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DSA1001DL1-074.2500TVAO

更新时间：2024-11-08 14:59:32

品牌：MICROCHIP

描述：CMOS Output Clock Oscillator, 74.25MHz Nom

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DSA1001DL1-074.2500TVAO 概述

CMOS Output Clock Oscillator, 74.25MHz Nom XO

DSA1001DL1-074.2500TVAO 规格参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	风险等级：	5.71
其他特性：	AEC-Q100; STANDBY; ENABLE/DISABLE FUNCTION; TR; ALSO COMPATIBLE WITH 1.8 & 2.5V SUPPLY VOLTAGE	最长下降时间：	2 ns
频率调整-机械：	NO	频率稳定性：	50%
JESD-609代码：	e3	安装特点：	SURFACE MOUNT
标称工作频率：	74.25 MHz	最高工作温度：	105 °C
最低工作温度：	-40 °C	振荡器类型：	CMOS
输出负载：	10 KOHM, 15 pF	物理尺寸：	2.5mm x 2.0mm x 0.85mm
最长上升时间：	2 ns	标称供电电压：	3.3 V
表面贴装：	YES	最大对称度：	55/45 %
端子面层：	Matte Tin (Sn)	Base Number Matches：	1

DSA1001DL1-074.2500TVAO 数据手册

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DSA1001/3/4

1.8V-3.3V Low-Power Precision CMOS Oscillators for Automotive

Features

General Description

• Automotive AEC-Q100 Qualified

• Frequency Range: 1 MHz to 150 MHz

• Exceptional Stability over Temperature

- ±20 ppm, ±25 ppm, ±50 ppm

• Operating Voltage

The DSA1001/3/4 is a silicon MEMS based CMOS

family of oscillators that offers excellent jitter and

stability performance over a wide range of supply

voltages and temperatures. The device operates from

1 MHz to 150 MHz with supply voltages between 1.8 to

3.3 volts and temperature ranges up to –40°C to

105°C.

- 1.7 to 3.6V

• Operating Temperature Range

- Automotive Grade 2: –40°C to 105°C

- Automotive Grade 3: –40°C to 85°C

• Low Operating and Standby Current

- 6 mA Operating (1 MHz)

The DSA1001/3/4 incorporate an all silicon resonator

that is extremely robust and nearly immune to stress

related fractures, common to crystal based oscillators.

Without sacrificing the performance and stability

required of today’s systems, a crystal-less design

allows for a higher level of reliability, making the

DSA1001/3/4 ideal for rugged, industrial, and portable

applications where stress, shock, and vibration can

damage quartz crystal based systems.

- 15 µA Standby (Max.)

• Ultra Miniature Footprint

- 2.5 mm x 2.0 mm x 0.85 mm

- 3.2 mm x 2.5 mm x 0.85 mm

- 5.0 mm x 3.2 mm x 0.85 mm

• MIL-STD 883 Shock and Vibration Resistant

• Pb Free, RoHS, Reach SVHC Compliant

Available in industry standard packages, the

DSA1001/3/4 can be “dropped-in” to the same PCB

footprint as standard crystal oscillators.

The DSA1003 and DSA1004 have the same

functionality and performance as the DSA1001, but

feature higher output drives of 25 pF and 40 pF,

respectively.

Applications

• Automotive Infotainment

• Automotive ADAS

Package Types

• Automotive Camera Module

DSA1001/3/4

CDFN/DFN

(Top View)

Benefits

• Replace High Temperature Crystals and Quartz

Oscillators

• Pin for Pin “Drop-In” Replacement for Industry

Standard Oscillators

STANDBY#

GND

VDD

OUT

• Semiconductor Level Reliability, Significantly

Higher than Quartz

• Longer Battery Life/Reduced Power Consumption

• Compact Plastic Package

• Cost Effective

 2017 Microchip Technology Inc.

DS20005889A-page 1

DSA1001/3/4

Block Diagram

V_DD

OUTPUT

VCO

PFD

RESONATOR

FRAC-N

PLL

STANDBY#

GND

(PIN1)

DS20005889A-page 2

 2017 Microchip Technology Inc.

DSA1001/3/4

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Input Voltage (V_IN) ............................................................................................................................–0.3V to V_DD+ 0.3V

ESD Protection ....................................................................................................... 4 kV HBM, ±200V MM, 1.5 kV CDM

Recommended Operating Conditions

Supply Voltage (V_DD) ................................................................................................................................ +1.7V to +3.6V

Output Load (Z_L)............................................................................................................................. R > 10 kΩ, C ≤ 15 pF

† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at those or any other conditions above those indicated

in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended

periods may affect device reliability.

TABLE 1-1:

ELECTRICAL CHARACTERISTICS

Electrical Characteristics: V_DD= 1.8 to 3.3V; T_A= +85°C unless otherwise specified.

Parameters

Frequency

Sym.

Min.

Typ.

Max.

Units

MHz Single Frequency

Includes frequency variations

Conditions

F₀

—

150

±20

±25

±50

±5

—

due to initial tolerance,

temperature and power supply

voltage

Frequency Tolerance

Δf

ppm

Aging

Δf

ppm

µA

1 year @ +25°C

T = +25°C

Supply Current, Standby

I_DD

Output Startup Time

(Note 1)

t_SU

—

1.0

1.3

T = +25°C

Output Disable Time

Output Duty Cycle

Input Logic Level High

Input Logic Level Low

V_DD= 1.8V

t_DA

SYM

V_IH

—

100

—

0.75 x V_DD

—

V_IL

0.25 x V_DD

—

6.0

6.5

7.2

8.3

—

6.3

7.1

1 MHz

C_L= 0 pF,

27 MHz

—

Supply Current, No Load

I_DD

R_L= ∞,

T = +25°C

—

8.5

70 MHz

11.9

150 MHz

0.8 x V_DD

—

–6 mA, DSA1004, C_L= 40 pF

–6 mA, DSA1003, C_L= 25 pF

–4 mA, DSA1001, C_L= 15 pF

6 mA, DSA1004, C_L= 40 pF

6 mA, DSA1003, C_L= 25 pF

6 mA, DSA1001, C_L= 15 pF

Output Logic Level High

Output Logic Level Low

V_OH

—

0.2 x V_DD

V_OL

—

Note 1: t_SUis time to stable output frequency after V_DDis applied. t_SUand t_EN(after EN is asserted) are identical

values.

2: Measured over 50k clock cycles.

 2017 Microchip Technology Inc.

DS20005889A-page 3

DSA1001/3/4

TABLE 1-1:

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: V_DD= 1.8 to 3.3V; T_A= +85°C unless otherwise specified.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

DSA1001,

C_L= 15 pF

—

1.4

3.0

Output Transition Rise

Time

DSA1003,

C_L= 25 pF

T = +25°C,

20% to 80%

t_R

—

1.5

1.8

1.0

1.1

1.2

3.0

DSA1004,

C_L= 40 pF

DSA1001,

C_L= 15 pF

Output Transition Fall

Time

DSA1003,

C_L= 25 pF

T = +25°C,

20% to 80%

t_F

DSA1004,

C_L= 40 pF

Jitter, Max.

Cycle-to-Cycle

J_CC

J_P

—

f = 100 MHz (Note 2)

Period Jitter

ps_RMSf = 100 MHz (Note 2)

V_DD= 2.5V

—

6.0

6.7

7.7

9.6

—

6.4

7.5

1 MHz

C_L= 0 pF,

R_L= ∞,

T = +25°C

—

27 MHz

70 MHz

150 MHz

Supply Current, No Load

I_DD

—

9.4

13.9

0.9 x V_DD

0.8 x V_DD

—

–6 mA, DSA1004, C_L= 40 pF

–6 mA, DSA1003, C_L= 25 pF

–4 mA, DSA1001, C_L= 15 pF

6 mA, DSA1004, C_L= 40 pF

6 mA, DSA1003, C_L= 25 pF

4 mA, DSA1001, C_L= 15 pF

Output Logic Level High

Output Logic Level Low

V_OH

—

0.1 x V_DD

0.2 x V_DD

V_OL

—

DSA1001, C_L=

15 pF

—

1.0

1.1

1.2

0.9

1.0

1.1

2.0

Output Transition Rise

Time

DSA1003,

C_L= 25 pF

T = +25°C,

20% to 80%

t_R

DSA1004,

C_L= 40 pF

DSA1001,

C_L= 15 pF

Output Transition Fall

Time

DSA1003,

C_L= 25 pF

T = +25°C,

20% to 80%

t_F

DSA1004,

C_L= 40 pF

Note 1: t_SUis time to stable output frequency after V_DDis applied. t_SUand t_EN(after EN is asserted) are identical

values.

2: Measured over 50k clock cycles.

DS20005889A-page 4

 2017 Microchip Technology Inc.

DSA1001/3/4

TABLE 1-1:

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: V_DD= 1.8 to 3.3V; T_A= +85°C unless otherwise specified.

Parameters

Jitter, Max.

Cycle-to-Cycle

Period Jitter

V_DD= 3.3V

Sym.

Min.

Typ.

Max.

Units

Conditions

J_CC

J_P

—

f = 100 MHz (Note 2)

ps_RMSf = 100 MHz (Note 2)

—

6.0

6.8

8.2

10.8

—

6.5

8.0

1 MHz

C_L= 0 pF,

R_L= ∞,

T = +25°C

—

27 MHz

70 MHz

150 MHz

Supply Current, No Load

I_DD

—

10.5

16.6

0.9 x V_DD

0.8 x V_DD

—

–8 mA, DSA1004, C_L= 40 pF

–6 mA, DSA1003, C_L= 25 pF

–4 mA, DSA1001, C_L= 15 pF

8 mA, DSA1004, C_L= 40 pF

6 mA, DSA1003, C_L= 25 pF

4 mA, DSA1001, C_L= 15 pF

Output Logic Level High

Output Logic Level Low

V_OH

—

0.1 x V_DD

0.2 x V_DD

V_OL

—

DSA1001,

C_L= 15 pF

—

1.0

1.1

1.2

0.9

1.0

1.1

2.0

Output Transition Rise

Time

DSA1003,

C_L= 25 pF

T = +25°C,

20% to 80%

t_R

DSA1004,

C_L= 40 pF

DSA1001,

C_L= 15 pF

Output Transition Fall

Time

DSA1003,

C_L= 25 pF

T = +25°C,

20% to 80%

t_F

DSA1004,

C_L= 40 pF

Jitter, Max.

Cycle-to-Cycle

J_CC

J_P

—

f = 100 MHz (Note 2)

Period Jitter

ps_RMSf = 100 MHz (Note 2)

Note 1: t_SUis time to stable output frequency after V_DDis applied. t_SUand t_EN(after EN is asserted) are identical

values.

2: Measured over 50k clock cycles.

 2017 Microchip Technology Inc.

DS20005889A-page 5

DSA1001/3/4

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Temperature Ranges

Sym.

Min.

Typ.

Max.

Units

Conditions

–40

—

+105

+85

°C

Ordering Option L

Operating Temperature Range (T)

T_A

Ordering Option I

Junction Operating Temperature

Storage Temperature Range

Soldering Temperature Range

T_J

T_A

T_S

+150

+260

—

–55

—

40 sec. max

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., T_A, T_J, _JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.

DS20005889A-page 6

 2017 Microchip Technology Inc.

DSA1001/3/4

2.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1:

Pin Number

CDFN PACKAGE PIN FUNCTION TABLE

Symbol

Description

STANDBY#

GND

Standby input (Section 4.1 “Standby Function”)

Power supply ground

OUT

Oscillator output

VDD

Positive power supply

 2017 Microchip Technology Inc.

DS20005889A-page 7

DSA1001/3/4

3.0

NOMINAL PERFORMANCE CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

FIGURE 3-1:

Supply Current.

FIGURE 3-4:

FIGURE 3-5:

FIGURE 3-6:

Supply Current.

FIGURE 3-2:

Rise Time.

Fall Time.

FIGURE 3-3:

Rise Time.

Fall Time.

DS20005889A-page 8

 2017 Microchip Technology Inc.

DSA1001/3/4

4.0

OUTPUT WAVEFORM

t_R

t_F

V_OH

OUTPUT

V_OL

t_EN

1/f_o

t_DA

V_IH

STANDBY#

V_IL

FIGURE 4-1:

Output Waveform.

4.1

Standby Function

Standby# (Pin 1)

Output (Pin 3)

High Level

Open (no connect)

Low Level

Output ON

High Impedance

 2017 Microchip Technology Inc.

DS20005889A-page 9

DSA1001/3/4

5.0

TEST CIRCUIT

I_DD

V_DD

0.01μF

*V_SD

15pF

*V_SD= Standby# Logic Level Input

FIGURE 5-1:

DSA1001/3/4 Test Circuit.

DS20005889A-page 10

 2017 Microchip Technology Inc.

DSA1001/3/4

6.0

BOARD LAYOUT (RECOMMENDED)

Via to GND Layer

VDD

Standby

Output

GND

Via to GND Layer

FIGURE 6-1:

Recommended Board Layout for DSA1001/3/4.

 2017 Microchip Technology Inc.

DS20005889A-page 11

DSA1001/3/4

7.0

SOLDER REFLOW PROFILE

20-40

Sec

260

217

200

60-150

Sec

ReŇow

60-180

Sec

150

Cool

Pre heat

Time

8 min max

FIGURE 7-1:

Solder Reflow Profile.

MSL 1 @ 260°C refer to JSTD-020C

Ramp-Up Rate (200°C to Peak Temp)

Preheat Time 150°C to 200°C

Time maintained above 217°C

Peak Temperature

3°C/sec. max.

60 to 180 sec.

60 to 150 sec.

255°C to 260°C

20 to 40 sec.

Time within 5°C of Actual Peak

Ramp-Down Rate

6°C/sec. max.

8 minutes max.

Time 25°C to Peak Temperature

DS20005889A-page 12

 2017 Microchip Technology Inc.

DSA1001/3/4

8.0

8.1

PACKAGING INFORMATION

Package Marking Information

Example

4-Lead CDFN/DFN*

XXXXXXX

DCPYYWW

0SSS

0200000

DCP1121

0603

Legend: XX...X Product code, customer-specific information, or frequency in MHz

without printed decimal point

Year code (last digit of calendar year)

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Pb-free JEDEC^®designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle

mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information. Package may or may not include

the corporate logo.

Underbar (_) and/or Overbar (‾) symbol may not be to scale.

 2017 Microchip Technology Inc.

DS20005889A-page 13

DSA1001/3/4

4-Lead CDFN 5.0 mm x 3.2 mm Package Outline & Recommended Land Pattern

DS20005889A-page 14

 2017 Microchip Technology Inc.

DSA1001/3/4

4-Lead CDFN 3.2 mm x 2.5 mm Package Outline & Recommended Land Pattern

 2017 Microchip Technology Inc.

DS20005889A-page 15

DSA1001/3/4

4-Lead CDFN 2.5 mm x 2.0 mm Package Outline & Recommended Land Pattern

DS20005889A-page 16

 2017 Microchip Technology Inc.

DSA1001/3/4

APPENDIX A: REVISION HISTORY

Revision A (March 2018)

• Initial release of data sheet DSA1001/3/4 to

Microchip format data sheet DS20005889A.

 2017 Microchip Technology Inc.

DS20005889A-page 17

DSA1001/3/4

NOTES:

DS20005889A-page 18

 2017 Microchip Technology Inc.

DSA1001/3/4

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Examples:

PART NO.

-XXX.XXXX

DSA1003BL3-030.0000:



Device Package

1.8V - 3.3V Low-Power Pre-

cision CMOS Oscillator, 4-

Temperature Stability

Range

Frequency

Packing

Option

Lead 5.0 mm

x 3.2 mm

CDFN, Automotive Grade 2

Temperature Range,

±20 ppm, 30 MHz Output

Frequency, 72/Tube

Device:

DSA1001/3/4: 1.8V - 3.3V Low-Power Precision CMOS

Oscillator for Automotive

Package:

4-Lead 5.0 mm x 3.2 mm CDFN

4-Lead 3.2 mm x 2.5 mm CDFN

4-Lead 2.5 mm x 2.0 mm CDFN

DSA1004DI1-075.0000T: 

1.8V - 3.3V Low-Power Pre-

cision CMOS Oscillator, 4-

Lead 2.5 mm

x 2.0 mm

CDFN, Automotive Grade 3

Temperature Range,

±50 ppm, 75 MHz 

Output Frequency, 1,000/

Reel

Temperature

Range:

–40C to +85C (Automotive Grade 3)

–40C to +105C (Automotive Grade 2)

Stability:

±50 ppm

±25 ppm

±20 ppm

Frequency:

xxx.xxxx =1 MHz to 150 MHz (user-defined)

<blank> = 110/Tube

Packing Option:

1,000/Reel

Please use the Microchip Clockworks to check AEC-Q100 compliance status and

build the exact part number.

Note 1:

Tape and Reel identifier only appears in the

catalog part number description. This

identifier is used for ordering purposes and

is not printed on the device package. Check

with your Microchip Sales Office for package

availability with the Tape and Reel option.

 2017 Microchip Technology Inc.

DS20005889A-page 19

DSA1001/3/4

NOTES:

DS20005889A-page 20

 2017 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR,

AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,

CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,

KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,

maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip

Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST

Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

and other countries.

ClockWorks, The Embedded Control Solutions Company,

EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,

mTouch, Precision Edge, and Quiet-Wire are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any

Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,

CodeGuard, CryptoAuthentication, CryptoCompanion,

CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average

Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial

Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,

KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,

MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,

Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,

PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple

Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,

SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,

USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and

ZENAare trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in

the U.S.A.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

Silicon Storage Technology is a registered trademark of Microchip

Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip Technology

Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ

CERTIFIEDꢀBYꢀDNVꢀ

ISBN: 978-1-5224-2763-6

== ISO/TSꢀ16949ꢀ==ꢀ

 2017 Microchip Technology Inc.

DS20005889A-page 21

Worldwide Sales and Service

AMERICAS

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EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

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DS20005889A-page 22

 2017 Microchip Technology Inc.

10/25/17

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