MCP111T-240E/NB [MICROCHIP]
IC,VOLT DETECTOR,FIXED,+2.32V,TO-236,3PIN,PLASTIC;
| 型号： | MCP111T-240E/NB |
| 厂家： | 
MICROCHIP |
| 描述： | IC,VOLT DETECTOR,FIXED,+2.32V,TO-236,3PIN,PLASTIC |
| 文件： | 总22页 (文件大小：333K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP111/112
Micropower Voltage Detector
Features
Description
• Ultra low supply current: 1.75 µA (max.)
The MCP111/112 are voltage-detecting devices
designed to keep a microcontroller in reset until the
system voltage has reached and stabilized at the
proper level for reliable system operation. These
devices also operate as protection from brown-out
conditions when the system supply voltage drops
below a safe operating level. The MCP111 and
MCP112 are available in eight different trip voltages.
•
Precision monitoring options of:
- 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V,
4.38V and 4.63V
• Resets microcontroller in a power loss event
• Active-low VOUT pin:
- MCP111 active-low, open-drain
- MCP112 active-low, push-pull
The MCP111 has an open-drain output with an active-
low pin (VOUT). This device will assert VOUT when the
voltage on the VDD pin is below the trip-point voltage.
• Available in SOT23-3, TO-92 and SC70 packages
•
Temperature Range:
- Extended: -40°C to +125°C
(except MCP1XX-195)
The MCP112 has a push-pull output and will assert an
active-low signal (VOUT pin) when the voltage on the
VDD pin is below the trip-point voltage.
- Industrial: -40°C to +85°C (MCP1XX-195 only)
During operation, the output (VOUT) remains at a logic-
high as long as VDD is greater that the specified
threshold voltage. When VDD falls below the voltage
trip point, VOUT is driven low.
Applications
• Critical µC and µP Power Monitoring Applications
• Computers
• Intelligent Instruments
Package Types
SOT23-3/SC-70
• Portable Battery-Powered Equipment
Block Diagram
VDD
1
2
VOUT
VDD
3
Comparator
VOUT
VSS
+
Output
Driver
–
TO-92
Band Gap
Reference
V
OUT
VSS
V
DD
VSS
2004 Microchip Technology Inc.
DS21889A-page 1
MCP111/112
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V
DD
Input current (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
DD
Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Rated Rise Time of V
. . . . . . . . . . . . . . . . . . . . . . 100V/µs
DD
All inputs and outputs w.r.t. V
. . . . . –0.6V to (V + 1.0V)
DD
SS
Storage temperature . . . . . . . . . . . . . . . . . .–65°C to + 150°C
Ambient temp. with power applied . . . . . . .–40°C to + 125°C
Maximum Junction temp. with power applied . . . . . . . .150°C
ESD protection on all pins. . . . . . . . . . . . . . . . . . . . . . . . . ≥ 2 kV
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for V = 1V to 5.5V, R = 100 kΩ (only MCP111),
DD
PU
T = –40°C to +125°C.
A
Parameters
Operating Voltage Range
Sym
Min
Typ
Max
Units
Conditions
V
V
1.0
1.0
—
—
5.5
V
V
DD
DD
DD
Specified V Value to V
low
I
= 10 uA, V
< 0.2V
RST
DD
OUT
RST
Operating Current
I
—
< 1
1.75
1.929
1.948
µA
V
V
Trip Point
MCP1XX-195
V
1.872
1.853
1.900
1.900
T = +25°C (Note 1)
A
DD
TRIP
V
T = -40°C to +85°C
A
(Note 2)
MCP1XX-240
MCP1XX-270
MCP1XX-290
MCP1XX-300
MCP1XX-315
MCP1XX-450
MCP1XX-475
2.285
2.262
2.591
2.564
2.857
2.828
2.886
2.857
3.034
3.003
4.314
4.271
4.561
4.514
—
2.320
2.320
2.630
2.630
2.900
2.900
2.930
2.930
3.080
3.080
4.380
4.380
4.630
4.630
±100
—
2.355
2.378
2.670
2.696
2.944
2.973
2.974
3.003
3.126
3.157
4.446
4.490
4.700
4.746
—
V
T = +25°C (Note 1)
A
V
Note 2
V
T = +25°C (Note 1)
A
V
Note 2
V
T = +25°C (Note 1)
A
V
Note 2
V
T = +25°C (Note 1)
A
V
Note 2
V
T = +25°C (Note 1)
A
V
Note 2
V
T = +25°C (Note 1)
A
V
Note 2
V
T = +25°C (Note 1)
A
V
Note 2
V
Trip Point Tempco
T
ppm/°C
DD
TPCO
Threshold Hysteresis
(min. = 1%, max = 6%)
MCP1XX-195
MCP1XX-240
MCP1XX-270
MCP1XX-290
MCP1XX-300
MCP1XX-315
MCP1XX-450
MCP1XX-475
V
0.019
0.023
0.026
0.029
0.029
0.031
0.044
0.046
0.114
0.139
0.158
0.174
0.176
0.185
0.263
0.278
V
V
V
V
V
V
V
V
T = +25°C
A
HYS
—
—
—
—
—
—
—
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
DS21889A-page 2
2004 Microchip Technology Inc.
MCP111/112
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for V = 1V to 5.5V, R = 100 kΩ (only MCP111),
DD
PU
T = –40°C to +125°C.
A
Parameters
Sym
Min
Typ
Max
Units
Conditions
=500 µA, V =V
TRIP(MIN)
V
V
Low Level Output Voltage
High Level Output Voltage
V
—
—
—
0.4
—
V
V
I
I
OUT
OL
OL
DD
V
V
– 0.6
= 1 mA, For only
OH
OUT
OH
DD
MCP112 (push-pull output)
Open-Drain Output Leakage Current
(MCP111 only)
I
—
0.1
—
µA
OD
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
VTRIP
1V
VDD
tRPU
tRPD
VOH
1V
VOL
VOUT
tRT
FIGURE 1-1:
Timing Diagram.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP111), TA = –40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Figure 1-1 and C = 50 pF
(Note 1)
V
V
Detect to V
Inactive
t
—
90
—
µs
L
DD
OUT
RPU
t
V
ramped from V
+
TRIP(MAX)
Detect to V
Active
—
—
130
5
—
—
µs
µs
RPD
DD
DD
OUT
250 mV down to V
-
TRIP(MIN)
250 mV, per Figure 1-1,
C = 50 pF (Note 1)
L
V
Rise Time After V
Active
t
For V
10% to 90% of final
OUT
OUT
RT
OUT
value per Figure 1-1, C = 50 pF
L
(Note 1)
Note 1: These parameters are for design guidance only and are not 100% tested.
2004 Microchip Technology Inc.
DS21889A-page 3
MCP111/112
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only
MCP111), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Specified Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Package Thermal Resistances
Thermal Resistance, 3L-SOT23
Thermal Resistance, 3L-SC-70
Thermal Resistance, 3L-TO92
TA
TA
TJ
TA
-40
-40
—
—
—
—
—
+85
ºC
ºC
ºC
ºC
MCP1XX-195
+125
+150
+150
Except MCP1XX-195
-65
θJA
θJA
θJA
—
—
—
336
340
—
—
—
ºC/W
ºC/W
ºC/W
131.9
DS21889A-page 4
2004 Microchip Technology Inc.
MCP111/112
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
1.6
1.4
1.2
1
1.6
1.4
1.2
1
MCP111-195
MCP111-195
5.5V
5.0V
+125°C
4.0V
+85°C
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
2.8V
-40°C
2.1V
1.7V
+25°C
1.0V
1.0
2.0
3.0
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-1:
IDD vs. Temperature
FIGURE 2-4:
IDD vs. VDD (MCP111-195).
(MCP111-195).
1.6
1.2
5.5V
5.0V
MCP112-300
MCP112-300
1.4
1.2
1
1
0.8
0.6
0.4
0.2
0
4.0V
2.8V
1.7V
+125°C
0.8
0.6
0.4
0.2
0
+85°C
2.1V
-40°C
1.0V
+25°C
1.0
2.0
3.0
4.0
DD (V)
5.0
6.0
V
Temperature (°C)
FIGURE 2-5:
IDD vs. VDD (MCP112-300).
FIGURE 2-2:
IDD vs. Temperature
(MCP112-300).
1.6
1
MCP112-475
MCP112-475
0.9
5.5V
2.1V
1.4
1.2
1
0.8
4.0V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
5.0V
2.8V
0.8
0.6
0.4
0.2
0
+125°C
+85°C
1.7V
1.0V
-40°C
+25°C
1.0
2.0
3.0
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-6:
IDD vs. VDD (MCP112-475).
FIGURE 2-3:
IDD vs. Temperature
(MCP112-475).
2004 Microchip Technology Inc.
DS21889A-page 5
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.120
MCP111-195
1.950
1.945
1.940
1.935
1.930
1.925
1.920
1.915
1.910
1.905
1.900
1.895
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0.000
VDD = 1.7V
VTRIP, V increasing
0.100
0.080
0.060
0.040
0.020
0.000
VHYS, Hysteresis
+125°C
MCP111-195
max temp is
+85°C
+85°C
-40°C
VTRIP, V decreasing
+25°C
-60
-10
40
90
140
0.00
0.25
0.50
0.75
1.00
Temperature (°C)
I
OL (mA)
FIGURE 2-7:
VTRIP and VHYST vs.
FIGURE 2-10:
V
OL vs. IOL (MCP111-195
Temperature (MCP111-195).
@ VDD = 1.7V).
0.080
MCP112-300
DD = 2.7V
3.040
0.100
0.098
0.096
0.094
0.092
0.090
0.088
0.086
0.084
0.082
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
VTRIP, V increasing
V
3.020
3.000
2.980
2.960
2.940
2.920
2.900
VHYS, Hysteresis
+125°C
+85°C
MCP112-300
-40°C
+25°C
VTRIP, V decreasing
0.00
0.25
0.50
OL (mA)
0.75
1.00
-60
-10
40
90
140
I
Temperature (°C)
FIGURE 2-8:
VTRIP and VHYST vs.
FIGURE 2-11:
VOL vs. IOL (MCP112-300
Temperature (MCP112-300).
@ VDD = 2.7V).
0.050
4.800
0.180
0.170
0.160
0.150
0.140
0.130
0.120
0.110
0.100
MCP112-475
VDD = 4.4V
VTRIP, V increasing
4.780
4.760
4.740
4.720
4.700
4.680
4.660
4.640
4.620
4.600
4.580
0.040
0.030
0.020
0.010
0.000
VHYS, Hysteresis
MCP112-475
+125°C
+85°C
-40°C
+25°C
VTRIP, V decreasing
-60
-20
20
60
100
140
0.00
0.25
0.50
0.75
1.00
IOL (mA)
Temperature (°C)
FIGURE 2-9:
VTRIP and VHYST vs.
FIGURE 2-12:
VOL vs. IOL (MCP112-475
Temperature (MCP112-475).
@ VDD = 4.4V).
DS21889A-page 6
2004 Microchip Technology Inc.
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.120
3.150
3.100
3.050
3.000
2.950
2.900
MCP111-195
VDD = 1.7 V
IOL = 1.00 mA
MCP112-300
VDD = 3.1V
0.100
0.080
0.060
0.040
0.020
0.000
IOL = 0.75 mA
IOL = 0.50 mA
-40 °C
+85 °C
+25 °C
IOL = 0.25 mA
IOL = 0.00 mA
80
+125 °C
-40
0
40
120
0.00
0.25
0.50
0.75
1.00
IOL (mA)
Temperature (°C)
FIGURE 2-13:
VOL vs. Temperature
FIGURE 2-16:
VOH vs. IOH (MCP112-300
(MCP111-195 @ VDD = 1.7V).
@ VDD = 3.1V).
0.080
4.820
4.800
4.780
4.760
4.740
4.720
4.700
MCP112-300
VDD = 3.1V
MCP112-300
VDD = 2.7V
IOL = 1.00 mA
0.070
0.060
0.050
0.040
0.030
0.020
0.010
0.000
IOL = 0.75 mA
IOL = 0.50 mA
+25 °C
-40 °C
IOL = 0.25 mA
IOL = 0.00 mA
+85 °C
+125 °C
4.680
0.00
-40
0
40
80
120
0.25
0.50
0.75
1.00
Temperature (°C)
IOL (mA)
FIGURE 2-14:
VOL vs. Temperature
FIGURE 2-17:
VOH vs. IOH (MCP112-475
(MCP112-300 @ VDD = 2.7V).
@ VDD = 4.8V).
0.050
600
500
400
IOL = 1.00 mA
MCP112-475
VDD = 4.4V
0.040
MCP111-195
IOL = 0.75 mA
IOL = 0.50 mA
MCP112-300
0.030
0.020
0.010
0.000
300
200
100
0
MCP112-475
IOL = 0.25 mA
IOL = 0.00 mA
0.001
0.01
0.1
1
10
-40
0
40
80
120
Temperature (°C)
VTRIP(min) - VDD
FIGURE 2-15:
VOL vs. Temperature
FIGURE 2-18:
Typical Transient Response
(MCP112-475 @ VDD = 4.4V).
(25 °C).
2004 Microchip Technology Inc.
DS21889A-page 7
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
400
350
300
250
200
150
100
50
350
300
250
200
150
100
50
MCP111-195
MCP111-195
VDD decreasing from:
5V - 1.7V
VDD increasing from:
0V - 2.1V
VDD decreasing from:
TRIP(max) + 0.25V to VTRIP(min) - 0.25V
V
VDD increasing from:
0V - 2.8V
VDD increasing
from: 0V - 4.0V
VDD decreasing from:
5V - 0V
VDD increasing
from: 0V - 5.5V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-19:
tRPD vs. Temperature
FIGURE 2-22:
tRPU vs. Temperature
(MCP111-195).
(MCP111-195).
140
120
100
80
160
MCP112-300
MCP112-300
VDD decreasing from:
VDD increasing from:
0V - 3.1V
140
120
100
80
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
VDD increasing from:
0V - 3.3V
VDD decreasing from:
5V - 2.7V
VDD increasing from:
0V - 4.0V
60
60
40
40
VDD decreasing from:
5V - 0V
20
20
VDD increasing from:
0V - 5.5V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-20:
tRPD vs. Temperature
FIGURE 2-23:
tRPU vs. Temperature
(MCP112-300).
(MCP112-300).
250
250
200
150
100
50
MCP112-475
MCP112-475
VDD decreasing from:
5V - 4.4V
VDD increasing from:
0V - 4.9V
200
150
100
50
VDD increasing from:
0V - 5.0V
VDD decreasing from:
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
VDD increasing from:
0V - 5.5V
VDD decreasing from:
5V - 0V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-21:
tRPD vs. Temperature
FIGURE 2-24:
tRPU vs. Temperature
(MCP112-475).
(MCP112-475).
DS21889A-page 8
2004 Microchip Technology Inc.
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.1500
0.1400
0.1300
0.1200
0.1100
0.1000
0.0900
0.0800
60
55
MCP112-475
MCP111-195
VDD increasing from:
50
VDD increasing from:
0V - 2.1V
45
0V - 5.0V
VDD increasing from:
0V - 4.9V
VDD increasing from:
0V - 5.5V
VDD increasing
from: 0V - 4.0V
40
35
30
VDD increasing from:
0V - 5.5V
VDD increasing from:
VDD increasing from:
0V - 4.8V
25
20
0V - 2.8V
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-25:
tRT vs. Temperature
FIGURE 2-27:
tRT vs. Temperature
(MCP111-195).
(MCP112-475).
0.4
VDD increasing from:
0V - 3.1V
VDD increasing from:
0.35
0V - 3.3V
0.3
0.25
0.2
VDD increasing from:
0V - 5.5V
0.15
0.1
VDD increasing from:
0V - 4.0V
0.05
0
MCP112-300
35
-40
-15
10
60
85
110
Temperature (°C)
FIGURE 2-26:
tRT vs. Temperature
(MCP112-300).
2004 Microchip Technology Inc.
DS21889A-page 9
MCP111/112
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
PIN FUNCTION TABLE
Symbol
Function
SOT23-3
T0-92
SC-70
1
1
VOUT
Output State
DD Falling:
V
H = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
H = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
2
3
3
2
VSS
VDD
Ground reference
Positive power supply
DS21889A-page 10
2004 Microchip Technology Inc.
MCP111/112
4.1
VTRIP Operation
4.0
APPLICATION INFORMATION
The voltage trip point (VTRIP) is determined on the falling
edge of VDD. The actual voltage trip point (VTRIPAC) will
be between the minimum trip point (VTRIPMIN) and the
maximum trip point (VTRIPMAX). There is a hysteresis on
this trip point to remove any “jitter” that would occur on
the VOUT pin when the device VDD is at the trip point.
For many of today’s microcontroller applications, care
must be taken to prevent low power conditions that can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply drops below the operating level momen-
tarily. The second most common cause is when a slowly
decaying power supply causes the microcontroller to
begin executing instructions without sufficient voltage to
sustain SRAM, thus producing indeterminate results.
Figure 4-1 shows a typical application circuit.
Figure 4-2 shows the state of the VOUT pin as deter-
mined by the VDD voltage. The VTRIP specification is for
falling VDD voltages. When the VDD voltage is rising, the
VOUT will not be driven high until VDD is at VTRIP + VHYS
.
VDD
3
VDD
VDD
PICmicro®
Microcontroller
0.1
µF
RPU
MCP11X
RESET
INPUT
1
VOUT
(Active-Low)
VSS
2
GND
Note 1: RPU may be required with the MCP111
due to the open-drain output. Resistor
RPU is not required with the MCP112.
FIGURE 4-1:
Typical Application Circuit.
VDD
VTRIPAC + VHYSAC
VTRIPMAX
VTRIPMIN
VTRIPAC
VTRIPAC
1V
VOUT
< 1 V is outside the
device specifications
FIGURE 4-2:
VOUT Operation as Determined by the VTRIP and VHYS.
2004 Microchip Technology Inc.
DS21889A-page 11
MCP111/112
4.2
Negative Going VDD Transients
4.3
Effect of Temperature on Time-out
Period (t
)
RPU
The minimum pulse width (time) required to cause a
reset may be an important criteria in the implementa-
tion of a POR circuit. This time is referred to as
transient duration and is the amount of time needed for
these supervisory devices to respond to a drop in VDD
The transient duration time is dependant on the magni-
tude of VTRIP – VDD. Generally speaking, the transient
The time-out period (tRPU) determines how long the
device remains in the reset condition. This is affected
by both VDD and temperature. The graph shown in
Figures 2-22, 2-23 and 2-24 show typical response for
different VDD values and temperatures.
.
duration decreases with increases in VTRIP – VDD
.
Figure 4-3 shows a typical transient duration vs. reset
comparator overdrive for which the MCP111/112 will
not generate a reset pulse. It shows that the farther
below the trip point the transient pulse goes, the dura-
tion of the pulse required to cause a reset gets shorter.
Figure 2-18 shows the transient response characteris-
tics for the MCP111/112.
A 0.1 µF bypass cap mounted as close as possible to
the VDD pin provides additional transient immunity
(refer to Figure 4-1).
5V
V
V
TRIP(MAX)
TRIP(MIN)
V
- V
DD
TRIP(MIN)
t
TRANS
0V
Time (µs)
FIGURE 4-3:
Example of Typical
Transient Duration Waveform.
DS21889A-page 12
2004 Microchip Technology Inc.
MCP111/112
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
3-Lead TO-92
Example:
XXXXXX
XXXXXX
XXXXXX
YWWNNN
MCP111
290I
TO0405
256
3-Pin SOT-23B
3-Pin SC-70
c d e
f g h
cdef
Bottom Side
Top Side
Part Number
MCP111T-195I/LB
SOT-23
SC-70
Part Number
SOT-23
SC-70
MPNN
MQNN
MGNN
MHNN
MJNN
MKNN
MLNN
MMNN
MCP112T-195E/LB
MCP112T-240E/LB
MCP112T-270E/LB
MCP112T-290E/LB
MCP112T-300E/LB
MCP112T-315E/LB
MCP112T-450E/LB
MCP112T-475E/LB
MCP112T-195I/TT
MCP112T-240ETT
MCP112T-270E/TT
MCP112T-290E/TT
MCP112T-300E/TT
MCP112T-315E/TT
MCP112T-450E/TT
MCP112T-475E/TT
NN
MCP111T-240E/LB
MCP111T-270E/LB
MCP111T-290E/LB
MCP111T-300E/LB
MCP111T-315E/LB
MCP111T-450E/LB
MCP111T-475E/LB
MCP111T-195I/TT
MCP111T-240ETT
MCP111T-270E/TT
MCP111T-290E/TT
MCP111T-300E/TT
MCP111T-315E/TT
MCP111T-450E/TT
MCP111T-475E/TT
MSNN
MANN
MBNN
MCNN
MDNN
MENN
MFNN
EPN
EQN
EGN
EHN
EJN
ERN
ESN
EAN
EBN
ECN
EDN
EEN
EFN
EKN
ELN
EMN
Legend:
1
2
3
4
5
6
Part Number + temperature range and voltage (two-digit code)
Part Number + temperature range and voltage (two-digit code)
Lot ID number
Year and work week
Year and work week
Year and work week
Note:
In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line thus limiting the number of available characters for customer
specific information.
2004 Microchip Technology Inc.
DS21889A-page 13
MCP111/112
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
E
E1
2
B
p1
D
n
p
1
α
c
A
A2
A1
φ
β
L
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
3
MAX
n
p
Number of Pins
3
Pitch
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
0.96
1.92
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.035
.044
0.89
0.88
1.01
0.95
0.06
2.37
1.30
2.92
0.45
5
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
Molded Package Thickness
.035
.000
.083
.047
.110
.014
0
.040
.004
.104
.055
.120
.022
10
Standoff
§
0.01
2.10
1.20
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.004
.015
0
.006
.017
5
.007
.020
10
0.09
0.37
0
0.14
0.44
5
0.18
0.51
10
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
DS21889A-page 14
2004 Microchip Technology Inc.
MCP111/112
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
E
E1
B
2
1
p1
D
3
p
a
A2
A
c
A1
b
L
Units
Dimension Limits
INCHES
3
MILLIMETERS*
MIN MAX
MIN
MAX
Number of Pins
Pitch
3
p
.026 BSC.
.051 BSC.
.031
.031
.000
.071
.045
.071
.004
.003
.006
8°
0.65 BSC.
1.30 BSC.
0.80
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.043
1.10
Molded Package Thickness
Standoff
.039
.0004
.094
.053
.089
.016
.010
.016
12°
0.80
1.00
.010
2.40
1.35
2.25
0.41
0.25
0.40
12°
0.00
Overall Width
1.80
Molded Package Width
Overall Length
E1
D
1.15
1.80
Foot Length
L
c
0.10
Lead Thickness
0.08
Lead Width
B
a
0.15
Mold Draft Angle Top
Mold Draft Angle Bottom
8°
b
8°
12°
8°
12°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
2004 Microchip Technology Inc.
DS21889A-page 15
MCP111/112
3-Lead Plastic Transistor Outline (TO) (TO-92)
E1
D
n
1
L
1
2
3
α
B
p
c
A
R
β
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
3
MAX
n
p
Number of Pins
3
Pitch
.050
.143
.186
.183
.090
.555
.017
.019
5
1.27
Bottom to Package Flat
Overall Width
A
E1
D
R
L
.130
.155
.195
.195
.095
.610
.020
.022
6
3.30
4.45
3.62
4.71
4.64
2.29
14.10
0.43
0.48
5
3.94
.175
.170
.085
.500
.014
.016
4
4.95
4.95
2.41
15.49
0.51
0.56
6
Overall Length
4.32
2.16
12.70
0.36
0.41
4
Molded Package Radius
Tip to Seating Plane
Lead Thickness
Lead Width
c
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
2
3
4
2
3
4
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
DS21889A-page 16
2004 Microchip Technology Inc.
MCP111/112
5.2
Product Tape and Reel Specifications
EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)
FIGURE 5-1:
Top
Cover
Tape
A
0
W
B
K
0
0
P
TABLE 1:
CARRIER TAPE/CAVITY DIMENSIONS
Carrier
Cavity
Dimensions
Output
Quantity
Units
Reel
Diameter in
mm
Dimensions
Case
Package
Outline
Type
W
P
A0
B0
mm
K0
mm
mm
mm
mm
NB
LB
SOT-23
SC-70
3L
3L
8
8
4
4
3.15
2.4
2.77
2.4
1.22
1.19
3000
3000
180
180
FIGURE 5-2:
3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS
g n i k M a r
e c D e v i
User Direction of Feed
Device
Marking
W, Width
of Carrier
Tape
Pin 1
Pin 1
P, Pitch
Reverse Reel Component Orientation
Standard Reel Component Orientation
2004 Microchip Technology Inc.
DS21889A-page 17
MCP111/112
FIGURE 5-3:
TO-92 DEVICES
P, Pitch
Device
Marking
3 LEAD
TO-92
W, Width of
Carrier Tape
Device
Marking
2 LEAD
TO-92
W, Width of
Carrier Tape
Reverse Reel
Component Orientation
Standard Reel
Component Orientation
H1
W6
H
H0
D
F1
F
F2
P1
P2
DS21889A-page 18
2004 Microchip Technology Inc.
MCP111/112
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
X
XXX
X
XX
a)
MCP111T-195I/NB: SOT-23B-3,
Device
Temperature Package
Range
Tape/Reel
Option
Monitoring
Options
Tape and Reel,
1.95V MicroPower
Voltage Detector,
open-drain,
-40°C to +85°C.
MCP111T-315E/LB: SC-70-3, Tape and Reel,
3.15V MicroPower
Device:
MCP111: MicroPower Voltage Detector, open-drain
MCP111T: MicroPower Voltage Detector, open-drain
(Tape and Reel)
MCP112: MicroPower Voltage Detector, push-pull
MCP112T: MicroPower Voltage Detector, push-pull
(Tape and Reel)
b)
c)
Voltage Detector,
open-drain,
-40°C to +125°C.
MCP111-300E/TO: TO-92-3, 3.00V
MicroPower Voltage
Detector,
Monitoring Options:
195 = 1.90V
240 = 2.32V
270 = 2.63V
290 = 2.90V
300 = 2.93V
315 = 3.08V
450 = 4.38V
475 = 4.63V
open-drain,
-40°C to +85°C.
a)
b)
c)
MCP112T-290E/NB: SOT-23B-3,
Tape and Reel,
2.90V MicroPower
Voltage Detector,
push-pull, -40°C to +85°C.
MCP112T-475E/LB: SC-70-3, Tape and Reel,
4.75V MicroPower
Temperature Range:
Package:
I
E
=
=
-40°C to +85°C (MCP11X-195 only)
-40°C to +125°C (Except MCP11X-195 only)
Voltage Detector,
push-pull,
-40°C to +125°C.
NB
LB
TO
=
=
=
SOT-23B, 3-lead
SC-70, 3-lead
TO-92, 3-lead
MCP112-450E/TO: TO-92-3,
4.5V MicroPower Voltage
Detector, push-pull,
-40°C to +85°C.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21889A-page 19
MCP111/112
NOTES:
DS21889A-page 20
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21889A-page 21
WORLDWIDE SALES AND SERVICE
China - Beijing
Korea
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: www.microchip.com
Unit 706B
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Fax: 86-28-86766599
Boston
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Dallas
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
China - Shunde
Fax: 248-538-2260
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
Kokomo
France
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Room 401, Hongjian Building, No. 2
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
Fengxiangnan Road, Ronggui Town, Shunde
District, Foshan City, Guangdong 528303, China
Tel: 86-757-28395507 Fax: 86-757-28395571
Germany
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
San Jose
1300 Terra Bella Avenue
Mountain View, CA 94043
Tel: 650-215-1444
Italy
India
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-22290061 Fax: 91-80-22290062
Japan
Fax: 650-961-0286
Toronto
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
Waegenburghtplein 4
NL-5152 JR, Drunen, Netherlands
Tel: 31-416-690399
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
05/28/04
DS21889A-page 22
2004 Microchip Technology Inc.
相关型号：
MCP111T-240E/TT
1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3, PLASTIC, TO-236, SOT-23B, 3-PIN
MICROCHIP
MCP111T-240E/TTG
1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3, PLASTIC, TO-236, SOT-23B, 3-PIN
MICROCHIP
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