technology Inc.

BM62/64

Figure 7-3 illustrates the recommended PCB footprint

for the BM62 module, and Figure 7-4 illustrates the rec-

ommended PCB footprint.for the BM64 module.

FIGURE 7-3:

RECOMMENDED BM62 PCB FOOTPRINT

Note 1: The “Keep Out Area” is reserved to keep the RF test point away from GND plane.

2: "All Metal Keep Out" is to isolate the PCB antenna.

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BM62/64

FIGURE 7-4:

RECOMMENDED BM64 PCB FOOTPRINT

Note 1: The “Keep Out Area” is reserved to keep the RF test point away from GND plane.

2: "All Metal Keep Out" is to isolate the PCB antenna.

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BM62/64

8.0

ELECTRICAL CHARACTERISTICS

This section provides an overview of the BM62/64 stereo audio module electrical characteristics. Additional

information will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the BM62/64 devices are listed below. Exposure to these maximum rating conditions for

extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above

the parameters indicated in the operation listings of this specification, is not implied.

8.1

Absolute Maximum Ratings

Ambient temperature under bias...............................................................................................................-20°C to +70°C

Voltage on VDD with respect to VSS ........................................................................................................ -0.3V to +3.6V

Maximum output current sink by any I/O pin..........................................................................................................12 mA

Maximum output current sourced by any I/O pin....................................................................................................12 mA

Note:

Stresses listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This

is a stress rating only. The functional operation of the device at those or any other conditions and those

indicated in the operation listings of this specification, is not implied. Exposure to maximum rating condi-

tions for extended periods may affect device reliability.

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BM62/64

TABLE 8-1:

Symbol

RECOMMENDED OPERATING CONDITION

Parameter

Input voltage for battery

Min

Typical

Max

Unit

BAT_IN

3.2

4.5

-20

3.8

5

4.2

5.5

V

ADAP_IN

T_OPERATION

Input voltage for adaptor

Operation temperature

+25

+70

ºC

Note 1: Absolute and Recommended operating condition tables reflect typical usage for device.

TABLE 8-2:

I/O AND RESET LEVEL

Parameter

Min

Typical

Max

Unit

I/O supply voltage (VDD_IO)

I/O voltage levels

3.0

3.3

3.6

V

VIL input logic levels low

VIH input logic levels high

VOL output logic levels low

VOH output logic levels high

RST_N

0

—

0.8

3.6

0.4

—

V

2.0

—

2.4

Threshold voltage

—

1.6

—

V

Note 1: These parameters are characterized but not tested in manufacturing.

TABLE 8-3:

BATTERY CHARGER

Parameter

Min

Typical

Max

Unit

ADAP_IN Input Voltage

4.5

—

5.0

3

5.5

4.5

—

V

Supply current to charger only

mA

—

350

Maximum Battery

Fast Charge Current

Headroom > 0.7V

(ADAP_IN = 5V)

—

175 (Note 2)

—

mA

Headroom = 0.3V~0.7V

(ADAP_IN = 4.5V)

—

3

—

V

Trickle Charge Voltage Threshold

10

%

Battery Charge Termination Current,

(% of Fast Charge Current)

Note 1: Headroom = VADAP_IN – VBAT

2: When VADAP_IN – VBAT > 2V, the maximum fast charge current is 175 mA for thermal protection.

3: These parameters are characterized but not tested in manufacturing.

TABLE 8-4:

LED DRIVER

Parameter

Min

Typical

Max

Unit

Open-drain Voltage

—

0

—

3.6

5.25

—

V

Programmable Current Range

Intensity Control

mA

step

mA

μA

—

16

Current Step

0.35

—

Power Down Open-drain Current

Shutdown Current

1

—

1

μA

Note 1: Test condition: BK_O = 1.8V with temperature +25 ºC.

2: These parameters are characterized but not tested in manufacturing.

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BM62/64

TABLE 8-5:

AUDIO CODEC ANALOG TO DIGITAL CONVERTER

T = 25 ^oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz

Parameter (Condition)

Min

Typical

Max

Unit

Resolution

—

8

—

92

16

48

—

Bit

kHz

dB

Output Sample Rate

—

Signal to Noise Ratio (Note 1)

(SNR at MIC or Line-in mode)

Digital Gain

-54

—

2~6

20

4.85

—

dB

Digital Gain Resolution

MIC Boost Gain

—

dB

Analog Gain

—

60

dB

Analog Gain Resolution

2.0

4

dB

Input full-scale at maximum gain (differential)

Input full-scale at minimum gain (differential)

3dB bandwidth

—

mV/rms

kHz

800

20

Microphone mode (input impedance)

THD+N (microphone input) at 30 mV/rms input

24

kOhm

%

0.02

Note 1: f_in= 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 1%, 150 mV_ppinput.

2: These parameters are characterized but not tested in manufacturing.

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BM62/64

TABLE 8-6:

AUDIO CODEC DIGITAL TO ANALOG CONVERTER

T = 25 ^oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz

Parameter (Condition)

Min

Typical

Max

Unit

Over-sampling rate

Resolution

—

16

8

128

—

20

48

—

f_s

Bit

Output Sample Rate

—

kHz

dB

—

98

Signal to Noise Ratio (Note 1)

(SNR at capless mode) for 48 kHz

—

98

—

dB

Signal to Noise Ratio (Note 1)

(SNR at single-ended mode) for 48 kHz

Digital Gain

-54

—

2~6

—

4.85

—

dB

Digital Gain Resolution

Analog Gain

-28

—

3

dB

Analog Gain Resolution

1

—

dB

Output Voltage Full-scale Swing (AVDD = 2.8V)

Maximum Output Power (16 Ohm load)

Maximum Output Power (32 Ohm load)

Allowed Load

495

—

742.5

34.5

17.2

16

—

mV/rms

mW

Ohm

pF

—

Resistive

—

O.C.

500

Capacitive

—

THD+N (16 Ohm load) (Note 2)

—

0.05

98

—

%

Signal to Noise Ratio (SNR at 16 Ohm load) (Note 1)

dB

Note 1: f_in= 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load = 100 kOhm

2: f_in= 1 kHz, B/W = 20~20 kHz, A-weighted, -1dBFS signal, Load=16 Ohm

3: f_in= 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.05%, 0dBFS signal, Load = 16 Ohm

4: These parameters are characterized but not tested in manufacturing.

TABLE 8-7:

TRANSMITTER SECTION FOR BDR AND EDR

Bluetooth

specification

Parameter

Min

Typical

Max

Unit

Maximum RF transmit

power

Class 1

Class 2

—

15.0⁽³⁾

—

< 20

dBm

—

-4

2⁽³⁾

—

1

-6 to 4

-4 to 1

dBm

dB

EDR/BDR Relative transmit power

-1.8

Note 1: The RF Tx power has modulation value.

2: The RF Transmit power is calibrated during production using the MP tool and MT8852 Bluetooth Test equip-

ment.

3: Test condition: VCC_RF = 1.28V, temperature +25 ºC.

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BM62/64

TABLE 8-8:

RECEIVER SECTION FOR BDR AND EDR

Bluetooth

specification

Modulation

Min

Typical

Max

Unit

Sensitivity at 0.1% BER

Sensitivity at 0.01% BER

GFSK

π/4 DQPSK

8DPSK

—

-89

-90

-83

—

≤-70

dBm

≤-70

Note 1: Test condition: VCC_RF = 1.28V with temperature +25 ºC.

2: These parameters are characterized but not tested in manufacturing.

TABLE 8-9:

SYSTEM CURRENT CONSUMPTION OF BM62

System Status

Typical⁽¹⁾

Max

Unit

System-Off mode

—

10

μA

Stop advertising (Samsung S5 (SM-G900I)/Android 4.4.2)

Stand-by mode

Link mode

0.57

0.5

—

mA

ESCO link

15.1

14.3

A2DP link

Stop advertising (iPhone 6/iOS 8.4)

Stand-by mode

Link mode

0.6

—

mA

SCO link

15.3

15.4

A2DP link

Note 1: The measurement data corresponds to Firmware v1.0.

2: Mode definition: Stand-by mode: Power-on without Bluetooth link; Link mode: With Bluetooth link in

low-power mode.

3: Current consumption values are considered with the BM62 validation board as test platform, BAT_IN =

3.8V. The distance between the smartphone and EVB is 30 cm, and the speaker is without loading.

.

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BM62/64

8.2

Timing specifications

Figure 8-1 and Figure 8-2 illustrate the clock and data

timing diagram of the BM62/64 module.

FIGURE 8-1:

TIMING DIAGRAM FOR I²S MODES (MASTER/SLAVE)

FIGURE 8-2:

TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE)

Note 1: f_s: 8 kHz,16 kHz, 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz and 96 kHz.

2: SCLK0: 64*f_s/256*f_s.

3: Word Length: 16-bit and 24-bit.

DS60001403A - Page 52

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BM62/64

Figure 8-3 illustrates the audio interface timing diagram

and Table 8-10 provides the audio interface timing

specifications.

FIGURE 8-3:

AUDIO INTERFACE TIMING DIAGRAM

TABLE 8-10: AUDIO INTERFACE TIMING SPECIFICATIONS

PARAMETER

SCLK0 duty ratio

SYMBOL

MIN

TYP

MAX

UNIT

d_SCLK

t_SCLKCY

t_SCLKCH

t_SCLKCL

t_RFSSU

t_RFSH

—

50

20

10

50

—

%

ns

SCLK0 cycle time

SCLK0 pulse width high

SCLK0 pulse width low

RFS0 set-up time to SCLK0 rising edge

RFS0 hold time from SCLK0 rising edge

DR0 hold time from SCLK0 rising edge

t_DH

Note:

Test Conditions: Slave Mode, f_s= 48 kHz, 24-bit data and SLK0 period = 256 f_s.

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BM62/64

NOTES:

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BM62/64

• Do not exceed peak temperature (T_P) of +250 ºC

• Refer to the solder paste data sheet for specific

reflow profile recommendations

9.0

SOLDERING

RECOMMENDATIONS

The BM62/64 module is assembled using a standard

lead-free reflow profile, IPC/JEDEC J-STD-020. The

BM62/64 module can be soldered to the main PCB

using a standard leaded and lead-free solder reflow

profiles.

• Use no-clean flux solder paste

• Do not wash, as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.

To avoid thedamage to the module, follow these recom-

mendations:

Figure 9-1 illustrates the reflow profile of the BM62/64

module.

• Refer to Microchip Technology Application Note

“AN233 Solder Reflow Recommendation”

(DS00233) for the soldering reflow recommenda-

tions

FIGURE 9-1:

REFLOW PROFILE

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BM62/64

NOTES:

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BM62/64

10.0 ORDERING INFORMATION

Table 10-1 provides the ordering information of the

BM62/64 module.

TABLE 10-1: BM62/64 MODULE ORDERING INFORMATION

Module

Microchip IC

Description

Shield

Part No.

BM62

IS2062GM Bluetooth 4.2 Stereo Audio module,

Class 2 with RF shield

Yes

BM62SPKS1MC2

BM62

BM64

IS2062GM Bluetooth 4.2 Stereo Audio module,

Class 2 without RF shield

No

Yes

No

BM62SPKA1MC2

BM64SPKS1MC2

BM64SPKA1MC2

BM64SPKS1MC1

BM64SPKA1MC1

IS2064GM Bluetooth 4.2 Stereo Audio module,

Class 2 with RF shield

IS2064GM Bluetooth 4.2 Stereo Audio module,

Class 2 without RF shield

IS2064GM Bluetooth 4.2 Stereo Audio module,

Class 1 with RF shield

Yes

No

IS2064GM Bluetooth 4.2 Stereo Audio module,

Class 1 without RF shield

Note: The BM62/64 module can be purchased through a Microchip representative.

Go to Microchip web site www.microchip.com for current pricing and a list of distributors for the product.

 2016 Microchip Technology Inc.

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BM62/64

NOTES:

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 2016 Microchip Technology Inc.

BM62/64

part B “Unintentional Radiators”), such as digital

devices, computer peripherals, radio receivers, etc.;

and to additional authorization requirements for the

non-transmitter functions on the transmitter module

(i.e., Verification, or Declaration of Conformity) (e.g.,

transmitter modules may also contain digital logic func-

tions) as appropriate.

APPENDIX A: CERTIFICATION

NOTICES

Note:

This device has not been authorized as

required by the rules of the Federal Com-

munications Commission. This device is

not, and may not be offered for sale or

lease, or sold or leased, until authorization

is obtained.

A.2.1

LABELING AND USER

INFORMATION REQUIREMENTS

The BM62/64 stereo audio module will cover

regulatory approval for following countries:

• United States; FCC ID: (In progress)

• Canada, IC ID: (In progress)

• Europe: (In progress)

The BM62/64 stereo audio module has been labeled

with its own FCC ID number, and if the FCC ID is not

visible when the module is installed inside another

device, then the outside of the finished product into

which the module is installed must also display a label

referring to the enclosed module. This exterior label can

use wording as follows:

• Japan: (In progress)

• Korea: (In progress)

Contains Transmitter Module FCC ID:

• Taiwan; NCC No: (In progress)

• China: CMIIT ID: (In progress)

or

Contains FCC ID:

A.1

REGULATORY APPROVAL

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

(1) this device may not cause harmful interference,

and (2) this device must accept any interference

received, including interference that may cause

undesired operation

This section outlines the regulatory information for the

BM62/64 stereo audio module for the following

countries:

• United States

• Canada

• Europe

• Japan

A user’s manual for the finished product must include

the following statement:

• Korea

• Taiwan

• China

This equipment has been tested and found to comply

with the limits for a Class B digital device, pursuant to

part 15 of the FCC Rules. These limits are designed

to provide reasonable protection against harmful

interference in a residential installation. This equip-

ment generates, uses and can radiate radio fre-

quency energy, and if not installed and used in

accordance with the instructions, may cause harmful

interference to radio communications. However,

there is no guarantee that interference will not occur

in a particular installation. If this equipment does

cause harmful interference to radio or television

reception, which can be determined by turning the

equipment off and on, the user is encouraged to try to

correct the interference by one or more of the follow-

ing measures:

• Other Regulatory Jurisdictions

A.2

United States

The BM62/64 stereo audio module has received Federal

Communications Commission (FCC) CFR47 Telecom-

munications, Part 15 Subpart C “Intentional Radiators”

modular approval in accordance with Part 15.212 Mod-

ular Transmitter approval. Modular approval allows the

user to integrate the BM62/64 module into a finished

product without obtaining subsequent and separate

FCC approvals for intentional radiation, provided no

changes or modifications are made to the module cir-

cuitry. Changes or modifications could void the user’s

authority to operate the equipment. The user must com-

ply with all of the instructions provided by the Grantee,

which indicate installation and/or operating conditions

necessary for compliance.

• Reorient or relocate the receiving antenna

• Increase the separation between the equipment

and receiver

• Connect the equipment into an outlet on a circuit

different from that to which the receiver is con-

nected

The finished product is required to comply with all appli-

cable FCC equipment authorizations regulations,

requirements and equipment functions not associated

with the transmitter module portion. For example, com-

pliance must be demonstrated to regulations for other

transmitter components within the host product; The

requirements for unintentional radiators (Part 15 Sub-

• Consult the dealer or an experienced radio/TV

technician for help

Additional information on labeling and user information

requirements for Part 15 devices can be found in KDB

Publication 784748 available at the FCC Office of Engi-

 2016 Microchip Technology Inc.

DS60001403A - Page 59

BM62/64

neering and Technology (OET) Laboratory Division

Knowledge Database (KDB)

http://apps.fcc.gov/oetcf/kdb/index.cfm

tus shall contain the following or equivalent notice in a

conspicuous location in the user manual or alterna-

tively on the device or both:

This device complies with Industry Canada

license-exempt RSS standard(s). Operation is sub-

ject to the following two conditions: (1) this device

may not cause interference, and (2) this device must

accept any interference, including interference that

may cause undesired operation of the device.

A.1.3

RF EXPOSURE

All transmitters regulated by FCC must comply with RF

exposure requirements. KDB 447498 General RF

Exposure Guidance provides guidance in determining

whether proposed or existing transmitting facilities,

operations or devices comply with limits for human

exposure to Radio Frequency (RF) fields adopted by

the Federal Communications Commission (FCC).

Le présent appareil est conforme aux CNR d'Indus-

trie Canada applicables aux appareils radio exempts

de licence. L'exploitation est autorisée aux deux con-

ditions suivantes: (1) l'appareil ne doit pas produire

de brouillage, et (2) l'utilisateur de l'appareil doit

accepter tout brouillage radioélectrique subi, même

si le brouillage est susceptible d'en compromettre le

fonctionnement.

From the FCC Grant: Output power listed is conducted.

This grant is valid only when the module is sold to OEM

integrators and must be installed by the OEM or OEM

integrators. This transmitter is restricted for use with

the specific antenna(s) tested in this application for

Certification and must not be co-located or operating in

conjunction with any other antenna or transmitters

within a host device, except in accordance with FCC

multi-transmitter product procedures.

Transmitter Antenna (from Section 8.3 RSS-Gen, Issue

4, November 2014): User manuals for transmitters

shall display the following notice in a conspicuous loca-

tion:

A.1.4

HELPFUL WEB SITES

Communications Commission

Under Industry Canada regulations, this radio trans-

mitter may only operate using an antenna of a type

and maximum (or lesser) gain approved for the trans-

mitter by Industry Canada. To reduce potential radio

interference to other users, the antenna type and its

gain must be so chosen that the equivalent isotropi-

cally radiated power (e.i.r.p.) is not more than that

necessary for successful communication.

Federal

http://www.fcc.gov

(FCC):

FCC Office of Engineering and Technology (OET) Lab-

oratory Division Knowledge Database (KDB):

http://apps.fcc.gov/oetcf/kdb/index.cfm

A.2

Canada

Conformément à la réglementation d'Industrie Can-

ada, le présent émetteur radio peut fonctionner avec

une antenne d'un type et d'un gain maximal (ou

inférieur) approuvé pour l'émetteur par Industrie Can-

ada. Dans le but de réduire les risques de brouillage

radioélectrique à l'intention des autres utilisateurs, il

faut choisir le type d'antenne et son gain de sorte que

la puissance isotrope rayonnée équivalente (p.i.r.e.)

ne dépasse pas l'intensité nécessaire à l'établisse-

ment d'une communication satisfaisante.

The BM62/64 stereo audio module has been certified

for use in Canada under Industry Canada (IC) Radio

Standards Procedure (RSP) RSP-100, Radio Stan-

dards Specification (RSS) RSS-Gen and RSS-247.

Modular approval permits the installation of a module in

a host device without the need to recertify the device.

A.2.1

LABELING AND USER

INFORMATION REQUIREMENTS

Labeling Requirements for the host device (from Sec-

tion 3.1, RSS-Gen, Issue 4, November 2014): The host

device shall be properly labeled to identify the module

within the host device.

The above notice may be affixed to the device instead

of displayed in the user manual.

A.2.2

RF EXPOSURE

The Industry Canada certification label of a module

shall be clearly visible at all times when installed in the

host device, otherwise the host device must be labeled

to display the Industry Canada certification number of

the module, preceded by the words “Contains transmit-

ter module”, or the word “Contains”, or similar wording

expressing the same meaning, as follows:

All transmitters regulated by IC must comply with RF

exposure requirements listed in RSS-102 - Radio Fre-

quency (RF) Exposure Compliance of Radio communi-

cation Apparatus (All Frequency Bands).

A.2.3

HELPFUL WEB SITES

Industry Canada: http://www.ic.gc.ca/

Contains transmitter module IC:

User Manual Notice for License-Exempt Radio Appara-

tus (from Section 8.4 RSS-Gen, Issue 4, November

2014): User manuals for license-exempt radio appara-

DS60001403A - Page 60

 2016 Microchip Technology Inc.

BM62/64

A.3.1

LABELING AND USER

INFORMATION REQUIREMENTS

A.3

Europe

The BM62/64 stereo audio module is an R&TTE Direc-

tive assessed radio module that is CE marked and has

been manufactured and tested with the intention of

being integrated into a final product.

The label on the final product which contains the

BM62/64 stereo audio module must follow CE marking

requirements. The R&TTE Compliance Association

Technical Guidance Note 01 provides guidance on final

product CE marking.

The BM62/64 stereo audio module has been tested to

R&TTE Directive 1999/5/EC Essential Requirements

for Health and Safety (Article (3.1(a)), Electro Magnetic

Compatibility (EMC) (Article 3.1(b)), and Radio (Article

3.2) and are summarized in TABLE A-1:“EUROPEAN

COMPLIANCE TESTING”. A notified body opinion has

also been issued.

A.3.2

ANTENNA REQUIREMENTS

From R&TTE Compliance Association document Tech-

nical Guidance Note 01:

Provided the integrator installing an assessed

radio module with an integral or specific antenna

and installed in conformance with the radio mod-

ule manufacturer's installation instructions

requires no further evaluation under Article 3.2

of the R&TTE Directive and does not require fur-

ther involvement of an R&TTE Directive Notified

Body for the final product. [Section 2.2.4]

The R&TTE Compliance Association provides guid-

ance on modular devices in document Technical Guid-

ance

Note

01

available

at

http://www.rtteca.com/html/download_area.htm

Note: To maintain conformance to the testing

listed in TABLE A-1:“EUROPEAN COM-

PLIANCE TESTING”, the module shall be

installed in accordance with the installa-

tion instructions in this data sheet and

shall not be modified.

The European Compliance Testing listed in TABLE

A-1:“EUROPEAN COMPLIANCE TESTING” was

performed using the PCB Trace antenna.

When integrating a radio module into a

completed

product

the

integrator

becomes the manufacturer of the final

product and is therefore responsible for

demonstrating compliance of the final

product with the essential requirements of

the R&TTE Directive.

TABLE A-1:

EUROPEAN COMPLIANCE TESTING

Standards

Report

Number

Certification

Article Laboratory

Date

Safety

Health

EMC

EN60950-1:2006/A11:2009+A1:2 [3.1(a)]

010+A12:2011+A2:2013

—

ETSI EN 300 328 V1.9.1

EN62479:2010

—

EN300 489-1 V1.9.2

EN301 489-17 V2.2.1

ETSI EN 300 328 V1.9.1

—

[3.1(b)]

Radio

(3.2)

—

Notified Body

nications Administrations (CEPT):

http://www.cept.org

A.3.3

HELPFUL WEBSITES

A document that can be used as a starting point in

understanding the use of Short Range Devices (SRD)

in Europe is the European Radio Communications

Committee (ERC) Recommendation 70-03 E, which

can be downloaded from the European Radio Commu-

nications Office (ERO) at: http://www.ero.dk/

• European Telecommunications Standards Insti-

tute (ETSI):

http://www.etsi.org

• European Radio Communications Office (ERO):

http://www.ero.dk

• The Radio and Telecommunications Terminal

Equipment Compliance Association (R&TTE CA):

http://www.rtteca.com/

Additional helpful web sites are:

• Radio and Telecommunications Terminal Equip-

ment (R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm

• European Conference of Postal and Telecommu-

 2016 Microchip Technology Inc.

DS60001403A - Page 61

BM62/64

uct does not require additional radio certification pro-

vided installation instructions are followed and no

modifications of the module are allowed.

A.4

Japan

The BM62/64 stereo audio module has received type

certification and is labeled with its own technical confor-

mity mark and certification number as required to con-

form to the technical standards regulated by the

Ministry of Internal Affairs and Communications (MIC)

of Japan pursuant to the Radio Act of Japan.

A.5.1

LABELING AND USER

INFORMATION REQUIREMENTS

The label on the final product which contains the

BM62/64 stereo audio module must follow KC marking

requirements. The integrator of the module must refer

to the labeling requirements for Korea available on the

Korea Communications Commission (KCC) website.

Integration of this module into a final product does not

require additional radio certification provided installa-

tion instructions are followed and no modifications of

the module are allowed. Additional testing may be

required:

The BM62/64 stereo audio module is labeled with its

own KC mark.

• If the host product is subject to electrical appli-

ance safety (for example, powered from an AC

mains), the host product may require Product

Safety Electrical Appliance and Material (PSE)

testing. The integrator must contact their confor-

mance laboratory to determine if this testing is

required.

The final product requires the KC mark and certificate

number of the module:

• There is an voluntary Electromagnetic Compatibil-

ity (EMC) test for the host product administered

by VCCI: http://www.vcci.jp/vcci_e/index.html

A.5.2

HELPFUL WEB SITES

Korea Communications Commission (KCC):

http://www.kcc.go.kr

A.4.1

LABELING AND USER

INFORMATION REQUIREMENTS

National Radio Research Agency (RRA):

http://rra.go.kr

The label on the final product which contains the

BM62/64 stereo audio module must follow Japan mark-

ing requirements. The integrator of the module must

refer to the labeling requirements for Japan available at

the Ministry of Internal Affairs and Communications

(MIC) website.

A.6

Taiwan

The BM62/64 stereo audio module has received com-

pliance approval in accordance with the Telecommuni-

cations Act. Customers seeking to use the compliance

approval in their product must contact Microchip Tech-

nology sales or distribution partners to obtain a Letter

of Authority.

The BM62/64 stereo audio module is labeled with its

own technical conformity mark and certification num-

ber. The final product in which this module is being

used must have a label referring to the type certified

module inside:

Integration of this module into a final product does not

require additional radio certification provided installa-

tion instructions are followed and no modifications of

the module are allowed.

A.6.1

LABELING AND USER

INFORMATION REQUIREMENTS

The BM62/64 stereo audio module is labeled with its

own NCC mark and certificate number as follows:

A.4.2

HELPFUL WEB SITES

Ministry of Internal Affairs and Communications (MIC):

http://www.tele.soumu.go.jp/e/index.htm

Association of Radio Industries and Businesses

(ARIB): http://www.arib.or.jp/english/

A.5

Korea

The user's manual must contain below warning (for RF

device) in traditional Chinese:

The BM62/64 stereo audio module has received certi-

fication of conformity in accordance with the Radio

Waves Act. Integration of this module into a final prod-

注意 !

依據低功率電波輻射性電機管理辦法

DS60001403A - Page 62

 2016 Microchip Technology Inc.

BM62/64

第十二條經型式認證合格之低功率射頻電機，非經許

可，

公司、商號或使用者均不得擅自變更頻率、加大功率或

變更原設計

之特性及功能。

第十四條低功率射頻電機之使用不得影響飛航安全及

干擾合法通信；

經發現有干擾現象時，應立即停用，並改善至無干擾時

方得繼續使用。

前項合法通信，指依電信規定作業之無線電信。

低功率射頻電機須忍受合法通信或工業、科學及醫療用

電波輻射性

電機設備之干擾。

A.6.2

HELPFUL WEB SITES

National Communications Commission (NCC):

http://www.ncc.gov.tw

A.7

China

The BM62/64 stereo audio module has received certi-

fication of conformity in accordance with the China MIIT

Notice 2014-01 of State Radio Regulation Committee

(SRRC) certification scheme. Integration of this module

into a final product does not require additional radio

certification, provided installation instructions are fol-

lowed and no modifications of the module are allowed.

A.7.1

LABELING AND USER

INFORMATION REQUIREMENTS

The BM62/64 stereo audio module is labeled with its

own CMIIT ID as follows:

When Host system is using an approved Full Modular

Approval (FMA) radio: The host must bear a label

containing the statement “This device contains SRRC

approved Radio module CMIIT ID XXXXXXXXXX”.

A.8

Other Regulatory Jurisdictions

Should other regulatory jurisdiction certification be

required by the customer, or the customer need to

recertify the module for other reasons, contact Micro-

chip for the required utilities and documentation.

 2016 Microchip Technology Inc.

DS60001403A - Page 63

BM62/64

NOTES:

DS60001403A - Page 64

 2016 Microchip Technology Inc.

BM62/64

APPENDIX B: REVISION HISTORY

Revision A (May 2016)

This is the initial released version of this document.

 2016 Microchip Technology Inc.

DS60001403A - Page 65

BM62/64

NOTES:

DS60001403A - Page 66

 2016 Microchip Technology Inc.

BM62/64

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

Customers

must

contact

their

distributor,

representative or Field Application Engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

Technical support is available through the web site

at: http://microchip.com/support

• Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the

registration instructions.

 2016 Microchip Technology Inc.

DS60001403A - Page 67

BM62/64

NOTES:

DS60001403A - Page 68

 2016 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate,

dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,

KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,

MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,

RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O

are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company,

ETHERSYNCH, Hyper Speed Control, HyperLight Load,

IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,

BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,

dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,

EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip

Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,

motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,

MPLINK, MultiTRAK, NetDetach, Omniscient Code

Generation, PICDEM, PICDEM.net, PICkit, PICtail,

PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,

Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total

Endurance, TSHARC, USBCheck, VariSense, ViewSpan,

WiperLock, Wireless DNA, and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

are for its PIC^®MCUs and dsPIC^®DSCs, KEE OQ^®code hopping

L

GestIC is a registered trademarks of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip

Technology Inc., in other countries.

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

All other trademarks mentioned herein are property of their

respective companies.

QUALITY MANAGEMENT SYSTEM

CERTIFIED BY DNV

ISBN: 978-1-5224-0576-4

== ISO/TS 16949 ==

 2016 Microchip Technology Inc.

DS60001403A - Page 69

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Asia Pacific Office

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

Hong Kong

Tel: 852-2943-5100

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Web Address:

www.microchip.com

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

Germany - Dusseldorf

Tel: 49-2129-3766400

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

China - Beijing

Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

Germany - Karlsruhe

Tel: 49-721-625370

India - Pune

Tel: 91-20-3019-1500

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Austin, TX

Tel: 512-257-3370

Japan - Osaka

Tel: 81-6-6152-7160

Fax: 81-6-6152-9310

Boston

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Japan - Tokyo

Tel: 81-3-6880- 3770

Fax: 81-3-6880-3771

China - Dongguan

Tel: 86-769-8702-9880

Italy - Venice

Tel: 39-049-7625286

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

China - Hangzhou

Tel: 86-571-8792-8115

Fax: 86-571-8792-8116

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

Cleveland

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

China - Hong Kong SAR

Tel: 852-2943-5100

Fax: 852-2401-3431

Poland - Warsaw

Tel: 48-22-3325737

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Sweden - Stockholm

Tel: 46-8-5090-4654

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Detroit

Novi, MI

UK - Wokingham

Tel: 44-118-921-5800

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Tel: 248-848-4000

Fax: 44-118-921-5820

Houston, TX

Tel: 281-894-5983

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

China - Shenzhen

Tel: 86-755-8864-2200

Fax: 86-755-8203-1760

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Kaohsiung

Tel: 886-7-213-7828

Taiwan - Taipei

Tel: 886-2-2508-8600

Fax: 886-2-2508-0102

New York, NY

Tel: 631-435-6000

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

San Jose, CA

Tel: 408-735-9110

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Canada - Toronto

Tel: 905-673-0699

Fax: 905-673-6509

07/14/15

DS60001403A - Page 70

 2016 Microchip Technology Inc.


型号：	BM64SPKS1MC2
厂家：	MICROCHIP
描述：	BluetoothÂ® 4.2 Stereo Audio Module
文件：	总70页 (文件大小：4444K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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