C1413NCUA [MICROCHIP]
3A High-Speed MOSFET Drivers; 3A高速MOSFET驱动器
| 型号： | C1413NCUA |
| 厂家： | 
MICROCHIP |
| 描述： | 3A High-Speed MOSFET Drivers |
| 文件： | 总16页 (文件大小：345K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1413/TC1413N
M
3A High-Speed MOSFET Drivers
Features
General Description
• Latch-Up Protected: Will Withstand 500 mA
The TC1413/TC1413N are 3A CMOS buffers/drivers.
They will not latch-up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
As MOSFET drivers, the TC1413/TC1413N can easily
charge an 1800 pF gate capacitance in 20 nsec with
matched rise and fall times, and provide low enough
impedance in both the ON and the OFF states to
ensure the MOSFET’s intended state will not be
affected, even by large transients. The leading and
trailing edge propagation delay times are also matched
to allow driving short-duration inputs with greater
accuracy.
Reverse Current
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected: 4 kV
• High Peak Output Current: 3A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 1800 pF in 20 nsec
• Short Delay Time: 35 nsec Typ
• Matched Delay Times
• Low Supply Current
-
-
With Logic ‘1’ Input: 500 µA
With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 2.7Ω
• Available in Space-Saving 8-pin MSOP Package
• Pinout Same as TC1410/TC1411/TC1412
Applications
• Switch Mode Power Supplies
• Line Drivers
• Pulse Transformer Drive
• Relay Driver
Package Type
8-Pin MSOP/PDIP/SOIC
VDD
VDD
1
8
7
VDD
IN 2
NC 3
1
8 VDD
7 OUT
6 OUT
5 GND
IN 2
NC 3
GND 4
OUT
6 OUT
5 GND
TC1413
TC1413N
GND 4
6,7
Non-Inverting
2
6,7
2
Inverting
NC = No Internal Connection
NOTE: Duplicate pins must be connected together
for proper operation.
2003 Microchip Technology Inc.
DS21392C-page 1
TC1413/TC1413N
Functional Block Diagram
V
DD
TC1413
Inverting
Outputs
300 mV
Output
Non-Inverting
Outputs
Input
TC1413N
Effective
Input C = 10 pF
4.7V
GND
DS21392C-page 2
2003 Microchip Technology Inc.
TC1413/TC1413N
1.0
ELECTRICAL
PIN FUNCTION TABLE
CHARACTERISTICS
Symbol
Description
V
Supply input, 4.5V to 16V
Control input
No connection
Ground
Ground
CMOS push-pull output,
common to pin 7
Absolute Maximum Ratings†
Supply Voltage .....................................................+20V
DD
INPUT
NC
GND
GND
OUTPUT
Input Voltage ......................V + 0.3V to GND – 5.0V
DD
Power Dissipation (T ≤ 70°C)
A
MSOP.......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Storage Temperature Range.............. -65°C to +150°C
Maximum Junction Temperature...................... +150ºC
OUTPUT
CMOS push-pull output,
common to pin 6
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
V
Supply input, 4.5V to 16V
DD
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ V ≤ 16V.
DD
Typical values are measured at T = +25°C, V = 16V.
A
DD
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
V
V
2.0
—
-1.0
-10
—
—
—
—
—
0.8
1.0
10
V
V
IH
IL
I
µA 0V ≤ V ≤ V
T = +25°C
DD, A
-40°C ≤ T ≤ +85°C
IN
IN
A
Output
High Output Voltage
Low Output Voltage
Output Resistance
V
V
R
V
– 0.025
—
—
—
—
—
—
—
0.025
4.0
5.0
5.0
—
V
V
Ω
DC Test
DC Test
OH
DD
OL
2.7
3.3
3.3
3.0
0.5
V
= 16V, I = 10 mA, T = +25°C
O
DD O A
0°C ≤ T ≤ +70°C
A
-40°C ≤ T ≤ +85°C
A
Peak Output Current
Latch-Up Protection
Withstand Reverse Current
I
—
—
A
A
V
= 16V
PK
DD
I
—
Duty cycle ≤ 2%, t ≤ 300 µsec,
REV
V
DD
= 16V
Switching Time (Note 1)
Rise Time
t
—
—
—
—
—
—
20
22
24
20
22
24
28
33
33
28
33
33
nsec T = +25°C
A
R
0°C ≤ T ≤ +70°C
A
-40°C ≤ T ≤ +85°C, Figure 4-1
A
Fall Time
t
nsec T = +25°C
F
A
0°C ≤ T ≤ +70°C
A
-40°C ≤ T ≤ +85°C, Figure 4-1
A
Note 1: Switching times ensured by design.
2003 Microchip Technology Inc.
DS21392C-page 3
TC1413/TC1413N
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ V ≤ 16V.
DD
Typical values are measured at T = +25°C, V = 16V.
A
DD
Parameters
Delay Time
Sym
Min
Typ
Max
Units
Conditions
t
—
—
—
—
—
—
35
40
40
35
40
40
45
50
50
45
50
50
nsec T = +25°C,
D1
D2
A
0°C ≤ T ≤ +70°C
-40°C ≤ T ≤ +85°C, Figure 4-1
A
A
Delay Time
t
nsec T = +25°C
A
0°C ≤ T ≤ +70°C
-40°C ≤ T ≤ +85°C, Figure 4-1
A
A
Power Supply
Power Supply Current
I
—
—
0.5
0.1
1.0
0.15
mA
V
V
= 3V, V = 16V
= 0V
S
IN
IN
DD
Note 1: Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ V ≤ 18V.
DD
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range (C)
Specified Temperature Range (E)
Maximum Junction Temperature
Storage Temperature Range
T
0
-40
—
—
—
—
—
+70
+85
+150
+150
ºC
ºC
ºC
ºC
A
T
A
T
J
T
-65
A
Package Thermal Resistances
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
θ
θ
θ
—
—
—
206
125
155
—
—
—
ºC/W
ºC/W
ºC/W
JA
JA
JA
DS21392C-page 4
2003 Microchip Technology Inc.
TC1413/TC1413N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V ≤ 16V.
DD
500
400
300
200
100
0
500
400
300
200
100
0
T
= +25°C
V
= 16V
A
SUPPLY
V
= 3V
IN
V
= 3V
IN
V
= 0V
IN
V
= 0V
IN
-40
-20
0
20
40
60
80
4
6
8
10
(V)
12
14
16
V
TEMPERATURE (°C)
DD
FIGURE 2-1:
Quiescent Supply Current
FIGURE 2-4:
Quiescent Supply Current
vs. Supply Voltage.
vs. Temperature.
1.6
1.6
V
= 16V
T
= +25°C
SUPPLY
A
1.5
1.4
1.3
1.5
1.4
1.3
1.2
1.1
V
IH
V
IH
1.2
1.1
V
V
IL
IL
4
6
8
10
(V)
12
14
16
-40
-20
0
20
40
60
80
V
TEMPERATURE (°C)
DD
FIGURE 2-2:
Input Threshold vs. Supply
FIGURE 2-5:
Input Threshold vs.
Voltage.
Temperature.
9
8
7
6
5
4
3
2
9
8
7
T
= +85°C
T
A
= +85°C
A
6
5
4
3
2
T
= +25°C
A
T
= +25°C
A
T
= -40°C
A
6
T
= -40°C
A
1
4
1
4
8
10
12
14
16
6
8
10
12
14
16
V
(V)
V
(V)
DD
DD
FIGURE 2-3:
High-State Output
FIGURE 2-6:
Low-State Output
Resistance vs. Supply Voltage
Resistance vs. Supply Voltage.
2003 Microchip Technology Inc.
DS21392C-page 5
TC1413/TC1413N
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ V ≤ 16V.
DD
70
60
50
40
30
20
10
70
60
50
40
30
20
10
C
= 1800 pF
C
= 1800 pF
LOAD
LOAD
T
= +85°C
A
T
= +85°C
A
T
= +25°C
A
T
= +25°C
A
T
= -40°C
A
T
= -40°C
A
4
6
8
10
(V)
12
14
16
4
6
8
10
12
14
16
V
V
(V)
DD
DD
FIGURE 2-7:
Rise Time vs. Supply
FIGURE 2-10:
Fall Time vs. Supply
Voltage.
Voltage.
100
110
100
90
C
= 1800 pF
C
= 1800 pF
LOAD
LOAD
90
80
T
= +85°C
A
80
T
= +85°C
70
60
50
40
30
20
A
70
T
= +25°C
T
= +25
°C
A
A
60
50
40
T
= -40°C
A
T
= -40°C
A
30
20
4
6
8
10
12
14
16
4
6
8
10
(V)
12
14
16
V
(V)
V
DD
DD
FIGURE 2-8:
Propagation Delay vs.
FIGURE 2-11:
Propagation Delay vs.
Supply Voltage.
Supply Voltage.
40
35
T
V
= +25°C
DD
T
V
= +25°C
A
DD
A
t
RISE
= 16V
= 16V
t
D2
34
33
32
31
30
29
28
30
20
10
0
t
FALL
t
D1
0
1000
2000
3000
(pF)
4000
5000
0
1000
2000
3000
(pF)
4000
5000
C
C
LOAD
LOAD
FIGURE 2-9:
Rise and Fall Times vs.
FIGURE 2-12:
Propagation Delays vs.
Capacitive Load.
Capacitive Load.
DS21392C-page 6
2003 Microchip Technology Inc.
TC1413/TC1413N
3.3
CMOS Push-Pull Output
3.0
PIN DESCRIPTIONS
(OUTPUT)
The descriptions of the pins are listed in Table 3-1.
The MOSFET driver output is a low-impedance, CMOS
push-pull style output, capable of driving a capacitive
load with 3A peak currents.
TABLE 3-1:
Pin
PIN FUNCTION TABLE
Description
Symbol
No.
3.4
Ground (GND)
1
2
3
4
5
6
V
Supply input, 4.5V to 16V
Control input
No connection
Ground
DD
The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
INPUT
NC
GND
GND
Ground
OUTPUT CMOS push-pull output,
3.5
No Connect (NC)
common to pin 7
No internal connection.
7
8
OUTPUT CMOS push-pull output,
common to pin 6
V
Supply input, 4.5V to 16V
DD
3.1
Supply Input (V
)
DD
The V input is the bias supply for the MOSFET driver
DD
and is rated for 4.5V to 16V with respect to the ground
pin. The V input should be bypassed to ground with
DD
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2
Control Input (INPUT)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input has 300 mV of
hysteresis between the high and low thresholds which
prevents output glitching even when the rise and fall
time of the input signal is very slow.
2003 Microchip Technology Inc.
DS21392C-page 7
TC1413/TC1413N
4.0
APPLICATION INFORMATION
+5V
90%
Input
VDD = 16V
10%
0V
VDD
tD1
tD2
tF
tR
0.1 µF
1.0 µF
90%
90%
1, 8
Output
0V
2
6, 7
10%
10%
Input
Output
CL = 1800 pF
Inverting Driver
TC1413
TC1413
TC1413N
+5V
90%
Input
4, 5
10%
0V
VDD
Input: 100 kHz,
square wave,
RISE = tFALL ≤ 10 nsec
90%
tD2
90%
tD1
tF
tR
Output
0V
t
10%
10%
Non-Inverting Driver
TC1413N
FIGURE 4-1:
Switching Time Test Circuit.
DS21392C-page 8
2003 Microchip Technology Inc.
TC1413/TC1413N
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
TC1413
CPA057
YYWW
0347
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
TC1413
COA0347
NNN
057
Example:
8-Lead MSOP
1413NE
XXXXXXX
YWWNNN
347057
Legend: XX...X Customer specific information*
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
2003 Microchip Technology Inc.
DS21392C-page 9
TC1413/TC1413N
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
Dimension Limits
INCHES*
NOM
MILLIMETERS
MIN
MAX
MIN
NOM
8
MAX
n
p
A
A2
A1
E
E1
D
L
c
B1
B
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
8
.100
.155
.130
2.54
3.94
3.30
.140
.170
.145
3.56
2.92
4.32
3.68
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21392C-page 10
2003 Microchip Technology Inc.
TC1413/TC1413N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
1
B
n
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
A
A2
A1
E
E1
D
Number of Pins
Pitch
Overall Height
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
h
L
φ
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2003 Microchip Technology Inc.
DS21392C-page 11
TC1413/TC1413N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
E
E1
p
D
2
B
n
1
A2
A
c
A1
(F)
L
Units
Dimension Limits
INC HE S
NOM
MILLIME TE R S *
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of P ins
P itch
8
.026 BS C
0.65 BS C
Overall Height
A
A2
A1
E
-
-
.043
-
-
0.85
-
1.10
Molded P ackage Thickness
S tandoff
.030
.000
.033
-
.037
.006
0.75
0.95
0.15
0.00
Overall Width
.193 BS C
4.90 BS C
Molded P ackage Width
Overall Length
E 1
D
.118 BS C
.118 BS C
3.00 BS C
3.00 BS C
Foot Length
L
.016
.024
.037 R E F
.031
0.40
0.60
0.95 R E F
0.80
Footprint (R eference)
Foot Angle
F
0˚
.003
.009
5˚
-
8˚
.009
.016
15˚
0˚
0.08
0.22
5˚
-
-
-
-
-
8˚
0.23
0.40
15˚
c
Lead Thickness
Lead Width
.006
B
.012
Mold Draft Angle Top
Mold Draft Angle B ottom
*C ontrolling P arameter
Notes:
-
-
5˚
15˚
5˚
15˚
Dimensions D and E 1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
J E DE C E quivalent: MO-187
Drawing No. C 04-111
DS21392C-page 12
2003 Microchip Technology Inc.
TC1413/TC1413N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) TC1413COA: 3A Single MOSFET driver,
Temperature Package
Range
SOIC package, 0°C to +70°C.
b) TC1413CPA: 3A Single MOSFET driver,
PDIP package, 0°C to +70°C.
Device:
TC1413: 3 A Single MOSFET Driver, Inverting
c) TC1413EUA713: Tape and Reel, 3A
Single MOSFET driver, MSOP package,
-40°C to +85°C.
TC1413N: 3 A Single MOSFET Driver, Non-Inverting
Temperature Range:
Package:
C
E
=
=
0°C to +70°C
-40°C to +85°C
a) TC1413NCPA: 3A Single MOSFET driver,
PDIP package, 0°C to +70°C.
OA
=
Plastic SOIC, (150 mil Body), 8-lead
b) TC1413NEPA: 3A Single MOSFET driver,
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
PDIP package, -40°C to +85°C.
c) TC1413NEUA: 3A Single MOSFET driver,
MSOP package, -40°C to +85°C.
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
* MSOP package is only available in E-Temp.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS21392C-page 13
TC1413/TC1413N
NOTES:
DS21392C-page 14
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Accuron, Application Maestro, dsPIC, dsPICDEM,
dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select
Mode, SmartSensor, SmartShunt, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
®
PICmicro 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2003 Microchip Technology Inc.
DS21392C-page 15
M
WORLDWIDE SALES AND SERVICE
Japan
AMERICAS
ASIA/PACIFIC
Microchip Technology Japan K.K.
Benex S-1 6F
Corporate Office
Australia
2355 West Chandler Blvd.
Microchip Technology Australia Pty Ltd
Marketing Support Division
Suite 22, 41 Rawson Street
Epping 2121, NSW
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Australia
Korea
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Atlanta
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
China - Beijing
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Tel: 770-640-0034 Fax: 770-640-0307
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Boston
Bei Hai Wan Tai Bldg.
Singapore
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Chicago
China - Chengdu
Singapore, 188980
333 Pierce Road, Suite 180
Itasca, IL 60143
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Tel: 630-285-0071 Fax: 630-285-0075
Microchip Technology (Barbados) Inc.,
Taiwan Branch
Ming Xing Financial Tower
Dallas
No. 88 TIDU Street
4570 Westgrove Drive, Suite 160
Addison, TX 75001
11F-3, No. 207
Chengdu 610016, China
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 86-28-86766200 Fax: 86-28-86766599
Tel: 972-818-7423 Fax: 972-818-2924
China - Fuzhou
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Detroit
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
Tri-Atria Office Building
EUROPE
Austria
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
No. 71 Wusi Road
Microchip Technology Austria GmbH
Durisolstrasse 2
Fuzhou 350001, China
Kokomo
Tel: 86-591-7503506 Fax: 86-591-7503521
A-4600 Wels
2767 S. Albright Road
Kokomo, IN 46902
China - Hong Kong SAR
Austria
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
Kwai Fong, N.T., Hong Kong
18201 Von Karman, Suite 1090
Irvine, CA 92612
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Tel: 852-2401-1200 Fax: 852-2401-3431
China - Shanghai
Tel: 949-263-1888 Fax: 949-263-1338
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Ballerup DK-2750 Denmark
Phoenix
Tel: 45-4420-9895 Fax: 45-4420-9910
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
Room 701, Bldg. B
France
Far East International Plaza
No. 317 Xian Xia Road
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
San Jose
Shanghai, 200051
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Batiment A - ler Etage
China - Shenzhen
91300 Massy, France
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Tel: 408-436-7950 Fax: 408-436-7955
Germany
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Toronto
Microchip Technology GmbH
Steinheilstrasse 10
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-755-82901380 Fax: 86-755-82966626
China - Qingdao
Rm. B505A, Fullhope Plaza,
Italy
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Tel: 39-0331-742611 Fax: 39-0331-466781
Microchip Technology Inc.
India Liaison Office
United Kingdom
Marketing Support Division
Divyasree Chambers
Microchip Ltd.
505 Eskdale Road
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/25/03
DS21392C-page 16
2003 Microchip Technology Inc.
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