DSA11030BA2TVA0 [MICROCHIP]
Low-Jitter Precision LVDS Oscillator for Automotive;
| 型号： | DSA11030BA2TVA0 |
| 厂家： | 
MICROCHIP |
| 描述： | Low-Jitter Precision LVDS Oscillator for Automotive |
| 文件： | 总28页 (文件大小：598K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSA1103/23
Low-Jitter Precision LVDS Oscillator for Automotive
Features
General Description
• Automotive AEC-Q100 Qualified
The DSA1103 and DSA1123 series of high
performance oscillators utilize a proven silicon MEMS
technology to provide excellent jitter and stability over
a wide range of supply voltages and temperatures. By
eliminating the need for quartz or SAW technology,
MEMS oscillators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
automotive applications like in-vehicle networking and
autonomous driving.
• Wide Frequency Range: 2.3 MHz to 460 MHz
(LVDS)
• Low RMS Phase Jitter: <1 ps (typ.)
• High Stability: ±20 ppm, ±25 ppm, ±50 ppm
• Wide Temperature Range:
- Automotive Grade 1: –40°C to +125°C
- Automotive Grade 2: –40°C to +105°C
- Automotive Grade 3: –40°C to +85°C
• High Supply Noise Rejection: –50 dBc
• Small Industry Standard Footprints
- 2.5 mm x 2.0 mm (VDFN)
DSA1103 has a standby feature that allows it to
completely power-down when pin 1 is pulled low. For
DSA1123, only the outputs are disabled when pin 1 is
low. Both oscillators are available in industry standard
packages, including the small 2.5 mm x 2.0 mm, and
are drop-in replacements for standard 6-pin LVDS
crystal oscillators.
- 3.2 mm x 2.5 mm (VDFN & Wettable Flank)
- 5.0 mm x 3.2 mm (CDFN)
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTBF than Quartz Oscillators
• Low Current Consumption
Functional Block Diagram
• Supply Range of 2.25 to 3.63V
• Standby and Output Enable Function
• Lead-Free and RoHS Compliant
Pin 6
VDD
SUPPLY
REGULATION
DIGITAL
CONTROL
Pin 1
OE/STDBY/FS
Applications
MEMS
RESONATOR
Pin 2
NC
• Automotive Infotainment
• Automotive ADAS
• In-Vehicle Networking
• Autonomous Driving
Pin 5
CLK–
Pin 4
CLK+
OUTPUT
DIV
TEMP SENSOR +
CONTROL &
COMPENSATION
PLL
Pin 3
GND
2019 Microchip Technology Inc.
DS20005891A-page 1
DSA1103/23
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage, VIN .............................................................................................................................. –0.3V to VDD +0.3V
Supply Voltage .........................................................................................................................................–0.3V to + 4.0V
ESD Protection (HBM) ...............................................................................................................................................4 kV
ESD Protection (MM) ............................................................................................................................................... 400V
ESD Protection (CDM) ............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
Supply Voltage (Note 1)
VDD
2.25
—
3.6
V
—
DSA1103, EN pin low. Output is
disabled and device is in
standby
—
—
0.095
Supply Current
IDD
mA
DSA1123, EN pin low, output is
disabled
—
20
22
—
—
—
—
—
—
±10
±20
±25
Grade 2 and Grade 3 only
Includes frequency
Frequency Stability
Δf
ppm
variations due to initial
tolerance, temp. and
power supply voltage.
—
—
±50
Aging - First year
ΔfY1
ΔfY2
tSU
—
—
—
—
—
—
—
±5
ppm One year @ 25°C
Aging - After first year
Startup Time (Note 2)
—
<±1
ppm/yr Year two and beyond at +25°C
—
5
ms
V
T = +25°C
Input logic high
Input logic low
—
VIH
VIL
0.75 x VDD
—
Input Logic Levels
—
—
0.25 x VDD
V
Output Disable Time (Note 3)
Output Enable Time
tDS
5
5
ns
ms
ns
DSA1103
DSA1123
tEN
—
—
—
—
20
Enable Pull-Up Resistor
(Note 4)
40
—
kΩ
Internally pulled-up
LVDS Output
Supply Current
IDD
VOS
ΔVOS
VPP
—
1.125
—
29
—
32
1.4
mA
V
Output enabled, RL = 100Ω
R = 100Ω differential
—
Output Offset Voltage
Delta Offset Voltage
Peak-to-Peak Output Swing
Output Logic Level High
Output Logic Level Low
—
50
mV
mV
V
—
350
—
—
Single-ended
VOH
VOL
0.9 x VDD
—
—
I = ±6 mA
—
0.1 x VDD
V
Output Transition Rise Time
(Note 3)
tR
tF
—
—
20% to 80%, RL = 50Ω,
CL = 2 pF
200
ps
Output Transition Fall Time
(Note 3)
—
—
2.3
3.3
—
—
460
460
–40°C to +85°C
Frequency
fO
MHz
–40°C to +105°C
and –40°C to +125°C
DS20005891A-page 2
2019 Microchip Technology Inc.
DSA1103/23
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions
Output Duty Cycle
Period Jitter
SYM
JPER
48
—
—
52
—
%
—
2.5
psRMS
—
200 kHz to 20 MHz @
156.25 MHz
—
0.28
—
Integrated Phase Noise
JPH
psRMS 100 kHz to 20 MHz @
156.25 MHz
—
—
0.4
1.7
—
2
12 kHz to 20 MHz @ 125 MHz
Note 1: Pin 6 VDD should be filtered with 0.1 μF capacitor.
2: tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled.
3: Output Waveform and Test Circuit figures define the parameters.
4: Output is enabled if pad is floated or not connected.
2019 Microchip Technology Inc.
DS20005891A-page 3
DSA1103/23
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Symbol Min.
Typ.
Max. Units
Conditions
TA
TA
TA
TJ
–40
–40
–40
—
—
—
—
—
—
—
+85
°C
°C
°C
°C
°C
°C
Ordering Option I
Ordering Option L
Ordering Option A
—
Operating Temperature Range (T)
+105
+125
+150
+150
+260
Junction Operating Temperature
Storage Temperature Range
TA
TS
–40
—
—
Soldering Temperature Range
Package Thermal Resistance
6-Lead VDFN 5.0 mm x 3.0 mm (B)
6-Lead VDFN 3.2 mm x 2.5 mm (C)
6-Lead VDFN 2.5 mm x 2.0 mm (D)
40 sec. max.
—
—
—
—
—
—
26
45
—
—
—
RθJA
°C/W
258
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DS20005891A-page 4
2019 Microchip Technology Inc.
DSA1103/23
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
DSA1103/DSA1123 PIN FUNCTION TABLE
Pin Number
Pin Name
Pin Type
Description
Output Enable (DSA1123)
OE
H = Specified frequency output.
L = Output is high impedance.
1
I
Standby: (DSA1103)
H = Specified frequency output.
L = Output is high impedance.
STDBY
Device in low power mode; Supply current = ISTDBY
.
2
3
4
5
6
NC
No Connect
Power
Do not connect.
GND
CLK+
CLK–
VDD
Power supply ground.
O
Clock output.
Power supply.
Power
2019 Microchip Technology Inc.
DS20005891A-page 5
DSA1103/23
3.0
NOMINAL PERFORMANCE CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Unless otherwise specified, T = +25°C, VDD = 3.3V.
2.5
156MHz-LVDS
212MHz-LVDS
320MHz-LVDS
410MHz-LVDS
2.0
1.5
1.0
0.5
0.0
0
200
400
600
800
1000
Low-end of integration BW: x kHz to 20 MHz
FIGURE 3-1:
Phase Jitter (Integrated
Phase Noise).
0
-10
-20
-30
-40
-50
-60
-70
50 mV
100 mV
-80
0.1
1
10
100
1000
10000
Supply Noise Frequency (kHz)
FIGURE 3-2:
Power Supply Rejection
Ratio.
DS20005891A-page 6
2019 Microchip Technology Inc.
DSA1103/23
4.0
OUTPUT WAVEFORM
tR
tF
CLK+
80
%
350 mV
50%
20%
CLK-
tEN
1/fo
tDA
VIH
Enable
VIL
FIGURE 4-1:
DSA1103/23 Output Waveform.
2019 Microchip Technology Inc.
DS20005891A-page 7
DSA1103/23
5.0
TYPICAL TERMINATION SCHEME
VDD
0.1uF
6
5
2
3
100
100
4
FIGURE 5-1:
Typical Termination Scheme for DSA1103/23.
DS20005891A-page 8
2019 Microchip Technology Inc.
DSA1103/23
6.0
BOARD LAYOUT (RECOMMENDED)
Via to GND layer
4
Supply bypass
capacitor
Via to GND layer
FIGURE 6-1:
DSA1103/23 Recommended Board Layout.
Note:
Ferrite beads in series with the power supply are not recommended, since they can prevent device start-up
by limiting start-up current. If a ferrite bead is used, a tantalum bypass capacitor of at least 20 μF at pin 6 is
recommended and correct start-up verified.
2019 Microchip Technology Inc.
DS20005891A-page 9
DSA1103/23
7.0
SOLDER REFLOW PROFILE
FIGURE 7-1:
Solder Reflow Profile.
TABLE 7-1:
SOLDER REFLOW
MSL 1 @ 260°C Refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp.)
Preheat Time 150°C to 200°C
Time Maintained above 217°C
Peak Temperature
3°C/sec. max.
60 to 180 sec.
60 to 150 sec.
255°C to 260°C
20 to 40 sec.
Time within 5°C of Actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
DS20005891A-page 10
2019 Microchip Technology Inc.
DSA1103/23
8.0
8.1
PACKAGING INFORMATION
Package Marking Information
Example
6-Pin CDFN/VDFN*
XXXXXXX
DCPYYWW
0SSS
0750000
DCP1723
0421
Legend: XX...X Product code, customer-specific information, or frequency in MHz
without printed decimal point
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2019 Microchip Technology Inc.
DS20005891A-page 11
DSA1103/23
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
1
TOP2VIEW
2X
0.05 C
0.10 C
A
C
A1
SEATING
PLANE
6X
0.08 C
SIDE VIEW
2X b2
1
2
L2
5X L1
N
4X b1
0.10
0.05
C
C
A B
e
BOTTOM VIEW
Microchip Technology Drawing C04-1005 Rev C Sheet 1 of 2
© 2018 Microchip Technology Incorporated
DS20005891A-page 12
2019 Microchip Technology Inc.
DSA1103/23
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal Length
N
6
e
0.825 BSC
0.85
0.02
2.50 BSC
2.00 BSC
0.65
0.25
0.70
0.765
A
A1
D
0.80
0.00
0.90
0.05
E
b1
b2
L1
L2
0.60
0.20
0.60
0.70
0.30
0.80
0.665
0.865
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1005 Rev C Sheet 2 of 2
© 2018 Microchip Technology Incorporated
2019 Microchip Technology Inc.
DS20005891A-page 13
DSA1103/23
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
X2
6
Y
G2
C
1
2
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Contact Pitch
E
X1
X2
Y
0.825 BSC
Contact Pad Width (X4)
Contact Pad Width (X2)
Contact Pad Length (X6)
Contact Pad Spacing
0.65
0.25
0.85
C
1.45
Space Between Contacts (X4)
Space Between Contacts (X3)
G1
G2
0.38
0.60
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3005 Rev C
© 2018 Microchip Technology Incorporated
DS20005891A-page 14
2019 Microchip Technology Inc.
DSA1103/23
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
0.08 C
A1
C
A
SEATING
PLANE
6X
SIDE VIEW
2X b2
1
2
NOTE 1
L
N
4X b1
L1
e
0.07
0.05
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-1007A Sheet 1 of 2
2019 Microchip Technology Inc.
DS20005891A-page 15
DSA1103/23
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal Pullback
N
6
e
1.05 BSC
0.85
0.02
3.20 BSC
2.50 BSC
0.90
0.50
0.70
0.10 REF
A
A1
D
0.80
0.00
0.90
0.05
E
b1
b2
L
0.85
0.45
0.65
0.95
0.55
0.75
L1
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1007A Sheet 2 of 2
DS20005891A-page 16
2019 Microchip Technology Inc.
DSA1103/23
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
G
6
C
Y
1
2
X1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
0.25
NOM
1.05 BSC
1.60
MAX
Contact Pitch
E
C
X1
X2
Y
Contact Pad Spacing
Contact Pad Width (X4)
Contact Pad Width (X2)
Contact Pad Length (X6)
1.00
0.60
0.85
Space Between Contacts (X4)
G1
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3007A
2019 Microchip Technology Inc.
DS20005891A-page 17
DSA1103/23
DS20005891A-page 18
2019 Microchip Technology Inc.
DSA1103/23
6-Lead Very Thin Plastic Dual Flat, No Lead Package (KDA) - 3.2x2.5 mm Body [VDFN]
With Stepped Wettable Flanks
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
(A4)
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
(E3)
TOP VIEW
0.05 C
END VIEW
0.10 C
0.08 C
A
C
A1
SEATING
PLANE
6X
SIDE VIEW
A3
2X b2 0.50
1
0.25
4X b1 0.90
2
0.10
0.05
C
C
A B
NOTE 1
6X L
N
e1.05
BOTTOM VIEW
Microchip Technology Drawing C04-01252 Rev A Sheet 1 of 2
© 2018 Microchip Technology Incorporated
2019 Microchip Technology Inc.
DS20005891A-page 19
DSA1103/23
6-Lead Very Thin Plastic Dual Flat, No Lead Package (KDA) - 3.2x2.5 mm Body [VDFN]
With Stepped Wettable Flanks
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Terminal Thickness
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Step Width
N
6
e
1.05 BSC
0.85
0.02
A
A1
A3
D
0.80
0.00
0.15
0.90
0.05
0.25
0.20
3.20 BSC
2.50 BSC
0.90
0.50
0.80
E
b1
b2
L
E3
A4
0.85
0.45
0.70
0.95
0.55
0.90
0.05 REF
0.10 REF
Step Height
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-01252 Rev A Sheet 2 of 2
© 2018 Microchip Technology Incorporated
DS20005891A-page 20
2019 Microchip Technology Inc.
DSA1103/23
6-Lead Very Thin Plastic Dual Flat, No Lead Package (KDA) - 3.2x2.5 mm Body [VDFN]
With Stepped Wettable Flanks
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
X1
6
C
G1
CH
Y
1
2
G2
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.05 BSC
2.00
MAX
Contact Pitch
E
C
Contact Pad Spacing
Contact Pad Width (X20)
Optional Center Pad Width
Contact Pad Length (X20)
X1
X2
Y
1.00
0.60
0.80
Contact Pad to Contact Pad (X3)
Contact Pad to Contact Pad (X4)
Terminal 1 Corner Chamfer
G1
G2
CH
0.75
0.25
0.28
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-03252 Rev A
© 2018 Microchip Technology Incorporated
2019 Microchip Technology Inc.
DS20005891A-page 21
DSA1103/23
NOTES:
DS20005891A-page 22
2019 Microchip Technology Inc.
DSA1103/23
APPENDIX A: REVISION HISTORY
Revision A (June 2019)
• Initial release of DSA1103/23 as Microchip data
sheet DS20005891A.
• Minor changes throughout the data sheet.
2019 Microchip Technology Inc.
DS20005891A-page 23
DSA1103/23
NOTES:
DS20005891A-page 24
2019 Microchip Technology Inc.
DSA1103/23
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
X
3
X
X
X
-XXX.XXXX
X
XXX
Device
(First 2 Digits)
Enable
Modes
Device
(First 2 Digits)
Temperature
Range
Frequency
Stability
Media
Type
Automotive
Suffix
Package
Frequency
Examples:
Device:
DSA11x3:
Low-Jitter Precision LVDS Oscillator for
Automotive
a) DSA1123BI2-
400.0000TVA0:
Low-Jitter Precision LVDS Oscillator
for Automotive, Enable/Disable,
5x3.2 CDFN, –40°C to +85°C,
±25ppm, 400 MHz, 1000/Reel
Enable Modes:
Package:
0
2
=
=
Enable/Standby
Enable/Disable
b) DSA1103CL3- Low-Jitter Precision LVDS Oscillator
074.2500VA0: for Automotive, Enable/Standby,
B
=
=
=
=
5.0 mm x 3.2 mm CDFN
3.2 mm x 2.5 mm VDFN
2.5 mm x 2.0 mm VDFN
3.2 mm x 2.5 mm VDFN (Wettable Flanks)
C
D
W
3.2x2.5 VDFN, –40°C to +105°C,
±20 ppm, 74.25 MHz, 100/Tube
c) DSA1103WI2- Low-Jitter Precision LVDS Oscillator
056.0000VA0:
for Automotive, Enable/Standby,
3.2x2.5 VDFN (Wettable Flanks),
–40°C to +85°C, ±25 ppm, 56 MHz,
100/Tube
Temperature
Range:
A
I
L
=
=
=
–40°C to +125°C
–40°C to +85°C
–40°C to +105°C
Stability:
1
2
3
=
=
=
±50 ppm
±25 ppm
±20 ppm
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
Frequency Code:
Media Type:
xxx.xxxx = 2.3 MHz to 460 MHz (user-defined)
T
=
1,000/Reel
(blank) = 100/Tube
Automotive Suffix: VXX = Automotive Suffix in which “XX” is assigned by
Microchip.
Note: Please use the Microchip Clockworks tool to check AEC-Q100 compliance
status and build the exact part number.
2019 Microchip Technology Inc.
DS20005891A-page 25
DSA1103/23
NOTES:
DS20005891A-page 26
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4722-1
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2019 Microchip Technology Inc.
DS20005891A-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
Germany - Garching
Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
Germany - Haan
Tel: 49-2129-3766400
Austin, TX
Tel: 512-257-3370
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Germany - Heilbronn
Tel: 49-7131-72400
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
Germany - Karlsruhe
Tel: 49-721-625370
China - Qingdao
Philippines - Manila
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
Tel: 49-8031-354-560
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Israel - Ra’anana
Tel: 972-9-744-7705
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
Detroit
Novi, MI
Tel: 248-848-4000
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
Houston, TX
Tel: 281-894-5983
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7288-4388
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20005891A-page 28
2019 Microchip Technology Inc.
05/14/19
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