KSZ8721SLI-TR [MICROCHIP]
3.3V Single Power Supply 10/100 Base-TX/FX MII Physical Layer Transceiver;型号: | KSZ8721SLI-TR |
厂家: | MICROCHIP |
描述: | 3.3V Single Power Supply 10/100 Base-TX/FX MII Physical Layer Transceiver 局域网(LAN)标准 |
文件: | 总44页 (文件大小:572K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
KSZ8721BL/SL
3.3V Single Power Supply 10/100 Base-TX/FX MII Physical Layer
Transceiver
Features
• Single Chip 100BASE-TX/100BASE-FX/
10BASE-T Physical Layer Solution
• On-Chip, Built-In, Analog Front-End Filtering for
Both 100BASE-TX and 10BASE-T
• 2.5V CMOS Design; 2.5/3.3V Tolerance on I/O
• LED Outputs for Link, Activity, Full-Duplex/Half-
Duplex, Collision, and Speed
• 3.3V Single Power Supply with Built-In Voltage
Regulator; Power Consumption <340 mW
(Including Output Driver Current)
• Supports Back-to-Back, FX to TX for Media
Converter Applications
• Fully Compliant to IEEE 802.3u Standard
• Supports MII and Reduced MII (RMII)
• Supports MDI/MDI-X Auto-Crossover
• KSZ8721BL is a Drop-In Replacement for the
KSZ8721BT in the Same Footprint
• Supports 10BASE-T, 100BASE-TX, and
100BASE-FX with Far-End Fault Detection
• KSZ8721SL is a Drop-In Replacement for the
KSZ8721B in the Same Footprint
• Supports Power Down and Power Saving Modes
• Commercial Temperature Range: 0°C to +70°C
• Industrial Temperature Range: –40°C to +85°C
• Available in 48-pin SSOP and LQFP Packages
• Configurable Through MII Serial Management
Ports or via External Control Pin
• Supports Auto-Negotiation and Manual Selection
for 10/100 Mbps Speed and Full-Duplex/Half-
Duplex Modes
2018 Microchip Technology Inc.
DS00002813A-page 1
KSZ8721BL/SL
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DS00002813A-page 2
2018 Microchip Technology Inc.
KS8721BL/SL
Table of Contents
1.0 Introduction ..................................................................................................................................................................................... 4
2.0 Pin Description and Configuration .................................................................................................................................................. 5
3.0 Functional Description .................................................................................................................................................................. 10
4.0 Register Map ................................................................................................................................................................................. 19
5.0 Operational Characteristics ........................................................................................................................................................... 25
6.0 Electrical Characteristics ............................................................................................................................................................... 26
7.0 Timing Specifications .................................................................................................................................................................... 28
8.0 Packaging Information .................................................................................................................................................................. 36
Appendix A: Data Sheet Revision History ........................................................................................................................................... 39
The Microchip Web Site ...................................................................................................................................................................... 40
Customer Change Notification Service ............................................................................................................................................... 40
Customer Support ............................................................................................................................................................................... 40
Product Identification System ............................................................................................................................................................. 41
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KSZ8721BL/SL
1.0
1.1
INTRODUCTION
General Description
Operating with a 2.5V core to meet low-voltage and low-power requirements, the KSZ8721BL and KSZ8721SL are
10BASE-T/100BASE-TX/FX Physical Layer Transceivers that use MII and RMII interfaces to transmit and receive data.
They contain 10BASE-T Physical Medium Attachment (PMA), Physical Medium Dependent (PMD), and Physical
Coding Sub-layer (PCS) functions. The KSZ8721BL/SL also have on-chip 10BASE-T output filtering. This eliminates
the need for external filters and allows a single set of line magnetics to be used to meet requirements for both
100BASE-TX and 10BASE-T.
The KSZ8721BL/SL automatically configure themselves for 100 or 10Mbps and full-duplex or half-duplex operation,
using an on-chip auto-negotiation algorithm. They are the ideal physical layer transceiver for 100BASE-TX/10BASE-T
applications.
FIGURE 1-1:
KSZ8721BL/SL FUNCTIONAL DIAGRAM
4B/5B Encoder
Scrambler
Parallel/Serial
NRZ/NRZI
MLT3 Encoder
TXD3
TXD2
TXD1
TXD0
TXER
TXC
TXEN
CRS
COL
10/100
Pulse
Shaper
TX+
Transmitter
TX-
Parallel/Serial
Manchester Encoder
MII/RMII
Registers
and
Controller
Interface
Adaptive EQ
Base Line
Wander Correction
MLT3 Decoder
NRZI/NRZ
RX+
RX-
4B/5B Decoder
Descrambler
Serial/Parallel
Clock
Recovery
MDIO
MDC
RXD3
RXD2
RXD1
RXD0
RXER
RXDV
RXC
Auto
Negotiation
Manchester Decoder
Serial/Parallel
10BASE-T
Receiver
Power
Down or
Saving
LINK
COL
FDX
SPD
LED
Driver
XI
PLL
XO
PWRDWN
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KSZ8721BL/SL
2.0
PIN DESCRIPTION AND CONFIGURATION
FIGURE 2-1:
48-PIN SSOP (SM) AND 48-PIN LQFP (LQ) (TOP VIEW)
48-Pin SSOP (SM)
MDIO
MDC
1
48 RST#
2
3
4
5
6
7
8
9
47 VDDPLL
46 XI
48-Pin LQFP (LQ)
R3D3/PHYAD1
RXD2/PHYAD2
RXD1/PHYAD3
RXD0/PHYAD4
VDDIO
45 XO
44 GND
43 GND
48 47 46 45 44 43 42 4140 39 38 37
42 VDDTX
41 TX+
36
35
34
33
32
31
30
29
28
27
GND
GND
MDIO
1
2
3
MDC
RXD1/PHYAD1
RXD2/PHYAD2
RXD1/PHYAD3
RXD0/PHYAD4
VDDIO
GND
FXSD/FXEN
RX+
4
RXDV/PCS_LPBK
40 TX-
5
RX–
6
VDDRX
RXC 10
RXER/ISO 11
GND 12
39 GND
PD#
7
38 VDDRCV
37 REXT
8
LED3/NWAYEN
LED2/DUPLEX
LED1/SPD100
LED0/TEST
GND
RXDV/PCS_LPBK
RXC
9
10
RXER/ISO
11
12
26
25
VDDC 13
36 GND
GND
INT#/PHYAD0
13 14 15 16 17 18 19 20 21 22 23 24
TXER 14
35 GND
TXC/REF_CLK 15
TXEN 16
34 FXSD/FXEN
33 RX+
TXD0 17
32 RX-
TXD1 18
31 VDDRX
30 PD#
TXD2 19
TXD3 20
29 LED3/NWAYEN
28 LED2/DUPLEX
27 LED1/SPD100
26 LED0/TEST
25 INT#/PHYAD0
COL/RMII 21
CRS/RMII_BTB 22
GND 23
VDDIO 24
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KSZ8721BL/SL
TABLE 2-1:
PIN DESCRIPTION
Pin
Number
Type
(Note 2-1)
Pin Name
Description
Management Independent Interface (MII) Data I/O. This pin
requires an external 4.7 kΩ pull-up resistor.
1
2
MDIO
MDC
I/O
I
MII Clock Input. This pin is synchronous to the MDIO.
MII Receive Data Output. RXD [3..0], these bits are synchronous
with RXCLK. When RXDV is asserted, RXD [3..0] presents valid
data to MAC through the MII. RXD [3..0] is invalid when RXDV is
de-asserted.
RXD3/PHYAD
3
IPD/O
During reset, the pull-up/pull-down value is latched as PHYADDR
[1]. See Table 2-2 for details.
MII Receive Data Output.
4
5
6
RXD2/PHYAD2
RXD1/PHYAD1
RXD0/PHYAD4
IPD/O
IPD/O
IPD/O
During reset, the pull-up/pull-down value is latched as PHY-
ADDR[2]. See Table 2-2 for details.
MII Receive Data Output.
During reset, the pull-up/pull-down value is latched as PHY-
ADDR[3]. See Table 2-2 for details.
MII Receive Data Output.
During reset, the pull-up/pull-down value is latched as PHY-
ADDR[4]. See Table 2-2 for details.
Digital IO 2.5 /3.3V tolerant power supply. 3.3V power Input of
voltage regulator. See Section 3.23 “Circuit Design Reference
for Power Supply” for details.
7
8
9
VDDIO
GND
P
GND
IPD/O
Ground.
MII Receive Data Valid Output.
During reset, the pull-up/pull-down value is latched as
PCS_LPBK. See Table 2-2 for details.
RXDV/CRSDV/
PCS_LPBK
MII Receive Clock Output. Operating at 25 MHz = 100 Mbps,
2.5 MHz = 10 Mbps.
10
11
RXC
O
MII Receive Error Output.
During reset, the pull-up/pull-down value is latched as ISOLATE
during reset. See Table 2-2 for details.
RXER/ISO
IPD/O
12
13
14
GND
VDDC
TXER
GND
P
Ground.
Digital core 2.5V only power supply. See Section 3.23 “Circuit
Design Reference for Power Supply” for details.
IPD
MII Transmit Error Input.
MII Transmit Clock Output.
Input for crystal or an external 50 MHz clock. When REFCLK pin
is used for REF clock interface, pull up XI to VDDPLL 2.5V via
10 kΩ resistor and leave XO pin unconnected.
15
TXC/REFCLK
I/O
16
17
18
TXEN
TXD0
TXD1
IPD
IPD
IPD
MII Transmit Enable Input.
MII Transmit Data Input.
MII Transmit Data Input.
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KSZ8721BL/SL
TABLE 2-1:
PIN DESCRIPTION (CONTINUED)
Type
Pin
Number
Pin Name
Description
(Note 2-1)
19
20
TXD2
TXD3
IPD
IPD
MII Transmit Data Input.
MII Transmit Data Input.
MII Collision Detect Output.
21
22
COL/RMII
IPD/O
IPD/O
During reset, the pull-up/pull-down value is latched as RMII select.
See Table 2-2 for details.
MII Carrier Sense Output.
During reset, the pull-up/pull-down value is latched as RMII back-
to-back mode when RMII mode is selected. See Table 2-2 for
details.
CRS/RMII_BTB
23
24
GND
GND
P
Ground.
Digital IO 2.5/3.3V tolerant power supply. 3.3V power input of volt-
age regulator. See
Power Supply
VDDIO
Section 3.23, Circuit Design Reference for
for details.
Management Interface (MII) Interrupt Out. Interrupt level set by
Register 1f, bit 9. During reset, latched as PHYAD[0]. See Table 2-
2 for details.
25
INT#/PHYAD0
LED0/TEST
IPU/O
IPU/O
Link/Activity LED Output. The external pull-down enable test
mode and only used for the factory test. Active low.
Link/Act
No Link
Link
Pin State
LED Definition PHYAD0
26
H
L
Off
On
Act
—
Toggle
Speed LED Output. Latched as SPEED (Register 0, bit 13) during
power-up/ reset. See Table 2-2 for details. Active low.
LED1/SPD100/
nFEF
Speed
10BT
Pin State
LED Definition
27
28
29
IPU/O
IPU/O
IPU/O
H
L
Off
On
100BT
Full-duplex LED Output. Latched as DUPLEX (register 0h, bit 8)
during power-up/ reset. See “Table 2-2 for details. Active low.
Duplex
Half
Pin State
LED Definition
LED2
H
L
Off
On
Full
Collision LED Output. Latched as ANEG_EN (register 0h, bit 12)
during power-up/ reset. See Table 2-2 for details.
Collision
No Collision
Collision
Pin State
LED Definition
LED3/NWAYEN
H
L
Off
On
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KSZ8721BL/SL
TABLE 2-1:
PIN DESCRIPTION (CONTINUED)
Pin
Number
Type
(Note 2-1)
Pin Name
Description
30
31
PD#
IPU
P
Power Down. 1 = Normal operation, 0 = Power-down. Active low.
Analog 2.5V power supply. See Section 3.23 “Circuit Design
Reference for Power Supply” section for details.
VDDRX
Receive Input. Differential receive input pins for 100FX,
100BASE-TX, or 10BASE-T.
32
33
RX–
RX+
I
I
Receive Input: Differential receive input pin for 100FX, 100BASE-
TX, or 10BASE-T.
Fiber Mode Enable/Signal Detect in Fiber Mode. If FXEN = 0, FX
mode is disable. The default is “0”. See Section 3.21 “100BT FX
Mode” for more details.
FXSD/
FXEN
34
IPD/O
35
36
37
GND
GND
REXT
GND
GND
I
Ground.
Ground.
External resistor (6.49 kW) connects to REXT and GND.
Analog 2.5V power supply. 2.5V power output of voltage regulator.
See Section 3.23 “Circuit Design Reference for Power Sup-
ply” for details.
38
VDDRCV
P
39
40
GND
TX–
GND
O
Ground.
Transmit Outputs: Differential transmit output for 100FX,
100BASE-TX, or 10BASE-T.
Transmit Outputs: Differential transmit output for 100FX,
100BASE-TX, or 10BASE-T.
41
42
TX+
O
P
Transmitter 2.5V power supply. See Section 3.23 “Circuit
Design Reference for Power Supply” for details.
VDDTX
43
44
45
GND
GND
XO
GND
GND
O
Ground.
Ground.
XTAL feedback: Used with XI for Xtal application.
Crystal Oscillator Input: Input for a crystal or an external 25 MHz
clock. If an oscillator is used, XI connects to a 3.3V tolerant oscil-
lator, and X2 is a no-connect.
46
47
XI
I
Analog PLL 2.5V power supply. See Section 3.23 “Circuit
Design Reference for Power Supply” for details.
VDDPLL
RST#
P
48
IPU
Chip Reset. Active low, minimum of 50 µs pulse is required.
Note 2-1
P = Power supply;
GND = Ground;
I = Input; O = Output; I/O = Bi-directional;
IPU/O = Input with internal pull-up during power-up/reset; output pin otherwise.
IPU = Input with internal pull-up.
IPD = Input with internal pull-down.
IPD/O = Input with internal pull-down during reset; output pin otherwise.
IPU/O = Input with internal pull-up during reset; output pin otherwise.
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KSZ8721BL/SL
Note 2-2
Speed: Low (100BASE-TX), High (10BASE-T)
Full-Duplex: Low (full-duplex), High (half-duplex)
Act: Toggle (transmit / receive activity)
Link: Low (link), High (no link)
TABLE 2-2:
Pin Number
STRAPPING OPTIONS (Note 2-1)
Pin Name
Type (Note 2-2) Pin Function
PHYAD[4:1]/
RXD[0:3]
PHY Address latched at power-up/reset. The default
PHY address is 00001.
6, 5, 4, 3
25
IPD/O
IPU/O
IPD/O
IPD/O
PHYAD0/
INT#
Enables PCS_LPBK mode at power-up/reset. PD
(default) = Disable, PU = Enable.
PCS_LPBK/
RXDV
Enables ISOLATE mode at power-up/reset. PD
(default) = Disable, PU = Enable.
9 (Note 2-3)
11 (Note 2-3)
Enables RMII mode at power-up/reset. PD (default) =
Disable, PU = Enable.
ISO/RXER
Enable RMII back-to-back mode at power-up/reset. PD
(default) = Disable,
PU = Enable.
21 (Note 2-3)
22 (Note 2-3)
RMII/COL
IPD/O
IPD/O
Enable RMII back-to-back mode at power-up/reset. PD
(default) = Disable,
PU = Enable.
RMII_BTB
CRS
Latched into Register 0h bit 13 during power-up/reset.
PD = 10Mbps, PU (default) = 100Mbps. If SPD100 is
asserted during power-up/reset, this pin is also latched
as LED1 the Speed Support in register 4h. (If FXEN is
pulled up, the latched value 0 means no Far_End
_Fault.)
SPD100/
No FEF/
27
28
IPU/O
IPU/O
Latched into Register 0h bit 8 during power-up/reset.
PD = Half-duplex, PU (default) = Full-duplex. If Duplex
is pulled up during reset, this pin is also latched as the
Duplex support in register 4h.
DUPLEX/
LED2
Nway (auto-negotiation) Enable. Latched into Register
0h bit 12 during power-up/reset. PD = Disable Auto-
Negotiation, PU (default) = Enable Auto-Negotiation.
NWAYEN/
LED3
29
30
IPU/O
IPU
Power-Down Enable. PU (default) = Normal operation,
PD = Power-Down mode.
PD#
Note 2-1
Note 2-2
Strap-in is latched during power-up or reset.
IPU = Input with internal pull-up.
IPD/O = Input with internal pull-down during reset; output pin otherwise.
IPU/O = Input with internal pull-up during reset; output pin otherwise.
See “Reference Circuit” section for pull-up/pull-down and float information.
Note 2-3
Some devices may drive MII pins that are designated as output (PHY) on power-up, resulting in
incorrect strapping values latched at reset. It is recommended that an external pull-down via 1 kΩ
resistor be used in these applications to augment the KSZ8721’s internal pull-down
2018 Microchip Technology Inc.
DS00002813A-page 9
KSZ8721BL/SL
3.0
3.1
FUNCTIONAL DESCRIPTION
100BASE-TX transmit
The 100BASE-TX transmit function performs parallel to serial conversion, NRZ-to-NRZI conversion, and MLT-3 encod-
ing and transmission. The circuitry starts with a parallel to serial conversion that converts the 25 MHz, 4-bit nibbles into
a 125 MHz serial bit stream. The incoming data is clocked in at the positive edge of the TXC signal. The serialized data
is further converted from NRZ to NRZI format, and then transmitted in MLT3 current output. The output current is set by
an external 1% 6.49 kΩ resistor for the 1:1 transformer ratio. Its typical rise/fall time of 4 ns complies with the ANSI
TP-PMD standard regarding amplitude balance, overshoot, and timing jitter. The wave-shaped 10BASE-T output driver
is also incorporated into the 100BASE-TX driver.
3.2
100BASE-TX Receive
The 100BASE-TX receive function performs adaptive equalization, DC restoration, MLT-3 to NRZI conversion, data and
clock recovery, NRZI-to-NRZ conversion, and serial-to-parallel conversion. The receiving side starts with the equaliza-
tion filter to compensate inter-symbol interference (ISI) over the twisted pair cable. Because the amplitude loss and
phase distortion are a function of the length of the cable, the equalizer has to adjust its characteristic to optimize perfor-
mance. In this design, the variable equalizer will make an initial estimation based on comparisons of incoming signal
strength against some known cable characteristics, then tunes itself for optimization. This is an ongoing process and
can self-adjust for environmental changes such as temperature variations.
The equalized signal then goes through a DC restoration and data conversion block. The DC restoration circuit is used
to compensate for the effects of base line wander and improve dynamic range. The differential data conversion circuit
converts the MLT3 format back to NRZI. The slicing threshold is also adaptive.
The clock recovery circuit extracts the 125 MHz clock from the edges of the NRZI signal. This recovered clock is then
used to convert the NRZI signal into the NRZ format. Finally, the NRZ serial data is converted to 4-bit parallel 4B nibbles.
A synchronized 25 MHz RXC is generated so that the 4B nibbles are clocked out at the negative edge of RCK25 and
is valid for the receiver at the positive edge. When no valid data is present, the clock recovery circuit is locked to the
25 MHz reference clock and both TXC and RXC clocks continue to run.
3.3
PLL Clock Synthesizer
The KSZ8721BL/SL generates 125 MHz, 25 MHz, and 20 MHz clocks for system timing. An internal crystal oscillator
circuit provides the reference clock for the synthesizer.
3.4
Scrambler/De-scrambler (100BASE-TX Only)
The purpose of the scrambler is to spread the power spectrum of the signal in order to reduce electromagnetic interfer-
ence (EMI) and baseline wander.
3.5
10BASE-T Transmit
When TXEN (transmit enable) goes high, data encoding and transmission begins. The KSZ8721BL/SL continues to
encode and transmit data as long as TXEN remains high. The data transmission ends when TXEN goes low. The last
transition occurs at the boundary of the bit cell if the last bit is zero, or at the center of the bit cell if the last bit is one.
The output driver is incorporated into the 100BASE-T driver to allow transmission with the same magnetics. They are
internally wave-shaped and pre-emphasized into outputs with typical 2.5V amplitude. The harmonic contents are at least
27dB below the fundamental when driven by all-ones, Manchester-encoded signal.
3.6
10BASE-T Receive
On the receive side, input buffer and level detecting squelch circuits are employed. A differential input receiver circuit
and a PLL performs the decoding function. The Manchester-encoded data stream is separated into clock signal and
NRZ data. A squelch circuit rejects signals with levels less than 300 mV or with short pulse widths in order to prevent
noise at the RX+ or RX– input from falsely triggering the decoder. When the input exceeds the squelch limit, the PLL
locks onto the incoming signal and the KSZ8721BL/SL decodes a data frame. This activates the carrier sense (CRS)
and RXDV signals and makes the receive data (RXD) available. The receive clock is maintained active during idle peri-
ods in between data reception.
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KSZ8721BL/SL
3.7
SQE and Jabber Function (10BASE-T Only)
In 10BASE-T operation, a short pulse is put out on the COL pin after each packet is transmitted. This is required as a
test of the 10BASE-T transmit/receive path and is called an SQE test. The 10BASE-T transmitter is disabled and COL
goes high if TXEN is high for more than 20 ms (jabbering). If TXEN then goes low for more than 250 ms, the
10BASE-T transmitter is re-enabled and COL goes low.
3.8
Auto-Negotiation
The KSZ8721BL/SL performs auto-negotiation by hardware strapping option (pin 29) or software (Register 0.12). It
automatically chooses its mode of operation by advertising its abilities and comparing them with those received from its
link partner whenever auto-negotiation is enabled. It can also be configured to advertise 100BASE-TX or 10BASE-T in
either full-duplex or half-duplex mode (please refer to ). Auto-negotiation is disabled in the FX mode.
During auto-negotiation, the contents of Register 4, coded in fast link pulse (FLP), are sent to its link partner under the
conditions of power-on, link-loss, or restart. At the same time, the KSZ8721BL/SL monitors incoming data to determine
its mode of operation. The parallel detection circuit is enabled as soon as either 10BASE-T normal link pulse (NLP) or
100BASE-TX idle is detected. The operation mode is configured based on the following priority:
• Priority 1: 100BASE-TX, full-duplex
• Priority 2: 100BASE-TX, full-duplex
• Priority 3: 100BASE-TX, full-duplex
• Priority 4: 10BASE-T, half-duplex
When the KSZ8721BL/SL receives a burst of FLP from its link partner with three identical link code words (ignoring
acknowledge bit), it will store these code words in Register 5 and wait for the next three identical code words. Once the
KSZ8721BL/SL detects the second code words, it then configures itself according to the above-mentioned priority. In
addition, the KSZ8721BL/SL also checks for 100BASE-TX idle or 10BASE-T NLP symbols. If either is detected, the
KSZ8721BL/SL automatically configures to match the detected operating speed.
• A physical connection including a data line (MDIO), a clock line (MDC), and an optional interrupt line (INTRPT).
• A specific protocol that runs across the above mentioned physical connection that allows one controller to commu-
nicate with multiple KSZ8721BL/SL devices. Each KSZ8721BL/SL is assigned an MII address between 0 and 31
by the PHYAD inputs.
• An internal addressable set of fourteen 16-bit MDIO registers. Registers [0:6] are required and their functions are
specified by the IEEE 802.3 specifications. Additional registers are provided for expanded functionality.
The INTPRT pin functions as a management data interrupt in the MII. An active low or high in this pin indicates a status
change on the KSZ8721BL/SL based on 1fh.9 level control. Register bits at 1bh[15:8] are the interrupt enable bits. Reg-
ister bits at 1bh[7:0] are the interrupt condition bits. This interrupt is cleared by reading Register 1bh.
3.9
MII Data Interface
The data interface consists of separate channels for transmitting data from a 10/100 802.3-compliant Media Access
Controller (MAC) to the KSZ8721BL/SL, and for receiving data from the line. Normal data transmission is implemented
in 4B nibble mode (4-bit wide nibbles).
3.9.1
TRANSMIT CLOCK (TXC)
The transmit clock is normally generated by the KSZ8721BL/SL from an external 25 MHz reference source at the X1
input. The transmit data and control signals must always be synchronized to the TXC by the MAC. The KSZ8721BL/SL
normally samples these signals on the rising edge of the TXC.
3.9.2
RECEIVE CLOCK (RXC)
For 100BASE-TX links, the receive clock is continuously recovered from the line. If the link goes down, and auto-nego-
tiation is disabled, the receive clock operates off the master input clock (X1 or TXC). For 10BASE-T links, the receive
clock is recovered from the line while carrier is active, and operates from the master input clock when the line is idle.
The KSZ8721BL/SL synchronizes the receive data and control signals on the falling edge of RXC in order to stabilize
the signals at the rising edge of the clock with 10 ns setup and hold times.
3.9.3
TRANSMIT ENABLE
The MAC must assert TXEN at the same time as the first nibble of the preamble, and deassert TXEN after the last bit
of the packet.
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KSZ8721BL/SL
3.9.4
RECEIVE DATA VALID
The KSZ8721BL/SL asserts RXDV when it receives a valid packet. Line operating speed and MII mode will determine
timing changes in the following way:
• For 100BASE-TX links with the MII in 4B mode, RXDV is asserted from the first nibble of the preamble to the last
nibble of the data packet.
• For 10BASE-T links, the entire preamble is truncated. RXDV is asserted with the first nibble of the SFD “5D” and
remains asserted until the end of the packet.
3.9.5
ERROR SIGNALS
Whenever the KSZ8721BL/SL receives an error symbol from the network, it asserts RXER and drives “1110” (4B) on
the RXD pins. When the MAC asserts TXER, the KSZ8721BL/SL will drive “H” symbols (a Transmit Error defined in the
IEEE 802.3 4B/5B code group) out on the line to force signaling errors.
3.9.6
CARRIER SENSE (CRS)
For 100BASE-TX links, a start-of-stream delimiter, or /J/K symbol pair causes assertion of Carrier Sense (CRS). An end-
of-stream delimiter, or /T/R symbol pair, causes deassertion of CRS. The PMA layer will also de-assert CRS if IDLE
symbols are received without /T/R, yet in this case RXER will be asserted for one clock cycle when CRS is deasserted.
For 10BASE-T links, CRS assertion is based on reception of valid preamble, and deassertion on reception of an end-
of-frame (EOF) marker.
3.9.7
COLLISION
Whenever the line state is half-duplex and the transmitter and receiver are active at the same time, the KSZ8721BL/SL
asserts its collision signal, which is asynchronous to any clock.
3.10 RMII (Reduced MII) Data Interface
RMII interface specifies a low pin count, Reduced Media Independent Interface (RMII) intended for use between
Ethernet PHYs and Switch or Repeater ASICs. It is fully compliant with IEEE 802.3u [2].
This interface has the following characteristics:
• It is capable of supporting 10 Mbps and 100 Mbps data rates.
• A single clock reference is sourced from the MAC to PHY (or from an external source).
• It provides independent 2-bit wide (di-bit) transmit and receive data paths.
• It uses TTL signal levels compatible with common digital CMOS ASIC processes.
TABLE 3-1:
RMII SIGNAL DEFINITION
Direction
Direction
(w/respect to the MAC)
Signal Name
Use
(w/respect to the PHY)
Synchronous clock reference
for receive, transmit and con-
trol interface
REF_CLK
Input
Input or Output
Carrier Sense/Receive Data
Valid
CRS_DV
Output
Input
RXD[1:0]
TX_EN
Output
Input
Input
Output
Output
Input
Receive Data
Transmit Enable
Transmit Data
Receive Error
TXD[1:0]
RX_ER
Input
Output
3.11 Reference Clock (REF_CLK)
REF_CLK is a continuous 50 MHz clock that provides the timing reference for CRS_DV, RXD[1:0], TX_EN, TXD[1:0],
and RX_E. REF_CLK is sourced by the MAC or an external source. Switch implementations may choose to provide
REF_CLK as an input or an output depending on whether they provide a REF_CLK output or rely on an external clock
distribution device. Each PHY device must have an input corresponding to this clock but may use a single clock input
for multiple PHYs implemented on a single IC.
DS00002813A-page 12
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KSZ8721BL/SL
3.12 Carrier Sense/Receive Data Valid (CRS_DV)
CRS_DV is asserted asynchronously on detection of carrier due to the criteria relevant to the operating mode. That is,
in 10BASE-T mode, when squelch is passed or in 100BASE-X mode when two noncontiguous zeroes in 10 bits are
detected, the carrier is detected.
Loss-of-carrier results in the deassertion of CRS_DV synchronous to REF_CLK. As carrier criteria are met, CRS_DV
remains continuously asserted from the first recovered di-bit of the frame through the final recovered di-bit and is
negated prior to the first REF_CLK that follows the final di-bit.
The data on RXD[1:0] is considered valid once CRS_DV is asserted. However, because the assertion of CRS_DV is
asynchronous relative to REF_CLK, the data on RXD[1:0] remains as “00” until proper receive signal decoding takes
place (see Section 3.13, Receive Data [1:0] (RXD[1:0])).
3.13 Receive Data [1:0] (RXD[1:0])
RXD[1:0] transitions synchronously to REF_CLK. For each clock period in which CRS_DV is asserted, RXD[1:0] trans-
fers two bits of recovered data from the PHY. In some cases (e.g., before data recovery or during error conditions), a
predetermined value for RXD[1:0] is transferred instead of recovered data. RXD[1:0] remains as “00” to indicate idle
when CRS_DV is deasserted. Values of RXD[1:0] other than “00” when CRS_DV is deasserted are reserved for out-of-
band signaling (to be defined). Values other than “00” on RXD[1:0] while CRS_DV is deasserted are ignored by the
MAC/repeater. Upon assertion of CRS_DV, the PHY ensures that RXD[1:0]=00 until proper receive decoding takes
place.
3.14 Transmit Enable (TX_EN)
Transmit Enable TX_EN indicates that the MAC is presenting di-bits on TXD[1:0] on the RMII for transmission. TX_EN
is asserted synchronously with the first nibble of the preamble and remains asserted while all transmitted di-bits are
presented to the RMII. TX_EN is negated prior to the first REF_CLK following the final di-bit of a frame. TX_EN transi-
tions synchronously with respect to REF_CLK.
3.15 Transmit Data [1:0] (TXD[1:0])
Transmit Data TXD[1:0] transitions synchronously with respect to REF_CLK. When TX_EN is asserted, TXD[1:0] are
accepted for transmission by the PHY. TXD[1:0] remains as “00” to indicate idle when TX_EN is deasserted. Values of
TXD[1:0] other than “00” when TX_EN is deasserted are reserved for out-of-band signaling (to be defined). Values other
than “00” on TXD[1:0] while TX_EN is deasserted are ignored by the PHY.
3.16 Collision Detection
Because the definition of CRS_DV and TX_EN both contain an accurate indication of the start of frame, the MAC reliably
regenerates the COL signal of the MII by ANDing TX_EN and CRS_DV.
During the IPG time following the successful transmission of a frame, the COL signal is asserted by some transceivers
as a self-test. The Signal Quality Error (SQE) function is not supported by the reduced MII due to the lack of the COL
signal. Historically, SQE was present to indicate that a transceiver located physically remote from the MAC was func-
tioning. Because the reduced MII only supports chip-to-chip connections on a PCB, SQE functionality is not required.
3.17 RX_ER
The PHY provides RX_ER as an output according to the rules specified in IEEE 802.3u [2] (see Clause 24, Figure 24-
11– Receive State Diagram). RX_ER is asserted for one or more REF_CLK periods to indicate that an error (e.g., a
coding error or any error that a PHY is capable of detecting, and that may otherwise be undetectable by the MAC sub-
layer) is detected somewhere in the frame presently being transferred from the PHY. RX_ER transitions synchronously
with respect to REF_CLK. While CRS_DV is deasserted, RX_ER has no effect on the MAC.
TABLE 3-2:
Symbol
RMII AC CHARACTERISTICS
Parameter
Min.
Typ.
Max.
Units
—
—
REF_CLK Frequency
REF_CLK Duty Cycle
—
50
—
—
MHz
%
35
65
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KSZ8721BL/SL
TABLE 3-2:
Symbol
tSU
RMII AC CHARACTERISTICS
Parameter
Min.
Typ.
Max.
Units
TXD[1:0], TX_EN, RXD[1:0], CRS_DV, RXER
4
—
—
ns
TXD[1:0], TX_EN, RXD[1:0], CRS_DV, RXER
Data Hold from REF_CLKRising Edge
tH
2
—
—
ns
3.18 Unused RMII Pins
Input Pins
TXD[2:3] and TXER are pull-down to GND
Output Pins RXD[2:3] and RXC are no connect.
Note that the RMII pin needs to be pulled up to enable RMII mode.
3.19 Auto-Crossover (Auto-MDI/MDI-X)
Automatic MDI/MDI-X configuration is intended to eliminate the need for crossover cables between similar devices. The
assignment of pinouts for a 10/100 BASE-T crossover function cable is shown below.
This feature eliminates the confusion in applications by allowing the use of both straight and crossover cables. This fea-
ture is controlled by register 1f:13. See Table 4-13 for details.
FIGURE 3-1:
STRAIGHT THROUGH CABLE
10/100 Ethernet
Media Dependent Interface
10/100 Ethernet
Media Dependent Interface
1
1
Transmit Pair
2
Receive Pair
2
Straight
Cable
3
4
5
6
7
8
3
4
Receive Pair
Transmit Pair
5
6
7
8
Modular Connector
(RJ-45)
Modular Connector
(RJ-45)
NIC
HUB
(Repeater or Switch)
DS00002813A-page 14
2018 Microchip Technology Inc.
KSZ8721BL/SL
FIGURE 3-2:
CROSSOVER CABLE
10/100 Ethernet
Media Dependent Interface
10/100 Ethernet
Media Dependent Interface
1
1
Crossover
Cable
Receive Pair
2
Receive Pair
2
3
3
4
4
Transmit Pair
5
Transmit Pair
5
6
7
8
6
7
8
Modular Connector (RJ-45)
HUB
Modular Connector (RJ-45)
HUB
(Repeater or Switch)
(Repeater or Switch)
3.20 Power Management
The KSZ8721BL/SL offers the following modes for power management:
• Power-Down Mode: This mode can be achieved by writing to Register 0.11 or pulling pin 30 PD# low.
• Power-Saving Mode: This mode can be disabled by writing to Register 1fh.10. The KSZ8721BL/SL turns off
everything except for the Energy Detect and PLL circuits when the cable is not installed. In other words, the
KSZ8721BL/SL shuts down most of the internal circuits to save power if there is no link. Power-saving mode is in
the most effective state when auto-negotiation mode is enabled.
3.21 100BT FX Mode
Please contact your local field application engineer (FAE) for a reference schematic on fiber connection.
100BT FX mode is activated when FXSD/FXEN is higher than 0.6V (this pin has a default pull down). Under this mode,
the auto-negotiation and auto-MDI-X features are disabled.
In fiber operation, the FXSD pin should connect to the signal detect (SD) output of the fiber module. The internal thresh-
old of FXSD is around 1/2 VDD ±50 mV (1.25V ±0.05V). Above this level, the fiber signal is considered detected.
The operation is summarized in Table 3-3:
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KSZ8721BL/SL
TABLE 3-3:
100BT FX MODE
FXSD/FXEN
Condition
Less than 0.6V
100TX mode
FX mode
No signal detected
FEF generated
Less than 1.25V,
but greater than 0.6V
FX mode
Signal detected
Greater than 1.25
To ensure proper operation, the swing of fiber module SD should cover the threshold variation. Aresistive voltage divider
is recommended to adjust the SD voltage range.
Far End Fault (FEF), repetition of a special pattern which consists of 84-one and 1-zero, is generated under “FX mode
with no signal detected.” The purpose of FEF is to notify the sender of a faulty link. When receiving an FEF, the LINK
will go down to indicate a fault, even with fiber signal detected. The transmitter is not affected by receiving an FEF and
still sends out its normal transmit pattern from MAC. FEF can be disabled by strapping pin 27 low. Refer to Table 2-2.
3.22 Media Converter Operation
The KSZ8721BL/SL is capable of performing media conversion with two parts in a back-to-back RMII loop-back mode
as indicated in the diagram. Both parts are in RMII mode and with RMII BTB asserted (pins 21 and 22 strapped high).
One part is operating in TX mode and the other is operating in FX mode. Both parts can share a common 50 MHz oscil-
lator.
Under this operation, auto-negotiation on the TX side prohibits 10BASE-T link-up. Additional options can be
implemented under this operation. Disable the transmitter and set it at tri-state by controlling the high TXD2 pin. In order
to do this, RXD2 and TXD2 pins need to be connected via inverter. When TXD2 pin is high in both the copper and fiber
operation, it is disabled transmit. Meanwhile, the RXD2 pin on the copper side serves as the energy detect and can
indicate if a line signal is detected. TXD3 should be tied low and RXD3 let float.
FIGURE 3-3:
FIBER MODULE
VCC
21 22
Pin
+/-
Rx
RxD
KS8721BL/SL
TxD
Tx +/-
FTx
TxC/
Ref_CLK
OSC
50MHz
TxC/
Ref_CLK
TxD
RxD
KS8721BL/SL
(Fiber Mode)
FR
x
Pin
34
Pin
21 22
To the SD pin of the
Fiber Module
VCC
DS00002813A-page 16
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KSZ8721BL/SL
3.23 Circuit Design Reference for Power Supply
Microchip’s integrated built-in, voltage regulator technology and thoughtful implementation allows the user to save BOM
cost on both existing and future designs with the use of the new KSZ8721BL/SL single supply, single port 10/100 Ether-
net PHY.
FIGURE 3-4:
CIRCUIT DESIGN
The circuit design in Figure 7-1 shows the power connections for the power supply: the 3.3V to VDDI/O is the only input
power source and the 2.5V at VDDRCV, pin 38, is the output of the voltage regulator that needs to supply through the
rest of the 2.5V VDD pins via the 2.5V power plane.
The 2.5V VDD pins make the drop-in replacement with the existing KSZ8721B/BT part. Table 3-4 shows the drop-in
replacement from the existing KSZ8721B/BT to the KSZ8721SL/BL. Please contact your local Microchip FAE for
Application Note AN-117, “Drop-in Replacement with KSZ8721BT.”
TABLE 3-4:
DROP-IN REPLACEMENT
2.5V/3.3V Supply
3.3V Supply with Built-in Regulator
Part Number
KSZ8721B
Package
Part Number
Package
48-SSOP
48-TQFP
48-SSOP
KSZ8721SL
KSZ8721BL
KSZ8721SLI
48-SSOP
48-LQFP
48-SSOP
KSZ8721BT
KSZ8721BI
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KSZ8721BL/SL
Notes:
DS00002813A-page 18
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KSZ8721BL/SL
4.0
REGISTER MAP
TABLE 4-1:
REGISTER DESCRIPTION
Register Number
Description
0h
1h
Basic Control Register
Basic Status Register
2h
PHY Identifier I
3h
PHY Identifier II
4h
Auto-Negotiation Advertisement Register
Auto-Negotiation Link Partner Ability Register
Auto-Negotiation Expansion Register
Auto-Negotiation Next Page Register
Link Partner Next Page Ability
RXER Counter Register
5h
6h
7h
8h
15h
1 bh
1 fh
Interrupt Control/Status Register
100BASE-TX PHY Control Register
TABLE 4-2:
REGISTER 0H - BASIC CONTROL
Bit
Name
Description
Default
Reference
0.15
Reset
1 = Software reset. Bit is self-clearing
RW/SC
0
1 = Loop-back mode
0 = Normal operation
0.14
Loop-Back
RW
0
1 = 100 Mbps
0 = 10 Mbps
Ignored if Auto-Negotiation is enabled (0.12 = 1)
Set by
SPD100
0.13
Speed Select (LSB)
RW
1 = Enable auto-negotiation process
(override 0.13 and 0.8)
0 = Disable auto-negotiation process
Set by
NWAYEN
0.12
0.11
0.10
Auto-Negotiation Enable
Power Down
RW
RW
RW
1 = Power-down mode
0 = Normal operation
0
1 = Electrical isolation of PHY from MII and TX+/
TX–
Isolate
Set by ISO
0 = Normal operation
1 = Restart auto-negotiation process
0 = Normal operation. Bit is self-clearing
0.9
0.8
Restart Auto-Negotiation
Duplex Mode
RW/SC
RW
0
1 = Full-duplex
0 = Half-duplex
Set by
DUPLEX
1 = Enable COL test
0 = Disable COL test
0.7
0.6:1
0.0
Collision Test
Reserved
RW
RO
RW
0
0
0
—
Disable
Transmitter
0 = Enable transmitter
1 = Disable transmitter
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KSZ8721BL/SL
TABLE 4-3:
REGISTER 1H - BASIC STATUS
Bit
Name
100BASE-T4
Description
Default
Reference
1 = T4 capable
0 = Not T4 capable
1.15
RO
0
100BASE-TX Full-Duplex 1 = Capable of 100BASE-X full-duplex
0 = Not capable of 100BASE-X full-duplex
1.14
1.13
1.12
1.11
RO
RO
RO
RO
1
1
1
1
100BASE-TX Half-Duplex 1 = Capable of 100BASE-X half-duplex
0 = Not capable of 100BASE-X half-duplex
10BASE-T Full-Duplex
1 = 10 Mbps with full-duplex
0 = No 10 Mbps with full-duplex capability
10BASE-T Half-Duplex
1 = 10 Mbps with half-duplex
0 = No 10 Mbps with half-duplex capability
1.10:7 Reserved
—
RO
RO
0
1
1.6
1.5
1.4
1.3
1.2
1.1
1.0
No Preamble
1 = Preamble suppression
0 = Normal preamble
Auto-Negotiation Complete 1 = Auto-negotiation process completed
0 = Auto-negotiation process not completed
RO
0
Remote Fault
1 = Remote fault
0 = No remote fault
RO/LH
RO
0
1
Auto-Negotiation Ability
Link Status
1 = Capable to perform auto-negotiation
0 = Unable to perform auto-negotiation
1 = Link is up
0 = Link is down
RO/LL
RO/LH
RO
0
0
1
Jabber Detect
1 = Jabber detected
0 = Jabber not detected. Default is low
Extended Capability
1 = Supports extended capabilities registers
TABLE 4-4:
REGISTER 2H - PHY IDENTIFIER 1
Bit
Name
Description
Default
Reference
Assigned to the 3rd through 18th bits of the organi-
2.15:0 PHY ID Number
zationally unique identifier (OUI). Microchip’s OUI RO
is 0010A1 (hex).
0022h
TABLE 4-5:
REGISTER 3H - PHY IDENTIFIER 2
Bit
Name
Description
Default
Reference
Assigned to the 19th through 24th bits of the orga-
nizationally unique identifier (OUI). Microchip’s
OUI is 0010A1 (hex).
3.15:0 PHY ID Number
RO
000101
3.9:4
3.3:0
Model Number
Six bit manufacturer’s model number
Four bit manufacturer’s model number
RO
RO
100001
1001
Revision Number
TABLE 4-6:
REGISTER 4H - AUTO-NEGOTIATION ADVERTISEMENT
Bit
Name
Description
Default
Reference
1 = Next page capable
0 = No next page capability
4.15
4.14
4.13
Next page
RW
RO
RW
RO
0
0
0
0
Reserved
—
1 = Remote fault supported
0 = No remote fault
Remote Fault
4.12:11 Reserved
—
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KSZ8721BL/SL
TABLE 4-6:
REGISTER 4H - AUTO-NEGOTIATION ADVERTISEMENT (CONTINUED)
Bit
Name
Description
Default
Reference
1 = Pause function supported
0 = No pause function
4.10
Pause
RW
0
1 = T4 capable
0 = No T4 capability
4.9
4.8
100BASE-T4
RO
0
Set by
SPD100 &
DUPLEX
1 = TX with full-duplex
0 = No TX full-duplex capability
100BASE-TX Full-Duplex
RW
1 = TX capable
0 = No TX capability
Set by
SPD100
4.7
4.6
100BASE-TX
RW
RW
RW
RW
1 = 10 Mbps with full-duplex
0 = No 10 Mbps full-duplex capability
Set by
DUPLEX
10BASE-T Full-Duplex
10BASE-T
1 = 10 Mbps capable
0 = No 10 Mbps capability
4.5
1
1 = 10 Mbps capable
0 = No 10 Mbps capability
4.4:0
Selector Field
00001
TABLE 4-7:
REGISTER 5H - AUTO-NEGOTIATION LINK PARTNER ABILITY
Bit
Name
Description
Default
Reference
1 = Next page capable
0 = No next page capability
5.15
Next page
RO
0
1 = Link code word received from partner
0 = Link code word not yet received
5.14
Acknowledge
RO
0
5.13
5.12
Remote Fault
Reserved
1 = Remote fault detected; 0 = no remote fault
RO
RO
0
0
—
5.10 5.11
0
0
No PAUSE
0
1
5.11:10 Pause
Asymmetric PAUSE (link partner)
RO
0
1
0
Symmetric PAUSE
1
1
Symmetric & Asymmetric PAUSE (local device)
1 = T4 capable
0 = No T4 capability
5.9
5.8
5.7
5.6
100 BASE-T4
RO
RO
RO
RO
0
0
0
0
1 = TX with full-duplex
0 = No TX full-duplex capability
100BASE-TX Full-Duplex
100BASE-TX
1 = TX capable
0 = No TX capability
1 = 10 Mbps with full-duplex
0 = No 10 Mbps full-duplex capability
10BASE-T Full-Duplex
1 = 10 Mbps capable
0 = No 10 Mbps capability
5.5
10BASE-T
RO
RO
0
5.4:0
Selector Field
[00001] = IEEE 802.3
00001
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TABLE 4-8:
REGISTER 6H - AUTO-NEGOTIATION EXPANSION
Bit
Name
Description
Default
Reference
6.15:5 Reserved
—
RO
0
1 = Fault detected by parallel detection
0 = No fault detected by parallel detection
6.4
6.3
6.2
6.1
Parallel Detection Fault
RO/LH
RO
0
0
1
0
Link Partner Next Page
Able
1 = Link partner has next page capability
0 = Link partner does not have next page capability
1 = Local device has next page capability
0 = Local device does not have next page capability
Next Page Able
Page Received
RO
1 = New page received
0 = New page not yet received
RO/LH
1 = Link partner has auto-negotiation capability
0 = Link partner does not have auto-negotiation
capability
Link Partner
Auto-Negotiation Able
6.0
RO
0
TABLE 4-9:
REGISTER 7H - AUTO-NEGOTIATION NEXT PAGE
Bit
Name
Description
Default
Reference
1 = Additional next page(s) will follow
0 = Last page
7.15
7.14
7.13
Next Page
RW
RP
0
0
1
Reserved
—
1 = Message page
0 = Unformatted page
Message Page
RW
1 = Will comply with message
0 = Cannot comply with message
7.12
7.11
Acknowledge 2
Toggle
RW
0
1 = Previous value of the transmitted link code
word equaled logic One
RO
0
0 = Logic Zero
7.10:0 Message Field
11-bit wide field to encode 2048 messages
RW
001
TABLE 4-10: REGISTER 8H - LINK PARTNER NEXT PAGE ABILITY
Bit
Name
Description
Default
Reference
1 = Additional next page(s) will follow
0 = Last page
8.15
Next Page
RO
0
1 = Successful receipt of link word
0 = No successful receipt of link word
8.14
8.13
8.12
Acknowledge
Message Page
Acknowledge 2
RO
RO
RO
0
0
0
1 = Message Page
0 = Unformatted page
1 = Able to act on the information
0 = Not able to act on the information
1 = Previous value of transmitted link code word
equal to logic zero
0 = Previous value of transmitted link code word
equal to logic one
8.11
Toggle
RO
RO
0
0
8.10:0 Message Field
—
TABLE 4-11: REGISTER 15H - RXER COUNTER
Bit Name Description
Default
Reference
15.15:0 RXER Counter
RX Error counter for the RX_ER in each package RO
000
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KSZ8721BL/SL
TABLE 4-12: REGISTER 1BH - INTERRUPT CONTROL/STATUS REGISTER
Bit
Name
Description
Default
Reference
1 = Enable jabber interrupt
0 = Disable jabber interrupt
1b.15
Jabber Interrupt Enable
RW
0
Receive Error
Interrupt Enable
1 = Enable receive error interrupt
0 = Disable receive error interrupt
1b.14
1b.13
1b.12
1b.11
1b.10
1b.9
1b.8
1b.7
1b.6
1b.5
1b.4
1b.3
1b.2
1b.1
1b.0
RW
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Page Received
Interrupt Enable
1 = Enable page received interrupt
0 = Disable page received interrupt
RW
Parallel Detect Fault
Interrupt Enable
1 = Enable parallel detect fault interrupt
0 = Disable parallel detect fault interrupt
RW
Link Partner Acknowledge 1 = Enable link partner acknowledge interrupt
Interrupt Enable
RW
0 = Disable link partner acknowledge interrupt
Link Down
Interrupt Enable
1 = Enable link down interrupt
0 = Disable link down interrupt
RW
Remote Fault
Interrupt Enable
1 = Enable remote fault interrupt
0 = Disable remote fault interrupt
RW
1 = Enable link up interrupt
0 = Disable link up interrupt
Link Up Interrupt Enable
Jabber Interrupt
RW
1 = Jabber interrupt occurred
0 = Jabber interrupt has not occurred
RO/SC
RO/SC
RO/SC
RO/SC
RO/SC
RO/SC
RO/SC
RO/SC
1 = Receive error occurred
0 = Receive error has not occurred
Receive Error Interrupt
Page Receive Interrupt
1 = Page receive occurred
0 = Page receive has not occurred
Parallel Detect
Fault Interrupt
1 = Parallel detect fault occurred
0 = Parallel detect fault has not occurred
Link Partner
Acknowledge Interrupt
1 = Link partner acknowledge occurred
0 = Link partner acknowledge has not occurred
1 = Link down occurred
0 = Link down has not occurred
Link Down Interrupt
Remote Fault Interrupt
Link Up Interrupt
1 = Remote fault occurred
0 = Remote fault has not occurred
1 = Link up interrupt occurred
0 = Link up interrupt has not occurred
2018 Microchip Technology Inc.
DS00002813A-page 23
KSZ8721BL/SL
TABLE 4-13: REGISTER 1FH - 100BASE-TX PHY CONTROLLER
Bit
Name
Description
Default
Reference
1f.15:14 Reserved
—
RO
0
1 = Disable MDI/MDI-X
0 = Enable MDI/MDI-X
1f.13
1f.12
Pairswap Disable
RW
RO
0
0
1 = Presence of signal on RX+/RX– analog wire pair
0 = No signal detected on RX+/RX–
Energy Detect
Force Link
1 = Force link pass
0 = Normal link operation
This bit bypasses the control logic and allow trans-
mitter to send pattern even if there is no link.
1f.11
RW
0
1 = Enable power-saving
0 = Disable
1f.10
1f.9
1f.8
1f.7
1f.6
1f.5
Power Saving
Interrupt Level
Enable Jabber
RW
RW
RW
RW
RO
RO
1
0
1
0
0
0
1 = Interrupt pin active high
0 = Active low
1 = Enable jabber counter
0 = Disable
Auto-Negotiation
Complete
1 = Auto-negotiation complete
0 = Not complete
Enable Pause
(Flow-Control Result)
1 = Flow control capable
0 = No flow control
1 = PHY in isolate mode
0 = Not isolated
PHY Isolate
[000] = Still in auto-negotiation
[001] = 10BASE-T half-duplex
[010] = 100BASE-TX half-duplex
[011] = Reserved
[101] = 10BASE-T full-duplex
[110] = 100BASE-TX full-duplex
[111] = PHY/MII isolate
Operation Mode
Indication
1f.4:2
RO
0
1 = Enable SQE test
0 = Disable
1f.1
1f.0
Enable SQE Test
RW
RW
0
0
1 = Disable scrambler
0 = Enable
Disable Data Scrambling
Note 4-1
RW = Read/Write
RO = Read Only
SC = Self Clear
LH = Latch High
LL = Latch Low
Some of the default values are set by strap-in. See Table 2-2.
DS00002813A-page 24
2018 Microchip Technology Inc.
KSZ8721BL/SL
5.0
5.1
OPERATIONAL CHARACTERISTICS
Absolute Maximum Ratings*
Storage Temperature (TS)...................................................................................................................... –55°C to +150°C
Supply Referenced to GND ...................................................................................................................... –0.5V to +4.0V
All Pins ...................................................................................................................................................... –0.5V to +4.0V
*Exceeding the absolute maximum rating may damage the device. Stresses greater than the absolute maximum rating
may cause permanent damage to the device. Operation of the device at these or any other conditions above those spec-
ified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect
reliability.
5.2
Operating Ratings**
Supply Voltage
(VDD_PLL, VDD_TX, VDD_RXC, VDD_RCV, VDDC).........................................................................................................+2.5V
(VDDIO).....................................................................................................................................................................+3.3V
Ambient Temperature (TA)
Commercial..................................................................................................................................................0°C to +70°C
Industrial .................................................................................................................................................. –40°C to +85°C
Package Thermal Resistance (Note 5-1)
LQFP (θJA) No Airflow....................................................................................................................................+83.56°C/W
SSOP (θJA) No Airflow ...................................................................................................................................+75.19°C/W
**The device is not guaranteed to function outside its operating ratings. Unused inputs must always be tied to an appro-
priate logic voltage level (GROUND to VDD_IO).
Note 5-1
No (HS) heat spreader in this package.
2018 Microchip Technology Inc.
DS00002813A-page 25
KSZ8721BL/SL
6.0
ELECTRICAL CHARACTERISTICS
TABLE 6-1:
ELECTRICAL CHARACTERISTICS (Note 6-1)
VDD = 3.3V ±10%
Parameters
Symbol
Min.
Typ.
Max.
Units Conditions
Total Supply Current (Including TX Output Driver Current) (Note 6-2)
Normal 100BASE-TX
IDD1
IDD2
—
—
116
151
—
—
mA Including 43 mA output current
Normal 100BASE-TX
(Independent of utilization)
Including 103 mA output
mA
current
Power Saving Mode 1
Power Down Mode
TTL Inputs
IDD3
IDD5
—
—
47
4
—
—
mA Auto-negotiation is enable
mA
—
1/2VDD(I/O)
+0.2
Input High Voltage
VIH
—
—
V
—
Input Low Voltage
Input Current
VIL
IIN
—
—
—
0.8
10
V
—
–10
µA
VIN = GND ~ VDDIO
TTL Outputs
1/2VDD(I/O)
+0.6
Output High Voltage
VOH
—
—
V
IOH = –4mA
Output Low Voltage
VOL
IOZ
—
—
—
—
0.4
10
V
IOL = 4mA
—
Output Tri-state Leakage
100Base-TX Receive
µA
RX+/RX– Differential Input
Resistance
—
—
8
—
kΩ
ns
—
RIN
Propagation Delay
50
110
From magnetics to RDTX
10Base-TX Transmit (Measured Differentially After 1:1 Transformer)
Peak Differential Output
Voltage
VO
0.95
—
1.05
V
50Ω from each output to VDD
Output Voltage Imbalance
Rise/Fall Time
VIMB
—
3
—
—
2
5
%
ns
50Ω from each output to VDD
—
Rise/Fall Time Imbalance
Duty Cycle Distortion
Overshoot
0
—
0.5
±0.5
5
ns
—
tr, tf
—
—
—
—
—
—
ns
—
—
%
—
Reference Voltage of ISET
Propagation Delay
Jitters
0.75
45
—
V
—
VSET
60
1.4
ns
From TDTX to magentics
—
0.7
ns(PP)
10Base-TX Receive
RX+/RX– Differential Input
Resistance
RIN
—
—
8
—
—
kW
—
Squelch Threshold
VSQ
400
mV 5 MHz square wave
100Base-TX Transmit (Measured Differentially After 1:1 Transformer)
Peak Differential Output
Voltage
2.2
—
2.8
V
50Ω from each output to VDD
VP
Jitters Added
—
—
—
±3.5
—
ns
ns
50Ω from each output to VDD
—
Rise/Fall Time
Clock Outputs
Crystal Oscillator
Receive Clock, 100TX
tr, tf
25
X1, X2
—
—
25
25
—
—
MHz
MHz
—
—
RXC100
DS00002813A-page 26
2018 Microchip Technology Inc.
KSZ8721BL/SL
TABLE 6-1:
ELECTRICAL CHARACTERISTICS (Note 6-1) (CONTINUED)
VDD = 3.3V ±10%
Parameters
Symbol
Min.
Typ.
Max.
Units Conditions
MHz
ns(pp) —
Receive Clock, 10T
Receive Clock Jitters
Transmit Clock, 100TX
Transmit Clock, 10T
Transmit Clock Jitters
—
—
—
—
—
2.5
3.0
25
—
—
—
—
—
—
RXC10
TXC100
TXC10
MHz
MHz
—
—
2.5
1.8
ns(pp) —
Note 6-1
Note 6-2
TA = 25°C. Specification for packaged product only.
There is 100% data transmission in full-duplex mode and a minimum IPG with a 130 meter cable.
2018 Microchip Technology Inc.
DS00002813A-page 27
KSZ8721BL/SL
7.0
7.1
TIMING SPECIFICATIONS
10BASE-T MII Transmit Timing
FIGURE 7-1:
10BASE-T MII TRANSMIT TIMING
TXC
tHD2
tHD1
tSU2
TXEN
TXD[3:0]
CRS
tSU1
tCRS1
tCRS2
Valid
Data
TXP/TXM
tLAT
SQE Timing
TXC
TXEN
COL
tSQE
tSQEP
TABLE 7-1:
Parameter
10BASE-T MII TRANSMIT TIMING PARAMETERS
Symbol
Min.
Typ.
Max.
Units
TXD [3:0] Set-Up to TXC High
tSU1
tSU2
10
10
0
—
—
—
—
4
—
—
—
—
—
—
—
—
—
ns
TXEN Set-Up to TXC High
ns
TXD [3:0] Hold After TXC High
tHD1
ns
TXEN Hold After TXC High
tHD2
0
ns
TXEN High to CRS Asserted Latency
TXEN Low to CRS De-Asserted Latency
TXEN High to TXP/TXM Output (TX Latency)
COL (SQE) Delay After TXEN De-Asserted
COL (SQE) Pulse Duration
tCRS1
tCRS2
tLAT
—
—
—
—
—
BT (Note 7-1)
8
BT
BT
µs
µs
4
tSQE
tSQEP
2.5
1.0
Note 7-1
1BT = 10 ns at 10BASE-TX.
DS00002813A-page 28
2018 Microchip Technology Inc.
KSZ8721BL/SL
7.2
100BASE-T MII Transmit Timing
FIGURE 7-2:
100BASE-T MII TRANSMIT TIMING
TXC
tHD2
tSU2
TXEN
tHD1
tSU1
TXD[3:0],
TXER
Data
In
tCRS2
tCRS1
tLAT
CRS
Symbol
Out
TX+/TX-
TABLE 7-2:
Parameter
100BASE-T MII TRANSMIT TIMING PARAMETERS
Symbol
Min.
Typ.
Max.
Units
TXD [3:0] Set-Up to TXC High
TXEN Set-Up to TXC High
tSU1
tSU2
tHD1
tHD2
tHD3
tCRS1
tCRS2
tLAT
10
10
0
—
—
—
—
—
4
—
—
—
—
—
—
—
—
ns
ns
TXD [3:0] Hold After TXC High
TXER Hold After TXC High
ns
0
ns
TXEN Hold After TXC High
0
ns
BT (Note 7-1)
BT
TXEN High to CRS Asserted Latency
TXEN Low to CRS De-Asserted Latency
TXEN High to TXP/TXM Output (TX Latency)
—
—
—
4
9
BT
Note 7-1
1BT = 10 ns at 100BASE-TX
2018 Microchip Technology Inc.
DS00002813A-page 29
KSZ8721BL/SL
7.3
100BASE-T MII Receive Timing
FIGURE 7-3:
100BASE-T MII RECEIVE TIMING
Start of
Stream
End of
Stream
RX+/RX-
tCRS1
CRS
tCRS2
RXDV
tRLAT
tHD
RXD[3:0]
RXER
tSU
tWH
RXC
tWL
tP
TABLE 7-3:
Parameter
100BASE-T MII RECEIVE TIMING PARAMETERS
Symbol
Min.
Typ.
Max.
Units
RXC Period
tP
—
20
40
—
—
20
20
6
—
—
ns
ns
ns
ns
ns
BT
ns
ns
RXC Pulse Width
RXC Pulse Width
tWL
tWH
tSU
tHD
20
—
RXD [3:0], RXER, RXDV Set-Up to Rising Edge of RXC
RXD [3:0], RXER, RXDV Hold from Rising Edge of RXC
CRS to RXD Latency, 4B or 5B Aligned
—
—
—
—
tRLAT
tCRS1
tCRS2
—
—
“Start of Stream” to CSR Asserted
106
154
—
—
138
186
“End of Stream” to CSR De-Asserted
DS00002813A-page 30
2018 Microchip Technology Inc.
KSZ8721BL/SL
7.4
Auto-Negotiation
FIGURE 7-4:
AUTO-NEGOTIATION/FAST LINK PULSE TIMING
FLP
Burst
FLP
Burst
TX+/TX-
tFLPW
tBTB
Clock
Pulse
Data
Pulse
Clock
Pulse
Data
Pulse
TX+/TX-
tPW
tPW
tCTD
tCTC
TABLE 7-4:
Parameter
AUTO-NEGOTIATION/FAST LINK PULSE TIMING PARAMETERS
Symbol
Min.
Typ.
Max.
Units
FLP Burst to FLP Burst
tBTB
tFLPW
tPW
8
16
2
24
—
—
—
—
33
ms
ms
ns
FLP Burst Width
—
—
—
—
17
Clock/Data Pulse Width
Clock Pulse to Data Pulse
Clock Pulse to Clock Pulse
Number of Clock/Data Pulses per Burst
100
69
tCTD
µs
136
—
tCTC
µs
2018 Microchip Technology Inc.
DS00002813A-page 31
KSZ8721BL/SL
7.5
SMI Timing
FIGURE 7-5:
SERIAL MANAGEMENT INTERFACE TIMING
tP
MDC
tMD1
tMD2
MDIO
(Into Chip)
Valid
Data
Valid
Data
tMD3
MDIO
(Out of Chip)
Valid
Data
TABLE 7-5:
SERIAL MANAGEMENT INTERFACE TIMING PARAMETERS
Parameter
Symbol
Min.
Typ.
Max.
Units
MDC Period
tP
—
10
10
—
400
—
—
—
—
—
ns
ns
ns
ns
MDIO Set-Up to MDC (MDIO as Input)
MDIO Hold After MDC (MDIO as Input)
MDC to MDIO Valid (MDIO as Output)
tMD1
tMD2
tMD3
—
222
DS00002813A-page 32
2018 Microchip Technology Inc.
KSZ8721BL/SL
7.6
Reset Timing
FIGURE 7-6:
RESET TIMING
Supply
Voltage
tsr
RST_N
Strap-In
Value
TABLE 7-6:
Parameter
RESET TIMING PARAMETERS
Symbol
Min.
Typ.
Max.
Units
Stable Supply Voltages to Reset High
fSR
50
—
—
µs
7.6.1
RESET CIRCUIT DIAGRAM
The following discrete reset circuit as shown in Figure 7-7 is recommended when powering up the KSZ8721BL/SL
device. For the application where the reset circuit signal comes from another device (e.g., CPU, FPGA, etc), please
refer to the reset circuit as shown in Figure 7-8.
FIGURE 7-7:
RECOMMENDED RESET CIRCUIT
2018 Microchip Technology Inc.
DS00002813A-page 33
KSZ8721BL/SL
FIGURE 7-8:
RECOMMENDED CIRCUIT FOR INTERFACING WITH CPU/FPGA RESET
VCC
R
D1
ꢀꢁNȍ
KS8721BL/SL
RST
CPU/FPGA
RST_OUT_n
D2
C
10μF
D1, D2: 1N4148
At power-on-reset, R, C, and D1 provide the necessary ramp rise time to reset the device. The reset out from CPU/
FPGA provides warm reset after power up. It is also recommended to power up the VDD core voltage earlier than VDDIO
voltage. At worst case, the both VDD core and VDDIO voltages should come up at the same time.
7.6.2
REFERENCE CIRCUIT FOR STRAPPING OPTION CONFIGURATION
Figure 7-9 shows the reference circuit for strapping option pins.
FIGURE 7-9:
REFERENCE CIRCUIT, STRAPPING OPTION PINS
2.5V
220:
Pull-Up
10k:
LED pin
KS8721BL/SL
2.5V
220:
Pull-down
LED pin
KS8721BL/SL
1k:
Reference circuits for unmanaged programming through LED ports.
DS00002813A-page 34
2018 Microchip Technology Inc.
KSZ8721BL/SL
7.7
Selection of Isolation Transformers
One simple 1:1 isolation transformer is needed at the line interface. An isolation transformer with integrated common-
mode choke is recommended for exceeding FCC requirements. The following table gives recommended transformer
characteristics.
TABLE 7-7:
Parameter
Turns ratio
SELECTION OF ISOLATION TRANSFORMERS (Note 7-1)
Value
Test Condition
1 CT : 1 CT
350 µH
0.4 µH
—
Open-circuit inductance (min)
Leakage inductance (max)
Inter-winding capacitance (max)
D.C. resistance (max)
Insertion loss (max)
100 mV, 100 kHz, 8 mA
1 MHz (min)
12 pF
—
0.9Ω
—
0 MHz - 65 MHz
—
1.0 dB
HIPOT (min)
1500Vrms
Note 7-1
The IEEE 802.3u standard for 100BASE-TX assumes a transformer loss of 0.5dB. For the transmit
line transformer, insertion loss of up to 1.3 dB can be compensated or by increasing the line drive
current by means of reducing the ISET resistor value. Please select the transformer that supports
auto-MDI/MDI-X.
7.8
Selection of Reference Crystal
An oscillator or crystal with the following typical characteristics is recommended.
TABLE 7-8:
SELECTION OF ISOLATION TRANSFORMERS
Characteristics
Value
Frequency
25 MHz
±100 ppm
20 pF
Frequency tolerance (max)
Load capacitance (max)
Series resistance (max)
40Ω
TABLE 7-9:
QUALIFIED SINGLE PORT TRANSFORMER LISTS
Single Port Magnetic Manufacturer
Part Number
Auto MDIX
Pulse
H1102
S558-5999-U7
PT163020
HB726
Yes
Yes
Yes
Yes
Yes
Yes
Bel Fuse
YCL
Transpower
Delta
LF8505
LanKom
LF-H41S
Integrated Transformers
Pulse
Pulse
J0011D21
J00-0061
Yes
Yes
2018 Microchip Technology Inc.
DS00002813A-page 35
KSZ8721BL/SL
8.0
8.1
PACKAGING INFORMATION
Package Marking Information
48-Lead SSOP*
Example
MICREL
MICREL
XXXXXXXXX
KSZ8721SL
1736A4G000001736200
YYWWA4GXXXXXYYWWNNN
Example
48-Lead LQFP*
MICREL
MICREL
KSZ8721BL
1641A4O
XXXXXXXXX
YYWWA4O
GXXXXXYYWWNNN
G000001641230
Legend: XX...X Product code or customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
DS00002813A-page 36
2018 Microchip Technology Inc.
KSZ8721BL/SL
FIGURE 8-1:
48-LEAD LQFP 7 MM X 7 MM PACKAGE OUTLINE & RECOMMENDED LAND
PATTERN
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc.
DS00002813A-page 37
KSZ8721BL/SL
FIGURE 8-2:
48-LEAD SSOP 7 MM X 7 MM PACKAGE OUTLINE & RECOMMENDED LAND
PATTERN
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS00002813A-page 38
2018 Microchip Technology Inc.
KSZ8721BL/SL
APPENDIX A: DATA SHEET REVISION HISTORY
TABLE A-1:
REVISION HISTORY
Revision
Section/Figure/Entry
Correction
Converted Micrel data sheet KSZ8721BL/SL to
Microchip DS00002813A. Minor text changes
throughout.
DS00002813A (10-30-18)
—
2018 Microchip Technology Inc.
DS00002813A-page 39
KSZ8721BL/SL
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-
tains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-
nars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://microchip.com/support
DS00002813A-page 40
2018 Microchip Technology Inc.
KSZ8721BL/SL
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Example:
X
-XX
PART NO.
Device
X
X
Supply
Voltage
Media
Type
Package
Temperature
a) KSZ8721-BL:
b) KSZ8721-SL:
c) KSZ8721-BLI:
d) KSZ8721-SLI:
10/100 Base-TX/FX MII Physical
Layer Transceiver, 48-Lead
LQFP, Single 3.3V Supply,
0C to +70C,250/Tray
Device:
KSZ8721
10/100 Base-TX/FX MII Physical
Layer Transceiver, 48-Lead
SSOP, Single 3.3V Supply,
0C to +70C,30/Tube
B = 48-Lead LQFP
S = 48-Lead SSOP
Package:
10/100 Base-TX/FX MII Physical
Layer Transceiver, 48-Lead
LQFP, Single 3.3V Supply,
–40°C to +85°C,250/Tray
Supply Voltage:
Temperature:
L = Single 3.3V Supply
<blank> = 0C to +70C
I = –40°C to +85°C
10/100 Base-TX/FX MII Physical
Layer Transceiver, 48-Lead
SSOP, Single 3.3V Supply,
–40°C to +85°C,30/Tube
Media Type:
<blank> = 30/Tube (SSOP Package Only)
<blank> = 250/Tray (LQFP package Only)
<TR> = 1000/Reel
e) KSZ8721-BL-TR: 10/100 Base-TX/FX MII Physical
Layer Transceiver, 48-Lead
LQFP, Single 3.3V Supply,
0C to +70C,1000/Reel
f) KSZ8721-SL-TR:
10/100 Base-TX/FX MII Physical
Layer Transceiver, 48-Lead
SSOP, Single 3.3V Supply,
0C to +70C, 1000/Tray
g) KSZ8721-BLI-TR: 10/100 Base-TX/FX MII Physical
Layer Transceiver, 48-Lead
LQFP, Single 3.3V Supply,
–40°C to +85°C,1000/Reel
d) KSZ8721-SLI-TR: 10/100 Base-TX/FX MII Physical
Layer Transceiver, 48-Lead
SSOP, Single 3.3V Supply,
–40°C to +85°C,1000/Reel
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for
package availability with the Tape and Reel
option.
2018 Microchip Technology Inc.
DS00002813A-page 41
KSZ8721BL/SL
NOTES:
DS00002813A-page 42
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other
countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision
Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication,
CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN,
In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM,
PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other
countries.
All other trademarks mentioned herein are property of their respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3789-5
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
CERTIFIEDꢀBYꢀDNVꢀ
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TSꢀ16949ꢀ==ꢀ
2018 Microchip Technology Inc.
DS00002813A-page 43
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
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Tel: 61-2-9868-6733
India - Bangalore
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Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
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Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
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France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
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Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
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Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
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Boston
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China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
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Tel: 49-721-625370
China - Qingdao
Philippines - Manila
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Tel: 49-89-627-144-0
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Tel: 86-532-8502-7355
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Taiwan - Kaohsiung
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Italy - Milan
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Fax: 39-0331-466781
China - Suzhou
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Taiwan - Taipei
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Detroit
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China - Wuhan
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Thailand - Bangkok
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Italy - Padova
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Vietnam - Ho Chi Minh
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Netherlands - Drunen
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Fax: 31-416-690340
Indianapolis
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Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
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China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
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Los Angeles
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Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
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Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS00002813A-page 44
2018 Microchip Technology Inc.
08/15/18
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