DSC1121AM2-041.5000T [MICROCHIP]
CMOS Output Clock Oscillator, 41.5MHz Nom;
| 型号： | DSC1121AM2-041.5000T |
| 厂家： | 
MICROCHIP |
| 描述： | CMOS Output Clock Oscillator, 41.5MHz Nom |
| 文件： | 总30页 (文件大小：618K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSC1101/21
Low-Jitter Precision CMOS Oscillator
Features
General Description
• Low RMS Phase Jitter: <1 ps (typ.)
The DSC1101 and DSC1121 series of high
performance oscillators utilize a proven silicon MEMS
technology to provide excellent jitter and stability over
a wide range of supply voltages and temperatures. By
eliminating the need for quartz or SAW technology,
MEMS oscillators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
communications, storage, and networking applications.
• High Stability: ±10 ppm, ±20 ppm, ±25 ppm,
±50 ppm
• Wide Temperature Range:
- Automotive: –55°C to +125°C
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Commercial: –20°C to +70°C
• High Supply Noise Rejection: –50 dBc
• Wide Freq. Range: 2.3 MHz to 170 MHz
• Small Industry Standard Footprints
DSC1101 has a standby feature that allows it to
completely power-down when EN pin is pulled low;
whereas for DSC1121, only the outputs are disabled
when EN is low. Both oscillators are available in
industry standard packages, including the small
2.5 mm x 2.0 mm, and are “drop-in” replacements for
standard 4-pin CMOS quartz crystal oscillators.
- 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm, 5.0 mm
x 3.2 mm, and 7.0 mm x 5.0 mm
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF than Quartz Oscillators
• Low Current Consumption
Functional Block Diagram
• Supply Range of 2.25 to 3.6V
• Standby and Output Enable Function
• Lead-Free and RoHS Compliant
Applications
• Storage Area Networks
- SATA, SAS, Fibre Channel
• Passive Optical Networks
- EPON, 10G-EPON,V GPON, 10G-PON
• Ethernet
- 1G, 10GBASE-T/KR/LR/SR, and FCoE
• HD/SD/SDI Video and Surveillance
• PCI Express
• Display Port
2017 Microchip Technology Inc.
DS20005613B-page 1
DSC1101/21
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage, VIN ..............................................................................................................................–0.3V to VDD + 0.3V
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
ESD Protection On All Pins...........................................................................................4000V HBM, 1500V CDM (max.)
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Note: 1000+ years of data retention on internal memory.
TABLE 1-1:
DC CHARACTERISTICS
Electrical Characteristics
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage (Note 1)
VDD
2.25
—
3.6
V
—
DSC1101, EN pin low, output
is disabled
—
—
—
0.095
22
DSC1121, EN pin low, output
is disabled
Supply Current
IDD
20
mA
Output enabled, CL = 15 pF,
F0 = 100 MHz
—
—
31
—
35
±10
±20
±25
±50
±5
Ext Comm. & Ind. only
All temp ranges
All temp ranges
All temp ranges
1 year @ 25°C
T = 25°C
Frequency Stability
(Including frequency
variations due to initial
tolerance, temp. and
power supply voltage.)
f
ppm
—
—
—
—
—
—
—
—
Aging
f
tSU
VIH
ppm
ms
Startup Time (Note 2)
—
5
Input Logic Levels
Input Logic High
Input Logic Low
0.75VDD
—
V
—
—
VIL
tDS
—
—
—
0.1VDD
Output Disable Time
(Note 3)
—
5
ns
—
—
—
—
5
ms
ns
DSC1101
DSC1121
Output Enable Time
tEN
—
20
Enable Pull-up Resistor
(Note 4)
—
40
—
k
Pull-up Resistor Exist
CMOS Output
Output Logic Levels
Output Logic High
Output Logic Low
VOH
VOL
0.9VDD
—
—
—
V
I = ±6 mA
—
0.1VDD
Note 1: Pin 6 VDD should be filtered with 0.1 µF capacitor.
2: tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled.
3: Output Waveform and Test Circuit figures define the parameters.
4: Output is enabled if pad is floated or not connected.
DS20005613B-page 2
2017 Microchip Technology Inc.
DSC1101/21
TABLE 1-1:
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics
Parameters
Sym.
tR
Min.
—
Typ.
1.1
Max.
Units
Conditions
Output Transition Time
Rise Time
Fall Time
2
2
20% to 80%
CL = 15 pF
ns
tF
—
1.3
CL = 15 pF, –20°C to +70°C
and –40°C to +85°C
2.3
3.3
—
—
170
170
Frequency
f0
MHz
%
CL = 15 pF, –40°C to +105°C
and –55°C to +125°C
Output Duty Cycle
Period Jitter
SYM
JPER
45
—
—
—
—
—
3
55
—
—
—
2
—
psRMS FOUT = 125 MHz
200kHzto20MHz@125MHz
0.3
0.38
1.7
Integrated Phase Noise
JPH
psRMS 100kHzto20MHz@125MHz
12 kHz to 20 MHz @ 125 MHz
Note 1: Pin 6 VDD should be filtered with 0.1 µF capacitor.
2: tSU is time to 100 ppm of output frequency after VDD is applied and outputs are enabled.
3: Output Waveform and Test Circuit figures define the parameters.
4: Output is enabled if pad is floated or not connected.
2017 Microchip Technology Inc.
DS20005613B-page 3
DSC1101/21
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
TA
TA
TA
TA
TJ
–20
–40
–40
–55
—
—
—
—
—
—
—
—
+70
+85
°C
°C
°C
°C
°C
°C
°C
Ordering Option E
Ordering Option I
Ordering Option L
Ordering Option M
—
Operating Temperature Range (T)
+105
+125
+150
+150
+260
Junction Operating Temperature
Storage Temperature Range
Soldering Temperature Range
TA
TS
–40
—
—
40 sec. max
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005613B-page 4
2017 Microchip Technology Inc.
DSC1101/21
2.0
NOMINAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Phase Jitter (Integrated
Phase Noise).
FIGURE 2-2:
Power Supply Rejection
Ratio.
2017 Microchip Technology Inc.
DS20005613B-page 5
DSC1101/21
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1. Pin order and descriptions apply across all package types.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number Pin Number Pin Number Pin Number Pin Number
Pin Name
Description
7x5 w/ Pad
7x5 w/o Pad
5x3.2
3.2x2.5
2x2.5
1
2
1
2
1
2
1
2
1
2
EN
NC
Enable.
Do not connect.
Ground.
3
3
3
3
3
GND
OUT
NC
4
4
4
4
4
Output.
5
5
5
5
5
Do not connect.
Supply voltage.
Tie to ground.
6
6
6
6
6
VDD
PAD
PAD
—
—
—
—
TABLE 3-2:
OUTPUT ENABLE MODES
EN Pin
DSC1101
DSC1121
High
Output Active
Output Active
Standby
Output Active
Output Active
NC
Low
Output Disabled
DS20005613B-page 6
2017 Microchip Technology Inc.
DSC1101/21
4.0
OUTPUT WAVEFORM
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
VIH
ENABLE
VIL
FIGURE 4-1:
DSC1101/21 Output Waveform.
2017 Microchip Technology Inc.
DS20005613B-page 7
DSC1101/21
5.0
TYPICAL TERMINATION SCHEME
FIGURE 5-1:
Typical Termination Scheme for DSC1101/21.
DS20005613B-page 8
2017 Microchip Technology Inc.
DSC1101/21
6.0
BOARD LAYOUT (RECOMMENDED)
Via to GND layer
Supply bypass
capacitor
Via to GND layer
FIGURE 6-1:
DSC1101/21 Recommended Board Layout.
2017 Microchip Technology Inc.
DS20005613B-page 9
DSC1101/21
7.0
SOLDER REFLOW PROFILE
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time Maintained Above 217°C
Peak Temperature
3°C/Sec. Max.
60-180 Sec.
60-150 Sec.
255-260°C
20-40 Sec.
Time within 5°C of Actual Peak
Ramp-Down Rate
6°C/Sec. Max.
8 minute Max.
Time 25°C to Peak Temperature
DS20005613B-page 10
2017 Microchip Technology Inc.
DSC1101/21
8.0
8.1
PACKAGING INFORMATION
Package Marking Information
Example
6-Pin CDFN/VDFN*
XXXXXXX
DCPYYWW
0SSS
0750000
DCP1723
0421
Legend: XX...X Product code, customer-specific information, or frequency in MHz
without printed decimal point
Y
Year code (last digit of calendar year)
YY
WW
SSS
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc.
DS20005613B-page 11
DSC1101/21
6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
1
TOP2VIEW
2X
0.05 C
0.10 C
A
C
A1
SEATING
PLANE
6X
0.08 C
SIDE VIEW
2X b2
1
2
L2
5X L1
N
4X b1
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1005A Sheet 1 of 2
DS20005613B-page 12
2017 Microchip Technology Inc.
DSC1101/21
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal Length
N
6
e
0.825 BSC
0.85
A
A1
D
0.80
0.00
0.90
0.05
0.02
2.50 BSC
2.00 BSC
0.65
0.25
0.70
E
b1
b2
L1
L2
0.60
0.20
0.60
0.70
0.30
0.80
0.665
0.765
0.865
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1005A Sheet 2 of 2
2017 Microchip Technology Inc.
DS20005613B-page 13
DSC1101/21
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
X2
1
2
Y
G2 C
6
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Contact Pitch
E
X1
X2
Y
0.825 BSC
Contact Pad Width (X4)
Contact Pad Width (X2)
Contact Pad Length (X6)
Contact Pad Spacing
0.65
0.25
0.85
C
1.45
Space Between Contacts (X4)
Space Between Contacts (X3)
G1
G2
0.38
0.60
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3005A
DS20005613B-page 14
2017 Microchip Technology Inc.
DSC1101/21
6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
0.08 C
A1
C
A
SEATING
PLANE
6X
SIDE VIEW
2X b2
1
2
NOTE 1
L
N
4X b1
L1
e
0.07
0.05
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-1007A Sheet 1 of 2
2017 Microchip Technology Inc.
DS20005613B-page 15
DSC1101/21
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal Pullback
N
6
e
1.05 BSC
0.85
0.02
3.20 BSC
2.50 BSC
0.90
0.50
0.70
0.10 REF
A
A1
D
0.80
0.00
0.90
0.05
E
b1
b2
L
0.85
0.45
0.65
0.95
0.55
0.75
L1
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1007A Sheet 2 of 2
DS20005613B-page 16
2017 Microchip Technology Inc.
DSC1101/21
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
G
6
C
Y
1
2
X1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
0.25
NOM
1.05 BSC
1.60
MAX
Contact Pitch
E
C
X1
X2
Y
Contact Pad Spacing
Contact Pad Width (X4)
Contact Pad Width (X2)
Contact Pad Length (X6)
1.00
0.60
0.85
Space Between Contacts (X4)
G1
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3007A
2017 Microchip Technology Inc.
DS20005613B-page 17
DSC1101/21
6-Lead CDFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern
DS20005613B-page 18
2017 Microchip Technology Inc.
DSC1101/21
6-Lead VDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
6
ØV
C
Y2
EV
G
Y1
1
2
X1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
MILLIMETERS
NOM
2.54 BSC
MIN
MAX
Contact Pitch
Optional Center Pad Width
Optional Center Pad Length
Contact Pad Spacing
X2
Y2
C
2.90
1.90
3.70
Contact Pad Width (X6)
Contact Pad Length (X6)
Contact Pad to Center Pad (X2)
Thermal Via Diameter (X6)
Thermal Via Pitch
X1
Y1
G
V
EV
1.50
1.35
0.20
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3010A
2017 Microchip Technology Inc.
DS20005613B-page 19
DSC1101/21
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.20 C
2X
1
2
0.20 C
TOP VIEW
A1
0.10 C
0.08 C
C
A
SEATING
PLANE
6X
SIDE VIEW
0.10
C A B
D2
2
1
0.10
C A B
NOTE 1
E2
6X L
(K)
6X b
N
0.10
0.05
C A B
C
e
BOTTOM VIEW
Microchip Technology Drawing C04-1010A Sheet 1 of 2
DS20005613B-page 20
2017 Microchip Technology Inc.
DSC1101/21
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
N
e
6
2.54
Overall Height
Standoff
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Terminal Width
Terminal Length
A
A1
D
D2
E
E2
b
L
0.80
0.00
0.85
0.02
7.00 BSC
2.80
5.00 BSC
1.80
0.90
0.05
2.70
2.90
1.70
1.35
1.00
1.90
1.45
1.20
1.40
1.10
Terminal-to-Exposed-Pad
K
0.20 REF
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1010A Sheet 2 of 2
2017 Microchip Technology Inc.
DS20005613B-page 21
DSC1101/21
6-Lead CDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern
DS20005613B-page 22
2017 Microchip Technology Inc.
DSC1101/21
NOTES:
2017 Microchip Technology Inc.
DS20005613B-page 23
DSC1101/21
DS20005613B-page 24
2017 Microchip Technology Inc.
DSC1101/1121
APPENDIX A: REVISION HISTORY
Revision A (August 2017)
• Initial creation of document DSC1101/21 to Micro-
chip data sheet template DS20005613A.
• Minor text changes throughout.
Revision B (December 2017)
• Military temperature range changed to Automotive
in Features and Product Identification System.
• Supply Current values updated in Table 1-1.
• Test Circuit section removed.
• Updated Figure 6-1, Recommended Board Lay-
out.
2017 Microchip Technology Inc.
DS20005613B-page 25
DSC1101/21
NOTES:
DS20005613B-page 26
2017 Microchip Technology Inc.
DSC1101/21
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
PART NO.
X
X
-XXX.XXXX
X
a)
DSC1101AM1-010.0000T:
Low-Power
CMOS Oscillator
Device Package
Precision
with
Temperature Stability
Range
Frequency
Packaging
Option
Standby, 6-LD 7.0X5.0
VDFN, Automotive Tem-
perature Range, ±50 ppm,
Device:
DSC1101:
DSC1121:
Low-Power Precision CMOS Oscillator with
Standby
Low-Power Precision CMOS Oscillator
10 MHz
quency, 1,000/Reel
b) DSC1101BL2-030.0000:
Output
Fre-
Package:
A
B
C
D
N
=
=
=
=
=
6-Lead 7.0 mm x 5.0 mm VDFN
6-Lead 5.0 mm x 3.2 mm CDFN
6-Lead 3.2 mm x 2.5 mm VDFN
6-Lead 2.5 mm x 2.0 mm VDFN
6-Lead 7.0 mm x 5.0 mm CDFN (no center pad)
Low-Power
Precision
CMOS Oscillator with
Standby, 6-LD 5.0X3.2
CDFN, Extended Indus-
trial Temperature Range,
±25 ppm, 30 MHz Output
Frequency, 110/Tube
Temperature
Range:
E
I
L
M
=
=
=
=
–20C to +70C (Extended Commercial)
–40C to +85C (Industrial)
–40C to +105C (Extended Industrial)
–55C to +125C (Automotive)
c)
DSC1101DE5-150.0000:
Low-Power
CMOS
Precision
with
Oscillator
Standby, 6-LD 2.5X2.0
VDFN, Extended Commer-
cial Temperature Range,
±10 ppm, 150 MHz Output
Frequency, 110/Tube
Stability:
1
2
3
5
=
=
=
=
±50 ppm
±25 ppm
±20 ppm
±10 ppm
d) DSC1101AI2-075.0000T:
Frequency:
xxx.xxxx =2.3 MHz to 170 MHz (user-defined)
Low-Power
Precision
CMOS Oscillator with
Standby, 6-LD 7.0X5.0
VDFN, Industrial Tempera-
ture Range, ±25 ppm,
75 MHz Output Fre-
quency, 1,000/Reel
Packing Option:
<blank>= 110/Tube
T
=
1,000/Reel
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
2017 Microchip Technology Inc.
DS20005613B-page 27
DSC1101/21
NOTES:
DS20005613B-page 28
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENAare trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2480-2
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005613B-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
Germany - Garching
Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
Germany - Haan
Tel: 49-2129-3766400
Austin, TX
Tel: 512-257-3370
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Germany - Heilbronn
Tel: 49-7131-67-3636
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
Germany - Karlsruhe
Tel: 49-721-625370
China - Qingdao
Philippines - Manila
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
Tel: 49-8031-354-560
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Israel - Ra’anana
Tel: 972-9-744-7705
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
Detroit
Novi, MI
Tel: 248-848-4000
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
Houston, TX
Tel: 281-894-5983
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7289-7561
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20005613B-page 30
2017 Microchip Technology Inc.
10/25/17
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